Etching device for IC semiconductor chip processing

Abstract

The invention relates to the technical field of semiconductor processing equipment, and discloses an etching device for IC semiconductor chip processing, which comprises an etching box, the etching box is used for providing a relatively closed space for the whole etching operation, a liquid storage frame is arranged on the etching box, an etching platform is arranged above the liquid storage frame, a clamping assembly is arranged on the etching platform, and the clamping assembly is used for clamping the liquid storage frame. The clamping assembly is used for clamping a wafer, and the etching platform is communicated with the liquid storage frame through a connecting frame; a liquid dropping mechanism is arranged on the etching box, the liquid dropping mechanism is arranged above the etching platform, a liquid dropping head is adopted as a liquid dropping element, and the liquid dropping mechanism is used for carrying out liquid dropping etching on the wafer, the wafer is etched in an etching liquid dropping mode, etching operation can be effectively and accurately carried out on the etching portion of the wafer, waste of the etching liquid is avoided, and the etching efficiency is improved. Meanwhile, damage to surrounding equipment caused by sputtering of the etching liquid can be reduced through the dripping mode, the service life of the etching equipment is guaranteed, and meanwhile the uniformity of wafer etching is also guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, in particular to an etching device for processing IC semiconductor chips. Background Art

[0002] IC semiconductor chip, that is, integrated circuit semiconductor chip, is a miniature electronic device that integrates a large number of electronic components (such as transistors, resistors, capacitors, etc.) and their interconnection circuits on a semiconductor substrate (such as silicon, germanium, etc.). It is the core of modern electronic technology and is widely used in various fields such as computers, communications, consumer electronics, automotive electronics, industrial control, etc. It is specifically composed of semiconductor substrates, transistors, interconnection circuits and packaging. During its production process, it needs to go through wafer preparation, lithography, etching and doping, thin film deposition, as well as interconnection and testing processes.

[0003] Among them, the etching process of IC semiconductor chips is divided into dry etching and wet etching. Dry etching is a process that uses physical or chemical means such as plasma, ion beam or laser in a vacuum environment to remove atoms or molecules on the surface of the material. It is suitable for micro-nano processing that requires high precision and high resolution. Wet etching is a process that dissolves or corrodes the material by chemically reacting with the material surface through chemical solutions. It is suitable for large-area, low-cost preliminary processing.

[0004] In the wet etching process, specific implementation methods include immersion etching and spray etching. However, in actual use, immersion etching requires a sufficient amount of etching solution to immerse the wafer, and the etching solution consumption is large, which increases production costs and makes it difficult to selectively etch specific areas on the wafer surface. During the use of spray etching, the etching solution sprayed onto the wafer surface will produce sputtering, and the etching solution will sputter to other places on the wafer, thereby causing unevenness in the wafer during the etching process. Summary of the Invention

[0005] The object of the present invention is to provide an etching device for processing IC semiconductor chips to solve the problems raised in the above-mentioned background technology.

[0006] To solve the above technical problems, the present invention is achieved through the following technical solutions:

[0007] The present invention is an etching device for processing IC semiconductor chips, comprising an etching box, which is used to provide a relatively closed space for the entire etching operation; a liquid storage frame is provided on the etching box, an etching platform is provided above the liquid storage frame, a clamping assembly is provided on the etching platform, the clamping assembly is used to clamp the wafer, and the etching platform and the liquid storage frame are connected through a connecting frame; a dripping mechanism is provided on the etching box, which is arranged above the etching platform and adopts a dripping head as a dripping element for drip etching of the wafer; an adjusting mechanism is provided on the etching box, which comprises a rotating assembly and a translating assembly for driving the dripping head to rotate and translate, and is used to adjust the position of the dripping head above the etching platform to adapt to different wafer etching positions.

[0008] Furthermore, the rotating assembly is composed of a rotating disk and a rotating motor, the rotating disk is rotatably mounted on the etching box, the rotating motor is mounted on the etching box, the rotating motor and the rotating disk are connected by gear meshing, the translation assembly is arranged on the rotating disk, the translation assembly is composed of a translation frame, a translation screw, a translation motor and a translation block, the translation frame is mounted on the rotating disk, the translation screw is rotatably mounted on the translation frame, the translation motor is mounted on the translation frame, the output shaft of the translation motor is connected to the translation screw, the translation block is slidably mounted on the translation frame, and the translation block is threadedly connected to the translation screw.

