Multifunctional chip glue

Abstract

The invention provides multifunctional chip glue, and relates to the technical field of chip glue. The multifunctional chip glue specifically comprises the following components: a glue main body, a photoinitiator, a curing agent, a diluent, an auxiliary agent and a movable monomer, and the ratio of the glue main body to the acrylate oligomer to the photoinitiator to the curing agent to the diluent to the auxiliary agent to the movable monomer is 50: 3: 2: 30: 1: 1. The glue main body is formed by combining polylactic acid, polyhydroxyalkanoate and starch nanocrystals, and the ratio of the polylactic acid to the polyhydroxyalkanoate to the starch nanocrystals is 10: 10: 1. Through a specific component combination and a preparation process, the adhesive has better environmental adaptability, flexibility and mechanical properties while keeping a certain adhesive force, can quickly reduce viscosity under ultraviolet irradiation, facilitates chip pickup, keeps certain flexibility after curing, and avoids chip damage.

Description

Technical Field

[0001] The invention relates to the technical field of chip glue, in particular to multifunctional chip glue. Background Art

[0002] Chip glue is a special adhesive that has strong adhesion in its original state and can firmly fix the chip to prevent it from shifting or flying during cutting and grinding. However, after being exposed to ultraviolet rays, its viscosity will decrease sharply, making it extremely easy to separate from the chip, facilitating subsequent chip picking. This glue is widely used in the chip cutting and grinding process to achieve temporary fixation and protection of the chip.

[0003] The existing patent (publication number: CN103992750A) discloses that "the present invention relates to the field of adhesive technology, and in particular to an adhesive for docking an optical fiber array and a chip in an optical splitter, which solves the problem of adhesives used for docking and packaging chips and optical fiber arrays in the processing of optical splitters. It is characterized by the following formula ingredients: UV curing glue 72-77%, ethyl orthosilicate modified epoxy phenolic resin 6-11%, optical fiber matching liquid 4-6%, ultraviolet photoinitiator 4-6%, glycidyl ester epoxy resin 2%, acrylate prepolymer 2%, viscosity reducer 1%, F46 resin 1%. It has good fluidity and low viscosity before curing, and the refractive index before and after curing is controlled, which overcomes the problem of uneven grinding caused by insufficient rigidity of the glue after curing, and enables the glue to maintain a certain elasticity after curing, thereby protecting the bonding end face."

[0004] In the process of realizing this application, the inventors discovered that the prior art has the following problems: the glue in the prior art has insufficient environmental adaptability and flexibility, and may be too brittle after curing, which may easily cause damage to the chip. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present invention provides a multifunctional chip glue, which solves the problem that the prior chip glue is poor in practicality and easily causes chip damage.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution: a multifunctional chip glue, specifically composed of the following components: a glue body, a photoinitiator, a curing agent, a diluent, an auxiliary agent and an activated monomer, and the ratio between the glue body, acrylate polymer, photoinitiator, curing agent, diluent, auxiliary agent and activated monomer is 50:3:2:30:1:1.

[0007] Preferably, the glue body is composed of polylactic acid, polyhydroxyalkanoate and starch nanocrystals, and the ratio of polylactic acid, polyhydroxyalkanoate and starch nanocrystals is 10:10:1.

[0008] Preferably, the photoinitiator is composed of benzophenone and benzoin methyl ether, and the ratio between the benzophenone and benzoin methyl ether is 1:1.

[0009] Preferably, the curing agent is composed of polypropylmethylsiloxane and epoxy resin, and the ratio between the polypropylmethylsiloxane and the epoxy resin is 3:1.

[0010] Preferably, the diluent is made of methyl methacrylate.

[0011] Preferably, the auxiliary agent is composed of a stabilizer, an adhesion enhancer and a thixotropic agent, the ratio of the stabilizer, adhesion enhancer and thixotropic agent is 2:2:1, the stabilizer is made of hydroquinone monomethyl ether, the adhesion enhancer is made of γ-aminopropyltriethoxysilane, and the thixotropic agent is made of organic bentonite.

