Exposure device and exposure method

Abstract

The invention provides an exposure apparatus and an exposure method, which can properly perform correction processing on pattern distortion caused by an optical system. An exposure device (10) is provided with an exposure head (20) which is provided with a DMD (22) and a projection optical system (23) and which divides a scanning band region (BR) through which an exposure region (EA) of the exposure head passes in a sub-scanning direction (Y direction). In addition, correction values for the series of partitions (Bm) are obtained in accordance with pre-delivery, maintenance, and the like. When an exposure operation is performed, a vector data correction circuit (26) corrects pattern data (vector data) of a linear pattern on the basis of a correction value.

Description

Technical Field

[0001] The present invention relates to an exposure device having an array of light modulation elements such as a DMD, and more particularly to correction of pattern distortion and positional deviation caused by an optical system. Background Art

[0002] The maskless exposure system features an exposure head equipped with a DMD (Digital Micro-mirror Device). This DMD is a two-dimensional array of micromirrors, with multiple exposure heads positioned adjacent to each other along the secondary scanning direction. The substrate is then scanned by moving it along the primary scanning direction, with each micromirror controlled to switch on / off depending on the pattern to be formed in the exposure area, which serves as the DMD's projection area. Light reflected by the DMD is imaged onto the substrate via a projection optical system installed in the exposure head, forming a pattern on the substrate.

[0003] To form a high-precision pattern, it is necessary to form the pattern with a uniform line width. However, distortion and aberrations in the projection optical system can cause distortion in the pattern shape and shift in the pattern formation position. As a result, the pattern line width becomes uneven. To correct for such pattern distortion, methods are known that perform correction processing on the drawing data to expand or reduce the area illuminated by light (exposure area) (see Patent Document 1).

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 2012-088464

[0005] In recent years, high-resolution patterns are required to have uniform line widths. However, pattern distortion and positional shifts caused by the optical system vary depending on the location within the exposure area. For example, the line width of vertical lines along the main scanning direction varies differently from that of horizontal lines along the sub-scanning direction.

[0006] It is difficult to cope with such uneven line widths in the correction processing of the drawing data from the center to the periphery of the exposure area, which takes distortion into account. Moreover, it is impossible to cope with such uneven line widths in the correction processing of the drawing data, which corrects deformation of the substrate caused by heat, positional offset of the exposure head, etc.

[0007] Therefore, there is a demand for an exposure apparatus that can appropriately correct pattern distortion and positional deviation caused by an optical system. Summary of the Invention

[0008] An exposure device as one embodiment of the present invention includes: an exposure head, which has an array of light modulator elements obtained by two-dimensionally arranging light modulator elements; a scanning unit, which moves a carrier carrying a substrate along a main scanning direction to move an exposure area of ​​the light modulator array relative to a scanning belt area; and a pattern data correction processing unit, which corrects the drawing data of a line pattern formed on the substrate, the pattern data correction processing unit corrects the drawing data in a manner that makes the line width of the line pattern along a prescribed direction consistent within the scanning belt area based on a correction value pre-assigned to each zone prescribed along a sub-scanning direction of the scanning belt area.

[0009] The pattern data correction process is not limited to maintaining strict line width uniformity; it is sufficient to perform correction processing to maintain line width uniformity within a range permitted by, for example, the required pattern resolution. Correction values ​​can be obtained by measuring the correction amount, plotting the line pattern, and determining correction values ​​for each segment. For example, the pattern can be divided into evenly spaced segments along the sub-scanning direction, and correction values ​​can be pre-assigned to each segment based on the displacement (offset) measured for each segment. For example, the correction value can be determined to compensate for pattern formation position deviations caused by the projection optical system provided in the exposure head.

[0010] The pattern data correction processing unit may correct the vector data as drawing data. For example, the pattern data correction processing unit may perform at least one of elongation, reduction, rotation, and parallel translation (displacement) of the vector representing the outline of the drawing data.

