A heat exchange assembly of a flooded-type water chiller

Abstract

The application relates to the technical field of heat exchangers, in particular to a full-liquid type water chiller heat exchange assembly, which comprises a condenser and an evaporator, a supercooling assembly is arranged below the condenser, the supercooling assembly is located in the lower half of the condenser and is used for cooling refrigerant in the condenser. By adopting the supercooling assembly, the refrigeration function of a semiconductor refrigeration sheet is utilized, the temperature is conducted to the refrigerant through a heat-conducting semicircular sheet, the temperature of the refrigerant is lowered, the supercooling degree is improved, meanwhile, the piece-type heat-conducting sheet is matched, the contact between the heat-conducting sheet and the refrigerant is increased, the falling refrigerant is contained, and the refrigerant is cooled in a concentrated manner.

Description

TECHNICAL FIELD

[0001] The present application relates to heat exchanger technology field, specifically relates to a kind of full liquid type water chiller heat exchange subassembly. BACKGROUND

[0002] Full liquid type water chiller is a refrigeration equipment, in the process of working, refrigerant is condensed in condenser, from condenser into evaporator, utilize refrigerant to absorb the temperature of water in heat exchange pipe, refrigerant changes from liquid to gas, utilize the process of gasification heat absorption to absorb a large amount of heat, and the speed of refrigerant condensation in condenser and the temperature of refrigerant after condensation will influence the heat absorption effect in evaporator. SUMMARY

[0003] In view of the above-mentioned shortcomings of the prior art, the present application provides a kind of full liquid type water chiller heat exchange subassembly, can effectively solve the problem of how to optimize the condensation process of prior art.

[0004] To achieve the above object, the present application is realized by the following technical scheme:

[0005] The present application provides a kind of full liquid type water chiller heat exchange subassembly, including condenser, evaporator, condenser lower installation has supercooling component, the supercooling component is in the lower half of condenser, for cooling refrigerant in condenser;

[0006] The supercooling component includes heat-conducting semicircular sheet embedded and fixedly installed in the inside of condenser, the outer side of the heat-conducting semicircular sheet is fixedly installed with a plurality of semiconductor refrigeration sheets, the outer side of the semiconductor refrigeration sheet is fixedly installed with a plurality of cooling fins, and the inner diameter wall of the heat-conducting semicircular sheet is fixedly installed with a plurality of heat-conducting sheets.

[0007] Further, a plurality of condensing heat exchange pipes are installed in the condenser, cold water flows through the condensing heat exchange pipes to cool the refrigerant, and the heat-conducting sheets are provided with holes and are sleeved on the condensing heat exchange pipes.

[0008] Further, the heat-conducting sheet includes a heat-conducting semicircular ring fixedly installed on the inner wall of the heat-conducting semicircular sheet, the two sides of the heat-conducting semicircular ring are fixedly connected with connecting sheets, and the connecting sheets are provided with groove positions for the condensing heat exchange pipes to pass through.

[0009] Further, the condensing heat exchange pipes include straight pipes and curved pipes, the heat-conducting semicircular ring is located directly below the center of curvature of the straight pipes, and the combination of the straight pipes and the curved pipes is distributed in the upper half of the condenser.

[0010] Further, the lower part of each flat tube is provided with a flow receiving pipe, a plurality of the flow receiving pipes are fixedly connected through a connecting frame, a flow passing pipe is fixedly connected in the center of the flow receiving pipe, a flow guide column is fixedly connected in the flow passing pipe, the flow guide column is in contact with the flat tube, and the flow passing pipe is directly above the heat conducting half circular ring.

[0011] Further, the top of the heat dissipation fin is fixedly provided with a liquid dropping pipe, and a water pipe is communicated with the liquid dropping pipe.

[0012] Further, the bottom of the condenser is provided with two liquid outlet pipes, two groups of two groups of liquid blocking plates are fixedly installed in the condenser, the two liquid blocking plates are distributed on the two sides of the liquid outlet pipes, a containing groove is formed in the liquid blocking plate, an electric push rod is fixedly installed in the containing groove, and a siphon pipe is fixedly connected to the top of the electric push rod.

[0013] Further, one side of the liquid blocking plate is fixedly connected with a temperature sensor for detecting the temperature of the refrigerant.

[0014] Further, the two side edges of the containing groove are fixedly connected with fixed baffles, and the bottom of the siphon pipe is fixedly connected with a movable baffle.

