Quartz wafer cleaning system and cleaning method

Abstract

The invention discloses a quartz wafer cleaning system and a cleaning method thereof, the cleaning system comprises an equipment shell, a plurality of cleaning tanks, a cleaning basket and a clamp, and the cleaning basket comprises a basket frame with a vertical clamping groove, a movable upper cover and a deflection structure. The key technical characteristics are that the movable upper cover is broken in the middle in the length direction and is divided into a first cover plate and a second cover plate, and the two cover plates can move relatively, so that the wafer clamping plate can be mounted conveniently, and the edge of the upper part of the wafer clamping plate can be accurately restrained and positioned through a transverse clamping groove. And the two cover plates are kept in an external expansion state under the action of the external expansion spring, and the movable part of the lifting handle can control the cover plates to be gathered together. The deflection structure is arranged at the end of the basket, when the cleaning basket reciprocates up and down in cleaning liquid, the deflection structure obtains driving force by making contact with the bottom face of the cleaning pool, the movable upper cover is pushed to do horizontal reciprocating motion, the inclination angle of the wafer clamping plate is made to change periodically, and dynamic reversing cleaning is achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, in particular to the field of quartz wafer cleaning technology, and more specifically to a quartz wafer cleaning system with dynamic reversing cleaning function and a cleaning method thereof. Background Art

[0002] The ultrasonic cleaning method for quartz wafers uses the alternating shock waves and cavitation generated by ultrasonic frequencies in liquids to physically clean dirt. This method is green cleaning and is thorough and efficient.

[0003] Chinese patent application CN110238122B discloses a quartz wafer cleaning device and method. This technology utilizes a robotic arm in conjunction with ultrasonic cleaning. Through the coordinated cooperation of first, second, and third transmission mechanisms, the flower basket tray achieves large-stroke reciprocating motion, subsurface fine-tuning, and rotational motion. Combined with the cavitation and straight-through flow effects of ultrasonic waves, this device cleans the quartz wafers in all directions. While this technology achieves a combined mechanical and ultrasonic cleaning effect, improving cleaning effectiveness, its mechanical motion primarily consists of simple up-and-down reciprocating and rotational motions. The cleaning liquid can only impact the wafer surface from fixed angles, resulting in the problem of blind spots.

[0004] Chinese patent application CN114618828A discloses a quartz wafer cleaning and drying system that connects a cleaning device and a drying device via a conveyor, thereby preventing the quartz wafer from being contaminated during transport. The system comprises an ultrasonic alkaline cleaning tank, a first pure water spray rinsing tank, an ultrasonic acid cleaning tank, a second pure water spray rinsing tank, a megasonic fine cleaning tank, and an isopropyl alcohol vibration cleaning tank, all arranged in sequence. This system utilizes a multi-stage cleaning process to improve cleaning effectiveness. However, the quartz wafer in this system is maintained in a fixed vertical position in each cleaning tank for cleaning. The cleaning fluid can only contact the wafer surface from a single direction, making it difficult to thoroughly clean fine impurities such as abrasive sand and metal particles in the gap between the wafer clamping plates due to the lack of multi-angle impact.

[0005] Traditional cleaning methods also have the following problems: First, the chip clamping plate always maintains a fixed angle during the cleaning process, and the flow direction of the cleaning liquid is single, which easily forms cleaning dead corners in the chip gap and the complex parts of the clamping plate structure; second, the existing mechanical movement form is relatively simple and cannot produce sufficient turbulence effect to enhance the impact force of the cleaning liquid; third, the cleaning system usually requires a complex electronic control system and multiple drive devices, which increases equipment costs and failure risks, especially reliability issues in corrosive cleaning fluid environments.

[0006] Therefore, how to achieve multi-angle and all-round cleaning of quartz wafers through structural innovation while ensuring the cleaning effect, eliminating cleaning dead corners, simplifying the equipment structure and improving system reliability has become a technical problem to be solved in this technical field. Summary of the Invention

[0007] The present invention arranges a deflection structure to utilize the up and down reciprocating motion of the cleaning equipment to drive the movable upper cover to move horizontally, so that the quartz wafer clamping plate periodically changes the tilt angle during the cleaning process, realizing multi-angle dynamic reversing cleaning to eliminate cleaning dead angles and improve the cleaning effect.

