Cutting equipment and method for multilayer circuit board

Abstract

The invention discloses cutting equipment for a multi-layer circuit board and a method thereof, and belongs to the technical field of circuit board cutting, the cutting equipment comprises a base station, and further comprises a cutting device and a turnover material distribution mechanism; a speed chain conveyor is fixedly mounted on the right side of the upper end of the base table; the multilayer circuit board is composed of a plurality of cutting parts which are connected left and right; the cutting part comprises a plurality of circuit board bulk materials and circuit board excess materials; the right end of the circuit board bulk material is fixedly connected with the left end of the circuit board excess material; the right end of the circuit board excess material is fixedly connected with the left ends of the plurality of circuit board bulk materials of the adjacent cutting part; a cutting device is mounted in the middle of the upper end of the base; the left side of the upper end of the base table is provided with a turnover distributing mechanism. By means of the mode, the device can achieve automatic material distributing and plate placing operation on the circuit board bulk materials, the situation that the circuit board bulk materials deviate after being cut, and the additional workload that manual intervention is still needed for position correction is avoided, and the cutting efficiency of the multilayer circuit board is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board cutting, and in particular to a cutting device and method for a multi-layer circuit board. Background Art

[0002] In order to adapt to electronic products of different sizes, the circuit board substrates provided by the circuit board factory may include multiple pieces of circuit board bulk materials, such as Figure 10 shown.

[0003] Chinese patent CN117549357A discloses a circuit board cutting device, which includes a frame, a cutting device on the frame, and a cutting device including a cutting shell, a cutting blade, and a lifting mechanism. The cutting shell and the lifting mechanism are both mounted on the frame, and the cutting blade is mounted on the cutting shell, which is connected to the lifting mechanism. The cutting blade is used to cut the circuit board raw materials conveyed to the frame. The frame is also provided with a conveying device for conveying the raw materials to the cutting blade. The cutting shell is also provided with a switching device, which is connected to the cutting blade, and the switching device is used to replace the cutting blade. However, the device still has the following problems during use: After the cutting knife cuts the cutting part of the circuit board substrate, the cut circuit board bulk material will automatically fall onto the conveying device below. The cutting knife then cuts off the remaining material on the circuit board substrate connected to the bulk material part, but at this time the remaining material will also fall onto the conveying device below, so manual intervention is required to separate the cut circuit board bulk material and the cut circuit board remaining material, which is inefficient and inconvenient. Moreover, when the cutting knife is worn, the entire cutting knife still needs to be replaced, which is costly and reduces cutting efficiency.

[0004] Based on this, the present invention designs a cutting device and method for multi-layer circuit boards to solve the above problems. Summary of the Invention