[0012] Preferably, the reactive monomer is composed of isobornyl acrylate, tripropylene glycol diacrylate and trimethylolpropane triacrylate, and the ratio of isobornyl acrylate, tripropylene glycol diacrylate and trimethylolpropane triacrylate is 2:1:1.

[0013] Preferably, the method specifically comprises the following preparation steps: S1. Raw material preparation S101. Weighing raw materials The mass ratio of the glue body: polylactic acid, polyhydroxyalkanoate, and starch nanocrystals is 10:10:1; Photoinitiator: the mass ratio of benzophenone and benzoin methyl ether is 1:1; Curing agent: The mass ratio of polypropylmethylsiloxane and epoxy resin is 3:1; Diluent: methyl methacrylate; Additives: The mass ratio of stabilizer (hydroquinone monomethyl ether), adhesion enhancer (γ-aminopropyltriethoxysilane), and thixotropic agent (organic bentonite) is 2:2:1; Reactive monomers: isobornyl acrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate in a mass ratio of 2:1:1; S102. Raw material inspection Use a high-precision electronic balance to weigh each raw material with an accuracy of ±0.1%. Perform appearance and purity tests on the raw materials to ensure they are free of impurities, moisture, or deterioration. The purity should be above 99.0%. S2. Preparation of glue body S201. Reactor pretreatment Use anhydrous ethanol to wipe the inner wall of the reactor to ensure that there are no impurities and oil stains, and blow dry the reactor with dry nitrogen to ensure that there is no moisture residue; S202. Mixing and stirring Add the weighed polylactic acid, polyhydroxyalkanoate and starch nanocrystals into the reactor, stir at 40 rpm for 30 minutes, and control the heating temperature at 60-80°C; S203. Mixing uniformity test After stirring is completed, samples are taken for microscopic observation to ensure that the components are evenly dispersed and there is no obvious aggregation; S3. Addition of photoinitiator and curing agent S301. Sequential Mixing First add the photoinitiator into the reactor, stir evenly, then add the curing agent, stirring at 30 rpm for 15-20 minutes; S302. Temperature control During the addition process, the temperature in the reactor should be controlled at 40-60°C; S4. Addition of diluent and additives S401. Diluent pretreatment Filter methyl methacrylate using a filter membrane with a filtration accuracy of 0.2-0.5 microns; S402. Additive mixing Mix the additives evenly according to the proportion, stirring at a speed of 100-150 rpm for 5-10 minutes; S403. Add process monitoring After adding the diluent and additives into the reactor, stir at a speed of 30-40 rpm for 10-15 minutes to ensure that there is no stratification or precipitation of the glue; S5. Addition of active monomer S501. Active monomer mixing Mix the active monomers in proportion, stirring at a speed of 20-30 rpm for 10-15 minutes; S502. Add temperature control When adding active monomers, the temperature in the reactor should be controlled at 30-50°C, the stirring speed should be 30-40 rpm, and the stirring time should be 10-15 minutes; S6. Mixing S601. Mixing parameter adjustment All raw materials were fully stirred in the reactor at a stirring speed of 30 rpm for 40 minutes; S602. Mixing uniformity detection Use a rheometer to test the rheological properties of the glue to ensure that the viscosity and shear stress are uniform and consistent, and that the particle size distribution of the glue is uniform and there is no obvious difference; S7. Grinding S701. Grinding equipment selection Use a three-roller grinding machine, the rollers are made of stainless steel or ceramic; S702. Grinding parameter optimization The roller speed is 10-20 rpm, the grinding pressure is 0.5-1.0 MPa, and the grinding times are 3-5 times until the particle size of the ground particles is less than 20 microns; S703. Post-grinding inspection Use a laser particle size analyzer to test the particle size distribution to ensure that the particle size is less than 20 microns and that the glue has a uniform appearance without granular matter and precipitation; S8. Degassing S801. Degassing equipment selection Use a vacuum pump for degassing, and the vacuum degree reaches above -0.09MPa; S802. Degassing parameter optimization The degassing time is 30 minutes and the temperature is controlled at 30-50℃; S803. Detection after degassing Use an ultrasonic detector or visual inspection to check for bubbles in the glue to ensure that the glue has a uniform appearance without bubbles or delamination; S9. Packaging S901. Packaging material selection Use aluminum foil composite bags or plastic barrels for packaging to ensure that the packaging materials have good sealing, moisture resistance and corrosion resistance; S902. Packaging process control The packaging workshop should be kept clean and dry, with relative humidity controlled at 30%-70%. Packaging personnel must wear gloves and masks to ensure that the glue is completely sealed in the packaging container; S903. Post-packaging inspection Check the sealing of the packaging to ensure there is no leakage, and conduct sampling inspection on the glue after packaging to ensure that its performance meets the requirements.

