Ultra-thin vapor chamber production assembly and ultra-thin vapor chamber manufacturing method

Abstract

This disclosure provides an assembly for producing an ultra-thin heat spreader and a method for manufacturing an ultra-thin heat spreader. The assembly includes a heat spreader sintering mold and a support component sintering mold. The heat spreader sintering mold has a heat spreader limiting groove adapted to fit the stamping flange of the lower cover plate of the ultra-thin heat spreader, the limiting groove accommodating the limiting stamping flange. The support component sintering mold is used for sintering and manufacturing the support component, and has a sintering shaping groove. One end of the support component sintering mold with the sintering shaping groove is adapted to fit the stamping groove of the lower cover plate. Multiple sintering shaping grooves are provided, each located at a predetermined position on the support component sintering mold, so that the multiple sintering shaping grooves are evenly distributed on the support component sintering mold. This assembly not only improves the production quality of the ultra-thin heat spreader but also reduces its production cost.

Description

Technical Field

[0001] This disclosure relates to the technical field of ultra-thin heat spreader production process, and in particular to an ultra-thin heat spreader production component and an ultra-thin heat spreader manufacturing method. Background Technology

[0002] Vacuum chamber (VC) heat spreaders, also known as vapor chamber heat spreaders, are typically made of copper or stainless steel and are highly efficient heat dissipation devices based on heat transfer principles. A heat spreader mainly consists of a sealed upper and lower cover, with a capillary layer inside the sealed cavity filled with a working medium. High-power heat spreaders now commonly use a layer of sintered copper powder on the lower cover as a capillary carrier. The sintered copper powder structure has a large heat capacity, which can meet the high-power requirements of electronic products. The traditional manufacturing process for vapor chambers involves several steps: First, multiple copper powder support pillars are sintered individually. Then, these pillars are placed in pre-defined positions within the stamping groove of the lower cover, ensuring even distribution. Next, the upper cover is closed, with the ends of the copper powder support pillars abutting against both the upper and lower covers, aligning the outer edges of the upper and lower covers. Finally, the outer edges of the upper and lower covers are sealed and sintered together to form a vacuum cavity, and the ends of the copper powder support pillars are sintered and fixed to both covers, forming the capillary structure of the vapor chamber. However, this complex manufacturing process significantly increases both the difficulty and cost of producing vapor chambers.

[0003] Existing patent CN220761003U discloses a copper powder sintering fixture for a heat spreader plate, which includes an upper cover plate and a lower cover plate that overlap each other. An upper mold and a lower mold are respectively provided on the inner sides of the upper and lower cover plates. The lower mold is used to install the heat spreader plate cover plate, and the space between the upper and lower molds is a cavity for filling copper powder. By injecting powder into the powder injection channel, a planar copper powder layer can be formed in the cavity. The surface of the upper mold has holes arranged to form copper powder support pillars. In an embodiment, the upper mold protrudes from the inner side of the upper cover plate, and the lower mold is recessed into the inner side of the lower cover plate. The upper and lower molds cooperate to form the powder injection cavity. The above-mentioned sintering fixture has a simple structure and can complete the sintering and forming of the copper powder support pillars and the sintering and fixing of the copper powder support pillars to the upper and lower cover plates in one step, thereby greatly reducing the manufacturing steps of the heat spreader plate. This not only significantly reduces the production difficulty of the heat spreader plate but also significantly reduces its production cost.

[0004] However, when using the aforementioned sintering fixture to manufacture ultra-thin VC heat exchange plates, the thickness of the ultra-thin VC heat exchange plate is much thinner than that of ordinary heat exchange plates (the thickness of ultra-thin VC heat exchange plates is generally less than 0.3 mm, while the thickness of ordinary heat exchange plates is generally more than 0.8 mm). This makes it easy for the lower cover plate to deform or even melt and be damaged due to excessively high heating temperature and excessively long heating time when the aforementioned sintering fixture completes the sintering and forming of the copper powder support column and the sintering and fixing of the copper powder support column to the upper and lower cover plates in one go. At the same time, if the heating temperature or heating time during the sintering of the copper powder support column does not reach the preset requirement range, the structural strength of the copper powder support column is easily reduced, making it impossible for the copper powder support column to effectively support the ultra-thin VC heat exchange plate. As a result, the traditional heat exchange plate manufacturing process is still used when manufacturing ultra-thin VC heat exchange plates, which not only greatly increases the manufacturing difficulty of the heat exchange plate, but also greatly increases the production cost of the heat exchange plate. Summary of the Invention

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide an ultra-thin heat spreader production assembly and an ultra-thin heat spreader manufacturing method that can not only improve the production quality of ultra-thin heat spreaders but also reduce the production cost of ultra-thin heat spreaders.

[0006] The purpose of this disclosure is achieved through the following technical solution:

[0007] An ultra-thin heat spreader production assembly is used to manufacture an ultra-thin heat spreader, and the ultra-thin heat spreader production assembly includes a heat spreader sintering mold and a support sintering mold.

[0008] The heat spreader sintering mold is formed with a heat spreader limiting groove adapted to the stamping flange of the lower cover plate of the ultra-thin heat spreader, and the heat spreader limiting groove is used to accommodate and limit the stamping flange.

[0009] The sintering mold for the support component is used to sinter and manufacture the support component. The sintering mold for the support component has a sintering shaping groove, which is used to shape the support component. One end of the sintering mold for the support component has the sintering shaping groove and is adapted to the stamping groove of the lower cover plate. There are multiple sintering shaping grooves, and each sintering shaping groove is respectively set at a preset position of the sintering mold for the support component, so that the multiple sintering shaping grooves are evenly distributed in the sintering mold for the support component.

[0010] In one embodiment, the bottom of the heat spreader limiting groove is further formed with a stepped positioning groove for matching the stepped stamping flange of the lower cover plate. The stepped positioning groove is formed at the bottom of the heat spreader limiting groove and is connected to the heat spreader limiting groove.

[0011] In one embodiment, the sintering mold of the support member has a positioning flange formed on one side of the sintering shaping groove for matching the stepped stamping groove of the lower cover plate.

[0012] In one embodiment, the sintering shaping groove includes a support column shaping groove and a support strip shaping groove. There are multiple support column shaping grooves and support strip shaping grooves. The multiple support column shaping grooves and multiple support strip shaping grooves are evenly arranged on one side of the support member sintering mold where the sintering shaping groove is formed, and the multiple support strip shaping grooves are arranged parallel to each other at intervals.

[0013] In one embodiment, a length limiting groove is formed at the bottom of each of the support bar shaping grooves, the length limiting groove being used to limit the length of the support bar of the support member.

[0014] In one embodiment, the sintering mold for the support member has a first abutment surface on one side for abutting the bottom of the stamping groove, and a second abutment surface on the other side for abutting the bottom of the stepped stamping groove, the second abutment surface being formed on the positioning flange. The sintering shaping groove includes a first sintering shaping groove and a second sintering shaping groove. The first sintering shaping groove is formed on the first abutment surface, the second sintering shaping groove is formed on the second abutment surface, the vertical height from the first abutment surface to the bottom of the first sintering shaping groove is a first height, the vertical height from the second abutment surface to the bottom of the second sintering shaping groove is a second height, and the vertical height from the second abutment surface to the first abutment surface is a third height. The second height is equal to the sum of the first height and the third height.

