Misoperation prevention and control method and system for CAM (Computer Aided Manufacturing) manufacturing in PCB (Printed Circuit Board) production

Abstract

The invention relates to the technical field of PCBs, in particular to a misoperation prevention and control method and system for CAM manufacturing in PCB production. According to the method, the lamination structure information of the CAM design data of the target PCB is automatically obtained, and the interlayer signal delay is calculated based on the lamination structure information, so that human judgment errors can be effectively avoided, the drilling overlapping rate is ensured to be within an acceptable range by automatically adjusting the CAM design data, and the drilling efficiency is improved by accurately calculating and adjusting the drilling parameters. It is ensured that the drill hole overlapping rate meets the preset requirement, design errors caused by human negligence, improper use of software tools or flow management vulnerabilities can be effectively avoided, verification is conducted through an automatic simulation system, subjective factors in manual judgment can be eliminated, it is ensured that design data meets the preset process standard, and the design efficiency is improved. Communication obstacles between design and production are reduced, misunderstanding and errors between the design stage and the production stage can be reduced through efficient cooperation, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCBs, and in particular to a method and system for preventing and controlling misoperation of CAM production in PCB production. Background Art

[0002] In PCB production, CAM (computer-aided manufacturing) production is the key link connecting design (CAD) and production. Its core task is to convert design files (such as Gerber files) into process files required for production (such as photolithography files, drilling files, solder mask files, etc.).

[0003] Currently, errors may occur in the CAM production process due to human negligence, improper use of software tools, or process management loopholes. For example, if the design files are verified and judged to be correct based on experience, errors in CAM design data may not be discovered and corrected in time due to errors in experience verification. As a result, the errors will gradually appear in the subsequent production process, directly affecting the quality, cost, and delivery cycle of the PCB. Summary of the Invention

[0004] The main purpose of the present invention is to provide a method for preventing and controlling misoperation of CAM production in PCB production, aiming to solve the technical problems in the prior art.

[0005] The present invention provides a method for preventing and controlling misoperation of CAM production in PCB production, comprising: Acquire lamination structure information of CAM design data of a target PCB, and acquire inter-layer signal delay according to the lamination structure information; Determining whether the inter-layer signal delay is greater than a preset signal delay; If the inter-layer signal delay is greater than the preset signal delay, it is determined that the CAM design data has an inter-layer alignment deviation anomaly; Adjusting CAM design data according to the laminate structure information until the inter-layer signal delay is no greater than a preset signal delay; If the inter-layer signal delay is not greater than the preset signal delay, obtaining drilling parameter information of the CAM design data of the target PCB, and obtaining a drilling overlap rate according to the drilling parameter information; Determining whether the drilling overlap ratio is greater than a preset overlap ratio; If the drilling overlap ratio is greater than a preset overlap ratio, it is determined that the CAM design data has an insufficient overlap ratio anomaly; Adjusting the CAM design data according to the drilling parameter information until the drilling overlap ratio is no greater than a preset overlap ratio; If the drilling overlap ratio is not greater than a preset overlap ratio, the CAM design data is input into a simulation system to obtain a simulation result; Determining whether the simulation results meet the preset process performance indicators; If the simulation result does not meet the preset process performance index, the CAM design data is repaired according to the simulation result to obtain repaired design data, and the repaired design data is marked as qualified design data.

[0006] Preferably, the step of obtaining inter-layer signal delay according to the laminate structure information includes: Acquire characteristic parameters of each dielectric layer according to the laminated structure information, wherein the characteristic parameters include dielectric constant and dielectric thickness; Acquire the transmission line width and the transmission line length according to the laminated structure information, and acquire the corrected average value of the electric field distribution according to the transmission line width, the dielectric constant and the dielectric thickness; Obtaining an effective dielectric constant of the microstrip line according to the corrected average value of the electric field distribution and the dielectric constant, and obtaining a signal transmission line delay according to the effective dielectric constant of the microstrip line and the transmission line length; Obtaining a corresponding single-layer via delay according to each of the dielectric constants and dielectric thicknesses, and obtaining a signal via delay according to multiple single-layer via delays; The inter-layer signal delay is obtained according to the signal via delay and the signal transmission line delay.

[0007] Preferably, the step of adjusting the CAM design data according to the laminate structure information comprises: Acquire the dielectric thickness of each dielectric layer and the first thermal expansion coefficient in the length direction and the second thermal expansion coefficient in the width direction of each dielectric layer according to the laminated structure information; Acquiring a temperature variation range, an original length, and an original width of a target PCB according to the laminate structure information; Obtaining a first equivalent coefficient according to the plurality of medium thicknesses and the first thermal expansion coefficient, and obtaining a horizontal expansion amount according to the temperature variation range, the original length, and the first equivalent coefficient; Obtain a second equivalent coefficient according to the plurality of medium thicknesses and the second thermal expansion coefficient, and obtain a vertical expansion amount according to the temperature variation range, the original width, and the second equivalent coefficient; Obtaining a vertical reference amount and a horizontal reference amount, and obtaining a vertical compensation amount according to the vertical reference amount and the vertical expansion amount; Obtaining a horizontal compensation amount according to the horizontal reference amount and the horizontal expansion amount, and obtaining an inter-layer compensation amount according to the horizontal compensation amount and the vertical compensation amount; The CAM design data is adjusted according to the inter-layer compensation amount.

[0008] Preferably, the step of adjusting the CAM design data according to the drilling parameter information includes: Obtaining target PCB characteristics and drilling characteristics according to the drilling parameter information, and obtaining drilling force, drill cross-sectional area, feed speed, drilling depth, and drilling time according to the drilling characteristics; Obtaining a plate mass and a specific heat capacity according to the target PCB characteristics, and obtaining a plate heat capacity according to the plate mass and the specific heat capacity; Obtaining drilling input heat energy according to the drilling force, feed speed, and drilling time, and obtaining drilling generated heat according to the drilling input heat energy and the heat capacity of the plate; Obtaining a drilling expansion coefficient according to the drilling parameter information, and obtaining a thermal expansion deformation according to the drilling expansion coefficient, the amount of heat generated by drilling, and the drilling depth; Obtaining an elastic modulus of a target PCB, and obtaining an axial stiffness based on the elastic modulus and a cross-sectional area of ​​a drill bit; Obtaining an elastic deformation according to the drilling force and the axial stiffness, and obtaining a drilling compensation amount according to the elastic deformation and the thermal expansion deformation; The CAM design data is adjusted according to the drilling compensation amount.