[0014] Preferably, the glue can quickly reduce viscosity under UV irradiation, and the UV energy is 200-300mJ.

[0015] The present invention provides a multifunctional chip glue having the following beneficial effects: 1. The present invention provides a multifunctional chip glue. Compared with the existing chip glue, the chip glue has better environmental adaptability, flexibility and mechanical properties while maintaining a certain bonding force through a specific combination of ingredients and a preparation process. It can quickly reduce viscosity under ultraviolet irradiation, making it easy to pick up chips, and maintain a certain flexibility after curing to avoid chip damage. At the same time, through fine stirring, grinding and degassing treatment, the quality stability of the glue is improved, ensuring that the performance of each batch of glue is consistent, thereby improving production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the processing flow of the present invention. DETAILED DESCRIPTION

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] like Figure 1 As shown, an embodiment of the present invention provides a multifunctional chip glue, which is specifically composed of the following components: a glue body, a photoinitiator, a curing agent, a diluent, an auxiliary agent and an activated monomer, the ratio between the glue body, acrylate polymer, photoinitiator, curing agent, diluent, auxiliary agent and active monomer is 50:3:2:30:1:1, the glue body is composed of polylactic acid, polyhydroxyalkanoate and starch nanocrystals, the ratio between polylactic acid, polyhydroxyalkanoate and starch nanocrystals is 10:10:1, the photoinitiator is composed of benzophenone and benzoin methyl ether, the ratio between benzophenone and benzoin methyl ether is 1:1, the curing agent is composed of polypropylmethylsiloxane and epoxy resin, the ratio between polypropylmethylsiloxane and epoxy resin is 3:1, the diluent is made of methyl methacrylate, and the glue can quickly reduce viscosity under UV irradiation, and the UV energy is 200-300mJ.

[0019] The additive is composed of a stabilizer, an adhesion enhancer and a thixotropic agent, the ratio of the stabilizer, the adhesion enhancer and the thixotropic agent is 2:2:1, the stabilizer is made of hydroquinone monomethyl ether, the adhesion enhancer is made of γ-aminopropyltriethoxysilane, the thixotropic agent is made of organic bentonite, and the active monomer is composed of isobornyl acrylate, tripropylene glycol diacrylate and trimethylolpropane triacrylate, and the ratio of the active monomer isobornyl acrylate, tripropylene glycol diacrylate and trimethylolpropane triacrylate is 2:1:1.

[0020] Specifically, the main body of the glue is composed of polylactic acid, polyhydroxyalkanoates and starch nanocrystals. Both polylactic acid and polyhydroxyalkanoates have good biocompatibility and degradability, while starch nanocrystals can provide additional mechanical strength and stability. This combination allows the glue to maintain a certain adhesion while also having better environmental adaptability.

[0021] The photoinitiator uses a combination of benzophenone and methyl benzoin ether, which can quickly trigger the curing reaction of the glue under light of a specific wavelength. At the same time, under UV irradiation, the free radicals generated by the photoinitiator will attack the polymer chains in the glue, causing the molecular chains to break, making the original cured glue structure gradually loose, thereby reducing its viscosity. The curing agent is composed of polypropylmethylsiloxane and epoxy resin, which not only provides a good curing effect, but also allows the glue to maintain a certain flexibility after curing, avoiding damage to the chip due to excessive brittleness after curing.

