Plate-type viscoelastic damper integrated with semiconductor active temperature control system

Abstract

The invention relates to a plate-type viscoelastic damper integrated with a semiconductor active temperature control system, which comprises a plate-type viscoelastic damper module, a semiconductor temperature control system hardware module, a hardware control circuit module and a temperature control algorithm module, wherein the semiconductor temperature control system hardware module comprises TEC1-12706 type semiconductor chilling plates, NTC (Negative Temperature Coefficient) thermistors, an STM32F407VGT6 type main control chip and a water-cooling heat dissipation module, and eight TEC1-12706 pieces are symmetrically arranged on the two sides of the plate type viscoelastic damper and are connected in parallel; the hardware control circuit design module is used for converting a hardware scheme into a realizable electrical connection blueprint to ensure the cooperative control of the refrigeration sheet and the accurate feedback of the sensor; the temperature control algorithm module is input into the main control chip to realize the temperature control function of the device; after the temperature control system is integrated, all performance indexes of the plate type viscoelastic damper are kept stable in a target temperature range, and rigidity attenuation and energy consumption efficiency fluctuation caused by temperature rise are effectively restrained.

Description

Technical Field

[0001] The present invention relates to the technical field of earthquake resistance and vibration reduction in civil engineering, in particular to the field of plate-type viscoelastic dampers, and specifically to a plate-type viscoelastic damper with an integrated semiconductor active temperature control system. Background Art

[0002] Plate-type viscoelastic dampers rely on the viscoelastic dissipation mechanism of polymer materials to achieve vibration control, but their engineering applications face dual challenges: first, the material's intrinsic temperature sensitivity is significant: at low temperatures, the glass transition causes a surge in brittleness and a sharp drop in damping efficiency; at high temperatures, over-activation of molecular chains leads to modulus attenuation and degradation of energy dissipation capacity. This strong correlation between temperature and performance severely restricts its reliability in extreme climatic environments; second, the heat accumulation effect under long-term service conditions exacerbates performance degradation: in typical application scenarios such as wind vibration control, the damper needs to withstand long-period dynamic loads, and the heat generated by continuous energy consumption is difficult to dissipate effectively, causing the internal temperature to gradually increase with working time, further inducing material softening.

[0003] Existing technologies focus on material modification to broaden temperature range adaptability, but generally ignore the problem of fatigue softening under high-frequency cyclic loads. Wind vibration control is precisely the most widely used field for plate-type viscoelastic dampers. Its operating characteristics determine that the damper must undergo cyclic loading. At this time, the internal heat dissipation efficiency of the material is insufficient, forming a vicious cycle. Existing passive heat dissipation designs and static material optimizations are unable to solve the problem of thermal coupling failure under dynamic loads. This technological gap leads to the frequent multi-modal performance degradation of dampers in actual engineering, such as insufficient low-temperature efficiency, high-temperature stiffness degradation, and long-term service fatigue failure. Innovative research is needed from the perspective of coordinated optimization of thermal conductivity modification and fatigue resistance.

[0004] Semiconductor refrigeration technology, based on the Peltier effect, achieves cooling by driving heat transfer between electrons and holes in semiconductor materials through electric current. It boasts advantages such as no moving parts, compact structure, and fast response speed. The core of a semiconductor refrigeration device is a thermoelectric module, typically composed of multiple P-type and N-type semiconductor thermocouple pairs. When current passes through the thermocouples, heat is transferred from the cold end to the hot end, achieving the cooling effect. The performance of a thermoelectric module depends primarily on the material's Seebeck coefficient, electrical conductivity, and thermal conductivity, which together determine the quality factor of the thermoelectric material. Summary of the Invention

[0005] The present invention overcomes the shortcomings of the prior art by providing a plate-type viscoelastic damper with an integrated semiconductor active temperature control system. This damper achieves precise dynamic control of the damper's operating temperature, maintaining it at its optimal operating temperature and preventing abnormal performance degradation of the viscoelastic material due to overheating or overcooling. This ensures the reliable application of the damper in long-term vibration control.