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides a cutting device and method for a multi-layer circuit board.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: A cutting device for multi-layer circuit boards includes a base, a cutting device, and a turning and dividing mechanism; a double-speed chain conveyor is fixedly installed on the right side of the upper end of the base; The multilayer circuit board is composed of a plurality of cutting sections connected left and right; the cutting sections include a plurality of bulk circuit board materials and residual circuit board materials; the right end of the bulk circuit board materials is fixedly connected to the left end of the residual circuit board materials; the right end of the residual circuit board materials is fixedly connected to the left ends of the plurality of bulk circuit board materials adjacent to the cutting section; A cutting device for cutting and separating the bulk circuit board materials and the residual circuit board materials is installed in the middle of the upper end of the base; A flipping and dividing mechanism is installed on the left side of the upper end of the base, which is used to separate the bulk circuit board materials from the residual circuit board materials and automatically sort and plate the bulk circuit board materials; The flip material distribution mechanism includes a revolution component, a rotation component, an electric clamp, a material guide plate and a material box; the revolution component is installed on the left side of the upper end of the base; multiple groups of rotation components are installed on the revolution component; the electric clamp is connected to the rotation component; the material guide plate is fixedly installed on the upper end of the base; a through groove is provided in the middle of the upper end of the base; and a material box is provided below the base; Furthermore, the cutting device includes a plurality of spliced ​​cutting components for cutting, a control component for driving the plurality of spliced ​​cutting components to move forward and backward, and a guide component for providing cutting limits for the spliced ​​cutting components; the control component is mounted on the middle of the upper end of the base; the spliced ​​cutting components are mounted on the control component; and the guide component is mounted on the middle of the upper end of the base; A disposable chamfering mechanism for rounding the corners of bulk circuit board materials is installed on the left side of the upper end of the base; A discharge mechanism is also installed on the left side of the upper end of the base to drive the bulk of the circuit boards that have completed the rounded corner grinding to move and discharge; The discharging mechanism includes a second linear module and a material tray; the second linear module is fixedly mounted on the left side of the upper end of the base; the material tray is fixedly connected to the movable end of the second linear module; The installation height of the material tray is lower than the installation height of the electric gripper; Furthermore, the control assembly includes a stand, a first linear module, a movable plate and a rotating disk; the stand is fixedly mounted on the middle portion of the upper end of the base; the first linear module is fixedly mounted on the upper left end of the stand; the movable end of the first linear module is fixedly mounted with the movable plate; the rotating disk is rotatably mounted on the left end of the movable plate; a plurality of spliced ​​cutting assemblies are mounted on the rotating disk; Furthermore, the splicing cutting assembly includes an insert plate, a fan-shaped cutter and a rotating baffle; a slot is provided on the outer ring of the left end of the rotating disk; the insert plate is plugged into the slot; the fan-shaped cutter is fixedly mounted on the outer end of the insert plate; one end of the rotating baffle is rotatably mounted on the left end of the rotating disk; the other end of the rotating baffle is detachably connected to the left end of the rotating disk by a bolt; Furthermore, the guide assembly includes a first dual-axis cylinder and a guide plate; the first dual-axis cylinder is fixedly mounted on the middle portion of the upper end of the base; the output end of the first dual-axis cylinder is fixedly connected to the guide plate; the upper end of the guide plate is provided with a slot; Furthermore, the revolution assembly includes a fixed plate, a rotating shaft, a driving motor, a rotating plate and an L-shaped fixed plate; the fixed plates are symmetrically fixedly mounted on the front and rear sides of the left upper end of the base; the front and rear ends of the rotating shaft are rotatably connected to the front and rear fixed plates; the driving motor is fixedly mounted on the front end of the front fixed plate, and the output end of the driving motor is fixedly connected to the rotating shaft; a plurality of rotating plates are fixedly mounted on the rotating shaft; the left end of the rotating plate is fixedly connected to the short side end of the L-shaped fixed plate; the L-shaped fixed plate is equipped with a rotation assembly; Furthermore, the self-rotating assembly includes a servo motor and a movable mounting plate; the servo motor is fixedly mounted on the front end of the long side of the L-shaped fixed plate; the movable mounting plate is rotatably mounted on the rear end of the long side of the L-shaped fixed plate; and the output end of the servo motor is fixedly connected to the movable mounting plate; the rear end of the movable mounting plate is fixedly connected to the electric clamp; Furthermore, the disposable chamfering mechanism includes a micro motor, a grinding rod, an electric rotating disk and a second double-axis cylinder; a plurality of second double-axis cylinders are fixedly installed on the left side of the upper end of the base; the output end of the second double-axis cylinder is fixedly connected to the electric rotating disk; four micro motors are fixedly installed at the lower end of the movable end of the electric rotating disk; the grinding rod is fixedly installed at the output end of the micro motor In order to better achieve the purpose of the present invention, the present invention also provides a method for using a cutting device for a multilayer circuit board, comprising the following steps: Step 1: The double-speed chain conveyor drives the completed multi-layer circuit board to the cutting station; then the first dual-axis cylinder drives the guide plate upward until the groove set on the upper end of the guide plate contacts the connection between the bulk circuit board material and the residual circuit board material in the cutting section; Step 2: The electric gripper clamps the bulk PCB material on the left side of the cutting groove. The first linear module drives the movable plate and rotating disk to move back and forth, and the fan-shaped cutter rolls back and forth along the cutting groove. When the fan-shaped cutters installed on the rotating disk come into contact with the connection between the bulk PCB materials and the residual PCB materials, the multiple bulk PCB materials and the residual PCB materials will be cut and separated; and during the cutting process, the connection between the bulk PCB materials and the residual PCB materials will also drive the fan-shaped cutters to rotate the rotating disk, so that the fan-shaped cutters of different spliced ​​cutting components alternately come into contact with the connection between the bulk PCB materials and the residual PCB materials; Step 3: After the PCB bulk and PCB residue are separated, the drive motor drives the rotating shaft to rotate, so that the multiple rotating plates and L-shaped fixed plates drive the electric clamp to flip left to the grinding station; Step 4: The second dual-axis cylinder drives the electric rotating disk to move upward until the grinding rod contacts the side of the PCB bulk material. The micro motor drives the grinding rod to rotate. Then the electric rotating disk drives multiple grinding rods to rotate left and right continuously, making the grinding rods move continuously in an arc trajectory to perform rounded corner grinding on the edges and corners of the PCB bulk material. Step 5: After polishing is completed, the servo motor drives the electric clamp to rotate rightward toward the standard unloading station until the PCB bulk moves away from the lower side of one end of the electric clamp and contacts the bottom of the tray. Then the electric clamp releases the clamping of the PCB bulk, and the servo motor continues to drive the electric clamp to rotate downward. At this time, the PCB bulk will rotate downward with the lower side of the end in contact with the bottom of the tray as the support point, until the side of the PCB bulk in contact with the electric clamp slides out from the movable end of the electric clamp and moves to the inner bottom of the tray. Then the second linear module works to drive the tray forward for unloading. Step 6: After the PCB bulk material is separated from the PCB surplus material, the double-speed chain conveyor will continue to work and drive the multi-layer PCB to move to the left until the connection between the PCB surplus material of the cutting section and the PCB bulk material of the adjacent cutting section is moved to the cutting station; then the first linear module will work to drive the multiple fan-shaped cutters on the rotating disk to move back and forth along the cutting groove. When the fan-shaped cutters touch the connection between the PCB surplus material and the PCB bulk material of the adjacent cutting section, the PCB surplus material will be separated from the PCB bulk material of the adjacent cutting section. Then the PCB surplus material will fall downward along the inclined surface set on the guide plate and pass through the through slot and move into the material box; The servo motor then drives the electric gripper to rotate leftward to reset, and the drive motor drives the servo motor and the electric gripper to rotate rightward to reset. The double-speed chain conveyor then drives the multi-layer circuit board to continue moving leftward until the lower end of the connection between the next cutting section's bulk circuit board material and the remaining circuit board material contacts the cutting groove, and the bulk circuit board material is located between the two movable ends of the electric gripper. Step 7: When the fan-shaped cutter is worn, remove the bolts connecting the corresponding rotating baffle to the rotating disk, then flip the rotating baffle to separate the rotating baffle from the plug-in plate, then pull the plug-in plate and the fan-shaped cutter outward along the slot, and insert the new plug-in plate and fan-shaped cutter into the slot, then flip the rotating baffle so that the rotating baffle contacts the left end of the plug-in plate to prevent the plug-in plate from moving to the left, and then re-fix the rotating baffle to the rotating disk.