[0015] Compared with the known prior art, the technical scheme provided by the present application has the following beneficial effects:

[0016] 1. By adopting the supercooling assembly, using the refrigeration function of the semiconductor refrigeration fin, the temperature is conducted to the refrigerant through the heat conducting half circular fin, which helps to reduce the temperature of the refrigerant and improve the supercooling degree, and the split type heat conducting fin helps to increase the contact with the refrigerant and accommodate the falling refrigerant to cool the refrigerant more concentratedly.

[0017] 2. By adopting the liquid blocking plate in the supercooling assembly, the flow of the refrigerant is limited to ensure the cooling time of the refrigerant, and the movable siphon pipe is adopted to quickly guide out the refrigerant when the temperature of the refrigerant reaches the standard, which is convenient for guiding out the refrigerant. DETAILED DESCRIPTION

[0018] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any creative labor.

[0019] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0020] Figure 2 It is a schematic diagram of the internal structure of the condenser of the present application;

[0021] Figure 3 It is the schematic diagram of the condensing heat conducting pipe arrangement in the condenser of the present application;

[0022] Figure 4 It is the schematic diagram of the condensing heat exchanging pipe of the present application;

[0023] Figure 5 It is the schematic diagram of the heat conducting sheet separation of the present application;

[0024] Figure 6 It is the schematic diagram of the structure separation of the liquid blocking plate of the present application.

[0025] The reference numbers in the figure respectively represent: 1, condenser; 2, drip pipe; 3, water pipe; 4, supercooling component; 401, semiconductor refrigeration sheet; 402, heat conducting half-round sheet; 403, heat conducting sheet; 4031, heat conducting half-round ring; 4032, connecting sheet; 404, flow connection pipe; 405, flow pipe; 406, flow guide column; 407, liquid blocking plate; 408, fixed baffle; 409, temperature sensor; 410, electric push rod; 411, siphon pipe; 412, movable baffle; 413, containing groove; 414, heat dissipation sheet; 5, condensing heat exchanging pipe; 501, straight pipe; 502, curved pipe. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without making creative efforts fall within the protection scope of the present application.

[0027] The present application will be further described below in combination with the embodiments.

[0028] Embodiment: Refer to Figures 1-6 A flooded type cold water unit heat exchanging component, comprising a condenser 1, an evaporator, a flash drum, a compressor and an electric control cabinet, a supercooling component 4 is installed below the condenser 1, the supercooling component 4 is in the lower half of the condenser 1, used for cooling the refrigerant in the condenser 1, a plurality of condensing heat exchanging pipes 5 are installed in the condenser 1, cold water flows through the condensing heat exchanging pipes 5 to cool the refrigerant, the heat conducting sheet 403 is provided with holes and is sleeved on the condensing heat exchanging pipes 5.

[0029] The supercooling assembly 4 includes a heat-conducting semicircular sheet 402 fixedly installed inside the condenser 1, a plurality of semiconductor refrigeration sheets 401 fixedly installed on the outer side of the heat-conducting semicircular sheet 402, heat dissipation fins 414 fixedly installed on the outer side of the semiconductor refrigeration sheets 401, a plurality of heat-conducting sheets 403 fixedly installed on the inner diameter wall of the heat-conducting semicircular sheet 402, and a drip pipe 2 fixedly installed on the top of the heat dissipation fins 414, wherein the drip pipe 2 is communicated with a water pipe 3.

[0030] The condenser 1 is cooled by water to change the refrigerant working medium from a gaseous state to a liquid state, that is, the water absorbs the heat of the refrigerant, the temperature of the refrigerant is reduced, and the temperature of the water is increased. The condensation heat exchange pipe 5 is filled with water, and the space between the condensation heat exchange pipe 5 and the shell is filled with refrigerant. The refrigerant enters the heat exchanger from the upper part in a gaseous state and exits from the lower part in a liquid state. At the same time, the water enters the heat exchanger from the lower water inlet on the side and exits from the upper water inlet with a higher temperature. In the container, the condenser 1 is divided into an upper part and a lower part. The upper part cools the refrigerant from a gaseous state to a liquid state, and the lower part further cools the liquid refrigerant to improve the supercooling degree and provide higher efficiency for the subsequent unit operation. In the lower part, the heat-conducting semicircular sheet 402 and the semiconductor refrigeration sheet 401 are arranged. The refrigeration end of the semiconductor refrigeration sheet 401 is in contact with the heat-conducting semicircular sheet 402 to further cool the refrigerant accumulated on the heat-conducting semicircular sheet 402 through heat transfer. During the condensation process, the condensation heat exchange pipe 5 in the upper part produces liquid refrigerant. The refrigerant flows downward and flows into the heat-conducting sheets 403. The heat-conducting semicircular sheet 402 transfers heat to the heat-conducting semicircular sheet 402 and the heat-conducting sheets 403, which cools the dripping refrigerant and helps to reduce the temperature of the refrigerant, so that the refrigerant can enter the working temperature more quickly and improve the supercooling degree of the refrigerant.