[0008] In order to solve the above technical problems, the present invention provides a quartz wafer cleaning system, comprising: Main components: The equipment housing has two sides with feed and discharge ports; cleaning tanks are located between the feed and discharge ports; a cleaning basket is used to load the quartz crystals to be cleaned; a fixture is used to pick up the cleaning basket and transfer it between cleaning tanks; the core structure of the cleaning basket is: the basket frame is equipped with vertical slots. Multiple groups of vertical slots are arranged in parallel along the length of the two sides of the basket frame. Each group of vertical slots consists of symmetrical slots located on both sides of the basket frame, which are used to support the wafer clamping plate. The bottom of the vertical slots has a secondary shallow groove with a width that matches the thickness of the wafer clamping plate for precise positioning.

[0009] Movable upper cover: provides upper constraints for the wafer clamping plate, and is provided with a horizontal slot corresponding to the vertical slot position, which is used to constrain the upper edge of the wafer clamping plate.

[0010] Deflection structure: used to drive the movable upper cover to move in translation, preferably arranged at the two ends of the basket frame.

[0011] Improved design of the movable upper cover: The movable upper cover can be broken in the middle of the length direction to be divided into a first cover plate and a second cover plate. The two cover plates can move relative to each other to facilitate the loading and positioning of the wafer clamping plate.

[0012] Control mechanism: Limiting posts are set on both sides of the basket frame, and corresponding limiting waist holes are set on the first cover plate and the second cover plate to limit the movement direction of the cover plate; an outward expansion spring is ringed on the limiting post to keep the first cover plate and the second cover plate in the outward expanded state; the handle includes a fixed part and a movable part, and the two ends of the movable part are provided with compression parts for controlling the convergence of the first cover plate and the second cover plate.

[0013] System supporting facilities: Cleaning cage: The cleaning basket is fixedly placed in the cleaning cage, and the entire cleaning cage together with the cleaning basket therein performs reciprocating motion up and down in the cleaning liquid.

[0014] The present invention also provides a dynamic reversing cleaning method for a quartz wafer, comprising the following steps: S1 Loading step: Load the wafer clamping plate into the vertical slot of the cleaning basket, and constrain the wafer clamping plate up and down through the horizontal slot of the movable upper cover; S2 placement step: placing the cleaning basket loaded with the wafer clamping plate into the cleaning solution in the cleaning tank; S3 driving step: driving the cleaning basket to perform reciprocating motion up and down in the cleaning liquid; S4 reversing step: During the up and down reciprocating motion, the deflection structure obtains driving force by contacting the bottom surface of the cleaning tank, driving the movable upper cover to move horizontally back and forth, causing the tilt angle of the wafer clamping plate to change periodically; S5 cleaning step: By periodically changing the tilt angle of the wafer clamping plate, the cleaning liquid impacts the wafer surface from different directions, achieving a dynamic reversing cleaning effect.

[0015] Core technical features: Each up and down movement cycle causes the deflection structure to reverse 180 degrees, pushing the movable upper cover to move horizontally between two extreme positions, so that the wafer clamping plate switches between two different tilt angles.

