Double-circulation heat dissipation all-in-one computer
The combination of a dual-circulation cooling system and a heat-conducting fan solves the problem of coolant temperature rising in the flow channel, achieving efficient heat dissipation for the all-in-one computer.
Patent Information
- Application Number
- CN202510880884.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-27
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2045-06-27
AI Technical Summary
The cooling liquid of existing all-in-one computers gradually heats up in the flow channel, affecting the heat dissipation effect of subsequent components.
A dual-circulation heat dissipation system is adopted, and the interior of the casing is divided into a first circulation chamber and a second circulation chamber by a partition plate. The driving parts and secondary heat dissipation parts are used to realize dual-circulation cooling of the coolant. The heat exchange is carried out in combination with the heat conduction plate and the heat conduction fan to enhance the heat dissipation effect.
The effective control of the coolant temperature in the double circulation process is achieved, which avoids the influence of the coolant temperature rise on the heat dissipation of subsequent components and improves the overall heat dissipation efficiency.
Smart Images

Figure CN120704494A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of dual-circulation all-in-one computers, and particularly relates to a dual-circulation heat dissipation all-in-one computer. Background Art
[0002] An all-in-one computer is a computer in which the host and monitor are synchronized in one casing. Its internal CPU, memory and other components are all set in a casing similar to the monitor. This type of all-in-one computer is easy to carry when in use. You only need to assemble the monitor and you can take it away without installing a host.
[0003] However, the components in the all-in-one computer are installed relatively compactly, so a heat dissipation component needs to be installed in the casing to dissipate heat. When the existing heat dissipation component is in use, its air duct or liquid cooling flow channel mainly flows from the output position to the components in the all-in-one computer to dissipate heat, and then it is re-delivered to the cooling mechanism for cooling. This cooling method is prone to the coolant gradually heating up in the flow channel, and then when it flows halfway through the pipeline, the temperature will rise, affecting the heat dissipation of subsequent components. Summary of the Invention
[0004] Therefore, the technical problem to be solved by the present invention is to provide a computer all-in-one with dual-circulation heat dissipation, which can solve the problem that the coolant gradually heats up in the flow channel, and then when it flows halfway through the pipeline, the temperature rises, affecting the heat dissipation of subsequent components.
[0005] In order to solve the above problems, the present invention provides an all-in-one computer with dual-circulation heat dissipation, comprising: a bracket, a support column fixedly connected to the top side of the bracket, a number of support rods fixedly connected to the sides of the support column, a number of support rods fixedly connected to a housing, a circular cover fixedly connected to a side of the housing near the bracket, a partition plate fixedly connected to the inner peripheral side wall of the circular cover, a heat conducting plate provided between the partition plate and the side of the housing near the support column, and the heat conducting plate fixedly connected to the inner peripheral side of the circular cover;
[0006] The partition plate and the heat conducting plate divide the circular cover into a first circulation chamber, a second circulation chamber and a heat dissipation chamber from one side to the other. Circulation cooling elements are provided on both sides of the partition plate for cooling the circuit boards in the housing.
[0007] A secondary heat sink is provided on the side of the heat conducting plate away from the partition plate, which is used to dissipate heat inside the casing and the circulating cooling element;
[0008] A driving component is provided on the top of the supporting column for driving the circulating cooling component and the secondary heat dissipation component.
[0009] Furthermore, the circulating cooling part includes two discs, which are rotatably connected to two opposite sides of the partition plate and are eccentrically arranged. A number of slide grooves are opened on the outer side of the disc, and a reciprocating spring is fixedly connected to the inner wall of the slide groove. The end of the reciprocating spring is fixedly connected to a sliding rod, which is slidably connected in the slide groove. The end of the sliding rod is in contact with the inner side wall of the circular cover, and a pipeline part is arranged on the outer side of the circular cover.
