Preparation method of conductive enclosure structure

Abstract

The invention discloses a preparation method of a conductive enclosure structure, and relates to the technical field of electronic packaging, in the preparation method, a preparation mode can be selected to apply a conductive layer to a base material substrate, the conductive layer is formed on the base material substrate, and interlayer bonding reinforcement is carried out to improve the bonding between the conductive layer and the base material substrate. The thickness of the conductive enclosure structure is greatly reduced, after a target conductive pattern area is formed through exposure and development, the target conductive pattern area or a non-target conductive pattern area is selectively covered through a graphical covering layer, the outline of the target conductive pattern area or the non-target conductive pattern area is defined, and the thickness of the conductive enclosure structure is reduced according to the outline defined by the covering layer. The target conductive pattern is formed by removing or adding the conductive material, the material utilization rate is greatly improved by adopting a selective addition method process, an etching compensation space does not need to be reserved, the structural design can be more compact, and redundancy is reduced.

Description

Technical Field

[0001] The present application relates to the field of electronic packaging technology, and in particular to a method for preparing a conductive enclosure structure. Background Art

[0002] With the rapid development of electronic packaging technology, the performance of the conductive enclosure structure, as a core component for electromagnetic shielding, signal transmission, and heat dissipation, directly determines the reliability of electronic equipment. In the existing technology, the conductive structure is usually welded by metal cavity.

[0003] The welding preparation process using a metal cavity requires pre-processing of the metal sheet, such as cutting and forming, before welding. However, the heat generated during welding can easily cause deformation of the metal sheet. To control deformation, additional measures are required, such as adding supports or adopting a suitable welding sequence. This increases the complexity and size of the conductive structure, making it redundant and limiting the miniaturization of the device, making it difficult to adapt to lightweight scenarios.

[0004] In view of this, a method for preparing a conductive enclosure structure is provided to solve the above problems. Summary of the Invention

[0005] The purpose of this application is to solve the problem that the size of the existing conductive structure is redundant and limits the miniaturization of the equipment, making it difficult to adapt to lightweight scenarios. In order to solve the above technical problems, a preparation method of a conductive enclosure structure is provided, which reduces the redundancy of the size and miniaturizes the equipment, and can adapt to lightweight scenarios.

[0006] To achieve the above-mentioned objectives, the embodiments of the present application adopt the following technical solutions: a method for preparing a conductive enclosure structure, comprising the following steps: substrate preparation, providing a substrate substrate, and pre-treating the substrate substrate; conductive layer preparation, selecting a preparation method to apply a conductive layer to the substrate substrate, forming a conductive layer on the substrate substrate, and performing interlayer bonding reinforcement to enhance the bonding between the conductive layer and the substrate substrate; conductive pattern construction, forming a target conductive pattern area on the substrate surface by exposure and development; conductive pattern preparation, selectively covering the target conductive pattern area or the non-target conductive pattern area with a patterned covering layer, and defining the outline of the target conductive pattern area or the non-target conductive pattern area, and forming the target conductive pattern according to the outline by removing or adding conductive material; conductive pattern protection, covering the substrate surface with a protective material so that the protective material is combined with the substrate to form a target substrate structure.

[0007] Furthermore, according to an embodiment of the present application, the method also includes the following steps: constructing a conductive enclosure structure to achieve electrical conductivity and physical fixation between the target substrate structure and the internal module structure, which is divided into three-dimensional cavity connection and planar conductive connection according to the connection dimension, and forming a package body through three-dimensional cavity interconnection or planar conductive interconnection; preparing a conductive enclosure structure, operating the surface of the package body, and completing the preparation of the conductive enclosure structure.

[0008] Furthermore, according to an embodiment of the present application, in the substrate manufacturing step, an adhesive coating operation is performed on the substrate substrate.

[0009] Furthermore, according to an embodiment of the present application, in the conductive layer preparation step, the pre-prepared conductive surface material is mounted by a physical mounting method, and the conductive material is directly attached to the surface of the base substrate to form a conductive layer.