[0007] Compared with the prior art, the present invention has the following advantages: 1. Through the cooperation of the revolution component, the rotation component and the electric clamp, the device can realize the automatic material separation and plate setting operation of the bulk circuit board, avoiding the additional workload of manual intervention for position correction caused by the deviation of the bulk circuit board after cutting, thereby improving the cutting efficiency of multi-layer circuit boards; 2. Through the one-time chamfering mechanism, the rounded corners of the PCB bulk materials can be polished during the material separation process, avoiding the tedious process of setting up an additional polishing device for rounded corners after the material separation operation is completed, further improving the cutting quality and efficiency of multi-layer PCBs; 3. Since the multi-layer circuit board is thicker and the force-bearing area of ​​the spliced ​​cutting component and the circuit board bulk material is smaller when the spliced ​​cutting component first contacts the circuit board bulk material, the spliced ​​cutting component will be subjected to a greater pressure. In addition, in the initial contact between the spliced ​​cutting component and the circuit board bulk material, the elastic deformation resistance of the circuit board bulk material will be relatively large, and the force applied to the spliced ​​cutting component will usually be relatively large, which will cause the spliced ​​cutting component at the initial contact point with the circuit board bulk material to be most severely worn. At this time, the spliced ​​cutting component with the most severe wear can be disassembled and replaced, reducing the cost of replacing the entire cutter disc. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0009] Figure 1 A perspective view of a cutting device for a multi-layer circuit board according to the present invention; Figure 2 A front view of a cutting device for a multi-layer circuit board according to the present invention; Figure 3 This is a left side view of a cutting device for a multi-layer circuit board according to the present invention; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 It is a three-dimensional diagram of the flip material distribution mechanism and the one-time chamfering mechanism; Figure 6 for Figure 5 Enlarged view of point B in the middle; Figure 7 It is a three-dimensional diagram of the disposable chamfering mechanism; Figure 8 It is a three-dimensional diagram of the spliced ​​cutting components; Figure 9 A perspective view of the guide assembly; Figure 10 This is a three-dimensional diagram of a multi-layer circuit board.

[0010] The numbers in the figure represent: 1. Base; 2. Double-speed chain conveyor; 3. Cutting device; 31. Stand; 32. First linear module; 33. Movable plate; 34. Rotating plate; 35. Slot; 36. Insert plate; 37. Sector cutter; 38. Rotating baffle; 39. First double-axis cylinder; 310. Guide plate; 311. Cutting groove; 4. Flipping and distributing mechanism; 41. Fixed plate; 42. Rotating shaft; 43. Driving motor; 44. Rotating plate; 45. L-shaped fixing plate; 46. Servo motor; 47. Electric gripper; 48. Material guide plate; 49. Through slot; 410. Material box; 411. Movable mounting plate; 5. Disposable chamfering mechanism; 51. Micro motor; 52. Grinding rod; 53. Electric rotating disk; 54. Second dual-axis cylinder; 6. Multi-layer circuit board; 61. Bulk circuit board material; 62. Residual circuit board material; 7. Discharging mechanism; 71. Second linear module; 72. Material tray. DETAILED DESCRIPTION

[0011] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0012] The terms “left,” “right,” “front,” “back,” “up,” and “down” mentioned in the following description are oriented in the viewing direction of the front view.