[0010] Furthermore, the pipeline component includes a first circulation pipe, which is fixedly connected to the outer peripheral side of the circular cover and communicated with the output position of the first circulation chamber. The first circulation pipe is arranged in a reciprocating shape and its end extends to the bottom of the circular cover. The end of the first circulation pipe is fixedly connected to the first through pipe, and the end of the first through pipe is communicated with the suction position of the second circulation pipe;
[0011] A second circulation pipe is also fixedly connected to the outer peripheral side of the circular cover and is communicated with the output position of the first circulation chamber. The second circulation pipe is arranged in a reciprocating shape, and the end portion extends to the top of the circular cover. The end portion of the second circulation pipe is fixedly connected to a second through pipe, and the bottom end of the second through pipe is communicated with the suction position of the second circulation chamber.
[0012] Furthermore, the secondary heat dissipation element includes a circular channel, which is fixedly connected to the side of the heat conduction plate away from the partition plate and is coaxially arranged with the circular disc. A mounting shaft is provided in the middle of the circular cover, which is fixedly connected to the side of the heat conduction plate. A heat conduction fan is fixedly connected to the outer peripheral side of the mounting shaft. An inner air outlet is provided on the outer peripheral side of the circular channel, and a side of the circular channel close to the support column is closed. An outer air guide is also provided on the outer peripheral side of the circular cover.
[0013] Furthermore, the external air guide includes a number of external air outlets, which are distributed in a circular array on the outer peripheral side of the circular cover and are connected to the heat dissipation cavity. An air supply outlet is provided on the side wall of the casing, and an exhaust outlet is provided on the side of the casing and at the position of the support column.
[0014] Furthermore, an air duct is fixedly installed on the inner wall of the casing, the end of the air duct extends to the outer peripheral side of the circular cover, and the end of the air duct is connected to the corresponding external air outlet, and the end of the air duct is in contact with the outer peripheral side of the first circulation cavity.
[0015] Furthermore, an arc-shaped groove is opened in the outer peripheral side wall of the circular cover, and the arc-shaped groove is respectively connected to the air guide pipe and the corresponding external air outlet.
[0016] Furthermore, the driving member includes a driving motor, which is fixedly connected to the top of the support column. The motor shaft of the driving motor is fixedly connected to the mounting shaft, and the end portion extends into the first circulation chamber and is fixedly connected to the two discs respectively. The motor shaft of the driving motor is rotatably connected to the heat conduction plate and the partition plate.
[0017] In summary, the present invention includes at least one of the following beneficial technical effects:
[0018] 1. This dual-circulation heat dissipation all-in-one computer can, when in use, cool the coolant after cooling a portion of the components and then directly re-transfer it to the circular cover for cooling, and then dissipate heat for the remaining components. The coolant circulates in the dual pipes, achieving the purpose of dual circulation, thereby improving the heat dissipation effect and avoiding the coolant temperature rising after cooling a portion of the components, which affects the heat dissipation effect of subsequent components.
[0019] 2. In this dual-circulation heat dissipation all-in-one computer, an air duct is fixedly connected to the inner wall of the casing. When the heat conduction fan rotates to draw air, one of the external air outlets will draw air from the air duct, so that the internal air directly flushes the outer wall of the first circulation cavity, and then enters the circular channel to further dissipate heat in the first circulation cavity, so as to facilitate heat exchange treatment of the coolant in the first circulation cavity, thereby avoiding the cooling oil temperature in the first circulation cavity being too high, which in turn affects the subsequent cooling of the circuit boards and components in the casing. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;
[0021] Figure 2 It is a schematic diagram of the front structure of the present invention;
[0022] Figure 3 Schematic diagram of the internal structure of the casing of the present invention;
[0023] Figure 4 This is a schematic diagram of the overall structure of the circulating cooling unit of the present invention;
[0024] Figure 5 Schematic diagram of the internal structure of the circular cover of the present invention;
[0025] Figure 6 For the present invention Figure 5 Schematic diagram of the back structure;
[0026] Figure 7 Schematic diagram of the internal structure of the first circulation cavity and the second circulation cavity of the present invention;
[0027] Figure 8 For the present invention Figure 7 Schematic diagram of the back structure;
[0028] Figure 9 Schematic diagram of the structure of the arc groove of the present invention.