[0006] In order to achieve the above-mentioned object, the plate-type viscoelastic damper of the integrated semiconductor active temperature control system of the present invention is as follows: The main features of the plate-type viscoelastic damper of the integrated semiconductor active temperature control system are: plate-type viscoelastic damper module, semiconductor temperature control system hardware module, hardware control circuit module and temperature control algorithm module; among them, The plate-type viscoelastic damper module includes an outer horizontal constraint steel plate, an intermediate horizontal constraint steel plate, and an inner horizontal constraint steel plate. A viscoelastic energy-absorbing core material is fixed between each horizontal steel plate. Each horizontal constraint steel plate and the viscoelastic energy-absorbing core material are mechanically fastened to the outside of the core material area by multiple sets of high-strength bolts penetrating the structure. Circular mounting holes are provided at the four corners of the two outermost constraint plates for connecting to the docking base plate of the building structure. The semiconductor temperature control system hardware module is symmetrically arranged on both sides of the plate-type viscoelastic damper module and connected in parallel with the plate-type viscoelastic damper module to achieve cooling capacity superposition and temperature difference uniform distribution control; The hardware control circuit module includes a temperature acquisition circuit and a drive circuit. The main control chip performs temperature control processing through the hardware control circuit. The temperature control algorithm module controls the main control chip to perform temperature control through the NTC thermistor calibration algorithm and the temperature control system fuzzy PID control algorithm.

[0007] Preferably, the semiconductor temperature control system hardware module includes a semiconductor refrigeration chip array, a temperature sensor, a main control chip and a water cooling system, wherein: The semiconductor refrigeration chip array is composed of a plurality of semiconductor refrigeration chips, which are symmetrically arranged on both sides of the plate-type viscoelastic damper module; The temperature sensor is an NTC thermistor, which is arranged next to the semiconductor refrigeration chip array to monitor the actual cooling or heating temperature; The main control chip is combined with the semiconductor refrigeration chip to generate a PWM signal, which is collected and processed by the ADC to achieve temperature closed-loop control; The water cooling system includes a water cooling head, a water pump, a coolant, water pipes and joints. The water cooling head transfers the heat from the hot end of the semiconductor cooler TEC to the coolant. The water pump drives the coolant circulation, the coolant transfers the heat, and the components are connected by water pipes and joints to achieve sealing.

[0008] Preferably, the temperature acquisition circuit adopts a constant voltage circuit, a subtractor circuit or a Wheatstone circuit.

[0009] Preferably, the driving circuit adopts an H-bridge topology structure, realizes the cooling or heating function of the semiconductor refrigeration plate by switching the current direction, and controls the cooling or heating power by controlling the current size; the control logic of the driving circuit is: Cooling mode: GPIO1 = high level, GPIO2 = low level; Heating mode: GPIO1 = low level, GPIO2 = high level.

[0010] More preferably, the NTC thermistor calibration algorithm adopts an adaptive Steinhart-Hart coefficient calibration algorithm, updates the model parameters in real time through a recursive least squares method, and calculates the absolute temperature using the updated coefficients, specifically: The resistance-temperature relationship of the thermistor is defined as a nonlinear equation: ,in, is the absolute temperature, is the measurement vector, A, B, C are Steinhart-Hart coefficients, let y = 1 / T, construct the state vector and the measurement vector , the equation is transformed into linear form: ; Assume that at the kth sampling time, the measured temperature is , the corresponding resistance is , then the model output error is defined as: , get the coefficient estimate of the previous iteration; Assume that the kth sampling data point is ( ), first calculate the gain matrix , For the Subsampled covariance matrix; updated parameter estimates , update the covariance matrix , and finally use the real-time updated coefficients Calculating absolute temperature .

[0011] Preferably, the fuzzy PID control algorithm of the temperature control system takes the temperature difference and the error change rate as input, and is mapped to a 7-level fuzzy set {NB, NM, NS, ZO, PS, PM, PB} after fuzzification processing, wherein the input variable adopts a triangular membership function, the output variable correction amount adopts a Gaussian function, and a 7×7 fuzzy rule base is constructed according to the combination of different errors and change rates, NB is a large negative error, NM is a medium negative error, NS is a small negative error, ZO is a zero error, PS is a small positive error, PM is a medium positive error, and PB is a large positive error. Finally, the center of gravity method is used to calculate the exact value of the correction amount.

