Winding laminated structure design method and equipment for optimizing high-frequency copper loss of planar transformer

Abstract

The invention discloses a winding laminated structure design method and device for optimizing high-frequency copper loss of a planar transformer. The method comprises the steps that 1, parameters of a to-be-optimized planar transformer winding are determined; 2, a lamination combination is arranged for the windings, the number of copper layers corresponding to the windings and the number of turns of the windings in the copper layers are determined, and the copper layers have no sequential relation; 3, the current amplitude and phase of each copper layer in the lamination combination are calculated, the currents of the copper layers are sequentially connected in a vector mode on a complex plane according to an optimal path, a local optimal lamination structure is obtained, and the optimal path judgment basis is that after the current vectors of the copper layers are connected end to end, the sum of squares of the distances from the end points of all the vectors to the original point is minimum; 4, calculating the copper loss of the local optimal laminated structure based on a preset high-frequency copper loss analysis model; step 5, setting different lamination combinations for the windings, and repeating the step 3 and the step 4 until all possible combinations are traversed; and step 6, comparing the local optimal laminated structure copper loss corresponding to all combinations, and selecting the copper loss with the minimum copper loss as the global optimum. According to the method, high-frequency skin and proximity loss can be effectively inhibited, and high-frequency copper loss is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of planar magnetic components, and in particular relates to a winding stacking structure design method and equipment for optimizing high-frequency copper loss of a planar transformer. Background Art

[0002] Compared to traditional wound transformers, planar transformers can reduce transformer height and improve heat dissipation. However, at high frequencies, planar transformer winding losses increase significantly, especially under high current power conditions. Planar transformer copper losses (winding losses) often dominate converter losses.

[0003] To reduce the winding losses of planar transformers, the winding structure must be optimized. Traditionally, this approach optimizes DC resistance by designing an appropriate winding radius and width. This allows for a more balanced distribution of current density across the copper width within the same copper winding layer, reducing copper losses and potentially achieving a comprehensive optimization of both magnetic and copper losses. However, at high frequencies, the skin effect and proximity effect between different copper layers cause uneven current density distribution across the copper thickness, increasing losses. In fact, the increased losses caused by the skin and proximity effects are the primary factors contributing to the dramatic increase in copper losses at high frequencies. Improper winding stacking can significantly increase the magnetomotive force, leading to a sharp increase in current density at the winding surface and significant losses. However, traditional methods for optimizing winding radius and width cannot reduce these effects, limiting their effectiveness in optimizing copper losses at high frequencies. Currently, there is no stacking structure design method for optimizing high-frequency copper losses in planar transformers, especially multi-port planar transformers. Summary of the Invention

[0004] In response to the problems existing in the prior art, the present invention provides a method and equipment for designing a winding stacking structure for optimizing the high-frequency copper loss of a planar transformer. By allocating the stacking combinations of the windings, designing a sorting method for the stacking combinations, and calculating the copper loss, a winding stacking structure with the final minimum copper loss can be obtained, which effectively suppresses the high-frequency skin loss and proximity loss of the planar transformer winding and reduces the high-frequency copper loss.

[0005] In order to solve the above technical problems, the present invention is implemented through the following technical solutions: According to a first aspect of the present invention, a method for designing a winding stack structure for optimizing high-frequency copper loss of a planar transformer is provided, comprising: Step 1: Determine the parameters of the planar transformer winding to be optimized, including winding current, number of winding turns, copper layer width, effective length of copper layer, and copper layer thickness; Step 2: setting a stacking combination for the winding based on the parameters of the winding, wherein the stacking combination determines the number of copper layers corresponding to each winding and the number of winding turns in each copper layer, and the copper layers have no sequential relationship; Step 3: Calculate the amplitude and phase of the current of each copper layer in the stacked combination, and connect the currents of each copper layer in the complex plane in the form of vectors along the optimal path to obtain a local optimal stacked structure; the optimal path is determined based on: after the current vectors of each copper layer are connected end to end from the origin, the sum of the squares of the distances of all vector endpoints to the origin is minimized; Step 4: Calculate the copper loss of the local optimal stacked structure based on a preset high-frequency copper loss analytical model; Step 5: setting different stacking combinations for the winding, and repeating steps 3 and 4 until all possible stacking combinations are traversed; Step 6: Compare the copper losses of the local optimal stacking structures corresponding to all stacking combinations, and select the stacking structure with the smallest copper loss as the stacking structure with the global optimal copper loss.