[0029] The reference numerals indicate:
[0030] 1. Bracket; 2. Support column; 3. Strut; 4. Casing; 5. Round cover; 6. Partition plate; 7. Heat conduction plate; 8. First circulation chamber; 9. Second circulation chamber; 10. Heat dissipation chamber; 11. Circulation cooling element; 12. Secondary heat dissipation element; 13. Driving motor; 14. Driving element; 15. Disc; 16. Slide; 17. Reciprocating spring; 18. Slide; 19. Pipe fitting; 20. First circulation pipe; 21. First through pipe; 22. Second circulation pipe; 23. Second through pipe; 24. Round channel; 25. Mounting shaft; 26. Heat conduction fan; 27. Inner air outlet; 28. Outer air guide; 29. Outer air outlet; 30. Air supply outlet; 31. Exhaust outlet; 32. Air guide duct; 33. Arc groove. DETAILED DESCRIPTION
[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.
[0033] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.
[0034] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.
[0035] See also Figures 1-9As shown, according to embodiment 1 of the present invention, a dual-circulation heat dissipation all-in-one computer is provided, comprising: a bracket 1, a support column 2 being fixedly connected to the top side of the bracket 1, a plurality of support rods 3 being fixedly connected to the sides of the support column 2, a plurality of support rods 3 being fixedly connected to a housing 4, a circular cover 5 being fixedly connected to a side of the housing 4 close to the bracket 1, a partition plate 6 being fixedly connected to the inner peripheral side wall of the circular cover 5, a heat conducting plate 7 being provided between the partition plate 6 and a side of the housing 4 close to the support column 2, and the heat conducting plate 7 being fixedly connected to the inner peripheral side of the circular cover 5;
[0036] The partition plate 6 and the heat conducting plate 7 divide the circular cover 5 from one side to the other into a first circulation chamber 8, a second circulation chamber 9 and a heat dissipation chamber 10. Circulation cooling elements 11 are provided on both sides of the partition plate 6 for cooling the circuit boards in the housing 4.
[0037] A secondary heat sink 12 is provided on the side of the heat conducting plate 7 away from the partition plate 6 for dissipating heat from the inside of the housing 4 and the circulating cooling element 11;
[0038] A driving member 14 is provided on the top of the support column 2 for driving the circulating cooling member 11 and the secondary heat dissipation member 12 .
[0039] In this embodiment, reference Figure 1 , the components of the all-in-one computer can be set in the housing 4, refer to Figure 3 and Figure 5 The circulating cooling element 11, the first circulating chamber 8 and the second circulating chamber 9 are all filled with coolant. The circulating cooling element 11 is driven by the driving element 14, and the coolant will flow out of the first circulating chamber 8 to cool the computer components, and then flow into the second circulating chamber 9 to perform heat exchange using the secondary heat sink 12, and then dissipate heat for another part of the computer components. In addition, the secondary heat sink 12 can also synchronously perform heat exchange on the first circulating chamber 8 and the second circulating chamber 9, further reducing the temperature in the first circulating chamber 8 and the second circulating chamber 9, and avoiding overheating of the first circulating chamber 8 and the second circulating chamber 9 due to long-term operation.
[0040] In a further preferred embodiment of the present invention, Figure 6 and Figure 7 As shown, the circulating cooling part 11 includes two discs 15, which are rotatably connected to the two opposite sides of the partition plate 6 and are eccentrically arranged. A number of slide grooves 16 are opened on the outer peripheral side of the disc 15, and a reciprocating spring 17 is fixedly connected to the inner side wall of the slide groove 16. The end of the reciprocating spring 17 is fixedly connected to a slide rod 18, and the slide rod 18 is slidably connected in the slide groove 16. The end of the slide rod 18 is in contact with the inner peripheral side wall of the circular cover 5, and a pipeline part 19 is provided on the outer peripheral side of the circular cover 5.
