Chip magnetic shielding packaging structure

Abstract

The invention discloses a chip magnetic shielding packaging structure, in the chip magnetic shielding packaging structure, a middle cavity for placing a chip is formed in a cavity shell layer, the cavity shell layer is provided with a first opening and a second opening, and the cavity shell layer is wrapped by a first adhesive layer to provide magnetic shielding. The shielding layer is provided with a third opening, a fourth opening, a first channel and a second channel, the first channel is connected with the first opening and the third opening, the second channel is connected with the second opening and the fourth opening, the substrate is bonded to the bottom of the shielding layer through the second adhesive layer, and the substrate is provided with a fifth opening and a sixth opening. The fifth opening is aligned with and communicated with the third opening, and the sixth opening is aligned with and communicated with the fourth opening.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, in particular to a chip magnetic shielding packaging structure. Background Art

[0002] For chips using magnetic materials or magnetically sensitive elements, such as magnetic random access memory (MRAM) and magnetic sensors, external magnetic fields have a direct impact on their operation and reading processes. The interaction between magnetic moments and magnetic fields is a fundamental property of magnetic systems. Therefore, external magnetic fields can significantly perturb the magnetic moments of the magnetic layers in magnetoresistive elements, especially the relatively weak anisotropy of the free layer. Consequently, external magnetic fields can interfere with the normal operation of MRAM, reducing its read and write performance and reliability.

[0003] Because magnetic field lines are continuous, magnetic field shielding can be achieved through the shunting effect. A shielding layer with high magnetic permeability in a magnetic field has low magnetic resistance compared to the cavity in the shielded area. Most magnetic field lines will pass through the shielding layer, achieving a shielding effect and protecting the shielded area. Magnetic shielding is typically made of a soft magnetic material with high magnetic permeability, covering the top and at least a portion of the sides of the circuit module.

[0004] Taking into account the working environment of the chip, the magnetic shielding packaging structure used for the chip needs to be able to achieve magnetic shielding in any direction. However, since the wiring used to connect the chip to external electrical equipment must be considered in the packaging structure, this will inevitably lead to magnetic leakage at the opening, thus affecting the normal operation of the chip. The thickness and number of shielding layers can be increased to avoid saturation of ferromagnetic materials, thereby effectively shielding the magnetic field, but this goes against the concept of light and thin packaging. In addition, traditional high magnetic permeability soft magnetic materials, such as Permalloy, are relatively expensive. In summary, the research and development of magnetic shielding technology with excellent performance and moderate cost has become one of the hot topics in the industry.

[0005] The information disclosed in this Background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art. Summary of the Invention

[0006] In response to the deficiencies or defects of the above-mentioned prior art, a chip magnetic shielding packaging structure is provided, which utilizes the high magnetic permeability, low coercive force and other properties of soft magnetic materials and a slotted structure to achieve excellent magnetic shielding effect.

[0007] The purpose of the present invention is achieved through the following technical solutions.

[0008] A chip magnetic shielding packaging structure includes:

[0009] The cavity shell has a middle cavity formed therein for placing the chip, and the cavity shell is provided with a first opening and a second opening.

[0010] A shielding layer, which wraps the cavity shell layer via a first adhesive layer to provide magnetic shielding, the shielding layer having a third opening, a fourth opening, a first channel, and a second channel, wherein the first channel connects the first opening and the third opening, and the second channel connects the second opening and the fourth opening.

[0011] The base is bonded to the bottom of the shielding layer by the second adhesive layer. The base is provided with a fifth opening and a sixth opening. The fifth opening is aligned with and connected to the third opening. The sixth opening is aligned with and connected to the fourth opening.

[0012] In the chip magnetic shielding packaging structure, the first opening, the second opening, the third opening, the fourth opening, the fifth opening and the sixth opening are holes or long groove structures.

[0013] In the chip magnetic shielding packaging structure, the first channel and the second channel are long groove structures.

[0014] In the chip magnetic shielding packaging structure, the cavity shell layer and the shielding layer are both circular or rectangular structures.

[0015] In the chip magnetic shielding packaging structure, the length of the first channel is equal to the distance between the first opening and the third opening, and the length of the second channel is equal to the distance between the second opening and the fourth opening.

