Waste circuit board recovery device

Abstract

The invention discloses a waste circuit board recycling device, and relates to the technical field of circuit board recycling, the waste circuit board recycling device comprises a treatment box, the side wall of the treatment box is fixedly connected with a shell, the side wall of the treatment box is provided with an electric control door, the inner wall of the treatment box is rotatably connected with a rotating shaft, the surface of the rotating shaft is fixedly connected with a mounting assembly, and the mounting assembly comprises a fixed part and a sliding part; the fixing part is detachably connected with the sliding part, the fixing part is provided with a heating spray head and two sets of quick spray heads, the surface of the shell is provided with a pressing switch for controlling the electric control door, the recovery device further comprises a solder paste removing part, a dynamic air control part and a matching part, and the solder paste removing part is arranged in the shell so that the mounting assembly can rotate; the temperature rising nozzle and the two sets of quick nozzles continuously generate hot air flow when the mounting assembly rotates through the dynamic air control component, and the solder paste removing device has the effect of optimizing the solder paste removing procedure through mutual cooperation of the structures.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board recycling, in particular to a waste circuit board recycling device. Background Art

[0002] Circuit boards make circuits miniaturized and intuitive, playing an important role in the mass production of fixed circuits and optimizing the layout of electrical appliances. They are the core of all electronic devices. Solder paste, also known as tin paste, is a paste-like mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components on circuit boards.

[0003] With the rapid development of the electronic information industry, the number of discarded printed circuit boards is increasing. Due to the wide integration of circuit boards, they have very high recycling value, including the recycling of metal copper and the regeneration of circuit boards. However, traditional circuit board recycling devices mostly directly crush the circuit boards, leaving a large amount of solder remaining on them. If they are directly crushed, the subsequent removal of the solder is more difficult, which affects the subsequent resource recycling process. Most of the existing measures also manually heat the solder on the circuit boards to separate the solder to recycle the circuit boards. This separation method is not only difficult but also inefficient. Therefore, the existing waste circuit board recycling devices are still insufficient in the process of removing solder paste, and there is still room for improvement in improving the removal rate and removal quality of solder paste. Summary of the Invention

[0004] The purpose of the present invention is to provide a waste circuit board recycling device, which has the effect of optimizing the solder paste removal process and solves the problems mentioned in the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a waste circuit board recycling device, comprising a processing box, a shell fixedly connected to the side wall of the processing box, an electric-controlled door provided on the side wall of the processing box, a rotating shaft rotatably connected to the inner wall of the processing box, a mounting assembly fixedly connected to the surface of the rotating shaft, the mounting assembly comprising a fixed portion and a sliding portion, the fixed portion and the sliding portion being detachably connected, a heating nozzle and two groups of fast nozzles being provided on the fixed portion, and a push switch for controlling the electric-controlled door being provided on the surface of the shell;

[0006] The recovery device also includes a solder paste cleaning component, a dynamic air control component and a matching component. The solder paste cleaning component is arranged in the shell to make the installation component rotate, and has the characteristics of first accelerating and then rapidly decelerating on the rotation path. The dynamic air control component can continuously generate hot air flow through the heating nozzle and the two groups of fast nozzles when the installation component rotates, and synchronously stop exhausting when the installation component accelerates. When the installation component decelerates, the two groups of fast nozzles quickly eject gas. The matching component can only be pressed after the installation component rotates two circles.

[0007] Optionally, the solder paste removal component includes a main shaft, the shaft arm of the main shaft is fixedly connected to the broken gear 1, the shaft arm of the rotating shaft is fixedly connected to the broken gear 2, the broken gear 1 is meshed with the teeth of the broken gear 2, the shaft arm of the main shaft is fixedly connected to the incomplete gear 1, the shaft arm of the rotating shaft is fixedly connected to the incomplete gear 2, the side walls of the incomplete gear 1 and the incomplete gear 2 are fixedly connected to a tooth head rod, and the end of the main shaft is rotatably connected to the side wall of the processing box.

[0008] The air filter press has a first end in contact with the air filter, and the second end in contact with the second air filter press has a first end in contact with the first air filter press, and a second end in contact with the second air filter press has a second end in contact with the second air filter press.