[0015] In one embodiment, a folded edge limiting groove is formed on the outer periphery of the opening of the heat-spreading plate limiting groove of the heat-spreading plate sintering mold. The heat-spreading plate limiting groove is connected to the folded edge limiting groove. The folded edge limiting groove is used to adapt to the folded edge of the lower cover plate. The folded edge limiting groove is used to accommodate and limit the folded edge of the lower cover plate.

[0016] In one embodiment, the folded edge limiting groove is adapted to the upper cover plate of the ultra-thin heat spreader, and the folded edge limiting groove is used to limit the upper cover plate.

[0017] A method for manufacturing an ultrathin heat spreader, comprising using the ultrathin heat spreader production assembly described in any of the above embodiments to manufacture the ultrathin heat spreader, the method comprising:

[0018] The lower cover plate is placed at a preset position in the heat spreader sintering mold so that the stamping flange receiving limit is located in the heat spreader limiting groove.

[0019] Copper powder is poured into the sintering and shaping groove of the sintering mold of the support component until the copper powder is flush with the horizontal plane at the opening of the sintering and shaping groove.

[0020] The copper powder in the sintering mold of the support is sintered to shape the copper powder in the sintering and shaping groove into the support.

[0021] The sintering mold of the sintered support member with the sintering shaping groove is inverted into the stamping groove of the lower cover plate, and the sintering mold of the heat spreader plate is vibrated so that the sintered support member is detached from the sintering shaping groove and falls to the preset position of the lower cover plate.

[0022] After all the supporting components are removed from the supporting component sintering mold, the supporting component sintering mold is removed from the stamping groove, and the upper cover plate of the ultra-thin heat spreader is placed on the lower cover plate so that the outer periphery of the lower cover plate abuts against the outer periphery of the upper cover plate. At the same time, the two ends of the supporting components abut against and support the upper cover plate and the lower cover plate respectively to form an ultra-thin heat spreader semi-finished product.

[0023] The ultra-thin heat spreader semi-finished product in the heat spreader sintering mold is sintered to seal and fix the outer periphery of the lower cover plate to the outer periphery of the upper cover plate, so that the lower cover plate and the upper cover plate together form a vacuum cavity, and at the same time, the two ends of the support member are sintered and fixed to the upper cover plate and the lower cover plate respectively.

[0024] In one embodiment, before the sintering mold of the sintered support member, having the sintering shaping groove formed at one end, is inverted into the stamping groove of the lower cover plate, the method for manufacturing the ultrathin heat spreader plate further includes:

[0025] The first copper mesh is welded to the upper cover plate, which covers one side of the lower cover plate, and the second copper mesh is welded to the bottom of the stamping groove of the lower cover plate.

[0026] Compared with the prior art, this disclosure has at least the following advantages:

[0027] 1. In the above-mentioned ultra-thin heat spreader production assembly, the heat spreader sintering mold is formed with a heat spreader limiting groove that is adapted to the stamping flange of the lower cover plate of the ultra-thin heat spreader. The heat spreader limiting groove is used to accommodate the limiting stamping flange so that the lower cover plate can be reliably limited in the heat spreader sintering mold by the stamping flange. This avoids the phenomenon of the lower cover plate shaking or displacement relative to the heat spreader sintering mold during the manufacturing process of the ultra-thin heat spreader, which greatly improves the manufacturing stability of the ultra-thin heat spreader production assembly and thus greatly improves the production quality of the ultra-thin heat spreader.

[0028] 2. Since the sintering mold for the support component is used for sintering and manufacturing the support component, the sintering mold has sintering and shaping grooves. These grooves are used to shape the support component. One end of the sintering mold with the sintering and shaping groove is adapted to fit the stamping groove of the lower cover plate. There are multiple sintering and shaping grooves, each set at a preset position on the sintering mold, so that the multiple sintering and shaping grooves are evenly distributed on the sintering mold. When it is necessary to evenly arrange the support component in the stamping groove... At the bottom, the production worker only needs to invert the end of the sintering mold with the sintering shaping groove formed after the sintering operation is completed into the stamping groove and vibrate the sintering mold of the heat exchange plate. This allows the support to fall from the sintering shaping groove and drop to the preset position at the bottom of the stamping groove, thereby making the support evenly distributed at the bottom of the stamping groove. This greatly reduces the manufacturing steps of the ultra-thin heat exchange plate, which not only greatly reduces the production difficulty of the ultra-thin heat exchange plate, but also greatly reduces the production cost of the ultra-thin heat exchange plate. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of an ultrathin heat spreader production assembly according to one embodiment;

[0031] Figure 2 for Figure 1 A partial structural schematic diagram of the ultrathin heat spreader production assembly is shown.

[0032] Figure 3 for Figure 2 A partially enlarged schematic diagram of the ultra-thin heat spreader production assembly;

[0033] Figure 4 for Figure 1 Another partial structural diagram of the ultrathin heat spreader production assembly is shown;

[0034] Figure 5 for Figure 4 A partially enlarged schematic diagram of the ultrathin heat spreader production assembly shown;

[0035] Figure 6 for Figure 4 A schematic diagram of the CC cross-section of the ultrathin heat spreader production assembly shown.

[0036] Figure 7 for Figure 6A partially enlarged schematic diagram of the ultrathin heat spreader production assembly shown;

[0037] Figure 8 for Figure 4 Another perspective view of the ultra-thin heat spreader production assembly;

[0038] Figure 9 This is a schematic diagram of an ultra-thin heat spreader.

[0039] Figure 10 This is a partial structural diagram of an ultrathin heat spreader.

[0040] Figure 11 for Figure 10 Another perspective view of the ultrathin heat spreader shown;

[0041] Figure 12 This is a schematic diagram of the actual sintering mold for the support component;

[0042] Figure 13 A schematic diagram of the stamping groove of the sintering mold for the support component being inverted onto the lower cover plate;

[0043] Figure 14 A schematic diagram of the stamping groove for the support components arranged in the lower cover plate;

[0044] Figure 15 This is a schematic diagram of the support component and the sintering mold for the support component;

[0045] Figure 16 This is another physical schematic diagram of an ultra-thin heat spreader;

[0046] Figure 17 This is a schematic diagram of the manufacturing process of an ultrathin heat spreader.