[0013] Example 1: In some embodiments, please refer to the accompanying drawings of the specification. Figures 1-10 A cutting device for multi-layer circuit boards includes a base 1, a double-speed chain conveyor 2, a cutting device 3, a flipping and dividing mechanism 4, a one-time chamfering mechanism 5, and a discharging mechanism 7; the double-speed chain conveyor 2 is fixedly installed on the right side of the upper end of the base 1; like Figure 10 As shown, the multilayer circuit board 6 is composed of a plurality of cutting sections connected left and right; the cutting sections include a plurality of circuit board bulk materials 61 and a circuit board residual material 62; the right end of the circuit board bulk material 61 is fixedly connected to the left end of the circuit board residual material 62; the right end of the circuit board residual material 62 is fixedly connected to the left ends of the plurality of circuit board bulk materials 61 of the adjacent cutting section; A cutting device 3 is installed at the middle of the upper end of the base 1 for cutting and separating the bulk circuit board material 61 and the residual circuit board material 62; like Figure 1As shown, the cutting device 3 includes a plurality of spliced ​​cutting components for cutting, a control component for driving the plurality of spliced ​​cutting components to move back and forth, and a guide component for providing cutting limits for the spliced ​​cutting components; the control component is mounted on the middle of the upper end of the base 1; the spliced ​​cutting components are mounted on the control component; and the guide component is mounted on the middle of the upper end of the base 1; A turning and dividing mechanism 4 is installed on the left side of the upper end of the base 1 for separating the bulk PCB materials 61 from the residual PCB materials 62 and automatically sorting and arranging the bulk PCB materials 61; like Figure 5 As shown, the flip material distribution mechanism 4 includes a revolution component, a rotation component, an electric clamp 47, a material guide plate 48 and a material box 410; the revolution component is mounted on the upper left side of the base 1; multiple groups of rotation components are mounted on the revolution component; and the rotation components are linearly and evenly distributed on the revolution component at equal intervals; the electric clamp 47 is connected to the rotation component; The guide plate 48 is fixedly mounted on the upper end of the base 1; a through slot 49 is provided in the middle of the upper end of the base 1; a material box 410 is provided below the base 1; The upper side of the right end of the guide plate 48 is provided with an inclined surface inclined to the left; A disposable chamfering mechanism 5 for rounding the corners of the bulk circuit board material 61 is installed on the left side of the upper end of the base 1; A discharge mechanism 7 is also installed on the left side of the upper end of the base 1 for driving the bulk circuit board 61 with rounded corners to move and discharge; like Figure 5 As shown, the discharging mechanism 7 includes a second linear module 71 and a material tray 72; the second linear module 71 is fixedly mounted on the left side of the upper end of the base 1; the material tray 72 is fixedly connected to the movable end of the second linear module 71; The installation height of the material tray 72 is lower than the installation height of the electric clamp 47; The position of the material tray 72 is set as a standard discharge station; The position of the guide assembly is set as a cutting station; The position of the disposable chamfering mechanism 5 is set as a grinding station; In the present invention, the double-speed chain conveyor 2 drives the multi-layer circuit board 6 after production to the cutting station; then the guide assembly moves upward until the guide assembly contacts the connection portion of the circuit board bulk material 61 and the circuit board residual material 62 in the cutting section; At this time, the bulk PCB material 61 is located between the two movable ends of the electric clamp 47. The electric clamp 47 then operates to clamp and secure the bulk PCB material 61. The control assembly operates to drive the splicing and cutting assembly to move forward and backward along the guide assembly. When the splicing and cutting assembly touches the bulk PCB material 61 and the residual PCB material 62, the bulk PCB material 61 and the residual PCB material 62 are cut and separated. Then the revolution component drives the multiple rotation components and the electric clamp 47 to flip left to the grinding station; the one-time chamfering mechanism 5 works to perform the rounding operation on the circuit board bulk material 61. After the grinding is completed, the rotation component drives the electric clamp 47 to rotate right toward the standard discharge station until the circuit board bulk material 61 moves away from the lower side of one end of the electric clamp 47 and contacts the bottom end of the material tray 72. Then the electric clamp 47 releases the clamping fixation of the circuit board bulk material 61, and the servo motor 46 continues to drive the electric clamp 47 to rotate downward. At this time, the circuit board bulk material 61 will rotate downward with the lower side of the end in contact with the bottom end of the material tray 72 as the support point, until the end of the circuit board bulk material 61 in contact with the electric clamp 47 slides out from the movable end of the electric clamp 47 and moves to the inner bottom of the material tray 72; then the second linear module 71 works to drive the material tray 72 to move forward for discharge; After the bulk PCB material 61 is separated from the residual PCB material 62, the double-speed chain conveyor 2 continues to work and drives the multi-layer PCB 6 to move to the left until the connection between the residual PCB material 62 of the cutting section and the bulk PCB material 61 of the adjacent cutting section is moved to the cutting station; then the control component works to drive the splicing cutting component to move back and forth along the guide component. When the splicing cutting component touches the connection between the residual PCB material 62 and the bulk PCB material 61 of the adjacent cutting section, the residual PCB material 62 is separated from the bulk PCB material 61 of the adjacent cutting section. Then, the residual PCB material 62 falls downward along the inclined surface provided on the guide plate 48 and passes through the through slot 49 and moves into the material box 410. Then, the self-rotating assembly drives the electric clamp 47 to rotate leftward to reset, and the revolution assembly drives the self-rotating assembly and the electric clamp 47 to rotate rightward to reset; then, the double-speed chain conveyor 2 works to drive the multi-layer circuit board 6 to continue to move leftward until the lower end of the connection between the next cutting section of the circuit board bulk material 61 and the circuit board residual material 62 contacts the guide assembly, and the circuit board bulk material 61 is located between the two movable ends of the electric clamp 47; then, the above operation is repeated to realize the continuous automatic material separation operation of the circuit board bulk material 61 and the circuit board residual material 62; Since the multi-layer circuit board 6 is relatively thick, and the force-bearing area of ​​the splicing and cutting components and the circuit board bulk material 61 is relatively small when the splicing and cutting components first come into contact, the splicing and cutting components are subjected to relatively large pressure. In addition, in the initial contact period between the splicing and cutting components and the circuit board bulk material 61, the elastic deformation resistance of the circuit board bulk material 61 is relatively large, and the force applied to the splicing and cutting components is usually relatively large, which causes the splicing and cutting components to be most severely worn at the part that first comes into contact with the circuit board bulk material 61. At this time, the splicing and cutting components with the most severe wear can be disassembled and replaced, reducing the cost of replacing the entire cutter head. The coordination of the revolution assembly, the rotation assembly, and the electric gripper 47 enables the device to automatically sort and position the bulk circuit board 61, thereby avoiding the additional workload of manual intervention for position correction due to deviation of the bulk circuit board 61 after cutting, thereby improving the cutting efficiency of the multi-layer circuit board 6. Through the one-time chamfering mechanism 5, the circuit board bulk material 61 can be rounded during the material separation operation, avoiding the tedious process of setting up an additional grinding device for rounded corner grinding after completing the material separation operation, further improving the cutting quality and efficiency of the multi-layer circuit board 6.

