Recipe setting device, recipe setting method, and program

Abstract

Provided is a recipe setting device (130) capable of effectively reducing the burden on managing a recipe in a system in which a plurality of modules can be selectively used. The present invention is provided with: a recipe storage unit (131) for storing a reference recipe indicating conditions for substrate processing; an offset storage unit (132) that stores an offset table in association with the reference recipe, the offset table including a plurality of offset values corresponding to each of the plurality of modules; a selection unit (133) that selects one module from among the plurality of modules; an offset value extraction unit (134) that extracts an offset value corresponding to the selected module from among the plurality of offset values; and a recipe generation unit (135) that generates a processing recipe to be executed by the selected one module on the basis of a reference recipe and the extracted offset value.

Description

Technical Field

[0001] The present invention relates to a recipe setting device, a recipe setting method and a program. Background Art

[0002] The coating and developing apparatus described in Japanese Patent Application Laid-Open No. 2023-072178 includes a plurality of processing modules, each of which includes a liquid processing unit and a heat treatment unit. For example, the liquid processing unit rotates a wafer supplied with a processing liquid to form a film of the processing liquid on the wafer.

[0003] The control device for the coating and developing apparatus has the function of adjusting film thickness between modules. The modules here correspond to units that perform specific wafer processing, such as the liquid processing unit and thermal processing unit. In the coating and developing apparatus disclosed in Japanese Patent Application Laid-Open No. 2023-072178, the recipe for processing in each module can be adjusted to minimize differences in film thickness distribution caused by processing in different modules.

[0004] As the number of modules increases, more recipes need to be managed. Each module's recipe includes numerous adjustment items. Even when there's only one item to adjust, it's necessary to open the recipe's item list for all recipes and search for the item to adjust. Performing this task for all recipes places a significant burden on the user and can lead to errors, such as selecting an item that differs from the one to adjust. Summary of the Invention

[0005] The present invention provides a system that can effectively reduce the burden of managing recipes in a system that can selectively use a plurality of modules.

[0006] In an exemplary embodiment, a recipe setting device includes: a recipe storage unit that stores a baseline recipe representing conditions for substrate processing; an offset storage unit that stores an offset table in association with the baseline recipe, wherein the offset table includes a plurality of offset values ​​corresponding to a plurality of modules of a substrate processing device; a selection unit that selects one module from the plurality of modules; an offset value extraction unit that extracts the offset value corresponding to the selected module from the plurality of offset values; and a recipe generation unit that generates a processing recipe to be executed by the selected one module based on the baseline recipe and the extracted offset value.

[0007] According to the present invention, a recipe setting device, a recipe setting method, and a program can be provided, which can effectively reduce the burden of managing recipes in a system that can selectively use a plurality of modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1It is a plan view schematically illustrating the structure of a wafer processing system.

[0009] Figure 2 It is a front view schematically illustrating the structure of a wafer processing system.

[0010] Figure 3 This is a diagram showing an example of a block diagram of a control device.

[0011] Figure 4 This is a diagram showing an example of the module structure of a processing station.

[0012] Figure 5 This is a diagram showing an example of a module serving as a liquid processing unit.

[0013] Figure 6 This is a diagram showing an example of a measurement unit.

[0014] Figure 7 This is a diagram showing an example of the correspondence relationship between each recipe.

[0015] Figure 8 (a) in the middle is a diagram schematically showing the film thickness distribution of the treated film. Figure 8 Middle (b) is a diagram for explaining the suppression of the difference between the average film thickness and the film thickness distribution. Figure 8 (c) in the middle is a diagram for explaining a case where the average value of the film thickness is kept constant and the film thickness distribution is brought close to a target value.

[0016] Figure 9 This is a diagram showing another example of a block diagram of a control device.

[0017] Figure 10 This is a diagram showing an example of the hardware configuration of the control device.

[0018] Figure 11 This is a diagram showing a series of processing flows of a method for controlling the film thickness distribution among a plurality of modules so that the average value of the film thickness of each module reaches a target value.

[0019] Figure 12 This is a diagram showing a series of processing flows for changing the offset value by the manual changing unit.

[0020] Figure 13 This is a diagram showing an example of an offset table list.

[0021] Figure 14 This is a diagram showing an example of an input interface.

[0022] Figure 15 This is a diagram showing an example of the change history.

[0023] Figure 16 This is a diagram showing an example of the second input interface.

[0024] Figure 17 This is a diagram showing a series of processing flows for generating a processing recipe when a substrate processing control unit performs liquid processing.

[0025] Figure 18 This is a diagram showing another example of a block diagram of a control device.

[0026] Figure 19 This is a diagram showing an example of a monitoring interface.

[0027] Figure 20 This is a diagram showing another example of the monitoring interface.

[0028] Figure 21 This is a diagram showing another example of an offset table list.

[0029] Figure 22 This is a diagram showing a series of processing flows of a method for monitoring multiple offset values. DETAILED DESCRIPTION

[0030] Hereinafter, the recipe setting device of this embodiment will be described with reference to the accompanying drawings. In addition, in this specification, the same reference numerals are attached to elements having substantially the same functional configuration, and repeated descriptions are omitted.

[0031] [Wafer processing system]

[0032] First, the configuration of the wafer processing system according to this embodiment will be described. Figure 1 、 Figure 2 The diagrams are a top view and a front view schematically illustrating the configuration of the wafer processing system 1. In this embodiment, the wafer processing system 1 is described as a photolithography processing system that performs resist film formation and development on wafers (substrates) W.

[0033] like Figure 1 As shown, the wafer processing system 1 has a cassette station 2 and a processing station 3. In the cassette station 2, a cassette C containing a plurality of wafers W is brought in / out, and the processing station 3 includes a plurality of various processing devices for performing prescribed processing on the wafers W. The processing station 3 is an example of a substrate processing device. Moreover, the wafer processing system 1 has a structure in which the cassette station 2, the processing station 3 and the interface station 4 are connected as one body. The interface station 4 transfers the wafers W between the exposure device (not shown) adjacent to the side opposite to the processing station 3. In addition, as shown in FIG. Figure 1 As shown, two processing stations 3 are provided between the cassette station 2 and the interface station 4 , but the number may be one or more.

[0034] The cassette station 2 is provided with a plurality of cassette mounting tables 21 and wafer transport devices 22 and 23. The cassette station 2 uses the wafer transport device 22 or 23 to transport wafers W between the cassette C mounted on the mounting table 21 and the processing station 3. To this end, the wafer transport devices 22 and 23 are each equipped with drive mechanisms for the X direction, Y direction, vertical direction, and around the vertical axis (θ direction), as required, and may also be equipped with drive mechanisms for all directions.

[0035] At least one of the wafer conveyor devices 22 and 23 is capable of transferring wafers W to and from the cassette C and to and from the processing station 3. Transferring wafers W to and from the processing station 3, for example, involves transferring wafers W to and from the third block G3, which includes a transfer device accessible to a wafer conveyor device 33 within the processing station 3, described later. The third block G3 may include multiple transfer devices (not shown) arranged in a vertical direction.

[0036] Furthermore, the cassette station 2 may include a testing device (not shown) for testing the wafers W at a position accessible to either of the wafer conveying devices 22 and 23 .

[0037] The processing station 3 is an example of a substrate processing device. The processing station 3 is provided with a plurality of blocks (for example, the first block G1, the second block G2, and the fourth block G4). Figure 2 As shown, a plurality of layers 31 including the first block G1 and the second block G2 are stacked in the vertical direction. Figure 1 The first block G1 is provided on the negative side of the X direction of the processing station 3. Figure 1 A second block G2 is provided on the positive X-direction side of the processing station 3. Figure 1 A fourth block G4 is provided in the portion of the processing station 3 (on the positive Y direction) or connected to another adjacent processing station 3. The fourth block G4 may include multiple transfer devices arranged in a vertical direction. Furthermore, the aforementioned third block G3 may be provided within the processing station 3.

[0038] Multiple processing devices are arranged in the first block G1, such as a patterning film forming apparatus and a development processing apparatus (not shown). Examples of patterning film forming apparatuses include a resist film forming apparatus and an anti-reflective film forming apparatus. For example, multiple processing devices are arranged horizontally. The number, arrangement, and type of these processing devices can be arbitrarily selected.

[0039] These patterning film-forming apparatuses and development processing apparatuses perform operations such as supplying a predetermined processing liquid or supplying a predetermined gas onto the wafer W. In this manner, the patterning film-forming apparatus forms a resist film, an anti-reflection film, and the like. The resist film serves as a mask for forming the pattern of the underlying film, and the anti-reflection film is used to efficiently perform light irradiation processes, such as exposure. Meanwhile, the development processing apparatus removes a portion of the exposed resist film to form the concave-convex pattern serving as the mask.

[0040] For example, in the second block G2, heat treatment devices (not shown) for performing heat treatments such as heating or cooling of the wafer W are arranged in the vertical direction and the horizontal direction. Figure 2 A hydrophobizing device for performing hydrophobic treatment to improve the adhesion between the resist liquid and the wafer W and a periphery exposure device for exposing the outer periphery of the wafer W are arranged in parallel in the Z direction and the horizontal direction. The number and arrangement of these heat treatment devices, hydrophobizing devices, and periphery exposure devices can also be arbitrarily selected.

[0041] like Figure 1 As shown in FIG. 1 , a wafer conveying area 32 is formed in an area between the first block G1 and the second block G2 in a plan view. In the wafer conveying area 32 , for example, a wafer conveying device 33 is disposed.

[0042] The wafer conveying device 33 has a conveying arm that can move in the X direction, the Y direction, the θ direction, and the vertical direction. The wafer conveying device 33 can move within the wafer conveying area 32 and convey the wafer W to the predetermined devices in the surrounding first block G1, second block G2, third block G3, and fourth block G4. Figure 1 As shown, when there are multiple processing stations 3, the wafer conveying device 33 arranged in the processing station 3 located on the side of the interface station 4 can not only convey the wafer W to the first block G1, the second block G2, and the fourth block G4, but also can convey it to the specified device in the fifth block G5 described later.

[0043] For example, a plurality of wafer conveying devices 33 are arranged vertically. One wafer conveying device 33 can convey the wafer W to a plurality of layers 31 stacked vertically (see Figure 2 ) at the height of the upper multiple layers 31. Wafers W can be transported by another wafer transport device 33 to the predetermined devices at the height of the multiple layers 31 below these layers 31. Multiple wafer transport areas 32 are provided to enable such transport of wafers W. The number of wafer transport devices 33 and the number of layers 31 corresponding to one wafer transport device 33 can be arbitrarily selected; for example, a wafer transport device 33 can be provided for each layer 31.

[0044] Furthermore, the wafer transfer area 32 or the first block G1 or the second block G2 may include a shuttle transport device (not shown) that linearly transports wafers W between a space adjacent to one side of the processing station 3 and another space adjacent to the opposite side.

[0045] The interface station 4 is equipped with a fifth block G5 equipped with multiple transfer devices and wafer conveyor devices 41 and 42. The interface station 4 uses the wafer conveyor device 41 or 42 to transport wafers W between the fifth block G5, where the wafer conveyor device 33 can transfer wafers W, and the exposure system. To this end, the wafer conveyor devices 41 and 42 each include drive mechanisms for the X and Y directions, the vertical direction, and around the vertical axis (θ direction), as needed. Alternatively, they may include drive mechanisms for all directions. At least one of the wafer conveyor devices 41 and 42 can support wafers W and transport them between the transfer device and the exposure system within the fifth block G5.

[0046] A cleaning device for cleaning the surface of the wafer W and the aforementioned edge exposure device may be provided in the interface station 4 at a position accessible to either of the wafer conveying devices 41 and 42 .

[0047] As described above, the test device can be set in the cassette station 2, but can also be set in any of the transport arms ( Figure 1 or Figure 2 33, 41, 42) in the accessible position.