[0047] Reference numerals: Ultra-thin heat spreader production assembly 10; Heat spreader sintering mold 101; Heat spreader limiting groove 1011; Stepped positioning groove 1012; Folding edge limiting groove 1013; Support contact surface 10131; Support component sintering mold 102; Sintering shaping groove 1021; Support column shaping groove 10211; Support strip shaping groove 10212; Length limiting groove 102121; First sintering shaping groove 10213; Second sintering shaping groove 10214; Positioning flange 1 022; First contact surface 1023; Second contact surface 1024; First height H1; Second height H2; Third height H3; Ultra-thin heat spreader 20; Upper cover plate 201; Lower cover plate 202; Stamped flange 2021; Stamped groove 2022; Stepped stamped flange 2023; Stepped stamped groove 2024; Folded edge 2025; Support member 203; Support strip 2031; Support column 2032; Guide channel 204; First copper mesh 205; Second copper mesh 206. Detailed Implementation

[0048] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0049] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0051] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0052] like Figures 1 to 16 As shown, an embodiment of the ultrathin heat spreader production assembly 10 is used to manufacture an ultrathin heat spreader 20. The ultrathin heat spreader production assembly 10 includes a heat spreader sintering mold 101 and a support sintering mold 102. The heat spreader sintering mold 101 is formed with a heat spreader limiting groove 1011 for matching the stamping flange 2021 of the lower cover plate 202 of the ultrathin heat spreader 20. The heat spreader limiting groove 1011 is used to accommodate the limiting stamping flange 2021 so that the lower cover plate 202 can be reliably limited within the heat spreader sintering mold 101 by the stamping flange 2021. This avoids the phenomenon of the lower cover plate 202 shaking or shifting relative to the heat spreader sintering mold 101 during the manufacturing process of the ultrathin heat spreader 20, which greatly improves the manufacturing stability of the ultrathin heat spreader production assembly 10 and thus greatly improves the production quality of the ultrathin heat spreader 20.

[0053] like Figures 1 to 16As shown, further, the support sintering mold 102 is used to sinter and manufacture the support 203. The support sintering mold 102 has a sintering shaping groove 1021, which is used to shape the support 203. One end of the support sintering mold 102 with the sintering shaping groove 1021 is adapted to the stamping groove 2022 of the lower cover plate 202. There are multiple sintering shaping grooves 1021, each of which is set at a preset position in the support sintering mold 102, so that the multiple sintering shaping grooves 1021 are evenly arranged in the support sintering mold 102. When it is necessary to evenly shape the support 203... When the support member 203 is evenly distributed at the bottom of the stamping groove 2022, the production operator only needs to invert one end of the sintering mold 102 of the support member after the sintering operation is completed, which has the sintering shaping groove 1021, into the stamping groove 2022 and vibrate the heat exchange plate sintering mold 101. This allows the support member 203 to fall from the sintering shaping groove 1021 and drop to the preset position at the bottom of the stamping groove 2022, thereby making the support member 203 evenly distributed at the bottom of the stamping groove 2022. This greatly reduces the manufacturing steps of the ultra-thin heat exchange plate 20, which not only greatly reduces the production difficulty of the ultra-thin heat exchange plate 20, but also greatly reduces the production cost of the ultra-thin heat exchange plate 20.

[0054] The aforementioned ultra-thin heat spreader production assembly 10 has a heat spreader limiting groove 1011 formed in the heat spreader sintering mold 101 to match the stamping flange 2021 of the lower cover plate 202 of the ultra-thin heat spreader 20. The heat spreader limiting groove 1011 is used to accommodate the limiting stamping flange 2021, so that the lower cover plate 202 can be reliably limited within the heat spreader sintering mold 101 by the stamping flange 2021. This avoids the phenomenon of the lower cover plate 202 shaking or shifting relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20, which greatly improves the manufacturing stability of the ultra-thin heat spreader production assembly 10 and thus greatly improves the production quality of the ultra-thin heat spreader 20.

[0055] Furthermore, since the support component sintering mold 102 is used for sintering and manufacturing the support component 203, the support component sintering mold 102 has a sintering shaping groove 1021, which is used to shape the support component 203. One end of the support component sintering mold 102 with the sintering shaping groove 1021 is adapted to fit the stamping groove 2022 of the lower cover plate 202. There are multiple sintering shaping grooves 1021, each of which is set at a preset position in the support component sintering mold 102, so that the multiple sintering shaping grooves 1021 are evenly distributed in the support component sintering mold 102. When it is necessary to evenly arrange the support component 203... When the support member 203 is at the bottom of the stamping groove 2022, the production operator only needs to invert one end of the support member sintering mold 102 with the sintering shaping groove 1021 formed after the sintering operation is completed and place it inside the stamping groove 2022 and vibrate the heat exchange plate sintering mold 101. This will cause the support member 203 to fall off from the sintering shaping groove 1021 and fall to the preset position at the bottom of the stamping groove 2022. This will make the support member 203 evenly distributed at the bottom of the stamping groove 2022, thereby greatly reducing the manufacturing steps of the ultra-thin heat exchange plate 20. This not only greatly reduces the production difficulty of the ultra-thin heat exchange plate 20, but also greatly reduces the production cost of the ultra-thin heat exchange plate 20.

[0056] like Figure 1 As shown, in this embodiment, the heat spreader sintering mold 101 is a graphite sintering fixture, so that the heat spreader sintering mold 101 can have good high temperature resistance, corrosion resistance, wear resistance and thermal conductivity. At the same time, it can also reduce the demolding difficulty of the ultra-thin heat spreader 20. This not only greatly improves the stability and service life of the heat spreader sintering mold 101, but also greatly reduces the production difficulty of the ultra-thin heat spreader 20.

[0057] like Figure 1 As shown, in this embodiment, the support sintering mold 102 is a graphite sintering fixture, so that the support sintering mold 102 can have good high temperature resistance, corrosion resistance, wear resistance and thermal conductivity, and at the same time reduce the demolding difficulty of the support 203. This not only greatly improves the stability and service life of the support sintering mold 102, but also greatly reduces the production difficulty of the ultra-thin heat spreader 20.

[0058] like Figures 4 to 7 As shown, in one embodiment, the bottom of the sintering and shaping tank 1021 is a horizontal contact surface to increase the contact area between the support member 203 and the upper cover plate 201 and the lower cover plate 202, so as to avoid the phenomenon of puncturing and damaging the upper cover plate 201 or the lower cover plate 202 due to the excessive sharpness of the end of the support member 203, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0059] like Figures 2 to 11As shown, in one embodiment, the bottom of the heat spreader limiting groove 1011 is further formed with a stepped positioning groove 1012 for matching with the stepped stamping flange 2023 of the lower cover plate 202. The stepped positioning groove 1012 is formed at the bottom of the heat spreader limiting groove 1011 and communicates with the heat spreader limiting groove 1011 to reduce the difficulty of aligning the lower cover plate 202 with the heat spreader limiting groove 1011. This allows the lower cover plate 202 to be quickly and accurately installed at the preset position of the heat spreader sintering mold 101 via the stepped stamping flange 2023, thereby greatly reducing the difficulty of aligning the lower cover plate 202 with the heat spreader limiting groove 1011. The difficulty of installing the 02 at the preset position of the heat spreader limiting groove 1011 not only greatly reduces the production cost of the ultra-thin heat spreader 20, but also greatly improves the production efficiency of the ultra-thin heat spreader 20. At the same time, the heat spreader sintering mold 101 can more reliably limit the lower cover plate 202 in the heat spreader limiting groove 1011 through the stepped positioning groove 1012, further avoiding the phenomenon of the lower cover plate 202 shaking or shifting relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0060] like Figures 4 to 13 As shown, in one embodiment, the sintering mold 102 of the support member has a sintering shaping groove 1021 on one side, and a positioning flange 1022 is formed on the side for matching with the stepped stamping groove 2024 of the lower cover plate 202. This reduces the difficulty of aligning the sintering mold 102 of the support member with the stamping groove 2022 of the lower cover plate 202, allowing the sintering mold 102 of the support member to be quickly and accurately installed at the preset position of the lower cover plate 202 via the positioning flange 1022. This greatly reduces the difficulty of installing the lower support member sintering mold 102 at the preset position of the stamping groove 2022 of the lower cover plate 202, and significantly reduces the production cost of the ultra-thin heat spreader plate 20. Furthermore, it greatly improves the production efficiency of the ultra-thin heat spreader plate 20; at the same time, the support component sintering mold 102 can be more reliably positioned in the stamping groove 2022 of the lower cover plate 202 through the positioning flange 1022, so that during the process of separating the support component 203 from the support component 203 sintering mold by vibrating the heat spreader plate sintering mold 101, the phenomenon of the support component sintering mold 102 shaking or displacing relative to the lower cover plate 202 is effectively avoided, thereby ensuring that each support component 203 can be accurately placed in the preset position of the lower cover plate 202 after being removed from the support component sintering mold 102, thereby further improving the production quality of the ultra-thin heat spreader plate 20.