[0016] Beneficial effects: The present invention obtains driving force by contacting the bottom surface of the cleaning tank with the deflection structures provided at both ends of the basket, pushing the movable upper cover to move horizontally back and forth, so that the chip clamping plate loaded in the vertical slot can periodically change the tilt angle, thereby achieving multi-angle and all-round cleaning coverage. Compared with the traditional fixed vertical cleaning method, this dynamic reversing mechanism enables the cleaning liquid to impact the chip surface from different directions. In addition, the design of the movable upper cover being divided into a first cover plate and a second cover plate, combined with the ingenious coordination of the limiting column, the limiting waist hole and the outward expansion spring, not only facilitates the loading and positioning of the chip clamping plate, but also achieves precise control of the cover plate gathering through the fixed part and the movable part of the handle, making the entire cleaning process more efficient and stable. At the same time, the system has an adaptive adjustment mechanism that can automatically adjust the reversing frequency according to different cleaning intensities and frequencies, achieving the best match between cleaning intensity and reversing frequency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 : Schematic diagram of the overall structure of the system equipment; Figure 2 : Schematic diagram of the structure of the system equipment with part of the shell hidden; Figure 3 : Schematic diagram of the overall structure of the cleaning basket; Figure 4 : Schematic diagram of the overall structure of the movable upper cover, with the deflection structure installed; Figure 5 : Schematic diagram of the overall structure with the movable upper cover disconnected; Figure 6 : Schematic diagram of the overall structure of the cleaning basket and the disconnected movable upper cover; Figure 7 : Figure 6 A partial enlarged view of point A in the middle; Figure 8 : Schematic diagram of the overall structure of the wafer clamping plate placed on the disconnected movable upper cover; Figure 9 : Figure 8 A partial enlarged view of point B in the middle; Figure 10 : Schematic diagram of the overall structure of the cleaning basket and the movable upper cover; Figure 11 : Figure 10 The partial enlarged view of point C in the middle shows the connection between the movable upper cover, the cleaning basket and the deflection structure; Figure 12 : Left view of the combination of the cleaning basket and the movable upper cover; Figure 13 :for Figure 12 The full cross-sectional view of AA in the middle shows the schematic diagram of the reversing swing of the wafer clamping plate; Figure 14 : Schematic diagram of the dynamic reversing activity of the deflection structure 003; Figure 15 : Schematic diagram of the cleaning basket fixed to the cleaning cage.

[0018] Reference numerals: 1. Equipment housing; 2. Cleaning tank; 001. Cleaning basket; 002. Movable upper cover; 003. Deflection structure; 10. Wafer clamping plate; 011. Basket; 012. Handle; 013. Fence; 20. Cleaning cage; 021. First cover plate; 022. Second cover plate; 031. Tubular mounting seat; 032. Reversing rod; 033. Spring; 034. Lower guide member; 035. Upper guide member; 036. Circumferential guide protrusion; 037. Eccentric head; 038. Vertical protrusion; 039. Deflector plate; 041. First inclined plane; 042. Second inclined plane; 051. Third inclined plane; 052. Fourth inclined plane; 111. Vertical slot; 112. Limiting column; 113. Limiting waist hole; 114. Outward expansion spring; 115. Sliding sleeve; 121. Fixed part; 122. Movable part; 123. Compression part; 124. Avoidance gap; 222. Horizontal slot; 391. Long waist hole. DETAILED DESCRIPTION

[0019] The following combination Figures 1-15 The present invention is described.

[0020] See also Figure 1This embodiment provides a quartz wafer cleaning system, comprising an equipment housing 1, with a feed inlet and a discharge outlet defined on either side of the housing, respectively; multiple cleaning slots 2 disposed between the feed inlet and the discharge outlet; a cleaning basket 001 for loading the quartz crystals to be cleaned; and a retractable fixture for gripping the cleaning basket 001 (the fixture is a mechanism such as a robotic arm with a gripper or a gantry with a gripper, which is conventional and not described here). In one embodiment, the fixture is horizontally slidably mounted at the top of the housing 1; in another embodiment, the fixture is circularly and rotatably mounted within the housing 1.

[0021] The cleaning basket 001 is provided with a movable upper cover 002 for providing upper constraints for the wafer clamping plate 10, and a deflection structure 003 for driving the movable upper cover to move horizontally.

[0022] See also Figure 1 The cleaning basket 001 includes: a basket frame 011 that provides support for the wafer clamping plate 10; handles 012 welded to both sides of the basket frame 011; and two fences 013 fixed to both sides of the basket frame 011. Figure 1 、 Figure 2 、 Figure 4 As shown, multiple sets of vertical slots 111 are arranged parallel and spaced along the two longitudinal sides of the basket frame 011. Each set of vertical slots 111 consists of two symmetrical slots located on either side of the basket frame 011, and each set of vertical slots 111 is used to support a wafer clamping plate 10. Typically, the width of the vertical slots 111 is 6-8 mm, allowing a 4-5 mm clearance relative to the thickness of the wafer clamping plate 10 (2-3 mm). Compared to the prior art, this clearance is larger to accommodate the swinging motion of the wafer clamping plate 10. Preferably, the bottom of the vertical slots 111 is provided with a secondary shallow groove, the width of which matches the thickness of the wafer clamping plate 10, to serve as a positioning point for the wafer clamping plate 10, ensuring more stable swinging motion.

