Electronic load meter capable of being used for testing quick charger

Abstract

The invention discloses an electronic load instrument for testing a quick charger, and the instrument comprises an outer housing which is internally provided with a plurality of module housings; the circuit board is arranged in the module shell, and electronic elements used for testing the charger are arranged on the circuit board; the heat dissipation part comprises a heat dissipation frame body, the heat dissipation frame body is rectangular, heat dissipation fins are arranged in the heat dissipation frame body in an array mode, the two ends of the heat dissipation frame body are open ends, a first heat dissipation semicircular plate and a second heat dissipation semicircular plate are arranged at one end of the heat dissipation frame body, and the first heat dissipation semicircular plate and the second heat dissipation semicircular plate are rotationally connected with the heat dissipation frame body; the heat dissipation fan is arranged on the outer shell, one side of the heat dissipation fan is connected with a main heat dissipation pipe, a plurality of auxiliary heat dissipation pipes are arranged on the main heat dissipation pipe in an array mode, and the auxiliary heat dissipation pipes communicate with the heat dissipation frame body; and the switch assembly is arranged in the module shell and comprises a rotating rod, and the rotating rod is fixedly connected with the first heat dissipation semicircular plate.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic instruments, and in particular to an electronic load meter that can be used to test a fast charger. Background Art

[0002] When testing fast chargers, an electronic load meter is a key tool that can effectively simulate the current demands of actual use environments and evaluate the charger's performance and stability. Existing electronic load meters may require different types or specifications of loads for different test scenarios. With a removable design, users can replace different modules or components based on specific test requirements, such as adjusting constant current, constant voltage, constant power, or replacing modules with different current ranges. This flexibility allows electronic load meters to adapt to a wider range of application scenarios, improving their versatility and applicability.

[0003] Modular electronic loads typically house cooling fans inside the device housing. These fans not only take up considerable space but are also relatively heavy, significantly increasing the overall size and weight of the device. In practice, this design makes the device more cumbersome and awkward to carry and operate. While modularity offers some flexibility, the cooling fan design introduces significant inconvenience during use and replacement.

[0004] To this end, we propose an electronic load meter that can be used to test fast chargers. Summary of the Invention

[0005] The present invention aims to provide an electronic load meter that can be used to test a fast charger, so as to solve the problems raised in the above background technology. To achieve the above object, the present invention provides the following technical solution: an electronic load meter that can be used to test a fast charger, comprising:

[0006] An outer shell, wherein a plurality of module shells are arranged in the outer shell;

[0007] A circuit board is disposed in the module housing and is provided with electronic components for testing the charger;

[0008] A heat dissipation unit, the heat dissipation unit comprising:

[0009] A heat dissipation frame, the heat dissipation frame is rectangular, an array of heat dissipation fins is arranged in the heat dissipation frame, both ends of the heat dissipation frame are open ends, and one end of the heat dissipation frame is provided with a heat dissipation semicircular plate 1 and a heat dissipation semicircular plate 2, and the heat dissipation semicircular plate 1 and the heat dissipation semicircular plate 2 are rotatably connected to the heat dissipation frame;

[0010] A heat dissipation fan is provided on the outer shell, one side of the heat dissipation fan is connected to a main heat dissipation pipe, a plurality of auxiliary heat dissipation pipes are arranged in an array on the main heat dissipation pipe, and the auxiliary heat dissipation pipes are connected to the heat dissipation frame;

[0011] A switch assembly is provided in the module housing and includes:

[0012] A rotating rod, wherein the rotating rod is fixedly connected to a heat dissipation semicircular plate, the heat dissipation frame is provided with a reset member at one end of the rotating rod, a magnetic block 1 is fixedly connected to the end of the rotating rod, the circuit board is provided with a circuit frame on one side of the rotating rod, a fixing member is provided in the middle of the circuit frame, a magnetic block 2 is fixedly connected to the inner wall of the fixing member, the magnetic block 1 is magnetically connected to the magnetic block 2, an elastic member is provided on the outside of the fixing member, a spring member is provided at one end of the fixing member, the spring member is made of memory metal material, one end of the spring member is fixedly connected to the fixing member and the other end is fixedly connected to the circuit frame;

[0013] An adjusting component is provided in the module housing and is used to adjust the angle between the second heat dissipation semicircular plate and the heat dissipation frame.