[0006] In a possible implementation manner of the first aspect, in any stacking combination, all windings are located on the same side of the air gap, and each copper layer has an equal copper layer thickness.

[0007] In a possible implementation of the first aspect, the calculating the amplitude and phase of the current in each copper layer in the stacked combination is specifically: The amplitude and phase of the current in each copper layer are the vector sum of all winding currents in each copper layer.

[0008] In a possible implementation of the first aspect, the correspondence between the local optimal stacking structure and the optimal path is: the copper layer where the current vector starting from the origin is located is the copper layer farthest from the air gap, and the copper layer where the current vector reaching the end point is located is the copper layer closest to the air gap, and the other layers are also in one-to-one correspondence in order.

[0009] In a possible implementation of the first aspect, the high-frequency copper loss analytical model is specifically:

[0010] Where, is the high frequency copper loss; n is the number of copper layers; ξ is the ratio of copper layer thickness to skin depth; v i-1 and v i From the origin i The two endpoints of the current vector of the copper layer; v 0 is the origin; v n For the end point; Rdc|ξ=1 is the DC resistance of the copper layer when the ratio of the copper layer thickness to the skin depth is 1.

[0011] In a possible implementation of the first aspect, the different stacking combinations must satisfy that the number of copper layers corresponding to each winding and the number of winding turns in each copper layer are not completely the same as those of the traversed stacking combinations, and the copper layers have no sequential relationship.

[0012] In a possible implementation of the first aspect, the winding is the primary and secondary windings of a two-port transformer, or the primary, secondary, and secondary windings of a multi-port transformer. N Secondary winding.

[0013] In a possible implementation manner of the first aspect, the copper layer is a copper foil, a copper sheet, a planar copper conductor in a printed circuit board, a ceramic circuit board, or a flexible circuit board.

[0014] According to a second aspect of the present invention, a computer device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the method for designing a winding stacking structure for optimizing the high-frequency copper loss of a planar transformer is implemented.

[0015] According to a third aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer is implemented.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects: The present invention provides a method for designing a winding stack structure that optimizes the high-frequency copper loss of a planar transformer. A copper loss model is established that takes into account the current phase difference between copper layers, quantitatively characterizing the effects of the skin effect of current within a copper layer and the proximity effect of current between copper layers on copper loss. Based on this model, the present invention proposes a two-level optimization design method. At the local optimization level, the stack structure is designed according to the optimal layer current vector path, minimizing the proximity loss while maintaining the skin loss unchanged, thereby significantly reducing the proximity loss. At the global optimization level, all possible stack combinations are traversed to find the global optimal structure under all local optimal structures, achieving simultaneous optimization of proximity loss and skin loss. The resulting winding stack structure with the lowest copper loss can effectively suppress the high-frequency skin loss and proximity loss of the planar transformer winding, reducing high-frequency copper loss.

[0017] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the specific embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a flow chart of a method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer according to the present invention; FIG2 is a design flow chart of a laminated structure for optimizing high-frequency copper loss of a planar transformer in Example 1 of the present invention; FIG3 shows two different situations of the planar transformer winding stacking combination in Example 1 of the present invention; FIG4 is a diagram showing the copper layer current vector of planar transformer winding stacking combination 1 in Example 1 of the present invention; FIG5 shows different connection modes of copper layer current vectors in the planar transformer winding stacking combination case 1 in Example 1 of the present invention; FIG. 6 shows the copper loss of all stacked structures obtained by simulation in Example 1 of the present invention. DETAILED DESCRIPTION

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0021] like Figure 1 The embodiment of the present invention provides a method for designing a winding stack structure for optimizing high-frequency copper loss of a planar transformer, which specifically includes the following steps: Step 1: Determine the parameters of the planar transformer winding to be optimized. Specifically, the winding parameters include winding current, number of winding turns, copper layer width, effective length of copper layer, and copper layer thickness.

