Flat or half-layer flat base island local filling and sealing structure and spraying process method thereof

Abstract

The invention discloses a flat or half-layer flat base island local filling structure and a spraying process method thereof, the flat or half-layer flat base island local filling structure comprises a metal lead frame body, a metal base island and a metal inner pin are arranged on the metal lead frame body, and an inner filling plastic package material is connected between the metal base island and the metal inner pin. The front surface of the metal base island, the front surface of the metal lead frame body and the front surfaces of the metal inner pins are positioned on the same plane; the metal base island is a flat base island or a half-layer flat base island; and the local filling structure is prepared by adopting a spraying process. According to the flat base island local filling structure and the spraying process method thereof, the problems of electrical short circuit or pollution and the like of a large chip and a small base island can be solved.

Description

Technical Field

[0001] The invention relates to a flat or half-layer flat base island local filling structure and a spraying process method thereof, belonging to the technical field of semiconductor chip packaging. Background Art

[0002] The traditional method of making metal lead frame is to use die punching or chemical etching to make a metal lead frame with a full hollow structure (such as Figure 1 However, there are some defects: 1) Since the metal lead frame is a fully hollow structure design, especially the metal base island position, the chip installation structure is limited, requiring a small chip and large base island structure (such as Figure 2 2) If the chip has a large function, the size of the chip will usually be larger than the effective size of the base island. When the chip is installed, the adhesive material (such as conductive glue or non-conductive glue) between the chip and the metal base island will be squeezed to the periphery of the metal base island, causing an electrical short circuit between the metal base island and the metal inner pins or causing the metal inner pins to be contaminated (such as Figure 3 As shown in the figure, the metal inner pins cannot or are difficult to be bonded with metal wires.

[0003] Traditional LED chip packaging uses a pre-molded metal lead frame structure. The manufacturing method is to use a mold to punch or chemically etch to form a completely hollow metal lead frame, and then use a pre-molded mold to mold the lamp particle reflector cup on the completely hollow metal lead frame. However, there are certain defects: 1) The pre-molded mold requires the use of potting equipment, which has high equipment costs; 2) The pre-molded mold is a mold designed specifically for the chip package appearance. The manufacturing cycle takes 3 to 4 months, which is time-consuming. In addition, the use of dedicated molds is limited, and multiple pre-molded molds take up a lot of space; 3) The pre-molded mold is used to pot the epoxy resin molding compound. Due to factors such as foreign matter on the mold surface and exhaust grooves, the molding compound will overflow, which increases the overflow removal process, not only reducing production efficiency, but also consuming manpower, material and financial resources; 4) The thickness of the molding compound of the pre-molded mold is fixed and cannot be changed with changes in function or thickness requirements. Summary of the Invention

[0004] To address at least one problem existing in the above-mentioned prior art, the present invention provides a flat base island partial filling structure and a spraying process method thereof, which can solve the problems of electrical short circuit or contamination of large chip and small base island.

[0005] In order to achieve the above-mentioned objectives, the present invention adopts the following technical solution: a flat or half-layer flat base island partial filling structure, including a metal lead frame body, on which a metal base island and a metal inner pin with a metal layer are provided, and an inner filling plastic sealing material is connected between the metal base island and the metal inner pin, and the front surface of the metal base island is in the same plane as the front surface of the metal lead frame body and the front surface of the metal inner pin; the metal base island is a flat base island or a half-layer flat base island.

[0006] Preferably, the flat or half-layer flat base island partial filling structure is also provided with a structural wall with a raised arrangement. The shape of the structural wall can be a circle type, a single-row straight line type, a multi-row straight line type, etc., and is arranged around the flat base island or the half-layer flat base island. The structural wall is connected to the front side of the internal plastic filling material and the front side of the metal inner pin.

[0007] Preferably, the cross section of the flat base island is T-shaped or diamond-shaped, and the thickness of the flat base island is the same as the thickness of the metal lead frame body.

[0008] Preferably, the cross section of the half-layer flat base island is a straight-line structure, and the thickness of the half-layer flat base island is smaller than the thickness of the metal lead frame body.