[0048] The wafer processing system 1 is provided with a control device 100. The control device 100 is, for example, a computer and includes a program storage unit (not shown). The program storage unit stores programs for controlling the processing of wafers W in the wafer processing system 1. Furthermore, the program storage unit also stores programs for controlling the operation of the various processing devices, conveyor devices, and other drive systems described above to implement wafer processing in the wafer processing system 1. The programs are recorded on a computer-readable storage medium and can be installed from this storage medium into the control device 100.

[0049] [Operation of the wafer processing system]

[0050] The wafer processing system 1 is configured as described above. Next, an example of wafer processing performed using the wafer processing system 1 having the above configuration will be described.

[0051] First, a cassette C containing multiple wafers W is brought into the cassette station 2 of the wafer processing system 1 and placed on the cassette loading table 21. Next, the wafers W in the cassette C are sequentially removed by the wafer transport device 22 or 23 and transported to the transfer device in the third block G3.

[0052] The wafer W transported to the transfer device of the third block G3 is supported by the wafer transport device 33 and transported to the hydrophobic treatment device set in the second block G2 for hydrophobic treatment. Then, it is transported by the wafer transport device 33 to the resist film forming device. After the resist film is formed on the wafer W, the wafer W is transported to the heat treatment device for pre-baking treatment, and then transported to the transfer device of the fifth block G5. In addition, in the case of Figure 1 、 Figure 2 In the case where there are multiple processing stations 3, wafers W are first placed at the transfer device in the fourth block G4 before being transferred to the transfer device in the fifth block G5. They are then transferred between the multiple wafer conveyor devices 33. Furthermore, wafers W can be transferred from the wafer conveyor device 33 to the peripheral exposure device as needed to perform exposure processing on the peripheral edge of the wafer W.

[0053] The wafer W transferred to the transfer device of the fifth block G5 is transferred to the exposure device by the wafer transfer devices 41 and 42 and subjected to exposure processing in a predetermined pattern. In addition, the wafer W may be cleaned by a cleaning device before the exposure processing.

[0054] The wafer W after exposure is transported to the transfer device of the fifth block G5 by the wafer transport devices 41 and 42. Thereafter, the wafer W is transported to the thermal treatment device by the wafer transport device 33 for post-exposure baking.

[0055] The wafer W that has undergone the post-exposure baking process is transported by the wafer transport device 33 to the developing device for development. After the development is completed, the wafer W is transported by the wafer transport device 33 to the thermal processing device 40 for post-bake processing.

[0056] Afterwards, the wafer W is transported by the wafer transport device 33 to the transfer device of the third block G3 and then transported by the wafer transport device 22 or 23 of the cassette station 2 to a predetermined cassette C on the cassette stage 21. Thus, a series of photolithography processes are completed.

[0057] Furthermore, the wafer processing system of the present invention is not limited to the structure and operation described above. For example, the above embodiment describes a case where wafers W are transferred between the interface station 4 and the exposure apparatus. However, it is also possible that the interface station 4 is not directly connected to the exposure apparatus. In this case, for example, after wafers W are transferred from the cassette station 2 to the processing station 3 for necessary processing, they are then transferred back to the cassette station 2 for external transport. Furthermore, among the devices listed as processing devices, unnecessary devices may not be installed, or the processing in those devices may not be performed.

[0058] The specific structure of the substrate processing apparatus is not limited to the processing station 3. The substrate processing apparatus may have any structure as long as it includes a processing apparatus for performing a photolithography process on a wafer W and a control unit 10 capable of controlling the processing apparatus.

[0059] [Overview of the recipe setting device]

[0060] The processing station 3 has a plurality of modules. For example, as a plurality of modules, the processing station 3 includes a plurality of liquid processing modules (such as the aforementioned "resist film forming device") for performing liquid processing in the first block G1. As a plurality of modules, the processing station 3 may also include a plurality of heat treatment modules (such as the aforementioned "heat treatment device") for performing heat processing in the second block G2. The substrate processing in each module is performed according to a pre-set processing recipe. Here, if the number of modules increases, more processing recipes need to be managed accordingly. The processing recipe of each module includes a large number of adjustment items. Editing each processing recipe will bring a large burden to the user, and may also lead to errors such as selecting an item different from the item to be adjusted.

[0061] Therefore, if Figure 3 As shown, the control device 100 includes a recipe setting device 130. The recipe setting device 130 is used to set and change the processing recipe to be executed in each module. The recipe setting device 130 stores a baseline recipe that represents the conditions for substrate processing. Furthermore, the recipe setting device 130 stores an offset table including multiple offset values ​​corresponding to multiple modules in association with the baseline recipe. The recipe setting device 130 extracts the offset value corresponding to the selected module from the multiple offset values ​​and generates a processing recipe to be executed by the selected module based on the baseline recipe and the extracted offset values. According to the recipe setting device 130, for items in the baseline recipe that need to be adjusted for each module, the multiple offset values ​​corresponding to the multiple modules are summarized in the offset table. The offset value is extracted for each module, and the processing recipe is generated based on the extracted offset value and the baseline recipe. As a result, the processing recipe for each module can be essentially managed through the simple operation of centrally editing the offset table without having to open each recipe and search for the items.

[0062] The above-described configuration can be applied to various stages of substrate processing, but is described as an example in which it is applied to a film forming process (eg, a resist film forming process) performed by a plurality of liquid processing modules.

[0063] [Module structure]

[0064] Figure 4 : is a diagram showing an example of the arrangement of a plurality of liquid processing modules in the processing station 3. Figure 4In the example shown, processing station 3 has two distinct first blocks G11 and G12. The first first block G11 includes four modules: modules 111 through 114. The second first block G12 includes four modules: modules 121 through 124. The following description will illustrate a case where the multiple modules consist of modules 111 through 124.

[0065] Each of the plurality of modules 111 to 124 can be connected to any one of more than one supply source of a processing medium. The processing medium is a medium temporarily supplied to the wafer W to promote processing. The processing medium is, for example, a processing liquid, but can also be a processing gas. Figure 4 In the example, each of the multiple modules 111 to 124 is connected to one of four supply sources (or multiple supply sources). For example, modules 111 and 112 are connected to a common supply source 62A, which supplies treatment liquid to modules 111 and 112. Modules 113 and 114 are connected to a common supply source 62B, which supplies treatment liquid to modules 113 and 114. Modules 121 and 122 are connected to a common supply source 62C, which supplies treatment liquid to modules 121 and 122. Modules 123 and 124 are connected to a common supply source 62D, which supplies treatment liquid to modules 123 and 124.

[0066] [Liquid processing module]

[0067] Next, a configuration example of a liquid processing module will be described. Modules 111 to 124 have a common configuration, so the configuration of module 111 will be described as a representative example. Figure 5 This is a diagram showing an example of the structure of the module 111. Figure 5 It shows the state where the processing film AF is formed on the wafer W. Figure 5 As shown, module 111 includes a nozzle 111a, a nozzle driver 111b, a holder 111c, a shaft 111d, and a rotation driver 111e. Nozzle 111a is connected to pump 63 and supply source 62A via an on-off valve 64. Similar to supply source 62A, pump 63 and on-off valve 64 can be shared by multiple modules. For example, modules 111 and 112 can be connected to a common pump 63 and on-off valve 64.

[0068] The holding portion 111 c (supporting portion) supports the wafer W. For example, the holding portion 111 c supports the center portion of the wafer W, which is horizontally arranged with the surface Wa facing upward, and holds the wafer W through vacuum suction or other means. The upper surface of the holding portion 111 c (the surface supporting the wafer W) can be circular when viewed from above, with a radius of approximately 1 / 6 to 1 / 2 the radius of the wafer W. A rotational drive unit 111 e is connected to the lower portion of the holding portion 111 c via a shaft 111 d.

[0069] The rotation drive unit 111e is an actuator including a power source such as an electric motor, and rotates the holding unit 111c about a vertical axis Ax. The rotation drive unit 111e rotates the holding unit 111c, thereby rotating the wafer W held (supported) by the holding unit 111c. The holding unit 111c can hold the wafer W so that its center is substantially aligned with the axis Ax.

[0070] The nozzle 111a discharges the processing liquid onto the surface Wa of the wafer W held by the holding portion 111c. For example, the nozzle 111a is positioned above the wafer W (vertically above the center of the wafer W) and discharges the processing liquid downward. The processing liquid is, for example, a solution (resist) used to form a resist film. The supply source 62A supplies the processing liquid to the nozzle 111a. In addition, a pump 63 for adjusting the supply amount of the processing liquid may be provided between the supply source 62A and the nozzle 111a. The pump 63 pressurizes the processing liquid in the flow path, allowing the processing liquid to be discharged from the nozzle 111a.

[0071] An on-off valve 64 is provided on the supply path between the nozzle 111a and the supply source 62A. The on-off valve 64 switches the supply path between open and closed. The nozzle driver 111b moves the nozzle 111a between a discharge position above the wafer W and a retracted position away from the discharge position. The discharge position is, for example, a position vertically above the rotation center of the wafer W (a position on the axis Ax). The standby position is, for example, set outside the periphery of the wafer W.

[0072] [Measurement Module]

[0073] The processing station 3 may further include a measuring unit for obtaining information on the film thickness of each film formed by each of the modules 111 to 124. The measuring unit may be provided as a plurality of measuring units corresponding to the modules 111 to 124, or as a single measuring unit shared by the modules 111 to 124. Figure 6 This is a diagram showing an example of a measurement unit.

[0074] like Figure 6 As shown, the measuring unit 70 functions as a measuring unit for performing measurements related to film thickness measurement. Specifically, the measuring unit 70 includes a housing 71, a measuring holding portion 72, a linear drive portion 73, and a spectrophotometric measurement portion 74. The measuring holding portion 72 can be configured so that the portion on which the wafer W is mounted can rotate relative to the housing 71. The axis of rotation in this case can be the center portion of the wafer W held by the measuring holding portion 72. In this case, the wafer W can be rotated by rotating the upper portion of the measuring holding portion 72. Furthermore, the linear drive portion 73 uses, for example, an electric motor as a power source to move the measuring holding portion 72 along a horizontal linear path.

[0075] The spectrometer 74 has the function of receiving light from the wafer W and performing spectroscopic analysis to obtain a spectroscopic spectrum. The spectrometer 74 includes: an incident portion 75 for receiving light from the wafer W; a waveguide 76 for guiding the light incident on the incident portion 75; a spectrometer 77 for performing spectroscopic analysis on the light guided by the waveguide 76 to obtain a spectroscopic spectrum; and a light source 78. The incident portion 75 is configured so that when the wafer W held by the measurement holder 72 moves as the linear drive 73 drives it, light from the center of the wafer W can be incident thereon. In other words, the incident portion 75 is arranged at a position corresponding to the movement path of the center of the measurement holder 72 driven by the linear drive 73. Furthermore, the incident portion 75 is installed so that when the wafer W moves due to the movement of the measurement holder 72, the incident portion 75 moves relative to the surface of the wafer W in the radial direction of the wafer W. Thus, spectrometer 74 can obtain a spectral spectrum at various positions along the radial direction of wafer W, including the center of wafer W. Waveguide 76 is composed of, for example, an optical fiber. Spectrometer 77 splits the incident light to obtain a spectral spectrum containing intensity information corresponding to each wavelength. Light source 78 irradiates illumination light downward. Thus, light reflected from wafer W is incident on spectrometer 77 via incident portion 75 and waveguide 76.