[0011] The pattern data correction processing unit can correct the drawing data for the line widths of the vertical line patterns along the main scanning direction and the horizontal line patterns along the sub-scanning direction. Since correction values ​​are assigned to each segment defined along the sub-scanning direction, the pattern data correction processing unit only needs to correct the drawing data so that at least the line widths of the vertical line patterns along the main scanning direction are consistent. The pattern data correction processing unit can correct the drawing data so that the line widths of multiple vertical line patterns along the main scanning direction that converge within multiple segments are consistent.

[0012] The pattern data correction processing unit may perform correction on the drawing data to make the line width of the vertical line pattern along the main scanning direction uniform and on the drawing data to make the line width of the horizontal line pattern along the sub-scanning direction uniform.

[0013] The exposure device may include a light intensity adjustment unit that adjusts the light intensity across the entire exposure area. The light intensity adjustment unit adjusts the light intensity across the entire exposure area so that the line width varies along the main scanning direction and the sub-scanning direction for a vertical line pattern along the main scanning direction or a horizontal line pattern along the sub-scanning direction. The pattern data correction processing unit may correct the drawing data so that the line width is uniform along the sub-scanning direction based on the correction by the light intensity adjustment unit.

[0014] The light intensity adjustment unit may change the line width of the vertical line pattern along the main scanning direction or the horizontal line pattern along the sub-scanning direction based on mask data that specifies the arrangement of unused light modulators. Alternatively, the output of the light source may be adjusted.

[0015] On the other hand, an exposure device as another embodiment of the present invention includes: an exposure head, which has an array of light modulator elements obtained by two-dimensionally arranging light modulator elements; a scanning unit, which moves a carrier carrying a substrate along a main scanning direction to move the exposure area of ​​the light modulator array relatively along a scanning belt area; and a pattern data correction processing unit, which corrects the drawing data of the pattern formed on the substrate, and the pattern data correction processing unit corrects the drawing data in a manner that makes the width of the pattern consistent within the scanning belt area based on a correction value pre-assigned to each zone defined in the scanning belt area along a sub-scanning direction.

[0016] The patterns targeted for calibration are not limited to those requiring uniform line widths for vertical lines along the scanning direction and horizontal lines along the sub-scanning direction. Calibration can be performed on a variety of patterns, including arcuate patterns, rectangular patterns, and circular patterns. The calibration value for each segment can be calculated based on the line pattern drawn on the measurement substrate.

[0017] For example, the pattern data correction processing unit corrects the drawing data so that at least the width of the pattern in the sub-scanning direction matches the width of the pattern in the main scanning direction.

[0018] An exposure method as another embodiment of the present invention includes the following steps: moving the exposure area of ​​the light modulator array along the scanning band area relative to the exposure area of ​​the light modulator array by moving the carrier carrying the substrate along the main scanning direction, wherein the light modulator array is obtained by two-dimensionally arranging the light modulators; and correcting the drawing data of the linear pattern formed on the substrate, and forming the pattern on the substrate according to the corrected drawing data, wherein the drawing data is corrected in such a manner that the line width of the line pattern along the prescribed direction is made consistent within the scanning band area according to a correction value pre-assigned to each zone prescribed along the sub-scanning direction of the scanning band area.

[0019] An exposure method as another embodiment of the present invention includes the following steps: moving an exposure area of ​​an optical modulator array relatively along a scanning band area by moving a stage carrying a substrate along a main scanning direction, wherein the optical modulator array is obtained by two-dimensionally arranging optical modulators; and correcting drawing data of a linear pattern formed on the substrate, and forming a pattern on the substrate according to the corrected drawing data, wherein the drawing data is corrected in such a manner that the width of the pattern is made consistent within the scanning band area according to a correction value pre-assigned to each zone of the scanning band area along a sub-scanning direction.

[0020] According to the present invention, it is possible to provide an exposure apparatus capable of appropriately correcting distortion of a pattern caused by an optical system. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a block diagram of the exposure apparatus of this embodiment.