[0041] In this embodiment, reference Figure 6and Figure 7 A disc 15 is provided in both the first circulation chamber 8 and the second circulation chamber 9. The two discs 15 are rotatably connected to the two sides of the partition plate 6. The driving member 14 drives the secondary heat sink 12 while also driving the two discs 15 to rotate. When the disc 15 rotates, it will drive several slide rods 18 to rotate. At the same time, the disc 15 is eccentrically arranged on the partition plate 6. Therefore, as the disc 15 rotates, the hydraulic oil starts to be output at the position where the slide rod 18 is squeezed and moved by the inner wall of the circular cover, and the suction work is performed when the slide rod 18 is pushed out by the reciprocating spring 17.
[0042] In a further preferred embodiment of the present invention, Figure 4 and Figure 6 As shown, the pipe member 19 includes a first circulation pipe 20, which is fixedly connected to the outer peripheral side of the circular cover 5 and communicated with the output position of the first circulation chamber 8. The first circulation pipe 20 is arranged in a reciprocating manner and its end extends to the bottom of the circular cover 5. The end of the first circulation pipe 20 is fixedly connected to a first through pipe 21, and the end of the first through pipe 21 is communicated with the suction position of the second circulation pipe 22;
[0043] The outer peripheral side of the circular cover 5 is also fixedly connected to a second circulation pipe 22, and is connected to the output position of the first circulation chamber 8. The second circulation pipe 22 is arranged in a reciprocating shape, and the end extends to the top of the circular cover 5. The end of the second circulation pipe 22 is fixedly connected to a second through pipe 23, and the bottom end of the second through pipe 23 is connected to the suction position of the second circulation chamber 9.
[0044] In this embodiment, reference Figure 4 and Figure 6 When the disk 15 rotates, it drives the slide bar 18 to reciprocate, and its output position is connected to the first circulation pipe 20, transporting the coolant into the first circulation pipe 20, and then the first circulation pipe 20 cools the circuit board in the casing 4. After the temperature of the circuit board is reduced, the various components will be cooled to avoid affecting the normal operation of the computer all-in-one. Then the coolant in the first circulation pipe 20 will be transported from the position of the first through-pipe 21 to the suction end position of the second circulation chamber 9, so that the coolant can flow quickly and take away the heat quickly, entering the second circulation chamber 9. When the disk 15 in the second circulation chamber 9 rotates, the coolant will be transported to the second circulation pipe 22 by the reciprocating motion of the slide bar 18. The second circulation pipe 22 will cool down and dissipate heat at another position of the circuit board in the casing 4, and then transport it to the second through-pipe 23, and then input from the suction end of the first circulation chamber 8, so that the coolant can undergo two heat exchange processes after the secondary circulation, avoiding the coolant temperature being too high during the cooling process, thereby affecting the heat dissipation of the circuit board and computer components.
[0045] In a further preferred embodiment of the present invention, Figure 5As shown, the secondary heat dissipation element 12 includes a circular channel 24, which is fixedly connected to the side of the heat conducting plate 7 away from the partition plate 6 and is coaxially arranged with the disc 15. A mounting shaft 25 is provided in the middle of the circular cover, and the mounting shaft 25 is fixedly connected to the side of the heat conducting plate 7. A heat conducting fan 26 is fixedly connected to the outer peripheral side of the mounting shaft 25. An inner air outlet 27 is provided on the outer peripheral side of the circular channel 24. The side of the circular channel 24 close to the support column 2 is closed, and an outer air guide 28 is also provided on the outer peripheral side of the circular cover 5.