[0009] Preferably, the step of repairing the CAM design data according to the simulation result to obtain repaired CAM design data comprises: Acquire multiple failure parameter types according to the simulation results, and determine corresponding failure location information according to each failure parameter type; Acquire a target design element in the CAM design data according to each of the failure position information, and acquire an original parameter of each of the target design elements; Obtaining a preset repair strategy library, wherein the preset repair strategy library consists of multiple failure types and one-to-one corresponding repair strategy solutions; According to each of the failure parameter types, a plurality of preliminary parameter adjustment rules are determined by matching the failure parameter type with a preset repair strategy library; Obtaining a correlation degree between the target design element and each preliminary parameter adjustment rule, and selecting the preliminary parameter adjustment rule with the greatest correlation degree as the correlation parameter adjustment rule; Parameter compensation is performed on the corresponding original parameters according to each of the associated parameter adjustment rules to obtain repair CAM design data.

[0010] Preferably, after the step of marking the repair design data as qualified design data, the method further comprises: Acquire original metadata items of the qualified design data, wherein the original metadata items include original number of layers, original line width, original aperture tolerance, and original pad diameter; Obtaining a format conversion rule library, and selecting a preset format conversion rule from the format conversion rule library to convert the qualified design data to obtain a conversion file; Acquire conversion metadata items of the conversion file, wherein the conversion metadata items include conversion layer number, conversion line width, conversion aperture tolerance, and conversion pad diameter; Obtaining a layer number deviation according to the original layer number and the converted layer number, and obtaining a line width deviation according to the original line width and the converted line width; Obtaining an aperture tolerance deviation according to the original aperture tolerance and the converted aperture tolerance, and obtaining a pad diameter deviation according to the original pad diameter and the converted pad diameter; Obtaining a total deviation based on the pad diameter deviation, aperture tolerance deviation, line width deviation, and layer number deviation, and determining whether the total deviation is greater than a preset deviation; If the total deviation is greater than the preset deviation, it is determined that a conversion error occurs, and the process returns to the step of selecting a preset format conversion rule from the format conversion rule library to convert the qualified design data until the total deviation is no greater than the preset deviation; If the total deviation is not greater than the preset deviation, it is determined that the conversion is correct.

[0011] The present application also provides a control system for preventing misoperation of CAM production in PCB production, comprising: An acquisition module, configured to acquire laminate structure information of CAM design data of a target PCB, and acquire inter-layer signal delay based on the laminate structure information; A first judging module, configured to judge whether the inter-layer signal delay is greater than a preset signal delay; If the inter-layer signal delay is greater than the preset signal delay, it is determined that the CAM design data has an inter-layer alignment deviation anomaly; A first adjustment module is configured to adjust the CAM design data according to the laminate structure information until the inter-layer signal delay is no greater than a preset signal delay; If the inter-layer signal delay is not greater than the preset signal delay, obtaining drilling parameter information of the CAM design data of the target PCB, and obtaining a drilling overlap rate according to the drilling parameter information; A second judgment module is used to judge whether the drilling overlap rate is greater than a preset overlap rate; If the drilling overlap ratio is greater than a preset overlap ratio, it is determined that the CAM design data has an insufficient overlap ratio anomaly; A second adjustment module is used to adjust the CAM design data according to the drilling parameter information until the drilling overlap rate is no greater than a preset overlap rate; If the drilling overlap ratio is not greater than a preset overlap ratio, the CAM design data is input into a simulation system to obtain a simulation result; A third judgment module is used to judge whether the simulation result meets the preset process performance index; If the simulation result does not meet the preset process performance index, the CAM design data is repaired according to the simulation result to obtain repaired design data, and the repaired design data is marked as qualified design data.

[0012] Preferably, the acquisition module includes: a first acquiring unit, configured to acquire characteristic parameters of each dielectric layer according to the laminated structure information, wherein the characteristic parameters include a dielectric constant and a dielectric thickness; A second acquisition unit is used to acquire the transmission line width and the transmission line length according to the laminated structure information, and to acquire a corrected average value of the electric field distribution according to the transmission line width, the dielectric constant and the dielectric thickness; a third acquiring unit, configured to acquire an effective dielectric constant of the microstrip line according to the corrected average value of the electric field distribution and the dielectric constant, and acquire a signal transmission line delay according to the effective dielectric constant of the microstrip line and the transmission line length; a fourth acquiring unit, configured to acquire a corresponding single-layer via delay according to each of the dielectric constants and dielectric thicknesses, and acquire a signal via delay according to a plurality of the single-layer via delays; A fifth acquiring unit is configured to acquire an inter-layer signal delay according to the signal via delay and the signal transmission line delay.

[0013] The present invention also provides a computer device including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the steps of the above-mentioned method for preventing and controlling misoperation of CAM production in PCB production are implemented.

[0014] The present invention also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the above-mentioned method for preventing and controlling misoperation of CAM production in PCB production.

[0015] The present invention has the following beneficial effects: by automatically acquiring the laminate structure information of the target PCB's CAM design data and calculating the inter-layer signal delay based on the laminate structure information, the present invention can effectively avoid human judgment errors. By analyzing the signal delay of the CAM design data, it can promptly detect whether the inter-layer signal delay exceeds the preset range. By accurately verifying and adjusting the CAM data, it can reduce the situation of later rework and product failure caused by design errors. By scientifically calculating the drilling parameters, it can reduce the deviation of human judgment. By automatically detecting and adjusting the drilling overlap rate, it can promptly detect and correct potential overlap problems. By automatically adjusting the CAM design data to ensure that the drilling overlap rate is within an acceptable range, these subsequent problems can be avoided, thereby improving production efficiency. By accurately calculating and adjusting the drilling parameters to ensure that the drilling overlap rate meets the preset requirements, it can effectively avoid design errors caused by human negligence, improper use of software tools, or process management loopholes. Verification through an automated simulation system can eliminate subjective factors in human judgment, ensure that the design data meets the predetermined process standards, and reduce communication barriers between design and production. This efficient collaboration can reduce misunderstandings and errors between the design and production stages and improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of a method flow according to an embodiment of the present invention.

[0017] Figure 2 FIG. 1 is a schematic diagram of a system structure according to an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram of the internal structure of a computer device according to an embodiment of the present application.