[0022] The additives are composed of a stabilizer, an adhesion enhancer and a thixotropic agent, which can effectively improve the stability and adhesion of the glue. At the same time, the presence of the thixotropic agent can also enable the glue to maintain a certain shape when it is stationary, making it easy to operate. The active monomers are composed of isobornyl acrylate, tripropylene glycol diacrylate and trimethylolpropane triacrylate, which can participate in the curing reaction of the glue and improve the crosslinking density and mechanical properties of the glue.

[0023] A multifunctional chip glue specifically includes the following preparation steps: S1. Raw material preparation S101. Weighing raw materials The mass ratio of the glue body: polylactic acid, polyhydroxyalkanoate, and starch nanocrystals is 10:10:1; Photoinitiator: the mass ratio of benzophenone and benzoin methyl ether is 1:1; Curing agent: The mass ratio of polypropylmethylsiloxane and epoxy resin is 3:1; Diluent: methyl methacrylate; Additives: The mass ratio of stabilizer (hydroquinone monomethyl ether), adhesion enhancer (γ-aminopropyltriethoxysilane), and thixotropic agent (organic bentonite) is 2:2:1; Reactive monomers: isobornyl acrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate in a mass ratio of 2:1:1; S102. Raw material inspection Use a high-precision electronic balance to weigh each raw material with an accuracy of ±0.1%. Perform appearance and purity tests on the raw materials to ensure they are free of impurities, moisture, or deterioration. The purity should be above 99.0%. S2. Preparation of glue body S201. Reactor pretreatment Use anhydrous ethanol to wipe the inner wall of the reactor to ensure that there are no impurities and oil stains, and blow dry the reactor with dry nitrogen to ensure that there is no moisture residue; S202. Mixing and stirring Add the weighed polylactic acid, polyhydroxyalkanoate and starch nanocrystals into the reactor, stir at 40 rpm for 30 minutes, and control the heating temperature at 60-80°C; S203. Mixing uniformity test After stirring is completed, samples are taken for microscopic observation to ensure that the components are evenly dispersed and there is no obvious aggregation; S3. Addition of photoinitiator and curing agent S301. Sequential Mixing First add the photoinitiator into the reactor, stir evenly, then add the curing agent, stirring at 30 rpm for 15-20 minutes; S302. Temperature control During the addition process, the temperature in the reactor should be controlled at 40-60°C; S4. Addition of diluent and additives S401. Diluent pretreatment Filter methyl methacrylate using a filter membrane with a filtration accuracy of 0.2-0.5 microns; S402. Additive mixing Mix the additives evenly according to the proportion, stirring at a speed of 100-150 rpm for 5-10 minutes; S403. Add process monitoring After adding the diluent and additives into the reactor, stir at a speed of 30-40 rpm for 10-15 minutes to ensure that there is no stratification or precipitation of the glue; S5. Addition of active monomer S501. Active monomer mixing Mix the active monomers in proportion, stirring at a speed of 20-30 rpm for 10-15 minutes; S502. Add temperature control When adding active monomers, the temperature in the reactor should be controlled at 30-50°C, the stirring speed should be 30-40 rpm, and the stirring time should be 10-15 minutes; S6. Mixing S601. Mixing parameter adjustment All raw materials were fully stirred in the reactor at a stirring speed of 30 rpm for 40 minutes; S602. Mixing uniformity detection Use a rheometer to test the rheological properties of the glue to ensure that the viscosity and shear stress are uniform and consistent, and that the particle size distribution of the glue is uniform and there is no obvious difference; S7. Grinding S701. Grinding equipment selection Use a three-roller grinding machine, the rollers are made of stainless steel or ceramic; S702. Grinding parameter optimization The roller speed is 10-20 rpm, the grinding pressure is 0.5-1.0 MPa, and the grinding times are 3-5 times until the particle size of the ground particles is less than 20 microns; S703. Post-grinding inspection Use a laser particle size analyzer to test the particle size distribution to ensure that the particle size is less than 20 microns and that the glue has a uniform appearance without granular matter and precipitation; S8. Degassing S801. Degassing equipment selection Use a vacuum pump for degassing, and the vacuum degree reaches above -0.09MPa; S802. Degassing parameter optimization The degassing time is 30 minutes and the temperature is controlled at 30-50℃; S803. Detection after degassing Use an ultrasonic detector or visual inspection to check for bubbles in the glue to ensure that the glue has a uniform appearance without bubbles or delamination; S9. Packaging S901. Packaging material selection Use aluminum foil composite bags or plastic barrels for packaging to ensure that the packaging materials have good sealing, moisture resistance and corrosion resistance; S902. Packaging process control The packaging workshop should be kept clean and dry, with relative humidity controlled at 30%-70%. Packaging personnel must wear gloves and masks to ensure that the glue is completely sealed in the packaging container; S903. Post-packaging inspection Check the sealing of the packaging to ensure there is no leakage, and conduct sampling inspection on the glue after packaging to ensure that its performance meets the requirements.