[0061] like Figures 14 to 16As shown, in one embodiment, the support member 203 includes a support strip 2031 and a support column 2032. Both ends of the support strip 2031 and the support column 2032 are respectively used to abut against and support the upper cover plate 201 and the lower cover plate 202. The support area of ​​the support strip 2031 is larger than that of the support column 2032, so that both ends of the support member 203 can better support the upper cover plate 201 and the lower cover plate 202, thereby greatly improving the structural strength of the ultra-thin heat spreader 20, and thus greatly improving the stability and service life of the ultra-thin heat spreader 20.

[0062] like Figures 14 to 16 As shown, in one embodiment, the support strip 2031 is a copper powder support strip, and the support column 2032 is a copper powder support column, so that the support members 203 have good structural strength and thermal conductivity.

[0063] like Figures 4 to 11 As shown, in one embodiment, the sintering shaping groove 1021 includes a support column shaping groove 10211 and a support strip shaping groove 10212. There are multiple support column shaping grooves 10211 and support strip shaping grooves 10212. These multiple support column shaping grooves 10211 and multiple support strip shaping grooves 10212 are evenly arranged on one side of the support member sintering mold 102 where the sintering shaping groove 1021 is formed. This ensures that when the support member sintering mold 102 is inverted onto the lower cover plate 202 at a preset position and all support columns 2032 and support strips 2031 are separated from the support member sintering mold 102 by vibration, the multiple support columns 2032 and multiple support strips 2031 can be evenly arranged at the bottom of the stamping groove 2022 of the lower cover plate 202. This not only ensures that when the ultra-thin heat spreader 20 is subjected to external pressure or impact, the evenly distributed support columns 2032 and support strips 2031 can maintain their position. 1. It can better disperse stress, effectively preventing the upper cover plate 201 and lower cover plate 202 from deforming or even being damaged due to excessive local stress, thereby further improving the service life and stability of the ultra-thin heat spreader plate 20. It can also reduce the flow resistance of steam in the ultra-thin heat spreader plate 20, improve the flow efficiency of steam, and ensure that steam can flow evenly in the ultra-thin heat spreader plate 20, thereby greatly improving the heat dissipation efficiency and heat dissipation uniformity of the ultra-thin heat spreader plate 20. In addition, multiple support strip shaping grooves 10212 are arranged parallel to each other so that the support strips 2031, upper cover plate 201 and lower cover plate 202 can jointly form a guide channel 204, so that steam flows along the guide channel 204 inside the ultra-thin heat spreader plate 20, further reducing the flow resistance of steam in the ultra-thin heat spreader plate 20, improving the flow efficiency of steam, and thus greatly improving the heat dissipation efficiency of the ultra-thin heat spreader plate 20.

[0064] It is understandable that when copper powder is sintered into support 203, its volume will shrink, especially support strip 2031. If the length of support strip 2031 is too short, it will greatly shorten the length of guide channel 204, which will greatly reduce the guiding effect of guide channel 204, thereby reducing the flow efficiency of steam inside ultrathin heat spreader 20, and thus greatly reducing the heat dissipation efficiency of ultrathin heat spreader 20.

[0065] like Figures 4 to 5 As shown, in one embodiment, a length limiting groove 102121 is formed at the bottom of each support bar shaping groove 10212. The length limiting groove 102121 is used to limit the length of the support bar 2031 so that when the support bar 2031 shrinks during sintering, the length limiting groove 102121 can limit the support bar 2031 to a preset length range and avoid the phenomenon that the flow efficiency of steam inside the ultra-thin heat spreader 20 is reduced due to the support bar 2031 being too short, thereby greatly improving the heat dissipation efficiency of the ultra-thin heat spreader 20.

[0066] like Figures 4 to 5 As shown, in one embodiment, there are multiple length limiting grooves 102121. These multiple length limiting grooves 102121 are evenly arranged at the bottom of the support strip shaping groove 10212. This prevents the support strip 2031 from cracking or even breaking due to uneven force when the length limiting groove 102121 restricts the length of the support strip 2031. This ensures that the ultra-thin heat dissipation plate 20 has good production quality and heat dissipation efficiency.

[0067] like Figures 4 to 8As shown, in one embodiment, the support member sintering mold 102 has a first abutment surface 1023 on one side for abutting against the bottom of the stamping groove 2022, and a second abutment surface 1024 on one side for abutting against the bottom of the stepped stamping groove 2024. The second abutment surface 1024 is formed on the positioning flange 1022. The sintering and shaping groove 1021 includes a first sintering and shaping groove 10213 and a second sintering and shaping groove 10214. The first sintering and shaping groove 10213 is formed on the first abutment surface 1023, and the second sintering and shaping groove 10214 is formed on the second abutment surface 1024. The first abutment surface 1023 extends to the bottom of the first sintering and shaping groove 10213. The vertical height of the second contact surface 1024 to the bottom of the second sintering and shaping groove 10214 is the first height H1; the vertical height of the second contact surface 1024 to the first contact surface 1023 is the third height H3. The second height H2 is equal to the sum of the first height H1 and the third height H3, so that when the support member 203 is removed from the support member sintering mold 102 and arranged at the preset position of the lower cover plate 202, the ends of all support members 203 away from the lower cover plate 202 can be on the same horizontal plane, ensuring that both ends of all support members 203 can respectively abut and support the upper cover plate 201 and the lower cover plate 202, thereby greatly improving the production quality of the ultra-thin heat spreader plate 20.

[0068] like Figures 6 to 8 As shown, in one embodiment, the first contact surface 1023 is a horizontal contact surface, which makes it easier for the production worker to scrape off the copper powder that overflows from the sintering and shaping tank 1021, greatly reducing the manufacturing difficulty of the support 203 and thus greatly improving the production efficiency of the ultra-thin heat spreader 20.

[0069] like Figures 6 to 8 As shown, in one embodiment, the second contact surface 1024 is a horizontal contact surface, which makes it easier for the production worker to scrape off the copper powder that overflows from the sintering and shaping tank 1021, greatly reducing the manufacturing difficulty of the support 203 and thus greatly improving the production efficiency of the ultra-thin heat spreader 20.