[0010] Furthermore, according to an embodiment of the present application, in the conductive pattern preparation step, the target conductive pattern area is protected by a covering layer, the unprotected area is chemically etched, and the contour defined by the covering layer is corroded using a chemical etching solution to retain the target conductive pattern under the covering layer.

[0011] Furthermore, according to an embodiment of the present application, in the conductive pattern protection step, an adhesive layer is coated on the surface of the substrate and the substrate substrate is laminated through a lamination process to achieve protection of the target conductive pattern and interlayer connection, and form a target substrate structure.

[0012] Furthermore, according to an embodiment of the present application, in the substrate manufacturing step, a substrate backing is formed by a molding process, and is ground to control the thickness of the substrate backing.

[0013] Furthermore, according to an embodiment of the present application, in the conductive layer preparation step, a seed layer is deposited on the surface of the base substrate by chemical plating.

[0014] Furthermore, according to an embodiment of the present application, in the conductive pattern preparation step, the non-target conductive area is covered by a covering layer to expose the target conductive area to be retained, and a conductive material is deposited or electroplated on the exposed area outside the covering layer, and then the covering layer is removed, and the irregular area or conductive material remaining at the edge is etched, and the target conductive pattern is retained.

[0015] Furthermore, according to an embodiment of the present application, in the conductive pattern protection step, the target conductive pattern is fully covered and protected with a plastic encapsulation material, and excess plastic encapsulation material is removed through a grinding process to control the overall thickness and form a target substrate structure.

[0016] Compared with the prior art, the present application selects a preparation method to apply a conductive layer to the base substrate, forms a conductive layer on the base substrate, and performs interlayer bonding reinforcement to enhance the bonding between the conductive layer and the base substrate, so that the thickness of the conductive enclosure structure is greatly reduced. After the target conductive graphic area is formed by exposure and development, the target conductive graphic area or the non-target conductive graphic area is selectively covered by the covering layer, and the outline of the target conductive graphic area or the non-target conductive graphic area is defined. According to the outline, the target conductive graphic is formed by removing or adding conductive material. The selective addition process greatly improves the material utilization rate, and there is no need to reserve etching compensation space. The structural design can be more compact and reduce redundancy, thereby solving the problem that the size of the existing conductive structure has redundancy that limits the miniaturization of the equipment and is difficult to adapt to lightweight scenarios. The better effect of reducing redundancy in size and miniaturizing the equipment, which can adapt to lightweight scenarios, is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present application is further described below with reference to the accompanying drawings and examples.

[0018] Figure 1 It is a flow chart of a method for preparing a conductive enclosure structure according to an embodiment of the present application.

[0019] Figure 2 This is the analytical process of the preparation method in the embodiment of this application Figure 1 .

[0020] Figure 3 This is the analytical process of the preparation method in the embodiment of this application Figure 2 . DETAILED DESCRIPTION

[0021] In order to clearly and completely describe the objectives and technical solutions of the present invention and make the advantages more clearly understood, the embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, not all of them, and are only used to explain the embodiments of the present invention, not to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] In the description of the present invention, it should be noted that the terms "center," "middle," "upper," "lower," "left," "right," "inner," "outer," "top," "bottom," "side," "vertical," "horizontal," and the like, indicating positions or location relationships, are based on the positions or location relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. Furthermore, the terms "one," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0024] For the purpose of simplicity and illustration, the principles of the embodiments are described primarily with reference to examples. In the following description, many specific details are provided to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that these embodiments may not be limited to these specific details in practice. In some instances, well-known methods and structures are not described in detail to avoid unnecessarily obscuring the understanding of these embodiments. In addition, all embodiments may be used in combination with each other.

