High-temperature anti-oxidation testing device for integrated circuit chip

Abstract

The invention discloses an integrated circuit chip high-temperature anti-oxidation testing device, and relates to the technical field of sorting equipment, the integrated circuit chip high-temperature anti-oxidation testing device comprises a machine body, and the machine body is sequentially provided with a feeding device, a heating device, a caching device, a heat preservation device, a testing device and a cooling device in a connected mode along a chip transmission path; the flow channels are arranged on the heating device, the caching device, the heat preservation device and the testing device respectively, and flow channel grooves for placing chips are formed in the flow channels; an inflation cavity communicated with the flow channel groove is formed between the inner wall of the separation cover and the flow channel, and the two opposite sides of the separation cover are respectively provided with a communication port for the chip to enter and output; a plurality of air injection holes located in the side, away from the groove opening, of the flow channel groove are formed in the flow channel, a conveying groove communicating with the air injection holes is formed in the flow channel, and an air inlet hole communicating with the conveying groove and allowing inert gas to enter is formed in the side, back to the flow channel groove, of the flow channel. According to the invention, the possibility of oxidation of the integrated circuit chip in the test process can be prevented.

Description

Technical Field

[0001] The present application relates to the technical field of sorting equipment, and in particular to a high-temperature anti-oxidation testing device for integrated circuit chips. Background Art

[0002] In the semiconductor industry, integrated circuit chip technology continues to advance, with its applications expanding across numerous fields, including computers, communications, and consumer electronics. The performance and reliability of integrated circuit chips are crucial to the stable operation of the entire electronic system, and reliability in high-temperature environments is a particular focus for manufacturers and users. Because integrated circuit chips may encounter various high-temperature conditions in real-world applications, their reliability is directly related to product performance and service life, which in turn impacts the development and progress of the entire electronics industry. As electronic products continue to enhance their functionality and increase their integration, testing and screening integrated circuit chips in high-temperature environments has become increasingly important to ensure that products can function properly under these complex operating conditions.

[0003] For high-temperature testing and sorting of integrated circuit chips, the common practice in the past was to use equipment with a specific process design. For example, Chinese invention patent publication number CN117339906A discloses a semiconductor device heating module mobile feeding testing and sorting device. This device comprises a rack with a heating mechanism, a buffering mechanism, a testing mechanism, and a cooling mechanism arranged sequentially along the transport direction of semiconductor devices (such as chips or packages). The heating mechanism heats the device to a preset test temperature, the buffering mechanism manages the test queue and balances processing speed differences between workstations, the testing mechanism measures the device's electrical performance parameters at high temperatures, and the cooling mechanism is responsible for reducing the temperature of the tested device to a safe range for subsequent sorting or processing. This equipment is designed to implement a linear, automated "heating-buffering-testing-cooling" process, providing a viable approach for high-temperature testing of integrated circuit chips.

[0004] However, existing high-temperature testing and sorting methods for integrated circuit chips have significant drawbacks. After being heated in air and buffered, the metal conductive surfaces of integrated circuit chips, such as pads and pins, undergo thermal oxidation, forming an oxide layer with poor conductivity. When high-temperature electrical performance testing is performed on integrated circuit chips with this oxide layer, their true electrical parameters are severely distorted, leading to distorted test results, significantly impacting test accuracy and product reliability. Summary of the Invention

[0005] In order to reduce the possibility of oxidation of integrated circuit chips during testing, the present application provides a high-temperature anti-oxidation testing device for integrated circuit chips.

[0006] This application provides a high-temperature anti-oxidation test device for integrated circuit chips, which adopts the following technical solutions: A high-temperature anti-oxidation testing device for integrated circuit chips, comprising a body, wherein a feeding device, a heating device, a buffer device, a heat preservation device, a testing device, and a cooling device are sequentially connected to the body along a chip transmission path; There are multiple flow channels, which are respectively arranged on the heating device, the buffer device, the heat preservation device, and the testing device. The flow channels are provided with flow channel grooves for placing the chips; A separation cover is provided on the heating device, the buffer device, and the heat preservation device and is located on the flow channel. The separation cover covers the flow channel groove. An air-filled cavity connected to the flow channel groove is formed between the inner wall of the separation cover and the flow channel. The separation cover is provided with communication ports for chip entry and output on opposite sides. The flow channel is provided with a plurality of air injection holes located on one side of the flow channel groove distribution slot, the flow channel is provided with a transmission groove connected to the air injection holes, and the flow channel is provided with an air inlet hole connected to the transmission groove and for the inert gas to enter on the side facing away from the flow channel groove.

[0007] By adopting the above technical solution, feeding, heating, caching, preheating, testing and cooling devices are sequentially arranged along the chip transmission path to realize a linear automated process for high-temperature testing and sorting of integrated circuit chips; flow channels with flow channel grooves are respectively provided in the heating, caching, preheating and testing devices for placing chips, and the flow channels are provided with transmission grooves, air inlets and multiple air injection holes, through which inert gas can be introduced to cover and protect the chips, thereby reducing the possibility of thermal oxidation of the metal conductive parts and pins on the chip surface in a high-temperature environment, which is conducive to improving test accuracy and product reliability.