[0016] In the chip magnetic shielding packaging structure, the cavity shell is formed of polypropylene or ABS plastic.

[0017] In the chip magnetic shielding packaging structure, the shielding layer is made of soft magnetic material and is used to guide the external magnetic field to flow along the shielding layer to achieve magnetic shielding protection for the chip in the middle cavity.

[0018] In the chip magnetic shielding packaging structure, the substrate is made of alumina ceramic or polyimide material.

[0019] In the chip magnetic shielding packaging structure, the lower left side of the middle cavity is grooved to form a first opening having a hollow area for wiring, the lower right side of the middle cavity is grooved to form a second opening having a hollow area for wiring, the shielding layer is grooved on the left side of the first opening to form a first channel having a hollow area for wiring, the shielding layer is grooved on the right side of the second opening to form a second channel having a hollow area for wiring, the shielding layer is grooved on the lower left side of the first channel to form a third opening having a hollow area for wiring, the shielding layer is grooved on the lower right side of the second channel to form a fourth opening having a hollow area for wiring, the base is grooved directly below the third opening to form a fifth opening having a hollow area for wiring, and the base is grooved directly below the fourth opening to form a sixth opening having a hollow area for wiring.

[0020] In the chip magnetic shielding packaging structure, the materials of the first adhesive layer and the second adhesive layer are epoxy resin or acrylic resin.

[0021] Compared with existing technologies, this invention offers the following advantages: A shielding layer provides magnetic shielding for the chip within the central cavity of the package structure. Wiring is achieved through openings and channels within the shielding layer, improving the uniformity of the magnetic field distribution within the package structure and reducing window magnetic leakage, thereby enhancing the chip's effectiveness and reliability in magnetic field environments. The shielding package structure, made of an iron-nickel soft magnetic alloy, boasts a moderate size and reduced production costs.

[0022] The above description is only an overview of the technical solution of the present invention. In order to make the technical means of the present invention clearer and easier to understand, so that those skilled in the art can implement it according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are illustrated below. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Various other advantages and benefits of the present invention will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are intended only to illustrate preferred embodiments and are not to be construed as limiting the present invention. It should be understood that the drawings described below are merely examples of the present invention, and that those skilled in the art will be able to derive other drawings from these drawings without inventive effort. Throughout the drawings, identical reference numerals are used to denote identical components.

[0024] In the attached figure:

[0025] Figure 1 Schematic diagram of the magnetic field shielding mechanism of the present invention;

[0026] Figure 2 It is a schematic front view of the chip packaging structure according to an embodiment of the present invention;

[0027] Figure 3 A schematic diagram of a simulation of a chip packaging structure according to an embodiment of the present invention;

[0028] FIG4 (a) is a schematic diagram showing the relationship between the magnetic flux density at the center of the cavity and the external magnetic field under an external magnetic field in the x-direction of the chip packaging structure according to an embodiment of the present invention;

[0029] FIG4( b ) is a schematic diagram showing the relationship between the magnetic flux density at the center of the cavity and the external magnetic field under an external magnetic field in the y direction of the chip package structure according to an embodiment of the present invention;

[0030] FIG4( c ) is a schematic diagram showing the relationship between the magnetic flux density at the center of the cavity and the external magnetic field under an external magnetic field in the z direction of the chip packaging structure according to an embodiment of the present invention.

[0031] The present invention will be further explained below with reference to the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0032] Specific embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although specific embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0033] It should be noted that certain words are used in the specification and claims to refer to specific components. Those skilled in the art should understand that technicians may use different nouns to refer to the same component. This specification and claims do not use the difference in nouns as a way to distinguish components, but use the difference in the functions of the components as the criterion for distinction. As mentioned throughout the specification and claims, "including" or "comprising" is an open term, so it should be interpreted as "including but not limited to". The subsequent description of the specification is a preferred embodiment of the present invention, but the description is based on the general principles of the specification and is not intended to limit the scope of the invention. The scope of protection of the present invention shall be as defined in the attached claims.

[0034] To facilitate understanding of the embodiments of the present invention, several specific embodiments will be further explained below with reference to the accompanying drawings. However, the accompanying drawings do not limit the embodiments of the present invention.