[0012] More preferably, the fuzzy PID control algorithm of the temperature control system is specifically designed as follows: ; in, is the proportional coefficient, which is used to respond proportionally to the current error; is the integral coefficient, which is used to eliminate the steady-state error of the system; is the differential coefficient, which is used to predict the future trend of the error and reduce overshoot; Indicates the control signal output by the system at the current moment, which is used to adjust the temperature; is the error at the current moment, that is, the set temperature With actual temperature The difference between Represents the error over time The change of the integral from the initial moment To the current moment The cumulative historical error value of t is ; The weighted median value is used to process the internal temperature sensor data of the plate viscoelastic damper, and the mean value is calculated after removing the outliers: ; in, is the actual temperature of the internal temperature sensor, For the The weight factor of each data point; For the Temperature measurements; For all temperature data , , ... , the median; Adopt two-dimensional fuzzy PID control strategy to adjust PID parameters in real time: ; in, =2.79, =0.0106, =14.3 is the initial PID parameter; is the proportional coefficient The amount of change; is the integral coefficient The amount of change; is the differential coefficient The amount of change; The controller uses the temperature difference The sum of the error change rate is input and mapped to the 7-level fuzzy set {NB, NM, NS, ZO, PS, PM, PB} after fuzzification processing. The input variables use the triangular membership function: ; in, To express the temperature difference In fuzzy sets The membership function in ; The output variable correction uses a Gaussian function: ; in, Indicates the error change rate The membership function in the fuzzy set NS is used to smoothly adjust the parameters.

[0013] The application of the plate-type viscoelastic damper using the above-mentioned integrated semiconductor active temperature control system in building structure vibration reduction.

[0014] The plate-type viscoelastic damper, which incorporates the integrated semiconductor active temperature control system of the present invention, combines semiconductor refrigeration technology with intelligent control algorithms. It employs an adaptive Steinhart-Hart coefficient calibration algorithm, using recursive least squares to correct sensor nonlinearity in real time, thus resolving the temperature drift problem associated with traditional fixed-coefficient models. Furthermore, a fuzzy-PID composite control strategy is designed, utilizing fuzzy logic to dynamically adjust PID parameters without requiring a precise mathematical model. This modular and miniaturized hardware design also offers universal applicability to nonlinear and time-varying systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a flow chart of the control principle of the semiconductor temperature control system hardware module of the present invention.

[0016] Figure 2 Schematic diagram of the working process of the semiconductor temperature control system hardware module of the present invention.

[0017] Figure 3 This is a flow chart of the fuzzy PID control algorithm for the semiconductor temperature control system of the present invention.

[0018] Figure 4 The temperature response curve comparison of the three control algorithms.

[0019] Figure 5 Schematic diagram of the dimensions of the plate-type viscoelastic damper specimen of the present invention.

[0020] Figure 6 The hysteresis curves of the plate-type viscoelastic damper specimen of the present invention are obtained under different ambient temperature conditions at a given strain amplitude of 5 mm and a given frequency of 1 Hz, without an integrated temperature control system.

[0021] Figure 7The hysteresis curves of the integrated temperature control system of the plate-type viscoelastic damper specimen of the present invention under different ambient temperature conditions at a given strain amplitude of 5 mm and a given frequency of 1 Hz. DETAILED DESCRIPTION

[0022] In order to more clearly describe the technical content of the present invention, further description is given below in conjunction with specific embodiments.

[0023] Before describing in detail embodiments according to the present invention, it should be noted that, hereinafter, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, whereby a process, method, article, or apparatus comprising a list of elements includes not only those elements, but also other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0024] The plate-type viscoelastic damper of the integrated semiconductor active temperature control system includes: a plate-type viscoelastic damper module, a semiconductor temperature control system hardware module, a hardware control circuit module and a temperature control algorithm module; wherein, The plate-type viscoelastic damper module includes an outer horizontal constraint steel plate, an intermediate horizontal constraint steel plate, and an inner horizontal constraint steel plate. A viscoelastic energy-absorbing core material is fixed between each horizontal steel plate. Each horizontal constraint steel plate and the viscoelastic energy-absorbing core material are mechanically fastened to the outside of the core material area by multiple sets of high-strength bolts penetrating the structure. Circular mounting holes are provided at the four corners of the two outermost constraint plates for connecting to the docking base plate of the building structure. The semiconductor temperature control system hardware module is symmetrically arranged on both sides of the plate-type viscoelastic damper module and connected in parallel with the plate-type viscoelastic damper module to achieve cooling capacity superposition and temperature difference uniform distribution control; The hardware control circuit module includes a temperature acquisition circuit and a drive circuit. The main control chip performs temperature control processing through the hardware control circuit. The temperature control algorithm module controls the main control chip to perform temperature control through the NTC thermistor calibration algorithm and the temperature control system fuzzy PID control algorithm.