[0022] Figure 2 This is a diagram showing a portion of a pattern determined for a swath area as pattern data (vector data).

[0023] Figure 3 1 is a diagram showing correction of pattern data for a vertical line pattern.

[0024] Figure 4 1 is a diagram showing correction of pattern data for a horizontal line pattern.

[0025] Figure 5 1 is a diagram illustrating correction of pattern data for a linear pattern extending in an oblique direction.

[0026] Figure 6 : is a diagram showing a flowchart of pattern data correction processing.

[0027] Label Description

[0028] 10: exposure device; 20: exposure head; 22: DMD (light modulation element array); 26: vector data correction circuit; BR: scanning band area; EA: exposure area. DETAILED DESCRIPTION

[0029] Hereinafter, the exposure apparatus according to the present embodiment will be described with reference to the drawings.

[0030] Figure 1 This is a block diagram of the exposure apparatus of this embodiment.

[0031] The exposure device 10 is a maskless exposure device for directly forming a pattern on a substrate W having a photosensitive material such as a photoresist formed on the surface thereof, and includes a plurality of exposure heads 20 (in Figure 1(Only one exposure head is shown in the figure), the exposure head 20 includes a light source 21 such as a laser and a DMD (Digital Micro-mirror Device) 22. Illumination light emitted from the light source 21 is guided to the DMD 22 via an illumination optical system (not shown).

[0032] The DMD 22 is an optical modulation element array composed of tiny rectangular micromirrors (e.g., several to several tens of μm) arranged two-dimensionally in a matrix. It is driven by a DMD driver circuit 24. Vector data (drawing data), such as CAD / CAM data, sent from a server or workstation (not shown), is corrected in a vector data correction circuit 26 and then converted into raster data representing a two-dimensional dot pattern in a raster conversion circuit 28.

[0033] The DMD driver circuit 24 transmits exposure data based on the generated raster data to the DMD 22. The micromirrors of the DMD 22 are turned on / off based on the exposure data. Light reflected by the on-state micromirrors passes through the projection optical system 23 and forms an image on the surface (photosensitive surface) of the substrate W as patterned light.

[0034] The stage 12, carrying the substrate W, is capable of reciprocating in the main scanning direction by a stage drive mechanism 14. As the stage 12 moves, the projection area, or exposure area, of the DMD 22 moves relative to the substrate W. However, the substrate W may also be placed on a worktable disposed on the stage. The exposure area is tilted at a slight angle relative to the main scanning direction (X direction).

[0035] The position of the substrate W (stage 12) is detected by the position detection sensor 15. In the stage 12 (substrate W), XY coordinates are defined so as to coincide with the main scanning direction and the sub-scanning direction perpendicular to the main scanning direction.

[0036] While the substrate W is moving at a predetermined speed, the DMD driving circuit 24 outputs exposure data corresponding to the position of the substrate W to the DMD 22. Thus, a pattern corresponding to the position of the exposure area is formed on the substrate W. Here, a multiple exposure operation is performed in which the microscopic projection areas of the micromirrors overlap with each other at a predetermined exposure pitch.

[0037] The controller 30 controls the operation of the exposure device 10 , and the memory 32 stores data related to correction processing of pattern data, etc. A control program related to the exposure operation, etc. is stored in a ROM (not shown) in the controller 30 .

[0038] The exposure device 10 includes a camera (not shown) for reading alignment marks written on the substrate W. The vector data correction circuit 26 corrects the vector data based on the amount of mark position shift caused by thermal deformation of the substrate W, etc., detected before the multi-exposure operation.

[0039] Furthermore, the vector data correction circuit 26 performs correction processing on the pattern data (vector data) to correct the aforementioned alignment mark positional deviations, as well as to compensate for pattern distortion and positional deviations caused by the projection optical system 23 and other factors, thereby returning the pattern to its intended drawing position. The correction processing for pattern distortion and positional deviations caused by the optical system will be described in detail below.