[0035] For better understanding, Figure 1 As shown in FIG4 (c), a chip magnetic shielding packaging structure includes:

[0036] The cavity shell 3 has a middle cavity 4 formed therein for placing the chip. The cavity shell 3 is provided with a first opening 5 and a second opening 6.

[0037] The shielding layer 2 wraps the cavity shell 3 via the first adhesive layer 13 to provide magnetic shielding. The shielding layer 2 is provided with a third opening 9, a fourth opening 10, a first channel 7 and a second channel 8. The first channel 7 connects the first opening 5 and the third opening 9, and the second channel 8 connects the second opening 6 and the fourth opening 10.

[0038] The base 1 is bonded to the bottom of the shielding layer 2 by a second adhesive layer 14 . The base 1 is provided with a fifth opening 11 and a sixth opening 12 . The fifth opening 11 is aligned with and connected to the third opening 9 . The sixth opening 12 is aligned with and connected to the fourth opening 10 .

[0039] In a preferred embodiment of the chip magnetic shielding packaging structure, the first opening 5, the second opening 6, the third opening 9, the fourth opening 10, the fifth opening 11 and the sixth opening 12 are holes or long groove structures.

[0040] In a preferred embodiment of the chip magnetic shielding packaging structure, the first channel 7 and the second channel 8 are long groove structures.

[0041] In a preferred embodiment of the chip magnetic shielding packaging structure, the cavity shell 3 and the shielding layer 2 are both circular or rectangular structures.

[0042] In a preferred embodiment of the chip magnetic shielding packaging structure, the length of the first channel 7 is equal to the distance between the first opening 5 and the third opening 9 , and the length of the second channel 8 is equal to the distance between the second opening 6 and the fourth opening 10 .

[0043] In a preferred embodiment of the chip magnetic shielding packaging structure, the cavity shell 3 is formed of polypropylene or ABS plastic.

[0044] In a preferred embodiment of the chip magnetic shielding packaging structure, the shielding layer 2 is made of soft magnetic material and is used to guide the external magnetic field to flow along the shielding layer to achieve magnetic shielding protection for the chip in the middle cavity.

[0045] In a preferred embodiment of the chip magnetic shielding packaging structure, the substrate 1 is made of alumina ceramic or polyimide material.

[0046] In a preferred embodiment of the chip magnetic shielding packaging structure, the intermediate cavity 4 is grooved at the lower left side to form a first opening 5 having a hollow area for wiring, the intermediate cavity 4 is grooved at the lower right side to form a second opening 6 having a hollow area for wiring, the shielding layer 2 is grooved at the left side of the first opening 5 to form a first channel 7 having a hollow area for wiring, the shielding layer 2 is grooved at the right side of the second opening 6 to form a second channel 8 having a hollow area for wiring, the shielding layer 2 is grooved at the lower left side of the first channel 7 to form a third opening 9 having a hollow area for wiring, the shielding layer 2 is grooved at the lower right side of the second channel 8 to form a fourth opening 10 having a hollow area for wiring, the base 1 is grooved directly below the third opening 9 to form a fifth opening 11 having a hollow area for wiring, and the base 1 is grooved directly below the fourth opening 10 to form a sixth opening 12 having a hollow area for wiring.

[0047] In a preferred embodiment of the chip magnetic shielding packaging structure, the materials of the first adhesive layer 13 and the second adhesive layer 14 are epoxy resin or acrylic resin.

[0048] In one embodiment, the structure comprises,

[0049] The cavity shell 3 has a middle cavity 4 formed therein for placing the chip. The cavity shell 3 is provided with a first opening 5 and a second opening 6.

[0050] The shielding layer 2 wraps the cavity shell 3 via the first adhesive layer 13. The shielding layer 2 is provided with a first channel 7 and a second channel 8. The first channel 7 connects the first opening 5 and the third opening 9. The second channel 8 connects the second opening 6 and the fourth opening 10. The shielding layer 2 is provided with a third opening 9 and a fourth opening 10.

[0051] The base 1 is bonded to the bottom of the shielding layer 2 by a second adhesive layer 14 . The base 1 is provided with a fifth opening 11 and a sixth opening 12 . The fifth opening 11 is aligned with the third opening 9 , and the sixth opening 12 is aligned with the fourth opening 10 .