[0009] Optionally, the dynamic air control component includes a fan-shaped gear, which is fixedly connected to the shaft arm of the main shaft, and the inner wall of the shell is fixedly connected to a support block, and the support block and the opposite side of the shell are jointly fixedly connected with two limit rods, and the rod arms of the two limit rods are jointly slidably connected to a moving frame, and the rod arms of the two limit rods are both provided with auxiliary springs, and the ends of the two auxiliary springs are respectively connected to the surface of the moving frame and the inner wall of the shell, and teeth are provided on the lower side of the inner wall of the moving frame, and are meshed with the fan-shaped gear through these teeth, and the side of the moving frame close to the support block is fixedly connected to a push cylinder 1, and the inner wall of the push cylinder 1 is slidably connected to a push cylinder 2, and the push cylinder 2 is connected to the opposite side of the push cylinder 1 by an extrusion spring.

[0010] The top surface of the housing is provided with two through-holes, and the inner wall of the push switch is provided with an electric control component. The inner wall of the push switch is provided with two through-holes. The inner wall of the push switch is provided with a rod, and the rod is rotatably connected to the inner wall of the support block. The end of the rod is fixedly connected to the rotating plate, and the top surface of the rotating plate is provided with a blocking block corresponding to the two through-holes respectively. The lever arm of the rod is provided with a return spring, and the two ends of the return spring are respectively engaged with the push switch and the inner wall of the support block. The end of the rod is fixedly connected to the one-way ratchet to cooperate with the one-way tooth plate, and the one-way ratchet rotates 90° when the one-way tooth plate is reset once.

[0011] Optionally, a conveying device is provided on the side of the processing box, and the conveying device is specifically a moving belt.

[0012] Optionally, a collection box is provided at the bottom of the processing box, and the size of the collection box is adapted to the size of the installation assembly.

[0013] Optionally, a motor is fixedly connected to the inner wall of the shell, and an output end of the motor is fixedly connected to the end of the main shaft.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] First, the present invention uses the cooperation of the incomplete gear 1, the incomplete gear 2, and the incomplete gear 1 to make the waste circuit board rotate one circle around the rotating shaft. During the rotation, when it deflects to the direction of about 12 o'clock, it begins to accelerate, quickly deflects to the direction of about 9 o'clock, then begins to deflect slowly, and finally performs a uniform deflection and returns to the original position. In this way, the waste circuit board generates a large downward impact force, and the tin material on its surface is impacted and falls into the collection box, thereby completing the work of removing the tin material from the surface of the waste circuit board. Compared with traditional methods, this impact method is more efficient, faster, and more effective than some existing impact methods.

[0016] At the same time, by adopting this method, after the waste circuit board is subjected to a rapid impact, it will also undergo a slower displacement. This process can give the solder paste sufficient time to fall, preventing the solder paste from falling into areas other than the collection box.

[0017] Second, the present invention uses the coordination of the connecting air pipe, the one-way pipe and the slide plate to enable the two sets of fast nozzles to eject gas with a faster flow rate during the slow deflection process after the impact of the waste circuit boards, so as to blow off the residual and stubborn parts that are only shaken but not completely dropped after the impact, thereby improving the removal quality of solder paste;

[0018] At the same time, this process corresponds to the slower deflection of the circuit board, which is logically reasonable and has a better removal effect.

[0019] 3. The present invention uses the coordination of the rod, the push switch and the return spring to ensure that a waste circuit board can be removed after at least two impact operations. On the one hand, the quality of solder paste removal is guaranteed, and on the other hand, it can prevent the operator from accidentally pressing the push switch and opening the electric control door before completing the prescribed removal process. After the removal is completed, the waste circuit board is removed and placed on the moving belt for transfer to the subsequent recycling station. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is an axonometric drawing of the present invention;

[0021] Figure 2 is a top cross-sectional view of the present invention;

[0022] Figure 3 A diagram showing the motion principle of the fixed portion and the sliding portion of the present invention from a right perspective;

[0023] Figure 4 It is a schematic diagram of the position of the internal structure of the housing of the present invention;

[0024] Figure 5 This is a schematic diagram of the cooperation between the heating nozzle and the fast nozzle in a top view of the present invention;

[0025] Figure 6 Schematic diagram of the connection between the sector gear and the moving frame of the present invention;

[0026] Figure 7 Schematic diagram of the cooperation between the residual gear 1 and the residual gear 2 of the present invention;

[0027] Figure 8 This is a diagram showing the connection between the push cylinder 1 and the push cylinder 2 of the present invention;

[0028] Figure 9 This is a schematic diagram of the connection principle of hot gas from one-way pipe 1 to the connecting gas pipe of the present invention;

[0029] Figure 10 It is a planar cross-sectional view of the internal structure of the support block of the present invention.