[0022] Step 2: Based on the parameters of the winding, a stacking combination is set for the winding. The stacking combination determines the number of copper layers corresponding to each winding and the number of winding turns in each copper layer, and the copper layers have no sequential relationship.

[0023] In other words, a stacking combination specifies the number of copper layers for each winding and the number of turns within each copper layer, but does not specify the order of the copper layers. In other words, a stacking combination must meet the following requirements: The number of copper layers corresponding to each winding and the number of turns within each copper layer are clearly defined; the order of the copper layers in the stacking combination is not considered; only the relationship between the copper layers and the windings is considered.

[0024] In one implementation, in the stacked combination, all windings are located on the same side of the air gap, and each copper layer has an equal copper layer thickness to ensure simplicity and repeatability of industrial production.

[0025] Step 3: Calculate the amplitude and phase of the current in each copper layer in the stacked combination, and connect the currents of each copper layer in the complex plane in vector form along the optimal path to obtain a locally optimal stacked structure. The optimal path is determined by minimizing the sum of the squares of the distances from the endpoints of each copper layer's current vector to the origin when the vectors are connected end-to-end from the origin.

[0026] Specifically, for the stacking combination that has been set, the following operations are performed to obtain the local optimal stacking structure: calculate the amplitude and phase of the current of each copper layer in the stacking combination. Specifically, the amplitude and phase of the current of each copper layer are the vector sum of all winding currents in the copper layer. Connect the currents of each copper layer in the complex plane in the form of vectors according to the optimal path. According to the optimal path, the arrangement order of each copper layer in the local optimal stacking structure is determined. Specifically, the copper layer where the current vector starting from the origin is located is the copper layer farthest from the air gap, and the copper layer where the current vector reaching the end point is located is the copper layer closest to the air gap. The other layers correspond one to one in the order in which the current vectors are connected.

[0027] Step 4: Calculate the copper loss of the local optimal stacked structure based on a preset high-frequency copper loss analytical model. The high-frequency copper loss analytical model is as follows:

[0028] Where, is the high frequency copper loss; n is the number of copper layers; ξ is the ratio of copper layer thickness to skin depth; v i-1 and v i From the origin i The two endpoints of the current vector of the copper layer; v 0 is the origin; v n For the end point; R dc|ξ=1 is the DC resistance of the copper layer when the ratio of the copper layer thickness to the skin depth is 1.

[0029] Step 5: Set different stacking combinations for the windings, and repeat steps 3 and 4 until all possible stacking combinations are traversed.

[0030] In one achievable manner, different stacking combinations need to satisfy that the number of copper layers corresponding to each winding and the number of winding turns in each copper layer are not completely the same as those of the traversed stacking combinations, and the copper layers have no sequential relationship.

[0031] Step 6: Compare the copper losses of the local optimal stacking structures corresponding to all stacking combinations, and select the stacking structure with the smallest copper loss as the stacking structure with the global optimal copper loss. This structure is the final winding stacking structure that optimizes the high-frequency copper loss of the planar transformer.

[0032] Through the above steps, the present invention can effectively suppress the high-frequency skin loss and proximity loss of the planar transformer winding and reduce the high-frequency copper loss.

[0033] In one implementation, the winding is suitable for the primary and secondary windings of a two-port transformer, or the primary, secondary, and secondary windings of a multi-port transformer. N Secondary winding.

[0034] In one implementation, the copper layer may be a copper foil, a copper sheet, a planar copper conductor in a printed circuit board, a ceramic circuit board, or a flexible circuit board.

[0035] Compared to traditional methods that optimize winding width and radius, this method significantly optimizes high-frequency AC copper losses while ensuring optimal DC copper losses. Under the same constraints of copper width, thickness, number of PCB layers, number of winding turns, and core parameters, copper losses can be reduced by 5%-75%, improving planar transformer efficiency and overall converter performance. Compared to methods that optimize copper losses through finite element simulation, this method can significantly shorten design time, improve design efficiency, and reduce costs while achieving the same results.

[0036] The following describes a specific embodiment of the present invention by taking the winding stacking structure design of a three-port planar transformer as an example.