[0025] Example 1:

[0026] like Figure 1 As shown, this embodiment provides a method for preparing a conductive enclosure structure, comprising the following steps:

[0027] S10, substrate preparation, providing a substrate substrate, and pre-treating the substrate substrate;

[0028] S20, preparing a conductive layer, applying a conductive layer to the base substrate by selecting a preparation method, forming a conductive layer on the base substrate, and performing interlayer bonding reinforcement to improve the bonding between the conductive layer and the base substrate;

[0029] S30, constructing a conductive pattern, forming a target conductive pattern area on the surface of the substrate by exposure and development;

[0030] S40, preparing a conductive pattern, selectively covering a target conductive pattern area or a non-target conductive pattern area with a patterned cover layer, defining the contours of the target conductive pattern area or the non-target conductive pattern area, and forming the target conductive pattern by removing or adding conductive material according to the contours;

[0031] S50, conductive pattern protection, covering the surface of the substrate with a protective material, so that the protective material and the substrate are combined to form a target substrate structure.

[0032] like Figure 2 As shown, in the substrate preparation step S10, the substrate substrate is coated with an adhesive. The substrate substrate can be selected from materials including epoxy resin-based FR-4 or flexible polyimide substrate, but is not limited to the above materials. The thickness is controlled to be 0.1-1.6 mm, and the thickness can be adjusted according to the shielding performance requirements. Secondly, while providing the substrate substrate, the substrate substrate can be subjected to surface pretreatment operations, such as plasma cleaning or chemical micro-etching to improve the adhesion of the glue;

[0033] In the conductive layer preparation step S20, a pre-prepared conductive surface material is mounted by a physical mounting method, and the conductive material is directly attached to the surface of the base substrate to form the conductive layer. A predetermined conductive pattern is formed by exposure and development. The exposure and development operation can optionally be performed by coating a photoresist and performing ultraviolet exposure to form a predetermined conductive pattern that is resistant to etching after development and concealment.

[0034] In the conductive pattern construction step S40, the target conductive pattern area is protected by a cover layer, and the unprotected area is chemically etched. A chemical etching solution is used to erode the outline defined by the cover layer, and the target conductive pattern under the cover layer is retained. The chemical etching process can use an acidic etching solution or a dry etching method to remove the conductive surface material not protected by the photoresist, and retain the designed predetermined conductive pattern;

[0035] In the conductive pattern protection step S50, an adhesive layer is applied to the surface of the target conductive pattern, and the substrate is laminated through a lamination process to achieve protection of the target conductive pattern and interlayer connection, thereby forming a target substrate structure. A secondary glue coating is performed and a lamination process is used to complete the attachment of the substrate. The lamination process can be completed using a vacuum laminator or other device.

[0036] The method for preparing the conductive enclosure structure further includes the following steps:

[0037] Conductive enclosure structure is constructed to achieve electrical connection and physical fixation between the target substrate structure and the internal module structure. It is divided into three-dimensional cavity connection and planar conductive connection according to the connection dimension. The package is formed through three-dimensional cavity interconnection or planar conductive interconnection;

[0038] Conductive enclosure structure preparation: operating the surface of the package body and completing the preparation of the conductive enclosure structure.

[0039] In the conductive enclosure structure construction step, the laminated structure is first processed to form a target substrate structure and a cavity is installed, wherein the target substrate structure can be hollowed out, that is, the target substrate structure can be set as a hollow mesh enclosure or a non-hollow enclosure. When the target substrate structure is a hollow mesh enclosure, it can achieve electromagnetic shielding and optimize the anti-interference performance during the period. The pattern enclosure is left empty, which can achieve directional or regional electromagnetic channels. When the target substrate structure is a non-hollow enclosure, it can improve the airtightness of the device, reduce the corrosion effect of small-sized molecular materials on the device in this direction, and optimize the long-term reliability of the device. The small-sized molecular materials are, for example, water molecules, helium, etc.

[0040] Secondly, after the internal module structure is mounted inside the cavity, the mounting process can use a positioning system, that is, visual alignment and servo motor drive for mounting. The accuracy of the visual alignment can be controlled within ±10μm, and the corresponding mounting pressure is applied to the servo motor to ensure that the internal module structure is mounted. After the internal module structure is mounted, the steps are repeated to form the outer layer package.