[0019] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0020] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0021] like Figure 1 As shown, the present application provides a method for preventing and controlling misoperation of CAM production in PCB production, comprising: S1. Obtaining laminate structure information of CAM design data of a target PCB, and obtaining inter-layer signal delay based on the laminate structure information; S2. Determine whether the inter-layer signal delay is greater than a preset signal delay; If the inter-layer signal delay is greater than the preset signal delay, it is determined that the CAM design data has an inter-layer alignment deviation anomaly; S3. Adjusting the CAM design data according to the laminate structure information until the inter-layer signal delay is no greater than a preset signal delay; If the inter-layer signal delay is not greater than the preset signal delay, obtaining drilling parameter information of the CAM design data of the target PCB, and obtaining a drilling overlap rate according to the drilling parameter information; S4, determining whether the drilling overlap ratio is greater than a preset overlap ratio; If the drilling overlap ratio is greater than a preset overlap ratio, it is determined that the CAM design data has an insufficient overlap ratio anomaly; S5. Adjusting the CAM design data according to the drilling parameter information until the drilling overlap ratio is no greater than a preset overlap ratio; If the drilling overlap ratio is not greater than a preset overlap ratio, the CAM design data is input into a simulation system to obtain a simulation result; S6. Determine whether the simulation results meet the preset process performance indicators; If the simulation result meets the preset process performance index, the CAM design data is marked as qualified design data; S7. If the simulation result does not meet the preset process performance index, the CAM design data is repaired according to the simulation result to obtain repaired design data, and the repaired design data is marked as qualified design data.

[0022] As described in the above steps S1-S7, the present invention obtains the laminated structure information of the CAM design data of the target PCB, and obtains the interlayer signal delay based on the laminated structure information, and judges whether the interlayer signal delay is greater than the preset signal delay. If the interlayer signal delay is greater than the preset signal delay, it is determined that the CAM design data has an abnormal interlayer alignment deviation. At this time, the CAM design data is adjusted according to the laminated structure information until the interlayer signal delay is no greater than the preset signal delay. By automatically obtaining the laminated structure information of the CAM design data of the target PCB and calculating the interlayer signal delay based on this information, human judgment errors can be effectively avoided. This is because traditionally designers often rely on experience to judge whether the design is suitable, but this method is easily affected by personal experience differences, fatigue or other factors, and is prone to misjudgment. The present invention reduces subjective factors and improves the accuracy and reliability of design verification through scientific calculations and automated processes. By analyzing the signal delay of CAM design data, it can Timely detection of whether the inter-layer signal delay exceeds the preset range, so that design defects can be discovered and corrected before production, avoiding the situation where problems are discovered during the production process, which helps to ensure the quality of the final product. If the inter-layer signal delay exceeds the preset value, the CAM design data can be adjusted in time to avoid the wrong design from flowing into the production process. This reduces rework or re-production due to unqualified design, saving production cycle, material cost and labor cost. By accurately verifying and adjusting the CAM data, the later rework and product failure caused by design errors can be reduced, thereby reducing costs. Through scientific analysis and adjustment of the inter-layer signal delay, better coordination between the design and production processes can be ensured. If the inter-layer signal delay is not greater than the preset signal delay, the drilling parameter information of the CAM design data of the target PCB is obtained, and the center distance and aperture of each two adjacent drill holes are obtained based on the drilling parameter information, and the drilling overlap rate is calculated based on each center distance and aperture. The calculation formula is: ; Wherein, Z(CD) represents the drilling overlap rate, K(J1) represents the aperture of the first drill hole, K(J2) represents the aperture of the second drill hole, and Z(XJ) represents the center distance. It is judged whether the drilling overlap rate is greater than the preset overlap rate. If the drilling overlap rate is greater than the preset overlap rate, it is determined that the CAM design data has an abnormality of insufficient overlap rate. At this time, the CAM design data is adjusted according to the drilling parameter information until the drilling overlap rate is not greater than the preset overlap rate. The present invention reduces the deviation of human judgment through scientific calculation of drilling parameters, calculates the center distance and aperture of each pair of adjacent drill holes, ensures that the drilling layout meets the design specifications, and effectively avoids problems caused by human negligence or improper use of tools. The drilling overlap rate directly affects the manufacturing and subsequent If the drilling overlap rate exceeds the preset standard, problems may occur in the production process, such as non-compliant hole diameters, increased difficulty in machining, and even electrical performance problems of the circuit. By automatically detecting and adjusting the drilling overlap rate, potential overlap problems can be discovered and corrected in a timely manner, thereby ensuring the manufacturing quality of the PCB design. By automatically adjusting the CAM design data to ensure that the drilling overlap rate is within an acceptable range, these subsequent problems can be avoided, thereby improving production efficiency, reducing the defective rate, saving time and cost. A drilling overlap rate that is too high may result in substandard drilling quality, which in turn affects subsequent welding, assembly and other processes, and may even affect the functional stability and reliability of the PCB. By judging and adjusting the drilling overlap rate in advance, Effectively avoid technical risks in production, ensure the smooth progress of each link, thereby improving product reliability and consistency. By automatically analyzing and adjusting the drilling overlap rate, communication problems between design and production can be reduced, ensuring that there are no problems with the design files during the production process. By accurately calculating and adjusting the drilling parameters, ensuring that the drilling overlap rate meets the preset requirements, it can effectively avoid design errors caused by human negligence, improper use of software tools or process management loopholes. If the drilling overlap rate is not greater than the preset overlap rate, the CAM design data is input into the simulation system to obtain the simulation results, and it is judged whether the simulation results meet the preset process performance indicators. If the simulation results meet the preset process performance indicators, the CAM design data is marked as qualified design data. If the simulation result does not meet the preset process performance index, the CAM design data is repaired according to the simulation result to obtain the repaired design data, and the repaired design data is marked as qualified design data. It is verified by an automated simulation system, which can eliminate the subjective factors in manual judgment and ensure that the design data meets the predetermined process standards. By using the simulation system for verification in the design stage, it can be discovered early whether the design data meets the process performance requirements. Through simulation verification, the design can be optimized in the design stage to ensure that the design data meets the preset process performance indicators, thereby ensuring the manufacturing quality and performance of the PCB. After the CAM design data is verified by simulation, it can be guaranteed that the design meets the process requirements, reducing the communication barriers between design and production.This efficient collaboration can reduce misunderstandings and errors between the design and production stages and improve work efficiency.