[0030] In the figure: 1. Processing box; 2. Housing; 3. Electric control door; 4. Rotating shaft; 5. Mounting assembly; 6. Heating nozzle; 7. Quick nozzle; 8. Press switch; 9. Spindle; 10. Incomplete gear 1; 11. Incomplete gear 2; 12. Incomplete gear 1; 13. Incomplete gear 2; 14. Gear head rod; 15. Connector; 16. Connecting air pipe; 17. Air pump; 18. Transmission air pipe; 19. Air box; 20. One-way pipe 1; 21. One-way Tube 2; 22. Slide plate; 23. Adaptive spring; 24. Fan gear; 25. Support block; 26. Limit rod; 27. Moving frame; 28. Push cylinder 1; 29. ​​Push cylinder 2; 30. Extrusion spring; 31. One-way tooth plate; 32. Rod; 33. Turn plate; 34. Return spring; 35. One-way ratchet; 36. Moving belt; 37. Collection box; 38. Motor; 39. Auxiliary spring; 501. Fixed part; 502. Sliding part. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] Example 1:

[0033] See also Figures 1 to 10 The present invention provides a waste circuit board recycling device, comprising a processing box 1, the side wall of the processing box 1 is fixedly connected to the shell 2, the side wall of the processing box 1 is provided with an electric control door 3, the inner wall of the processing box 1 is rotatably connected to the rotating shaft 4, and the surface of the rotating shaft 4 is fixedly connected to the mounting assembly 5, the mounting assembly 5 includes a fixing portion 501 and a sliding portion 502, the fixing portion 501 and the sliding portion 502 are detachably connected, and a heating nozzle 6 and two sets of quick nozzles 7 are provided on the fixing portion 501. A pressing switch 8 for controlling the electric control door 3 is provided on the surface of the shell 2. The electric control door 3 is opened by pressing the switch 8, and then the sliding portion 502 on the mounting assembly 5 is pulled out, and the connection mode of the sliding portion 502 and the fixing portion 501 can be a block connection. Then, the waste circuit board is fixedly placed on the sliding portion 502. This process can be easily achieved by existing technical means, and the specific method of fixing is not repeated here. Then the sliding portion 502 is pushed back into the device to make it close to the rotating shaft 4, and the electric control door 3 is closed by pressing the switch 8.

[0034] The recovery device further includes a solder paste removal component, a dynamic air control component and a matching component, and the solder paste removal component is arranged in the housing 2;

[0035] The solder paste removal component includes a main shaft 9, the shaft arm of the main shaft 9 is fixedly connected to a residual gear 10, the shaft arm of the rotating shaft 4 is fixedly connected to a residual gear 2 11, the residual gear 10 is meshed with the teeth of the residual gear 2 11, the shaft arm of the main shaft 9 is fixedly connected to an incomplete gear 12, the shaft arm of the rotating shaft 4 is fixedly connected to an incomplete gear 2 13, the side walls of the incomplete gear 12 and the incomplete gear 2 13 are fixedly connected to a tooth head rod 14, the end of the main shaft 9 is rotatably connected to the side wall of the processing box 1, the inner wall of the outer shell 2 is fixedly connected to a motor 38, and the output end of the motor 38 is fixedly connected to the end of the main shaft 9.