[0023] See also Figure 2 The movable upper cover 002 has a central rectangular through-hole. Downward flanges extend along both sides of the length of the movable upper cover 002. At the edges of the rectangular through-hole, corresponding to the vertical slots 111 of the basket frame 011, there are at least as many horizontal slots 222 as there are vertical slots 111. The horizontal slots 222 are used to restrain the upper edge of the wafer clamping plate 10, leaving approximately 1mm of clearance between the wafer clamping plate 10 and the movable upper cover 002. The movable upper cover 002 rests on the basket frame 011 by its own weight. Furthermore, stop bolts extending into the bottom of the fence 013 can be installed below the fence 013.

[0024] In another embodiment, see Figure 5The movable upper cover 002 is designed to be disconnected in the middle of the length direction, divided into a first cover plate 021 and a second cover plate 022, and the disconnected first cover plate 021 and the second cover plate 022 are made retractable in the Y-axis direction by setting a connection and limiting structure. In this way, when the basket frame 011 receives the chip clamping plate 10, the first cover plate 021 and the second cover plate 022 are pushed outward respectively, and the chip clamping plate 10 will not be restricted by the horizontal slot 222, which makes it easy to place. In order to facilitate the positioning of the chip clamping plate 10 after the chip clamping plate 10 is placed, the open end of the horizontal slot 222 is provided with a chamfer of appropriate size (that is, the chamfer is larger than the horizontal dimension of the chip clamping plate 10 when the vertical slot 111 may tilt at the maximum angle). In this way, when the first cover plate 021 and the second cover plate 022 are gathered inward to position the chip clamping plate 10, all the chip clamping plates 10 can be gathered to the same consistent direction angle.

[0025] In another embodiment, see Figure 6 , outwardly protruding limiting posts 112 are fixedly provided on both sides of the basket frame 011, and limiting waist holes 113 are provided at the positions of the limiting posts 112 corresponding to the flanges of the first cover plate 021 and the second cover plate 022. The limiting posts 112 and the limiting waist holes 113 make the first cover plate 021 and the second cover plate 022 only move along the Figure 5 Movement in the X-axis and Y-axis directions is shown.

[0026] In another embodiment, see Figure 6-Figure 9An outward expansion spring 114 is looped on the limiting column 112, and one end of the outward expansion spring 114 abuts against the basket frame 011 and the other end abuts against the inner wall of the limiting waist hole 113. In this way, the first cover plate 021 and the second cover plate 022 remain in the outward expansion state. In order to further make the first cover plate 021 and the second cover plate 022 move smoothly in the X-axis direction, a sliding sleeve 115 is added between the end of the outward expansion spring 114 and the limiting waist hole 113. To facilitate the convergence of the first and second cover plates 021 and 022, the following configuration is employed: the handle 012 is configured as a fixed portion 121 and a movable portion 122. The fixed portion 121 is positioned outside the movable portion 122 relative to the center of the basket frame 011. The movable portion 122 is an "n"-shaped rod structure, attached to the fixed portion 121 for movement, meaning it can move along the Z-axis. A compression portion 123 is provided at each end of the movable portion 122, facing the longitudinal centerline of the basket frame 011. Each compression portion 123 corresponds to one end of the first and second cover plates 021 and 022. To this end, avoidance notches 124 are provided at the corresponding locations of the first and second cover plates 021 and 022. Specifically, the movable portion 122 moves downward, and the pressing portion 123 presses against the edge of the avoidance notch 124, causing the first cover plate 021 and the second cover plate 022 to converge toward the center. Each set of transverse slots 222 clamps the corresponding wafer clamping plate 10 in place, allowing it to be controlled by the translation of the deflection structure 003. The connection between the fixed portion 121 and the movable portion 122 is preferably made using an outer sheath.