[0076] The spectroscopic spectrum data obtained by the spectrometer 77 is sent to the control device 100. In the control device 100, the film thickness of the film on the surface of the wafer W can be estimated based on the spectroscopic spectrum data, and the estimation result is stored in the control device 100 as a test result. As a method for estimating the film thickness of the film on the surface of the wafer W based on the spectroscopic spectrum data, for example, a method of pre-generating a model for estimating the relationship between the film thickness of the film on the surface of the wafer W and the spectroscopic spectrum data can be cited. In this case, the film thickness can be estimated by applying the above-mentioned model to the spectroscopic spectrum data obtained from the wafer W as the object of film thickness estimation. However, the method for estimating the film thickness of the film on the surface of the wafer W is not limited to the above-mentioned method.

[0077] [Control device]

[0078] The control device 100 controls the plurality of modules 111 to 124 to supply a processing liquid to form a film on the surface of the wafer W. The control device 100 may control a measurement unit to obtain information on the film thickness of the film formed by the modules 111 to 124 .

[0079] The control device 100 constitutes at least a portion of the recipe setting device 130. For example, the control device 100 is configured to execute the following steps: storing a base recipe, storing an offset table including a plurality of offset values ​​in association with the base recipe, selecting one module from the plurality of modules 111 to 124, extracting an offset value corresponding to the selected module from the plurality of offset values, and generating a processing recipe to be executed by the selected module based on the base recipe and the extracted offset value.

[0080] Refer again Figure 3 . Figure 3 is a block diagram showing the functional structure of the control device 100. Figure 3 As shown, the control device 100 includes, for example, a substrate processing control unit 110 and a film thickness calculation unit 120 as functional components (hereinafter referred to as "functional modules"). Furthermore, as components of a recipe setting device 130, the control device 100 includes a recipe storage unit 131, an offset storage unit 132, a selection unit 133, an offset value extraction unit 134, and a recipe generation unit 135. The processing executed by these functional modules corresponds to the processing executed by the recipe setting device 130 and also corresponds to the processing executed by the control device 100.

[0081] The substrate processing control unit 110 controls the plurality of modules 111 to 124 to supply a processing liquid to form a film on the surface of the wafer W. For example, the substrate processing control unit 110 controls the modules 111 to 124 to perform a liquid process on the wafer W according to a processing recipe generated by the recipe setting device 130 , thereby forming a predetermined film on the surface of the wafer W by supplying the processing liquid.

[0082] The film thickness calculation unit 120 estimates the thickness of the process film based on the measurement results of the measurement unit. For example, the film thickness calculation unit 120 stores a pre-generated film thickness model that represents the relationship between the spectral spectrum and film thickness. The film thickness calculation unit 120 estimates the film thickness based on the spectral spectrum data obtained by the spectrophotometry unit 80 and the film thickness model. The film thickness calculation method used by the film thickness calculation unit 120 can be modified appropriately depending on the configuration of the measurement unit.

[0083] The recipe storage unit 131 stores a reference recipe representing substrate processing conditions. The reference recipe includes parameter setting values ​​for one or more control parameters related to substrate processing. The recipe storage unit 131 stores the reference recipe in association with the modules. For example, the recipe storage unit 131 stores a reference recipe RP1 (see FIG. 1 ) for causing each of the modules 111 to 124 to form the above-mentioned predetermined film. Figure 7 ). As an example, the reference recipe RP1 includes a "discharge rotation speed" and a "drying rotation speed". The discharge rotation speed (first set value) is a control parameter indicating the rotation speed of the wafer W when discharging the processing liquid onto the wafer W (for example, the number of rotations per minute). The drying rotation speed (second set value) is a control parameter indicating the rotation speed of the wafer W when drying the liquid film formed on the wafer W by supplying the processing liquid. The discharge rotation speed and the drying rotation speed affect the average film thickness and film thickness distribution within the surface of the wafer W.

[0084] The offset storage unit 132 stores an offset table in association with a reference recipe. The offset table includes offset values ​​corresponding to a plurality of modules. The offset value represents, for example, an offset amount (eg, a difference) relative to a parameter setting value of a control parameter in the reference recipe RP1.

[0085] For example, Figure 7 As shown, the offset storage unit 132 stores the offset table OT1 in association with the reference recipe RP1. The offset table OT1 includes a plurality of offset values ​​corresponding to the plurality of modules 111 to 124. For example, the offset table OT1 associates the identification information of the plurality of modules 111 to 124 with the plurality of offset values. In the offset table OT1, the offset value of the speed during discharge and the offset value of the speed during drying are included corresponding to each of the plurality of modules 111 to 124. For example, Figure 7 In the example, for the drying speed parameter setting of 1379, the offset value corresponding to module 111 is +11, and the offset value corresponding to module 121 is +1. "+" indicates addition to the parameter setting, and "-" indicates subtraction from the parameter setting. The drying speed for module 111 is 1390, which is obtained by adding 11 to 1379. Similarly, the drying speed for module 121 is 1380.

[0086] Back to Figure 3 The selection unit 133 selects one module from the plurality of modules 111 to 124. The selection unit 133 may select one module based on user input, or according to a pre-set processing plan.

[0087] The offset value extraction unit 134 extracts the offset value corresponding to the module selected by the selection unit 133 from the plurality of offset values. For example, the offset value extraction unit 134 extracts the offset value associated with the identification information of the module selected by the selection unit 133 from the offset table OT1. For example, if the selection unit 133 selects module 111, the offset value extraction unit 134 extracts "+11" as the offset value for the drying rotation speed.

[0088] The recipe generator 135 generates a process recipe for the selected module based on the baseline recipe RP1 and the extracted offset value. The recipe generator 135 adds the extracted offset value to the parameter settings of the control parameters in the baseline recipe RP1 and uses the resulting value as the parameter settings for the process recipe. For example, the offset value corresponding to module 111 + 11 is added to the parameter setting 1379 for the drying speed in the baseline recipe RP1, resulting in 1390. The recipe generator 135 generates a process recipe that includes this value as the drying speed. The generated process recipe is output to the substrate processing control unit 110. The substrate processing control unit 110 performs liquid processing on the wafer W according to the process recipe.

[0089] The control device 100 may further include an offset editing unit 136. The offset editing unit 136 is configured to edit the offset table stored in the offset storage unit 132. For example, the offset editing unit 136 can change the offset value of each module in the offset table.

[0090] The offset editing unit 136 can change two or more offset values ​​in the offset table by the same amount. For example, the offset editing unit 136 can change two or more offset values ​​belonging to the same group by the same amount based on a constraint. Constraints are, for example, pre-set conditions that divide the multiple offset values ​​in the offset table OT1 into one or more groups. Here, since the offset values ​​in the constrained groups are changed by the same amount, the constraints can also be referred to as conditions that constrain (limit) the amount of change in the offset values.

[0091] The offset editing unit 136 can select a constraint condition from a plurality of preset default constraint conditions, and based on the selected constraint condition, change two or more offset values ​​belonging to the same group with the same change amount. For example, the control device 100 can also include a condition storage unit 138. The condition storage unit 138 stores a plurality of default constraint conditions. The offset editing unit 136 selects a constraint condition from the plurality of default constraint conditions stored in the condition storage unit 138. Among the plurality of default constraint conditions, the number of groups is different for each default constraint condition. Figure 7 An example of a predetermined constraint condition is described below. The plurality of predetermined constraint conditions includes a first condition C1, a second condition C2, a third condition C3, and a fourth condition C4. As the first condition C1, the second condition C2, the third condition C3, and the fourth condition C4 are ranked, the degree of constraint increases and the number of groups decreases.

[0092] The first condition C1 is a condition for grouping the plurality of modules 111 to 124 into separate groups. That is, when the first condition C1 is selected as the constraint condition, the offset value is changed individually for each module.

[0093] The second condition C2 is a condition for grouping two or more modules connected to the common supply source 62 among the plurality of modules 111 to 124 into the same group. Figure 4In the example, modules 111 and 112 are connected to a common supply source 62A, and modules 113 and 114 are connected to a common supply source 62B. Modules 121 and 122 are connected to a common supply source 62C, and modules 123 and 124 are connected to a common supply source 62D. In this case, when the second condition C2 is selected as the constraint condition, modules 111 and 112 are grouped together, and modules 113 and 114 are grouped together. Modules 121 and 122 are grouped together, and modules 123 and 124 are grouped together. For example, multiple modules 111 to 124 are divided into the following four groups.

[0094] Group 2-1: Modules 111 and 112

[0095] Group 2-2: Modules 113 and 114

[0096] Group 2-3: Modules 121 and 122

[0097] Groups 2-4: Modules 123, 124

[0098] The third condition C3 is a condition for grouping two or more modules located in the same block of the processing station 3 among the plurality of modules 111 to 124 into the same group. Figure 4 In the example, the modules 111 to 114 included in the first block G11 are grouped together, and the modules 121 to 124 included in the first block G12 are grouped together. For example, the modules 111 to 124 are divided into the following two groups.

[0099] Group 3-1: Modules 111-114

[0100] Group 3-2: Modules 121-124

[0101] The fourth condition C4 is a condition for grouping all the modules 111 to 124 into the same group. Figure 7 In the example, modules 111 to 124 all form the same group.

[0102] The offset editing unit 136 may further include an offset modification unit 137. The offset modification unit 137 causes each of the multiple modules 111 to 124 to execute processing based on a process recipe and modifies the offset table based on the multiple processing results and constraints of the multiple modules 111 to 124. For example, the offset modification unit 137 causes the selection unit 133 to sequentially select the multiple modules 111 to 124. Based on the module selection by the selection unit 133, the offset value extraction unit 134 extracts offset values ​​and the recipe generation unit 135 generates a process recipe, which is then output to the substrate processing control unit 110. Thus, processing based on the process recipe is executed, and the film thickness calculation unit 120 estimates the film thickness as an example of the processing result.

[0103] The offset changing unit 137 obtains the estimated film thicknesses as the processing results of the modules 111 to 124 and changes the offset table OT1 based on the processing results and constraints of the modules 111 to 124. The offset changing unit 137 can repeatedly perform the following steps: causing the modules 111 to 124 to execute processing individually while changing the constraints to reduce the number of groups; and changing the offset table OT1.

[0104] For example, the offset change unit 137 can change the offset table OT1 in a manner that reduces the difference between the multiple processing results under the constraint condition (for example, the first condition C1) that the multiple modules 111~124 are each classified into a separate group, and can change the offset table OT1 in a manner that makes the average of the multiple processing results close to the target under the constraint condition (for example, the fourth condition C4) that all the multiple modules 111~124 are classified into the same group.

[0105] Here, refer to Figure 8 , and illustrates the changes in offset values ​​in three modules among the multiple modules 111 to 124. Figure 8 (a) shows the relationship between the film thickness distributions FD1 to FD3 on wafers W processed by different modules and the target value FD0. The trends of the film thickness distributions FD1 to FD3 differ from each other. Therefore, simply changing the offset value to bring the average film thickness on each wafer W closer to the target value FD0 may result in residual differences in the film thickness distribution trends.

[0106] In this case, if Figure 8 As shown in (b), the offset change unit 137 first suppresses the difference in film thickness distribution between the multiple modules 111~124. For example, under the above-mentioned first condition C1, the offset values ​​of the multiple modules 111~124 are individually changed so that the film thickness distribution FD1~FD3 becomes the same film thickness average value and in-plane trend. Here, the in-plane trend can be, for example, the in-plane flatness of the film thickness distribution FD1~FD3, or it can be the surface roughness. Then, under the above-mentioned fourth condition C4, the offset values ​​of the multiple modules 111~124 are changed by the same amount so that the average value of the film thickness of each wafer W becomes the target value FD0 and becomes the target in-plane trend. The target in-plane trend can be pre-stored in the condition storage unit 138, for example, or it can be set by the user. Thus, as Figure 8 As shown in (c), while the film thickness distributions FD1 to FD3 maintain the same trend, the average film thickness of each wafer W approaches the target value FD0, and the in-plane trends of the film thickness distributions FD1 to FD3 reach the target in-plane trends.