[0014] Embodiment 2: In some embodiments, as Figures 1-10 As shown, as a preferred embodiment of the present invention, the control assembly includes a stand 31, a first linear module 32, a movable plate 33 and a rotating disk 34; the stand 31 is fixedly mounted on the middle part of the upper end of the base 1; the first linear module 32 is fixedly mounted on the upper left end of the stand 31; the movable end of the first linear module 32 is fixedly mounted with the movable plate 33; the rotating disk 34 is rotatably mounted on the left end of the movable plate 33; and a plurality of spliced ​​cutting components are mounted on the rotating disk 34; like Figure 4 and Figure 8 As shown, the splicing cutting assembly includes an insert plate 36, a fan-shaped cutter 37 and a rotating baffle 38; a slot 35 is provided on the outer ring of the left end of the rotating disk 34; the insert plate 36 is plugged into the slot 35; the fan-shaped cutter 37 is fixedly mounted on the outer end of the insert plate 36; one end of the rotating baffle 38 is rotatably mounted on the left end of the rotating disk 34; the other end of the rotating baffle 38 is detachably connected to the left end of the rotating disk 34 by a bolt; like Figure 9 As shown, the guide assembly includes a first dual-axis cylinder 39 and a guide plate 310; the first dual-axis cylinder 39 is fixedly mounted on the middle portion of the upper end of the base 1; the output end of the first dual-axis cylinder 39 is fixedly connected to the guide plate 310; a groove 311 is provided on the upper end of the guide plate 310; The sector cutter 37 is in rolling connection with the cutting groove 311; like Figure 5 As shown, the revolution assembly includes a fixed plate 41, a rotating shaft 42, a driving motor 43, a rotating plate 44 and an L-shaped fixed plate 45; the fixed plate 41 is symmetrically fixedly mounted on the front and rear sides of the left upper end of the base 1; the front and rear ends of the rotating shaft 42 are rotatably connected to the front and rear fixed plates 41; the driving motor 43 is fixedly mounted on the front end of the front fixed plate 41, and the output end of the driving motor 43 is fixedly connected to the rotating shaft 42; a plurality of rotating plates 44 are fixedly mounted on the rotating shaft 42; the left end of the rotating plate 44 is fixedly connected to the short side end of the L-shaped fixed plate 45; the rotation assembly is mounted on the L-shaped fixed plate 45; like Figure 6As shown, the rotation assembly includes a servo motor 46 and a movable mounting plate 411; the servo motor 46 is fixedly mounted on the front end of the long side of the L-shaped fixed plate 45; the movable mounting plate 411 is rotatably mounted on the rear end of the long side of the L-shaped fixed plate 45; and the output end of the servo motor 46 is fixedly connected to the movable mounting plate 411; the rear end of the movable mounting plate 411 is fixedly connected to the electric clamp 47; like Figure 7 As shown, the disposable chamfering mechanism 5 includes a micro motor 51, a grinding rod 52, an electric rotating disk 53 and a second double-axis cylinder 54; a plurality of second double-axis cylinders 54 are fixedly mounted on the left side of the upper end of the base 1; the output end of the second double-axis cylinder 54 is fixedly connected to the electric rotating disk 53; four micro motors 51 are fixedly mounted on the lower end of the movable end of the electric rotating disk 53; the grinding rod 52 is fixedly mounted on the output end of the micro motor 51; In the present invention, the double-speed chain conveyor 2 drives the completed multi-layer circuit board 6 to the cutting station; then the first dual-axis cylinder 39 drives the guide plate 310 upward until the groove 311 provided on the upper end of the guide plate 310 contacts the connection between the bulk circuit board 61 and the residual circuit board 62 in the cutting section. At this point, the bulk PCB material 61 is positioned between the two movable ends of the electric clamp 47. The electric clamp 47 then operates to clamp and secure the bulk PCB material 61. The first linear module 32 operates to drive the movable plate 33 and the rotating disk 34 to move back and forth, causing the sector cutter 37 to roll back and forth along the cutting groove 311. When the fan-shaped cutters 37 mounted on the rotating disk 34 come into contact with the connection between the bulk PCB materials 61 and the residual PCB materials 62, the plurality of bulk PCB materials 61 and the residual PCB materials 62 are cut and separated. Furthermore, during the cutting process, the connection between the bulk PCB materials 61 and the residual PCB materials 62 drives the fan-shaped cutters 37, causing the rotating disk 34 to rotate, so that the fan-shaped cutters 37 of different spliced ​​cutting assemblies alternately come into contact with the connection between the bulk PCB materials 61 and the residual PCB materials 62. After the PCB bulk 61 and the PCB residue 62 are separated, the drive motor 43 drives the rotating shaft 42 to rotate, so that the multiple rotating plates 44 and the L-shaped fixed plate 45 drive the electric clamp 47 to flip left to the grinding station; Then, the second dual-axis cylinder 54 drives the electric rotating disk 53 to move upward until the grinding rod 52 contacts the side of the bulk PCB material 61. Then, the micro motor 51 drives the grinding rod 52 to rotate. Then, the electric rotating disk 53 drives the multiple grinding rods 52 to rotate left and right continuously, so that the grinding rods 52 continuously move in an arc trajectory, performing a rounded corner grinding operation on the edges and corners of the bulk PCB material 61. After the grinding is completed, the servo motor 46 drives the electric clamp 47 to rotate rightward toward the standard discharge station until the circuit board bulk material 61 moves away from the lower side of one end of the electric clamp 47 and contacts the bottom end of the tray 72. Then the electric clamp 47 releases the clamping fixation of the circuit board bulk material 61, and the servo motor 46 continues to drive the electric clamp 47 to rotate downward. At this time, the circuit board bulk material 61 will rotate downward with the lower side of the end in contact with the bottom end of the tray 72 as the support point, until the side of the circuit board bulk material 61 in contact with the electric clamp 47 slides out from the movable end of the electric clamp 47 and moves to the inner bottom of the tray 72; then the second linear module 71 works to drive the tray 72 to move forward for discharge. After the bulk PCB material 61 is separated from the residual PCB material 62, the double-speed chain conveyor 2 continues to work and drives the multi-layer PCB 6 to move to the left until the connection between the residual PCB material 62 of the cutting section and the bulk PCB material 61 of the adjacent cutting section is moved to the cutting station; then the first linear module 32 works to drive the multiple fan-shaped cutters 37 on the rotating disk 34 to move back and forth along the cutting groove 311. When the fan-shaped cutters 37 touch the connection between the residual PCB material 62 and the bulk PCB material 61 of the adjacent cutting section, the residual PCB material 62 is separated from the bulk PCB material 61 of the adjacent cutting section. Then, the residual PCB material 62 falls downward along the inclined surface provided on the guide plate 48 and passes through the through slot 49 and moves into the material box 410. Then, the servo motor 46 drives the electric clamp 47 to rotate leftward to reset, and the drive motor 43 drives the servo motor 46 and the electric clamp 47 to rotate rightward to reset. Then, the double-speed chain conveyor 2 works to drive the multi-layer circuit board 6 to continue to move leftward until the lower end of the connection between the next cutting section of the circuit board bulk material 61 and the circuit board residual material 62 contacts the cutting groove 311, and the circuit board bulk material 61 is located between the two movable ends of the electric clamp 47. Then, the above operation is repeated to realize the continuous automatic material separation operation of the circuit board bulk material 61 and the circuit board residual material 62. When the fan-shaped cutter 37 is worn, the bolts connecting the corresponding rotating baffle 38 to the rotating disk 34 are removed, and then the rotating baffle 38 is flipped over to separate the rotating baffle 38 from the plug plate 36. Then, the plug plate 36 and the fan-shaped cutter 37 are pulled outward along the slot 35, and a new plug plate 36 and fan-shaped cutter 37 are inserted into the slot 35. Then, the rotating baffle 38 is flipped over so that the rotating baffle 38 contacts the left end of the plug plate 36 to prevent the plug plate 36 from moving to the left. Then, the rotating baffle 38 and the rotating disk 34 are re-fixed.