[0009] The present invention also provides a chip packaging structure with a flat or half-layer flat base island partial filling structure, including an adhesive material arranged on the front side of the metal base island, a chip is arranged on the front side of the adhesive material, a metal wire is connected between the front side of the chip and the front side of the metal inner pin, and the periphery of the metal base island, the metal inner pin, the metal wire and the chip are encapsulated with an external encapsulation plastic material.

[0010] The present invention also provides a spraying process method for a flat or semi-flat base island partially filled structure, comprising the following steps:

[0011] 1) Based on the metal lead frame with a flat or half-layer flat base island, the program graphics draw the position where spraying is required;

[0012] 2) Clean the metal lead frame and remove the protective layer;

[0013] 3) After the metal lead frame is positioned, the front and back of the metal lead frame are partially sprayed according to the program graphics;

[0014] 4) UV pre-curing: After each layer of local spraying, UV pre-curing is required to achieve a semi-cured, fixed, and non-flowing state;

[0015] 5) Post-curing: permanent curing state;

[0016] 6) Inspection, packaging and storage.

[0017] Preferably, the local spraying includes spraying inner filling plastic sealing material and spraying structural walls.

[0018] Preferably, the material of the inner filling plastic sealing material and the structural wall is UV epoxy resin ink.

[0019] Preferably, the local spraying is performed according to the program graphics, first spraying the plastic sealing material on the back of the metal lead frame where the plastic sealing material needs to be filled, and then spraying the structural wall on the front of the metal lead frame where the structural wall needs to be filled.

[0020] The present invention also provides a chip packaging structure with a flat or half-layer flat base island partial filling structure, including an adhesive material arranged on the front side of the metal base island, a chip is arranged on the front side of the adhesive material, a metal wire is connected between the front side of the chip and the front side of the metal inner pin, and the periphery of the metal base island, the metal inner pin, the metal wire and the chip are encapsulated with an external encapsulation plastic material.

[0021] The present invention also provides a spraying process method for chip packaging with a flat or semi-flat base island partially filled structure, comprising the following steps:

[0022] (1) After the flat or half-flat base island partial filling structure process is completed based on the metal lead frame, an adhesive material is applied on the front surface of the metal base island;

[0023] (2) Laminating the chip to the front of the adhesive material;

[0024] (3) forming a metal wire bond to connect the front side of the chip to the front side of the metal inner pin;

[0025] (4) outer packaging and plastic sealing;

[0026] (5) Curing: in a permanent cured state;

[0027] (6) Molding, inspection, separation and packaging.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] 1. The flat or half-layer flat base island partially encapsulated structure of the present invention uses a metal lead frame as a substrate, the front surface of the metal base island is flush with the front surface of the metal inner pin, the metal base island is set as a flat or half-layer flat base island, and an inner filling plastic encapsulation material is set between the metal base island and the metal inner pin. It can be designed to produce a structure with a large chip and a small base island, which solves the problem of electrical short circuit between the metal base island and the metal inner pin or contamination of the metal inner pin when the chip is connected and installed with the metal base island.

[0030] 2. The flat or half-layer flat base island partial filling structure of the present invention also provides a raised structural wall around the upper flat or half-layer flat base island, which can increase the bonding ability with the plastic sealing material and prevent the adhesive material from expanding outward and contaminating the metal wire bonding.

[0031] 3. The spraying process method of the flat base island partial filling structure of the present invention adopts a universal program graphic spraying equipment, which can have a full or partial spraying mode, and can also spray the required positions of the fully hollow metal lead frame of different packaging types, which can avoid contamination of the pins and other parts inside the metal lead frame.

[0032] 4. The spraying process method of the flat base island partial filling structure of the present invention also uses UV epoxy resin ink to spray the structural wall and the inner filling plastic sealing material, which can control the thickness of the spraying. After the spraying is completed, UV pre-curing is immediately performed to avoid the defects of overflow of the sprayed structural wall and the inner filling plastic sealing material, etc., and the dimensional shaping and accuracy can be fully controlled to further prevent the contamination of the pins and other parts of the metal lead frame and avoid any additional costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a structural diagram of an existing fully hollowed-out metal lead frame;

[0034] Figure 2 Schematic diagram of the existing chip packaging structure with small chip and large base island;

[0035] Figure 3 This is a schematic diagram of the existing chip packaging structure with a large chip and a small base island;

[0036] Figure 4 A front plan view of a partially enclosed structure of a flat base island without a structural wall according to the present invention;