[0014] Preferably, the reset member is made of rubber;

[0015] Connecting ear 1, the connecting ear 1 is arranged on the side of the heat dissipation frame close to the rotating axis of the heat dissipation semicircular plate 1, the magnetic block 1 is fixedly connected to the connecting ear 2, one end of the reset member is fixedly connected to the connecting ear 1 and the other end is fixedly connected to the connecting ear 2, and the reset member is arranged parallel to the rotating rod.

[0016] Preferably, the adjustment component includes:

[0017] A gear assembly, the gear assembly being used to rotate the second heat dissipation semicircular plate;

[0018] a bending assembly, the bending assembly being used to provide kinetic energy to the gear assembly;

[0019] A heat transfer component, the heat transfer component is used to provide heat energy to the bending component;

[0020] A fine-tuning component is used to control the heat transfer efficiency of the heat transfer component.

[0021] Preferably, the bending assembly comprises:

[0022] A fixing plate is fixedly connected to the outer wall of the air inlet duct of the heat dissipation frame. A bimetallic plate is fixedly connected to the fixing plate. The bimetallic plate is made of two metal materials with different expansion coefficients. A circular groove ring is fixedly connected to the top of the bimetallic plate.

[0023] Preferably, the gear assembly comprises:

[0024] A gear seat, the gear seat being fixedly connected to the outer wall of the air inlet duct of the heat dissipation frame;

[0025] A small gear is fixedly connected to the two rotating shaft ends of the heat dissipation semicircular plate, the small gear is rotatably connected to the gear seat, a large gear is meshed with one side of the small gear, the large gear is rotatably connected to the gear seat, a round rod is fixedly connected to the large gear, and the round rod is arranged in a circular groove ring.

[0026] Preferably, the heat transfer component comprises:

[0027] A connecting frame is provided on a circuit board, and is sleeved on a heat-generating electronic component. A connecting portion is provided in the connecting frame, and the connecting portion is made of a material with good heat transfer performance. The end of the connecting portion is fixedly connected to the bottom end of the bimetallic plate, and the connecting frame is made of a heat-insulating material.

[0028] Preferably, the fine-tuning component includes:

[0029] An insulation tube passes through the circuit board and is fixedly connected to the inner wall of the module shell. A round tube is fixedly connected to the bottom of the fixed plate. A plurality of heat dissipation holes are arranged in an array on the round tube. An insulation piece is provided between the round tube and the insulation tube, and the insulation piece is slidably connected to the insulation tube.

[0030] Preferably, a sliding button is slidably connected to the outer wall of the module housing, and a connecting piece is fixedly connected between the sliding button and the heat insulation piece.

[0031] Preferably, the connecting portion is made of aluminum, aluminum-magnesium-silicon alloy or thermally conductive silicone.

[0032] The present invention has at least the following beneficial effects:

[0033] 1. When the load meter is working, the circuit frame will be in the power-on state. At this time, the current flows through the spring part made of memory metal material, and the spring part heats up rapidly. During the heating process, the spring part returns to its initial state and contracts, thereby driving the second magnetic block on the fixed part to separate from the first magnetic block. At this time, the rotation rod will be unrestricted, and the heat dissipation fan will start working at the same time. The heat dissipation fan uses wind force to blow open the heat dissipation semicircular plate 1, thereby completing the heat dissipation purpose. In addition, the heat dissipation semicircular plate 1 that is not working will not open. When the heat dissipation is completed, the reset part will drive the heat dissipation semicircular plate 1 to return to its initial state. After power is turned off, the spring part returns to normal temperature, and the elastic part drives the second magnetic block on the fixed part to re-magnetically connect with the first magnetic block.

[0034] 2. When the load is working, the electronic heating element on the circuit board starts to heat up. The heat will reach the bending component through the heat transfer component. The bending component cooperates with the gear component to drive the second heat dissipation semicircular plate to expand. The user can also control the heat transfer efficiency of the heat transfer component through the fine adjustment component, thereby controlling the opening angle of the second heat dissipation semicircular plate to be different when the electronic component is at the same temperature.