[0015] Embodiment 3: In some embodiments, as Figures 1-10 As shown, as a preferred embodiment of the present invention, a method for using a cutting device for a multilayer circuit board includes the following steps: Step 1: The double-speed chain conveyor 2 operates to move the completed multi-layer circuit board 6 to the cutting station; then the first dual-axis cylinder 39 operates to move the guide plate 310 upward until the notch 311 provided on the upper end of the guide plate 310 contacts the connection between the bulk circuit board 61 and the residual circuit board 62 in the cutting section; Step 2: The electric gripper 47 clamps and secures the bulk PCB material 61 on the left side of the slot 311. The first linear module 32 drives the movable plate 33 and the rotating disk 34 to move back and forth, causing the sector cutter 37 to roll back and forth along the slot 311. When the fan-shaped cutters 37 mounted on the rotating disk 34 come into contact with the connection between the bulk PCB materials 61 and the residual PCB materials 62, the plurality of bulk PCB materials 61 and the residual PCB materials 62 are cut and separated. Furthermore, during the cutting process, the connection between the bulk PCB materials 61 and the residual PCB materials 62 drives the fan-shaped cutters 37, causing the rotating disk 34 to rotate, so that the fan-shaped cutters 37 of different spliced ​​cutting assemblies alternately come into contact with the connection between the bulk PCB materials 61 and the residual PCB materials 62. Step 3: After the PCB bulk 61 and the PCB residue 62 are separated, the drive motor 43 drives the rotating shaft 42 to rotate, so that the multiple rotating plates 44 and the L-shaped fixed plate 45 drive the electric clamping jaw 47 to flip left to the polishing station; Step 4: The second dual-axis cylinder 54 drives the electric rotating disk 53 to move upward until the grinding rod 52 contacts the side of the PCB bulk material 61. The micro motor 51 drives the grinding rod 52 to rotate. Then, the electric rotating disk 53 drives the multiple grinding rods 52 to rotate left and right continuously, so that the grinding rods 52 continuously move in an arc trajectory, performing a rounded corner grinding operation on the edges and corners of the PCB bulk material 61. Step 5: After the polishing is completed, the servo motor 46 drives the electric clamp 47 to rotate rightward toward the standard discharge station until the circuit board bulk material 61 moves away from the lower side of one end of the electric clamp 47 and contacts the bottom end of the tray 72. Then the electric clamp 47 releases the clamping fixation of the circuit board bulk material 61, and the servo motor 46 continues to drive the electric clamp 47 to rotate downward. At this time, the circuit board bulk material 61 will rotate downward with the lower side of the end in contact with the bottom end of the tray 72 as the support point, until the side of the circuit board bulk material 61 in contact with the electric clamp 47 slides out from the movable end of the electric clamp 47 and moves to the inner bottom of the tray 72; then the second linear module 71 works to drive the tray 72 to move forward for discharge. Step 6: After the bulk PCB material 61 is separated from the residual PCB material 62, the double-speed chain conveyor 2 continues to drive the multi-layer PCB 6 to move to the left until the connection between the residual PCB material 62 of the cutting section and the bulk PCB material 61 of the adjacent cutting section is moved to the cutting station; then the first linear module 32 drives the multiple fan-shaped cutters 37 on the rotating disk 34 to move back and forth along the cutting groove 311. When the fan-shaped cutters 37 touch the connection between the residual PCB material 62 and the bulk PCB material 61 of the adjacent cutting section, the residual PCB material 62 is separated from the bulk PCB material 61 of the adjacent cutting section. Then, the residual PCB material 62 falls downward along the inclined surface provided on the guide plate 48 and passes through the through slot 49 and moves into the material box 410. The servo motor 46 then drives the electric clamp 47 to rotate leftward and reset, and the drive motor 43 drives the servo motor 46 and the electric clamp 47 to rotate rightward and reset. The double-speed chain conveyor 2 then operates to drive the multilayer circuit board 6 to continue moving leftward until the lower end of the connection between the next cutting section's bulk circuit board material 61 and the remaining circuit board material 62 contacts the cut groove 311, and the bulk circuit board material 61 is located between the two movable ends of the electric clamp 47. Step 7: When the sector cutter 37 is worn, remove the bolts connecting the corresponding rotating baffle 38 to the rotating disk 34, then flip the rotating baffle 38 to separate the rotating baffle 38 from the plug plate 36, then pull the plug plate 36 and the sector cutter 37 outward along the slot 35, and insert the new plug plate 36 and sector cutter 37 into the slot 35, then flip the rotating baffle 38 to make the rotating baffle 38 contact the left end of the plug plate 36 to prevent the plug plate 36 from moving to the left, and then re-fix the rotating baffle 38 to the rotating disk 34.