[0041] Finally, the package body is pre-cut, surface metallized and sonicated to complete the preparation of the conductive enclosure structure;

[0042] The pre-cutting process can use a diamond scriber or other cutting tool for cutting, and the cutting thickness can be adjusted according to actual conditions, for example, the cutting thickness can be controlled at 0.1mm, and the cutting depth can be 50% of the total thickness; the cutting path can extend 0.2mm along the outside of the predetermined conductive pattern to reserve a buffer zone to prevent damage to the package or the predetermined conductive pattern during cutting; the surface of the cut package is metallized, that is, the package is tinned or gold-plated, and finally, ultrasonic treatment is used to remove burrs on the package and strengthen the bonding between the conductive layer and the substrate to complete the installation preparation of the conductive enclosure structure.

[0043] Improved precision drives miniaturization: Through high-precision exposure and low side-etching etching, the line width or line spacing can be reduced by 40% compared to traditional processes, and the area of ​​conductive enclosure structures with equivalent functions can be reduced by 64%.

[0044] Strong bonding allows for ultra-thin designs: The interlayer bonding strength is improved, and ultra-thin conductive layers can be used to replace traditional copper foil, greatly reducing the thickness.

[0045] Efficient material utilization and reduced redundancy: The additive process greatly improves material utilization, eliminates the need to reserve etching compensation space, and allows for a more compact structural design.

[0046] This method fundamentally solves the problem of space waste caused by processing defects in traditional processes through full-process precision control and efficient material utilization, and provides key technical support for the design of conductive structures for miniaturized electronic devices.

[0047] Example 2:

[0048] like Figure 1 As shown, this embodiment provides a method for preparing a conductive enclosure structure, which has the same structural features as embodiment 1, and the preparation method includes the following steps:

[0049] S10, substrate preparation, providing a substrate substrate, and pre-treating the substrate substrate;

[0050] S20, preparing a conductive layer, applying a conductive layer to the base substrate by selecting a preparation method, forming a conductive layer on the base substrate, and performing interlayer bonding reinforcement to improve the bonding between the conductive layer and the base substrate;

[0051] S30, constructing a conductive pattern, forming a target conductive pattern area on the surface of the substrate by exposure and development;

[0052] S40, preparing a conductive pattern, selectively covering a target conductive pattern area or a non-target conductive pattern area with a patterned cover layer, defining the contours of the target conductive pattern area or the non-target conductive pattern area, and forming the target conductive pattern by removing or adding conductive material according to the contours;

[0053] S50, conductive pattern protection, covering the surface of the substrate with a protective material, so that the protective material and the substrate are combined to form a target substrate structure.

[0054] like Figure 3 As shown, in the substrate manufacturing step, the substrate substrate is plastic-sealed and ground to control the thickness of the substrate substrate. A substrate can be formed by plastic-sealing the substrate and controlling the thickness by grinding. An epoxy resin-based composite material or polyimide can be used as the substrate. For example, the thickness can be initially set to 0.5-1.0 mm, and the dielectric constant and thermal expansion coefficient in the industry are required. When the substrate is plastic-sealed, vacuum lamination can be used. The temperature can be controlled at 180-200° C. and the curing time is controlled at 30-45 minutes to ensure that the substrate is free of bubbles and delamination after plastic sealing.

[0055] After the plastic encapsulation is completed, the thickness can be controlled by grinding. The plastic encapsulation substrate can be ground to the target thickness value through a double-sided grinder. The tolerance value of the target thickness value can be controlled within ±5μm. During grinding, detection methods can be used to verify the thickness grinding process. For example, a laser thickness gauge can be used for real-time feedback, and cross-sectional analysis can be combined to verify the uniformity of the plastic encapsulation substrate after grinding.