[0070] like Figure 3 and Figure 10As shown, in one embodiment, a folded edge limiting groove 1013 is formed on the outer periphery of the opening of the heat-spreading plate limiting groove 1011 of the heat-spreading plate sintering mold 101. The heat-spreading plate limiting groove 1011 and the folded edge limiting groove 1013 are connected. The folded edge limiting groove 1013 is used to adapt to the folded edge 2025 of the lower cover plate 202. The folded edge limiting groove 1013 is used to accommodate and limit the folded edge 2025 of the lower cover plate 202, so that the lower cover plate 202 can be more securely limited in the heat-spreading plate limiting groove 1011 of the heat-spreading plate sintering mold 101. This further avoids the phenomenon of the lower cover plate 202 shaking or shifting relative to the heat-spreading plate sintering mold 101 during the manufacturing process of the ultra-thin heat-spreading plate 20, which greatly improves the manufacturing stability of the ultra-thin heat-spreading plate production component 10, and thus greatly improves the production quality of the ultra-thin heat-spreading plate 20.

[0071] like Figure 3 and Figure 10 As shown, in one embodiment, the bottom of the folded edge limiting groove 1013 is formed with a supporting abutment surface 10131. The supporting abutment surface 10131 is used to abut against the folded edge 2025 of the supporting lower cover plate 202, so as to avoid the deformation caused by the large pressure on the folded edge 2025 of the lower cover plate 202 when the upper cover plate 201 is covered by the lower cover plate 202, thereby greatly improving the production quality of the ultra-thin heat spreader plate 20.

[0072] like Figure 3 and Figure 10 As shown, in one embodiment, the support abutment surface 10131 is a horizontal abutment surface, so that the support abutment surface 10131 can better abut against the folded edge 2025 of the support lower cover plate 202, thereby greatly improving the load-bearing capacity of the folded edge 2025.

[0073] like Figure 3 and Figure 16 As shown, in one embodiment, the folded edge limiting groove 1013 is also used to adapt to the upper cover plate 201 of the ultra-thin heat spreader plate 20. The folded edge limiting groove 1013 is used to limit the upper cover plate 201 so that when the upper cover plate 201 can accurately cover the lower cover plate 202 at a preset position through the folded edge limiting groove 1013, the upper cover plate 201 can also be reliably limited to the lower cover plate 202 at a preset position through the folded edge limiting groove 1013. This effectively avoids the phenomenon of the upper cover plate 201 shaking or shifting relative to the lower cover plate 202 when the upper cover plate 201 and the lower cover plate 202 are sintered and fixed, thereby greatly improving the production quality of the ultra-thin heat spreader plate 20.

[0074] like Figure 3 and Figure 9As shown, in one embodiment, the vertical height from the bottom of the folded edge limiting groove 1013 to the opening of the folded edge limiting groove 1013 is less than the sum of the thickness of the upper cover plate 201 and the thickness of the folded edge 2025 of the lower cover plate 202, so that the upper cover plate 201 partially protrudes from the horizontal plane where the opening of the heat spreader limiting groove 1011 is located. This allows the side of the heat spreader sintering mold 101 away from the heat spreader limiting groove 1011 to abut against and press against the top of the upper cover plate 201 when multiple heat spreader sintering molds 101 are stacked. As a result, the upper cover plate 201 can more reliably abut against and limit the lower cover plate 202 at a preset position, further preventing the upper cover plate 201 from shaking or shifting relative to the lower cover plate 202 when the upper cover plate 201 and the lower cover plate 202 are sintered and fixed, thereby greatly improving the production quality of the ultra-thin heat spreader plate 20.

[0075] like Figure 7 and Figure 10 As shown, in one embodiment, the first height H1 is equal to the vertical height from the horizontal plane where the opening of the stamping groove 2022 of the lower cover plate 202 is located to the bottom of the stamping groove 2022, and the second height H2 is equal to the vertical height from the horizontal plane where the opening of the stepped stamping groove 2024 is located to the bottom of the stepped stamping groove 2024 of the lower cover plate 202, so that when the support member 203 is arranged at the preset position of the lower cover plate 202, the two ends of the support member 203 can respectively abut against and support the upper cover plate 201 and the lower cover plate 202, thereby greatly improving the production quality of the ultra-thin heat spreader plate 20.

[0076] like Figure 17 As shown, this disclosure also provides a method for manufacturing an ultrathin heat spreader plate, wherein an ultrathin heat spreader plate 20 is manufactured using the ultrathin heat spreader plate production assembly 10 described in any of the above embodiments. The method for manufacturing an ultrathin heat spreader plate includes some or all of the following steps:

[0077] S101, the lower cover plate 202 is placed at the preset position of the heat-spreading plate sintering mold 101 so that the stamping flange 2021 is contained within the heat-spreading plate limiting groove 1011.

[0078] In this embodiment, the lower cover plate 202 is placed at a preset position in the heat spreader sintering mold 101 so that the stamping flange 2021 is contained within the heat spreader limiting groove 1011. This ensures that the lower cover plate 202 is securely contained within the heat spreader sintering mold 101 by the stamping flange 2021, preventing the lower cover plate 202 from shaking or shifting relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20. This greatly improves the manufacturing stability of the ultra-thin heat spreader production component 10, thereby significantly improving the production quality of the ultra-thin heat spreader 20.

[0079] S103, pour copper powder into the sintering and shaping groove 1021 of the sintering mold 102 of the support component until the copper powder is flush with the horizontal plane where the groove opening of the sintering and shaping groove 1021 is located.

[0080] In this embodiment, copper powder is poured into the sintering and shaping groove 1021 of the sintering mold 102 of the support member until the copper powder is flush with the horizontal plane where the groove opening of the sintering and shaping groove 1021 is located, so that the height of the sintered support member 203 can reach the preset range, so that when the upper cover plate 201 is covered by the lower cover plate 202, the two ends of the support member 203 can respectively abut against and support the upper cover plate 201 and the lower cover plate 202, thereby improving the structural strength of the ultra-thin heat spreader 20.

[0081] S105, the copper powder in the sintering mold 102 of the support is sintered to shape the copper powder in the sintering and shaping groove 1021 into the support 203.

[0082] In this embodiment, the copper powder in the sintering mold 102 of the support component is sintered to shape the copper powder in the sintering and shaping tank 1021 into the support component 203. This allows the production operator to sinter the copper powder in the sintering mold 102 of the support component 203 according to the required sintering time and temperature. Compared with the operation in the sintering fixture of the above-mentioned related technology, which simultaneously completes the sintering and shaping of the copper powder support column 2032 and the sintering and fixing of the copper powder support column 2032 with the upper and lower cover plates 202, this application can independently control the sintering temperature and sintering time of the support component 203, avoiding the phenomenon that the lower cover plate 202 will deform or even melt and be damaged due to excessive heating temperature and excessive heating time, thereby greatly improving the production quality of the ultra-thin heat spreader plate 20.

