High-density server system based on reinforced DDR4 memory bank

Abstract

The invention relates to a high-density server system based on a reinforced DDR4 memory bank, and belongs to the field of computing servers. The system comprises a CPU (central processing unit), a reinforced DDR4 (double data rate 4) memory bank, an 8619 bridge chip, an X100 bridge chip, a CPLD (complex programmable logic device) chip, a BMC (baseboard management controller) module, a 10-gigabit Ethernet chip, a gigabit Ethernet chip, a FLASH chip and a hard disk. According to the design, the layout space is efficiently utilized, stability, reliability, environmental adaptability, universality, compatibility and autonomous controllability are achieved, and the method has important application significance in the field of high-integration-level and high-reliability computing servers.

Description

Technical Field

[0001] The present invention belongs to the technical field of computing servers, and in particular relates to a high-density server system based on reinforced DDR4 memory bars. Background Art

[0002] As server computing power, data throughput, scalability, and reliability improve, more and more functional modules are required, leading to higher server integration. High-density server systems also place higher demands on board layout and device reliability. Memory modules determine a server's reliability, processing speed, data access speed, concurrent processing capabilities, and system stability. There are two common ways to implement high-reliability and high-density server systems:

[0003] The first approach involves using a CPU mounted on the server motherboard with DDR4 chips. This solution has the following drawbacks: First, it takes up a lot of space, making it difficult to achieve a high-density layout; second, it places high demands on PCB routing, making it difficult to guarantee operating speed and stability; and third, if a DDR4 chip is damaged, the board is difficult to repair, which can reduce the reliability of the entire server system.

[0004] The second method is to use a CPU equipped with a DDR4 gold finger memory stick on the server motherboard, which is also the most commonly used implementation method in the industry. Metal has a strong antioxidant ability, which can protect the internal circuit from corrosion, and the strong conductivity of metal can ensure that the signal is not easily lost, while expanding the memory capacity and reducing the difficulty of maintenance. However, the above implementation method has three shortcomings: First, the thickness of the metal layer is generally between 0.25-1.3 microns, and the wear resistance is poor. Repeated plugging and unplugging of the memory stick can easily cause the metal layer to wear, resulting in poor contact and affecting signal transmission; second, the vibration resistance between the gold finger and the socket is very poor, which can easily cause the memory stick to loosen or even fall off under harsh environmental conditions, resulting in poor reliability;

[0005] Therefore, there is an urgent need for a high-density server system based on reinforced DDR4 memory sticks. Summary of the Invention

[0006] (1) Technical issues to be resolved

[0007] The technical problem to be solved by the present invention is how to provide a high-density server system based on reinforced DDR4 memory sticks to solve the difficulty of high-density device layout on the motherboard and overcome the defects of existing DDR4 gold finger memory sticks, such as poor wear resistance, poor vibration resistance and poor reliability.

[0008] (2) Technical solution

[0009] In order to solve the above technical problems, the present invention proposes a high-density server system based on a reinforced DDR4 memory bar, which includes: a CPU processor, a reinforced DDR4 memory bar, an 8619 bridge chip, an X100 bridge chip, a CPLD chip, a BMC module, a 10 Gigabit Ethernet chip, a Gigabit Ethernet chip, a FLASH chip and a hard disk;

[0010] The CPU processor is connected to 8 reinforced DDR4 memory sticks;

[0011] The 8619 bridge chip is connected to the upstream CPU processor via PCIE X8, and the extended PCIE X4 downstream interface is connected to the X100 bridge chip, and the extended PCIE X8 downstream interface is directly led out and used as a standard PCIE X8 interface;

[0012] The X100 bridge chip is used to expand various interfaces. Among them, the X100 bridge chip has two SATA interfaces for external expansion, each of which can be connected to a SATA hard drive; the X100 bridge chip has two Gigabit Ethernet chips;

[0013] The CPLD chip is connected to the CPU processor and the BMC module, and is provided with GPIO pins for the mainboard external status display and control functions.