[0046] In this embodiment, reference Figure 5 The circular channel 24 is fixedly connected to the side of the heat conducting plate 7 away from the partition plate 6, and is coaxially arranged with the disc 15. The mounting shaft 25 is fixedly connected to the heat conducting plate 7, and the heat conducting fan 26 is fixedly connected to the outer peripheral side of the mounting shaft 25. The heat conducting fan 26 is a worm gear fan, which can draw air from all sides and output it from the front. The air in the circular cover 5 is extracted by the inner air outlet 27 to dissipate heat inside the circular cover 5. At the same time, the air in the casing 4 is extracted by the air guide, and the external air is allowed to enter the casing 4 for heat exchange, thereby achieving the effect of further dissipating heat inside the casing 4.
[0047] In a further preferred embodiment of the present invention, Figure 1 and Figure 5 As shown, the outer air guide 28 includes a number of outer air outlets 29, which are distributed in a circular array on the outer peripheral side of the circular cover 5 and are connected to the heat dissipation cavity 10. An air supply port 30 is provided on the side wall of the casing 4, and an exhaust port 31 is provided on the side of the casing 4 and at the position of the support column 2.
[0048] In this embodiment, reference Figure 1 and Figure 5 , on the outer peripheral side of the circular cover 5 and at the position of the heat dissipation cavity 10, so that when the heat conduction fan 26 rotates, it can use the external air outlet 29 to extract the hot air in the casing 4, and the air outside the casing 4 will enter the interior of the casing 4 from the position of the external air outlet 29, thereby accelerating the air circulation inside the casing 4, achieving the effect of accelerated ventilation, and then the hot air inside the casing 4 is discharged from the position of the air supply port 30, and the hot air is discharged to achieve the heat dissipation effect.
[0049] In a further preferred embodiment of the present invention, Figure 3 and Figure 5 As shown, an air duct 32 is fixedly installed on the inner wall of the casing 4, and the end of the air duct 32 extends to the outer peripheral side of the circular cover 5, and the end of the air duct 32 is connected to the corresponding external air outlet 29, and the end of the air duct 32 is in contact with the outer peripheral side of the first circulation chamber 8.
[0050] In this embodiment, reference Figure 3 and Figure 5 An air duct 32 is fixedly connected to the inner wall of the casing 4. When the heat-conducting fan 26 rotates to extract air, one of the external air outlets 29 will draw air from the air duct 32, so that the internal air directly flushes the outer wall of the first circulation chamber 8, and then enters the circular channel 24, further dissipating the heat of the first circulation chamber 8, so as to facilitate heat exchange treatment of the coolant in the first circulation chamber 8, thereby avoiding the cooling oil temperature in the first circulation chamber 8 being too high, thereby affecting the subsequent cooling of the circuit boards and components in the casing 4.
[0051] In a further preferred embodiment of the present invention, Figure 9 As shown, an arcuate groove 33 is opened in the outer peripheral side wall of the circular cover 5, and the arcuate groove 33 is communicated with the air guide pipe 32 and the corresponding external air outlet 29 respectively.
[0052] In this embodiment, reference Figure 9 The air duct 32 transports air to the position of the arc groove 33, allowing the air to enter the arc groove 33 and then be discharged from the corresponding external air port 29. After the coolant is drawn into the first circulation chamber 8, the air in the air duct 32 is further used for heat exchange, thereby reducing the temperature of the coolant, thereby cooling the circuit boards and components in the housing 4.
[0053] In addition, the outer wall of the air duct 32 is coated with a heat-insulating coating or wrapped with a heat-insulating layer. The heat-insulating layer can be made of heat-insulating cotton, glass fiber and other materials, so that external air can be directly input into the arc groove 33 to cool the coolant in the first circulation chamber 8.
[0054] In a further preferred embodiment of the present invention, Figure 3 and Figure 5 As shown, the driving member 14 includes a driving motor 13, which is fixedly connected to the top of the support column 2, and the motor shaft of the driving motor 13 is fixedly connected to the mounting shaft 25, and the end portion extends into the first circulation chamber 8 and is fixedly connected to the two discs 15 respectively, and the motor shaft of the driving motor 13 is rotatably connected to the heat conducting plate 7 and the partition plate 6.