[0037] Figure 5 The bottom view of the partially encapsulated structure of the flat base island of the present invention;

[0038] Figure 6 A front plan view of a partially enclosed structure of a flat base island with a structural wall according to the present invention;

[0039] Figure 7 for Figure 6 Cross-sectional view of a flat base island (a) or a half-level flat base island (b) with a partially enclosed structure with a structural wall in the middle AA direction;

[0040] Figure 8 A cross-sectional view of a chip packaging structure having a partially encapsulated structure with a flat base island and a structural wall according to the present invention;

[0041] Figure 9A cross-sectional view of a chip packaging structure having a partially encapsulated structure with a half-layer flat base island and a structural wall according to the present invention;

[0042] Figure 10 This is a diagram showing the spraying process of the local filling structure of the flat base island of the present invention;

[0043] Figure 11 This is a diagram showing the spraying process of the partial filling structure of the half-layer flat base island of the present invention;

[0044] Figure 12 This is a flow chart of the chip packaging process of the flat base island with no structural wall and a local sealing structure of the present invention;

[0045] Figure 13 This is a flow chart of the chip packaging process of the present invention's half-layer flat partially encapsulated structure with structural walls.

[0046] In the figure: 1. Metal base island, 1a. Flat base island, 1b. Half-layer flat base island, 2. Metal inner pins, 3. Adhesive material, 4. Chip, 5. Metal wire, 6. Outer plastic encapsulation material, 7. Inner plastic encapsulation material, 8. Structural wall. DETAILED DESCRIPTION

[0047] The following is a clear and complete description of the technical solutions in the implementation of the present invention in conjunction with the accompanying drawings. The described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. If specific conditions are not specified in the embodiments, they are carried out according to conventional conditions or the conditions recommended by the manufacturer.

[0048] Example 1

[0049] This embodiment provides a flat base island partial filling structure, including a metal lead frame body. The metal lead frame body can be set as a fully hollow structure. A metal base island 1, metal inner pins 2 and inner filling plastic sealing material 7 are set on the metal lead frame body. The front of the flat base island 1a is in the same plane as the front of the metal lead frame body and the front of the metal inner pins 2. The metal base island 1 is connected to the metal inner pins 2 through the inner filling plastic sealing material 7.

[0050] In this embodiment, the cross section of the metal base island 1 is set to be a T-shaped or diamond-shaped structure, and is a flat base island 1a.

[0051] In this embodiment, if Figure 7 As shown in (a), the back surface of the flat base island 1a is in the same plane as the back surface of the metal lead frame body, that is, the thickness of the flat base island 1a is the same as the thickness of the metal lead frame body.

[0052] In this embodiment, the front surface of the planar base island 1 a and the front surface of the metal inner pin 2 are in the same plane.

[0053] Example 2

[0054] This embodiment provides a half-layer flat base island partial filling structure, including a metal lead frame body. The metal lead frame body can be set as a fully hollow structure. A metal base island 1, metal inner pins 2 and inner filling plastic sealing material 7 are set on the metal lead frame body. The front of the flat base island 1a is in the same plane as the front of the metal lead frame body and the front of the metal inner pins 2. The metal base island 1 is connected to the metal inner pins 2 through the inner filling plastic sealing material 7.

[0055] In this embodiment, the cross section of the metal base island 1 is set to be a straight-line structure, which is a half-layer flat base island 1b.

[0056] In this embodiment, if Figure 7 As shown in (b), the front of the half-layer flat base island 1b is in the same plane as the front of the metal lead frame body, and the back of the half-layer flat base island 1b is higher than the back of the metal lead frame body, that is, the thickness of the half-layer flat base island 1b is less than the thickness of the metal lead frame body.

[0057] In this embodiment, the front surface of the half-layer flat base island 1 b and the front surface of the metal inner pin 2 are in the same plane.