[0025] like Figure 1 and 2 As shown in the figure, in actual application, the semiconductor temperature control system hardware module includes a TEC1-12706 semiconductor cooler, an NTC thermistor, an STM32F407VGT6 main control chip, and a water cooling system. Eight TEC1-12706s are arranged symmetrically, with four installed on each side of the damper. The parallel connection achieves superimposed cooling capacity and uniform temperature distribution. This creates a symmetrical heat flow field on the damper surface, preventing performance degradation caused by localized overheating.

[0026] The installation position of the NTC thermistor directly affects the dynamic response and accuracy of the temperature control system. When performing cold end or heating monitoring, it is placed near the semiconductor refrigeration chip to monitor the actual cooling or heating temperature. The deployment of all sensors must follow the principle of thermal symmetry to avoid measurement deviations caused by local temperature gradients.

[0027] The STM32F407VGT6 main control chip generates a PWM signal, which is collected and processed by the ADC to achieve closed-loop temperature control.

[0028] The water cooling system includes a water cooling head, a water pump, a coolant, water pipes and joints; The water cooling head transfers the heat from the TEC hot end to the coolant. The water pump drives the coolant circulation. The coolant transfers heat and needs to have high thermal conductivity and corrosion resistance. The water pipes and joints connect the components to ensure sealing.

[0029] After the above hardware is integrated, one side of the semiconductor refrigeration plate is bonded to a copper sheet with good thermal conductivity through thermal conductive adhesive, and then the copper sheet is attached to both sides of the plate-type viscoelastic damper to generate heat or cooling through physical contact.

[0030] As a preferred embodiment of the present invention, the hardware control circuit module converts the hardware solution into a realizable electrical connection blueprint, including temperature acquisition circuit design and drive circuit design.

[0031] The temperature acquisition circuit design includes constant voltage circuit, subtractor circuit and Wheatstone circuit; The Wheatstone circuit, as the core sensor conversion unit, converts the temperature measurement into a weak voltage signal. The constant voltage circuit provides a stable reference voltage, ensuring that the Wheatstone circuit operates under constant conditions and preventing measurement deviations caused by power supply voltage variations. The subtractor circuit further processes the differential signal output by the Wheatstone circuit to effectively suppress common-mode interference.

[0032] The voltage signal output by the temperature acquisition circuit after collaborative processing has high stability, strong anti-interference and appropriate amplitude. It can be directly connected to a microcontroller or data acquisition card and other devices to complete the complete conditioning process from the physical quantity of temperature to a precise electrical signal, providing a basis for subsequent analysis and control of temperature data.

[0033] The core design of the driving circuit adopts H-bridge topology, which realizes the cooling or heating function of the semiconductor refrigeration chip by switching the current direction, and controls the cooling or heating power by controlling the current size; In a specific embodiment of the present invention, the drive circuit design is based on TEC1-12706 (12V / 6A). In the H-bridge drive circuit design, the BTS7960B driver chip is used. Its voltage and current meet the use requirements. The specific parameter information of the chip is detailed in Table 1 below: ;

[0034] The driver circuit's control logic states that when the GPIO control signal is "forward," current flows through the upper left and lower right switches of the H-bridge to the TEC, absorbing heat at the cold junction. When the signal is "reverse," current flows in the opposite direction through the upper right and lower left switches, releasing heat at the cold junction. When the signal is "stop," all switches are turned off, and no current flows through the TEC. As shown in Table 2 below, this driver circuit's control logic uses two complementary GPIO signals to achieve bidirectional mode switching. This is combined with a PWM signal to adjust the duty cycle and current level, ensuring precise switching between cooling and heating modes according to temperature control requirements.