[0035] 3. When more heat dissipation holes are exposed, the connection part will lose more heat in this section, so the amount of heat from the heat-generating electronic components to the bimetallic plate will be reduced, thereby reducing the degree of deviation of the bimetallic plate. Finally, the opening angle of the two heat-generating semicircular plates will be smaller, reducing the ventilation volume. When multiple loads are working at the same time, this adjustment method can be used to better dissipate heat from heat-generating electronic components with poor heat resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0037] Figure 2 This is a structural schematic diagram of another perspective of the present invention;

[0038] Figure 3 Schematic diagram of the internal structure of the present invention;

[0039] Figure 4 This is a schematic diagram of the cross-sectional structure of the main heat dissipation pipe of the present invention;

[0040] Figure 5 This is a schematic diagram of the switch assembly structure of the present invention;

[0041] Figure 6 For the present invention Figure 5 A schematic diagram of the enlarged structure of part A;

[0042] Figure 7 This is a schematic diagram of the structure of the regulating component of the present invention;

[0043] Figure 8 For the present invention Figure 7 The enlarged structural diagram of part B in the middle;

[0044] Figure 9 This is a schematic structural diagram of the adjustment component of the present invention from another perspective;

[0045] Figure 10 For the present invention Figure 9 Schematic diagram of the enlarged structure of part C in the middle.

[0046] In the figure: 10, outer shell; 11, module shell; 12, circuit board; 20, heat dissipation unit; 21, heat dissipation frame; 22, heat sink; 23, heat dissipation semicircular plate 1; 24, heat dissipation semicircular plate 2; 30, heat dissipation fan; 31, main heat dissipation pipe; 32, auxiliary heat dissipation pipe; 40, switch assembly; 41, rotating rod; 42, magnetic block 1; 43, circuit frame; 44, fixing member; 45, magnetic block 2; 46, elastic member; 47, spring member; 48, reset member; 50, adjustment assembly; 51, Gear assembly; 52. Bending assembly; 53. Heat transfer assembly; 54. Fine-tuning assembly; 521. Fixing plate; 522. Bimetallic plate; 523. Grooved ring; 511. Gear seat; 512. Small gear; 513. Large gear; 514. Round rod; 531. Connecting frame; 532. Connecting part; 541. Insulation tube; 542. Round tube; 543. Heat dissipation hole; 544. Insulation piece; 61. Sliding button; 62. Connecting piece; 481. Connecting ear one; 482. Connecting ear two. DETAILED DESCRIPTION

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0048] To better understand the electronic load meter for testing fast chargers provided in the embodiments of the present application, a brief introduction to existing electronic load meters is provided below. To achieve different functions, existing electronic load meters employ a modular design that allows for replacement at any time based on the measurement object. The heat dissipation system typically employs air cooling. In actual use, only one or a few of these fans are often used to complete the test, leaving the remaining cooling fans redundant.

[0049] The following is a brief overview of the application scheme. By placing the cooling fan externally and directly plugging it into the cooling frame inside the module load meter through a ventilation duct, it is easy to replace. At the same time, the switch component is used to control ventilation only when the module load meter is working, thereby avoiding waste of resources caused by diversion.

[0050] Example 1: Please refer to Figure 1-10 The present invention provides a technical solution: an electronic load meter that can be used to test a fast charger, comprising:

[0051] An outer shell 10, wherein a plurality of module shells 11 are disposed inside the outer shell 10, and the outer shell 10 is used to fix the module shells 11;

[0052] A circuit board 12 is disposed in the module housing 11 and is provided with electronic components for testing the charger;

[0053] The heat dissipation unit 20 includes:

[0054] The heat dissipation frame 21 is rectangular and has heat dissipation fins 22 arranged in an array within the heat dissipation frame 21. Both ends of the heat dissipation frame 21 are open ends. A heat dissipation semicircular plate 1 23 and a heat dissipation semicircular plate 24 are provided at one end of the heat dissipation frame 21. The heat dissipation semicircular plate 1 23 and the heat dissipation semicircular plate 24 are rotatably connected to the heat dissipation frame 21.