[0027] It should be noted that in the following content, when the deflection plate 039 of the deflection structure 003 adopts this embodiment, the connection between the deflection plate 039 and the first cover plate 021 and the second cover plate 022 has a translational movement space in the X-axis direction and is limited in the Y-axis direction, see Figure 5 Furthermore, after the movable upper cover 002 is disconnected, to improve stability, specifically both dynamic and static stability, the connection between the deflector plate 039 and the basket frame 011 constrains the deflector plate 039 in the Z and Y axes. This allows the first cover plate 021 and the second cover plate 022 to move horizontally, controlled by the movable portion 122 and the deflector plate 039, respectively.

[0028] The structure of the chip clamping plate 10 is part of the existing technology and is not an improved part of this embodiment. It will not be described here. Only the installation method in this embodiment will be described: the bottom edge of each chip clamping plate 10 is embedded in a corresponding set of vertical slots 111, and the upper edge is embedded in the corresponding horizontal slot 222, forming an installation method with upper and lower constraints.

[0029] The distance between the two fences 013 matches the width of the wafer clamping plate 10, and is used to prevent the wafer clamping plate 10 from being laterally displaced during the cleaning process.

[0030] At least one deflection structure 003 is provided at one end of the basket frame 011, preferably at both ends. This dual-end configuration provides a more uniform force distribution during the horizontal reciprocating movement of the movable upper cover 002, avoiding the torsional stress and uneven deformation that may result from single-end actuation, and ensuring that the movable upper cover 002 remains horizontal. Furthermore, the simultaneous operation of the two deflection structures 003 ensures synchronized movement of both ends of the movable upper cover 002, eliminating the oscillation or jitter that may occur with single-end actuation, and ensuring smoother and more precise changes in the tilt angle of the wafer clamping plate 10. Furthermore, even if one deflection structure 003 fails, the other end can still provide partial switching functionality, improving the system's fault tolerance and facilitating separate inspection and maintenance.

[0031] Each of the above-mentioned deflection structures 003 includes the following components: A tubular mounting seat 031 is vertically fixedly provided at the end of the basket frame 011 and is used to mount the actuating components of the deflection structure 003; A reversing rod 032 is coaxially disposed in the tubular mounting seat 031; the reversing rod 032 can move up and down in the tubular mounting seat 031 and rotate around its own axis; The spring 033 is mounted on the lower part of the reversing rod 032 in a ring. The lower end of the spring 033 abuts against the bottom of the tubular mounting seat 031, and the upper end supports the lower guide 034, providing an elastic reset force for the reversing rod 032 to move downward. The lower guide member 034 is fixed on the reversing rod 032 by a ring sleeve. It is located above the spring 033 and has a guiding slope structure on its upper edge. The upper guide member 035 is fixed on the reversing rod 032 by a ring sleeve and is located above the lower guide member 034. The lower edge of the upper guide member 035 is provided with a guiding inclined surface structure. The peripheral guide protrusion 036 provided on the outer circumference of the middle portion of the reversing rod 032 is located in the annular space between the upper guide member 035 and the lower guide member 034; An eccentric head 037 is fixedly mounted on the upper end of the reversing rod 032 and is provided with a vertical protrusion 038; The deflector plate 039 is fixed to the end of the movable upper cover 002 by bolt connection, and a long waist hole 391 is opened on the deflector plate 039.

[0032] Guide ramp structure: Figure 7 As shown, the guide slope of the upper guide member 035 includes: The first inclined surface 041 is a surface that slowly slopes upward, guiding the peripheral guide protrusion 036 to rise and causing the reversing rod 032 to rotate. The second inclined surface 042 is steeply inclined downward from the highest point of the first inclined surface 041 , and the inclination angle of the second inclined surface 042 is greater than that of the first inclined surface 041 ; The guiding slope of the lower guide member 034 includes: The third inclined surface 051 is steeply inclined from bottom to top, with an angle greater than that of the fourth inclined surface 052; The fourth inclined surface 052 is gently inclined downward from the highest point of the third inclined surface 051; The height relationship of the inclined surfaces is as follows: the lowest point of the third inclined surface 051 is lower than the lowest point of the fourth inclined surface 052 , and the lowest point of the first inclined surface 041 is higher than the lowest point of the second inclined surface 042 .