[0009] Furthermore, the etching platform and the liquid storage frame are connected by sliding, which facilitates the movement of the etching platform and provides convenience for the installation of the wafer. A limiting component is provided on the liquid storage frame to limit the etching platform. A slide groove 1 is provided on the liquid storage frame, and a slide bar is installed at the bottom of the etching platform. The slide bar is slidably connected to the slide groove 1, and a limiting groove is provided on the slide bar. The limiting component consists of a fixed frame and a limiting bar. The fixed frame is installed on the liquid storage frame, and the limiting bar is rotatably installed on the fixed frame. The limiting bar is adapted to the limiting groove.

[0010] Furthermore, the etching platform adopts a hollow setting, and fixed rods are installed on the etching platform. The number of fixed rods is set to multiple, and a gap is set between two adjacent fixed rods. The multiple fixed rods form a plane for placing wafers. A connecting frame is installed on the etching platform, and the other end of the connecting frame is connected to the liquid storage frame. The connecting frame is set to be retractable.

[0011] Furthermore, the clamping assembly is composed of a clamping plate, a clamping telescopic rod and a connecting frame. The clamping plate is arranged on the etching platform, the clamping telescopic rod is installed on the etching platform, and the connecting frame is slidably installed on the etching platform. The connecting frame is connected to the clamping plate and the clamping telescopic rod to facilitate the clamping telescopic rod to drive the clamping plate to move.

[0012] Furthermore, the dripping mechanism is composed of a liquid storage cylinder, a dripping cylinder, and a dripping head. The liquid storage cylinder is installed on the moving block, the dripping cylinder is installed on the liquid storage cylinder, the dripping cylinder is connected to the liquid storage cylinder, the dripping head is arranged on the dripping cylinder, the bottom of the dripping head is set to be conical, and a flow channel is provided on the dripping head, which is connected to the liquid storage cylinder. The etching liquid in the liquid storage cylinder is transported to the dripping cylinder through the flow channel for dripping operation.

[0013] Furthermore, an adjusting telescopic rod is installed on the liquid storage cylinder, and an adjusting frame is provided on the liquid storage cylinder. The adjusting frame is connected to the adjusting telescopic rod. The adjusting frame is composed of an adjusting rod and an adjusting head. The adjusting head is composed of a trapezoidal round block. The connection between the top of the dripping cylinder and the liquid storage cylinder is adapted to the adjusting head. The connection can be sealed by the adjusting head to adjust the dripping speed.

[0014] Furthermore, a separation cylinder is installed on the dripping cylinder, and an air separation frame is installed on the dripping cylinder. The air separation frame is connected to the dripping cylinder through a connecting hole. An air inlet pipe is installed on the air separation frame for inputting air flow into the air separation frame. The air flow flows along the dripping cylinder and is used to push the etching liquid away from the wafer surface after the etching liquid drops onto the wafer.

[0015] Furthermore, the bottom of the dripping tube is set to be a circular frame shape, and the inner diameter is larger than the inner diameter of the top of the dripping tube. The bottom end of the dripping tube is slidably installed with a mounting tube, and an adsorption part is provided in the mounting tube. The adsorption part is used to adsorb the sputtered etching liquid. A lifting telescopic rod is installed on the dripping tube, and the lifting telescopic rod is connected to the mounting tube with bolts.

[0016] Furthermore, a heating plate is provided on the dripping cylinder, which is located above the mounting cylinder. An air guide groove is opened on the dripping cylinder, and an exhaust pipe is installed on the dripping cylinder. The exhaust pipe is connected to the air guide groove. The exhaust pipe and the heating plate are used to heat the adsorption component to increase the service life of the adsorption component.