[0037] Design flow chart as Figure 2 As shown, there are the following steps: Step 1: Determine the winding parameters. In this embodiment, the operating frequency is 1 MHz, the copper layer is based on a PCB, the number of copper layers is 7, and the copper layer thickness is designed to be 2 oz, which is close to the copper skin depth at 1 MHz. The primary winding has 2 turns and a current of 5A∠0; the secondary winding has 5 turns and a current of 2A∠π / 4; the tertiary winding has 2 turns and a current of 3A∠7π / 6. For convenience, the primary winding is referred to as Winding 1, the secondary winding is Winding 2, and the tertiary winding is Winding 3.

[0038] Step 2: Set up a stacking combination for the winding. In this embodiment, the stacking combination set up for the winding is as follows: Figure 3 As shown in (a) in Figure 1, it is recorded as Case 1. At this time, winding 1 has 2 layers of PCB, each layer has 1 turn, winding 2 has 3 layers of PCB, each layer has 1, 2, and 2 turns respectively, and winding 3 has 2 layers of PCB, each layer has 1 turn.

[0039] Step 3: Calculate the amplitude and phase of the current of each copper layer in the stacked combination described in step 2, and connect the current of each copper layer in the complex plane in the form of vectors according to the optimal path to obtain a local optimal stacked structure. In this embodiment, there are 7 layer current vectors, which are equal to the number of copper layers. Their positions in the complex plane are as follows: Figure 4 As shown. Connect the layer current vectors along the path closest to the origin, and the optimal path is Figure 5 The path shown in (b) in the figure. Figure 5 It can be seen that the optimal path Figure 5 (b) Compared with the non-optimal path Figure 5 In (a), the sum of the squares of the distances from all endpoints to the origin is closer. Thus, the locally optimal stacking structure arrangement for this stacking combination is obtained as core-winding 2 (1 turn)-winding 3 (1 turn)-winding 2 (2 turns)-winding 3 (1 turn)-winding 1 (1 turn)-winding 2 (2 turns)-winding 1 (1 turn)-air gap.

[0040] Step 4: Calculate the copper loss of the local optimal stacking structure based on the preset high-frequency copper loss analytical model.

[0041] In this embodiment, the operating frequency is 1MHz, the skin depth is 66.7um, the copper layer thickness is 2oz, and the copper layer thickness skin depth ratio is

[0042] In this embodiment, the copper layer width w =5mm, the equivalent length of each winding layer is 30mm, and the DC resistance per unit skin depth is obtained as

[0043] In this embodiment, the vector endpoints of the optimal path are

[0044]

[0045]

[0046]

[0047]

[0048]

[0049]

[0050]

[0051] Copper loss is

[0052] Step 5: Set a different stacking combination for the winding, and repeat steps 3 and 4 until all stacking combinations are listed. In this embodiment, the stacking combination is changed as follows: Figure 3 As shown in (b), it is recorded as case 2. After performing steps 3 and 4, we can obtain the local optimal copper loss structure in this stacking combination (case 2): winding 2 (1 turn) - winding 3 (1 turn) - winding 2 (1 turn) - winding 3 (1 turn) - winding 2 (1 turn) - winding 2 (2 turns) - winding 1 (2 turns). The total copper loss of this local optimal copper loss structure is calculated as

[0053] Continue to change the stacking combination and repeat steps 3 and 4. You can get the local optimal structure of the remaining two stacking combinations. Case 3: Winding 2 (1 turn) - Winding 2 (1 turn) - Winding 3 (2 turns) - Winding 2 (1 turn) - Winding 1 (1 turn) - Winding 2 (2 turns) - Winding 1 (1 turn). The total copper loss of this local optimal copper loss structure is

[0054] Case 4: Winding 2 (1 turn) - Winding 2 (1 turn) - Winding 3 (2 turns) - Winding 2 (1 turn) - Winding 2 (1 turn) - Winding 2 (1 turn) - Winding 1 (2 turns)

[0055] Step 6: Compare the copper loss of the locally optimal stacking structures for all stacking combinations to obtain the stacking structure with the global optimal copper loss. In this embodiment, by comparing the copper loss of the locally optimal stacking structure arrangements for the four stacking combinations, it can be determined that the globally optimal copper loss stacking structure is the locally optimal arrangement for Case 1. That is, magnetic core - winding 2 (1 turn) - winding 3 (1 turn) - winding 2 (2 turns) - winding 3 (1 turn) - winding 1 (1 turn) - winding 2 (2 turns) - winding 1 (1 turn) - air gap, with an optimal copper loss of 241.7 mW.