[0052] In a preferred embodiment of a commercial standard-compatible chip magnetic shielding package structure, the first opening 5, second opening 6, third opening 9, fourth opening 10, fifth opening 11, and sixth opening 12 are holes or elongated slots. The first channel 7 and second channel 8 are elongated slots, and the cavity shell 3 and shielding layer 2 are both circular or rectangular. The shielding layer 2 is grooved below the left side of the intermediate cavity 4 to form a first opening 5 with a hollow area for wiring, and grooved below the right side of the intermediate cavity 4 to form a second opening 6 with a hollow area for wiring. The shielding layer 2 is grooved to the left of the first opening 5 to form a first channel 7 with a hollow area for wiring, and grooved to the right of the second opening 6 to form a second channel 8 with a hollow area for wiring. The shielding layer 2 is grooved below the left side of the first channel 7 to form a third opening 9 with a hollow area for wiring, and grooved below the right side of the second channel 8 to form a fourth opening 10 with a hollow area for wiring. The base 1 is grooved directly below the third opening 9 to form a fifth opening 11 with a hollow area for wiring, and the base 1 is grooved directly below the fourth opening 10 to form a sixth opening 12 with a hollow area for wiring. The first adhesive layer 13 and the second adhesive layer 14 are made of epoxy resin.

[0053] In one embodiment, the shielding layer 2 is used to shield the magnetic field and is made of iron-nickel alloy soft magnetic material; in the packaging structure, the shielding layer 2 is bonded to the cavity shell 3 forming the intermediate cavity 4 by a first adhesive layer 13, and the shielding layer 2 is bonded to the base 1 by a second adhesive layer 14.

[0054] In one embodiment, Figure 1 As shown, the principle of the present invention is that soft magnetic materials provide a low-reluctance magnetic path for interfering magnetic fields. The intermediate cavity 4 and the shielding layer 2 form a parallel magnetic circuit. Because the shielding layer 2 is made of a soft magnetic material, its magnetic permeability is much greater than that of the cavity, and the reluctance of the shielding layer 2 material is much lower than that of the cavity. Therefore, the magnetic induction flux mainly flows through the shielding layer 2, thereby diverting the interfering magnetic field and achieving the purpose of shielding the magnetic field.

[0055] like Figure 2 As shown, in the chip packaging structure, shielding layer 2 is bonded to cavity shell layer 3, which forms intermediate cavity 4, by a first adhesive layer 13. Shielding layer 2 is then bonded to substrate 1 by a second adhesive layer 14. It should be noted that the connection between the multiple shielding layers is achieved by bonding, i.e., adhesive layers are provided between adjacent shielding layers. Specifically, the adjacent shielding layers can be bonded together using epoxy resin.

[0056] In the above embodiment, the chip is located in a package structure covered with magnetic shielding material, and the strong magnetic field is shielded by the shunting effect of the shielding layer 2. The present invention can effectively shield the chip from external magnetic fields in all directions, improve the chip's resistance to magnetic interference, and thus enhance the chip's effectiveness and reliability in magnetic field environments.

[0057] In some embodiments, the material of the shielding layer 2 is an iron-nickel soft magnetic alloy, which has high magnetic permeability, high saturation magnetic induction, low coercive force, and low hysteresis loss. It can efficiently shunt the external magnetic field, confining the magnetic lines of force to the interior of the shielding layer and preventing them from diffusing into the shielded space. In other embodiments, other types of magnetic shielding materials can also be used as long as they can achieve the same functions as described above. Specifically, the iron-nickel soft magnetic alloy of the present invention can be 1J66, 1J79, 1J85, etc.

[0058] Specifically, the thickness of the shielding layer 2 of the present invention can be 5.5 mm to 6 mm. In this embodiment, the shielding layer 2 and the substrate 1 are connected by bonding, that is, a glue layer is provided between the shielding layer 2 and the substrate 1 .

[0059] In some embodiments, the material of substrate 1 is alumina ceramic, which has stable process, high thermal conductivity, light weight, good mechanical properties, and is a relatively mature packaging material with high reliability; or polyimide is used, which has high thermal stability and good mechanical properties and is a rapidly developing packaging material.

