Double-cycle heat dissipation all-in-one computer
By combining a dual-circulation cooling system and a heat-conducting fan, the problem of coolant temperature rising in the flow channel is solved, achieving efficient heat dissipation for the all-in-one computer and ensuring the normal operation of components.
Patent Information
- Application Number
- CN202510880884.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-27
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2045-06-27
AI Technical Summary
The coolant in existing all-in-one computers gradually heats up in the flow channel, leading to poor heat dissipation for subsequent components.
The system employs a dual-circulation cooling system, which divides the interior of the casing into a first circulation chamber and a second circulation chamber via a partition plate. The coolant is circulated in a dual-circulation manner using a drive component and a secondary heat dissipation component. Heat is exchanged using a heat-conducting plate and a heat-conducting fan, forming a dual-circulation cooling path.
This improves heat dissipation, preventing the coolant temperature from rising and affecting the heat dissipation of subsequent components, thus ensuring the normal operation of the all-in-one computer.
Smart Images

Figure CN120704494B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure belongs to the technical field of dual-circulation all-in-one computer, and particularly relates to a dual-circulation all-in-one computer. BACKGROUND
[0002] The all-in-one computer is a computer in which a host and a display are synchronized in one casing, and internal CPU, memory and other components are arranged in the casing similar to the display. When the all-in-one computer is used, it is convenient to carry, and only the display needs to be packed up to take away, without the need to additionally install a host.
[0003] The elements in the all-in-one computer are installed relatively compactly, and therefore a heat dissipation component needs to be installed in the casing to perform heat dissipation work. In use, the air duct or liquid cooling flow channel of the existing heat dissipation component mainly flows and dissipates heat from the components in the all-in-one computer at the output position, and then is retransported to the cooling mechanism to be cooled. This cooling method is prone to cause the cooling liquid to gradually heat up in the flow channel, and then the temperature rises when flowing to the middle of the pipeline, affecting the heat dissipation of the subsequent elements. SUMMARY
[0004] Therefore, the technical problem to be solved by the present application is to provide a dual-circulation all-in-one computer, which can solve the problem that the cooling liquid gradually heats up in the flow channel, and then the temperature rises when flowing to the middle of the pipeline, affecting the heat dissipation of the subsequent elements.
[0005] To solve the above problems, the present application provides a dual-circulation all-in-one computer, comprising: a support, the top side of the support is fixedly connected with a support column, the side of the support column is fixedly connected with a plurality of support rods, the plurality of support rods are fixedly connected with a casing, the side of the casing close to the support is fixedly connected with a circular cover, the inner circumferential side wall of the circular cover is fixedly connected with a partition plate, the partition plate and the side of the casing close to the support column are provided with a heat conduction plate, and the heat conduction plate is fixedly connected with the inner circumferential side of the circular cover.
[0006] The partition plate and the heat conduction plate divide the circular cover from one side to the other side into a first circulation cavity, a second circulation cavity and a heat dissipation cavity, respectively, and the two side sides of the partition plate are provided with a circulating cooling element for cooling the circuit board in the casing.
[0007] The side of the heat conduction plate away from the partition plate is provided with a secondary heat dissipation element for dissipating heat in the casing and the circulating cooling element.
[0008] The top of the support column is provided with a driving element for driving the circulating cooling element and the secondary heat dissipation element.
[0009] Further, the circulating cooling member comprises two discs rotationally connected to opposite sides of the partition plate and eccentrically arranged, a plurality of sliding grooves are formed on the outer periphery of the disc, a reciprocating spring is fixedly connected to the inner side wall of the sliding groove, the end of the reciprocating spring is fixedly connected with a sliding rod, the sliding rod is slidingly connected in the sliding groove, the end of the sliding rod is attached to the inner periphery wall of the circular cover, and a pipeline member is arranged on the outer periphery of the circular cover.