[0055] A heat dissipation fan 30 is provided on the outer shell 10 . A main heat dissipation pipe 31 is connected to one side of the heat dissipation fan 30 . A plurality of auxiliary heat dissipation pipes 32 are arranged in an array on the main heat dissipation pipe 31 . The auxiliary heat dissipation pipes 32 are connected to the heat dissipation frame 21 .

[0056] It should be noted that the heat generated by the heat-generating electronic components on the circuit board 12 enters the heat sink 22 in the heat dissipation frame 21 and then is driven by the external heat dissipation fan 30 to flow through the main heat dissipation pipe 31 into the auxiliary heat dissipation pipe 32 and accelerate the removal of heat from the heat sink 22;

[0057] The switch assembly 40 is disposed in the module housing 11 and includes:

[0058] A rotating rod 41 is fixedly connected to a heat dissipation semicircular plate 1 23. The heat dissipation frame 21 is provided with a reset member 48 at one end of the rotating rod 41. A magnetic block 1 42 is fixedly connected to the end of the rotating rod 41. The circuit board 12 is provided with a circuit frame 43 on one side of the rotating rod 41. A fixing member 44 is provided in the middle of the circuit frame 43. A magnetic block 2 45 is fixedly connected to the inner wall of the fixing member 44. The magnetic block 1 42 is magnetically connected to the magnetic block 2 45. An elastic member 46 is provided on the outside of the fixing member 44. A spring member 47 is provided at one end of the fixing member 44. The spring member 47 is made of memory metal material. One end of the spring member 47 is fixedly connected to the fixing member 44 and the other end is fixedly connected to the circuit frame 43.

[0059] It should be noted that when the load meter is working, the circuit frame 43 will be in a power-on state. At this time, current flows through the spring member 47 made of memory metal material, and the spring member 47 quickly heats up. The spring member 47 returns to its initial state and contracts during the heating process, thereby driving the second magnetic block 45 on the fixed member 44 to separate from the first magnetic block 42. At this time, the rotating rod 41 will be unrestricted, and the heat dissipation fan 30 will start working at the same time. The heat dissipation fan 30 uses wind force to blow open the heat dissipation semicircular plate 1 23, thereby achieving the purpose of heat dissipation. In addition, the heat dissipation semicircular plate 1 23 that is not working will not open. When the heat dissipation is completed, the reset member 48 will drive the heat dissipation semicircular plate 1 23 to return to its initial state. After power is turned off, after the spring member 47 returns to normal temperature, the elastic member 46 drives the second magnetic block 45 on the fixed member 44 to re-magnetically connect with the first magnetic block 42.

[0060] The adjustment component 50 is arranged in the module shell 11. The adjustment component 50 is used to adjust the angle between the heat dissipation semicircular plate 24 and the heat dissipation frame 21. The angle of the heat dissipation semicircular plate 24 is changed by the adjustment component 50, thereby adjusting the air intake volume, and then quickly cooling the electronic components with higher temperatures to avoid damage to the electronic components.

[0061] Further as Figure 5 and Figure 6 As shown, it is worth noting that the reset member 48 is made of rubber material;

[0062] Connecting ear 1 481, which is disposed on the side of the heat dissipation frame 21 close to the rotation axis of the heat dissipation semicircular plate 1 23. Connecting ear 2 482 is fixedly connected to magnetic block 1 42. One end of the reset member 48 is fixedly connected to connecting ear 1 481 and the other end is fixedly connected to connecting ear 2 482. The reset member 48 is disposed parallel to the rotating rod 41.

[0063] It should be noted that when the switch assembly 40 releases the restriction on the rotating rod 41, the wind force generated by the heat dissipation fan 30 can blow open the heat dissipation semicircular plate 23. At this time, the reset member 48 made of rubber generates elastic potential energy, but compared with the wind force, the elastic potential energy is far from enough to drive the heat dissipation semicircular plate 23 to return to its initial position. When the heat dissipation fan 30 stops operating, the elastic potential energy of the reset member 48 is converted into kinetic energy, and the reset member 48 restores the heat dissipation semicircular plate 23 to its initial position.