[0017] The present invention has the following beneficial effects:

[0018] (1) The present invention etches the wafer by dripping the etching liquid, which can effectively and accurately etch the etching part of the wafer, avoiding waste of etching liquid. At the same time, the dripping method can reduce the damage to surrounding equipment caused by the sputtering of the etching liquid, thereby ensuring the service life of the etching equipment and the uniformity of wafer etching.

[0019] (2) The present invention adjusts the supply of etching liquid dripping by setting an adjusting telescopic rod and an adjusting frame, and can be adjusted according to different drip etching requirements, thereby achieving the requirements of precise etching and saving etching liquid resources.

[0020] (3) The present invention provides an air distribution frame and a separation cylinder, and can quickly remove the etching liquid that is splashed to other places after the etching liquid drops onto the wafer surface by blowing the external airflow, thereby avoiding the sputtered etching liquid from staying in other places of the wafer, causing uneven etching of the wafer. At the same time, by providing an adsorption component to absorb the sputtered etching liquid, the etching liquid is further reduced from splashing to other places of the wafer, thereby effectively ensuring the uniformity of wafer etching.

[0021] (4) The present invention heats the adsorption element by setting a heating plate to remove the etching liquid therein, thereby ensuring the service life of the adsorption element. At the same time, the steam generated by heating can be effectively removed by setting the air guide groove and the exhaust pipe and the vacuum pump set on the outside, thereby preventing the corrosive gas contained in the steam from affecting the etching of the wafer. At the same time, by setting the connecting tube and the track tube, the pressure at the bottom of the track tube can be reduced by absorbing the air flow, thereby accelerating the dripping speed of the etching liquid and improving the etching efficiency.

[0022] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a partial cross-sectional structural schematic diagram of the present invention;

[0026] Figure 3 Schematic diagram of the cross-sectional structure of the etching box in the present invention;

[0027] Figure 4 Schematic diagram of the structure of the dripping mechanism in the present invention;

[0028] Figure 5 Schematic diagram of the cross-sectional structure of the dripping mechanism of the present invention;

[0029] Figure 6 This is a schematic diagram of the structure of the installation cylinder and the adsorption member in the present invention;

[0030] Figure 7 for Figure 5 The schematic diagram of the structure of part A is shown;

[0031] Figure 8 for Figure 5 The schematic diagram of the structure of part B is shown;

[0032] Figure 9 for Figure 5 Schematic diagram of the structure of part C is shown.

[0033] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0034] In the figure: 1. Etching box; 2. Etching platform; 3. Clamping assembly; 4. Rotating assembly; 5. Rotating motor; 6. Translation assembly; 7. Liquid storage cylinder; 8. Water pump; 9. Water pipe; 10. Connecting frame; 11. Dropping cylinder; 12. Adjusting telescopic rod; 13. Adjusting frame; 14. Dropping head; 15. Gas distribution frame; 16. Adjusting tube; 17. Adjusting part; 18. Threaded sleeve; 19. Adjusting sleeve; 20. Separating cylinder; 21. Track cylinder; 22. Connecting cylinder; 23. Heating plate; 24. Lifting telescopic rod; 25. Mounting cylinder; 26. Adsorption part. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] See also Figures 1-9 As shown, the present invention is an etching device for processing IC semiconductor chips, comprising an etching box 1, which is used to provide a relatively closed space for the entire etching operation. A through opening is provided on one side of the etching box 1, which is used for installing wafers. A sealing door is hinged at the through opening. A liquid storage frame is provided on the etching box 1, which has an opening. A sealing plate is provided in the opening, and the opening can be sealed by the sealing plate. An etching platform 2 is provided above the liquid storage frame, and a clamping assembly 3 is provided on the etching platform 2. The clamping assembly 3 is provided on the etching platform 2. Part 3 is used to clamp the wafer, and the etching platform 2 is connected to the liquid storage frame through the connecting frame 10; a dripping mechanism is provided on the etching box 1, and the dripping mechanism is arranged above the etching platform 2. It uses a dripping head 14 as a dripping element for drip etching of the wafer; an adjustment mechanism is provided on the etching box 1, and the adjustment mechanism includes a rotating component 4 and a translation component 6, which is used to drive the dripping head 14 to rotate and translate, and is used to adjust the position of the dripping head 14 above the etching platform 2 to adapt to different wafer etching positions.