[0010] Further, the pipeline member comprises a first circulating pipe fixedly connected to the outer periphery of the circular cover and communicated with the output position of the first circulating cavity, the first circulating pipe is arranged in a reciprocating manner and the end thereof extends below the circular cover, and the end of the first circulating pipe is fixedly connected with a first through pipe communicated with the suction position of the second circulating pipe.
[0011] The outer periphery of the circular cover is also fixedly connected with a second circulating pipe communicated with the output position of the first circulating cavity, the second circulating pipe is arranged in a reciprocating manner and the end thereof extends above the circular cover, the end of the second circulating pipe is fixedly connected with a second through pipe communicated with the suction position of the second circulating cavity.
[0012] Further, the secondary heat dissipation member comprises a circular channel fixedly connected to the side of the heat conduction plate away from the partition plate and coaxially arranged with the disc, a mounting shaft is arranged in the middle of the circular cover and fixedly connected with the side of the heat conduction plate, a heat conduction fan is fixedly connected to the outer periphery of the mounting shaft, an inner air inlet is formed on the outer periphery of the circular channel, the side of the circular channel close to the support column is closed, and an outer air guide member is arranged on the outer periphery of the circular cover.
[0013] Further, the outer air guide member comprises a plurality of outer air inlets arranged in an annular array on the outer periphery of the circular cover and communicated with the heat dissipation cavity, an air inlet is formed on the side wall of the casing, and an exhaust port is formed on the side of the casing at the position of the support column.
[0014] Further, a wind guide pipe is fixedly installed on the inner side wall of the casing, the end of the wind guide pipe extends to the position of the outer periphery of the circular cover, the end of the wind guide pipe is communicated with the corresponding outer air inlet, and the end of the wind guide pipe is attached to the outer periphery of the first circulating cavity.
[0015] Further, an arc-shaped groove is formed in the inner periphery wall of the circular cover and communicated with the wind guide pipe and the corresponding outer air inlet.
[0016] Further, the driving member comprises a driving motor fixedly connected to the top of the support column, the motor shaft of the driving motor is fixedly connected with the mounting shaft and extends into the first circulating cavity to be fixedly connected with the two discs, and the motor shaft of the driving motor is rotationally connected with the heat conduction plate and the partition plate.
[0017] In summary, the present application includes at least one of the following beneficial technical effects:
[0018] 1. The double-circulation heat dissipation all-in-one computer can directly re-deliver the cooling liquid cooled by a part of components to the circular cover for cooling, and then perform heat dissipation work on the remaining components, so that the cooling liquid circulates in the double pipeline, achieving the purpose of double circulation, thereby improving the heat dissipation effect and avoiding the temperature rise of the cooling liquid after cooling a part of components, which affects the heat dissipation effect on subsequent components.
[0019] 2. The double-circulation heat dissipation all-in-one computer is provided with a wind guide pipe fixedly connected to the inner wall of the shell. When the heat dissipation fan rotates to draw air, one of the outer air inlets draws air in the wind guide pipe, so that the internal air directly flushes the outer wall of the first circulation cavity and then enters the circular channel to further perform heat dissipation work on the first circulation cavity, so as to perform heat exchange treatment on the cooling liquid in the first circulation cavity, avoid the temperature of the cooling oil in the first circulation cavity being too high, and thereby affect the subsequent cooling work on the circuit board and components in the shell. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 is a schematic view of the overall structure of the present application;
[0021] Figure 2 is a schematic view of the front structure of the present application;
[0022] Figure 3 is a schematic view of the internal structure of the shell of the present application;
[0023] Figure 4 is a schematic view of the overall structure of the circulation cooling member of the present application;
[0024] Figure 5 is a schematic view of the internal structure of the circular cover of the present application;
[0025] Figure 6 is a schematic view of the back structure of the present application; Figure 5
[0026] Figure 7 is a schematic view of the internal structure of the first circulation cavity and the second circulation cavity of the present application;
[0027] Figure 8 is a schematic view of the back structure of the present application; Figure 7
[0028] Figure 9 is a schematic view of the structure of the arc-shaped groove of the present application.