[0023] In one embodiment, the step S1 of acquiring inter-layer signal delay according to the laminate structure information includes: S11. Acquire characteristic parameters of each dielectric layer according to the laminated structure information, wherein the characteristic parameters include dielectric constant and dielectric thickness; S12. Obtain the transmission line width and the transmission line length according to the laminated structure information, and obtain a corrected average value of the electric field distribution according to the transmission line width, dielectric constant, and dielectric thickness, wherein the calculation formula is: ; Where D(FB) represents the corrected average value of the electric field distribution, J(DS) represents the dielectric constant, J(HD) represents the dielectric thickness, and C(XK) represents the transmission line width; S13, obtaining an effective dielectric constant of the microstrip line according to the corrected average value of the electric field distribution and the dielectric constant, and obtaining a signal transmission line delay according to the effective dielectric constant of the microstrip line and the transmission line length; S14, obtaining a corresponding single-layer via delay according to each dielectric constant and dielectric thickness, and obtaining a signal via delay according to multiple single-layer via delays; S15. Obtaining inter-layer signal delay according to the signal via delay and the signal transmission line delay.

[0024] As described in the above steps S11-S15, the present invention obtains the dielectric constant and dielectric thickness of the characteristic parameters of each dielectric layer through the laminated structure information, obtains the transmission line width and transmission line length according to the laminated structure information, and obtains the electric field distribution corrected average value according to the transmission line width, dielectric constant and dielectric thickness, obtains the effective dielectric constant of the microstrip line according to the electric field distribution corrected average value and the dielectric constant, and obtains the signal transmission line delay according to the effective dielectric constant of the microstrip line and the transmission line length, obtains the corresponding single-layer via delay according to each dielectric constant and dielectric thickness, obtains the signal via delay according to multiple single-layer via delays, and obtains the inter-layer signal delay according to the signal via delay and the signal transmission line delay. The calculated physical parameters such as electric field distribution, effective dielectric constant, signal delay, etc. can greatly reduce human intervention and negligence, ensure the accuracy and consistency of the design, and help designers accurately obtain the characteristics of the microstrip line through precise parameter calculation and optimization, thereby avoiding erroneous judgment and ensuring the accuracy of electrical performance. In PCB design, parameters such as signal transmission delay and via delay directly affect circuit performance, especially It is even more critical in high-frequency signal transmission. By accurately calculating the characteristic parameters of each dielectric layer, the electric field distribution correction of the transmission line, and the signal transmission delay, every detail of the design can be finely controlled, signal problems caused by design errors can be reduced, and signal integrity can be guaranteed. It is more scientific and accurate than traditional experience-based verification methods, and can more effectively avoid design errors caused by negligence. It can accurately calculate the various parameters of the transmission line and dielectric layer before production, discover potential problems in advance and correct them in time, avoiding the tedious work of later corrections. By accurately calculating the dielectric constant, signal transmission delay and other parameters of each layer, such waste can be avoided in the design stage, ensuring seamless connection between design and production, thereby reducing manufacturing costs and improving production efficiency. By accurately calculating the generated data, the accuracy of the design file is enhanced, making the CAM process more efficient. By obtaining accurate electric field distribution, signal delay and other data, the CAM tool can better execute the design intent, avoid problems caused by improper tool settings or parameter errors, and ensure the stability and controllability of the production process.

[0025] In one embodiment, the step S3 of adjusting the CAM design data according to the laminate structure information includes: S31, acquiring the dielectric thickness of each dielectric layer and the first thermal expansion coefficient in the length direction and the second thermal expansion coefficient in the width direction of each dielectric layer according to the laminated structure information; S32, acquiring a temperature variation range, an original length, and an original width of a target PCB according to the laminate structure information; S33, obtaining a first equivalent coefficient according to the plurality of medium thicknesses and the first thermal expansion coefficient, and obtaining a horizontal expansion amount according to the product of the temperature variation range, the original length, and the first equivalent coefficient; S34, obtaining a second equivalent coefficient according to the plurality of medium thicknesses and the second thermal expansion coefficient, and obtaining a vertical expansion amount according to the product of the temperature variation range, the original width, and the second equivalent coefficient; S35, obtaining a vertical reference amount and a horizontal reference amount, and obtaining a vertical compensation amount according to the vertical reference amount and the vertical expansion amount; S36. Obtain a horizontal compensation amount according to the horizontal reference amount and the horizontal expansion amount, and obtain an inter-layer compensation amount according to the horizontal compensation amount and the vertical compensation amount; S37. Adjust the CAM design data according to the inter-layer compensation amount.

[0026] As described in the above steps S31-S37, the present invention obtains the dielectric thickness of each dielectric layer and the first thermal expansion coefficient of each dielectric layer in the length direction and the second thermal expansion coefficient in the width direction through the laminated structure information, obtains the temperature variation range, the original length and the original width of the target PCB according to the laminated structure information, obtains the first equivalent coefficient according to multiple dielectric thicknesses and the first thermal expansion coefficient, obtains the horizontal expansion amount according to the temperature variation range, the original length and the first equivalent coefficient, obtains the second equivalent coefficient according to the multiple dielectric thicknesses and the second thermal expansion coefficient, obtains the vertical expansion amount according to the temperature variation range, the original width and the second equivalent coefficient, obtains the vertical reference amount and the horizontal reference amount, obtains the vertical compensation amount according to the vertical reference amount and the vertical expansion amount, obtains the horizontal compensation amount according to the horizontal reference amount and the horizontal expansion amount, obtains the interlayer compensation amount according to the horizontal compensation amount and the vertical compensation amount, and adjusts the CAM design data according to the interlayer compensation amount. In the traditional CAM design process, there may be a situation where designers rely on experience to verify and judge In this case, this method is highly subjective and easily limited by personal experience and judgment accuracy. However, through calculation and adjustment by the above method, accurate compensation data and adjustment information can be provided according to the actual laminate structure, dielectric thickness, thermal expansion coefficient and other physical quantities, reducing the occurrence of human judgment errors. By obtaining the thickness and thermal expansion coefficient of each dielectric layer and combining it with parameters such as the temperature change range, the expansion amount in each direction can be accurately calculated, thereby obtaining a more accurate equivalent coefficient, ensuring that the design file can take into account the impact of temperature changes on the PCB structure, and can significantly improve the adaptability of the design file to the actual production environment, avoiding problems such as interlayer misalignment and deformation caused by thermal expansion problems. By conducting a detailed analysis of each dielectric layer, obtaining the relevant expansion amount and compensation amount, and adjusting the CAM design data, thermal expansion problems that may occur in the production process can be considered in advance in the design stage, thereby resolving potential risks before production and avoiding design data errors or physical problems in the later production process. This not only improves production stability and reliability, but also effectively reduces rework rate and repair costs. Accurately calculating and adjusting the thermal expansion compensation amount of each layer can ensure that the PCB has better dimensional stability and thermal adaptability in actual use, thereby improving the overall quality of the PCB and reducing design failures caused by uneven thermal expansion. By using this adjustment method based on physical models and thermal expansion calculations, the optimization and correction of CAM design data can be integrated into the design process in advance, thereby better controlling every link of production and improving overall production efficiency. This automated and standardized process can greatly improve work efficiency and accuracy, and avoid potential risks caused by human factors.