[0014] The BMC module is connected to the FLASH chip and PHY chip;

[0015] The 10 Gigabit Ethernet chip is directly connected to the CPU processor.

[0016] (3) Beneficial effects

[0017] The present invention proposes a high-density server system based on reinforced DDR4 memory sticks. This high-density server system, built with reinforced DDR4 memory sticks, effectively utilizes the height advantage of the reinforced DDR4 memory stick connector. Different stacking heights can be selected according to the density of the motherboard. Components that do not require active heat dissipation can be placed below the reinforced DDR4 memory sticks, effectively increasing the layout space of the PCB.

[0018] By utilizing the high-density server systems built with reinforced DDR4 memory modules, the extra space allows for the addition of active cooling modules, making the motherboard more adaptable to harsh environments. Using plug-in connectors to interconnect the reinforced DDR4 memory modules ensures stable and reliable signal contact, while avoiding poor wear resistance and providing excellent vibration resistance. This improves the overall stability and reliability of the motherboard and expands its environmental adaptability.

[0019] This high-density server system, built with reinforced DDR4 memory modules, takes full account of the reversible insertion design of existing Gold Finger memory modules. Compatible with Gold Finger SODIMM pin definitions, these pins are fully utilized to expose GPIO interfaces for custom configuration on the server motherboard. Furthermore, the use of multiple pins for functional reuse significantly enhances the versatility of the board. This design can significantly reduce labor costs and shorten the overall production cycle.

[0020] For high-density server systems built with reinforced DDR4 memory sticks, the motherboard is designed with an IIC bus to read and write the particle information, configuration parameters, etc. of the reinforced DDR4 memory sticks, effectively improving the motherboard's compatibility with the design differences of the reinforced DDR4 memory sticks themselves.

[0021] Furthermore, the design of this invention uses domestically produced components and can provide functions such as fan control, IIC interface, USB2.0 and USB3.0 interface, VGA interface, PCIE interface, LPC interface, UART interface, ADC interface, 1000Base-T interface, SerDes interface, RGMII interface and GPIO interface. On the basis of ensuring the versatility of the motherboard, the design is domestically produced, ensuring the independent control of the product.

[0022] The design of the present invention efficiently utilizes layout space and has stability, reliability, environmental adaptability, versatility, compatibility and autonomous controllability, and has important application significance in the field of high-integration, high-reliability computing servers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a functional interface block diagram of the present invention, which can clearly illustrate the parameters of each functional interface of the motherboard;

[0024] Figure 2 This is a DQ0 simulation effect diagram of the memory of the reinforced DDR4 memory bar of the present invention;

[0025] Figure 3 This is an A0 simulation effect diagram of the memory of the reinforced DDR4 memory bar of the present invention;

[0026] Figure 4 This is a DQ0 & A0 simulation effect diagram of the memory of the reinforced DDR4 memory bar of the present invention;

[0027] Figure 5 This is a physical diagram of the present invention. DETAILED DESCRIPTION

[0028] In order to make the purpose, content and advantages of the present invention more clear, the specific implementation methods of the present invention are further described in detail below with reference to the accompanying drawings and examples.

[0029] As server functionality increases, the difficulty of high-density device layout on the motherboard is resolved through refined wiring and strict space planning, while also taking into account equipment heat dissipation, signal interference, electromagnetic compatibility, and reliability factors.

[0030] The motherboard is equipped with a reinforced DDR4 memory module design to solve the problem that existing memory particles take up a lot of space and are difficult to achieve high-density layout. It also overcomes the defects of existing DDR4 gold finger memory modules such as poor wear resistance, poor vibration resistance and poor reliability.

[0031] The purpose of the present invention is to propose a high-density server system based on universal domestically reinforced DDR4 memory sticks to solve the problems of the above-mentioned prior art.

[0032] The present invention provides a high-density server system based on universal domestically reinforced DDR4 memory sticks. This system is designed to meet high-performance scenario requirements. The mainboard uses a domestically produced high-performance processor that can operate stably at a 2.2GHz main frequency, providing support for efficient and stable operation. The system has the functions of real-time monitoring of key components and active fault alarm display, making the equipment status visible and manageable, reducing maintenance costs, and improving reliability.