[0029] The reference signs are as follows:
[0030] 1, support; 2, support column; 3, brace; 4, cabinet; 5, circular cover; 6, partition plate; 7, heat conduction plate; 8, first circulating cavity; 9, second circulating cavity; 10, heat dissipation cavity; 11, circulating cooling piece; 12, secondary heat dissipation piece; 13, driving motor; 14, driving piece; 15, disc; 16, chute; 17, reciprocating spring; 18, sliding rod; 19, pipeline piece; 20, first circulating pipe; 21, first through pipe; 22, second circulating pipe; 23, second through pipe; 24, circular channel; 25, mounting shaft; 26, heat conduction fan; 27, inner air inlet; 28, outer air guide piece; 29, outer air inlet; 30, air outlet; 31, exhaust port; 32, air guide pipe; 33, arc-shaped groove. DETAILED DESCRIPTION
[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0032] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0033] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0034] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings, it should be understood that the preferred embodiments described herein are only for the purpose of description and explanation of the present application, and are not intended to limit the present application.
[0035] For reference Figures 1-9As shown, according to the embodiment 1 of the present application, a double-cycle heat dissipation all-in-one computer is provided, comprising: a support 1, the top side of the support 1 is fixedly connected with a support column 2, the side of the support column 2 is fixedly connected with a plurality of support rods 3, the plurality of support rods 3 are fixedly connected with a machine shell 4, the side of the machine shell 4 close to the support 1 is fixedly connected with a circular cover 5, the inner circumferential side wall of the circular cover 5 is fixedly connected with a partition plate 6, the partition plate 6 and the side of the machine shell 4 close to the support column 2 are provided with a heat conduction plate 7, and the heat conduction plate 7 is fixedly connected with the inner circumferential side of the circular cover 5.
[0036] The partition plate 6 and the heat conduction plate 7 divide the circular cover 5 from one side to the other side into a first circulation cavity 8, a second circulation cavity 9 and a heat dissipation cavity 10, and the two side edges of the partition plate 6 are provided with a circulation cooling member 11 for cooling the circuit board in the machine shell 4.
[0037] The side of the heat conduction plate 7 away from the partition plate 6 is provided with a secondary heat dissipation member 12 for heat dissipation of the machine shell 4 and the circulation cooling member 11.
[0038] The top of the support column 2 is provided with a driving member 14 for driving the circulation cooling member 11 and the secondary heat dissipation member 12.
[0039] In the embodiment, referring to Figure 1 , the elements in the all-in-one computer can be arranged in the machine shell 4, referring to Figure 3 and Figure 5 , the circulation cooling member 11, the first circulation cavity 8 and the second circulation cavity 9 are filled with cooling liquid, and the circulation cooling member 11 is driven by the driving member 14, so that the cooling liquid flows out of the first circulation cavity 8 to cool the computer elements, and then flows to the second circulation cavity 9 to perform heat exchange work by the secondary heat dissipation member 12 to cool another part of the computer elements, and the secondary heat dissipation member 12 can also perform heat exchange work in the first circulation cavity 8 and the second circulation cavity 9 at the same time, so as to further reduce the temperature in the first circulation cavity 8 and the second circulation cavity 9, and avoid overheating of the first circulation cavity 8 and the second circulation cavity 9 due to long-time work.
[0040] In a further preferred embodiment of the present application, as shown in Figure 6 and Figure 7 , the circulation cooling member 11 comprises two discs 15, the two discs 15 are eccentrically connected to the opposite two side edges of the partition plate 6, the outer circumferential side of the disc 15 is provided with a plurality of sliding grooves 16, the inner side wall of the sliding groove 16 is fixedly connected with a reciprocating spring 17, the end of the reciprocating spring 17 is fixedly connected with a sliding rod 18, the sliding rod 18 is slidingly connected in the sliding groove 16, the end of the sliding rod 18 is attached to the inner circumferential side wall of the circular cover 5, and the outer circumferential side of the circular cover 5 is provided with a pipeline member 19.