[0107] The offset changing unit 137 can change the constraint conditions from the first condition C1, through the second condition C2, and the third condition C3, to the fourth condition C4. For example, under the first condition C1, the offset changing unit 137 can change the offset table OT1 to reduce the differences between the multiple processing results, and then change the first condition C1 to the second condition C2. Under the second condition C2, the offset changing unit 137 can change the offset table OT1 to reduce the differences between groups 2-1 to 2-4, and then change the second condition C2 to the third condition C3. Under the third condition C3, the offset changing unit 137 can change the offset table OT1 to reduce the differences between groups 3-1 to 3-2, and then change the third condition C3 to the fourth condition C4. Under the fourth condition C4, the offset changing unit 137 can change the offset table OT1 to bring the average and in-plane trend of the multiple processing results closer to the target.

[0108] like Figure 7 As shown, the recipe storage unit 131 can also store a supply source recipe RP2 in association with multiple supply sources 62A~62D. The supply source recipe RP2 includes the supply stop time of the processing liquid (third set value) and the discharge pressure of the processing liquid (fourth set value). The recipe storage unit 131 can store the supply source recipe RP2 separately for each of the multiple supply sources 62A~62D. That is, the recipe storage unit 131 can store multiple supply source recipes RP2 corresponding to each of the multiple supply sources 62A~62D. The supply stop time of the processing liquid is, for example, the time when the on-off valve 64 is switched from the state of supplying the processing liquid to the wafer W to the closed state. By switching the on-off valve 64 to the closed state, the supply of the processing liquid from the nozzle is stopped. Both the third set value and the fourth set value will affect the film thickness distribution within the surface of the wafer W.

[0109] like Figure 9 As shown, the offset editing unit 136 may further include a manual change unit 139. The manual change unit 139 changes the offset table OT1 based on the user's input. The manual change unit 139 can be used, for example, when the user wants to change the processing recipe by manual operation due to changes in the external environment. The manual change unit 139 can generate an input interface that displays a list of multiple offset values ​​associated with multiple modules. The input interface is displayed, for example, by a display unit provided on the control device 100. In this case, the user selects a record of the module to be adjusted from the list of offset values ​​displayed on the input interface, and changes the offset value on the input interface. The manual change unit 139 can also change the offset table OT1 in response to the multiple offset values ​​being changed on the input interface.

[0110] The recipe setting device 130 also includes a history display unit 140 and a rollback unit 141. The history display unit 140 displays the history of changes made to the offset table OT1 by the manual change unit 139 on an input interface. The change history, for example, includes a chronological list of multiple change records. Each change record includes the date and time of the change, the module to be changed, the parameter to be changed, the correction value used in the change, the offset value before correction, and the offset value after correction.

[0111] The rollback unit 141 is used to restore the offset table OT1 to the past state selected in the change history. For example, when the user selects any change record from the change history, the rollback unit 141 changes the change target parameter of the target module of the change record to the offset value included in the change record.

[0112] The manual change unit 139 can be configured to associate a single offset table with multiple reference recipes. For example, the manual change unit 139 can generate a second input interface that displays the offset table OT1 in association with the recipe list including the reference recipe RP1. The second input interface is displayed, for example, by a display unit. In response to the addition of another reference recipe to the recipe list on the second input interface, the manual change unit 139 associates the other reference recipe with the offset table OT1. The offset table OT1 generated for one reference recipe can also be applied to other reference recipes. This reduces the workload associated with generating the offset table OT1.

[0113] In response to the selection of the offset table OT1, the manual change unit 139 can generate a candidate list including one or more base recipes that can be added to the recipe list. Furthermore, the manual change unit 139 can add the selected base recipe from the candidate list to the recipe list as another base recipe. For example, the user can select a new base recipe from the candidate list on the second input interface to be added to the recipe list as the other base recipe.

[0114] An example of a situation where the offset table OT1 for one benchmark recipe can be used with other benchmark recipes is when both the benchmark recipe and the other benchmark recipes target the same module and include the same control parameters. In particular, if the values ​​of the "same control parameters" in the benchmark recipe and the other benchmark recipes are identical or similar, there is a high probability that the offset table OT1 can be used. Therefore, the manual change unit 139 can generate a candidate list that includes one or more benchmark recipes whose parameter settings (item values) for control parameters corresponding to multiple offset values ​​are common with the benchmark recipe RP1. In other words, the manual change unit 139 can add one or more benchmark recipes to the candidate list that include parameter settings that are common with any control parameter setting included in the benchmark recipe RP1. For example, if the parameter setting for the drying speed of the benchmark recipe RP1 is common (e.g., identical) with the parameter setting for the drying speed of one or more benchmark recipes, the manual change unit 139 will include the one or more benchmark recipes in the candidate list. In this case, in one or more reference recipes, the parameter setting values ​​of the control parameters other than the rotation speed during drying may be different from those in the reference recipe RP1.

[0115] The control device 100 is composed of one or more control computers. Figure 10 FIG. 1 is a diagram showing an example of the hardware configuration of the control device 100. For example, the control device 100 has Figure 10 Circuit 150 is shown. Circuit 150 includes one or more processors 151, memory 152, storage 153, and input / output ports 154. Memory 153 comprises, for example, a computer-readable storage medium such as a hard disk. The storage medium stores a program for causing control device 100 to execute the substrate processing method and film thickness estimation method described below. The storage medium may be a removable medium such as a nonvolatile semiconductor memory, a magnetic disk, or an optical disk.

[0116] Memory 152 temporarily stores programs loaded from the storage medium of storage 153 and calculation results of processor 151. Processor 151 and memory 152 cooperate to execute the above-mentioned programs, thereby forming the above-mentioned functional modules. Input / output port 154 performs input and output of electrical signals between various components of processing station 3 according to instructions from processor 151.

[0117] The control device 100 may be comprised of multiple control computers. For example, the substrate processing control unit 110 and the film thickness calculation unit 120 may be comprised of one or more control computers, while the recipe setting device 130 may be comprised of another computer capable of communicating with the one or more control computers. Furthermore, the hardware structure of the control device 100 is not necessarily limited to programs constituting each functional module. For example, each functional module of the control device 100 may be comprised of dedicated logic circuits or an ASIC (Application Specific Integrated Circuit) formed by integrating these circuits.

[0118] [Recipe Setting Process]

[0119] Next, as an example of a recipe setting method, a recipe setting process of recipe setting device 130 is illustrated. This recipe setting process includes the following steps: storing a base recipe; storing an offset table associated with the base recipe, wherein the offset table includes multiple offset values ​​corresponding to multiple modules; selecting one module from the multiple modules; extracting the offset value corresponding to the selected module from the multiple offset values; and generating a process recipe to be executed by the selected module based on the base recipe and the extracted offset value. The recipe setting process illustrated below includes an automatic offset table editing process, a manual offset table editing process, and a process recipe generation process. Each process is described in detail below.

[0120] (Automatic editing process of offset table)

[0121] This process is executed in a state where the offset table is stored in the offset storage unit 132. The offset table stored in the offset storage unit 132 may be an initial table in which a plurality of offset values ​​are each an initial value (eg, zero).

[0122] like Figure 11 As shown, the recipe setting device 130 first executes step S11. In step S11, the offset changer 137 calculates the offset sensitivity. The offset sensitivity is information indicating the relationship between each offset value and the film thickness in one of the multiple modules 111 to 124. By obtaining the offset sensitivity in advance, it is possible to accurately estimate the amount by which each offset value should be changed to change the film thickness distribution.

[0123] To understand the relationship between each offset value and film thickness distribution, experimental data is required to understand how film thickness changes when the offset value is varied in one of the multiple modules 111-124. Therefore, the experimental conditions required to calculate the sensitivity of each offset value must first be selected. Specifically, appropriate experimental conditions can be selected using known experimental planning methods, and an experimental condition table can be prepared.

[0124] The offset changer 137 sequentially changes the offset value based on the prepared experimental condition table. Each time the offset value is changed, the offset changer 137 causes the selector 133 to select one of the aforementioned modules. Based on the module selected by the selector 133, the offset value extractor 134 extracts the offset value and the recipe generator 135 generates a process recipe, which is then output to the substrate processing control unit 110. Consequently, processing based on the process recipe is executed, and the film thickness calculator 120 estimates the film thickness distribution as an example of the processing result. Based on the experimental plan obtained in this manner and the film thickness distribution measurement results (experimental results), the offset changer 137 obtains an offset sensitivity indicating how each offset value affects the film thickness distribution of the processed film.

[0125] The feature quantity representing the film thickness distribution is obtained from the measurement result of the film thickness distribution. As an example, the feature quantity representing the film thickness distribution can be fitted using a Zernike polynomial, and the coefficient of each component can be used as the feature quantity.

[0126] The offset changing unit 137 calculates the relationship between the characteristic value obtained from the measurement results of the film thickness distribution after fitting with the Zernike polynomials and each offset value. For example, the offset changing unit 137 obtains information such as how much the weighting coefficients included in the Zernike polynomials change, and how much the film thickness distribution changes as a result of changing each offset value by a specific amount. This result can be used as the offset sensitivity.

[0127] Next, the recipe setting device 130 executes step S12. In step S12, the offset change unit 137 obtains the film thickness distribution of the wafer W after being processed by each of the multiple modules 111 to 124. For example, after the offset change unit 137 sets the offset value of each of the multiple modules 111 to 124 to zero, it causes the selection unit 133 to select the multiple modules 111 to 124 in sequence. Based on the selection of the module by the selection unit 133, the offset value extraction unit 134 performs offset value extraction and the recipe generation unit 135 generates a processing recipe, and the processing recipe is output to the substrate processing control unit 110. Thus, processing based on the processing recipe is performed, and the film thickness calculation unit 120 calculates the film thickness distribution as an example of the processing result. The offset change unit 137 obtains the calculation result of the film thickness calculation unit 120 as the film thickness distribution of the wafer W after being processed by each of the multiple modules 111 to 124.

[0128] In step S13, the offset changing unit 137 calculates a correction value (offset correction value) for reducing the difference in film thickness distribution (hereinafter referred to as "film thickness difference") between the plurality of modules 111 to 124 based on the film thickness distribution obtained in step S12 and the offset sensitivity calculated in step S11. For example, the offset changing unit 137 calculates the correction value for each module based on the first condition C1 described above. For example, the offset changing unit 137 sets the correction value for correcting the bias in the film thickness distribution as a quantitative Class I problem and solves the problem using a known method to calculate the correction value for each module.

[0129] In step S14, the offset changing unit 137 changes the offset value of each module in the offset table OT1 stored in the offset storage unit 132 based on the correction value calculated in step S13. For example, the offset changing unit 137 adds the correction value to the offset value of each module.

[0130] In step S15 , similar to step S12 , the offset changing unit 137 obtains the film thickness distribution of the wafer W processed by each of the plurality of modules 111 to 124 .

[0131] In step S16, the offset changing unit 137 determines whether the obtained film thickness difference between modules 111 to 124 is within the target range. If the film thickness difference between modules 111 to 124 is not within the target range ("No" in step S16), the recipe setting device 130 returns the process to step S13. The process of changing the offset value and checking whether the film thickness difference is within the target range is repeated until the film thickness difference between modules 111 to 124 is within the target range.

[0132] If the film thickness difference falls within the target range ("YES" in step S16), the recipe setting device 130 executes steps S17 and S18. In step S17, the offset changer 137 changes the constraint conditions. The offset changer 137 selects one of the second condition C2 through the fourth condition C4 from the established constraint conditions stored in the condition storage unit 138. For example, the offset changer 137 changes the first condition C1 to the fourth condition C4.