[0056] Figure 6The simulation results are given to verify that the simulation is performed using COMSOL2D magnetic field physics. The simulation results show that there are more than 600 stacking arrangements for case 1, among which the stacking structure corresponding to the minimum loss is winding 2 (1 turn) - winding 3 (1 turn) - winding 2 (2 turns) - winding 3 (1 turn) - winding 1 (1 turn) - winding 2 (2 turns) - winding 1 (1 turn), and the local minimum copper loss is 243mW; there are more than 400 stacking arrangements for case 2, among which the stacking structure corresponding to the minimum loss is winding 2 (1 turn) - winding 3 (1 turn) - winding 2 (1 turn) - winding 3 (1 turn) - winding 2 (1 turn) - winding 2 (2 turns) - winding 1 (2 turns), and the local minimum copper loss is 26 1mW; there are more than 600 stacking arrangements for case 3, among which the stacking structure corresponding to the minimum loss is winding 2 (1 turn) - winding 2 (1 turn) - winding 3 (2 turns) - winding 2 (1 turn) - winding 1 (1 turn) - winding 2 (2 turns) - winding 1 (1 turn), and the local minimum copper loss is 258mW; there are more than 40 stacking arrangements for case 4, among which the stacking structure corresponding to the minimum loss is winding 2 (1 turn) - winding 2 (1 turn) - winding 3 (2 turns) - winding 2 (1 turn) - winding 2 (1 turn) - winding 2 (1 turn) - winding 1 (2 turns), and the local minimum copper loss is 283mW. It can be seen that the local optimal structures in the four cases obtained by simulation are the same as the local optimal structures in the design process of the method proposed in the present invention, and it can be seen that the global optimal structure obtained by simulation is the global optimal copper loss winding stacking structure designed by the method proposed in the present invention. The copper loss calculation error between the simulation and the present invention is less than 1%, verifying the effectiveness of the present invention. It can also be seen that traditional finite element simulations require thousands of simulations to find the optimal solution, while the present invention only requires four local optimal path designs and four copper loss calculations to obtain the optimal solution, greatly improving efficiency. The minimum copper loss structure designed by the present invention reduces copper loss by 5%-75% compared to other stacked structures not designed according to the present invention, under conditions such as the same number of turns, winding parameters, number of PCB layers, and copper thickness, significantly improving the performance of the planar transformer.

[0057] In another embodiment of the present invention, a computer device is provided, which includes a processor and a memory, wherein the memory is used to store a computer program, the computer program includes program instructions, and the processor is used to execute the program instructions stored in the computer storage medium. The processor may be a central processing unit (CPU), or may be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. It is the computing core and control core of the terminal, which is suitable for implementing one or more instructions, specifically suitable for loading and executing one or more instructions in the computer storage medium to implement the corresponding method flow or corresponding function; the processor described in the embodiment of the present invention can be used for the operation of a winding stacking structure design method for optimizing the high-frequency copper loss of a planar transformer.

[0058] In another embodiment of the present invention, a storage medium is provided, specifically a computer-readable storage medium (Memory). The computer-readable storage medium is a memory device in a computer device, used to store programs and data. It is understood that the computer-readable storage medium herein may include both built-in storage media in the computer device and, of course, extended storage media supported by the computer device. The computer-readable storage medium provides storage space that stores the terminal's operating system. Furthermore, the storage space also stores one or more instructions suitable for being loaded and executed by a processor. These instructions may be one or more computer programs (including program code). It should be noted that the computer-readable storage medium herein may be a high-speed RAM memory or a non-volatile memory, such as at least one disk storage device. The processor may load and execute the one or more instructions stored in the computer-readable storage medium to implement the corresponding steps of the method for designing a winding stack structure for optimizing high-frequency copper loss in a planar transformer described in the above-mentioned embodiment.