[0060] Figure 3Figure 4 is a simulation diagram of a chip package structure according to an embodiment of the present invention. The direction of the external magnetic field is perpendicular to the package structure and extends upward from bottom to top. The magnetic field lines flow out through the shielding layer, protecting the intermediate cavity 4. A three-dimensional cross-section is drawn from the center of the first opening to the second opening at the center of the intermediate cavity 4. The relationship between the magnetic flux density within the cavity and its position is analyzed when the external magnetic field is 1 T and the direction of the external magnetic field changes. Figures 4(a) to 4(c) illustrate the relationship between the magnetic flux density within the cavity and its position under an external magnetic field of 1 T for the chip package structure according to an embodiment of the present invention. Figure 4(a) illustrates the relationship between the magnetic flux density at the center of the cavity and the external magnetic field under an external magnetic field in the x-direction. Figure 4(b) illustrates the relationship between the magnetic flux density at the center of the cavity and the external magnetic field under an external magnetic field in the y-direction. Figure 4(c) illustrates the relationship between the magnetic flux density at the center of the cavity and the external magnetic field under an external magnetic field in the z-direction for the chip package structure according to an embodiment of the present invention. In Figure 4 (a), when the external magnetic field is 1T, the magnetic field intensity at the center of the middle cavity 4 is between 0.011T and 0.012T, which is two orders of magnitude lower than the external magnetic field intensity; in Figure 4 (b), when the external magnetic field is 1T, the magnetic field intensity at the center of the middle cavity 4 is approximately 0.014T, which is two orders of magnitude lower than the external magnetic field intensity; in Figure 4 (c), when the external magnetic field is 1T, the magnetic field intensity at the center of the middle cavity 4 is approximately between 0.016T and 0.018T, which is two orders of magnitude lower than the external magnetic field intensity; the present invention achieves excellent magnetic field shielding effect by adjusting the slot structure while being compatible with commercial standards, and has broad application prospects in the field of integrated circuits.

[0061] Example 1: Commercial standard compatible chip magnetic shielding packaging structure

[0062] 1. Structural composition

[0063] This embodiment provides a chip magnetic shielding packaging structure compatible with commercial standards, including the following components:

[0064] Cavity Shell 3

[0065] Material: ABS plastic

[0066] There is an intermediate cavity 4 inside to accommodate the chip

[0067] A groove is formed at the lower left side of the middle cavity to form a first opening 5, and a groove is formed at the lower right side to form a second opening 6

[0068] Shielding layer 2

[0069] Material: Iron-nickel soft magnetic alloy such as 1J79

[0070] The cavity shell 3 is bonded and wrapped by the first adhesive layer 13

[0071] The shielding layer opens a first channel 7 on the left side of the first opening 5 and connects to the third opening 9.

[0072] The shielding layer opens a second channel 8 on the right side of the second opening 6 and connects to the fourth opening 10.

[0073] The first channel 7 and the second channel 8 are long slot structures, and their lengths are equal to the distances from the first opening to the third opening and from the second opening to the fourth opening, respectively.

[0074] Base 1

[0075] Material: Alumina ceramic

[0076] Adhere to the bottom of the shielding layer 2 via the second adhesive layer 14

[0077] The substrate is provided with a fifth opening 11 directly below the third opening 9 and a sixth opening 12 directly below the fourth opening 10.

[0078] All openings are aligned to allow external lead routing capabilities

[0079] Adhesive layer material

[0080] The first adhesive layer 13 and the second adhesive layer 14 are made of epoxy resin

[0081] 2. Working Principle

[0082] In this embodiment, shielding layer 2 utilizes the high magnetic permeability of soft magnetic materials to provide a low-resistance path for magnetic flux under the influence of an external magnetic field. Because the magnetic permeability of the shielding layer is much higher than that of the air or plastic medium within the intermediate cavity, most external magnetic lines of force are diverted through the shielding layer, effectively reducing the magnetic induction intensity within the intermediate cavity 4. Figure 3 This is a simulation diagram, which shows that when the external magnetic field enters the packaging structure vertically from bottom to top, the magnetic lines of force mainly flow along the shielding layer, and the middle cavity is well protected.