[0083] S107, the end of the sintering mold 102 with the sintering shaping groove 1021 formed on the sintered support is inverted into the stamping groove 2022 of the lower cover plate 202, and the heat spreader sintering mold 101 is vibrated so that the sintered support 203 falls out of the sintering shaping groove 1021 and falls to the preset position of the lower cover plate 202;

[0084] In this embodiment, the sintering mold 102 for the sintered support component, with one end having the sintering shaping groove 1021, is inverted into the stamping groove 2022 of the lower cover plate 202. The heat spreader sintering mold 101 is then vibrated to cause the sintered support component 203 to detach from the sintering shaping groove 1021 and fall to a predetermined position on the lower cover plate 202. When it is necessary to evenly distribute the support component 203 at the bottom of the stamping groove 2022, the production operator only needs to shape the support component sintering mold 102 after the sintering operation is completed. When one end of the sintering and shaping groove 1021 is inverted inside the stamping groove 2022 and the heat exchange plate sintering mold 101 is vibrated, the support member 203 can be detached from the sintering and shaping groove 1021 and fall to a preset position at the bottom of the stamping groove 2022. This allows the support member 203 to be evenly distributed at the bottom of the stamping groove 2022, thereby greatly reducing the manufacturing steps of the ultra-thin heat exchange plate 20. This not only greatly reduces the production difficulty of the ultra-thin heat exchange plate 20, but also greatly reduces the production cost of the ultra-thin heat exchange plate 20.

[0085] S109, after all the support members 203 have been removed from the support member sintering mold 102, the support member sintering mold 102 is removed from the stamping groove 2022, and the upper cover plate 201 of the ultra-thin heat spreader 20 is placed on the lower cover plate 202 so that the outer periphery of the lower cover plate 202 abuts against the outer periphery of the upper cover plate 201, and at the same time, the two ends of the support members 203 abut against and support the upper cover plate 201 and the lower cover plate 202 respectively, so as to form the semi-finished product of the ultra-thin heat spreader 20.

[0086] In this embodiment, after all the support members 203 are removed from the support member sintering mold 102, the support member sintering mold 102 is taken out from the stamping groove 2022, and the upper cover plate 201 of the ultra-thin heat spreader 20 is placed on the lower cover plate 202 so that the outer periphery of the lower cover plate 202 abuts against the outer periphery of the upper cover plate 201. At the same time, both ends of the support members 203 abut against the upper cover plate 201 and the lower cover plate 202 respectively to form a semi-finished product of the ultra-thin heat spreader 20, which facilitates the subsequent steps.

[0087] S111, the ultra-thin heat spreader plate 20 semi-finished product in the heat spreader plate sintering mold 101 is sintered to seal and fix the outer periphery of the lower cover plate 202 to the outer periphery of the upper cover plate 201, so that the lower cover plate 202 and the upper cover plate 201 together form a vacuum cavity, and at the same time, the two ends of the support member 203 are sintered and fixed to the upper cover plate 201 and the lower cover plate 202 respectively.

[0088] In this embodiment, the ultra-thin heat spreader plate 20 semi-finished product in the heat spreader plate sintering mold 101 is sintered to seal and fix the outer periphery of the lower cover plate 202 to the outer periphery of the upper cover plate 201, so that the lower cover plate 202 and the upper cover plate 201 together form a vacuum cavity. At the same time, the two ends of the support member 203 are sintered and fixed to the upper cover plate 201 and the lower cover plate 202 respectively. Compared with the operation in the sintering fixture of the above-mentioned related technology, which simultaneously completes the sintering and forming of the copper powder support column 2032 and the sintering and fixing of the copper powder support column 2032 to the upper and lower cover plates 202, this application can control the sintering temperature and sintering time separately when sintering and fixing the support member 203 to the upper cover plate 201 and the lower cover plate 202. This avoids the phenomenon that the lower cover plate 202 will deform or even melt and be damaged due to excessive heating temperature and excessive heating time, thereby greatly improving the production quality of the ultra-thin heat spreader plate 20.

[0089] In this embodiment, firstly, the lower cover plate 202 is placed at a preset position in the heat spreader sintering mold 101 so that the stamping flange 2021 is contained within the heat spreader limiting groove 1011; then, copper powder is poured into the sintering shaping groove 1021 of the support sintering mold 102 until the copper powder is flush with the sintering shaping groove 1021; subsequently, the copper powder in the support sintering mold 102 is sintered to shape the copper powder in the sintering shaping groove 1021 into a support 203; then, the end of the sintered support sintering mold 102 with the sintering shaping groove 1021 is inverted into the stamping groove 2022 of the lower cover plate 202, and the heat spreader sintering mold 101 is vibrated to cause the sintered support 203 to detach from the sintering shaping groove 1021 and fall to the preset position of the lower cover plate 202; then... After all the support components 203 have detached from the support component sintering mold 102, the support component sintering mold 102 is removed from the stamping groove 2022, and the upper cover plate 201 of the ultra-thin heat spreader 20 is placed on the lower cover plate 202 so that the outer periphery of the lower cover plate 202 abuts against the outer periphery of the upper cover plate 201. At the same time, the two ends of the support component 203 abut against and support the upper cover plate 201 and the lower cover plate 202 respectively, to form a semi-finished product of the ultra-thin heat spreader 20. Finally, the semi-finished product of the ultra-thin heat spreader 20 in the heat spreader sintering mold 101 is sintered to seal and fix the outer periphery of the lower cover plate 202 to the outer periphery of the upper cover plate 201, so that the lower cover plate 202 and the upper cover plate 201 together form a vacuum cavity. At the same time, the two ends of the support component 203 are sintered and fixed to the upper cover plate 201 and the lower cover plate 202 respectively, to complete the manufacturing of the ultra-thin heat spreader 20.

[0090] It is understandable that in order to ensure that the support 203 can be reliably positioned at the preset position of the ultra-thin heat spreader 20, copper powder needs to be sprinkled on the contact surfaces of the lower cover plate 202 and the upper cover plate 201 with the support 203 and then sintered separately during the manufacturing of the lower cover plate 202 and the upper cover plate 201, in order to improve the friction between the lower cover plate 202 and the upper cover plate 201 and the support 203. However, this also makes the manufacturing of the ultra-thin heat spreader 20 more complicated and cumbersome, and at the same time greatly increases the production cost of the ultra-thin heat spreader 20.

[0091] In one embodiment, before step S107, in which one end of the sintered support mold 102 with the sintering shaping groove 1021 is inverted into the stamping groove 2022 of the lower cover plate 202, the ultrathin heat spreader manufacturing method further includes some or all of the following steps:

[0092] S99, the first copper mesh 205 is welded to the upper cover plate 201 to cover one side of the lower cover plate 202, and the second copper mesh 206 is welded to the bottom of the stamping groove 2022 of the lower cover plate 202.