[0027] In one embodiment, the step S5 of adjusting the CAM design data according to the drilling parameter information includes: S51. Acquire target PCB characteristics and drilling characteristics according to the drilling parameter information, and acquire drilling force, drill cross-sectional area, feed speed, drilling depth, and drilling time according to the drilling characteristics; S52, obtaining a plate mass and a specific heat capacity according to the target PCB characteristics, and obtaining a plate heat capacity according to the product of the plate mass and the specific heat capacity; S53, obtaining drilling input heat energy according to the drilling force, feed speed, and drilling time, and obtaining drilling generated heat according to the product of the drilling input heat energy and the heat capacity of the plate; S54, obtaining a drilling expansion coefficient according to the drilling parameter information, and obtaining a thermal expansion deformation according to the product of the drilling expansion coefficient, the heat generated by drilling, and the drilling depth; S55, obtaining the elastic modulus of the target PCB, and obtaining the axial stiffness according to the product of the elastic modulus and the cross-sectional area of ​​the drill bit; S56, obtaining an elastic deformation according to a quotient obtained by dividing the drilling force by the axial stiffness, and obtaining a drilling compensation amount according to the elastic deformation and the thermal expansion deformation; S57: Adjust the CAM design data according to the drilling compensation amount.

[0028] As described in the above steps S51-S57, the present invention obtains target PCB characteristics and drilling characteristics through drilling parameter information, and obtains drilling force, drill cross-sectional area, feed speed, drilling depth and drilling time according to the drilling characteristics, obtains plate mass and specific heat capacity according to the target PCB characteristics, and obtains plate heat capacity according to the plate mass and specific heat capacity, obtains drilling input heat energy according to the drilling force, feed speed and drilling time, and obtains drilling generated heat according to the drilling input heat energy and plate heat capacity, obtains drilling expansion coefficient according to drilling parameter information, and obtains thermal expansion deformation according to the drilling expansion coefficient, drilling generated heat and drilling depth, obtains elastic modulus of the target PCB, and obtains elastic modulus according to elastic modulus. The axial stiffness is obtained from the modulus and the cross-sectional area of ​​the drill bit, the elastic deformation is obtained according to the drilling force and the axial stiffness, and the drilling compensation is obtained according to the elastic deformation and the thermal expansion deformation. The CAM design data is adjusted according to the drilling compensation. Through multi-dimensional analysis based on drilling parameters, PCB characteristics and plate characteristics, various influencing factors in the drilling process (such as drilling force, drilling heat, thermal expansion deformation, etc.) can be accurately calculated from multiple levels. This makes the designed CAM data more accurate, thereby effectively reducing design errors caused by incorrect experience judgment or improper use of tools. Through automation and a model based on scientific calculations, this method eliminates human error. In order to accurately judge the deviation, it can more accurately identify potential design problems and avoid errors in the subsequent production process. It dynamically adjusts CAM design data according to factors such as drilling parameters, board characteristics, thermal expansion, etc. This real-time adjustment capability can foresee and correct potential manufacturing problems in the design stage, reducing the complexity of later debugging and correction, and improving production stability. Through accurate heat calculation, expansion deformation calculation, and adjustment of drilling compensation, errors caused by factors such as temperature changes and material expansion can be predicted and compensated in the design stage. This can effectively reduce defective products in the production process, reduce rework and waste, thereby improving production efficiency and shortening production cycle. Effective heat and expansion compensation can ensure a smoother drilling process, avoid unnecessary waste and machine failures, and reduce the workload of manual inspection and adjustment, saving costs. Through detailed calculation and analysis, human errors and improper judgments in the traditional CAM design process are avoided, while improving the accuracy, production efficiency, product quality and reliability of PCB design. By timely adjusting design data, the system can effectively reduce design errors caused by lack of experience or tool problems, further optimize the production process, reduce costs and ensure product quality, thereby strongly supporting the precision, automation and efficiency of PCB manufacturing.

[0029] In one embodiment, the step S7 of repairing the CAM design data according to the simulation result to obtain repaired CAM design data includes: S71. Acquire multiple failure parameter types according to the simulation results, and determine corresponding failure location information according to each failure parameter type; S72, acquiring a target design element in the CAM design data according to each of the failure position information, and acquiring an original parameter of each of the target design elements; S73. Obtain a preset repair strategy library, wherein the preset repair strategy library consists of multiple failure types and one-to-one corresponding repair strategy solutions; S74, determining a plurality of preliminary parameter adjustment rules based on matching each of the failure parameter types with a preset repair strategy library; S75, obtaining the degree of association between the target design element and each preliminary parameter adjustment rule, and selecting the preliminary parameter adjustment rule with the greatest degree of association as the associated parameter adjustment rule; S76. Perform parameter compensation on the corresponding original parameters according to each of the associated parameter adjustment rules to obtain repair CAM design data.