[0083] 3. Performance Test Results

[0084] By performing a three-dimensional magnetic field simulation analysis on this embodiment, the shielding effect under external magnetic fields in different directions is evaluated:

[0085] X-direction magnetic field shielding effect

[0086] External magnetic field strength: 1T

[0087] Magnetic field strength in the center of the middle cavity: 0.011~0.012T

[0088] The magnetic field is attenuated by two orders of magnitude

[0089] Y-direction magnetic field shielding effect

[0090] External magnetic field strength: 1T

[0091] Magnetic field strength in the center of the middle cavity: about 0.014T

[0092] The magnetic field is attenuated by two orders of magnitude

[0093] Magnetic field shielding effect in the Z direction

[0094] External magnetic field strength: 1T

[0095] Magnetic field strength in the center of the middle cavity: 0.016~0.018T

[0096] The magnetic field is attenuated by two orders of magnitude

[0097] The above results demonstrate that the package structure of this embodiment exhibits excellent magnetic field shielding capabilities in all three spatial directions. The shielding layer thickness is controlled between 5.5mm and 6mm, balancing shielding efficiency and lightweight design requirements. The use of a proven iron-nickel alloy material and epoxy resin bonding process ensures production feasibility. The slotted structure design is compatible with commercial standard package dimensions, facilitating integration into existing chip manufacturing processes. The alumina ceramic substrate offers excellent thermal conductivity and mechanical stability, making it suitable for high-reliability applications.

[0098] The magnetic shielding packaging structure provided in this embodiment is particularly suitable for the following chip types and application scenarios: magnetic random access memory (MRAM) magnetic sensors (such as Hall sensors, magnetoresistive sensors) electronic systems that need to operate stably in a strong magnetic field environment (such as industrial automation, medical equipment, rail transportation control systems, etc.).

[0099] This invention uses a shielding layer made of soft magnetic materials (such as iron-nickel alloy and 1J79) to leverage their high magnetic permeability and low coercivity, providing a low-reluctance path for the external magnetic field. This allows magnetic lines of force to flow preferentially along the shielding layer, effectively reducing the magnetic field intensity within the intermediate cavity and achieving efficient magnetic shielding. The shielding layer wraps around the cavity shell and is bonded with an adhesive layer to enhance structural stability. This ensures good adhesion and sealing between the shielding layer and the cavity shell, improving overall package reliability. Multiple openings and channels (first through sixth openings, first and second channels) are provided in the shielding layer and substrate to facilitate chip lead routing. The slotted structure optimizes magnetic field distribution, reduces magnetic flux leakage, and enhances shielding efficiency. The openings and channels utilize elongated slots to facilitate wiring and routing, while controlling the opening area to minimize magnetic field leakage paths and enhance shielding effectiveness. The flexible structural design adapts to various packaging requirements. The shielding layer thickness is set between 5.5mm and 6mm to balance magnetic shielding performance with the requirements for a lightweight and thin package. This reduces the package size while ensuring sufficient shielding capability, meeting commercial standards. The cavity shell is constructed of polypropylene or ABS plastic, providing an insulated, isolated environment to prevent electromagnetic interference. Its low cost and excellent processability make it suitable for large-scale production. The substrate is made of alumina ceramic or polyimide. Alumina ceramic offers excellent thermal conductivity and mechanical strength, making it suitable for high-temperature, high-reliability applications; polyimide offers excellent flexibility and high-temperature resistance, adapting to diverse application requirements. The adhesive layer, constructed of epoxy or acrylic resin, provides excellent bonding strength and sealing performance, while also possessing sufficient temperature resistance and chemical stability to ensure long-term reliable operation of the package. The shielding layer features openings and channels on the left and right sides of the central cavity, creating a multi-level wiring path. This prevents concentrated magnetic field leakage caused by a single opening and improves the shielding uniformity of the package structure under magnetic fields of varying orientations. The circular or rectangular design of the central cavity facilitates symmetrical magnetic field distribution, enhancing the shielding consistency and effectiveness in the x, y, and z directions. The multi-layer stacked design (cavity shell + shielding layer + substrate) achieves functional zoning: the cavity shell protects the chip's physical space, the shielding layer provides magnetic shielding, and the substrate provides electrical connections and support. The overall structure is compact and fully functional. The present invention achieves the following significant technical effects: High-efficiency magnetic shielding: utilizing the high magnetic permeability characteristics of soft magnetic materials to guide the external magnetic field to bypass the chip area, greatly reducing the magnetic field strength in the cavity, and improving the working stability of the chip in a strong magnetic field environment. Omnidirectional shielding capability: through symmetrical structure and reasonable layout, good magnetic field shielding effects can be achieved in the three directions of x, y, and z, which is suitable for complex magnetic field environments. Compatible with commercial standards: standardized lead wiring is achieved through slotting and channel design, which complies with existing packaging process flow and is easy to promote and apply. Lightweight and thin structure: under the premise of ensuring shielding performance, the thickness of the shielding layer is controlled within the range of 5.5mm to 6mm, taking into account both lightweight and high performance requirements.Low Cost, High Reliability: Utilizing proven materials and processes (such as epoxy resin bonding, plastic shells, and alumina ceramic substrates), the package ensures reliability while reducing manufacturing costs. Multifunctional Integrated Design: A multi-layer structure integrates multiple functions, including chip protection, magnetic shielding, and electrical lead generation, enhancing package integration.