[0037] The rotating assembly 4 is composed of a rotating disk and a rotating motor 5. The rotating disk is rotatably mounted on the etching box 1. The rotating motor 5 is mounted on the etching box 1. The rotating motor 5 is meshed with the rotating disk through gears. A circular gear 1 is provided on the rotating disk. A circular gear 2 is sleeved on the output shaft of the rotating motor 5. The circular gear 1 is meshed with the circular gear 2. The translation assembly 6 is provided on the rotating disk. The translation assembly 6 is composed of a translation frame, a translation screw, a translation motor and a translation block. The translation frame is mounted on the rotating disk. The translation screw is rotatably mounted on the translation frame. The translation motor is mounted on the translation frame. The output shaft of the translation motor is connected to the translation screw. The translation block is slidably mounted on the translation frame. The translation block is threadedly connected to the translation screw.

[0038] The etching platform 2 and the liquid storage frame are connected by sliding, which makes it easy to move the position of the etching platform 2 and facilitate the installation of the wafer. A limiting component is provided on the liquid storage frame to limit the etching platform 2. A slide groove 1 is provided on the liquid storage frame. A slide bar is installed at the bottom of the etching platform 2. The slide bar is slidably connected to the slide groove 1, and a limiting groove is provided on the slide bar. The limiting component consists of a fixed frame and a limiting bar. The fixed frame is installed on the liquid storage frame, and the limiting bar is rotatably installed on the fixed frame. The limiting bar is adapted to the limiting groove.

[0039] The etching platform 2 adopts a hollow setting, and a fixed rod is installed on the etching platform 2. The number of fixed rods is set to be multiple, and a gap is set between two adjacent fixed rods. The multiple fixed rods form a plane for placing wafers. A connecting frame 10 is installed on the etching platform 2. The other end of the connecting frame 10 is connected to the liquid storage frame. The connecting frame 10 is set to be retractable. Through the setting of the fixed rod, the etching liquid on the wafer can be easily flowed into the etching platform 2, and then flowed into the liquid storage frame through the connecting frame 10. The clamping assembly 3 is composed of a clamping plate, a clamping telescopic rod and a connecting frame. The clamping plate is set on the etching platform 2, the clamping telescopic rod is installed on the etching platform 2, and the connecting frame is slidably installed on the etching platform 2. The connecting frame is connected to the clamping plate and the clamping telescopic rod to facilitate the clamping telescopic rod to drive the clamping plate to move.

[0040] The dripping mechanism is composed of a liquid storage cylinder 7, a dripping cylinder 11, and a dripping head 14. The liquid storage cylinder 7 is installed on the moving block. The liquid storage cylinder 7 is provided with a vent pipe for providing air to the liquid storage cylinder 7 to ensure the normal dripping of the etching liquid. The dripping cylinder 11 is installed on the liquid storage cylinder 7 and is connected to the liquid storage cylinder 7. The dripping head 14 is provided on the dripping cylinder 11. The bottom of the dripping head 14 is set to be conical. The dripping head 14 is provided with a flow channel, which is connected to the liquid storage cylinder 7. The etching liquid in the liquid storage cylinder 7 is transported to the dripping cylinder 11 through the flow channel for dripping operation. A water pump 8 is installed on the etching box 1, and a water pipe 9 is installed on the water pump 8. One end of the water pipe 9 is connected to the liquid storage frame, and the other end of the water pipe 9 is connected to the liquid storage cylinder 7. An adjusting telescopic rod 12 is installed on the liquid storage cylinder 7, and an adjusting frame 13 is provided on the liquid storage cylinder 7. The adjusting frame 13 is connected to the adjusting telescopic rod 12. The adjusting frame 13 is composed of an adjusting rod and an adjusting head. The adjusting head is composed of a trapezoidal round block. The connection between the top of the dripping cylinder 11 and the liquid storage cylinder 7 is adapted to the adjusting head. The connection can be sealed by the adjusting head to adjust the dripping speed.