[0031] The evaporator 2 works in the opposite direction of the condenser 1. The water is cooled by the refrigerant. The refrigerant enters the container from the bottom, passes through the evaporation heat exchange pipe 8, absorbs the temperature of the water in the evaporation heat exchange pipe 8, changes from a liquid state to a gaseous state, and exits from the upper part of the evaporator 2. At the same time, the water in the evaporation heat exchange pipe 8 enters from the upper water pipe on the side with a high temperature and exits from the lower water pipe with a low temperature, achieving the effect of refrigeration.

[0032] During the refrigeration process of the semiconductor refrigeration sheet 401, the part of the semiconductor refrigeration sheet 401 facing the outside will generate heat, and the heat dissipation of the hot end of the semiconductor refrigeration sheet 401 can help the refrigeration effect of the refrigeration end of the semiconductor refrigeration sheet 401. Therefore, the heat dissipation fins 414 are used to dissipate heat. During the process of dissipating heat from the semiconductor refrigeration sheet 401 by the heat dissipation fins 414, water is dripped onto the heat dissipation fins 414 from the drip pipe 2. The bending characteristics of the heat dissipation fins 414 of the heat dissipation fins 414 are used to make the dripping water evaporate after flowing to the lowest point of the heat dissipation fins 414, thereby removing heat at a low cost and with a simple device to produce a certain heat dissipation effect.

[0033] The heat-conducting sheet 403 comprises a heat-conducting semicircular ring 4031 fixedly installed on the inner wall of the heat-conducting semicircular sheet 402, and connecting sheets 4032 fixedly connected on both sides of the heat-conducting semicircular ring 4031, and slots for the condensing heat exchange pipes 5 to pass through are formed on the connecting sheets 4032.

[0034] The condensed refrigerant can slide down along the condensing heat exchange pipes 5, and the refrigerant sliding down at the bottom of the condenser 1 can flow through the connecting sheets 4032 and also fall on the heat-conducting semicircular sheet 402, and the refrigerant sliding down and the refrigerant on the heat-conducting semicircular sheet 402 are further cooled by the refrigeration effect of the semiconductor refrigeration sheet 401.

[0035] As shown in Figure 3 The condensing heat exchange pipes 5 comprise straight pipes 501 and curved pipes 502, the heat-conducting semicircular ring 4031 is located directly below the center of curvature of the straight pipes 501, the combination of the straight pipes 501 and the curved pipes 502 is distributed in the upper half of the condenser 1 and does not contact the heat-conducting sheet 403, the condensing heat exchange pipes 5 in the lower half of the condenser 1 are all straight and contact the heat-conducting sheet 403, and a flow connecting pipe 404 is arranged below each straight pipe 501, the flow connecting pipes 404 are fixedly connected by a connecting frame, a flow-through pipe 405 is fixedly connected in the center of the flow connecting pipe 404, a flow guide column 406 is fixedly connected in the flow-through pipe 405, the flow guide column 406 contacts the straight pipe 501, and the flow-through pipe 405 is directly above the heat-conducting semicircular ring 4031.

[0036] The combination of the straight pipes 501 and the curved pipes 502 is distributed in the upper half of the condenser 1, and when the gaseous refrigerant contacts the straight pipes 501 and the curved pipes 502 at high temperature, the gaseous refrigerant is liquefied on the straight pipes 501 and the curved pipes 502 and condenses thereon, and the condensed refrigerant can flow downward along the arc shape of the curved pipes 502 to the lowest part of the curved pipes 502 and then flow downward through the flow connecting pipe 404, and at the same time, the accumulated refrigerant can quickly flow to the flow connecting pipe 404 due to the contact between the flow guide column 406 and the most protruding position below the curved pipes 502, so that the refrigerant can be conveniently guided to flow into the connecting sheet 4032 below, so that the refrigerant can more concentratedly obtain the cooling effect, help to reduce the temperature of the refrigerant, and improve the supercooling degree.

[0037] The bottom of the condenser 1 has two liquid outlet pipes, and two sets of two groups of liquid blocking plates 407 are fixedly installed in the condenser 1, the two liquid blocking plates 407 are distributed on both sides of the liquid outlet pipes, a containing groove 413 is formed on the liquid blocking plate 407, an electric push rod 410 is fixedly installed in the containing groove 413, a siphon pipe 411 is fixedly connected to the top of the electric push rod 410, and a temperature sensor 409 is fixedly connected to one side of the liquid blocking plate 407 to detect the temperature of the refrigerant.