[0024] Specifically, when using this method, multi-step fine stirring and mixing, grinding and degassing treatment are adopted to make the components of the glue evenly dispersed, the particles are fine and there are no bubbles, which improves the quality stability of the glue, ensures the consistent performance of each batch of glue, and improves production efficiency and product quality.

[0025] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A multifunctional chip glue, characterized in that: Specifically, it is composed of the following components: glue main body, photoinitiator, curing agent, diluent, auxiliary agent and active monomer, and the ratio of the glue main body, acrylate oligomer, photoinitiator, curing agent, diluent, auxiliary agent and active monomer is 50:3:2:30:1:

1.

2. The multifunctional chip glue according to claim 1, characterized in that: The glue body is composed of polylactic acid, polyhydroxyalkanoate and starch nanocrystals, and the ratio of the polylactic acid, polyhydroxyalkanoate and starch nanocrystals is 10:10:

1.

3. The multifunctional chip glue according to claim 1, characterized in that: The photoinitiator is composed of benzophenone and benzoin methyl ether, and the ratio between the benzophenone and benzoin methyl ether is 1:

1.

4. The multifunctional chip glue according to claim 1, characterized in that: The curing agent is composed of polypropylmethylsiloxane and epoxy resin, and the ratio between the polypropylmethylsiloxane and the epoxy resin is 3:

1.

5. The multifunctional chip glue according to claim 1, characterized in that: The diluent is made of methyl methacrylate.

6. The multifunctional chip glue according to claim 1, characterized in that: The auxiliary agent is composed of a stabilizer, an adhesion enhancer and a thixotropic agent. The ratio of the stabilizer, adhesion enhancer and thixotropic agent is 2:2:

1. The stabilizer is made of hydroquinone monomethyl ether, the adhesion enhancer is made of γ-aminopropyltriethoxysilane, and the thixotropic agent is made of organic bentonite.

7. The multifunctional chip glue according to claim 1, characterized in that: The active monomer is composed of isobornyl acrylate, tripropylene glycol diacrylate and trimethylolpropane triacrylate, and the ratio of isobornyl acrylate, tripropylene glycol diacrylate and trimethylolpropane triacrylate is 2:1:

1.