[0040] Figure 2 This is a diagram showing a portion of a pattern determined for the scanning band area BR that moves relatively with respect to the exposure area EA as pattern data (vector data).

[0041] Here, pattern data PB1 for a linear pattern along the main scanning direction (X direction), pattern data PB2 for a linear pattern along the sub-scanning direction (Y direction), and pattern data PB3 for a rectangular pattern are shown. Furthermore, as described above, the exposure area EA is actually tilted at a slight angle relative to the scanning band area BR.

[0042] Vector data is data that expresses the outline of a pattern using vectors, and the shape of the pattern is determined by the coordinate information of the start and end points of the vectors that form the outline. Figure 2 The linear pattern data PB1 shown is represented by coordinate data (x0, y0), (x1, y1), (x2, y2), and (x3, y3).

[0043] A pattern conforming to the specifications of the substrate W is formed in the scanning band area BR. For example, a linear pattern such as that indicated by the pattern data PB1 (hereinafter referred to as a vertical line pattern depending on the case of being along the longitudinal direction of the substrate W) or a linear pattern such as that indicated by the pattern data PB2 (hereinafter referred to as a horizontal line pattern) is formed. Furthermore, there are also cases where a wiring pattern is formed in which the vertical line pattern is arranged in the sub-scanning direction (Y direction) or a wiring pattern is formed in which the horizontal line pattern is arranged in the main scanning direction (X direction).

[0044] Furthermore, pattern distortion and positional shifts caused by distortion and aberrations in optical systems such as the projection optical system 23 occur consistently within the scanning band area. The degree of distortion and the amount of positional shift vary depending on the position within the scanning band area, the direction in which the pattern is formed, etc. For example, the amount of increase in line width of a vertical line pattern along the main scanning direction (X direction) differs from the amount of increase in line width of a horizontal line pattern along the sub-scanning direction (Y direction).

[0045] In this embodiment, the scanning band area BR is divided (partitioned) along the sub-scanning direction (Y direction), and the correction value of the pattern data (hereinafter also referred to as vector data as needed) is determined for each of the multiple divisions (partitions).

[0046] Figure 3 The scanning band area BR is divided along the sub-scanning direction (Y direction) to define a series of partitions BT (B0 to B n Here, the length of each division along the sub-scanning direction (Y direction) is set to be the same. Figure 3 There is no pattern distortion along the main scanning direction (X direction). In addition, vertical line patterns of the same line width are formed in the regions of the divisions B1 and B2.

[0047] Assuming that there is no pattern distortion due to the optical system, the vector data VD1 and VD2 of the divisions B1 and B2 are represented by vector data having the same magnitude along the sub-scanning direction (Y direction).

[0048] However, in reality, pattern distortion and positional shifts occur due to the optical system, so when pattern formation based on the above-mentioned vector data VD1 and VD2 is performed without performing correction processing, vertical line patterns P1 and P2 with different line widths will be formed. Figure 3 In the example, the line width of the vertical line pattern P1 is narrower than that of the designed vector data VD1 , and the line width of the vertical line pattern P2 is thicker than that of the designed vector data VD2 .

[0049] Therefore, a correction value for compensating for such pattern distortion is obtained in advance, and correction processing is performed on the vector data during exposure. Figure 3 As shown, the vector data VD'1 is corrected to have a thicker line width than the designed vector data VD1, and the vector data VD'2 is corrected to have a thinner line width than the designed vector data VD2.

[0050] At this time, the vector data VD1 and VD2 are corrected based on the correction values ​​C1 and C2 determined for the partitions B1 and B2. Specifically, the correction values ​​C1 and C2 are used to correct the position coordinates of the start and end points of the vector data. n Correction value C1~C n It is stored in the memory 32 in the form of a correction table.