[0033] The present invention provides a high-density server system based on a universal domestically produced reinforced DDR4 memory bar, comprising: a CPU processor, a reinforced DDR4 memory bar, an 8619 bridge chip, an X100 bridge chip, a CPLD chip, a BMC module, a 10 Gigabit Ethernet chip, a Gigabit Ethernet chip, a FLASH chip and a hard disk;

[0034] Among them, the CPU processor is connected to 8 reinforced DDR4 memory sticks;

[0035] The 8619 bridge chip is connected to the upstream CPU processor via PCIE X8, and the extended PCIE X4 downstream interface is connected to the X100 bridge chip, and the extended PCIE X8 downstream interface is directly led out and used as a standard PCIE X8 interface;

[0036] The X100 bridge chip is used to expand various interfaces. Among them, the X100 bridge chip has two SATA interfaces, each of which can be connected to a SATA hard drive. The X100 bridge chip also has two Gigabit Ethernet chips, each used to output two 1000Base-T electrical signals.

[0037] The CPLD chip is connected to the CPU processor and the BMC module, and is provided with GPIO pins for the mainboard external status display and control functions.

[0038] The BMC module is connected to a FLASH chip and a PHY chip. The FLASH chip is used to store configuration information, and the PHY chip is used to implement the management network interface for out-of-band management.

[0039] The 10 Gigabit Ethernet chip is directly connected to the CPU processor to provide 10 Gigabit Ethernet signals.

[0040] Specific scheme of the present invention:

[0041] (1) The CPU processor is responsible for coordinating multi-task execution, memory management, energy efficiency balancing, and initializing, configuring, monitoring, and managing the bridge chip, 10 Gigabit Ethernet chip, and Gigabit Ethernet chip. The CPU processor of this solution is a domestic FT2000+ / 64 processor, which provides 64 computing cores and a main frequency of 2.2GHz. It integrates two DDR4 SDRAM controllers, PCIE3.0 interface, SPI interface controller, UART interface controller, I2C interface control, and GPIO.

[0042] (2) The reinforced DDR4 memory bar takes on the task of caching and buffering, providing fast data access speed to speed up data processing and transmission.

[0043] This solution uses reinforced DDR4 memory modules to implement functions on a high-density server system based on general-purpose domestically produced reinforced DDR4 memory modules. The modules include two CTOLC-135-12-LQA connectors, one RCD (Register Clock Driver) chip, and 18 8-bit 2GB DDR4 memory chips. The CPU processor of a high-density server system based on general-purpose domestically produced reinforced DDR4 memory modules uses two CSOLC-135-02-LQ-LC connectors to connect to the CTOLC-135-12-LQA connector of the reinforced DDR4 memory module. The CPU processor then accesses the DDR chips through the connector.

[0044] Each reinforced DDR4 memory stick integrates 18 2GB DDR particles, two of which are used for ECC (Error Checking and Correcting), forming a 32GB domestically produced server reinforced DDR4 memory stick with ECC function. All components are made of domestic materials, forming a domestically produced reinforced DDR4 memory stick.

[0045] A high-density server system based on universal domestically produced reinforced DDR4 memory modules, equipped with 8 reinforced DDR4 memory modules to form a large-capacity 256GB cache with ECC function.

[0046] Verification of the memory design of the present invention: After completing the layout and routing of the printed circuit board, the electromagnetic field simulation software was used to extract the frequency domain transmission characteristics (S parameters) of the printed circuit board routing. Then, in conjunction with the IBIS simulation model of the processor and memory particles, 10,000 UI random code streams were transmitted on the memory bus at a memory rate of 3200Mbps. 10ps signal jitter was added to the code stream, and the time domain waveform of each signal on the memory bus was obtained through the simulation software. Taking the DQ0 with the shortest routing and the A0 with the longest routing as an example, the time domain waveform of the signal received by the memory particle end on the reinforced DDR4 memory stick is as follows: Figure 2-Figure 4 As shown in the figure, the DQ0 signal is a point-to-point connection from the CPU to the memory chip, so its signal quality is relatively good. The A0 signal uses a Fly-By architecture during signal routing, resulting in a long link and some reflections, so its signal quality is slightly poorer. However, the eye opening degree meets the requirements, ensuring the stability and reliability of the motherboard memory.