[0036] More specifically, in this embodiment, after the waste circuit board is placed in the device, that is, on the mounting assembly 5, the motor 38 can be started to rotate the spindle 9. Figure 6 Take the direction shown as an example, combined with Figure 3 、 Figure 6 and Figure 7 , through the rotation of the main shaft 9, the incomplete gear 1 10 can be made to rotate clockwise, and then the transmission of the incomplete gear 1 10 and the incomplete gear 2 11 can be used to make the rotating shaft 4 rotate counterclockwise, so that the mounting assembly 5 can be deflected smoothly in the counterclockwise direction with the rotating shaft 4 as the axis. When the mounting assembly 5 is deflected smoothly from the initial horizontal state to the vertical state, the teeth of the incomplete gear 10 and the teeth of the incomplete gear 2 11 are disengaged, and at the same time, the tooth head rod 14 on the incomplete gear 12 is engaged with the teeth of the incomplete gear 2 13. In the subsequent rotation process of the main shaft 9, the incomplete gear 2 13 will be driven to rotate through the tooth head rod 14, and then the rotating shaft 4 will continue to rotate. At this time, the rotation shaft 4 and the main shaft 9 are in a state of tension. The transmission ratio changes, and the shaft 4 will deflect at a faster speed. This process is the process of the installation component 5 deflecting again from the vertical direction state to the horizontal direction state. Subsequently, when the tooth head rod 14 disengages from the teeth of the incomplete gear 2 13, the tooth head rod 14 on the incomplete gear 2 13 meshes with the teeth on the incomplete gear 1 12, thereby completing the continued deflection process of the shaft 4. Since the transmission ratio between the two changes again in this process, the shaft 4 will deflect at a slower speed. Until the two are disengaged, the residual gear 1 10 and the residual gear 2 11 are meshed again, driving the shaft 4 to rotate at a uniform speed. A collection box 37 is provided at the bottom of the processing box 1, and the size of the collection box 37 is adapted to the size of the installation component 5;

[0037] In this way, the waste circuit board can be rotated around the shaft 4 as the axis through the transmission of the shaft 4 and the installation component 5. Figure 6The direction shown is the positive direction. When it deflects to the direction of about 12 o'clock, it begins to accelerate, quickly deflects to the direction of about 9 o'clock, then begins to deflect slowly, and finally performs a process of uniform deflection and returning to the original position. In this way, the waste circuit board generates a large downward impact force, and the tin material on its surface is impacted and falls into the collection box 37, thereby completing the tin material removal work on the surface of the waste circuit board. Compared with traditional methods, this impact method is more efficient and faster than some existing impact methods. With this method, after the waste circuit board is subjected to a rapid impact, it will also undergo a slower displacement. This process can give the solder paste sufficient time to fall, and prevent the solder paste from falling into areas other than the collection box 37;

[0038] It is worth noting that during the impact removal process, the dynamic air control component operates synchronously to generate a hot air flow through the heating nozzle 6, making it easier for the tin material to be impact removed.

[0039] Example 2, based on the above example:

[0040] See also Figure 3-Figure 6 、 Figure 8 and Figure 9 The dynamic air control component includes a connector 15, the heating nozzle 6 is connected to the inner wall of the rotating shaft 4, and the two groups of quick nozzles 7 are fixedly connected with a connecting air pipe 16. The connecting air pipe 16 extends into the rotating shaft 4 and passes through the end of the rotating shaft 4. A cavity 1 connected to the rotating shaft 4 and a cavity 2 connected to the connecting air pipe 16 are provided in the connector 15. The connector 15 is rotatably connected to the rotating shaft 4 and the end of the connecting air pipe 16. The inner wall of the shell 2 is fixedly connected to an air pump 17, and the output end of the air pump 17 is fixedly connected to a transmission air pipe 18. The end of the transmission air pipe 18 is fixedly connected to a cavity 1 on the connector. The inner wall of the shell 2 is fixedly connected to an air box 19. The inner wall of the air box 19 is fixedly connected to a one-way pipe 1 20 and a one-way pipe 2 21. One-way pipe 1 20 is fixedly connected to the transmission air pipe 18, the one-way pipe 21 extends into the transmission air pipe 18 and is fixedly connected to the second cavity on the connector, the inner wall of the air box 19 is slidably connected with a slide plate 22, and the slide plate 22 and the opposite side of the air box 19 are fixedly connected with an adaptive spring 23. During the operation of the device, the air pump 17 works synchronously to generate a hot air flow, which passes through the inner wall of the rotating shaft 4 from the transmission air pipe 18 and is ejected from the heating nozzle 6. At the same time, it will also flow into the air box 19 through the one-way pipe 1 20, and then flow out from the one-way pipe 2 21, and then be ejected from the two sets of fast nozzles 7 after passing through the connecting air pipe 16. That is, in the process of the waste circuit board being rotated, hot air will be blown out around it to soften the solder paste thereon so that it can be better removed later;