[0041] In the embodiment, referring to Figure 6And Figure 7 In the first circulation cavity 8 and the second circulation cavity 9, a disc 15 is arranged, and the two discs 15 are respectively rotationally connected to two side edges of the partition plate 6. The driving member 14 drives the secondary heat dissipation member 12 and also drives the two discs 15 to rotate. When the disc 15 rotates, a plurality of slide rods 18 are rotated. The disc 15 is eccentrically arranged on the partition plate 6, so that the position of the hydraulic oil starts to output when the slide rod 18 is extruded and moved by the inner wall of the circular cover, and the slide rod 18 is inhaled when being pushed out by the reciprocating spring 17.
[0042] In a further preferred embodiment of the present application, as shown in Figure 4 And Figure 6 The pipeline member 19 comprises a first circulation pipe 20, which is fixedly connected to the outer circumferential side of the circular cover 5 and is in communication with the output position of the first circulation cavity 8. The first circulation pipe 20 is arranged in a reciprocating manner and extends to the lower side of the circular cover 5. The end of the first circulation pipe 20 is fixedly connected with a first through pipe 21, and the end of the first through pipe 21 is in communication with the inhaling position of the second circulation pipe 22.
[0043] The outer circumferential side of the circular cover 5 is also fixedly connected with the second circulation pipe 22, which is in communication with the output position of the first circulation cavity 8. The second circulation pipe 22 is arranged in a reciprocating manner and extends to the upper side of the circular cover 5. The end of the second circulation pipe 22 is fixedly connected with a second through pipe 23, and the bottom end of the second through pipe 23 is in communication with the inhaling position of the second circulation cavity 9.
[0044] In the present embodiment, as shown in Figure 4 And Figure 6 When the disc 15 rotates, the slide rod 18 is driven to reciprocate, and the output position thereof is in communication with the first circulation pipe 20, so that the cooling liquid is delivered into the first circulation pipe 20. Then, the first circulation pipe 20 cools the circuit board in the machine shell 4. After the temperature of the circuit board is reduced, the temperature of each element is also reduced, so that the normal work of the all-in-one computer is not affected. Then, the cooling liquid in the first circulation pipe 20 is delivered from the position of the first through pipe 21 to the inhaling end position of the second circulation cavity 9, so that the cooling liquid can quickly flow and quickly take away the heat to enter the second circulation cavity 9. When the disc 15 in the second circulation cavity 9 rotates, the cooling liquid is delivered into the second circulation pipe 22 by the reciprocating movement of the slide rod 18. The second circulation pipe 22 cools another position of the circuit board in the machine shell 4. Then, the cooling liquid is delivered into the second through pipe 23 and is input from the inhaling end of the first circulation cavity 8, so that the cooling liquid can be subjected to twice heat exchange by twice circulation, thereby avoiding that the temperature of the cooling liquid is too high in the cooling process and affecting the heat dissipation work of the circuit board and the computer elements.
[0045] In a further preferred embodiment of the present application, as shown in Figure 5As shown, the secondary heat dissipation member 12 includes a circular channel 24 fixedly connected to the heat conduction plate 7 away from the partition plate 6, and coaxially arranged with the disc 15, the middle part of the circular cover is provided with a mounting shaft 25 fixedly connected with the side of the heat conduction plate 7, the outer periphery of the mounting shaft 25 is fixedly connected with a heat conduction fan 26, the outer periphery of the circular channel 24 is provided with an inner air inlet 27, and the side of the circular channel 24 close to the support column 2 is provided with a circular cover 5.