[0041] A separating cylinder 20 is installed on the dropping cylinder 11, and an air dividing frame 15 is installed on the dropping cylinder 11. The air dividing frame 15 is connected to the dropping cylinder 11 through a connecting hole. An air inlet pipe is installed on the air dividing frame 15 for inputting airflow into the air dividing frame 15. The airflow flows along the dropping cylinder 11 and is used to push the etching liquid away from the wafer surface after the etching liquid drops onto the wafer. In actual use, an air generator needs to be set on the outside of the etching box 1 to input air into the air inlet pipe through the air generator. The air generator is constructed using existing technology.

[0042] The bottom of the dripping tube 11 is set to a round frame shape, and the inner diameter is larger than the inner diameter of the top of the dripping tube 11. The bottom end of the dripping tube 11 is slidably installed with a mounting tube 25, and an adsorption component 26 is provided in the mounting tube 25. The adsorption component 26 is used to adsorb the sputtered etching liquid. The adsorption component 26 can be made of hot foam silicon carbide material. A lifting telescopic rod 24 is installed on the dripping tube 11. The lifting telescopic rod 24 is connected to the mounting tube 25 by bolts. A connecting tube is provided on the mounting tube 25. The top of the connecting tube extends into the dripping tube 11. The position of the mounting tube 25 can be adjusted by the telescopic rod 24, so that the distance between the mounting tube 25 and the wafer is closer, thereby ensuring the absorption effect of the adsorption component 26 and reducing the probability of sputtering. At the same time, the adsorption component 26 can be easily replaced through the bolt connection.

[0043] A heating plate 23 is provided on the dripping cylinder 11, and the heating plate 23 is located above the mounting cylinder 25. The dripping cylinder 11 is provided with an air guide groove, and an exhaust pipe is installed on the dripping cylinder 11. The exhaust pipe is connected to the air guide groove. The exhaust pipe and the heating plate 23 are used to heat the adsorption component 26 to increase the service life of the adsorption component 26. During actual use, an air pump needs to be provided on the outside of the etching box 1, which is connected to the exhaust pipe through the air pump, and the gas is extracted through the air pump.

[0044] A track cylinder 21 is installed on the separation cylinder 20, and the bottom end of the track cylinder 21 is 1-2 mm away from the bottom end of the separation cylinder 20. A connecting cylinder 22 is installed on the dripping cylinder 11, one end of the connecting cylinder 22 is connected to the air guide groove, and the other end of the connecting cylinder 22 is connected to the separation cylinder 20.

[0045] A blocking groove is provided on the dripping tube 11, and an adjusting sleeve 19 is slidably installed in the blocking groove. A slider is installed on the adjusting sleeve 19, and a second slide groove is provided on the inner wall of the blocking groove. The slider is slidably connected to the second slide groove so that the adjusting sleeve 19 can only move up and down. A blocking hole is provided on the adjusting sleeve 19, and the blocking hole is adapted to the connecting hole. A threaded sleeve 18 is threadedly installed on the dripping tube 11, and the threaded sleeve 18 is rotatably connected to the adjusting sleeve 19. The adjusting sleeve 19 is pushed up by rotating the threaded sleeve 18, thereby adjusting the aperture of the connecting hole and controlling the airflow entering the dripping tube 11.

[0046] An adjusting tube 16 is installed on the top of the gas distribution frame 15, and an adjusting part 17 is provided on the adjusting tube 16. The adjusting part 17 is used to adjust the airflow pressure in the gas distribution frame 15. The adjusting part 17 is composed of a bucket-shaped block, a mounting frame, a telescopic rod, an adjusting spring and a blocking head. The bucket-shaped block is installed on the adjusting tube 16, the mounting frame is installed on the adjusting tube 16, the telescopic rod is installed on the mounting frame, the adjusting spring is sleeved on the telescopic rod, and the blocking head is installed on the telescopic shaft of the telescopic rod. The blocking head contacts the bucket-shaped block and blocks the bucket-shaped block through the blocking head. The telescopic rod is controlled by the adjusting spring to adjust the airflow pressure in the gas distribution frame 15. A connecting pipe is installed on the adjusting tube 16, and the connecting pipe is connected to the external gas processing equipment. The gas discharged by the vacuum pump is also connected to the gas processing equipment. The gas processing equipment is constructed using existing technology.