[0051] Since the exposure area EA moves relative to the main scanning direction (X direction), the vector data VD1 and VD2 can be corrected using the correction values ​​C1 and C2 regardless of the position of the exposure area EA along the main scanning direction (X direction). In other words, the line width correction amount of the vertical line patterns P1 and P2 does not need to be changed midway between the ends of the vertical line patterns. Therefore, the vertical line patterns P1 and P2 formed based on the corrected vector data VD'1 and VD'2 are formed into uniform wiring patterns with substantially identical line widths.

[0052] Furthermore, by utilizing not only the partitions B1 and B2 but also any partition B m (1≤m≤n) respectively assigned correction value C m For vector data VD m By performing the correction, a wiring pattern in which vertical line patterns with the same line width are arranged can be formed. Therefore, a wiring pattern in which vertical line patterns with the same line width are arranged can be formed in the entire scanning band area BR.

[0053] Figure 4 : is a diagram showing correction of pattern data for a horizontal line pattern. Due to pattern distortion caused by the optical system, the line width of the horizontal line pattern P3 along the sub-scanning direction (Y direction) is not constant. Figure 4 , a pattern P3 formed based on vector data VD3 is shown. However, here, there is no distortion of the pattern along the sub-scanning direction (Y direction).

[0054] Therefore, the vector data VD3 is corrected based on the correction values ​​D1 and D2 given to the divisions B1 and B2 to generate vector data VD'3. By the correction process, a pattern P3 having a uniform line width from end to end can be formed.

[0055] Moreover, while the exposure area EA moves relatively along the main scanning direction (X direction), by performing the same correction processing on the pattern data of the horizontal line patterns arranged at prescribed intervals, an arrangement pattern can be formed in which horizontal line patterns with the same line width are arranged along the main scanning direction (X direction).

[0056] Correction value C m The correction value D is obtained in the sub-scanning direction (Y direction). m This is the correction value obtained for the main scanning direction (X direction). m And use the correction value D for the horizontal line pattern m , it is possible to form vertical line patterns and horizontal line patterns with uniform line widths at desired locations in the scanning band area BR.

[0057] Here, the configuration is such that the correction value C is used to distinguish between the vertical line pattern and the horizontal line pattern.m , correction value D m The vector data correction circuit 26 performs correction processing in the main scanning direction (X direction) and the sub-scanning direction (Y direction) respectively. The vector data correction circuit 26 is a circuit structure that performs each correction processing separately.

[0058] However, the pattern distortion and pattern drawing position deviation caused by the optical system such as distortion usually occur in the main scanning direction (X direction) and the sub-scanning direction (Y direction). m The correction value E for correcting the vector data, that is, the start and end coordinates (X, Y) of the vector representing the pattern outline, is obtained in advance. m , according to the correction value E m Correct the vector data.

[0059] As one of such vector data correction processes, for example, the vector data may be corrected so as to converge to a certain area B. m The vector data can be corrected in such a way that the line width of the vertical line pattern is consistent from end to end. Figure 4 The same correction process is performed for the horizontal line pattern shown.

[0060] Furthermore, similar correction processing can be performed not only on vertical line patterns extending in the sub-scanning direction (Y direction) and horizontal line patterns extending in the main scanning direction (X direction), but also on other linear patterns extending in oblique directions.

[0061] Figure 5 3 is a diagram showing correction of pattern data for a linear pattern extending in an oblique direction.

[0062] For the vector data represented by the start and end point coordinates (x0, y0), (x1, y1), (x2, y2), and (x3, y3) of each vector representing the contour line of the linear pattern, a pattern P4 with varying line width is formed due to the distortion of the pattern caused by the optical system.

[0063] Therefore, according to the correction value C for the sub-scanning direction (Y direction), m The vector data is corrected to generate vector data VD'4. In this case, the vector data VD'4 is generated by a correction operation that stretches, shrinks, or rotates the vector. By forming the pattern P4 based on the vector data VD'4, a diagonal line pattern with a uniform line width can be formed.