[0046] In this embodiment, as shown in Figure 5 , the circular channel 24 is fixedly connected to the heat conduction plate 7 away from the partition plate 6, and coaxially arranged with the disc 15, the mounting shaft 25 is fixedly connected to the heat conduction plate 7, and the outer periphery of the mounting shaft 25 is fixedly connected with the heat conduction fan 26, the heat conduction fan 26 is arranged as a worm gear fan, which can extract air from all around and output from the front, and the inner air inlet 27 is used to extract air in the circular cover 5, and the air in the circular cover 5 is dissipated, and the air in the casing 4 is extracted by the air guide member, and the external air enters the casing 4 to exchange heat, so as to further dissipate heat in the casing 4.
[0047] In further preferred embodiments of the present application, as shown in Figure 1 and Figure 5 , the outer air guide member 28 includes a plurality of outer air inlets 29 arranged in a ring array on the outer periphery of the circular cover 5 and communicated with the heat dissipation cavity 10, the side wall of the casing 4 is provided with an air inlet 30, and the side of the casing 4 and located at the position of the support column 2 is provided with an air outlet 31.
[0048] In this embodiment, as shown in Figure 1 and Figure 5 , the outer periphery of the circular cover 5 and located at the position of the heat dissipation cavity 10, so that the heat conduction fan 26 can extract hot air in the casing 4 by the outer air inlet 29 when rotating, and the air outside the casing 4 will enter the casing 4 from the position of the outer air inlet 29, so as to accelerate the air circulation in the casing 4, so as to accelerate the ventilation effect, and then the hot air in the casing 4 is discharged from the position of the air inlet 30, so as to achieve the heat dissipation effect.
[0049] In further preferred embodiments of the present application, as shown in Figure 3 and Figure 5 , the inner side wall of the casing 4 is fixedly provided with an air guide pipe 32, the end of the air guide pipe 32 extends to the outer periphery of the circular cover 5, and the end of the air guide pipe 32 is communicated with the corresponding outer air inlet 29, and the end of the air guide pipe 32 is attached to the outer periphery of the first circulation cavity 8.
[0050] In this embodiment, as shown in Figure 3 andFigure 5 The inner wall of the shell 4 is fixedly connected with the air guide pipe 32. When the heat conduction fan 26 rotates to draw air, one of the outer air inlets 29 draws air in the air guide pipe 32, so that the internal air directly flushes the outer wall of the first circulation cavity 8 and then enters the circular channel 24, further performs heat dissipation on the first circulation cavity 8, and performs heat exchange on the cooling liquid in the first circulation cavity 8, so as to avoid that the temperature of the cooling liquid in the first circulation cavity 8 is too high, and then affects the cooling of the circuit board and elements in the shell 4.
[0051] In a further preferred embodiment of the present application, as shown in Figure 9 , the outer peripheral wall of the circular cover 5 is provided with an arc-shaped groove 33, and the arc-shaped groove 33 is in communication with the air guide pipe 32 and the corresponding outer air inlet 29.
[0052] In this embodiment, referring to Figure 9 , the air guide pipe 32 delivers air to the position of the arc-shaped groove 33, so that the air can enter the arc-shaped groove 33 and then be discharged from the corresponding outer air inlet 29. After the cooling liquid is drawn into the first circulation cavity 8, the air in the air guide pipe 32 is used for further heat exchange, so as to reduce the temperature of the cooling liquid, and then the circuit board and elements in the shell 4 are cooled.
[0053] In addition, the outer wall of the air guide pipe 32 is coated with a heat insulation coating or wrapped with a heat insulation layer. The heat insulation layer can be made of heat insulation cotton, glass fiber or the like. In this way, the external air can be directly input into the arc-shaped groove 33 to cool the cooling liquid in the first circulation cavity 8.
[0054] In a further preferred embodiment of the present application, as shown in Figure 3 and Figure 5 , the driving member 14 comprises a driving motor 13. The driving motor 13 is fixedly connected to the top of the support column 2. The motor shaft of the driving motor 13 is fixedly connected with the mounting shaft 25, and the end portion extends into the first circulation cavity 8 and is fixedly connected with the two discs 15. The motor shaft of the driving motor 13 is rotatably connected with the heat conduction plate 7 and the partition plate 6.