8. The multifunctional chip glue according to claim 1, characterized in that: Specifically comprising the following preparation steps: S1. Raw material preparation S101. Weighing raw materials The mass ratio of the glue body: polylactic acid, polyhydroxyalkanoate, and starch nanocrystals is 10:10:1; Photoinitiator: the mass ratio of benzophenone and benzoin methyl ether is 1:1; Curing agent: The mass ratio of polypropylmethylsiloxane and epoxy resin is 3:1; Diluent: methyl methacrylate; Additives: The mass ratio of stabilizer (hydroquinone monomethyl ether), adhesion enhancer (γ-aminopropyltriethoxysilane), and thixotropic agent (organic bentonite) is 2:2:1; Reactive monomers: isobornyl acrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate in a mass ratio of 2:1:1; S102. Raw material inspection Use a high-precision electronic balance to weigh each raw material with an accuracy of ±0.1%. Perform appearance and purity tests on the raw materials to ensure they are free of impurities, moisture, or deterioration. The purity should be above 99.0%. S2. Preparation of glue body S201. Reactor pretreatment Use anhydrous ethanol to wipe the inner wall of the reactor to ensure that there are no impurities and oil stains, and blow dry the reactor with dry nitrogen to ensure that there is no moisture residue; S202. Mixing and stirring Add the weighed polylactic acid, polyhydroxyalkanoate and starch nanocrystals into the reactor, stir at 40 rpm for 30 minutes, and control the heating temperature at 60-80°C; S203. Mixing uniformity test After stirring is completed, samples are taken for microscopic observation to ensure that the components are evenly dispersed and there is no obvious aggregation; S3. Addition of photoinitiator and curing agent S301. Sequential Mixing First add the photoinitiator into the reactor, stir evenly, then add the curing agent, stirring at 30 rpm for 15-20 minutes; S302. Temperature control During the addition process, the temperature in the reactor should be controlled at 40-60°C; S4. Addition of diluent and additives S401. Diluent pretreatment Filter methyl methacrylate using a filter membrane with a filtration accuracy of 0.2-0.5 microns; S402. Additive mixing Mix the additives evenly according to the proportion, stirring at a speed of 100-150 rpm for 5-10 minutes; S403. Add process monitoring After adding the diluent and additives into the reactor, stir at a speed of 30-40 rpm for 10-15 minutes to ensure that there is no stratification or precipitation of the glue; S5. Addition of active monomer S501. Active monomer mixing Mix the active monomers in proportion, stirring at a speed of 20-30 rpm for 10-15 minutes; S502. Add temperature control When adding active monomers, the temperature in the reactor should be controlled at 30-50°C, the stirring speed should be 30-40 rpm, and the stirring time should be 10-15 minutes; S6. Mixing S601. Mixing parameter adjustment All raw materials were fully stirred in the reactor at a stirring speed of 30 rpm for 40 minutes; S602. Mixing uniformity detection Use a rheometer to test the rheological properties of the glue to ensure that the viscosity and shear stress are uniform and consistent, and that the particle size distribution of the glue is uniform and there is no obvious difference; S7. Grinding S701. Grinding equipment selection Use a three-roller grinding machine, the rollers are made of stainless steel or ceramic; S702. Grinding parameter optimization The roller speed is 10-20 rpm, the grinding pressure is 0.5-1.0 MPa, and the grinding times are 3-5 times until the particle size of the ground particles is less than 20 microns; S703. Post-grinding inspection Use a laser particle size analyzer to test the particle size distribution to ensure that the particle size is less than 20 microns and that the glue has a uniform appearance without granular matter and precipitation; S8. Degassing S801. Degassing equipment selection Use a vacuum pump for degassing, and the vacuum degree reaches above -0.09MPa; S802. Degassing parameter optimization The degassing time is 30 minutes and the temperature is controlled at 30-50℃; S803. Detection after degassing Use an ultrasonic detector or visual inspection to check for bubbles in the glue to ensure that the glue has a uniform appearance without bubbles or delamination; S9. Packaging S901. Packaging material selection Use aluminum foil composite bags or plastic barrels for packaging to ensure that the packaging materials have good sealing, moisture resistance and corrosion resistance; S902. Packaging process control The packaging workshop should be kept clean and dry, with relative humidity controlled at 30%-70%. Packaging personnel must wear gloves and masks to ensure that the glue is completely sealed in the packaging container; S903. Post-packaging inspection Check the sealing of the packaging to ensure there is no leakage, and conduct sampling inspection on the glue after packaging to ensure that its performance meets the requirements.

9. The multifunctional chip glue according to claim 1, characterized in that: The glue can quickly reduce viscosity under UV irradiation, and the UV energy is 200-300mJ.

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