[0047] The ruggedized DDR4 memory module connector selected is the CTOLC-135-12-LQA, which features a 10Gbps transmission rate, a mechanical lifespan of 500 cycles, vibration and shock resistance, and an operating temperature range of -65°C to 125°C. Its plug-in connector design ensures reliable signal connections. Pin delay compensation introduced by the connector during PCB routing ensures signal integrity.

[0048] (3) An 8619 bridge chip for high-density server systems based on universal, domestically produced, reinforced DDR4 memory modules. This is a PCIe 2.0 switch with built-in DMA, 16 channels, and up to 16 ports. The link width can be configured as x8, x4, or x1, and can also automatically negotiate to x2.

[0049] This solution uses the 8619 bridge chip, which communicates with the upstream device CPU through PCIE X8, extends the PCIE X4 downstream interface to communicate with the Feiteng X100 bridge chip, and directly extends the PCIE X8 downstream interface to be used as a standard PCIE X8 interface.

[0050] (4) A Feiteng X100 bridge chip for a high-density server system based on universal, domestically produced, reinforced DDR4 memory sticks, which implements data communication via a PCIE X4 external plug-in to the downstream interface of the 8619 bridge. The Feiteng X100 bridge chip is primarily used to expand sub-devices such as USB, SATA, and PCIe. It is a complex of a series of integrated circuits, serving as a bridge for communication between the processor and peripheral devices, and coordinating the communication and cooperation of various functional modules.

[0051] This solution uses the Feiteng X100 bridge chip, which integrates a low-power GPU, 3 DisplayPort1.4 display interfaces, 1 HDAudio and 4 I2S, 1 64-bit DDR4 / LPDDR4 memory controller, 4 SATA3.0 interfaces, 8 independent USB 3.1Gen 1 interfaces, 4 UARTs, 1 LPCMaster, 96 GPIOs, 8 MIOs (configurable as UART, I2C, PWM, three modes), 4 PWMs, 1 QSPI, 2 general SPIMasters, 3 SMBus controllers, 2 CAN controllers, and an integrated temperature sensor.

[0052] The Feiteng X100 bridge chip in this solution expands 4 USB3.0 and 6 USB2.0 interfaces (4 of which are directly led out, and the other two are used as communication links for the cryptographic module), 2 VGA display interfaces, 2 IIC communication interfaces for VGA display, 2 SATA interfaces, 2 PCIEX2 interfaces (two WX1860AL2 network cards are hung below to provide Gigabit Ethernet interfaces to the outside world), 4 Gigabit Ethernet interfaces, 2 PCIE X1 interfaces are directly led out and used as standard PCIE X1 interfaces, and 2 PCIE X1 interfaces are used as communication links for the cryptographic module. It also has GPIO, UART, and IIC interfaces for communicating with CPLD, enriching the expansion functions of the server.

[0053] The X100 bridge chip has two SATA interfaces for external expansion, each of which can be connected to a SATA hard drive. One of the hard drives is used to store system files and user data to assist in running the operating system on the processor; the other hard drive is used to expand the system or store data.

[0054] (5) A CPLD for a high-density server system based on a universal domestically produced reinforced DDR4 memory stick is responsible for controlling the power-on and power-off timing and peripheral reset, communicating with the BMC module, completing the level conversion of some CPU-side signals, and realizing the external status display and control functions of the motherboard through the GPIO pins;

[0055] (6) A BMC chip for high-density server systems based on universal domestically reinforced DDR4 memory sticks for out-of-band management.

[0056] The FLASH chip on the BMC module is mainly used to store configuration information of the CPU, X100 bridge chip, BMC chip, etc., and data can be remotely updated through the BMC.