[0064] According to the above embodiment, this solution also has embodiment 2:

[0065] The adjustment component 50 includes:

[0066] Gear assembly 51, the gear assembly 51 is used to rotate the heat dissipation semicircular plate 24;

[0067] a bending assembly 52, wherein the bending assembly 52 is used to provide kinetic energy to the gear assembly 51;

[0068] a heat transfer component 53, the heat transfer component 53 being used to provide heat energy to the bending component 52;

[0069] A fine-tuning component 54, which is used to control the heat transfer efficiency of the heat transfer component 53;

[0070] It should be noted that when the load is working, the electronic heating element on the circuit board 12 starts to heat up, and the heat will reach the bending component 52 through the heat transfer component 53. The bending component 52 cooperates with the gear component 51 to drive the heat dissipation semicircular plate 2 24 to expand. The user can also control the heat transfer efficiency of the heat transfer component 53 through the fine-tuning component 54, and then control the opening angle of the heat dissipation semicircular plate 2 24 to be different at the same temperature of the electronic component.

[0071] Further as Figure 7 、 Figure 8 、 Figure 9 and Figure 10 As shown, it is worth noting that the bending component 52 includes:

[0072] A fixing plate 521 is fixedly connected to the outer wall of the air inlet duct of the heat dissipation frame 21. A bimetallic plate 522 is fixedly connected to the fixing plate 521. The bimetallic plate 522 is made of two metal materials with different expansion coefficients. A circular groove ring 523 is fixedly connected to the top of the bimetallic plate 522.

[0073] It should be noted that by fixing one end of the bimetallic plate 522 on the fixed plate 521, when the heat transfer component 53 heats the bimetallic plate 522, since the bimetallic plate 522 itself is made of two materials with different expansion coefficients, the metal with a larger expansion coefficient avoids the expansion of the other metal more, resulting in uneven internal stress in the bimetallic plate 522, thereby bending, and then driving the heat dissipation semicircular plate 2 24 to open to a certain angle according to the temperature and in cooperation with the gear component 51.

[0074] Further as Figure 8 As shown, it is worth noting that the gear assembly 51 includes:

[0075] The gear seat 511 is fixedly connected to the outer wall of the air inlet duct of the heat dissipation frame 21;

[0076] A small gear 512 is fixedly connected to the end of the rotating shaft of the heat dissipation semicircular plate 24. The small gear 512 is rotatably connected to the gear seat 511. A large gear 513 is meshed with one side of the small gear 512. The large gear 513 is rotatably connected to the gear seat 511. A round rod 514 is fixedly connected to the large gear 513 and is disposed within the circular groove ring 523.

[0077] It should be noted that since the round rod 514 is inside the circular groove ring 523, when the bimetallic plate 522 is bent by heat, it will drive the circular groove ring 523 on the top to deflect. The circular groove ring 523 drives the round rod 514 to drive the large gear 513 to rotate, and the large gear 513 drives the small gear 512 meshing with it to rotate. The small gear 512 drives the heat dissipation semicircular plate 24 to deflect. By driving the small gear 512 to rotate by the large gear 513, the rotation stroke can be increased.

[0078] Further as Figure 8 As shown, it is worth noting that the heat transfer component 53 includes:

[0079] A connecting frame 531 is provided on the circuit board 12 and sleeved over the heat-generating electronic component. A connecting portion 532 is provided within the connecting frame 531. The connecting portion 532 is made of a material with good heat transfer performance. The end of the connecting portion 532 is fixedly connected to the bottom end of the bimetallic plate 522. The connecting frame 531 is made of a heat-insulating material.

[0080] It should be noted that by setting the connecting frame 531 on the heat-generating electronic component on the circuit board 12, part of the heat generated by the heat-generating electronic component is exchanged with the air through the heat sink 22 and the heat dissipation fan 30, and the other part is conducted to the bimetallic plate 522 through the connecting portion 532, thereby heating the bimetallic plate 522. By making the connecting frame 531 of heat-insulating material, the connecting portion 532 can be prevented from losing heat during the heat conduction process.