[0055] In this embodiment, reference Figure 3 and Figure 5 The driving motor 13 drives the mounting shaft 25 to rotate. At the same time, the motor shaft of the driving motor 13 extends to the turntable, passes through the first disc 15 and is inserted into the second disc 15, and is fixedly connected to the two discs 15, so that the driving motor 13 can directly drive the mounting shaft 25 and the two discs 15 to rotate when working, so that the air cooling and liquid cooling work synchronously and cooperate with each other, thereby facilitating the cooling of the circuit boards and components in the casing 4.
[0056] Working principle: When the driving motor 13 is working, it can directly drive the mounting shaft 25 and the two discs 15 to rotate;
[0057] The cooling liquid is then fed into the first circulation pipe 20 and the cooling liquid is fed into the second circulation pipe 22. The cooling liquid is fed into the second circulation pipe 22 and the cooling liquid is fed into the second circulation pipe 22. The cooling liquid is fed into the second circulation pipe 22 and the cooling liquid is fed into the second circulation pipe 22. The cooling liquid is fed into the second circulation pipe 22 and the cooling liquid is fed into the second circulation pipe 22. The cooling liquid is fed into the second circulation pipe 22 and the cooling liquid is fed into the second circulation pipe 22. The cooling liquid is fed into the second circulation pipe 22 and the cooling liquid is fed into the second circulation pipe 22. The cooling liquid is fed into the second circulation pipe 22 and the cooling liquid is fed into the second circulation pipe 22. The cooling liquid is fed into the second circulation pipe 22 and the cooling liquid is fed into the second circulation pipe 22. The cooling liquid is fed into the second circulation pipe 22 and the cooling liquid is fed into the second circulation pipe 22. The cooling liquid is fed into the second circulation pipe 23 and the cooling liquid is fed into the first circulation pipe 8. The cooling liquid is fed into the second circulation pipe 22 and the cooling liquid is fed into the second circulation pipe 22.
[0058] When the driving motor 13 synchronously drives the mounting shaft 25 to rotate, it will drive the heat conduction fan 26 to rotate, so that it can draw air from all sides and output it from the front. The air in the circular cover 5 is drawn by the internal air outlet 27 to dissipate heat inside the circular cover 5. At the same time, the air in the casing 4 is drawn by the air guide, and the external air is allowed to enter the casing 4 for heat exchange, thereby achieving the effect of further dissipating heat inside the casing 4.
[0059] It is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous methods can be freely combined and superimposed.
[0060] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention. The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art may make various improvements and variations without departing from the technical principles of the present invention, and such improvements and variations shall also be considered within the scope of protection of the present invention.
Claims
1. A dual-circulation heat dissipation all-in-one computer, characterized in that: include: A bracket (1), wherein the top side of the bracket (1) is fixedly connected to a support column (2), a plurality of support rods (3) are fixedly connected to the side of the support column (2), a plurality of support rods (3) are fixedly connected to a housing (4), a circular cover (5) is fixedly connected to a side of the housing (4) close to the bracket (1), a partition plate (6) is fixedly connected to the inner peripheral side wall of the circular cover (5), a heat conducting plate (7) is provided between the partition plate (6) and a side of the housing (4) close to the support column (2), and the heat conducting plate (7) is fixedly connected to the inner peripheral side of the circular cover (5); The partition plate (6) and the heat conducting plate (7) divide the circular cover (5) from one side to the other into a first circulation chamber (8), a second circulation chamber (9) and a heat dissipation chamber (10), and both sides of the partition plate (6) are provided with circulation cooling members (11) for cooling the circuit board in the housing (4); A secondary heat sink (12) is provided on one side of the heat conducting plate (7) away from the partition plate (6) for dissipating heat from the inside of the housing (4) and the circulating cooling element (11); A driving member (14) is provided on the top of the support column (2) for driving the circulating cooling member (11) and the secondary heat dissipation member (12).