[0064] Rather than simply compensating for pattern distortion and positional offset caused by the optical system through pattern data correction processing, the correction process can also be combined with so-called dimming filter data. Dimming filter data represents data on the arrangement of micromirrors not used for the purpose of varying the amount of light for the entire DMD 22. Dimming filter data is described in, for example, Japanese Patent Application Publication No. 2013-134316 and Japanese Patent Application Publication No. 2016-173535, and a detailed description thereof will be omitted.

[0065] For example, the controller 30 may read the light adjustment filter data from the memory 32 , and the raster conversion circuit 28 may generate exposure data by combining the light adjustment filter data and the raster data.

[0066] The dimming filter data adjusts the light intensity for the entire exposure area EA. Therefore, when light intensity adjustment using the dimming filter data is performed, uniform line width variation occurs in both the main scanning direction (X direction) and the sub-scanning direction (Y direction) for both vertical and horizontal line patterns. The vector data correction circuit 26 corrects the pattern data (vector data) based on the line width variation caused by the light intensity adjustment.

[0067] For example, line width correction along the main scanning direction (X direction) may be performed by adjusting the amount of light, and the vector data correction circuit 26 may correct the line width along the sub-scanning direction (Y direction) based on the line width changes along the main scanning direction (X direction) and the sub-scanning direction (Y direction) caused by the light adjustment.

[0068] In addition, regarding the light intensity adjustment, instead of using the dimming filter data, the light intensity adjustment for the light source 21 may be performed by driving and controlling the light source driving unit 29 .

[0069] Figure 6 2 is a diagram showing a flowchart of correction processing of pattern data (vector data). However, correction processing combined with light amount adjustment is not performed here.

[0070] The memory 32 stores the partitions B m Furthermore, a correction table is prepared for each exposure head.

[0071] These correction values ​​are obtained by measuring the correction amount. Specifically, vertical, horizontal, and oblique lines are drawn on a measurement substrate, and the line widths of the drawn lines are measured. The correction values ​​are calculated based on the line widths, and the data in the correction table is stored in the memory 32.

[0072] The correction value is obtained as appropriate before shipment, during regular or irregular device maintenance, or in response to a change in the rod or substrate (photosensitive material).

[0073] When performing an exposure operation, the address of the correction table is calculated based on the start and end coordinates of the vector data, and the correction value is read out. Then, the vector data is corrected (S101 to S104).

[0074] The shape of the pattern to be corrected is not limited to a straight line; it can also be an arc-shaped pattern. Furthermore, even for wide shapes such as rectangles, the pattern width can be corrected based on a correction value based on the line width of the linear pattern drawn through the correction amount measurement process. Furthermore, the method can be applied to correct the width of any arbitrary pattern, including polygons or curves. During the correction process, the pattern width can be corrected in both the main scanning direction and the sub-scanning direction. Correction is sufficient so that the pattern width is consistent at least along the sub-scanning direction.

[0075] As described above, the exposure device 10 of this embodiment includes an exposure head 20, which is provided with a DMD 22 and a projection optical system 23. The exposure device 10 divides the scanning band area BR along the sub-scanning direction (Y direction) through which the exposure area EA of the exposure head passes. In addition, the scanning band area BR is obtained for a series of divided areas B according to the pre-shipment and maintenance conditions. m During exposure, the vector data correction circuit 26 corrects the pattern data (vector data) of the line pattern based on the correction value.

Claims

1. An exposure device, characterized in that: The exposure device comprises: An exposure head having a light modulation element array in which light modulation elements are arranged two-dimensionally; a scanning unit that moves a stage carrying a substrate along a main scanning direction so as to relatively move an exposure area of ​​the light modulation element array along a scanning band area; as well as a pattern data correction processing unit that corrects the drawing data of the line pattern formed on the substrate, The pattern data correction processing unit corrects the drawing data so that the line width of the line pattern along the predetermined direction in the scanning band area is made uniform based on the correction value previously assigned to each divided area of ​​the scanning band area along the sub-scanning direction.