[0058] Example 3

[0059] This embodiment is based on embodiment 1 or embodiment 2, and further provides a structural wall 8 for preventing the diffusion of the adhesive material 3. Specifically, a raised structural wall 8 is further provided on the front surface of the metal lead frame body. The shape can be ring-shaped, single-row straight-line-shaped, multi-row straight-line-shaped, etc. The structural wall 8 surrounds the front surface of the flat base island 1a or the half-layer flat base island 1b. The structural wall 8 is also connected to the inner filling plastic encapsulation material 7 and the metal inner pin 2. The structural wall 8 can surround the adhesive material 3 between the chip 4 and the metal base island 1. The structural wall 8 has a strong bonding ability with the inner filling plastic encapsulation material 7, and can prevent the adhesive material from expanding outward to contaminate the metal wire bonding, completely solving the problems of electrical short circuit or pollution of the large chip and small base island structure. The material of the structural wall 8 can be UV-type epoxy resin.

[0060] Example 4

[0061] Based on Embodiments 1 and 2, this embodiment provides a chip packaging structure with a flat or half-layer flat base island partially encapsulated structure, including an adhesive material 3, a chip 4, a metal wire 5, and an outer encapsulation plastic material 6.

[0062] Based on the local filling structure of the flat base island, the chip 4 is connected to the front of the flat base island 1a through the adhesive material 3, the front of the flat base island 1a and the front of the chip 4 are connected through the metal wire 5, and the flat base island 1a, the chip 4, the metal wire 5 and the metal inner pin 2 are externally encapsulated by the external encapsulation plastic material 6.

[0063] Based on the partially encapsulated structure of a half-layer flat island, the front surface of the half-layer flat island 1b is connected to the chip 4 via adhesive 3. The front surface of the flat island 1a is connected to the front surface of the chip 4 via metal wires 5. The flat island 1a, chip 4, metal wires 5, and metal inner pins 2 are encapsulated with an external encapsulation plastic 6.

[0064] In this embodiment, the size of the front side of the metal base island 1 is smaller than that of the chip 4, and the edge of the chip 4 is placed on the inner filling plastic sealing material 7. The inner filling plastic sealing material 7 is made of UV epoxy resin, which can prevent the diffusion of the adhesive material 3. Figure 8 The chip packaging structure of the large chip and small base island with a structural wall flat base island partial filling structure and Figure 9 The chip packaging structure of the large chip and small base island with a structural wall, a half-layer flat base island and a partially filled structure can solve the problems of electrical short circuit or pollution in the large chip and small base island structure.

[0065] Example 5

[0066] Based on Example 1 or 2, this embodiment provides a spraying process method for a flat or half-layer flat base island partial filling structure, such as Figure 10 and Figure 11 As shown:

[0067] Step 1. Program graphics drawing: Draw the graphics and positions to be sprayed on the AutoCAD graphics of the metal lead frame with a floating structure on the base island, and after completion, produce a file format suitable for the spraying equipment;

[0068] Step 2: Cleaning the metal lead frame: The metal lead frame needs to be cleaned before spraying the program pattern. In order to prevent the metal or metal plating surface of the metal lead frame from corrosion or rust, the metal lead frame will be coated with an antioxidant or film during the packaging process.

[0069] Step 3: Spraying the back of the program graphics: Using UV spraying equipment, position the metal lead frame according to the drawn program graphics data, and then spray the back of the metal lead frame with plastic filling material at the position where the plastic filling material needs to be filled according to the program graphics;

[0070] Step 4, UV pre-curing: After the location on the front of the metal lead frame where the inner filling plastic sealing compound needs to be sprayed is completed, the UV lamp of the UV spraying equipment is immediately started to irradiate to decompose the UV components in the UV epoxy resin, at this time, the inner filling plastic sealing compound is in a semi-cured, fixed and non-flowing state;

[0071] Step 5, post-curing: After the inner filling plastic sealing material is shaped and becomes non-flowing, it is baked at high temperature and for a long time with infrared rays to achieve true permanent curing of the inner filling plastic sealing material, forming a local filling structure with a flat or half-flat base island and no structural wall.

[0072] Step 6: After the product is tested and qualified, it is packaged and put into storage.

[0073] In this embodiment, the cleaning process can include grease removal, rust removal, pure water cleaning, and drying and baking according to the characteristics of the material to ensure that the surface of the metal lead frame is clean, which is conducive to increasing the bonding ability of the UV epoxy resin ink and the metal lead frame.

[0074] In this embodiment, the metal lead frame is positioned by using a fixed L-shaped positioning block on the UV spraying equipment or by using visual indiscriminate positioning; indiscriminate positioning means that there is no need to specify a position, as long as the metal lead frame is placed within the effective scanning area, and then visual scanning is used to memorize the position.