[0038] The refrigerant in the condenser 1 is subjected to the refrigeration effect of the heat-conducting semicircular sheet 402 and the heat-conducting sheet 403, and is blocked on both sides of the liquid outlet pipe by two groups of liquid blocking plates 407, so as to slow down the flow-out speed of the refrigerant and ensure the cooling time of the refrigerant. In this process, the temperature sensor 409 is used to detect the temperature of the refrigerant. When the refrigerant meets the temperature condition and the liquid level exceeds the liquid blocking plate 407, the electric push rod 410 is controlled to drive the siphon pipe 411 to descend. When the liquid level exceeds the highest point of the siphon pipe 411, the refrigerant can quickly flow to the liquid outlet pipe of the condenser 1 through the siphon pipe 411 by the siphon effect. When the temperature of the refrigerant is too high, the siphon pipe 411 is controlled to move upward, so as to continuously limit the flow-out of the refrigerant by the height of the liquid blocking plate 407, and ensure the temperature of the refrigerant flowing out.

[0039] The fixed baffle plate 408 is fixedly connected to the two side edges of the accommodating groove 413, and the movable baffle plate 412 is fixedly connected to the bottom of the siphon pipe 411.

[0040] The fixed baffle plate 408 and the movable baffle plate 412 both block the flow of the refrigerant, so that the refrigerant is difficult to pass through the accommodating groove 413 when the siphon pipe 411 is at any height.

[0041] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit the same. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalent features, without changing the essence of the corresponding technical solutions.

Claims

1. A heat exchange assembly of a flooded chiller, comprising a condenser and an evaporator, characterized in that, A supercooling assembly is installed below the condenser, which is in the lower half of the condenser and used to cool the refrigerant in the condenser. The supercooling assembly includes a heat-conducting semicircular sheet fixedly installed inside the condenser, a plurality of semiconductor refrigerating sheets fixedly installed on the outer side of the heat-conducting semicircular sheet, and heat radiating sheets fixedly installed on the outer side of the semiconductor refrigerating sheets, and a plurality of heat-conducting sheets fixedly installed on the inner diameter wall of the heat-conducting semicircular sheet.

2. The heat exchange component of a flooded chiller unit according to claim 1, characterized in that, A plurality of condensing heat exchange pipes are installed in the condenser, through which cold water flows to cool the refrigerant, and the heat-conducting sheets are provided with holes and are sleeved on the condensing heat exchange pipes.

3. The heat exchange assembly of a flooded-type chiller according to claim 2, wherein, The heat-conducting sheet includes a heat-conducting semicircular ring fixedly installed on the inner wall of the heat-conducting semicircular sheet, and connecting sheets fixedly connected on both sides of the heat-conducting semicircular ring, and the connecting sheets are provided with groove positions for the condensing heat exchange pipes to pass through.

4. The heat exchange assembly of a flooded-type chiller according to claim 3, wherein, The condensing heat exchange pipes include straight pipes and curved pipes, the heat-conducting semicircular ring is located directly below the center of curvature of the straight pipes, and the combination of the straight pipes and the curved pipes is distributed in the upper half of the condenser.

5. The heat exchange assembly of a flooded-type chiller according to claim 4, wherein, An interface pipe is placed below each straight pipe, a plurality of interface pipes are fixedly connected through a connecting frame, a flow-through pipe is fixedly connected in the center of the interface pipe, a flow guide column is fixedly connected in the flow-through pipe, the flow guide column is in contact with the straight pipe, and the flow-through pipe is located directly above the heat-conducting semicircular ring.

6. The heat exchange assembly of a flooded-type chiller according to claim 5, wherein, A liquid drop pipe is fixedly installed on the top of the heat radiating sheet, and a water pipe is connected to the liquid drop pipe.

7. The heat exchange assembly of a flooded-type chiller according to claim 6, wherein, The bottom of the condenser has two liquid outlet pipes, two groups of two groups of liquid blocking plates are fixedly installed in the condenser, two liquid blocking plates are distributed on both sides of the liquid outlet pipes, accommodating grooves are provided in the liquid blocking plates, electric push rods are fixedly installed in the accommodating grooves, and siphon pipes are fixedly connected to the top of the electric push rods.

8. The heat exchange assembly of a flooded-type chiller according to claim 7, wherein, A temperature sensor is fixedly connected to one side of the liquid blocking plate to detect the temperature of the refrigerant.

9. The heat exchange assembly of a flooded-type chiller according to claim 8, wherein, Fixed baffles are fixedly connected to the edges of both sides of the accommodating groove, and movable baffles are fixedly connected to the bottom of the siphon pipe.

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