[0057] The PHY chip is a network processing module within the BMC module, implementing the management network interface for out-of-band management. It implements SNMP through the management network, providing two functions: active query and self-test information reporting. The automatic reporting function can report motherboard self-test information to the specified IP address every 1 minute, including power on / off status, temperature, voltage, fan, power consumption, CPU model, kernel version, operating system version, number of CPU cores, memory size, memory utilization, CPU occupancy, or fault information.

[0058] (7) A high-density server system based on universal domestically reinforced DDR4 memory sticks includes two 10 Gigabit Ethernets and four 1 Gigabit Ethernets, wherein the 10 Gigabit Ethernet is converted into a serdes signal through an N10G 10 Gigabit network card, and the N10G 10 Gigabit network card is connected to a domestic optical module to convert a 4-transmit 4-receive 40Gbps optical communication interface, which is mainly used for high-bandwidth, low-latency and high-speed data transmission; the 1 Gigabit Ethernet is output by two WX1860AL2 network cards plugged under the Feiteng X100 bridge, which output two 1000Base-T electrical signals respectively, and are connected to the RJ45 interface through a transformer, which is mainly used for compatibility with old docking equipment and data interaction with external equipment.

[0059] (8) In such a complex and feature-rich server project, the layout and design of the motherboard are overflowing. The reinforced DDR4 memory stick design is adopted. The connector of the reinforced DDR4 memory stick has a stacking height, which makes the reinforced DDR4 memory stick suspended. At the same time, there are multiple stacking heights to choose from, and the selection can be made according to the actual situation of the project. After the reinforced DDR4 memory stick is suspended, the space under the reinforced DDR4 memory stick can be used to place different functional modules, such as components that do not require active heat dissipation or active heat dissipation heat dissipation modules, which fully saves layout space. At the same time, the reinforced DDR4 memory stick also has enough space for heat dissipation, which improves the environmental adaptability of the motherboard.

[0060] The connector connecting the motherboard and the reinforced DDR4 memory stick is designed with a compact structure, reliable connection, and high stability in transmitting high-speed signals. While ensuring the memory speed, it also avoids hidden dangers caused by wear and poor contact, thereby ensuring the reliability and stability of the motherboard.

[0061] The present invention proposes a high-density server system based on reinforced DDR4 memory sticks. This high-density server system, built with reinforced DDR4 memory sticks, effectively utilizes the height advantage of the reinforced DDR4 memory stick connector. Different stacking heights can be selected according to the density of the motherboard. Components that do not require active heat dissipation can be placed below the reinforced DDR4 memory sticks, effectively increasing the layout space of the PCB.

[0062] By utilizing the high-density server systems built with reinforced DDR4 memory modules, the extra space allows for the addition of active cooling modules, making the motherboard more adaptable to harsh environments. Using plug-in connectors to interconnect the reinforced DDR4 memory modules ensures stable and reliable signal contact, while avoiding poor wear resistance and providing excellent vibration resistance. This improves the overall stability and reliability of the motherboard and expands its environmental adaptability.

[0063] This high-density server system, built with reinforced DDR4 memory modules, takes full account of the reversible insertion design of existing Gold Finger memory modules. Compatible with Gold Finger SODIMM pin definitions, these pins are fully utilized to expose GPIO interfaces for custom configuration on the server motherboard. Furthermore, the use of multiple pins for functional reuse significantly enhances the versatility of the board. This design can significantly reduce labor costs and shorten the overall production cycle.

[0064] For high-density server systems built with reinforced DDR4 memory sticks, the motherboard is designed with an IIC bus to read and write the particle information, configuration parameters, etc. of the reinforced DDR4 memory sticks, effectively improving the motherboard's compatibility with the design differences of the reinforced DDR4 memory sticks themselves.

[0065] Furthermore, the design of this invention uses domestically produced components and can provide functions such as fan control, IIC interface, USB2.0 and USB3.0 interface, VGA interface, PCIE interface, LPC interface, UART interface, ADC interface, 1000Base-T interface, SerDes interface, RGMII interface and GPIO interface. On the basis of ensuring the versatility of the motherboard, the design is domestically produced, ensuring the independent control of the product.