[0035] ; like Figure 3 As shown, as a preferred embodiment of the present invention, the temperature control algorithm module includes an NTC thermistor calibration algorithm and a temperature control system fuzzy PID control algorithm.

[0036] The NTC thermistor calibration algorithm adopts an adaptive Steinhart-Hart coefficient calibration algorithm and updates the model parameters in real time through recursive least squares (RLS); The resistance-temperature relationship of the thermistor is defined as a nonlinear equation: , T is the absolute temperature in K, where A, B, and C are the Steinhart-Hart coefficients, which need to be determined by calibration. Let y = 1 / T, and construct the state vector and the measurement vector , the equation is transformed into linear form: ; The parameter estimation problem is transformed into a linear regression problem through linearization, and the recursive least squares (RLS) method is used to achieve dynamic parameter calibration. Assume that at the kth sampling time, the measured temperature And the corresponding resistance , then the model output error is defined as: , is the coefficient estimate of the previous iteration; The goal of the RLS algorithm is to minimize the weighted sum of squares of historical errors: , where is the forgetting factor, which is used to adjust the weight of historical data. Suppose the kth sampling data point is ( ), first initialize the algorithm, the initial value of the parameter vector, =0, initial value of covariance matrix , =106; First calculate the gain matrix , update the parameter estimates , update the covariance matrix , and finally use the real-time updated coefficients Calculating absolute temperature .

[0037] The fuzzy PID control algorithm of the temperature control system consists of three parts: proportional (P), integral (I) and differential (D), and its formula is: , is the proportional coefficient, which is used to respond proportionally to the current error. is the integral coefficient, which is used to eliminate the steady-state error of the system. is the differential coefficient, which is used to predict the future trend of the error and reduce overshoot; The weighted median value is used to process the temperature sensor data inside the damper, and the mean value is calculated after removing the outliers: ; Adopting two-dimensional fuzzy PID control strategy, the PID parameters are adjusted in real time through fuzzy logic to achieve adaptive control of complex working conditions. Its basic structure is: ; =2.79, =0.0106, =14.3 is the initial PID parameter; is the proportional coefficient The amount of change; is the integral coefficient The amount of change; is the differential coefficient The amount of change; The controller uses the temperature difference The sum of the error change rate is input and mapped to the 7-level fuzzy set {NB, NM, NS, ZO, PS, PM, PB} after fuzzification processing. The input variables use the triangular membership function: , The vertex coordinates are (-60,0), (-50,1), and (-40,0), and the output variable correction uses a Gaussian function: ; This is used to smoothly adjust parameters.

[0038] As shown in Table 3 below, the proportional coefficient is constructed The 7×7 fuzzy rule base covers parameter adjustment strategies under different combinations of errors and change rates to ensure adaptability to all working conditions.

[0039] ; ; ;

[0040] Tables 4 and 5 above are the integral coefficients in the fuzzy rule base. and differential coefficients The correction rules also cover the parameter adjustment strategies under different combinations of errors and change rates.

[0041] The application process of this technical solution is further explained below with reference to a specific embodiment: Example 1

[0042] This example verifies the control performance of the fuzzy PID control algorithm in practical applications, and conducts comparative tests with the Bang-Bang control algorithm and the traditional PID control algorithm. =2.79, =0.0106, =14.3, the initial fuzzy PID parameters are set the same, the ambient temperature is 28℃, and the target temperature is set to 12℃.

[0043] Figure 4 These are the temperature response curves of the fuzzy PID control algorithm, Bang-Bang control algorithm, and traditional PID control algorithm. Fuzzy PID control uses fuzzy logic to adaptively adjust the PID parameters. The curve decreases monotonically according to an exponential law starting from 22°C, with no obvious overshoot and no oscillation throughout the process, and stabilizes at the target temperature of 12°C with the smoothest transition and shortest adjustment time.

[0044] Example 2

[0045] This embodiment conducts a performance test of a plate-type viscoelastic damper with an integrated semiconductor active temperature control system. The dimensions of the plate-type viscoelastic damper specimen are as follows: Figure 5 shown.

[0046] Through various loading tests under various working conditions, the force and displacement hysteresis curves of the damper in different seasons, excitation frequencies and displacement amplitudes are obtained. After data processing, key performance parameters such as equivalent stiffness, equivalent damping ratio, single-turn energy consumption, and loss factor are calculated to verify the temperature control accuracy of the semiconductor temperature control device at the target temperature and its effect on improving the performance stability of the damper.