[0056] In the conductive layer preparation step, a seed layer is deposited on the surface of the base substrate by chemical plating to form the conductive layer. For example, the chemical copper plating process can adopt a copper sulfate-formaldehyde system, that is, using a copper sulfate solution and a formaldehyde reducing agent, and then depositing the seed layer;

[0057] A conductive pattern structure is formed on the surface of the substrate through an exposure, development and electroplating enhancement process. The exposure and development process can be performed by coating a dry film photoresist on the surface of the substrate, and then a corresponding metal is selected for electroplating to enhance its conductive current capacity to form a conductive pattern structure. For example, the metal can be electroplated with pure copper or a nickel-gold composite layer for operation;

[0058] Laser drilling is performed on the plastic-encapsulated substrate to form conductive through-holes. The laser drilling can use CO2 or UV laser. The hole diameter and blind hole depth-to-diameter ratio can be adjusted according to actual conditions. During the laser drilling process, the hole wall smoothness can be tested by a detection device.

[0059] In the conductive pattern preparation step, the non-target conductive area is covered with a cover layer to expose the target conductive area to be retained. A conductive material is deposited or electroplated on the exposed area outside the cover layer, and then the cover layer is removed. The irregular area or conductive material remaining at the edge is etched to retain the target conductive pattern. The stripping process can use an alkaline stripping solution, followed by a flash etching operation, such as using a 10% ammonium persulfate etching solution to remove the seed layer residue and retain the conductive pattern structure.

[0060] In the conductive pattern protection step, the target conductive pattern is fully covered and protected with a plastic encapsulation material, and excess plastic encapsulation material is removed through a grinding process to control the overall thickness and form a target substrate structure. The conductive pattern structure is plastic encapsulated and protected and subjected to a secondary grinding process. The plastic encapsulated conductive structure is ground to the target thickness and processed to form the target substrate structure.

[0061] The method for preparing the conductive enclosure structure further includes the following steps:

[0062] Conductive enclosure structure is constructed to achieve electrical connection and physical fixation between the target substrate structure and the internal module structure. It is divided into three-dimensional cavity connection and planar conductive connection according to the connection dimension. The package is formed through three-dimensional cavity interconnection or planar conductive interconnection;

[0063] Conductive enclosure structure preparation: operating the surface of the package body and completing the preparation of the conductive enclosure structure.

[0064] In the conductive enclosure structure construction step, the internal module structure is mounted on the conductive pattern structure of the target substrate structure. The mounting process can use a positioning system, namely, visual alignment and servo motor drive for mounting. The accuracy of the visual alignment can be controlled within ±10μm, and the servo motor is given a corresponding mounting pressure to ensure that the internal module structure is mounted. After the internal module structure is mounted, the steps are repeated to form the outer package.

[0065] Finally, the package body is pre-cut, surface metallized and surface acoustic wave screened to complete the preparation of the conductive enclosure structure;

[0066] The pre-cutting process can use a diamond scriber or other cutting tool for cutting, and the cutting thickness can be adjusted according to actual conditions, for example, the cutting thickness can be controlled at 0.1mm, and the cutting depth can be 50% of the total thickness; the cutting path can extend 0.2mm along the outside of the predetermined conductive pattern to reserve a buffer zone to prevent damage to the package or the predetermined conductive pattern during cutting; the surface of the cut package is metallized, that is, the package is tinned or gold-plated, and then ultrasonic treatment is used to remove burrs on the package and strengthen the bonding between the conductive layer and the substrate to complete the installation preparation of the conductive enclosure structure.