[0047] In this embodiment, the water pipe 9, the exhaust pipe, the air intake pipe, and the connecting pipe are constructed of retractable hoses to avoid obstruction to the movement of the liquid storage cylinder.

[0048] When in use, the wafer is placed on the etching platform 2 and clamped by the clamping assembly 3, and then the water pump 8 is started to deliver the etching liquid into the liquid storage cylinder 7, and then the adjustment telescopic rod 12 is started to adjust the position of the adjustment frame 13, so that the etching liquid is dripped through the dripping head 14, and the etching liquid is dripped onto the wafer through the dripping cylinder 11, thereby completing the etching operation of the wafer;

[0049] During the dripping process, the sputtered etching liquid is adsorbed by the adsorption member 26 to prevent the etching liquid from sputtering to other places of the wafer and causing uneven etching. The air flow is input into the gas distribution frame 15 through the external air flow generator, and the air flow flows into the dripping cylinder 11 through the connecting hole. The air flow is discharged along the dripping cylinder 11 and blows the dripped etching liquid away from the wafer surface, thereby preventing the etching liquid from staying in other places on the wafer surface and causing uneven wafer etching. At the same time, the air flow is extracted by the vacuum pump and the adsorption member 26 is heated by the heating plate 23. Heat keeps the adsorbent 26 in a dry state, thereby extending the service life of the adsorbent 26. The air flow extracted by the vacuum pump can absorb and discharge the steam generated by the heating, thereby preventing the steam from affecting the etching of the wafer. At the same time, in the process of extracting the air flow, part of the air flow will flow between the separation cylinder 20 and the track cylinder 21, and then be transported to the air guide groove through the connecting cylinder 22. In this process, the air flow pressure in the track cylinder 21 will be reduced, thereby accelerating the flow rate of the etching liquid droplets in the track cylinder 21, thereby increasing the etching speed of the wafer.

[0050] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An etching device for processing an IC semiconductor chip, comprising an etching box (1), the etching box (1) being used to provide a relatively closed space for the entire etching operation, and characterized in that: The etching box (1) is provided with a liquid storage frame, an etching platform (2) is provided above the liquid storage frame, a clamping assembly (3) is provided on the etching platform (2), the clamping assembly (3) is used to clamp the wafer, and the etching platform (2) and the liquid storage frame are connected via a connecting frame (10); The etching box (1) is provided with a dripping mechanism, which is arranged above the etching platform (2) and uses a dripping head (14) as a dripping element for performing drip etching on the wafer; An adjustment mechanism is provided on the etching box (1), and the adjustment mechanism includes a rotating component (4) and a translation component (6), which is used to drive the dripping head (14) to rotate and translate, and is used to adjust the position of the dripping head (14) above the etching platform (2) to adapt to different wafer etching positions.

2. The etching device for processing an IC semiconductor chip according to claim 1, wherein: The rotating assembly (4) is composed of a rotating disk and a rotating motor (5), the rotating disk is rotatably mounted on the etching box (1), the rotating motor (5) is mounted on the etching box (1), the rotating motor (5) and the rotating disk are connected by gear meshing, the translation assembly (6) is arranged on the rotating disk, the translation assembly (6) is composed of a translation frame, a translation screw, a translation motor and a translation block, the translation frame is mounted on the rotating disk, the translation screw is rotatably mounted on the translation frame, the translation motor is mounted on the translation frame, the output shaft of the translation motor is connected to the translation screw, the translation block is slidably mounted on the translation frame, and the translation block is threadedly connected to the translation screw.

3. The etching device for processing an IC semiconductor chip according to claim 2, wherein: The etching platform (2) and the liquid storage frame are connected by sliding, which facilitates the movement of the etching platform (2) and provides convenience for the installation of the wafer. A limiting component is provided on the liquid storage frame to limit the etching platform (2). A slide groove 1 is provided on the liquid storage frame. A slide bar is installed at the bottom of the etching platform (2). The slide bar is slidably connected to the slide groove 1. A limiting groove is provided on the slide bar. The limiting component consists of a fixed frame and a limiting bar. The fixed frame is installed on the liquid storage frame. The limiting bar is rotatably installed on the fixed frame. The limiting bar is adapted to the limiting groove.