[0133] In step S18, the offset change unit 137 determines whether the average value of the obtained film thickness is within the target range and whether the in-plane trend of each module of the modules 111 to 124 reaches the target in-plane trend. Here, the offset change unit 137 calculates the average value of the film thickness in multiple modules 111 to 124, for example. Regarding the target range, it can be, for example, the range obtained by adding a specified value in the positive and negative directions relative to the target value FD0. Regarding whether the target in-plane trend is reached, it can be whether 3σ of the difference between the target value of the in-plane trend and the value of the in-plane trend of each module reaches the reference value. Alternatively, regarding whether the target in-plane trend is reached, it can be whether the range from the minimum value to the maximum value of the difference between the target value of the in-plane trend and the value of the in-plane trend of each module reaches the reference range. Alternatively, regarding whether the target in-plane trend is reached, it can be whether 3σ of the value of the in-plane trend of each module reaches the reference value, or whether the range from the minimum value to the maximum value of the value of the in-plane trend of each module reaches the reference range.

[0134] If the average film thickness and in-plane trend do not fall within the target range ("No" in step S18), the recipe setting device 130 executes steps S19, S20, and S21. In step S19, the offset changer 137 calculates a correction value for the multiple modules 111 to 124 based on the fourth condition C4 described above. For example, the offset changer 137 calculates a correction value (offset correction value) to bring the average film thickness within the target range based on the average film thickness and the offset sensitivity. In step S20, the offset changer 137 adds the same correction value to each of the multiple offset values ​​stored in the offset storage unit 132 to update the offset table OT1. In step S21, similar to step S13, the offset changer 137 obtains the film thickness values ​​(e.g., the in-plane average film thickness of the wafer W) of the wafers W processed by each of the multiple modules 111 to 124. The recipe setting device 130 then returns to step S18. Steps S18 through S21 are then repeated until the average film thickness falls within the target range. If the average film thickness falls within the target range ("Yes" in step S18), the series of processing steps ends. Alternatively, the recipe setting device 130 may skip step S18. In this case, the recipe setting device 130 may execute steps S19, S20, and S21 regardless of whether the average film thickness and the in-plane trend fall within the target range.

[0135] (Manual editing process of the offset table)

[0136] This process further edits the offset table, which has already been edited using the automatic editing process, based on manual user input. For example, this process is executed when, due to changes in external conditions, the film thickness difference or average film thickness no longer falls within the target range even with the edited offset table. This process also allows the initial table to be edited based on manual user input without going through the automatic editing process.

[0137] like Figure 12 As shown, the recipe setting device 130 first executes steps S21 and S22. In step S21, the manual change unit 139 waits for the user to input a manual editing request. In step S22, the manual change unit 139 displays the offset table list on the display unit. Figure 13 1 is a diagram showing an example of an offset table list. In the offset table list 81, a plurality of offset tables and reference recipes corresponding to the respective offset tables are displayed in a list.

[0138] Back to Figure 12 The recipe setting device 130 then executes step S23. In step S23, the manual change unit 139 determines whether any offset table in the offset table list 81 has been selected. If an offset table has been selected ("Yes" in step S23), the manual change unit 139 generates an input interface in step S24. Figure 14 It is a diagram showing an example of the input interface 82 . Figure 14 The example of FIG. 8 shows the input interface 82 when the offset table OT1 is selected in step S23. Figure 14 In the example shown in FIG. 1 , input interface 82 includes an offset value list 83. Offset value list 83 includes control parameters, offset correction values, pre-correction offset values, and post-correction offset values ​​associated with each of multiple modules 111 to 124. Input interface 82 may also include a constraint input section 84. Input section 84 may include a drop-down menu for selecting from multiple pre-defined constraints. Input interface 82 may also include a history call button 85 for displaying a change history.

[0139] Back to Figure 12 The recipe setting device 130 then proceeds to step S25. In step S25, for example, it determines whether the constraint condition has been changed in the input unit 84. If the constraint condition has been changed ("Yes" in step S25), the recipe setting device 130 proceeds to step S27. In step S27, the offset changing unit 137 changes the constraint condition by the amount of change in the offset value according to the change in the input unit 84. If the constraint condition has not been changed ("No" in step S25), in step S26, the offset changing unit 137 maintains the original constraint condition.

[0140] After steps S26 and S27, recipe setting device 130 executes step S28. In step S28, manual change unit 139 determines whether a new correction value has been input. Based on the input correction value and the constraints, manual change unit 139 adds the correction value to the current offset value and stores the resulting offset value in offset storage unit 132 as the corrected offset value.

[0141] If no offset value change has been input ("No" in step S28), the recipe setting device 130 proceeds to step S30. In step S30, the manual change unit 139 determines whether the user has performed a history call operation. For example, the manual change unit 139 determines whether the user has pressed the history call button 85 on the input interface 82. If no history call has been received ("No" in step S30), the recipe setting device 130 returns the process to step S25. If it is determined in step S30 that a history call operation has been performed, the recipe setting device 130 proceeds to steps S31, S32, and S33. In step S31, the history display unit 140 displays the change history 86 on the input interface 82. Figure 15 86 is a diagram showing an example of the change history 86. The change history 86 is displayed below the offset value list 83 on the input interface 82, for example. Figure 15 In the example of , the change history 86 includes a plurality of change records 860 in chronological order. Each of the plurality of change records 860 includes a change date and time, a changed module, a changed parameter, a correction value used in the change, an offset value before correction, and an offset value after correction.

[0142] Back to Figure 12 In step S32, the rollback unit 141 waits until any one of the plurality of change records 860 is selected in the change history 86. In step S33, the rollback unit 141 changes the change target parameter of the target module of the selected change record to the offset value included in the change record.

[0143] After step S29 or step S33, recipe setting device 130 executes step S38. In step S38, manual change unit 139 updates change history 86 based on the offset value change executed in step S29 or step S33. For example, manual change unit 139 appends a change record including the changes made in step S29 or step S33 to change history 86.

[0144] If the offset table is not selected in step S23 ("No" in step S23), the recipe setting device 130 proceeds to step S34. In step S34, the manual change unit 139 determines whether a base recipe is selected in the offset table. If it is determined that a base recipe is not selected in the offset table ("No" in step S34), the recipe setting device 130 returns the process to step S23.

[0145] If it is determined in step S34 that the reference recipe is selected ("YES" in step S34), the recipe setting device 130 executes steps S35, S36, and S37. In step S35, the manual change unit 139 generates a second input interface. Figure 16 87 is a diagram showing an example of the second input interface 87. Figure 16 In the example of , the second input interface 87 includes a candidate list 88 and a recipe list 89. The recipe list 89 is a list of reference recipes that have been associated with the offset table OT1. Figure 16 , the reference recipe RP1 is listed in the recipe list 89 . The candidate list 88 is a list of one or more reference recipes that can be added to the recipe list 89 .

[0146] In step S36, manual change unit 139 waits for a base recipe to be selected from candidate list 88. In step S37, manual change unit 139 associates the base recipe selected from candidate list 88 with the offset table as another base recipe. Recipe setting device 130 may complete the manual editing process after executing step S36 or step S37, or may continue the manual editing process until an operation such as closing the offset table is performed.

[0147] (Processing recipe generation process)

[0148] This process is to generate a processing recipe based on the generated offset table and base recipe. Figure 17 As shown, the recipe setting device 130 executes steps S41 , S42 , S43 , S44 , and S45 .

[0149] In step S41, the selection unit 133 receives a process execution instruction from a process operation instruction unit (not shown) within the control device 100. The execution instruction includes identification information of the process to be executed. In step S42, the selection unit 133 selects any one of the multiple modules 111 to 124 capable of executing the instructed process. In step S43, the offset value extraction unit 134 selects the offset table associated with the base recipe for the instructed process.

[0150] In step S44, the offset value extraction unit 134 extracts the offset value corresponding to the module selected by the selection unit 133 from the offset table OT1. In step S45, the recipe generation unit 135 generates a process recipe for the selected module based on the reference recipe RP1 and the extracted offset value. The substrate processing control unit 110 performs liquid processing on the wafer W based on the process recipe generated in step S45.

[0151] (Monitoring the change of offset value over time)

[0152] The offset storage unit 132 can store multiple offset values ​​at multiple time points. For example, each time the offset table OT1 is updated by adding a correction value to each of the multiple offset values, the offset modification unit 137 stores the corrected multiple offset values ​​in the offset storage unit 132. The offset modification unit 137 can update the offset table OT1 during regular maintenance of the control device 100. In this case, the multiple time points are each a time point at which the control device 100 undergoes regular maintenance. For example, maintenance of the control device 100 can be performed daily, monthly, or every few months.

[0153] In the case where the offset storage unit 132 stores a plurality of offset values ​​at a plurality of time points, as shown in FIG. Figure 18 As shown, the recipe setting device 130 may further include a monitoring unit 142. Based on the multiple offset values ​​at multiple time points, the monitoring unit 142 may generate a monitoring interface that displays the temporal changes of the multiple offset values. In this case, the monitoring unit 142 may be configured in any manner as long as it can display the temporal changes of the multiple offset values.

[0154] As an example, Figure 19 As shown, the monitoring unit 142 generates a monitoring interface 90 in which a graph showing changes in a plurality of offset values ​​over time is displayed. Figure 19 In the example, the monitoring unit 142 displays a coordinate graph 91 and a coordinate graph 92 on the monitoring interface 90. The coordinate graph 91 shows the change of multiple offset values ​​of the rotation speed during discharge (first set value) over time, and the coordinate graph 92 shows the change of multiple offset values ​​of the rotation speed during drying (second set value) over time. The rotation speed during discharge is, for example, the rotation speed of the wafer W when the processing liquid is discharged from the nozzle 61, and is a value that affects the in-plane distribution of the film thickness of the processing liquid. The rotation speed during drying is, for example, the rotation speed of the wafer W after the discharge of the processing liquid from the nozzle 61 stops, and is a value that affects the average value of the film thickness of the processing liquid measured at multiple locations on the wafer W. The horizontal axes of the coordinate graphs 91 and 92 represent multiple time points. Figure 19 In the example shown in FIG, the specific date is displayed. The horizontal axis of the coordinate graph 91 can be used in conjunction with the horizontal axis of the coordinate graph 92. The vertical axis of the coordinate graph 91 represents the rotation speed during discharge, and the vertical axis of the coordinate graph 92 represents the rotation speed during drying. Figure 19In the example, the coordinate graph 91 and the coordinate graph 92 are displayed vertically on the monitoring interface 90, but the coordinate graph 91 and the coordinate graph 92 may be displayed horizontally.

[0155] In addition, the monitoring unit 142 can generate a monitoring interface 90 that displays the following coordinate graph 91, wherein the coordinate graph 91 includes a sub-coordinate graph 911, a sub-coordinate graph 912, and a sub-coordinate graph 913 that each individually represents a plurality of offset values ​​at a plurality of time points. The sub-coordinate graph 911, the sub-coordinate graph 912, and the sub-coordinate graph 913 each correspond to a plurality of time points. The horizontal axis of each of the sub-coordinate graphs 911, the sub-coordinate graph 912, and the sub-coordinate graph 913 represents any module among the plurality of modules 111 to 124. Figure 19 In the example of , a plurality of modules 111 to 122 are displayed. The vertical axis of each of the sub-graph 911 , the sub-graph 912 , and the sub-graph 913 represents the offset value of the rotation speed during discharge.

[0156] Using monitoring interface 90 generated by monitoring unit 142, a user can monitor the changes in multiple offset values ​​over time using graph 91. Furthermore, the user can also monitor the fluctuations in multiple offset values ​​across multiple modules 111 to 122 over time using sub-graphs 911, 912, and 913. For example, the user can first understand from graph 91 that multiple offset values ​​increased from December 6, 2024, to January 6, 2025. Furthermore, the user can understand from sub-graphs 912 and 913 that the fluctuations in multiple offset values ​​increased, particularly the increase in the offset values ​​of modules 113 and 114 relative to the other modules.