[0008] Optionally, an air diffusion groove connected to the air injection hole is opened on the groove wall on one side of the flow channel groove distribution groove opening.

[0009] By adopting the above technical solution, when the inert gas is ejected from the air jet hole, part of the inert gas is blown toward the upper process and the lower process through the gas diffusion groove, thereby reducing the possibility of oxidation of the chip during transmission to the upper process and the lower process.

[0010] Optionally, the air jet orifices are distributed in the middle of the flow channel groove.

[0011] By adopting the above technical solution, the possibility of inert gas directly entering the gas filling cavity through the positioning groove on the chip is reduced, which is conducive to increasing the amount of inert gas flowing to the upper and lower processes through the gas diffusion groove.

[0012] Optionally, the air injection holes are evenly spaced along the chip conveying direction.

[0013] By adopting the above technical solution, the inert gas is ejected relatively evenly, effectively suppressing the thermal oxidation of the metal conductive parts and pins on the chip surface in a high-temperature environment, reducing the formation of an oxide layer with poor conductivity, and improving the accuracy of high-temperature electrical performance testing and product reliability.

[0014] Optionally, the distance between adjacent air injection holes gradually decreases from the communication openings on both sides toward the middle of the flow channel groove.

[0015] By adopting the above technical solution, the amount of inert gas in the middle of the flow channel is increased, which is beneficial to increasing the amount of inert gas in the middle of the inflation cavity and improving the covering and protection effect on the chip.

[0016] Optionally, a vent pipe is slidably and symmetrically arranged in the flow channel, and the flow channel is provided with a connecting pipe connecting the vent pipe and the transmission groove; The ventilation pipe is evenly spaced and provided with a plurality of nozzles that slide on the flow channel, and the nozzles are arranged obliquely toward one side of the flow channel groove; The flow channel is provided with a control component, and the control component controls the ventilation pipe to slide back and forth in an axial direction.

[0017] By adopting the above technical solution, during the test process, inert gas can be sprayed into the flow channel through the ventilation pipe and the nozzle. At the same time, the nozzle can also slide back and forth axially under the action of the control component, so that the inert gas can more comprehensively and evenly cover the chip placed in the flow channel, achieving a better anti-oxidation effect, and improving test accuracy and product reliability.

[0018] Optionally, the control assembly includes a control blade, a control shaft, a reciprocating screw and a control block; A mounting block is provided on the outer circumference of the communicating pipe, the mounting block is provided with a mounting slot communicating with the communicating pipe, and the control shaft is rotatably connected to the mounting block and passes through the mounting slot; The control blades are evenly spaced along the circumferential direction and are arranged on the outer circumference of the control shaft, and the control blades extend into the communicating tube; The reciprocating screw is rotatably connected to the flow channel, and the reciprocating screw is coaxially arranged with the control shaft and fixedly connected; The control block is threadedly connected to the reciprocating screw rod, and the control block is slidably connected in the flow channel and connected to the ventilation pipe.

[0019] By adopting the above technical solution, when the inert gas enters the connecting pipe and flows, it can drive the control blade to rotate, thereby rotating the control shaft, and further driving the reciprocating screw to rotate, so that the control block threadedly connected to the reciprocating screw slides in the flow channel and drives the ventilation pipe to slide back and forth along the axial direction. This can expand the coverage range of the inert gas sprayed by the nozzle, better isolate the air, reduce the possibility of thermal oxidation of the metal conductive parts and pins on the chip surface to form a poorly conductive oxide layer, and improve the test accuracy and product reliability of high-temperature test and sorting equipment.

[0020] Optionally, the flow channel of the testing device is a first flow channel; The testing device includes a test piece, a test seat, a lifting seat, a lifting cylinder, a stopper, a positioning column, a first cylinder, and a second cylinder; The test piece is arranged at the bottom of the test seat, the test seat is arranged on the body, and the test seat is provided with a through-hole for the test piece to pass through; The first flow channel is provided on the lifting seat, and the lifting seat and the first flow channel are respectively provided with test holes that are interconnected and for the test piece to pass through; The lifting cylinder is provided on the test seat, and the lifting cylinder controls the lifting seat to approach the test piece; The test seat is provided with a support seat, the first cylinder and the second cylinder are respectively provided on the support seat, the stopper is provided at the end of the piston rod of the first cylinder, and the stopper is located between the support seat and the cooling device; A linkage plate is provided at the end of the piston rod of the second cylinder, and the positioning column is symmetrically arranged on one side of the linkage plate distributed on the second cylinder.

[0021] By adopting the above technical solution, the test piece of the testing device tests the chip through the test seat through-hole and the test holes of the lifting seat and the first flow channel. The lifting cylinder controls the lifting seat to approach the test piece; the first cylinder on the test seat drives the block to block the chip, and the second cylinder drives the linkage plate to enable the positioning column to position the chip, which helps to improve the accuracy of high-temperature testing and product reliability.