[0033] The coordinated effect of the guiding slopes: The guiding slopes of the upper guide member 035 and the lower guide member 034 are designed with different angles, forming a progressive guiding mechanism. The peripheral guide protrusions 036 generate different rotational resistances as they pass through each slope, ensuring smooth and accurate rotation of the reversing rod 032. The gradual inclination of the first and fourth slopes 041 and 052 ensures smooth reversal and prevents sudden angle changes from impacting the wafer clamping plate 10.

[0034] The vertical projection 038 of the eccentric head 037 passes through the long waist hole 391 of the deflector plate 039 from below, forming a sliding fit. When the reversing rod 032 rotates, the eccentric head 037 rotates synchronously, and the vertical projection 038 moves eccentrically within the long waist hole 391, pushing the deflector plate 039 and the movable upper cover 002 to move horizontally back and forth.

[0035] Reference Figure 13-15 The overall system operating mechanism: After entering the cleaning system through the feed port, the cleaning basket 001 is gripped by a fixture and transferred to the corresponding cleaning tank 2. The cleaning basket 001 is securely placed within the cleaning cage 20. The entire cleaning cage 20, along with the cleaning basket 001 within it, undergoes up and down reciprocating motion within the cleaning fluid. During this process, the deflection structure 003 on the cleaning basket 001 generates driving force through contact with the bottom of the cleaning tank, achieving dynamic reversal cleaning of the wafer clamping plate 10. After cleaning is complete, the fixture lifts the cleaning cage 20, removes the cleaning basket 001, and transfers it to the next cleaning tank or discharge port.

[0036] The specific steps include: Initial contact: The cleaning cage 20 drives the cleaning basket 001 to move up and down in the cleaning liquid, and the bottom of the reversing rod 032 contacts the bottom surface of the cleaning tank; Ascending stage: The reversing rod 032 is pushed upward, and the peripheral guide protrusion 036 first contacts the third inclined surface 051 of the lower guide member 034, and moves upward along the third inclined surface 051 to the highest point. During this process, the reversing rod 032 rotates about 90 degrees; Continue to rise: the peripheral guide protrusion 036 continues to move upward along the fourth inclined surface 052, and the reversing rod 032 continues to rotate 90 degrees to complete a 180-degree rotation; Descending stage: When the external force disappears, the elastic force of the spring 033 causes the reversing rod 032 to move downward, and the peripheral guide protrusion 036 contacts the first inclined surface 041 of the upper guide member 035, and moves downward along the first inclined surface 041, and the reversing rod 032 rotates 90 degrees again; Returning to the initial position: the peripheral guide protrusion 036 continues to move downward along the second inclined surface 042, and the reversing rod 032 completes the last 90-degree rotation, completing a complete rotation cycle of 360 degrees in total; During each up and down movement cycle, the reversing rod 032 rotates 180 degrees, driving the eccentric head 037 to rotate 180 degrees, causing the position of the vertical protrusion 038 in the long waist hole 391 to change, pushing the deflection plate 039 and the movable upper cover 002 to move horizontally, thereby changing the inclination angle of the chip clamping plate 10.

[0037] In another embodiment, a replaceable deflection structure solution is provided, Solution 1: a ballpoint pen-type pressing switching mechanism.

[0038] Product example: Ballpoint pen press-to-eject / retract refill mechanism.

[0039] The structure includes: lifting and pressing rod: equivalent to the pressing cap of a ballpoint pen, which obtains thrust as the cleaning basket moves up and down; built-in cam disc: there is a serrated cam groove on the disc, similar to the rotating disc inside a ballpoint pen; ratchet mechanism: cooperates with the cam disc, and each press causes the cam disc to rotate a fixed angle (such as 60 degrees); eccentric drive head: fixed on the cam disc, and the eccentric distance is designed to produce horizontal displacement when it rotates; connecting arm: transmits the movement of the eccentric drive head to the movable upper cover.