[0157] The monitoring unit 142 can display the coordinate graph 91 and the sub-coordinate graphs 911, 912, and 913 on the monitoring interface 90 in a manner that allows them to be distinguished. For example, the monitoring unit 42 can display the sub-coordinate graphs in a manner that separates the sub-coordinate graphs 911 and 912, and the sub-coordinate graphs 912 and 913. Figure 19 As shown, the monitoring unit 42 may display the sub-coordinate graph 911 , the sub-coordinate graph 912 , and the sub-coordinate graph 913 as line graphs, and may separate the intervals between the graphs.

[0158] The monitoring unit 142 may set at least one of a threshold indicating a maximum value (upper limit) and a threshold indicating a minimum value (lower limit) on the monitoring interface 90. The monitoring unit 142 may issue an abnormality alert to the user when the offset value exceeds the threshold indicating the maximum value or falls below the threshold indicating the minimum value. For example, Figure 19In the example shown in FIG, monitoring unit 142 sets a threshold value Th1 indicating a maximum value in graph 91. In this case, in sub-graph 913, the offset values ​​of module 113 and module 114 exceed threshold value Th1, so monitoring unit 142 issues an alarm to the user.

[0159] Similarly, the monitoring unit 142 can generate a monitoring interface 90 that displays the following coordinate graph 92, wherein the coordinate graph 92 includes a sub-coordinate graph 921, a sub-coordinate graph 922, and a sub-coordinate graph 923, each of which individually represents a plurality of offset values ​​at a plurality of time points. The sub-coordinate graphs 921, 922, and 923 are identical to the sub-coordinate graphs 911, 912, and 913, except that the vertical axis of each sub-coordinate graph represents the rotation speed during drying. Figure 19 In the example shown in FIG. 1 , monitoring unit 142 sets a threshold value Th2 in graph 92. In this case, for example, if the offset value of module 113 and the offset value of module 114 in sub-graph 922 exceed threshold value Th2, monitoring unit 142 issues an alert to the user. As an example of an alert, monitoring unit 142 may highlight the alert on monitoring interface 90. Alternatively, monitoring unit 142 may display the alert on a separate screen from monitoring interface 90. Monitoring unit 142 may also emit a warning sound in conjunction with or instead of displaying the alert.

[0160] The monitoring unit 142 can generate a monitoring interface that shows the change of the statistical values ​​of the multiple offset values ​​over time. The statistical value can include at least one of the average value, median and discrete value of the multiple offset values. The discrete value can be the standard deviation or 3σ representing 3 times the standard deviation, or a discrete range. The discrete range is, for example, the difference between the minimum offset value and the maximum offset value among the multiple offset values. The monitoring unit 142 can display the multiple statistical values ​​at multiple time points on the monitoring interface. As an example, Figure 20 As shown, the monitoring unit 142 generates a monitoring interface 93 showing the change of the average value of the plurality of offset values ​​and the discrete values ​​of the plurality of offset values ​​over time. The discrete value here is the range of the plurality of offset values ​​at each of the plurality of time points. Figure 20 In the example, the monitoring unit 142 displays a coordinate graph 94 and a coordinate graph 95 on the monitoring interface 93. The coordinate graph 94 shows the average value of the plurality of offset values ​​of the rotation speed during discharge and the range of the plurality of offset values. The coordinate graph 95 shows the average value of the plurality of offset values ​​of the rotation speed during drying and the range of the plurality of offset values. Figure 20 In the example, the coordinate graph 94 and the coordinate graph 95 are displayed side by side on the monitoring interface 93, but the coordinate graph 94 and the coordinate graph 95 may be displayed side by side up and down.

[0161] In addition, the monitoring unit 142 can generate a monitoring interface 93 that displays the following coordinate graph 94, wherein the coordinate graph 94 includes a sub-coordinate graph 941 representing the average value of multiple offset values ​​and a sub-coordinate graph 942 representing the range of multiple offset values. Similarly, the monitoring unit 142 can generate a monitoring interface 93 that displays the following coordinate graph 95, wherein the coordinate graph 95 includes a sub-coordinate graph 951 representing the average value of multiple offset values ​​and a sub-coordinate graph 952 representing the range of multiple offset values. The sub-coordinate graph 941 and the sub-coordinate graph 951 represent the average value of multiple modules at multiple time points. The sub-coordinate graph 942 and the sub-coordinate graph 952 represent the range of multiple modules at multiple time points. The horizontal axis of each sub-coordinate graph represents multiple time points. Figure 20 In the example, a specific date is displayed. The display method of the monitoring interface 93 is not limited to Figure 20 For example, the sub-coordinate graph 941 and the sub-coordinate graph 951 are displayed as line graphs, but can also be displayed as bar graphs.

[0162] The monitoring unit 142 can set at least one of a threshold indicating a maximum value (upper limit) and a threshold indicating a minimum value (lower limit) on the monitoring interface 93. The monitoring unit 142 can issue an abnormality alert to the user when the statistical value of the plurality of offset values ​​exceeds the threshold indicating the maximum value or falls below the threshold indicating the minimum value. For example, Figure 20 In the example shown in Figure 9, monitoring unit 142 sets a threshold value Th3 indicating the maximum value in sub-graph 942. In this case, the range at the time of January 6, 2025 in sub-graph 942 exceeds threshold value Th3, so monitoring unit 142 issues an alert to the user. Furthermore, monitoring unit 142 sets a threshold value Th4 indicating the maximum value in sub-graph 951. In this case, the range at the time of December 6, 2024 in sub-graph 951 exceeds threshold value Th4, so monitoring unit 142 issues an alert to the user.

[0163] After checking the statistical values ​​of the multiple offset values ​​over time on the monitoring interface 93, the user can check the changes of the multiple offset values ​​over time as detailed data on the monitoring interface 90. For example, Figure 21 As shown, the offset changing unit 137 can display an offset table list 810 including the monitoring interface 93 on the display unit. The offset table list 810 displays a plurality of offset tables, the reference recipes corresponding to each of the offset tables, and the monitoring interface 93 corresponding to each of the offset tables. Furthermore, the number of sub-graphs displayed on the monitoring interface 93 can be two or more, and each sub-graph can display two or more statistical values.

[0164] The user can first check the time-varying statistical values ​​of the multiple offset values ​​displayed on the monitoring interface 93 from the offset table list 810. Then, the user can call the detailed data by pressing the call button 811. Figure 19 The monitoring interface 90 is shown.

[0165] Next, an example of a method for monitoring multiple offset values ​​is described. Figure 22 As shown in FIG. 5 , the process can be executed in the order of steps S51 to S57. The process can be executed by storing a plurality of offset values ​​at a plurality of time points in the offset storage unit 132. First, the monitoring unit 142 generates a monitoring interface showing the change of the statistical values ​​of the plurality of offset values ​​over time (step S51). As an example, Figure 21 As shown, the offset changing unit 137 can display the offset table list 810 including the monitoring interface 93 on the display unit. Next, the monitoring unit 142 determines whether the statistical value of the plurality of offset values ​​is within the range of the threshold value (step S52). For example, Figure 20 In the example, monitoring unit 142 sets a threshold value Th3 in sub-coordinate graph 942. In this case, monitoring unit 142 determines whether the range of multiple offset values ​​at multiple time points in sub-coordinate graph 942 falls within threshold value Th3. If the statistical value is not within the threshold range ("No" in step S52), monitoring unit 142 may issue an abnormality alert to the user (step S53). After receiving the alert notification, the user can confirm the detailed data.

[0166] If the statistical value is within the threshold range ("Yes" in step S52) or after the user is alerted, the monitoring unit 142 determines whether the user has called up the detailed data (step S54). If the detailed data has not been called up ("No" in step S54), the monitoring unit 142 again determines whether the statistical value of the plurality of offset values ​​is within the threshold range (step S52). On the other hand, if the detailed data has been called up ("Yes" in step S54), the monitoring unit 142 generates the monitoring interface 90 (step S55) in which a graph showing the change of the plurality of offset values ​​over time is displayed. For example, Figure 19 As shown, monitoring unit 142 may display a graph 91 on the display unit, wherein the graph includes a sub-graph 911, a sub-graph 912, and a sub-graph 913, each of which individually represents a plurality of offset values ​​at a plurality of time points. Furthermore, monitoring unit 142 may display a graph 92 on the display unit on the same monitoring interface 90 as graph 91, wherein the graph includes a sub-graph 921, a sub-graph 922, and a sub-graph 923, each of which individually represents a plurality of offset values ​​at a plurality of time points.

[0167] Next, the monitoring unit 142 determines whether the plurality of offset values ​​are within a threshold range (step S56). Figure 19In the example, monitoring unit 142 sets a threshold value Th1 for graph 91. In this case, it determines whether the multiple offset values ​​for sub-graphs 911, 912, and 913 are within the threshold value Th1. If the multiple offset values ​​are not within the threshold value range ("No" in step S56), monitoring unit 142 can issue an abnormality alert to the user (step S57). After receiving the alert, the user can identify the time and module where the abnormality occurred and analyze the cause or repair the module. If the multiple offset values ​​are within the threshold value range ("Yes" in step S56), or after the user is alerted, the monitoring method ends.

[0168] [Effects of the embodiment]

[0169] According to the recipe setting device, recipe setting method, and recipe setting program described above, multiple offset values ​​corresponding to the modules 111-124 are aggregated into an offset table OT1 for each module-specific adjustment required for the base recipe RP1. The offset table OT1 is stored in association with the base recipe RP1, extracts offset values ​​for each module, and generates a process recipe based on the extracted offset values ​​and the base recipe RP1. This eliminates the need to open each recipe and search for items; the process recipes for each module can be managed by simply editing the offset table OT1. This reduces the burden of recipe management in systems that selectively use multiple modules 111-124.

[0170] The recipe setting device 130 also includes an offset editing unit 136 that changes two or more offset values ​​in the offset table OT1 by the same amount. In this case, if two or more offset values ​​can be shared, these two or more offset values ​​can be collectively changed, further reducing the management burden.

[0171] The offset editing unit 136 changes two or more offset values ​​belonging to the same group by the same amount based on pre-set constraints that divide the multiple offset values ​​in the offset table OT1 into one or more groups. This allows all offset values ​​within the same group to be changed at once based on the constraints, further reducing the burden of recipe management.

[0172] The recipe setting device 130 also includes a condition storage unit 138 that stores a plurality of different predefined constraints. The offset editing unit 136 selects a constraint from the predefined constraints and, based on the selected constraint, changes two or more offset values ​​belonging to the same group by the same amount. This allows for both the flexibility of changing multiple offset values ​​individually and the convenience of collectively changing two or more offset values. Furthermore, the ability to change a constraint by selecting from a plurality of predefined constraints reduces the workload associated with changing the constraint.

[0173] The multiple predefined constraints include: a first condition C1, which groups the multiple modules 111-124 into separate groups; a second condition C2, which groups two or more modules within the multiple modules 111-124 that are connected to a common supply source 62A-62D for the process medium into the same group; a third condition C3, which groups two or more modules within the multiple modules 111-124 that are within the same block into the same group; and a fourth condition C4, which groups all the multiple modules 111-124 into the same group. In this case, the first condition C1 accommodates situations where multiple offset values ​​need to be adjusted individually (for example, when process results vary significantly between modules). The second condition C2 accommodates situations where adjustments need to be made for two or more modules connected to a common supply source (for example, when the type of process medium changes and control parameters need to be changed accordingly). The third condition C3 accommodates situations where multiple offset values ​​need to be adjusted collectively (for example, when process results vary across modules on a block-by-block basis). The fourth condition C4 can be used to accommodate situations where all offset values ​​need to be adjusted collectively (for example, to bring the processing results of each module to a common value after fluctuations in the processing results of each module have been largely eliminated). In this way, multiple predefined constraints can be used to accommodate various situations.