[0075] In this embodiment, the inner-fill molding compound utilizes UV epoxy ink. UV epoxy ink is epoxy ink with UV chemicals added to achieve a quick, initial, and non-flowable state. Furthermore, the thickness of the inner-fill molding compound sprayed is determined by the viscosity, temperature, spray pressure, spray volume, and spray speed of the epoxy material matched to the nozzle in the spraying equipment. The number of inner-fill molding compound layers is determined by the thickness of each layer, and the total required thickness is determined by the number of layers applied. Adjustments can be made to meet different needs or functions without incurring any additional costs, simply by modifying the parameter program or graphics.

[0076] In this embodiment, the temperature and time of the post-curing baking are adjusted and set according to the type and characteristics of the material.

[0077] In this embodiment, the inspection method can use manual visual appearance and measuring instruments to perform dimensional inspection, or use visual equipment to perform relevant dimensional and appearance inspection; the packaging requirements depend on the relationship between the material and the environment, and general vacuum packaging or vacuum packaging after drying is performed.

[0078] Example 6

[0079] Based on Examples 3 and 5, this embodiment provides a spraying process method for a flat or half-layer flat base island partial filling structure:

[0080] Steps 1 to 4 are the same as those in Example 3;

[0081] Step 5: Spraying the front of the program graphics: Position the metal lead frame according to the program graphics, and spray a circular structural wall on the front of the metal lead frame where the structural wall is required. The structural wall is located around the metal base island and fits the inner plastic filling compound and the metal inner pins;

[0082] Step 6, UV pre-curing: After the position of the structural wall on the front of the metal lead frame is completed, the UV lamp of the UV spraying equipment is immediately started to irradiate the structural wall to a semi-cured, fixed, and non-flowing state;

[0083] Step 7, post-curing: After the structural wall is shaped and becomes non-flowing, it is baked at high temperature and for a long time with infrared rays to achieve true permanent curing of the structural wall, forming a flat or semi-flat base island with a local filling structure of the structural wall.

[0084] Step 8: After the product is tested and qualified, it is packaged and put into storage.

[0085] In this embodiment, the cleaning process can include grease removal, rust removal, pure water cleaning, and drying and baking according to the characteristics of the material to ensure that the surface of the metal lead frame is clean, which is conducive to increasing the bonding ability of the UV epoxy resin ink and the metal lead frame.

[0086] In this embodiment, the metal lead frame is positioned by using a fixed L-shaped positioning block on the UV spraying equipment or by visual indiscriminate positioning.

[0087] In this embodiment, UV epoxy ink is used for the internal plastic filling and structural wall. The thickness of the internal plastic filling and structural wall spraying is determined by the viscosity, temperature, spray pressure, spray volume, and spraying speed of the epoxy resin material matched to the nozzle in the spraying equipment. The number of layers of internal plastic filling and structural wall spraying is determined by the thickness of each layer, and the total thickness required is determined by the number of layers sprayed. Adjustments can be made to meet different needs or functions without any additional cost, simply by modifying the parameter program or graphics.

[0088] In this embodiment, the temperature and time of the post-curing baking are adjusted and set according to the type and characteristics of the material.

[0089] In this embodiment, the inspection method can use manual visual appearance and measuring instruments to perform dimensional inspection, or use visual equipment to perform relevant dimensional and appearance inspection; the packaging requirements depend on the relationship between the material and the environment, and general vacuum packaging or vacuum packaging after drying is performed.

[0090] Example 7

[0091] Based on Examples 1 to 6, the present invention also provides a spraying process method for chip packaging with a flat or half-layer flat base island partial filling structure, such as Figure 12 and Figure 13 The chip packaging process shown includes the following steps:

[0092] Step 1: After completing the process of partially filling the flat base island structure based on the metal lead frame, an adhesive material is applied on the front surface of the metal base island;

[0093] Step 2: Place the chip on the front of the applied adhesive and press firmly;

[0094] Step 3: Ball-weld a metal wire between the front side of the chip and the front side of the metal inner pin to form a metal wire bond;

[0095] Step 4: According to the program graphics, the chip, base island, and metal inner pins on the front of the metal lead frame are encapsulated by transfer molding at the locations where the plastic encapsulation material is required;

[0096] Step 5, curing: After the thermosetting epoxy resin molding compound is potted, a high-temperature, long-term permanent curing bake is required. The high-temperature, long-term baking parameters can be set according to the characteristics of different thermosetting epoxy resin molding compounds to form a chip packaging structure with a flat base island or a half-layer flat base island partially filled structure.