[0041] It also includes a sector gear 24, which is fixedly connected to the shaft arm of the main shaft 9. The inner wall of the outer shell 2 is fixedly connected to a support block 25. The support block 25 and the opposite side of the outer shell 2 are jointly fixedly connected to two limit rods 26. The rod arms of the two limit rods 26 are jointly slidably connected to a moving frame 27. The rod arms of the two limit rods 26 are both sleeved with auxiliary springs 39. The ends of the two auxiliary springs 39 are respectively connected to the surface of the moving frame 27 and the inner wall of the outer shell 2. The lower side of the inner wall of the moving frame 27 is provided with teeth, and is meshed with the sector gear 24 through these teeth. The side of the moving frame 27 close to the support block 25 is fixedly connected to a push cylinder 1 28, and the inner wall of the push cylinder 1 28 is slidably connected to a push cylinder 29. The push cylinder 29 and the opposite side of the push cylinder 1 28 are connected by an extrusion spring 30.

[0042] More specifically, in this embodiment, during the rotation of the main shaft 9, the sector gear 24 is synchronously driven to rotate. Figure 6 For example, when the waste circuit board is deflected to the 12 o'clock direction during the above process, the sector gear 24 synchronously drives the moving frame 27 to move, and during this process, the two auxiliary springs 39 are stretched, combined with Figure 4 , Then the push cylinder 29 squeezes the transmission air pipe 18 located on the surface of the support block 25, and squeezes this part of the area, which includes the transmission air pipe 18 and the one-way pipe 21 inside the transmission air pipe 18, so that the hot air cannot be transported. At this time, the hot air output by the air pump 17 will rush into the air box 19, squeezing the slide plate 22, so that the slide plate 22 compresses the adaptive spring 23. In this process, the waste circuit board is quickly impacted. After the impact of the waste circuit board is completed, it is slowly deflected. At this time, the teeth of the sector gear 24 are disengaged from the inner teeth of the moving frame 27, and under the left and right of the auxiliary spring 39, the moving frame 27 is moved. The movable frame 27 is quickly reset. At this time, the transmission air pipe 18 and the one-way tube 21 inside the transmission air pipe 18 are connected again. Since there is more gas in the air box 19 at this time, the adaptive spring 23 will be quickly reset when it is reconnected, and this part of the gas will be squeezed out from the one-way tube 21, so that the two groups of fast nozzles 7 will have a faster flow rate of gas. At this time, the remaining stubborn ones that are only shaken after the impact but not completely dropped can be blown off by the faster spraying, thereby improving the removal quality of the solder paste. At the same time, this process corresponds to the process of slower deflection of the circuit board, which is logically reasonable and has a better removal effect.

[0043] Example 3, based on the above example:

[0044] See also Figure 1 、 Figure 4 、 Figure 6 and Figure 10, the matching parts include: a one-way tooth plate 31, the one-way tooth plate 31 is fixedly connected to the side wall of the movable frame 27, the surface of the support block 25 is provided with an opening for the displacement of the one-way tooth plate 31, the push switch 8 is slidably connected to the housing 2 and the inner wall of the support block 25, the top surface of the housing 2 and the inner side surface of the push switch 8 are provided with electric control components, the inner wall of the push switch 8 is provided with two through holes, the inner wall of the push switch 8 is provided with a rod 32, the rod 32 is rotatably connected to the inner wall of the support block 25, and the end of the rod 32 It is fixedly connected with a rotating plate 33, and the top surface of the rotating plate 33 is provided with a card block corresponding to the two through holes respectively. The arm sleeve of the rod 32 is provided with a reset spring 34, and the two ends of the reset spring 34 are respectively in contact with the press switch 8 and the inner wall of the support block 25. The end of the rod 32 is fixedly connected with a one-way ratchet 35 to cooperate with the one-way tooth plate 31. When the one-way tooth plate 31 moves back to reset once, the one-way ratchet 35 rotates 90°. A conveying device is provided on the side of the processing box 1, and the conveying device is specifically a moving belt 36.