[0030] As described in the above steps S71-S76, the present invention obtains multiple failure parameter types through simulation results, and determines the corresponding failure position information according to each failure parameter type, obtains the target design element in the CAM design data according to each failure position information, obtains the original parameters of each target design element, obtains a preset repair strategy library, matches each failure parameter type with the preset repair strategy library, determines multiple preliminary parameter adjustment rules, obtains the degree of association between the target design element and each preliminary parameter adjustment rule, and selects the preliminary parameter adjustment rule with the largest degree of association as the associated parameter adjustment rule, performs parameter compensation on the corresponding original parameter according to each associated parameter adjustment rule, obtains repaired CAM design data, automatically identifies failure parameters through simulation results, and automatically matches repair plans according to the preset repair strategy library, can timely discover and correct potential errors in the design, thereby reducing the risk caused by human negligence, ensures more objective and accurate judgment through specific simulation results and preset repair strategies, reduces design defects caused by experience errors, and the repair strategy library corresponding to each failure parameter type can be used according to specific This method can perform targeted parameter repairs for different types of failure problems, thereby improving the accuracy and quality of the overall design and ensuring that the design data is more in line with production requirements. By discovering and repairing potential problems in advance, it avoids the need for rework after design errors are discovered during the production process, thereby greatly reducing the cost and time of rework. Timely correction of design files can effectively reduce production delays caused by errors, thereby shortening the delivery cycle, reducing production costs, and improving product delivery efficiency. By repairing according to the preset repair strategy library, the system can adapt to different types of design failures and provide a variety of repair solutions. By establishing a standardized repair strategy library and parameter adjustment rules, the systematicness and standardization of the entire CAM production process are enhanced. This not only reduces human interference and errors, but also ensures the traceability and standardization of the design repair process, which can effectively improve the quality management level of the entire design and production process, thereby having significant advantages in improving product quality, reducing costs and delivery cycles.

[0031] In one embodiment, after step S7 of marking the repaired design data as qualified design data, the method further includes: S77, obtaining original metadata items of the qualified design data, wherein the original metadata items include original number of layers, original line width, original aperture tolerance, and original pad diameter; S78, obtaining a format conversion rule library, and selecting a preset format conversion rule from the format conversion rule library to convert the qualified design data to obtain a conversion file; S79, obtaining conversion metadata items of the conversion file, wherein the conversion metadata items include conversion layer number, conversion line width, conversion aperture tolerance, and conversion pad diameter; S710, obtaining a layer number deviation according to the original layer number and the converted layer number, and obtaining a line width deviation according to the original line width and the converted line width; S711, obtaining an aperture tolerance deviation according to the original aperture tolerance and the converted aperture tolerance, and obtaining a pad diameter deviation according to the original pad diameter and the converted pad diameter; S712, obtaining a total deviation based on the pad diameter deviation, aperture tolerance deviation, line width deviation, and layer number deviation, and determining whether the total deviation is greater than a preset deviation; If the total deviation is greater than the preset deviation, it is determined that a conversion error occurs, and the process returns to the step of selecting a preset format conversion rule from the format conversion rule library to convert the qualified design data until the total deviation is no greater than the preset deviation; If the total deviation is not greater than the preset deviation, it is determined that the conversion is correct.

[0032] As described in the above steps S77-S712, the present invention obtains a format conversion rule library and selects a preset format conversion rule from the format conversion rule library to convert the output PCB design file to obtain a converted file, obtains the layer deviation according to the original layer number of the output PCB design file and the converted layer number of the converted file, obtains the line width deviation according to the original line width of the output PCB design file and the converted line width of the converted file, obtains the aperture tolerance deviation according to the original aperture tolerance of the output PCB design file and the converted aperture tolerance of the converted file, obtains the pad diameter deviation according to the original pad diameter of the output PCB design file and the converted pad diameter of the converted file, obtains the total deviation according to the pad diameter deviation, aperture tolerance deviation, line width deviation and layer deviation, and judges whether the total deviation is greater than the preset deviation. If the total deviation is greater than the preset deviation, it is determined that the conversion is wrong, and returns to the step of selecting a preset format conversion rule from the format conversion rule library to convert the output PCB design file until the total deviation is not greater than the preset deviation. If the total deviation is not greater than the preset deviation, it is determined that the conversion is correct, and the result is compared. By comparing the differences in key parameters (such as the number of layers, line width, aperture tolerance, and pad diameter) between the original design file and the converted file, it is possible to ensure that key information in the design file (such as the number of layers, dimensions, and tolerances) is not lost or distorted when converting between different design software. By precisely controlling the conversion process, the deviation between the design and actual production is reduced, ensuring that the design intent is accurately reflected. Errors during the format conversion process (such as lost information and dimensional deviation) are common problems in the PCB manufacturing process, especially when converting between different design software. By setting a threshold for total deviation and repeatedly executing the format conversion rules until the total deviation meets the preset standard, this self-checking and automatic correction mechanism can effectively reduce the occurrence of format conversion errors and ensure that the file remains consistent during the conversion process. By precisely controlling these deviations, it can be ensured that the produced PCB meets the design requirements, thereby significantly improving the quality and reliability of the final product. If format conversion errors are not discovered in time, they may lead to substandard product quality, which in turn requires rework or redoing, increasing production costs.Through the above method, potential errors can be discovered and corrected in the early stage of the conversion process, thus avoiding the accumulation of errors and reducing the risk and cost of rework. The automated format conversion and deviation detection process makes the entire workflow more efficient. Once the total deviation is found to be greater than the preset value, the system will automatically return and execute the new conversion rule until the deviation is less than the preset standard. This automated detection and adjustment mechanism greatly improves the efficiency of the conversion process, reduces the need for manual intervention, and thus improves the efficiency of the entire production process. Deviation verification is performed for each format conversion, and the system records and tracks the process of each conversion, which not only enhances the consistency of the data, but also provides complete traceability, making it convenient to trace possible design or conversion problems in the later stage. By selecting preset rules in the format conversion rule library and automatically adjusting according to the detected deviations, the system can flexibly adjust according to the actual situation. The conversion strategy can be adjusted flexibly, which not only improves the intelligence level of the system, but also adapts to the differences between different design software and production requirements, thereby enhancing the applicability and flexibility of the system. During the PCB design process, it is often necessary to convert design files from one software platform to another. Different software may use different file formats and standards, resulting in deviations during conversion. The present invention sets format conversion rules and systematically controls deviations to enhance cross-platform and cross-software compatibility, ensuring that files between different design platforms can be transmitted and converted correctly without error, and ensuring that the final output design files have high consistency, accuracy and operability in the actual manufacturing process, which helps to improve production efficiency, reduce rework costs, and improve product quality. At the same time, it enhances the synergy between design and manufacturing, ensuring that the final performance of the product meets the design requirements.