[0093] In this embodiment, the first copper mesh 205 is welded to the upper cover plate 201, which covers one side of the lower cover plate 202, and the second copper mesh 206 is welded to the bottom of the stamping groove 2022 of the lower cover plate 202. This allows the two ends of the support member 203 to abut against and be supported by the first copper mesh 205 and the second copper mesh 206, respectively. This not only greatly increases the friction between the support member 203 and the upper cover plate 201 and the lower cover plate 202, but also allows the support member 203 to be more securely positioned at the preset position of the ultra-thin heat spreader 20. This effectively prevents the support member 203 from shaking or shifting relative to the lower cover plate 202 and the upper cover plate 201 due to external factors. Furthermore, it also helps to maintain the connection between the support member 203 and the upper cover plate 201. The gap between the upper cover plate 201 and the lower cover plate 202 is compensated for, so that the support member 203 can more stably abut against and support the upper cover plate 201 and the lower cover plate 202, thereby greatly improving the production quality of the ultra-thin heat spreader plate 20. At the same time, when the support member 203 is sintered and fixed to the upper cover plate 201 and the lower cover plate 202, the two sides of the first copper mesh 205 can be sintered and fixed to the support member 203 and the upper cover plate 201 respectively, and the second copper mesh 206 can also be sintered and fixed to the support member 203 and the lower cover plate 202 respectively. This eliminates the need for the first copper mesh 205 and the second copper mesh 206 to be sintered and fixed to the upper cover plate 201 and the lower cover plate 202 first, thereby greatly reducing the manufacturing and production cost of the ultra-thin heat spreader plate 20.

[0094] like Figure 16As shown, in one embodiment, the first copper mesh 205 has a first welding area (not shown), and the second copper mesh 206 has a second welding area (not shown), so that the first copper mesh 205 and the second copper mesh 206 can be welded to the upper cover plate 201 and the lower cover plate 202 at preset positions, thereby reducing the manufacturing difficulty of the ultra-thin heat spreader plate 20.

[0095] In one embodiment, the bottom of the limiting groove is further formed with a stepped positioning groove 1012 for adapting to the stepped stamping flange 2023 of the lower cover plate 202. The stepped positioning groove 1012 is formed at the bottom of the heat spreader limiting groove 1011 and communicates with the heat spreader limiting groove 1011. The specific step S101 of placing the lower cover plate 202 at a preset position of the heat spreader sintering mold 101 so that the stamping flange 2021 is accommodated and limited within the heat spreader limiting groove 1011 includes part and all of the following steps:

[0096] S1011, the stepped stamping flange 2023 of the lower cover plate 202 is aligned with the stepped positioning groove 1012 of the heat spreader sintering mold 101, so that the stamping flange 2021 of the lower cover plate 202 is aligned with the heat spreader limiting groove 1011 of the heat spreader sintering mold 101.

[0097] In this embodiment, the stepped stamping flange 2023 of the lower cover plate 202 is aligned with the stepped positioning groove 1012 of the heat spreader sintering mold 101, so that the stamping flange 2021 of the lower cover plate 202 is aligned with the heat spreader limiting groove 1011 of the heat spreader sintering mold 101. This reduces the difficulty of aligning the lower cover plate 202 with the heat spreader limiting groove 1011, allowing the lower cover plate 202 to be quickly and accurately installed in the preset position of the heat spreader sintering mold 101 via the stepped stamping flange 2023. This greatly reduces the difficulty of installing the lower cover plate 202 in the preset position of the heat spreader limiting groove 1011, which not only greatly reduces the production cost of the ultra-thin heat spreader 20, but also greatly improves the production efficiency of the ultra-thin heat spreader 20.

[0098] S1013, the stepped stamping flange 2023 is placed and confined within the stepped positioning groove 1012, so that the stamping flange 2021 is confined within the heat spreader limiting groove 1011.

[0099] In this embodiment, the stepped stamping flange 2023 is placed and confined within the stepped positioning groove 1012, so that the stamping flange 2021 is confined within the heat spreader plate limiting groove 1011. This allows the heat spreader plate sintering mold 101 to more reliably confine the lower cover plate 202 within the heat spreader plate limiting groove 1011 through the stepped positioning groove 1012. This further avoids the phenomenon of the lower cover plate 202 shaking or shifting relative to the heat spreader plate sintering mold 101 during the manufacturing process of the ultra-thin heat spreader plate 20, thereby greatly improving the production quality of the ultra-thin heat spreader plate 20.

[0100] In one embodiment, the support member sintering mold 102 has a sintering shaping groove 1021 on one side, and a positioning flange 1022 is formed thereto adapt to the stepped stamping groove 2024 of the lower cover plate 202. The specific steps of inverting one end of the sintered support member sintering mold 102 with the sintering shaping groove 1021 into the stamping groove 2022 of the lower cover plate 202 include some or all of the following steps:

[0101] S1071, the positioning flange 1022 of the support sintering mold 102 is aligned with the stepped stamping groove 2024 of the lower cover plate 202;

[0102] In this embodiment, the positioning flange 1022 of the support sintering mold 102 is aligned with the stepped stamping groove 2024 of the lower cover plate 202 to reduce the difficulty of aligning the support sintering mold 102 with the stamping groove 2022 of the lower cover plate 202. This allows the support sintering mold 102 to be quickly and accurately installed at the preset position of the lower cover plate 202 via the positioning flange 1022, thereby greatly reducing the difficulty of installing the lower support sintering mold 102 at the preset position of the stamping groove 2022 of the lower cover plate 202. This not only greatly reduces the production cost of the ultra-thin heat spreader plate 20, but also greatly improves the production efficiency of the ultra-thin heat spreader plate 20.

[0103] S1073, the positioning flange 1022 is placed and confined within the stepped stamping groove 2024, so that one end of the support sintering mold 102 with the sintering shaping groove 1021 is confined within the stamping groove 2022.

[0104] In this embodiment, the positioning flange 1022 is placed and confined within the stepped stamping groove 2024, so that one end of the support member sintering mold 102 with the sintering shaping groove 1021 is confined within the stamping groove 2022. This allows the support member sintering mold 102 to be more securely positioned within the stamping groove 2022 of the lower cover plate 202 via the positioning flange 1022. This effectively prevents the support member sintering mold 102 from shaking or shifting relative to the lower cover plate 202 during the process of separating the support member 203 from the support member sintering mold 101 using the vibration heat exchanger sintering mold 101. Consequently, each support member 203 can be accurately placed at a preset position on the lower cover plate 202 after being detached from the support member sintering mold 102, thereby further improving the production quality of the ultra-thin heat exchanger plate 20.

[0105] Compared with the prior art, this disclosure has at least the following advantages:

[0106] In the above-described method for manufacturing an ultra-thin heat spreader, the heat spreader sintering mold 101 is formed with a heat spreader limiting groove 1011 that is adapted to the stamping flange 2021 of the lower cover plate 202 of the ultra-thin heat spreader 20. The heat spreader limiting groove 1011 is used to accommodate the limiting stamping flange 2021, so that the lower cover plate 202 can be reliably limited within the heat spreader sintering mold 101 by the stamping flange 2021. This avoids the phenomenon of the lower cover plate 202 shaking or shifting relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20, which greatly improves the manufacturing stability of the ultra-thin heat spreader production assembly 10 and thus greatly improves the production quality of the ultra-thin heat spreader 20.