[0016] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A cutting device for a multilayer circuit board, comprising a base (1), characterized in that: It also includes a cutting device (3) and a turning and dividing mechanism (4); a double-speed chain conveyor (2) is fixedly installed on the right side of the upper end of the base (1); The multilayer circuit board (6) is composed of a plurality of cutting sections connected to each other on the left and right; the cutting sections include a plurality of circuit board bulk materials (61) and circuit board surplus materials (62); the right end of the circuit board bulk materials (61) is fixedly connected to the left end of the circuit board surplus materials (62); the right end of the circuit board surplus materials (62) is fixedly connected to the left ends of a plurality of circuit board bulk materials (61) of adjacent cutting sections; A cutting device (3) for cutting and separating the bulk circuit board material (61) and the residual circuit board material (62) is installed in the middle of the upper end of the base (1); A turning and dividing mechanism (4) is installed on the left side of the upper end of the base (1) for separating the bulk circuit board material (61) from the residual circuit board material (62) and automatically sorting and arranging the bulk circuit board material (61); The flip material distribution mechanism (4) includes a revolution component, a rotation component, an electric clamp (47), a material guide plate (48) and a material box (410); the revolution component is installed on the left side of the upper end of the base (1); multiple groups of rotation components are installed on the revolution component; the electric clamp (47) is connected to the rotation component; the material guide plate (48) is fixedly installed on the upper end of the base (1); a through groove (49) is provided in the middle of the upper end of the base (1); and a material box (410) is provided below the base (1).

2. The cutting device for a multilayer circuit board according to claim 1, wherein: The cutting device (3) comprises a plurality of spliced ​​cutting components for cutting, a control component for driving the plurality of spliced ​​cutting components to move forward and backward, and a guide component for providing cutting limits for the spliced ​​cutting components; the control component is mounted on the middle portion of the upper end of the base (1); the spliced ​​cutting components are mounted on the control component; and the guide component is mounted on the middle portion of the upper end of the base (1); A disposable chamfering mechanism (5) for performing rounding on the bulk circuit board material (61) is installed on the left side of the upper end of the base (1); A discharge mechanism (7) is also installed on the left side of the upper end of the base (1) for driving the bulk circuit board material (61) that has completed rounded corner grinding to move and discharge the material; The discharging mechanism (7) comprises a second linear module (71) and a material tray (72); the second linear module (71) is fixedly mounted on the left side of the upper end of the base (1); the material tray (72) is fixedly connected to the movable end of the second linear module (71); The installation height of the material tray (72) is lower than the installation height of the electric clamp (47).

3. The cutting device for a multilayer circuit board according to claim 2, wherein: The control assembly comprises a stand (31), a first linear module (32), a movable plate (33) and a rotating disk (34); the stand (31) is fixedly mounted on the middle portion of the upper end of the base (1); the first linear module (32) is fixedly mounted on the upper side of the left end of the stand (31); the movable end of the first linear module (32) is fixedly mounted with the movable plate (33); the rotating disk (34) is rotatably mounted on the left end of the movable plate (33); and a plurality of spliced ​​cutting assemblies are mounted on the rotating disk (34).

4. The cutting device for a multilayer circuit board according to claim 3, wherein: The splicing cutting assembly comprises an inserting plate (36), a fan-shaped cutter (37) and a rotating baffle (38); a slot (35) is provided on the outer ring of the left end of the rotating disk (34); the inserting plate (36) is plugged into the slot (35); the fan-shaped cutter (37) is fixedly mounted on the outer end of the inserting plate (36); one end of the rotating baffle (38) is rotatably mounted on the left end of the rotating disk (34); and the other end of the rotating baffle (38) is detachably connected to the left end of the rotating disk (34) by a bolt.

5. The cutting device for a multi-layer circuit board according to claim 4, characterized in that: The guide assembly comprises a first dual-axis cylinder (39) and a guide plate (310); the first dual-axis cylinder (39) is fixedly mounted on the middle portion of the upper end of the base (1); the output end of the first dual-axis cylinder (39) is fixedly connected to the guide plate (310); and a slot (311) is provided at the upper end of the guide plate (310).

6. The cutting device for a multi-layer circuit board according to claim 5, characterized in that: The revolution assembly comprises a fixed plate (41), a rotating shaft (42), a driving motor (43), a rotating plate (44) and an L-shaped fixed plate (45); the fixed plate (41) is symmetrically fixedly mounted on the front and rear sides of the left upper end of the base (1); the front and rear ends of the rotating shaft (42) are rotatably connected to the front and rear fixed plates (41); the driving motor (43) is fixedly mounted on the front end of the front fixed plate (41), and the output end of the driving motor (43) is fixedly connected to the rotating shaft (42); a plurality of rotating plates (44) are fixedly mounted on the rotating shaft (42); the left end of the rotating plate (44) is fixedly connected to the short side end of the L-shaped fixed plate (45); and a rotation assembly is mounted on the L-shaped fixed plate (45).

7. The cutting device for a multi-layer circuit board according to claim 6, characterized in that: The self-rotating assembly includes a servo motor (46) and a movable mounting plate (411); the servo motor (46) is fixedly mounted on the front end of the long side end of the L-shaped fixed plate (45); the movable mounting plate (411) is rotatably mounted on the rear end of the long side end of the L-shaped fixed plate (45); and the output end of the servo motor (46) is fixedly connected to the movable mounting plate (411); and the rear end of the movable mounting plate (411) is fixedly connected to the electric clamp (47).