2. The exposure device according to claim 1, wherein The pattern data correction processing unit corrects the drawing data so that at least the line width of the vertical line pattern along the main scanning direction and the line width of the horizontal line pattern along the sub-scanning direction are consistent.

3. The exposure device according to claim 2, wherein The pattern data correction processing unit corrects the drawing data so that the line widths of the plurality of vertical line patterns along the main scanning direction that converge on the plurality of divisions are equal to each other.

4. The exposure device according to claim 2, wherein The pattern data correction processing section corrects the drawing data so as to make the line widths of vertical line patterns along the main scanning direction uniform and corrects the drawing data so as to make the line widths of horizontal line patterns along the sub-scanning direction uniform.

5. The exposure device according to claim 1, wherein The exposure device further includes a light quantity adjustment unit that adjusts the light quantity of the entire exposure area with respect to the vertical line pattern along the main scanning direction or the horizontal line pattern along the sub-scanning direction. The light amount adjustment section performs correction for changing the line width along the main scanning direction and the sub-scanning direction for a vertical line pattern along the main scanning direction or a horizontal line pattern along the sub-scanning direction. The pattern data correction processing unit corrects the drawing data so as to make the line width uniform along the sub-scanning direction based on the correction by the light amount adjustment unit.

6. The exposure device according to claim 5, wherein The light amount adjustment section changes the line width of a vertical line pattern along the main scanning direction or a horizontal line pattern along the sub-scanning direction based on mask data that defines the arrangement of unused light modulators.

7. The exposure device according to claim 1, wherein The drawing data is vector data. The pattern data correction processing unit corrects the drawing data by performing at least one of elongation, reduction, rotation, and parallel translation of a vector representing a contour line of the drawing data.

8. An exposure device, characterized in that: The exposure device comprises: An exposure head having a light modulation element array in which light modulation elements are arranged two-dimensionally; a scanning unit that moves a stage carrying a substrate along a main scanning direction so as to relatively move an exposure area of ​​the light modulation element array along a scanning band area; as well as a pattern data correction processing unit that corrects the drawing data of the pattern formed on the substrate, The pattern data correction processing unit corrects the drawing data so that the width of the pattern is uniform within the swath area based on a correction value previously assigned to each divided area defined along the sub-scanning direction of the swath area.

9. The exposure device according to claim 8, wherein The pattern data correction processing unit corrects the drawing data so that at least the width of the pattern in the sub-scanning direction, out of the width of the pattern in the sub-scanning direction and the width of the pattern in the main scanning direction, is consistent with each other.

10. The exposure device according to claim 8, wherein The correction value is calculated based on a line pattern drawn on a measurement substrate.

11. The exposure apparatus according to any one of claims 1 to 10, wherein: The correction value is determined to compensate for a deviation in a pattern forming position caused by a projection optical system provided in the exposure head.

12. An exposure method comprising the following steps: By moving a stage on which a substrate is mounted in a main scanning direction, an exposure area of ​​a light modulator array is relatively moved along a scanning band area, wherein the light modulator array is a two-dimensional array of light modulators; and Correcting drawing data of a linear pattern formed on the substrate, and forming a pattern on the substrate based on the corrected drawing data, It is characterized in that The drawing data is corrected based on a correction value previously assigned to each of the sections defined along the sub-scanning direction of the swath area so that the line widths of the line patterns along the defined direction within the swath area are made uniform.

13. An exposure method comprising the following steps: By moving a stage on which a substrate is mounted in a main scanning direction, an exposure area of ​​a light modulator array is relatively moved along a scanning band area, wherein the light modulator array is a two-dimensional array of light modulators; and Correcting drawing data of a pattern to be formed on the substrate, and forming the pattern on the substrate based on the corrected drawing data, It is characterized in that The drawing data is corrected so that the width of the pattern is made uniform within the swath area based on a correction value previously assigned to each of the divisions defined along the sub-scanning direction of the swath area.

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