[0067] Example 3:

[0068] This embodiment also provides a method for preparing a conductive enclosure structure, which has the same structural features as the first and second embodiments. The preparation method is as follows:

[0069] First, a target substrate structure is prepared. The preparation method can form the target substrate structure through a processing step, and the processing step includes the step in Example 1 and the step in Example 2. The conductive structure can be patterned by selecting the step in Example 1 or the step in Example 2. The step in Example 1, i.e., step A, can be briefly described as follows:

[0070] Substrate pretreatment → adhesive coating → conductive surface material mounting → exposure and development to form resist pattern → chemical etching to retain conductive pattern → secondary adhesive coating → support substrate attachment;

[0071] The process in the second embodiment, namely process B, can be briefly described as follows:

[0072] Plastic encapsulation substrate molding → grinding thickness control → laser drilling to form through holes → chemical copper plating to form seed layer → electroplating to thicken the conductive layer → exposure and development to form electroplating resist pattern → film stripping and flash etching to retain the conductive structure → plastic encapsulation protective layer molding;

[0073] It should be noted that in the preparation of the target substrate structure, the A process or the B process or the AB process can be used to cross-select the preparation method;

[0074] After the target substrate structure is prepared, the internal module structure can be prepared, that is, the internal functional layer, i.e., the internal module structure, can be constructed within the enclosed space of the target substrate structure. The internal functional layer includes operations such as module placement, interconnection process selection, and sealing treatment.

[0075] It should be noted that the method for preparing the conductive enclosure structure further includes the following steps:

[0076] Conductive enclosure structure is constructed to achieve electrical connection and physical fixation between the target substrate structure and the internal module structure. It is divided into three-dimensional cavity connection and planar conductive connection according to the connection dimension. The package is formed through three-dimensional cavity interconnection or planar conductive interconnection;

[0077] Conductive enclosure structure preparation: operating the surface of the package body and completing the preparation of the conductive enclosure structure.

[0078] First, the internal module structure is mounted on the target substrate structure to form a package. For example, a high-precision placement machine can be used to position the internal module structure to a preset area of ​​the target substrate structure. The accuracy can be controlled within ±10μm, and epoxy conductive adhesive is used for bonding. During the placement process, the placement offset can be detected by X-ray to detect in real time whether there is any deviation between the target substrate structure and the internal module structure during the placement process.

[0079] In the step of constructing the conductive enclosure structure, a wire tie connection can be used to achieve electrical connection between the target substrate structure and the internal module structure. Exemplarily, the wire tie connection can be performed using gold wire, wherein the thickness of the gold wire can be controlled within 25 μm, and the bonding arc height can be controlled within 100-150 μm. It should be noted that when performing the wire tie connection, it is necessary to ensure that the wire used has undergone a tensile test to prevent damage to the wire during subsequent use. Alternatively, a flexible PCB can be used for mounting to achieve electrical connection between the target substrate structure and the internal module structure. The flexible substrate of the flexible PCB can be polyimide, which is not limited here, and the connection is completed by performing hot pressing bonding with a conductive adhesive film.

[0080] During the preparation of the conductive enclosure structure, a protective colloid is first applied and cured. It is important to note that the protective colloid must cover the connection area. This coating process can be performed using a dispensing machine or other dispensing equipment. The dispensing equipment sprays the protective colloid in a quantitative manner. For example, the protective colloid can be 0.3 mm thick silicone. After curing, the hardness of the protective colloid must meet industry standards.

[0081] Then, a cover is mounted or welded, and after sealing, pre-cutting is performed, and tin / gold surface treatment and surface acoustic wave testing are performed to complete the preparation of the conductive enclosure structure.

[0082] Currently, the industry mostly uses integrated conductive enclosure structures, such as metal cavities or integrated plastic packaging designs. The processing requires multiple high-temperature and high-pressure treatments, which can easily lead to substrate warping and delamination. It is also difficult to be compatible with the refined conductive patterns required for high-frequency signal transmission. In addition, the integrated structure needs to be replaced in the event of repair or partial failure, which is very expensive. This application independently processes the target substrate structure and the internal module structure and then precisely mounts them, avoiding stress concentration and yield loss in the integrated structure. The split target substrate structure / internal module structure is used for processing and mounting, reducing assembly complexity.