[0174] The offset editing unit 136 includes an offset changing unit 137 that causes each of the plurality of modules 111 to 124 to execute processing based on the processing recipe and changes the offset table OT1 based on the plurality of processing results and constraints of the plurality of modules 111 to 124. In this case, the offset table OT1 can be easily adjusted automatically using the constraints and the offset table OT1.

[0175] The offset changing unit 137 repeatedly performs the following steps: changing the constraints to reduce the number of groups while causing the modules 111 to 124 to execute their own processing; and changing the offset table OT1. By changing the constraints to reduce the number of groups, it is possible to gradually adjust the processing results from reducing the fluctuations in each module to averaging the processing results across the modules 111 to 124.

[0176] Under the constraint (first condition C1) that the modules 111-124 are grouped as separate groups, the offset changing unit 137 changes the offset table OT1 to reduce the differences between the multiple processing results. Under the constraint that all modules 111-124 are grouped as a single group, the offset changing unit 137 changes the offset table OT1 to bring the average of the multiple processing results closer to a target value. By more clearly distinguishing between the phases of reducing individual fluctuations in the modules 111-124 and the phase of adjusting the average processing result of the modules 111-124, the offset table OT1 can be adjusted more efficiently.

[0177] The offset editing unit 136 includes a manual changing unit 139 that changes the offset table OT1 based on a user input. In this case, by making the offset table OT1 an object to be edited by the user, the recipe management burden on the user can be reduced.

[0178] The manual change unit 139 generates an input interface 82 that displays a list of offset values ​​associated with the modules 111 to 124, and changes the offset table OT1 in response to changes in the offset values ​​on the input interface 82. The list display allows easy editing of offset values ​​for each module.

[0179] The recipe setting device 130 further includes a history display unit 140 that can display the change history 86 of the offset table OT1 made by the manual change unit 139 on the input interface 82. By being able to check the change history 86, redundant research can be avoided, further reducing the recipe management burden on the user.

[0180] The recipe setting device 130 further includes a rollback unit 141 that can restore the offset table OT1 to a past state selected in the change history 86. In this case, the offset table OT1 can be easily restored to a past state.

[0181] Manual change unit 139 also generates a second input interface 87 that displays recipe list 89, including reference recipe RP1, in association with offset table OT1. In response to the addition of another reference recipe to recipe list 89 on second input interface 87, the other reference recipe is associated with offset table OT1. This allows for easy application of offset table OT1 associated with reference recipe RP1 to other reference recipes. This reduces the burden of separately adjusting offset tables corresponding to other reference recipes.

[0182] In response to the selection of the offset table OT1, the manual change unit 139 generates a candidate list 88 including one or more reference recipes that can be added to the recipe list 89, and adds the one reference recipe selected from the candidate list 88 as another reference recipe to the recipe list 89. This allows for easy addition of another reference recipe to the recipe list 89.

[0183] Manual change unit 139 generates candidate list 88 including one or more base recipes whose values ​​for items corresponding to multiple offset values ​​are common to base recipe RP1. Including one or more base recipes with a high probability of being applicable to the offset table in candidate list 88 makes it easier to add other base recipes to the recipe list.

[0184] Each of the modules 111 to 124 includes a rotation holding unit 50 that holds and rotates a wafer W, and a nozzle 61 that discharges a processing liquid toward the wafer W held by the rotation holding unit 50. This can reduce the burden of managing recipes in liquid processing requiring fine adjustment of the recipe.

[0185] The reference recipe RP1 includes a first set value indicating the rotational speed of the wafer W when the process liquid is discharged from the nozzle 61, and a second set value indicating the rotational speed of the wafer W after the discharge of the process liquid from the nozzle 61 stops. The offset table OT1 includes offset values ​​for the first set value and offset values ​​for the second set value, corresponding to each of the plurality of modules 111 to 124. In this case, by combining the offset values ​​for the first set value and the second set value, which facilitate independent adjustment of the film thickness, in the offset table OT1, process recipe adjustment based on the film thickness can be easily implemented.

[0186] Each of the multiple modules 111-124 is connected to one or more supply sources 62 of the process liquid. The recipe storage unit 131 also stores a supply source recipe RP2, which includes a third set value indicating the time to stop supplying the process liquid from one of the one or more supply sources 62, and a fourth set value indicating the discharge pressure of the process liquid from one of the one or more supply sources 62. In this case, the supply time and discharge pressure of the process liquid are parameters that affect film thickness, and adjusting them allows for more precise film thickness adjustment. Furthermore, by storing the supply source recipe RP2 separately from the base recipe RP1 and the offset table OT1, recipe management can be achieved with greater flexibility. For example, the recipe can be adjusted for each supply source independently of the adjustment for each module.

[0187] The recipe setting device 130 includes a plurality of supply sources 62A-62D as one or more supply sources 62, and the recipe storage unit 131 stores a supply source recipe RP2 corresponding to each of the plurality of supply sources 62A-62D. In this case, by storing the supply source recipe RP2 for each supply source 62 without separating the supply source 62 into recipes and offset values, the operating conditions during confirmation of the operation of a single supply source 62 and during processing of a wafer W can be aligned, thereby improving the reliability of the single-source operation confirmation.

[0188] The offset storage unit 132 stores a plurality of offset values ​​at a plurality of time points. The recipe setting device 130 further includes a monitoring unit 142 that generates a monitoring interface 90 that displays the temporal changes of the plurality of offset values ​​based on the plurality of offset values ​​at the plurality of time points. In this case, even if the processing results do not change due to adjustment of the offset values, abnormalities in the substrate processing device can be detected in advance based on the temporal changes in the offset values.

[0189] The monitoring unit 142 generates a monitoring interface 90 that displays graphs 91 and 92 showing temporal changes in the plurality of offset values. In this case, the readability of the temporal changes in the plurality of offset values ​​can be improved.

[0190] Monitoring unit 142 generates monitoring interface 90 that displays graph 91 and graph 92. Graph 91 includes sub-graphs 911 to 913 that individually represent multiple offset values ​​at multiple time points, and graph 92 includes sub-graphs 921 to 923 that individually represent multiple offset values ​​at multiple time points. This improves the readability of both the temporal changes in the multiple offset values ​​and the temporal fluctuations in the multiple offset values.

[0191] The monitoring unit 142 generates a monitoring interface 93 that shows temporal changes in the statistical values ​​of the plurality of offset values. In this case, the overall trend of changes in the plurality of offset values ​​can be easily grasped.

[0192] Statistical values ​​include the average or median of multiple offset values ​​and the discrete values ​​of the multiple offset values. Monitoring unit 142 generates monitoring interface 93 that displays the temporal changes of the average or median and the discrete values. In this case, both the temporal changes of the multiple offset values ​​and the temporal changes of the fluctuations of the multiple offset values ​​can be easily understood simultaneously.

[0193] Each of the multiple modules 111 to 124 includes a rotating holding portion 50 that holds and rotates a wafer W, and a nozzle 61 that discharges a processing liquid onto the wafer W held by the rotating holding portion 50. The reference recipe RP1 includes a first set value indicating the rotational speed of the wafer W when the processing liquid is discharged from the nozzle 61, and a second set value indicating the rotational speed of the wafer W after the discharge of the processing liquid from the nozzle 61 stops. In the offset table OT1, offset values ​​of the first set value and the second set value are included corresponding to each of the multiple modules 111 to 124. The monitoring unit 142 displays the changes in the multiple offset values ​​of the first set value and the multiple offset values ​​of the second set value over time on the monitoring interface 90. In this case, the film thickness can be adjusted by changing the offset values ​​of the first set value and the offset values ​​of the second set value respectively. Since the monitoring unit 142 displays the offset values ​​of the first set value and the offset values ​​of the second set value together, the history of the film thickness adjustment results can be understood at a glance.

[0194] The gist of the present invention is as follows [E1] to [E28].

[0195] [E1] A recipe setting device comprises: a recipe storage unit for storing a reference recipe representing conditions for substrate processing; an offset storage unit for storing an offset table in association with the reference recipe, wherein the offset table includes a plurality of offset values ​​corresponding to a plurality of modules of a substrate processing device; a selection unit for selecting one module from the plurality of modules; an offset value extraction unit for extracting the offset value corresponding to the selected module from the plurality of offset values; and a recipe generation unit for generating a processing recipe to be executed by the selected one module based on the reference recipe and the extracted offset value.

[0196] [E2] The recipe setting device according to [E1] further includes an offset editing unit that changes two or more offset values ​​in the offset table by the same amount of change.

[0197] [E3] A recipe setting device according to [E2], wherein the offset editing unit changes the two or more offset values ​​belonging to the same group by the same change amount based on a constraint condition pre-set in such a manner as to divide the multiple offset values ​​in the offset table into one or more groups.

[0198] [E4] The recipe setting device according to [E3] further includes a condition storage unit that stores a plurality of different established constraints, and the offset editing unit selects the constraint from the plurality of established constraints, and based on the selected constraint, changes the two or more offset values ​​belonging to the same group by the same change amount.

[0199] [E5] A recipe setting device according to [E4], wherein the plurality of established constraints include: a first condition, classifying each of the plurality of modules into a separate group; a second condition, classifying two or more modules among the plurality of modules that are connected to a common supply source of a processing medium into the same group; a third condition, classifying two or more modules among the plurality of modules that are contained in the same block of a substrate processing device into the same group; and a fourth condition, classifying all of the plurality of modules into the same group.

[0200] [E6] A recipe setting device according to any one of [E3] to [E5], wherein the offset editing unit has an offset changing unit, which causes the multiple modules to each perform processing based on the processing recipe and changes the offset table based on the multiple processing results of the multiple modules and the constraint conditions.

[0201] [E7] The recipe setting device according to [E6], wherein the offset changing unit repeatedly performs the following steps: changing the constraint conditions to reduce the number of groups while causing the multiple modules to perform processing individually; and changing the offset table.

[0202] [E8] A recipe setting device according to [E6] or [E7], wherein the offset changing unit changes the offset table in a manner that reduces the difference between the multiple processing results under the constraint condition that the multiple modules are each grouped as a separate group, and changes the offset table in a manner that makes the average of the multiple processing results approach a target under the constraint condition that all the multiple modules are grouped as the same group.

[0203] [E9] The recipe setting device according to any one of [E2] to [E8], wherein the offset editing unit has a manual change unit that changes the offset table based on user input.

[0204] [E10] A recipe setting device according to [E9], wherein the manual change unit generates an input interface that displays the multiple offset values ​​in association with each of the multiple modules at a glance, and changes the offset table in response to the multiple offset values ​​being changed on the input interface.

[0205] [E11] The recipe setting device according to [E10] further includes a history display unit that displays a history of changes made to the offset table by the manual change unit on the input interface.

[0206] [E12] The recipe setting device according to [E11] further includes a rollback unit that restores the offset table to a past state selected in the change history.

[0207] [E13] A recipe setting device according to any one of [E9] to [E12], wherein the manual change unit further generates a second input interface that displays a recipe list including the baseline recipe in association with the offset table, and in response to other baseline recipes being added to the recipe list on the second input interface, the other baseline recipes are associated with the offset table.

[0208] [E14] A recipe setting device according to [E13], wherein the manual change unit generates a candidate list including one or more baseline recipes that can be added to the recipe list in response to the offset table being selected, and adds one baseline recipe selected from the candidate list to the recipe list as the other baseline recipe.

[0209] [E15] The recipe setting device according to [E14], wherein the manual change unit generates the candidate list including the one or more baseline recipes, wherein, in the one or more baseline recipes, the values ​​of the items corresponding to the multiple offset values ​​are common to the baseline recipes.

[0210] [E16] A recipe setting device according to any one of [E1] to [E15], wherein each of the multiple modules includes a rotating holding portion that holds the substrate and rotates it, and a processing liquid nozzle that discharges a processing liquid toward the substrate held by the rotating holding portion.