[0055] In this embodiment, referring to Figure 3 and Figure 5 , the driving motor 13 drives the mounting shaft 25 to rotate. The motor shaft of the driving motor 13 extends to the rotating disc, penetrates through the first disc 15 and is inserted into the second disc 15, and is fixedly connected with the two discs 15. In this way, when the driving motor 13 works, the mounting shaft 25 and the two discs 15 can be directly driven to rotate. The air cooling and liquid cooling are synchronized to work and cooperate with each other, so as to cool the circuit board and elements in the shell 4.
[0056] Working principle: the driving motor 13 can directly drive the installation shaft 25 and the two discs 15 to rotate when working;
[0057] Wherein, when the disc 15 rotates, it drives the slide rod 18 to reciprocate, and the output position thereof is communicated with the first circulating pipe 20, so that the cooling liquid is delivered into the first circulating pipe 20, and then the first circulating pipe 20 cools the circuit board in the machine shell 4, and the temperature of the circuit board is reduced, so that each element is cooled, avoiding affecting the normal work of the all-in-one computer, and then the cooling liquid in the first circulating pipe 20 is delivered from the position of the first circulating pipe 21 to the suction end position of the second circulating cavity 9, so that the cooling liquid can flow quickly and take away heat quickly, and enter the second circulating cavity 9, and when the disc 15 in the second circulating cavity 9 rotates, it delivers the cooling liquid into the second circulating pipe 22 through the reciprocating motion of the slide rod 18, and the second circulating pipe 22 cools and heats the other position of the circuit board in the machine shell 4, and then delivers it into the second circulating pipe 23, and then inputs from the suction end of the first circulating cavity 8, so that the cooling liquid can be heat-exchanged twice through secondary circulation, avoiding that the cooling liquid is too high in temperature in the cooling process, and then affecting the heat dissipation work of the circuit board and the computer elements;
[0058] When the driving motor 13 synchronously drives the installation shaft 25 to rotate, it drives the heat-conducting fan 26 to rotate, so that it can extract air from all around and output from the front, and the inner air inlet 27 extracts the air in the circular cover 5, cools the circular cover 5, and then extracts the air in the machine shell 4 through the air guide member, and makes the external air enter the machine shell 4 to exchange heat, achieving the effect of further cooling the inside of the machine shell 4.
[0059] Those skilled in the art can easily understand that the above advantageous modes can be freely combined and superimposed without conflict.
[0060] The above is only a preferred embodiment of the present application, and is not used to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application. The above is only a preferred embodiment of the present application, and it should be pointed out that, for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications shall be regarded as the protection scope of the present application.