[0045] More specifically, in this embodiment: during the displacement of the moving frame 27, the one-way tooth plate 31 will extend into the supporting block 25, thereby pushing the one-way ratchet 35 to rotate 90°. When the moving frame 27 is reset, the one-way ratchet 35 will not rotate. The cooperation between the one-way ratchet 35 and the one-way tooth plate 31 is a prior art. In this embodiment, only this movement form is used, so the specific structural principle will not be repeated. The rotation of the one-way ratchet 35 will be driven by the rod 32 to cause the rotating plate 33 to rotate, thereby causing the two blocks on the rotating plate 33 to contact the upper portion of the press switch 8. The two through holes are misaligned, and the push switch 8 cannot be pressed down again, so that the electric control door 3 is opened. The one-way ratchet 35 needs to be driven to rotate again to align the block with the through hole again. In this way, a waste circuit board needs at least two impact operations before it can be taken out. This method can ensure the quality of solder paste removal on the one hand, and prevent the operator from accidentally touching the push switch 8 to open the electric control door 3 before completing the prescribed removal process. After the removal is completed, the waste circuit board is removed and placed on the moving belt 36 to be transferred to the subsequent recycling station.

[0046] Working principle: When the waste circuit board recycling device is used, the electric control door 3 is opened by pressing the switch 8, and then the sliding part 502 on the mounting assembly 5 is pulled out, and the waste circuit board is fixedly placed on the sliding part 502, and then the sliding part 502 is pushed back into the device so that it is close to the rotating shaft 4. The electric control door 3 is closed by pressing the switch 8, and then the motor 38 is started, so that the waste circuit board rotates one circle around the rotating shaft 4. During the rotation process, when it deflects to the direction of about 12 o'clock, it begins to accelerate, quickly deflects to the direction of about 9 o'clock, and then begins to deflect slowly, and finally performs a process of uniform deflection and returning to the original position. In this way, the waste circuit board generates a large downward impact force, and the tin material on its surface is impacted and falls into the collection box 37;

[0047] During the impact removal process, the push cylinder 29 squeezes the transmission air pipe 18 and the one-way tube 21 inside the transmission air pipe 18, preventing the hot air from being transported. At this time, the hot air output by the air pump 17 will rush into the air box 19. When the waste circuit board deflects slowly, the transmission air pipe 18 and the one-way tube 21 inside the transmission air pipe 18 are reconnected, so that the two sets of fast nozzles 7 will have a faster flow rate of gas. At this time, the faster spraying can blow off the residual and stubborn particles that are only shaken but not completely dropped after the impact, thereby improving the removal quality of the solder paste. At the same time, after the waste circuit board is impacted once, the push switch 8 cannot be pressed, and at least two impact operations are required before it can be removed. This method can not only ensure the removal quality of the solder paste, but also prevent the operator from accidentally pressing the push switch 8 and opening the electric control door 3 before completing the specified removal process. After the removal is completed, the waste circuit board is removed and placed on the moving belt 36 for transfer to the subsequent recycling station.

[0048] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A waste circuit board recycling device, comprising a processing box (1), characterized in that: The side wall of the processing box (1) is fixedly connected to the shell (2), the side wall of the processing box (1) is provided with an electric control door (3), the inner wall of the processing box (1) is rotatably connected to the rotating shaft (4), the surface of the rotating shaft (4) is fixedly connected to the mounting assembly (5), the mounting assembly (5) includes a fixed part (501) and a sliding part (502), the fixed part (501) and the sliding part (502) are detachably connected, the fixed part (501) is provided with a heating nozzle (6) and two groups of fast nozzles (7), and the surface of the shell (2) is provided with a push switch (8) for controlling the electric control door (3); The recovery device also includes: A solder paste removal component is disposed in the housing (2) to allow the mounting assembly (5) to rotate, with the characteristic of first accelerating and then rapidly decelerating on the rotation path; A dynamic air control component is configured so that when the mounting assembly (5) rotates, the heating nozzle (6) and the two sets of fast nozzles (7) continuously generate hot air flow, and when the mounting assembly (5) accelerates, the air discharge is synchronously stopped, and when the mounting assembly (5) decelerates, the two sets of fast nozzles (7) quickly discharge air; The mating parts are such that the push switch (8) can be pressed only after the mounting assembly (5) is rotated two turns.

2. The waste circuit board recycling device according to claim 1, characterized in that: The solder paste removal component includes: The main shaft (9) has an arm fixedly connected to a broken gear 1 (10), and the arm of the rotating shaft (4) has an arm fixedly connected to a broken gear 2 (11), and the teeth of the broken gear 1 (10) and the broken gear 2 (11) are meshed, the arm of the main shaft (9) has an arm fixedly connected to an incomplete gear 1 (12), and the arm of the rotating shaft (4) has an arm fixedly connected to an incomplete gear 2 (13), and the side walls of the incomplete gear 1 (12) and the incomplete gear 2 (13) are fixedly connected to a tooth head rod (14), and the end of the main shaft (9) is rotatably connected to the side wall of the processing box (1).