[0081] Further as Figure 8 and Figure 9 As shown, it is worth noting that the fine-tuning component 54 includes:

[0082] A thermal insulation tube 541 extends through the circuit board 12 and is fixedly connected to the inner wall of the module housing 11. A circular tube 542 is fixedly connected to the bottom of the fixing plate 521. The circular tube 542 is provided with a plurality of heat dissipation holes 543 in an array. A thermal insulation member 544 is provided between the circular tube 542 and the thermal insulation tube 541. The thermal insulation member 544 is slidably connected to the thermal insulation tube 541.

[0083] It should be noted that when the module load meter is replaced for measurement according to actual conditions, some module loads have internal heating electronic heating elements that can withstand higher loads and higher temperatures, so the heat insulation member 544 can be moved along the heat insulation tube 541 and gradually leak out of the heat dissipation holes 543 on the circular tube 542;

[0084] It is worth noting that when more heat dissipation holes 543 are exposed, the connection portion 532 will lose more heat in this section, so that the amount of heat from the heat-generating electronic components to the bimetallic plate 522 will be reduced, thereby reducing the degree of offset of the bimetallic plate 522, and finally making the opening angle of the heat dissipating semicircular plate 24 smaller, reducing the ventilation volume. When multiple loads are working at the same time, this method of adjustment can be used to better dissipate heat from heat-generating electronic components with poor heat resistance.

[0085] Further as Figure 9 As shown, it is worth mentioning that a sliding button 61 is slidably connected to the outer wall of the module shell 11, and a connecting member 62 is fixedly connected between the sliding button 61 and the thermal insulation member 544. The user can adjust the position of the thermal insulation member 544 on the thermal insulation tube 541 by sliding the sliding button 61 with his fingers.

[0086] Further as Figure 10 As shown, it is worth mentioning that the connecting portion 532 is made of aluminum, aluminum-magnesium-silicon alloy or thermally conductive silicone. The connecting portion 532 made of aluminum has excellent thermal conductivity, is lightweight and has low cost, and is suitable for most heat dissipation applications. The aluminum-magnesium-silicon alloy maintains the good thermal conductivity of aluminum while enhancing the strength and corrosion resistance, and is suitable for heat dissipation components that require higher strength. The connecting portion 532 made of thermally conductive silicone is used for heat conduction between electronic components, has moderate thermal conductivity, and is easy to install.

[0087] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0088] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, all of which fall within the scope of protection of the present invention.

Claims

1. An electronic load meter that can be used to test a fast charger, comprising: An outer shell (10), wherein a plurality of module shells (11) are arranged in the outer shell (10); A circuit board (12), the circuit board (12) being arranged in the module housing (11), and the circuit board (12) being provided with electronic components for testing the charger; Its characteristics are: A heat dissipation portion (20), the heat dissipation portion (20) comprising: A heat dissipation frame (21), the heat dissipation frame (21) is rectangular, a heat dissipation fin (22) is arranged in an array inside the heat dissipation frame (21), both ends of the heat dissipation frame (21) are open ends, a heat dissipation semicircular plate 1 (23) and a heat dissipation semicircular plate 2 (24) are arranged at one end of the heat dissipation frame (21), and the heat dissipation semicircular plate 1 (23) and the heat dissipation semicircular plate 2 (24) are rotatably connected to the heat dissipation frame (21); A heat dissipation fan (30), the heat dissipation fan (30) is arranged on the outer shell (10), a main heat dissipation pipe (31) is connected to one side of the heat dissipation fan (30), a plurality of auxiliary heat dissipation pipes (32) are arranged in an array on the main heat dissipation pipe (31), and the auxiliary heat dissipation pipes (32) are connected to the heat dissipation frame (21); A switch assembly (40), the switch assembly (40) being arranged in the module housing (11), the switch assembly (40) comprising: A rotating rod (41), the rotating rod (41) is fixedly connected to a heat dissipation semicircular plate (23), the heat dissipation frame (21) is located at one end of the rotating rod (41) and is provided with a reset member (48), the end of the rotating rod (41) is fixedly connected to a magnetic block (42), the circuit board (12) is located on one side of the rotating rod (41) and is provided with a circuit frame (43), a fixing member (44) is provided in the middle of the circuit frame (43), the inner wall of the fixing member (44) is fixedly connected to a magnetic block (45), the magnetic block (42) and the magnetic block (45) are magnetically connected, an elastic member (46) is provided on the outside of the fixing member (44), a spring member (47) is provided at one end of the fixing member (44), the spring member (47) is made of memory metal material, one end of the spring member (47) is fixedly connected to the fixing member (44) and the other end is fixedly connected to the circuit frame (43); An adjusting component (50) is provided in the module housing (11), and the adjusting component (50) is used to adjust the angle between the second heat dissipation semicircular plate (24) and the heat dissipation frame (21).