[0059] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0060] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0061] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0062] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0063] The present invention also provides a computer program product for executing any of the aforementioned methods for designing a winding stack structure for optimizing high-frequency copper loss in a planar transformer. Because the computer program product provided by the present invention and the aforementioned method for designing a winding stack structure for optimizing high-frequency copper loss in a planar transformer are based on the same inventive concept, the computer program product provided by the present invention possesses all the advantages of the aforementioned method for designing a winding stack structure for optimizing high-frequency copper loss in a planar transformer. Therefore, the beneficial effects of the computer program product provided by the present invention will not be detailed here.

[0064] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0065] Finally, it should be noted that the above-described embodiments are only specific implementations of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the above-described embodiments, those skilled in the art should understand that any person skilled in the art can modify or easily conceive of changes to the technical solutions described in the above-described embodiments within the technical scope disclosed by the present invention, or replace some of the technical features therein with equivalents. Such modifications, changes, or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A method for designing a winding stack structure for optimizing high-frequency copper loss of a planar transformer, characterized in that: include: Step 1: Determine the parameters of the planar transformer winding to be optimized, including winding current, number of winding turns, copper layer width, effective length of copper layer, and copper layer thickness; Step 2: setting a stacking combination for the winding based on the parameters of the winding, wherein the stacking combination determines the number of copper layers corresponding to each winding and the number of winding turns in each copper layer, and the copper layers have no sequential relationship; Step 3: Calculate the amplitude and phase of the current of each copper layer in the stacked combination, and connect the currents of each copper layer in the complex plane in the form of vectors along the optimal path to obtain a local optimal stacked structure; the optimal path is determined based on: after the current vectors of each copper layer are connected end to end from the origin, the sum of the squares of the distances of all vector endpoints to the origin is minimized; Step 4: Calculate the copper loss of the local optimal stacked structure based on a preset high-frequency copper loss analytical model; Step 5: setting different stacking combinations for the winding, and repeating steps 3 and 4 until all possible stacking combinations are traversed; Step 6: Compare the copper losses of the local optimal stacking structures corresponding to all stacking combinations, and select the stacking structure with the smallest copper loss as the stacking structure with the global optimal copper loss.

2. The method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer according to claim 1, characterized in that: In any stack-up combination, all windings are located on the same side of the air gap and all copper layers have equal copper thickness.

3. The method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer according to claim 1, characterized in that: The calculation of the amplitude and phase of the current of each copper layer in the stacked combination is specifically as follows: The amplitude and phase of the current in each copper layer are the vector sum of all winding currents in each copper layer.

4. The method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer according to claim 1, characterized in that: The correspondence between the local optimal stacking structure and the optimal path is: the copper layer where the current vector starting from the origin is located is the copper layer farthest from the air gap, and the copper layer where the current vector reaching the end point is located is the copper layer closest to the air gap, and the other layers are also in a one-to-one correspondence in order.

5. The method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer according to claim 1, characterized in that: The high-frequency copper loss analytical model is specifically: Where, is the high frequency copper loss; n is the number of copper layers; ξ is the ratio of copper layer thickness to skin depth; v i-1 and v i From the origin i The two endpoints of the current vector of the copper layer; v 0 is the origin; v n For the end point; R dc|ξ=1 is the DC resistance of the copper layer when the ratio of the copper layer thickness to the skin depth is 1.

6. The method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer according to claim 1, characterized in that: The different stacking combinations must satisfy the requirement that the number of copper layers corresponding to each winding and the number of winding turns in each copper layer are not completely the same as those of the stacking combinations that have been traversed, and the copper layers have no sequential relationship.

7. The method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer according to claim 1, characterized in that: The windings are the primary and secondary windings of a two-port transformer, or the primary, secondary, and secondary windings of a multi-port transformer. N Secondary winding.

8. The method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer according to claim 1, characterized in that: The copper layer is a planar copper conductor in a copper foil, a copper sheet, a printed circuit board, a ceramic circuit board or a flexible circuit board.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer as described in any one of claims 1 to 8 is implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for designing a winding stacking structure for optimizing high-frequency copper loss of a planar transformer as described in any one of claims 1 to 8 is implemented.

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