3. The waste circuit board recycling device according to claim 2, characterized in that: The dynamic gas control component includes: The connector (15) is connected to the inner wall of the rotating shaft (4), and the two groups of quick nozzles (7) are fixedly connected to a connecting air pipe (16). The connecting air pipe (16) extends into the rotating shaft (4) and passes through the end of the rotating shaft (4). The connector (15) is provided with a cavity 1 connected to the rotating shaft (4) and a cavity 2 connected to the connecting air pipe (16). The connector (15) is rotatably connected to the rotating shaft (4) and the end of the connecting air pipe (16). The inner wall of the housing (2) is fixedly connected to an air pump (17). The output end of the air pump (17) is fixedly connected to a transmission. An air transmission pipe (18), the end of the transmission air pipe (18) is fixedly connected to the cavity 1 on the connector, the inner wall of the housing (2) is fixedly connected to an air box (19), the inner wall of the air box (19) is fixedly connected to a one-way pipe 1 (20) and a one-way pipe 2 (21), the one-way pipe 1 (20) is fixedly connected to the transmission air pipe (18), the one-way pipe 2 (21) extends into the transmission air pipe (18) and is fixedly connected to the cavity 2 on the connector, the inner wall of the air box (19) is slidably connected to a slide plate (22), and the slide plate (22) and the opposite side of the air box (19) are fixedly connected to an adaptive spring (23).

4. The waste circuit board recycling device according to claim 3, characterized in that: The dynamic gas control component includes: A sector gear (24) is fixedly connected to the shaft arm of the main shaft (9), and a support block (25) is fixedly connected to the inner wall of the housing (2). The support block (25) and the opposite side of the housing (2) are fixedly connected to two limit rods (26). The rod arms of the two limit rods (26) are slidably connected to a moving frame (27). The rod arms of the two limit rods (26) are both sleeved with auxiliary springs (39). The end portions of the two auxiliary springs (39) are The movable frame (27) is connected to the surface of the movable frame (27) and the inner wall of the outer shell (2), and the lower side of the inner wall of the movable frame (27) is provided with teeth, and the teeth are engaged with the sector gear (24). The movable frame (27) is fixedly connected to a push cylinder 1 (28) on the side close to the support block (25), and the inner wall of the push cylinder 1 (28) is slidably connected to a push cylinder 2 (29), and the push cylinder 2 (29) is connected to the opposite side of the push cylinder 1 (28) through an extrusion spring (30).

5. The waste circuit board recycling device according to claim 4, characterized in that: The matching components include: A one-way tooth plate (31) is fixedly connected to the side wall of the movable frame (27); an opening for the displacement of the one-way tooth plate (31) is provided on the surface of the support block (25); the push switch (8) is slidably connected to the housing (2) and the inner wall of the support block (25); the top surface of the housing (2) and the inner side surface of the push switch (8) are both provided with electric control components; the inner wall of the push switch (8) is provided with two through holes; the inner wall of the push switch (8) is provided with a rod (32); the rod (32) is connected to the support block (25) ) is rotatably connected to the inner wall of the support block (25), the end of the rod (32) is fixedly connected to a rotating plate (33), the top surface of the rotating plate (33) is provided with a block corresponding to the two through holes, the arm sleeve of the rod (32) is provided with a reset spring (34), the two ends of the reset spring (34) are respectively fitted with the push switch (8) and the inner wall of the support block (25), the end of the rod (32) is fixedly connected to a one-way ratchet (35) to cooperate with the one-way tooth plate (31), and when the one-way tooth plate (31) moves back to the reset position once, the one-way ratchet (35) rotates 90°.

6. The waste circuit board recycling device according to claim 5, characterized in that: A conveying device is provided on the side of the processing box (1), and the conveying device is specifically a moving belt (36).

7. The waste circuit board recycling device according to claim 6, characterized in that: A collecting box (37) is provided at the bottom of the processing box (1), and the size of the collecting box (37) is adapted to the size of the mounting assembly (5).

8. The waste circuit board recycling device according to any one of claims 2 to 7, characterized in that: A motor (38) is fixedly connected to the inner wall of the housing (2), and an output end of the motor (38) is fixedly connected to the end of the main shaft (9).

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