[0047] Figure 6 These are the hysteresis curves of the plate viscoelastic damper specimen at a given strain amplitude of 5 mm and a given frequency of 1 Hz, under different ambient temperature conditions, without an integrated temperature control system.

[0048] Figure 7These are the hysteresis curves of the integrated temperature control system for the plate viscoelastic damper specimen under a given strain amplitude of 5 mm and a given frequency of 1 Hz at different ambient temperatures.

[0049] According to the experimental data, it can be clearly seen that after integrating the semiconductor active temperature control system of the present invention, under the same parameter conditions, this technical solution has a significant improvement in temperature control accuracy and damper performance stability.

[0050] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code comprising one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may be performed out of the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention pertain.

[0051] It should be understood that each part of the present invention can be implemented by hardware, software, firmware or a combination thereof. In the above embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution device.

[0052] Those skilled in the art will understand that all or part of the steps of the method for implementing the above-mentioned embodiment can be completed by instructing the relevant hardware through a program, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one of the steps of the method embodiment or a combination thereof.

[0053] The storage medium mentioned above can be a read-only memory, a magnetic disk or an optical disk, etc.

[0054] Throughout this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "embodiment" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0055] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

[0056] The plate-type viscoelastic damper adopts the integrated semiconductor active temperature control system of the present invention. After the temperature control system is integrated, the various performance indicators of the plate-type viscoelastic damper can be kept stable within the target temperature range, effectively suppressing the stiffness attenuation and energy efficiency fluctuations caused by temperature rise, highlighting the key role of the temperature control system in improving the environmental adaptability and long-term performance reliability of the damper.

[0057] In this specification, the present invention has been described with reference to specific embodiments thereof. However, it will be apparent that various modifications and variations may be made without departing from the spirit and scope of the present invention. Accordingly, the specification and drawings are to be regarded as illustrative rather than restrictive.

Claims

1. A plate-type viscoelastic damper integrated with a semiconductor active temperature control system, characterized in that: include: Plate viscoelastic damper module, semiconductor temperature control system hardware module, hardware control circuit module and temperature control algorithm module; among them, The plate-type viscoelastic damper module includes an outer horizontal constraint steel plate, an intermediate horizontal constraint steel plate, and an inner horizontal constraint steel plate. A viscoelastic energy-absorbing core material is fixed between each horizontal steel plate. Each horizontal constraint steel plate and the viscoelastic energy-absorbing core material are mechanically fastened to the outside of the core material area by multiple sets of high-strength bolts penetrating the structure. Circular mounting holes are provided at the four corners of the two outermost constraint plates for connecting to the docking base plate of the building structure. The semiconductor temperature control system hardware module is symmetrically arranged on both sides of the plate-type viscoelastic damper module and connected in parallel with the plate-type viscoelastic damper module to achieve cooling capacity superposition and temperature difference uniform distribution control; The hardware control circuit module includes a temperature acquisition circuit and a drive circuit. The main control chip performs temperature control processing through the hardware control circuit. The temperature control algorithm module controls the main control chip to perform temperature control through the NTC thermistor calibration algorithm and the temperature control system fuzzy PID control algorithm.

2. The plate-type viscoelastic damper of the integrated semiconductor active temperature control system according to claim 1, characterized in that: The semiconductor temperature control system hardware module includes a semiconductor refrigeration chip array, a temperature sensor, a main control chip and a water cooling system, wherein: The semiconductor refrigeration chip array is composed of a plurality of semiconductor refrigeration chips, which are symmetrically arranged on both sides of the plate-type viscoelastic damper module; The temperature sensor is an NTC thermistor, which is arranged next to the semiconductor refrigeration chip array to monitor the actual cooling or heating temperature; The main control chip is combined with the semiconductor refrigeration chip to generate a PWM signal, which is collected and processed by the ADC to achieve temperature closed-loop control; The water cooling system includes a water cooling head, a water pump, a coolant, water pipes and joints. The water cooling head transfers the heat from the hot end of the semiconductor cooler TEC to the coolant. The water pump drives the coolant circulation, the coolant transfers the heat, and the components are connected by water pipes and joints to achieve sealing.