[0033] like Figure 2 As shown, the present application also provides a control system for preventing misoperation of CAM production in PCB production, comprising: An acquisition module, configured to acquire laminate structure information of CAM design data of a target PCB, and acquire inter-layer signal delay based on the laminate structure information; A first judging module, configured to judge whether the inter-layer signal delay is greater than a preset signal delay; If the inter-layer signal delay is greater than the preset signal delay, it is determined that the CAM design data has an inter-layer alignment deviation anomaly; A first adjustment module is configured to adjust the CAM design data according to the laminate structure information until the inter-layer signal delay is no greater than a preset signal delay; If the inter-layer signal delay is not greater than the preset signal delay, obtaining drilling parameter information of the CAM design data of the target PCB, and obtaining a drilling overlap rate according to the drilling parameter information; A second judgment module is used to judge whether the drilling overlap rate is greater than a preset overlap rate; If the drilling overlap ratio is greater than a preset overlap ratio, it is determined that the CAM design data has an insufficient overlap ratio anomaly; A second adjustment module is used to adjust the CAM design data according to the drilling parameter information until the drilling overlap rate is no greater than a preset overlap rate; If the drilling overlap ratio is not greater than a preset overlap ratio, the CAM design data is input into a simulation system to obtain a simulation result; A third judgment module is used to judge whether the simulation result meets the preset process performance index; If the simulation result meets the preset process performance index, the CAM design data is marked as qualified design data; If the simulation result does not meet the preset process performance index, the CAM design data is repaired according to the simulation result to obtain repaired design data, and the repaired design data is marked as qualified design data.

[0034] In one embodiment, the acquisition module includes: a first acquiring unit, configured to acquire characteristic parameters of each dielectric layer according to the laminated structure information, wherein the characteristic parameters include a dielectric constant and a dielectric thickness; A second acquisition unit is used to acquire the transmission line width and the transmission line length according to the laminated structure information, and to acquire a corrected average value of the electric field distribution according to the transmission line width, the dielectric constant and the dielectric thickness; a third acquiring unit, configured to acquire an effective dielectric constant of the microstrip line according to the corrected average value of the electric field distribution and the dielectric constant, and acquire a signal transmission line delay according to the effective dielectric constant of the microstrip line and the transmission line length; a fourth acquiring unit, configured to acquire a corresponding single-layer via delay according to each of the dielectric constants and dielectric thicknesses, and acquire a signal via delay according to a plurality of the single-layer via delays; A fifth acquiring unit is configured to acquire an inter-layer signal delay according to the signal via delay and the signal transmission line delay.

[0035] It should be noted that each module and unit in the misoperation prevention control system produced by CAM in PCB production corresponds one-to-one to the steps in the misoperation prevention control method produced by CAM in PCB production.

[0036] like Figure 3 As shown, the present application also provides a computer device, which can be a server, and its internal structure can be as shown in FIG. Figure 3As shown. The computer device includes a processor, a memory, a network interface and a database connected via a system bus. The processor of the computer design is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store all data required for the process of the misoperation prevention and control method of CAM production in PCB production. The network interface of the computer device is used to communicate with an external terminal via a network connection. When the computer program is executed by the processor, the misoperation prevention and control method of CAM production in PCB production is implemented.

[0037] Those skilled in the art will understand that Figure 3 The structure shown in is merely a block diagram of a portion of the structure related to the present application solution and does not constitute a limitation on the computer device to which the present application solution is applied.

[0038] An embodiment of the present application also provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, any of the above-mentioned methods for preventing and controlling misoperation of CAM production in PCB production is implemented.

[0039] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided in this application and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct RAM bus dynamic RAM (DRDRAM), and RAM bus dynamic RAM (RDRAM).

[0040] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, apparatus, article, or method comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, apparatus, article, or method. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, apparatus, article, or method comprising the element.

[0041] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for preventing and controlling misoperation of CAM in PCB production, characterized in that: include: Acquire lamination structure information of CAM design data of a target PCB, and acquire inter-layer signal delay according to the lamination structure information; determining whether the inter-layer signal delay is greater than a preset signal delay; if so, determining that the CAM design data has an inter-layer alignment deviation anomaly, and adjusting the CAM design data according to the laminate structure information until the inter-layer signal delay is no greater than the preset signal delay; If the inter-layer signal delay is not greater than the preset signal delay, obtaining drilling parameter information of the CAM design data of the target PCB, and obtaining a drilling overlap rate according to the drilling parameter information; determining whether the drilling overlap ratio is greater than a preset overlap ratio, and if so, determining that the CAM design data has an insufficient overlap ratio anomaly, and adjusting the CAM design data according to the drilling parameter information until the drilling overlap ratio is no greater than the preset overlap ratio; If the drilling overlap ratio is not greater than a preset overlap ratio, the CAM design data is input into a simulation system to obtain a simulation result; Determining whether the simulation results meet the preset process performance indicators; If the simulation result does not meet the preset process performance index, the CAM design data is repaired according to the simulation result to obtain repaired design data, and the repaired design data is marked as qualified design data.

2. The method for preventing and controlling CAM misoperation in PCB production according to claim 1, characterized in that: The step of obtaining inter-layer signal delay according to the laminate structure information includes: Acquire characteristic parameters of each dielectric layer according to the laminated structure information, wherein the characteristic parameters include dielectric constant and dielectric thickness; Acquire the transmission line width and the transmission line length according to the laminated structure information, and acquire the corrected average value of the electric field distribution according to the transmission line width, the dielectric constant and the dielectric thickness; Obtaining an effective dielectric constant of the microstrip line according to the corrected average value of the electric field distribution and the dielectric constant, and obtaining a signal transmission line delay according to the effective dielectric constant of the microstrip line and the transmission line length; Obtaining a corresponding single-layer via delay according to each of the dielectric constants and dielectric thicknesses, and obtaining a signal via delay according to multiple single-layer via delays; The inter-layer signal delay is obtained according to the signal via delay and the signal transmission line delay.

3. The method for preventing and controlling CAM misoperation in PCB production according to claim 1, characterized in that: The step of adjusting the CAM design data according to the laminate structure information includes: Acquire the dielectric thickness of each dielectric layer and the first thermal expansion coefficient in the length direction and the second thermal expansion coefficient in the width direction of each dielectric layer according to the laminated structure information; Acquiring a temperature variation range, an original length, and an original width of a target PCB according to the laminate structure information; Obtaining a first equivalent coefficient according to the plurality of medium thicknesses and the first thermal expansion coefficient, and obtaining a horizontal expansion amount according to the temperature variation range, the original length, and the first equivalent coefficient; Obtain a second equivalent coefficient according to the plurality of medium thicknesses and the second thermal expansion coefficient, and obtain a vertical expansion amount according to the temperature variation range, the original width, and the second equivalent coefficient; Obtaining a vertical reference amount and a horizontal reference amount, and obtaining a vertical compensation amount according to the vertical reference amount and the vertical expansion amount; Obtaining a horizontal compensation amount according to the horizontal reference amount and the horizontal expansion amount, and obtaining an inter-layer compensation amount according to the horizontal compensation amount and the vertical compensation amount; The CAM design data is adjusted according to the inter-layer compensation amount.