Claims
1. A dual-cycle cooling all-in-one computer, characterized in that, include: A bracket (1) is fixedly connected to a support column (2) on its top side. A number of support rods (3) are fixedly connected to the side of the support column (2). A number of support rods (3) are fixedly connected to a housing (4). A circular cover (5) is fixedly connected to the side of the housing (4) near the bracket (1). A partition plate (6) is fixedly connected to the inner circumferential side wall of the circular cover (5). A heat-conducting plate (7) is provided between the partition plate (6) and the side of the housing (4) near the support column (2). The heat-conducting plate (7) is fixedly connected to the inner circumferential side of the circular cover (5). The partition plate (6) and the heat-conducting plate (7) divide the circular cover (5) from one side to the other into the first circulation chamber (8), the second circulation chamber (9) and the heat dissipation chamber (10), respectively. Both sides of the partition plate (6) are provided with circulation cooling components (11) for cooling the circuit boards inside the casing (4). A secondary heat dissipation component (12) is provided on the side of the heat conduction plate (7) away from the partition plate (6) for dissipating heat from the inside of the casing (4) and the circulating cooling component (11); The top of the support column (2) is provided with a drive component (14) for driving the circulating cooling component (11) and the secondary heat dissipation component (12). The circulating cooling component includes two discs (15), which are rotatably connected to two opposite sides of the partition plate (6) and are eccentrically arranged. A number of grooves (16) are opened on the outer periphery of the discs (15). A reciprocating spring (17) is fixedly connected to the inner side wall of the groove (16). A sliding rod (18) is fixedly connected to the end of the reciprocating spring (17). The sliding rod (18) is slidably connected in the groove (16). The end of the sliding rod (18) is in contact with the inner periphery of the circular cover (5). A pipe component (19) is provided on the outer periphery of the circular cover (5). The pipeline component (19) includes a first circulation pipe (20), which is fixedly connected to the outer periphery of the circular cover (5) and communicates with the output position of the first circulation chamber (8). The first circulation pipe (20) is arranged in a reciprocating manner and its end extends to the bottom of the circular cover (5). The end of the first circulation pipe (20) is fixedly connected to a first through pipe (21), and the end of the first through pipe (21) communicates with the suction position of the second circulation pipe (22). A second circulation pipe (22) is fixedly connected to the outer periphery of the circular cover (5) and is connected to the output position of the first circulation chamber (8). The second circulation pipe (22) is arranged in a reciprocating shape and its end extends to the top of the circular cover (5). A second passage pipe (23) is fixedly connected to the end of the second circulation pipe (22). The bottom end of the second passage pipe (23) is connected to the suction position of the second circulation chamber (9).
2. The all-in-one computer with dual-cycle heat dissipation according to claim 1, characterized in that, The secondary heat dissipation component (12) includes a circular channel (24), which is fixedly connected to the side of the heat-conducting plate (7) away from the partition plate (6) and is coaxial with the disc (15). A mounting shaft (25) is provided in the middle of the circular cover. The mounting shaft (25) is fixedly connected to the side of the heat-conducting plate (7). A heat-conducting fan (26) is fixedly connected to the outer periphery of the mounting shaft (25). An inner air vent (27) is opened on the outer periphery of the circular channel (24). The side of the circular channel (24) near the support column (2) is closed. An outer air guide (28) is also provided on the outer periphery of the circular cover (5).
3. The all-in-one computer with dual-cycle heat dissipation according to claim 2, characterized in that, The external air guide (28) includes a number of external air outlets (29). The number of external air outlets (29) are arranged in a ring array on the outer periphery of the circular cover (5) and are connected to the heat dissipation cavity (10). An air supply outlet (30) is provided on the side wall of the housing (4), and an exhaust outlet (31) is provided on the side of the housing (4) at the position of the support column (2).
4. The all-in-one computer with dual-cycle heat dissipation according to claim 3, characterized in that, An air duct (32) is fixedly installed on the inner wall of the housing (4). The end of the air duct (32) extends to the outer periphery of the circular cover (5), and the end of the air duct (32) is connected to the corresponding external air outlet (29). The end of the air duct (32) is in contact with the outer periphery of the first circulation chamber (8).
5. A dual-cycle cooling all-in-one computer according to claim 4, characterized in that, The outer peripheral sidewall of the circular cover (5) is provided with an arc-shaped groove (33), which is connected to the air duct (32) and the corresponding external air outlet (29).
6. A dual-cycle cooling all-in-one computer according to claim 5, characterized in that, The driving component (14) includes a driving motor (13), which is fixedly connected to the top of the support column (2). The motor shaft of the driving motor (13) is fixedly connected to the mounting shaft (25), and its end extends into the first circulation cavity (8) and is fixedly connected to two discs (15) respectively. The motor shaft of the driving motor (13) is rotatably connected to the heat-conducting plate (7) and the partition plate (6).
Citation Information
Patent Citations
Computer cooling device
CN112051907A
Composite cooling heat exchange device for new energy automobile lithium battery
CN114665187A