4. The etching device for processing an IC semiconductor chip according to claim 3, wherein: The etching platform (2) is hollow, and a plurality of fixing rods are installed on the etching platform (2). A gap is provided between two adjacent fixing rods, and the plurality of fixing rods form a plane for placing wafers. A connecting frame (10) is installed on the etching platform (2), and the other end of the connecting frame (10) is connected to the liquid storage frame, and the connecting frame (10) is configured to be retractable.

5. The etching device for processing an IC semiconductor chip according to claim 4, characterized in that: The clamping assembly (3) is composed of a clamping plate, a clamping telescopic rod and a connecting frame. The clamping plate is arranged on the etching platform (2), the clamping telescopic rod is installed on the etching platform (2), and the connecting frame is slidably installed on the etching platform (2). The connecting frame is connected to the clamping plate and the clamping telescopic rod, so that the clamping telescopic rod drives the clamping plate to move.

6. The etching device for processing an IC semiconductor chip according to claim 5, characterized in that: The dripping mechanism is composed of a liquid storage cylinder (7), a dripping cylinder (11), and a dripping head (14). The liquid storage cylinder (7) is installed on the moving block, the dripping cylinder (11) is installed on the liquid storage cylinder (7), the dripping cylinder (11) is connected with the liquid storage cylinder (7), the dripping head (14) is arranged on the dripping cylinder (11), the bottom of the dripping head (14) is set to be conical, and the dripping head (14) is provided with a flow channel, which is connected with the liquid storage cylinder (7). The etching liquid in the liquid storage cylinder (7) is transported to the dripping cylinder (11) through the flow channel to perform the dripping operation.

7. The etching device for processing an IC semiconductor chip according to claim 6, characterized in that: An adjusting telescopic rod (12) is installed on the liquid storage cylinder (7), and an adjusting frame (13) is provided on the liquid storage cylinder (7). The adjusting frame (13) is connected to the adjusting telescopic rod (12). The adjusting frame (13) is composed of an adjusting rod and an adjusting head. The adjusting head is composed of a trapezoidal round block. The connection between the top end of the dripping cylinder (11) and the liquid storage cylinder (7) is adapted to the adjusting head. The connection can be blocked by the adjusting head to adjust the dripping speed.

8. The etching device for processing an IC semiconductor chip according to claim 7, characterized in that: A separation cylinder (20) is installed on the dripping cylinder (11), and a gas separation frame (15) is installed on the dripping cylinder (11). The gas separation frame (15) is connected to the dripping cylinder (11) through a connecting hole. An air inlet pipe is installed on the gas separation frame (15) for inputting air flow into the gas separation frame (15). The air flow flows along the dripping cylinder (11) and is used to push the etching liquid away from the wafer surface after the etching liquid is dropped onto the wafer.

9. The etching device for processing an IC semiconductor chip according to claim 8, characterized in that: The bottom of the dripping tube (11) is set to a circular frame shape, and the inner diameter is larger than the inner diameter of the top of the dripping tube (11). The bottom of the dripping tube (11) is slidably installed with a mounting tube (25), and an adsorption member (26) is provided in the mounting tube (25). The adsorption member (26) is used to adsorb the sputtered etching liquid. A lifting telescopic rod (24) is installed on the dripping tube (11), and the lifting telescopic rod (24) and the mounting tube (25) are connected by bolts.

10. The etching device for processing an IC semiconductor chip according to claim 9, characterized in that: A heating plate (23) is provided on the dripping cylinder (11), and the heating plate (23) is located above the mounting cylinder (25). The dripping cylinder (11) is provided with an air guide groove. An exhaust pipe is installed on the dripping cylinder (11), and the exhaust pipe is connected to the air guide groove. The exhaust pipe and the heating plate (23) are used to heat the adsorption member (26) to improve the service life of the adsorption member (26).

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