4. The method for preventing and controlling CAM production errors in PCB production according to claim 1, characterized in that: The step of adjusting the CAM design data according to the drilling parameter information includes: Obtaining target PCB characteristics and drilling characteristics according to the drilling parameter information, and obtaining drilling force, drill cross-sectional area, feed speed, drilling depth, and drilling time according to the drilling characteristics; Obtaining a plate mass and a specific heat capacity according to the target PCB characteristics, and obtaining a plate heat capacity according to the plate mass and the specific heat capacity; Obtaining drilling input heat energy according to the drilling force, feed speed, and drilling time, and obtaining drilling generated heat according to the drilling input heat energy and the heat capacity of the plate; Obtaining a drilling expansion coefficient according to the drilling parameter information, and obtaining a thermal expansion deformation according to the drilling expansion coefficient, the amount of heat generated by drilling, and the drilling depth; Obtaining an elastic modulus of a target PCB, and obtaining an axial stiffness based on the elastic modulus and a cross-sectional area of ​​a drill bit; Obtaining an elastic deformation according to the drilling force and the axial stiffness, and obtaining a drilling compensation amount according to the elastic deformation and the thermal expansion deformation; The CAM design data is adjusted according to the drilling compensation amount.

5. The method for preventing and controlling CAM production errors in PCB production according to claim 1, characterized in that: The step of repairing the CAM design data according to the simulation result to obtain repaired CAM design data comprises: Acquire multiple failure parameter types according to the simulation results, and determine corresponding failure location information according to each failure parameter type; Acquire a target design element in the CAM design data according to each of the failure position information, and acquire an original parameter of each of the target design elements; Obtaining a preset repair strategy library, wherein the preset repair strategy library consists of multiple failure types and one-to-one corresponding repair strategy solutions; According to each of the failure parameter types, a plurality of preliminary parameter adjustment rules are determined by matching the failure parameter type with a preset repair strategy library; Obtaining a correlation degree between the target design element and each preliminary parameter adjustment rule, and selecting the preliminary parameter adjustment rule with the greatest correlation degree as the correlation parameter adjustment rule; Parameter compensation is performed on the corresponding original parameters according to each of the associated parameter adjustment rules to obtain repair CAM design data.

6. The method for preventing and controlling CAM production errors in PCB production according to claim 1, characterized in that: After the step of marking the repaired design data as qualified design data, the method further includes: Acquire original metadata items of the qualified design data, wherein the original metadata items include original number of layers, original line width, original aperture tolerance, and original pad diameter; Obtaining a format conversion rule library, and selecting a preset format conversion rule from the format conversion rule library to convert the qualified design data to obtain a conversion file; Acquire conversion metadata items of the conversion file, wherein the conversion metadata items include conversion layer number, conversion line width, conversion aperture tolerance, and conversion pad diameter; Obtaining a layer number deviation according to the original layer number and the converted layer number, and obtaining a line width deviation according to the original line width and the converted line width; Obtaining an aperture tolerance deviation according to the original aperture tolerance and the converted aperture tolerance, and obtaining a pad diameter deviation according to the original pad diameter and the converted pad diameter; Obtaining a total deviation based on the pad diameter deviation, aperture tolerance deviation, line width deviation, and layer number deviation, and determining whether the total deviation is greater than a preset deviation; If the total deviation is greater than the preset deviation, it is determined that a conversion error occurs, and the process returns to the step of selecting a preset format conversion rule from the format conversion rule library to convert the qualified design data until the total deviation is no greater than the preset deviation; If the total deviation is not greater than the preset deviation, it is determined that the conversion is correct.

7. A control system for preventing misoperation of CAM in PCB production, characterized in that: include: An acquisition module, configured to acquire laminate structure information of CAM design data of a target PCB, and acquire inter-layer signal delay based on the laminate structure information; A first judging module, configured to judge whether the inter-layer signal delay is greater than a preset signal delay; If the inter-layer signal delay is greater than the preset signal delay, it is determined that the CAM design data has an inter-layer alignment deviation anomaly; A first adjustment module is configured to adjust the CAM design data according to the laminate structure information until the inter-layer signal delay is no greater than a preset signal delay; If the inter-layer signal delay is not greater than the preset signal delay, obtaining drilling parameter information of the CAM design data of the target PCB, and obtaining a drilling overlap rate according to the drilling parameter information; A second judgment module is used to judge whether the drilling overlap rate is greater than a preset overlap rate; If the drilling overlap ratio is greater than a preset overlap ratio, it is determined that the CAM design data has an insufficient overlap ratio anomaly; A second adjustment module is used to adjust the CAM design data according to the drilling parameter information until the drilling overlap rate is no greater than a preset overlap rate; If the drilling overlap ratio is not greater than a preset overlap ratio, the CAM design data is input into a simulation system to obtain a simulation result; A third judgment module is used to judge whether the simulation result meets the preset process performance index; If the simulation result does not meet the preset process performance index, the CAM design data is repaired according to the simulation result to obtain repaired design data, and the repaired design data is marked as qualified design data.

8. The erroneous operation prevention control system for CAM production in PCB production according to claim 7, characterized in that: The acquisition module includes: a first acquiring unit, configured to acquire characteristic parameters of each dielectric layer according to the laminated structure information, wherein the characteristic parameters include a dielectric constant and a dielectric thickness; A second acquisition unit is used to acquire the transmission line width and the transmission line length according to the laminated structure information, and to acquire a corrected average value of the electric field distribution according to the transmission line width, the dielectric constant and the dielectric thickness; a third acquiring unit, configured to acquire an effective dielectric constant of the microstrip line according to the corrected average value of the electric field distribution and the dielectric constant, and acquire a signal transmission line delay according to the effective dielectric constant of the microstrip line and the transmission line length; a fourth acquiring unit, configured to acquire a corresponding single-layer via delay according to each of the dielectric constants and dielectric thicknesses, and acquire a signal via delay according to a plurality of the single-layer via delays; A fifth acquiring unit is configured to acquire an inter-layer signal delay according to the signal via delay and the signal transmission line delay.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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