[0083] Multiple substrates are spliced ​​together, and since multiple substrates are spliced ​​together, too many splicing gaps may cause electromagnetic leakage, and since the number of substrates is large, the volume of the conductive structure will increase, and additional space will be occupied, resulting in poor spatial adaptability; the present application is achieved by adopting a flexible PCB or semiconductor wire binding process, and its bending coefficient is greatly increased compared to substrate splicing, and it can directly fit into special-shaped cavities, reduce space occupancy, and reduce splicing gaps, thereby avoiding the possibility of electromagnetic leakage to a certain extent.

[0084] Although the above describes the illustrative specific implementation methods of the present application so that those skilled in the art can understand the present application, the present application is not limited to the scope of the specific implementation methods. For those of ordinary skill in the art, as long as various changes are within the spirit and scope of the present application defined and determined by the attached claims, all application creations based on the concept of the present application are protected.

Claims

1. A method for preparing a conductive enclosure structure, characterized in that: The following steps are involved: Substrate preparation, providing a substrate substrate, and pre-treating the substrate substrate; Conductive layer preparation, selecting a preparation method to apply a conductive layer to the base substrate, forming a conductive layer on the base substrate, and performing interlayer bonding reinforcement to improve the bonding between the conductive layer and the base substrate; Conductive pattern construction: forming a target conductive pattern area on the substrate surface by exposure and development; Conductive pattern preparation, selectively covering a target conductive pattern area or a non-target conductive pattern area with a patterned cover layer, and defining the contours of the target conductive pattern area or the non-target conductive pattern area, and forming the target conductive pattern by removing or adding conductive material according to the contours; Conductive pattern protection: covering the surface of the substrate with a protective material so that the protective material is combined with the substrate to form a target substrate structure.

2. The method for preparing a conductive enclosure structure according to claim 1, wherein: The following steps are also included: The conductive enclosure structure is constructed to achieve electrical conduction and physical fixation between the target substrate structure and the internal module structure. The connection dimension is divided into three-dimensional cavity connection and planar conductive connection, and the package is formed through three-dimensional cavity interconnection or planar conductive interconnection; Conductive enclosure structure preparation: operating the surface of the package body and completing the preparation of the conductive enclosure structure.

3. The method for preparing a conductive enclosure structure according to claim 1, wherein: In the substrate preparation step, the substrate backing is coated with an adhesive.

4. The method for preparing a conductive enclosure structure according to claim 3, wherein: In the conductive layer preparation step, the pre-prepared conductive surface material is mounted by a physical mounting method, and the conductive material is directly attached to the surface of the base substrate to form the conductive layer.

5. The method for preparing a conductive enclosure structure according to claim 4, characterized in that: In the conductive pattern preparation step, the target conductive pattern area is protected by the cover layer, the unprotected area is chemically etched, and the contour defined by the cover layer is corroded using a chemical etching solution to retain the target conductive pattern under the cover layer.

6. The method for preparing a conductive enclosure structure according to claim 5, characterized in that: In the conductive pattern protection step, an adhesive layer is coated on the surface of the substrate and the substrate substrate is laminated to achieve protection of the target conductive pattern and interlayer connection, thereby forming the target substrate structure.

7. The method for preparing a conductive enclosure structure according to claim 1, wherein: In the base material manufacturing step, the base substrate is formed by a plastic packaging process, and is ground to control the thickness of the base substrate.

8. The method for preparing a conductive enclosure structure according to claim 7, characterized in that: In the conductive layer preparation step, a seed layer is deposited on the surface of the base substrate by chemical plating.

9. The method for preparing a conductive enclosure structure according to claim 8, characterized in that: In the conductive pattern preparation step, the non-target conductive area is covered by the covering layer to expose the target conductive area to be retained, the conductive material is deposited or electroplated on the exposed area outside the covering layer, and then the covering layer is removed, the irregular area or conductive material remaining at the edge is etched, and the target conductive pattern is retained.

10. The method for preparing a conductive enclosure structure according to claim 9, characterized in that: In the conductive pattern protection step, the target conductive pattern is fully covered and protected by a plastic packaging material, and excess plastic packaging material is removed by a grinding process to control the overall thickness and form the target substrate structure.

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