[0211] [E17] A recipe setting device according to [E16], wherein the reference recipe includes a first set value indicating the rotation speed of the substrate when the processing liquid is ejected from the processing liquid nozzle, and a second set value indicating the rotation speed of the substrate after the processing liquid stops being ejected from the processing liquid nozzle, and in the offset table, an offset value of the first set value and an offset value of the second set value are included corresponding to each of the multiple modules.

[0212] [E18] A recipe setting device according to [E17], wherein each of the plurality of modules is connected to any one of more than one supply sources of the treatment liquid, and the recipe storage unit further stores a supply source recipe, the supply source recipe including: a third set value indicating a supply stop time of the treatment liquid from any one of the more than one supply sources; and a fourth set value indicating a discharge pressure of the treatment liquid from any one of the more than one supply sources.

[0213] [E19] The recipe setting device according to [E18] includes a plurality of supply sources as the one or more supply sources, and the recipe storage unit stores the supply source recipes corresponding to each of the plurality of supply sources.

[0214] [E20] A recipe setting device according to any one of [E1] to [E18], wherein the offset storage unit stores the multiple offset values ​​for each of the multiple time points, and the recipe setting device also includes a monitoring unit, which generates a monitoring interface that displays the changes of the multiple offset values ​​over time based on the multiple offset values ​​for each of the multiple time points.

[0215] [E21] The recipe setting device according to [E20], wherein the monitoring unit generates the monitoring interface for displaying a coordinate graph, wherein the coordinate graph represents changes in the plurality of offset values ​​over time.

[0216] [E22] The recipe setting device according to [E21], wherein the monitoring unit generates the monitoring interface for displaying the coordinate graph, and the coordinate graph includes a sub-coordinate graph that individually represents the multiple offset values ​​at each of the multiple time points.

[0217] [E23] A recipe setting device according to any one of [E20] to [E22], wherein the monitoring unit generates a monitoring interface representing changes in statistical values ​​of the multiple offset values ​​over time.

[0218] [E24] A recipe setting device according to [E23], wherein the statistical value includes an average value of the multiple offset values ​​and a discrete value of the multiple offset values, and the monitoring unit generates the monitoring interface representing changes in the average value and the discrete value over time.

[0219] [E25] A recipe setting device according to any one of [E20] to [E24], wherein each of the multiple modules includes a rotating holding portion that holds the substrate and rotates it, and a processing liquid nozzle that spits processing liquid onto the substrate held by the rotating holding portion, the reference recipe includes a first set value indicating the rotation speed of the substrate when the processing liquid is spouted from the processing liquid nozzle, and a second set value indicating the rotation speed of the substrate after the processing liquid is stopped from being spouted from the processing liquid nozzle, the offset table includes an offset value of the first set value and an offset value of the second set value corresponding to each of the multiple modules, and the monitoring portion displays the changes of the multiple offset values ​​of the first set value and the multiple offset values ​​of the second set value over time on the monitoring interface.

[0220] [E26] A recipe setting method comprises the following steps: storing a baseline recipe representing conditions for substrate processing; storing an offset table in association with the baseline recipe, wherein the offset table includes a plurality of offset values ​​corresponding to a plurality of modules of a substrate processing device; selecting one module from the plurality of modules; extracting an offset value corresponding to the selected module from the plurality of offset values; and generating a processing recipe to be executed by the selected one module based on the baseline recipe and the extracted offset value.

[0221] [E27] A program that causes a computer to execute a recipe setting method, the recipe setting method comprising the following steps: storing a baseline recipe representing conditions for substrate processing; storing an offset table in association with the baseline recipe, wherein the offset table includes a plurality of offset values ​​corresponding to a plurality of modules of a substrate processing device; selecting one module from the plurality of modules; extracting an offset value corresponding to the selected module from the plurality of offset values; and generating a processing recipe to be executed by the selected one module based on the baseline recipe and the extracted offset value.

[0222] [E28] A computer-readable storage medium storing the program described in [E27].

[0223] As will be understood from the foregoing description, the various embodiments of the present invention are described in this specification for illustrative purposes only and are subject to various modifications without departing from the scope and spirit of the present invention. Therefore, the various embodiments disclosed in this specification are not intended to limit the present invention, the true scope and spirit of which are indicated by the claimed technical solutions.

Claims

1. A recipe setting device, comprising: a recipe storage unit storing a reference recipe indicating substrate processing conditions; an offset storage unit for storing an offset table in association with the reference recipe, wherein the offset table includes a plurality of offset values ​​corresponding to a plurality of modules of the substrate processing apparatus; A selection unit, configured to select one module from the plurality of modules; an offset value extracting unit configured to extract an offset value corresponding to the selected module from the plurality of offset values; and The recipe generating unit generates a process recipe to be executed by the selected one module based on the reference recipe and the extracted offset value.

2. The recipe setting device according to claim 1, wherein: It also includes an offset editing unit that changes two or more offset values ​​in the offset table by the same amount of change.

3. The recipe setting device according to claim 2, wherein: The offset editing unit changes the two or more offset values ​​belonging to the same group by the same change amount based on a constraint condition that is set in advance so as to divide the plurality of offset values ​​in the offset table into one or more groups.

4. The recipe setting device according to claim 3, wherein: It also includes a condition storage unit that stores a plurality of predetermined constraint conditions that are different from each other. The offset editing unit selects the constraint condition from the plurality of predetermined constraint conditions, and based on the selected constraint condition, changes the two or more offset values ​​belonging to the same group by the same change amount.

5. The recipe setting device according to claim 4, wherein: The multiple established constraints include: The first condition is to group the multiple modules into separate groups; The second condition is that two or more modules connected to a common supply source of the process medium among the plurality of modules are grouped into the same group; A third condition is that two or more modules included in the same block of the substrate processing apparatus among the plurality of modules are grouped into the same group; and The fourth condition is to group all of the multiple modules into the same group.

6. The recipe setting device according to any one of claims 3 to 5, wherein: The offset editing unit includes an offset changing unit that causes each of the plurality of modules to execute a process based on the process recipe and changes the offset table based on a plurality of process results of the plurality of modules and the constraint conditions.

7. The recipe setting device according to claim 6, wherein: The offset changing unit repeatedly performs the following steps: causing each of the plurality of modules to execute processing while changing the constraint condition to reduce the number of groups; and The offset table is altered.

8. The recipe setting device according to claim 6, wherein: The offset changing unit changes the offset table so as to reduce the difference between the plurality of processing results under the constraint condition that the plurality of modules are grouped into separate groups. Furthermore, under the constraint condition that all the multiple modules are grouped into the same group, the offset table is changed so that the average of the multiple processing results approaches a target.

9. The recipe setting device according to any one of claims 2 to 5, wherein: The offset editing unit includes a manual changing unit that changes the offset table based on a user input.

10. The recipe setting device according to claim 9, wherein: The manual change unit generates an input interface that displays a list of the plurality of offset values ​​associated with the plurality of modules. Furthermore, the offset table is changed in response to the plurality of offset values ​​being changed on the input interface.

11. The recipe setting device according to claim 10, wherein: The system further comprises a history display unit, which displays the change history of the offset table made by the manual change unit on the input interface.

12. The recipe setting device according to claim 11, wherein: The system further includes a rollback unit that restores the offset table to a past state selected in the change history.

13. The recipe setting device according to claim 9, wherein: The manual change unit further generates a second input interface that displays a recipe list including the reference recipe in association with the offset table. Furthermore, in response to another reference recipe being added to the recipe list on the second input interface, the other reference recipe is associated with the offset table.

14. The recipe setting device according to claim 13, wherein: In response to the selection of the offset table, the manual change unit generates a candidate list including one or more reference recipes that can be added to the recipe list. Then, one reference recipe selected from the candidate list is added to the recipe list as the other reference recipe.

15. The recipe setting device according to claim 14, wherein: The manual change unit generates the candidate list including the one or more reference recipes, wherein values ​​of items corresponding to the plurality of offset values ​​in the one or more reference recipes are common to those in the reference recipes.

16. The recipe setting device according to any one of claims 1 to 5, wherein: Each of the multiple modules includes: a rotation holding portion that holds and rotates the substrate; and A processing liquid nozzle discharges a processing liquid toward the substrate held by the rotation holding portion.

17. The recipe setting device according to claim 16, wherein: The baseline formulation includes: a first set value indicating a rotation speed of the substrate when the processing liquid is ejected from the processing liquid nozzle; and a second set value indicating the rotation speed of the substrate after stopping the discharge of the processing liquid from the processing liquid nozzle, The offset table includes an offset value of the first setting value and an offset value of the second setting value corresponding to each of the plurality of modules.

18. The recipe setting device according to claim 17, wherein: Each of the plurality of modules is connected to one or more supply sources of the treatment liquid. The recipe storage unit further stores a supply source recipe, wherein the supply source recipe includes: a third set value indicating a timing at which supply of the processing liquid from any one of the one or more supply sources is stopped; and The fourth set value indicates the discharge pressure of the processing liquid from any one of the one or more supply sources.

19. The recipe setting device according to claim 18, wherein: including a plurality of supply sources as said one or more supply sources, The recipe storage unit stores the supply source recipe corresponding to each of the plurality of supply sources.

20. The recipe setting device according to any one of claims 1 to 5, wherein: The offset storage unit stores the plurality of offset values ​​at respective points in time. The recipe setting device further includes a monitoring unit configured to generate a monitoring interface that displays temporal changes in the plurality of offset values ​​based on the plurality of offset values ​​at each of the plurality of time points.

21. The recipe setting device according to claim 20, wherein: The monitoring unit generates the monitoring interface that displays a graph indicating changes in the plurality of offset values ​​over time.

22. The recipe setting device according to claim 21, wherein: The monitoring unit generates the monitoring interface that displays the coordinate graph, wherein the coordinate graph includes a sub-coordinate graph that individually represents the plurality of offset values ​​at each of the plurality of time points.

23. The recipe setting device according to claim 20, wherein: The monitoring unit generates a monitoring interface showing temporal changes in statistical values ​​of the plurality of offset values.

24. The recipe setting device according to claim 23, wherein: The statistical value includes an average value of the multiple offset values ​​and a discrete value of the multiple offset values. The monitoring unit generates the monitoring interface showing temporal changes of the average value and the discrete value.

25. The recipe setting device according to claim 20, wherein: Each of the multiple modules includes: a rotation holding portion that holds and rotates the substrate; and a processing liquid nozzle for discharging a processing liquid toward the substrate held by the rotation holding portion, The baseline formulation includes: a first set value indicating a rotation speed of the substrate when the processing liquid is ejected from the processing liquid nozzle; and a second set value indicating the rotation speed of the substrate after stopping the discharge of the processing liquid from the processing liquid nozzle, The offset table includes an offset value of the first setting value and an offset value of the second setting value corresponding to each of the plurality of modules. The monitoring unit displays, on the monitoring interface, changes over time of the plurality of offset values ​​of the first setting value and changes over time of the plurality of offset values ​​of the second setting value.

26. A recipe setting method comprising the following steps: storing a reference recipe representing conditions for substrate processing; An offset table is stored in association with the reference recipe, wherein: The offset table includes a plurality of offset values ​​corresponding to a plurality of modules of the substrate processing device respectively; Selecting one module from the plurality of modules; extracting an offset value corresponding to the selected module from the plurality of offset values; and A process recipe to be executed by the selected one module is generated based on the reference recipe and the extracted offset value.

27. A program for causing a computer to execute a recipe setting method, the recipe setting method comprising the following steps: storing a reference recipe representing conditions for substrate processing; storing an offset table in association with the reference recipe, wherein the offset table includes a plurality of offset values ​​corresponding to a plurality of modules of the substrate processing apparatus; Selecting one module from the plurality of modules; Extracting an offset value corresponding to the selected module from the plurality of offset values; and A process recipe to be executed by the selected one module is generated based on the reference recipe and the extracted offset value.

28. A computer-readable storage medium storing the program according to claim 27.

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