[0066] The design of the present invention efficiently utilizes layout space and has stability, reliability, environmental adaptability, versatility, compatibility and autonomous controllability, and has important application significance in the field of high-integration, high-reliability computing servers.

[0067] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A high-density server system based on reinforced DDR4 memory sticks, characterized in that: The system includes: CPU processor, reinforced DDR4 memory, 8619 bridge chip, X100 bridge chip, CPLD chip, BMC module, 10 Gigabit Ethernet chip, Gigabit Ethernet chip, FLASH chip and hard disk; The CPU processor is connected to 8 reinforced DDR4 memory sticks; The 8619 bridge chip is connected to the upstream CPU processor via PCIE X8, and the extended PCIE X4 downstream interface is connected to the X100 bridge chip, and the extended PCIE X8 downstream interface is directly led out and used as a standard PCIE X8 interface; The X100 bridge chip is used to expand various interfaces. Among them, the X100 bridge chip has two SATA interfaces for external expansion, each of which can be connected to a SATA hard drive; the X100 bridge chip has two Gigabit Ethernet chips; The CPLD chip is connected to the CPU processor and the BMC module, and is provided with GPIO pins for the external status display and control function of the motherboard; The BMC module is connected to the FLASH chip and PHY chip; The 10 Gigabit Ethernet chip is directly connected to the CPU processor.

2. The high-density server system based on reinforced DDR4 memory sticks according to claim 1, wherein: The CPU processor is a domestically produced FT2000+ / 64 processor.

3. The high-density server system based on reinforced DDR4 memory sticks according to claim 1, wherein: Each reinforced DDR4 memory stick includes: two CTOLC-135-12-LQA connectors, 1 RCD chip and 18 8-bit 2GB memory DDR4 particles. The CPU processor uses two CSOLC-135-02-LQ-LC connectors to connect to the CTOLC-135-12-LQA connector of the reinforced DDR4 memory stick.

4. The high-density server system based on reinforced DDR4 memory sticks according to claim 3, wherein: In each reinforced DDR4 memory stick, two 2GB DDR particles are used as ECC, forming a 32GB domestically produced server reinforced DDR4 memory stick with ECC function.

5. The high-density server system based on reinforced DDR4 memory sticks according to claim 1, wherein: The X100 bridge chip expands externally with 4 USB3.0 interfaces, 6 USB2.0 interfaces, 2 VGA display interfaces, 2 IIC communication interfaces for VGA display, 2 SATA interfaces, 2 PCIEX2 interfaces, 4 Gigabit Ethernet interfaces, 2 PCIE X1 interfaces directly led out for use as standard PCIEX1, and 2 PCIE X1 interfaces used as communication links for cryptographic modules. It also has GPIO, UART, and IIC interfaces for communicating with CPLD.

6. The high-density server system based on reinforced DDR4 memory sticks according to claim 1, wherein: The 10 Gigabit Ethernet chip is the N10G 10 Gigabit network card.

7. The high-density server system based on reinforced DDR4 memory sticks according to claim 6, wherein: The N10G 10G network card is connected to the domestic optical module to convert it into a 4-transmit 4-receive 40Gbps optical communication interface.

8. The high-density server system based on reinforced DDR4 memory sticks according to claim 1, wherein: The Gigabit Ethernet chip is the WX1860AL2 network card.

9. The high-density server system based on reinforced DDR4 memory sticks according to claim 8, characterized in that: The two WX1860AL2 network cards plugged into the X100 bridge each output two 1000Base-T electrical signals, which are connected to the RJ45 interface via a transformer.

10. The high-density server system based on reinforced DDR4 memory sticks according to any one of claims 3 to 9, characterized in that: The connector of the reinforced DDR4 memory module has a stacking height, so that the reinforced DDR4 memory module is suspended. After the reinforced DDR4 memory module is suspended, the space under the reinforced DDR4 memory module is used to place components that do not require active heat dissipation or a heat dissipation module that actively dissipates heat.

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