[0097] Step 7: After forming and separation, the product is tested and qualified, then packaged and put into storage.

[0098] In this embodiment, the outer packaging plastic material is a thermosetting epoxy resin plastic material.

[0099] In this embodiment, the inspection method can use manual visual appearance and measuring instruments to perform dimensional inspection, or use visual equipment to perform relevant dimensional and appearance inspection; the packaging requirements depend on the relationship between the material and the environment, and general vacuum packaging or vacuum packaging after drying is performed.

[0100] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be embodied in other specific forms without departing from the spirit and essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced therein.

[0101] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A flat or semi-flat base island partially encapsulated structure, comprising a metal lead frame body, on which a metal base island and metal inner pins with a metal layer are provided, characterized in that: The metal base island and the metal inner pin are connected with an inner plastic filling compound, and the front surface of the metal base island is in the same plane as the front surface of the metal lead frame body and the front surface of the metal inner pin; The metal base island is a flat base island or a half-layer flat base island.

2. A flat or half-layer flat island partial filling structure according to claim 1, characterized in that: A raised structural wall is also provided, which surrounds the flat base island or the half-layer flat base island and is connected to the front side of the inner plastic encapsulation material and the front side of the metal inner pin.

3. The flat base island partial filling structure according to claim 1, characterized in that: The cross section of the flat base island is a T-shaped or diamond-shaped structure, and the thickness of the flat base island is the same as the thickness of the metal lead frame body.

4. A flat or half-layer flat island partial filling structure according to claim 3, characterized in that: The cross section of the half-layer flat base island is a straight-line structure, and the thickness of the half-layer flat base island is smaller than the thickness of the metal lead frame body.

5. A spraying process for a flat or semi-flat island partially filled structure according to any one of claims 1 to 4, characterized in that: The following steps are involved: 1) Based on the metal lead frame with a flat or half-layer flat base island, the program graphics draw the position where spraying is required; 2) Clean the metal lead frame and remove the protective layer; 3) After the metal lead frame is positioned, the front and back of the metal lead frame are partially sprayed according to the program graphics; 4) UV pre-curing: After each layer of local spraying, UV pre-curing is required to achieve a semi-cured, fixed, and non-flowing state; 5) Post-curing: permanent curing state; 6) Inspection, packaging and storage.

6. The spray coating process for a flat or semi-flat island partially filled structure according to claim 5, characterized in that: The local spraying includes spraying inner filling plastic sealing material and spraying structural wall.

7. A flat or half-layer flat base island partial filling structure and its spraying process method according to claim 6, characterized in that: The material of the inner filling plastic sealing material and the structural wall is UV epoxy resin ink.

8. A flat base island partial filling structure and spraying process method thereof according to claim 7, characterized in that: The local spraying is to first spray the plastic sealing material on the back of the metal lead frame where the plastic sealing material is needed, and then spray the structural wall on the front of the metal lead frame where the structural wall is needed, according to the program graphics.

9. A chip packaging structure with a flat or half-layer flat base island partial encapsulation structure according to any one of claims 1 to 4, characterized in that: The chip packaging structure includes an adhesive material arranged on the front side of the metal base island, a chip is arranged on the front side of the adhesive material, a metal wire is connected between the front side of the chip and the front side of the metal inner pin, and the periphery of the metal base island, the metal inner pin, the metal wire and the chip are encapsulated with an external encapsulation plastic material.

10. A process for chip packaging structure with a flat or half-layer flat base island partially encapsulated structure according to claim 9, characterized in that: The following steps are involved: (1) After the flat or half-flat base island partial filling structure process is completed based on the metal lead frame, an adhesive material is applied on the front surface of the metal base island; (2) Laminating the chip to the front of the adhesive material; (3) forming a metal wire bond to connect the front side of the chip to the front side of the metal inner pin; (4) outer packaging and plastic sealing; (5) Curing: in a permanent cured state; (6) Molding, inspection, separation and packaging.

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