[0107] 2. Since the support component sintering mold 102 is used to sinter and manufacture the support component 203, the support component sintering mold 102 has a sintering shaping groove 1021. The sintering shaping groove 1021 is used to shape the support component 203. One end of the support component sintering mold 102 with the sintering shaping groove 1021 is adapted to the stamping groove 2022 of the lower cover plate 202. There are multiple sintering shaping grooves 1021, and each sintering shaping groove 1021 is respectively set at a preset position of the support component sintering mold 102, so that the multiple sintering shaping grooves 1021 are evenly arranged in the support component sintering mold 102. When it is necessary to evenly distribute the support component 203... When placed at the bottom of the stamping groove 2022, the production operator only needs to invert one end of the sintering mold 102 with the sintering shaping groove 1021 formed after the sintering operation is completed and place it inside the stamping groove 2022 and vibrate the heat exchange plate sintering mold 101. This will cause the support 203 to fall off from the sintering shaping groove 1021 and drop to the preset position at the bottom of the stamping groove 2022. This will allow the support 203 to be evenly distributed at the bottom of the stamping groove 2022, thereby greatly reducing the manufacturing steps of the ultra-thin heat exchange plate 20. This not only greatly reduces the production difficulty of the ultra-thin heat exchange plate 20, but also greatly reduces the production cost of the ultra-thin heat exchange plate 20.

[0108] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A production assembly for an ultrathin heat spreader plate, characterized in that, The ultra-thin heat spreader production assembly is used to manufacture an ultra-thin heat spreader, and the ultra-thin heat spreader production assembly includes a heat spreader sintering mold and a support sintering mold. The heat spreader sintering mold is formed with a heat spreader limiting groove adapted to the stamping flange of the lower cover plate of the ultra-thin heat spreader, and the heat spreader limiting groove is used to accommodate and limit the stamping flange. The sintering mold for the support component is used for sintering and manufacturing the support component. The sintering mold for the support component has a sintering and shaping groove, which is used to shape the support component. One end of the sintering mold for the support component has the sintering and shaping groove, which is used to fit with the stamping groove of the lower cover plate. There are multiple sintering and shaping grooves, and each sintering and shaping groove is respectively set at a preset position of the sintering mold for the support component, so that the multiple sintering and shaping grooves are evenly distributed in the sintering mold for the support component. The bottom of the heat spreader limiting groove is also formed with a stepped positioning groove for matching the stepped stamping flange of the lower cover plate. The stepped positioning groove is formed at the bottom of the heat spreader limiting groove and is connected to the heat spreader limiting groove. The sintering mold of the support member has a positioning flange on one side of the sintering and shaping groove for matching the stepped stamping groove of the lower cover plate. The sintering mold for the support member has a first abutment surface on one side for abutting the bottom of the stamping groove, and a second abutment surface on the other side for abutting the bottom of the stepped stamping groove. The second abutment surface is formed on the positioning flange. The sintering and shaping groove includes a first sintering and shaping groove and a second sintering and shaping groove. The first sintering and shaping groove is formed on the first abutment surface, and the second sintering and shaping groove is formed on the second abutment surface. The vertical height from the first abutment surface to the bottom of the first sintering and shaping groove is a first height. The vertical height from the second abutment surface to the bottom of the second sintering and shaping groove is a second height. The vertical height from the second abutment surface to the first abutment surface is a third height. The second height is equal to the sum of the first height and the third height. The first height is equal to the vertical height from the horizontal plane at the opening of the stamping groove to the bottom of the stamping groove. The second height is equal to the vertical height from the horizontal plane at the opening of the stepped stamping groove to the bottom of the stepped stamping groove. The sintering mold of the sintered support member, with the sintering shaping groove formed at one end, is inverted into the stamping groove of the lower cover plate, and the sintering mold of the heat spreader plate is vibrated so that the sintered support member falls out of the sintering shaping groove and drops to a preset position on the lower cover plate.

2. The ultra-thin heat spreader production assembly according to claim 1, characterized in that, The sintering and shaping groove includes a support column shaping groove and a support strip shaping groove. There are multiple support column shaping grooves and support strip shaping grooves. The multiple support column shaping grooves and multiple support strip shaping grooves are evenly arranged on one side of the support member sintering mold where the sintering and shaping groove is formed, and the multiple support strip shaping grooves are arranged parallel to each other at intervals.

3. The ultra-thin heat spreader production assembly according to claim 2, characterized in that, Each of the support bar shaping grooves has a length limiting groove formed at the bottom of the groove, which is used to limit the length of the support bar of the support member.

4. The ultra-thin heat spreader production assembly according to claim 1, characterized in that, The outer periphery of the heat-spreading plate limiting groove of the heat-spreading plate sintering mold is formed with a folded edge limiting groove. The heat-spreading plate limiting groove is connected to the folded edge limiting groove. The folded edge limiting groove is used to adapt to the folded edge of the lower cover plate. The folded edge limiting groove is used to accommodate and limit the folded edge of the lower cover plate.

5. The ultra-thin heat spreader production assembly according to claim 4, characterized in that, The folded edge limiting groove is used to fit the upper cover plate of the ultra-thin heat spreader, and the folded edge limiting groove is used to limit the upper cover plate.

6. A method for manufacturing an ultrathin heat spreader, characterized in that, The ultrathin heat spreader is manufactured using the ultrathin heat spreader production assembly according to any one of claims 1 to 5, and the method for manufacturing the ultrathin heat spreader includes: The lower cover plate is placed at a preset position in the heat spreader sintering mold so that the stamping flange receiving limit is located in the heat spreader limiting groove. Copper powder is poured into the sintering and shaping groove of the sintering mold of the support component until the copper powder is flush with the horizontal plane at the opening of the sintering and shaping groove. The copper powder in the sintering mold of the support is sintered to shape the copper powder in the sintering and shaping groove into the support. The sintering mold of the sintered support member with the sintering shaping groove is inverted into the stamping groove of the lower cover plate, and the sintering mold of the heat spreader plate is vibrated so that the sintered support member is detached from the sintering shaping groove and falls to the preset position of the lower cover plate. After all the supporting components are removed from the supporting component sintering mold, the supporting component sintering mold is removed from the stamping groove, and the upper cover plate of the ultra-thin heat spreader is placed on the lower cover plate so that the outer periphery of the lower cover plate abuts against the outer periphery of the upper cover plate. At the same time, the two ends of the supporting components abut against and support the upper cover plate and the lower cover plate respectively to form an ultra-thin heat spreader semi-finished product. The ultra-thin heat spreader semi-finished product in the heat spreader sintering mold is sintered to seal and fix the outer periphery of the lower cover plate to the outer periphery of the upper cover plate, so that the lower cover plate and the upper cover plate together form a vacuum cavity, and at the same time, the two ends of the support member are sintered and fixed to the upper cover plate and the lower cover plate respectively.

7. The method for manufacturing an ultrathin heat spreader according to claim 6, characterized in that, Before the sintering mold of the sintered support member, having the sintering shaping groove formed at one end, is inverted into the stamping groove of the lower cover plate, the method for manufacturing the ultrathin heat spreader plate further includes: The first copper mesh is welded to the upper cover plate, which covers one side of the lower cover plate, and the second copper mesh is welded to the bottom of the stamping groove of the lower cover plate.

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