3. The plate-type viscoelastic damper of the integrated semiconductor active temperature control system according to claim 1, characterized in that: The temperature acquisition circuit adopts a constant voltage circuit, a subtractor circuit or a Wheatstone circuit.

4. The plate-type viscoelastic damper of the integrated semiconductor active temperature control system according to claim 2, characterized in that: The driving circuit adopts an H-bridge topology, realizes the cooling or heating function of the semiconductor refrigeration plate by switching the current direction, and controls the cooling or heating power by controlling the current size; the control logic of the driving circuit is: Cooling mode: GPIO1 = high level, GPIO2 = low level; Heating mode: GPIO1 = low level, GPIO2 = high level.

5. The plate-type viscoelastic damper of the integrated semiconductor active temperature control system according to claim 1, characterized in that: The NTC thermistor calibration algorithm uses an adaptive Steinhart-Hart coefficient calibration algorithm, which updates the model parameters in real time through the recursive least squares method and calculates the absolute temperature using the updated coefficients. Specifically, The resistance-temperature relationship of the thermistor is defined as a nonlinear equation: ,in, is the absolute temperature, is the measurement vector, A, B, C are Steinhart-Hart coefficients, let y = 1 / T, construct the state vector and the measurement vector , the equation is transformed into linear form: ; Assume that at the kth sampling time, the measured temperature is , the corresponding resistance is , then the model output error is defined as: , get the coefficient estimate of the previous iteration; Assume that the kth sampling data point is ( ), first calculate the gain matrix , For the Subsampled covariance matrix; updated parameter estimates , update the covariance matrix , and finally use the real-time updated coefficients Calculating absolute temperature .

6. The plate-type viscoelastic damper of the integrated semiconductor active temperature control system according to claim 1, characterized in that: The fuzzy PID control algorithm for the temperature control system takes the temperature difference and the error change rate as input, and is mapped to a 7-level fuzzy set {NB, NM, NS, ZO, PS, PM, PB} after fuzzification processing. Among them, the input variable adopts a triangular membership function, and the output variable correction amount adopts a Gaussian function. A 7×7 fuzzy rule base is constructed according to the combination of different errors and change rates. NB is a negative large error, NM is a negative medium error, NS is a negative small error, ZO is a zero error, PS is a positive small error, PM is a positive medium error, and PB is a positive large error. Finally, the center of gravity method is used to calculate the exact value of the correction amount.

7. The plate-type viscoelastic damper of the integrated semiconductor active temperature control system according to claim 6, characterized in that: The fuzzy PID control algorithm of the temperature control system is specifically designed as follows: ； in, is the proportional coefficient, which is used to respond proportionally to the current error; is the integral coefficient, which is used to eliminate the steady-state error of the system; is the differential coefficient, which is used to predict the future trend of the error and reduce overshoot; Indicates the control signal output by the system at the current moment, which is used to adjust the temperature; is the error at the current moment, that is, the set temperature With actual temperature The difference between Represents the error over time The change of the integral from the initial moment To the current moment The cumulative historical error value of t is ; The weighted median value is used to process the internal temperature sensor data of the plate viscoelastic damper, and the mean value is calculated after removing the outliers: ; in, is the actual temperature of the internal temperature sensor, For the The weight factor of each data point; For the Temperature measurements; For all temperature data , , ... , the median; Adopt two-dimensional fuzzy PID control strategy to adjust PID parameters in real time: ； in, =2.79, =0.0106, =14.3 is the initial PID parameter; is the proportional coefficient The amount of change; is the integral coefficient The amount of change; is the differential coefficient The amount of change; The controller uses the temperature difference The sum of the error change rate is input and mapped to the 7-level fuzzy set {NB, NM, NS, ZO, PS, PM, PB} after fuzzification processing. The input variables use the triangular membership function: ； in, To express the temperature difference In fuzzy sets The membership function in ; The output variable correction uses a Gaussian function: ； in, Indicates the error change rate In fuzzy sets The membership function in S is used to smoothly adjust the parameters.

8. Use of a plate-type viscoelastic damper utilizing the integrated semiconductor active temperature control system according to any one of claims 1 to 7 in vibration reduction of building structures.

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