[0040] Working Principle: Each time the cleaning basket rises, the push rod is pushed upward, causing the pawl to rotate the cam plate 60 degrees. This completes a 360-degree cycle with six up-and-down movements. The eccentric motion of the eccentric drive head, through the connecting arm, pushes the movable cover left and right, achieving a periodic change in the wafer clamping plate's tilt angle.

[0041] Solution 2: Keyboard button type trigger reset mechanism, product example: mechanical keyboard button mechanism.

[0042] The structure includes: trigger rod: equivalent to the key rod of the keyboard, accepting up and down movement input; return spring: providing rebound force, similar to the rebound mechanism of the keyboard key; bistable switch: adopts a bistable structure similar to the keyboard micro switch; swing transmission arm: one end is connected to the bistable switch, and the other end is connected to the movable upper cover; limit guide rail: limits the movement trajectory of the transmission arm.

[0043] Working Principle: When the cleaning basket descends, the trigger lever contacts the pool bottom, generating an upward thrust similar to pressing a keyboard key. The bistable switch instantly switches state upon reaching the trigger point, driving the swing arm from one extreme position to the other. When the external force disappears, a return spring returns the trigger lever to its initial position, but the bistable switch retains its new state until the next trigger.

[0044] Through the above-mentioned deflection structure 003 and dynamic commutation mechanism, the present invention achieves the following significant technical effects: 1. Cleaning effect is significantly improved: The wafer clamping plate 10 periodically changes its tilt angle during the cleaning process, achieving multi-angle, all-around cleaning coverage. Compared to traditional fixed vertical cleaning methods, dynamic reversal allows the cleaning liquid to impact the wafer surface from different directions, effectively avoiding the formation of blind spots. The periodic change in tilt angle creates turbulence and impact force, particularly for fine impurities such as abrasive sand and metal particles trapped in the gap between the wafer clamping plates. This more effectively flushes out these stubborn contaminants.

[0045] 2. Ingenious and efficient structural design: The entire device utilizes a purely mechanical design, requiring no additional power source, control system, or electrical components. Relying solely on the reciprocating motion of the cleaning device itself to achieve 180-degree periodic reversal. This design not only significantly reduces equipment complexity and manufacturing costs, but also eliminates the risk of electrical failure, ensuring exceptional reliability and safety in cleaning fluid environments.

[0046] 3. Adaptive adjustment mechanism: The system automatically adapts to varying cleaning intensities and frequencies through the elastic restoring force provided by spring 033 and the multi-stage guide ramp structure (first ramp 041, second ramp 042, third ramp 051, and fourth ramp 052). The up and down movement of reversing rod 032 is automatically adjusted based on the depth of the cleaning tank and the up and down movement of the cleaning equipment. Reversal is not always achieved during each up and down movement. For example: Small amplitude movement: When the cleaning equipment swings slightly or the reversing rod 032 is in contact with the pool bottom for a short time, the peripheral guide protrusion 036 may only contact part of the guide slope and will not complete a full 360-degree rotation cycle. At this time, the wafer clamping plate 10 maintains a relatively stable angle for cleaning; During large-scale movement: When the cleaning equipment swings large enough so that the reversing rod 032 has sufficient up and down travel, the peripheral guide protrusion 036 can completely pass through all the guide inclined surfaces to complete a 360-degree rotation and a 180-degree reversal; Progressive response: As the cleaning intensity increases, the reversing frequency also increases accordingly, achieving automatic matching of cleaning intensity and reversing frequency.

[0047] This intelligent adaptive mechanism ensures the best cleaning effect under different cleaning conditions: it avoids ineffective reversing when the cleaning intensity is insufficient, and ensures sufficient reversing during strong cleaning, making the entire cleaning process more efficient and stable.

[0048] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present invention or exceeding the scope of the appended claims.