[0100] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A chip magnetic shielding packaging structure, characterized in that: It includes, A cavity shell (3) is formed inside which an intermediate cavity (4) for placing a chip is formed. The cavity shell (3) is provided with a first opening (5) and a second opening (6). A shielding layer (2) wraps the cavity shell (3) via a first adhesive layer (13) to provide magnetic shielding, the shielding layer (2) being provided with a third opening (9), a fourth opening (10), a first channel (7) and a second channel (8), the first channel (7) connecting the first opening (5) and the third opening (9), the second channel (8) connecting the second opening (6) and the fourth opening (10), A base (1) is bonded to the bottom of the shielding layer (2) by a second adhesive layer (14), the base (1) being provided with a fifth opening (11) and a sixth opening (12), the fifth opening (11) being aligned with and connected to the third opening (9), and the sixth opening (12) being aligned with and connected to the fourth opening (10).

2. The chip magnetic shielding packaging structure according to claim 1, wherein: Preferably, the first opening (5), the second opening (6), the third opening (9), the fourth opening (10), the fifth opening (11) and the sixth opening (12) are holes or elongated groove structures.

3. The chip magnetic shielding packaging structure according to claim 1, wherein: The first channel (7) and the second channel (8) are long groove structures.

4. The chip magnetic shielding packaging structure according to claim 1, wherein: The cavity shell (3) and the shielding layer (2) are both circular or rectangular structures.

5. The chip magnetic shielding packaging structure according to claim 1, wherein: The length of the first channel (7) is equal to the distance between the first opening (5) and the third opening (9), and the length of the second channel (8) is equal to the distance between the second opening (6) and the fourth opening (10).

6. The chip magnetic shielding packaging structure according to claim 1, wherein: The cavity shell (3) is formed of polypropylene or ABS plastic.

7. The chip magnetic shielding packaging structure according to claim 1, wherein: The shielding layer (2) is made of soft magnetic material and is used to guide the external magnetic field to flow along the shielding layer, so as to achieve magnetic shielding protection for the chip in the middle cavity.

8. The chip magnetic shielding packaging structure according to claim 1, wherein: The substrate (1) is made of alumina ceramic or polyimide material.

9. The chip magnetic shielding packaging structure according to claim 1, wherein: The middle cavity (4) is grooved at the lower left side to form a first opening (5) having a hollow area for wiring, the middle cavity (4) is grooved at the lower right side to form a second opening (6) having a hollow area for wiring, the shielding layer (2) is grooved at the left side of the first opening (5) to form a first channel (7) having a hollow area for wiring, the shielding layer (2) is grooved at the right side of the second opening (6) to form a second channel (8) having a hollow area for wiring, the shielding layer (2) is grooved at the lower left side of the first channel (7) to form a third opening (9) having a hollow area for wiring, the shielding layer (2) is grooved at the lower right side of the second channel (8) to form a fourth opening (10) having a hollow area for wiring, the base (1) is grooved directly below the third opening (9) to form a fifth opening (11) having a hollow area for wiring, and the base (1) is grooved directly below the fourth opening (10) to form a sixth opening (12) having a hollow area for wiring.

10. The chip magnetic shielding packaging structure according to claim 1, characterized in that: The materials of the first adhesive layer (13) and the second adhesive layer (14) are epoxy resin or acrylic resin.

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