2. The electronic load meter for testing a fast charger according to claim 1, characterized in that: The reset member (48) is made of rubber material; A connecting ear (481) is provided on the side of the heat dissipation frame (21) close to the rotating shaft of the heat dissipation semicircular plate (23); a connecting ear (482) is fixedly connected to the magnetic block (42); one end of the reset member (48) is fixedly connected to the connecting ear (481) and the other end is fixedly connected to the connecting ear (482); the reset member (48) is provided in parallel with the rotating rod (41).

3. The electronic load meter for testing a fast charger according to claim 1, characterized in that: The adjustment assembly (50) comprises: A gear assembly (51), wherein the gear assembly (51) is used to rotate the second heat dissipation semicircular plate (24); a bending assembly (52), wherein the bending assembly (52) is used to provide kinetic energy to the gear assembly (51); a heat transfer component (53), the heat transfer component (53) being used to provide heat energy to the bending component (52); A fine-tuning component (54) is used to control the heat transfer efficiency of the heat transfer component (53).

4. The electronic load meter for testing a fast charger according to claim 3, characterized in that: The bending assembly (52) includes: A fixing plate (521) is fixedly connected to the outer wall of the air inlet duct of the heat dissipation frame (21); a bimetallic plate (522) is fixedly connected to the fixing plate (521); the bimetallic plate (522) is made of two metal materials with different expansion coefficients; a circular groove ring (523) is fixedly connected to the top of the bimetallic plate (522).

5. The electronic load meter for testing a fast charger according to claim 4, characterized in that: The gear assembly (51) comprises: A gear seat (511), wherein the gear seat (511) is fixedly connected to the outer wall of the air inlet duct of the heat dissipation frame (21); A small gear (512) is fixedly connected to the end of the rotating shaft of the second heat dissipation semicircular plate (24). The small gear (512) is rotatably connected to the gear seat (511). A large gear (513) is meshed on one side of the small gear (512). The large gear (513) is rotatably connected to the gear seat (511). A round rod (514) is fixedly connected to the large gear (513). The round rod (514) is arranged in the circular groove ring (523).

6. The electronic load meter for testing a fast charger according to claim 4, characterized in that: The heat transfer component (53) comprises: A connecting frame (531) is provided on a circuit board (12), and the connecting frame (531) is sleeved on a heat-generating electronic component. A connecting portion (532) is provided in the connecting frame (531), and the connecting portion (532) is made of a material with good heat transfer performance. The end of the connecting portion (532) is fixedly connected to the bottom end of the bimetallic plate (522), and the connecting frame (531) is made of a heat-insulating material.

7. The electronic load meter for testing a fast charger according to claim 6, characterized in that: The fine-tuning component (54) includes: A heat-insulating tube (541) is provided, wherein the heat-insulating tube (541) passes through the circuit board (12) and is fixedly connected to the inner wall of the module housing (11); a circular tube (542) is fixedly connected to the bottom of the fixing plate (521); a plurality of heat dissipation holes (543) are arranged in an array on the circular tube (542); a heat-insulating member (544) is provided between the circular tube (542) and the heat-insulating tube (541); and the heat-insulating member (544) is slidably connected to the heat-insulating tube (541).

8. The electronic load meter for testing a fast charger according to claim 7, characterized in that: A sliding button (61) is slidably connected to the outer wall of the module housing (11), and a connecting piece (62) is fixedly connected between the sliding button (61) and the heat insulating piece (544).

9. The electronic load meter for testing a fast charger according to claim 6, characterized in that: The connecting portion (532) is made of aluminum, aluminum-magnesium-silicon alloy, or thermally conductive silicone.

Images