2. The dual-circulation heat dissipation all-in-one computer according to claim 1, characterized in that: The circulating cooling part includes two discs (15), which are rotatably connected to two opposite sides of the partition plate (6) and are eccentrically arranged. A number of slide grooves (16) are opened on the outer peripheral side of the disc (15), and a reciprocating spring (17) is fixedly connected to the inner side wall of the slide groove (16). The end of the reciprocating spring (17) is fixedly connected to a slide rod (18). The slide rod (18) is slidably connected in the slide groove (16), and the end of the slide rod (18) is in contact with the inner peripheral side wall of the circular cover (5). A pipeline part (19) is arranged on the outer peripheral side of the circular cover (5).
3. The dual-circulation heat dissipation all-in-one computer according to claim 2, characterized in that: The pipeline member (19) includes a first circulation pipe (20), the first circulation pipe (20) is fixedly connected to the outer peripheral side of the circular cover (5) and communicated with the output position of the first circulation chamber (8), the first circulation pipe (20) is arranged in a reciprocating manner and the end portion extends to the bottom of the circular cover (5), the end portion of the first circulation pipe (20) is fixedly connected to the first through pipe (21), and the end portion of the first through pipe (21) is communicated with the suction position of the second circulation pipe (22); A second circulation pipe (22) is fixedly connected to the outer peripheral side of the circular cover (5) and is communicated with the output position of the first circulation chamber (8). The second circulation pipe (22) is arranged in a reciprocating shape, and its end extends to the top of the circular cover (5). The end of the second circulation pipe (22) is fixedly connected to a second through pipe (23), and the bottom end of the second through pipe (23) is communicated with the suction position of the second circulation chamber (9).
4. The dual-circulation heat dissipation all-in-one computer according to claim 3, characterized in that: The secondary heat sink (12) includes a circular channel (24), which is fixedly connected to the side of the heat conducting plate (7) away from the partition plate (6) and is coaxially arranged with the disc (15). A mounting shaft (25) is provided in the middle of the circular cover, which is fixedly connected to the side of the heat conducting plate (7). A heat conducting fan (26) is fixedly connected to the outer peripheral side of the mounting shaft (25). An inner air outlet (27) is provided on the outer peripheral side of the circular channel (24). The side of the circular channel (24) close to the support column (2) is closed. An outer air guide (28) is also provided on the outer peripheral side of the circular cover (5).
5. The dual-circulation heat dissipation all-in-one computer according to claim 4, characterized in that: The outer air guide member (28) includes a plurality of outer air ports (29), which are distributed in an annular array and opened on the outer peripheral side of the circular cover (5) and are connected to the heat dissipation cavity (10). An air supply port (30) is opened on the side wall of the housing (4), and an exhaust port (31) is opened on the side of the housing (4) and located at the position of the support column (2).
6. The dual-circulation heat dissipation all-in-one computer according to claim 5, characterized in that: An air duct (32) is fixedly mounted on the inner wall of the housing (4), the end of the air duct (32) extending to the outer peripheral side of the circular cover (5), the end of the air duct (32) communicating with the corresponding outer air outlet (29), and the end of the air duct (32) abutting against the outer peripheral side of the first circulation chamber (8).
7. The dual-circulation heat dissipation all-in-one computer according to claim 6, characterized in that: An arcuate groove (33) is provided in the outer peripheral side wall of the circular cover (5), and the arcuate groove (33) is respectively communicated with the air guide pipe (32) and the corresponding external air outlet (29).
8. The dual-circulation heat dissipation all-in-one computer according to claim 7, characterized in that: The driving member (14) includes a driving motor (13), which is fixedly connected to the top of the support column (2). The motor shaft of the driving motor (13) is fixedly connected to the mounting shaft (25), and the end portion extends into the first circulation chamber (8) and is fixedly connected to the two discs (15) respectively. The motor shaft of the driving motor (13) is rotatably connected to the heat conducting plate (7) and the partition plate (6).
Citation Information
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