Claims

1. A quartz wafer cleaning system, characterized in that: include: An equipment housing (1), wherein a feed port and a discharge port are respectively provided on two sides of the equipment housing (1); A plurality of cleaning tanks (2) are arranged between the feed port and the discharge port; A cleaning basket (001) for loading the quartz crystal to be cleaned; A clamp for clamping the cleaning basket (001) and transferring it between the cleaning tanks (2); The cleaning basket (001) comprises: The basket frame (011) is provided with a vertical slot (111); A movable upper cover (002) provides upper restraint for the wafer clamping plate (10), wherein the movable upper cover (002) is provided with a transverse clamping groove (222) corresponding to the position of the vertical clamping groove (111) for restraining the upper edge of the wafer clamping plate (10); A deflection structure (003) is used to drive the movable upper cover (002) to move in translation; When the cleaning basket (001) moves back and forth in the cleaning liquid, the deflection structure (003) obtains driving force through contact with the bottom surface of the cleaning tank, driving the movable upper cover (002) to move back and forth horizontally, thereby changing the inclination angle of the chip clamping plate (10) and realizing dynamic reversing cleaning.

2. The quartz wafer cleaning system according to claim 1, characterized in that: The basket frame (011) is provided with a plurality of groups of vertical card slots (111) arranged in parallel and spaced apart on two side frames along the length direction. Each group of vertical card slots (111) is composed of symmetrical card slots located on both sides of the basket frame (011). Each group of vertical card slots (111) is used to carry a wafer clamping plate (10). The bottom of the vertical card slots (111) is provided with a secondary shallow groove whose width matches the thickness of the wafer clamping plate (10) for positioning the wafer clamping plate (10).

3. The quartz wafer cleaning system according to claim 1, wherein: The movable upper cover (002) is broken in the middle in the length direction and is divided into a first cover plate (021) and a second cover plate (022); the first cover plate (021) and the second cover plate (022) can move relative to each other to facilitate the loading and positioning of the wafer clamping plate (10).

4. The quartz wafer cleaning system according to claim 3, characterized in that: Limiting posts (112) are provided on both sides of the basket frame (011), and corresponding limiting waist holes (113) are provided on the first cover plate (021) and the second cover plate (022) to limit the moving directions of the first cover plate (021) and the second cover plate (022).

5. The quartz wafer cleaning system according to claim 4, characterized in that: An outward expansion spring (114) is looped around the limiting column (112) to keep the first cover plate (021) and the second cover plate (022) in an outward expansion state.

6. The quartz wafer cleaning system according to claim 5, characterized in that: The cleaning basket (001) further comprises a handle (012), wherein the handle (012) comprises a fixed portion (121) and a movable portion (122); The two ends of the movable portion (122) are provided with pressing portions (123) for controlling the convergence of the first cover plate (021) and the second cover plate (022).

7. The quartz wafer cleaning system according to claim 1, wherein: The cleaning cage (20) is also included. The cleaning basket (001) is fixedly placed in the cleaning cage (20). The entire cleaning cage (20) together with the cleaning basket (001) therein performs up and down reciprocating motion in the cleaning liquid.

8. The quartz wafer cleaning system according to claim 1, wherein: The deflection structure (003) is arranged at two ends of the basket frame (011).

9. A dynamic reversing cleaning method for a quartz wafer, characterized in that: The following steps are involved: S1: The wafer clamping plate (10) is placed in the vertical slot (111) of the cleaning basket (001), and the wafer clamping plate (10) is constrained up and down by the horizontal slot (222) of the movable upper cover (002); S2: placing the cleaning basket (001) loaded with the wafer clamping plate (10) into the cleaning liquid in the cleaning tank (2); S3: driving the cleaning basket (001) to perform up and down reciprocating motion in the cleaning liquid; S4: During the up and down reciprocating motion, the deflection structure (003) obtains a driving force by contacting the bottom surface of the cleaning tank, driving the movable upper cover (002) to move horizontally back and forth, causing the tilt angle of the wafer clamping plate (10) to change periodically; S5: By periodically changing the tilt angle of the wafer clamping plate (10), the cleaning liquid is allowed to impact and clean the wafer surface from different directions, thereby achieving a dynamic reversing cleaning effect.

10. The dynamic reversing cleaning method for a quartz wafer according to claim 9, characterized in that: In step S4, each up-and-down movement cycle causes the deflection structure (003) to reverse 180 degrees, pushing the movable upper cover (002) to move horizontally between two extreme positions, so that the wafer clamping plate (10) switches between two different tilt angles.

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