8. The cutting device for a multi-layer circuit board according to claim 7, wherein: The disposable chamfering mechanism (5) comprises a micro motor (51), a grinding rod (52), an electric rotating disk (53) and a second double-axis cylinder (54); a plurality of second double-axis cylinders (54) are fixedly mounted on the left side of the upper end of the base (1); the output end of the second double-axis cylinder (54) is fixedly connected to the electric rotating disk (53); four micro motors (51) are fixedly mounted on the lower end of the movable end of the electric rotating disk (53); and the grinding rod (52) is fixedly mounted on the output end of the micro motor (51).

9. A method of using the multilayer circuit board cutting device according to claim 8, characterized in that: The following steps are involved: Step 1: The double-speed chain conveyor (2) operates to drive the multi-layer circuit board (6) after production to the cutting station; then the first double-axis cylinder (39) operates to drive the guide plate (310) to move upward until the cutting groove (311) provided on the upper end of the guide plate (310) contacts the connection portion between the circuit board bulk material (61) and the circuit board residual material (62) of the cutting section; Step 2: The electric clamp (47) clamps and fixes the circuit board bulk material (61) located on the left side of the cutting groove (311); the first linear module (32) drives the movable plate (33) and the rotating disk (34) to move back and forth, and the fan-shaped cutter (37) rolls back and forth along the cutting groove (311); When the fan-shaped cutter (37) mounted on the rotating disk (34) contacts the connection portion of the circuit board bulk material (61) and the circuit board residual material (62), the plurality of circuit board bulk materials (61) and the circuit board residual material (62) are cut and separated; Furthermore, during the cutting process, the connection portion between the bulk circuit board material (61) and the residual circuit board material (62) also drives the fan-shaped cutter (37) to rotate the rotating disk (34), so that the fan-shaped cutters (37) of different spliced ​​cutting components alternately contact the connection portion between the bulk circuit board material (61) and the residual circuit board material (62); Step 3: After the circuit board bulk material (61) and the circuit board residual material (62) are separated, the driving motor (43) is driven to drive the rotating shaft (42) to rotate, so that the plurality of rotating plates (44) and the L-shaped fixed plate (45) drive the electric clamping claw (47) to flip left to the grinding station; Step 4: The second dual-axis cylinder (54) drives the electric rotating disk (53) to move upward until the grinding rod (52) contacts the side of the circuit board bulk material (61). The micro motor (51) drives the grinding rod (52) to rotate. Then, the electric rotating disk (53) drives the multiple grinding rods (52) to rotate left and right continuously, so that the grinding rods (52) continuously move in an arc trajectory, and perform a rounded corner grinding operation on the corners of the circuit board bulk material (61); Step 5: After the polishing is completed, the servo motor (46) drives the electric clamp (47) to rotate rightward toward the standard discharge station until the circuit board bulk material (61) moves away from the lower side of one end of the electric clamp (47) and contacts the bottom end of the material tray (72), and then the electric clamp (47) releases the clamping fixation of the circuit board bulk material (61), and the servo motor (46) continues to drive the electric clamp (47) to rotate downward. At this time, the circuit board bulk material (61) will rotate downward with the lower side of the end in contact with the bottom end of the material tray (72) as the support point, until the side of the circuit board bulk material (61) in contact with the electric clamp (47) slides out from the movable end of the electric clamp (47) and moves to the inner bottom of the material tray (72); then the second linear module (71) drives the material tray (72) to move forward for discharge; Step 6: After the circuit board bulk material (61) is separated from the circuit board surplus material (62), the double-speed chain conveyor (2) will continue to work and drive the multi-layer circuit board (6) to move to the left until the connection position between the circuit board surplus material (62) of the cutting section and the circuit board bulk material (61) of the adjacent cutting section is moved to the cutting station; then the first linear module (32) works to drive the multiple fan-shaped cutters (37) on the rotating disk (34) to move back and forth along the cutting groove (311), and when the fan-shaped cutters (37) touch the connection position between the circuit board surplus material (62) and the circuit board bulk material (61) of the adjacent cutting section, the circuit board surplus material (62) is separated from the circuit board bulk material (61) of the adjacent cutting section, and then the circuit board surplus material (62) falls downward along the inclined surface set on the guide plate (48), and passes through the through groove (49) and moves into the material box (410); Then, the servo motor (46) drives the electric clamp (47) to rotate leftward to reset, and the drive motor (43) drives the servo motor (46) and the electric clamp (47) to rotate rightward to reset; then, the double-speed chain conveyor (2) works to drive the multilayer circuit board (6) to continue to move leftward until the lower end of the connection part of the next cutting section circuit board bulk material (61) and the circuit board residual material (62) contacts the cutting groove (311), and the circuit board bulk material (61) is located between the two movable ends of the electric clamp (47); Step 7: When the fan-shaped cutter (37) is worn, the bolts connecting the corresponding rotating baffle (38) and the rotating disk (34) are removed, and then the rotating baffle (38) is turned over to separate the rotating baffle (38) from the inserting plate (36). Then, the inserting plate (36) and the fan-shaped cutter (37) are pulled outward along the slot (35), and a new inserting plate (36) and the fan-shaped cutter (37) are inserted into the slot (35). Then, the rotating baffle (38) is turned over to make the rotating baffle (38) contact the left end of the inserting plate (36) to prevent the inserting plate (36) from moving to the left. Then, the rotating baffle (38) and the rotating disk (34) are re-fixed.

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