[0022] In summary, this application has at least one of the following beneficial effects: 1. The flow channel grooves are combined with the air injection holes, transmission grooves and air inlet holes to allow the inert gas to cover the chip, reducing the possibility of thermal oxidation of the metal conductive parts on the surface of the chip during high-temperature heating and cache waiting, and reducing the formation of poor conductive oxide layers; 2. During the test, inert gas can be sprayed into the flow channel through the vent pipe and nozzle. At the same time, the nozzle can also slide back and forth along the axial direction under the action of the control component, so that the inert gas can more comprehensively and evenly cover the chip placed in the flow channel, achieving better anti-oxidation effect, improving test accuracy and product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall structure of Example 1 of the present application; Figure 2 Schematic diagram of the structure of the heating device in Example 1 of the present application; Figure 3 This is a schematic structural diagram of the flow channel in Example 1 of the present application; Figure 4 is a schematic diagram of the internal cross-section of the flow channel in Example 1 of the present application; Figure 5 Schematic diagram of the external structure of the test device in Example 2 of the present application; Figure 6 Schematic diagram of the internal structure of the test device in Example 2 of the present application; Figure 7 yes Figure 6 A magnified schematic diagram of part A; Figure 8 Schematic diagram of the external structure of the first flow channel in Example 3 of the present application; Figure 9 This is a schematic diagram of the overall structure of the first flow channel in Example 3 of the present application; Figure 10 This is a schematic diagram of the internal structure of the first flow channel in Example 3 of the present application; Figure 11 It is a schematic diagram of the internal cross-section of the first flow channel in Example 3 of the present application.

[0024] Reference numerals: 1, machine body; 11, feeding device; 12, heating device; 13, buffer device; 14, heat preservation device; 15, testing device; 151, test piece; 152, test seat; 1521, insertion opening; 1522, support seat; 153, lifting seat; 154, lifting cylinder; 155, stopper; 156, positioning column; 157, first cylinder; 158, second cylinder; 1581, linkage plate; 16, cooling device; 2, Flow channel; 21. Flow channel groove; 22. Jet hole; 23. Transmission groove; 24. Air inlet; 25. Air diffusion groove; 26. First flow channel; 3. Separation cover; 31. Connecting port; 4. Inflatable cavity; 5. Ventilation pipe; 51. Connecting pipe; 511. Mounting block; 512. Mounting groove; 52. Nozzle; 6. Control assembly; 61. Control blade; 62. Control shaft; 63. Reciprocating screw; 64. Control block; 7. Test hole; 8. Chip; 81. Positioning groove. DETAILED DESCRIPTION

[0025] The following is combined with Figure 1-11 This application is described in further detail.

[0026] The embodiment of the present application discloses a high-temperature anti-oxidation testing device for integrated circuit chips.

[0027] Example 1 See also Figure 1 and Figure 2 The embodiment of the present application provides a high-temperature anti-oxidation testing device for integrated circuit chips, comprising a body 1, a plurality of flow channels 2, and a separation cover 3. The body 1 is provided with a feeding device 11, a heating device 12, a buffer device 13, a heat preservation device 14, a testing device 15, and a cooling device 16 in sequence along the transmission path of the chip 8, so that the chip 8 can complete the feeding, heating, buffering, preheating, testing, and cooling processes in sequence, thereby achieving the effect of automated testing and sorting. During testing, the chip 8 is transported to the heating device 12 by the feeding device 11, and the chip 8 is heated by the heating device 12 and then transported to the buffer device 13; two testing devices 15 and two heat preservation devices 14 are respectively provided and correspond one to one. After the buffer device 13 receives the chip 8 heated by the heating device 12, the chip 8 is evenly transported to the two heat preservation devices 14, and then the heat preservation device 14 preheats and preserves the temperature. After the test position is vacated, the chip 8 is transported to the testing device 15 for testing. After the test is completed, the testing device 15 transports the tested chip 8 to the cooling device 16 for cooling. Since the feeding principle, heating principle, cache principle, chip 8 electrical performance testing principle and cooling principle of this application are existing technologies, they will not be described in detail here.

[0028] See also Figure 1 and Figure 3 , there are multiple flow channels 2 and they are respectively arranged in the heating device 12, the cache device 13, the insulation device 14 and the testing device 15. The flow channel 2 is a rectangular structure, and the length direction of the flow channel 2 is parallel to the conveying direction of the chip 8 on the flow channel 2. A flow channel groove 21 is provided on one end face of the flow channel 2, and the flow channel groove 21 extends along the length direction of the flow channel 2. The chips 8 are evenly placed in the flow channel groove 21 along the length direction of the flow channel 2. When placed, adjacent chips 8 abut against each other, and the pin parts of the chip 8 protrude out of the flow channel groove 21. In the embodiment of the present application, positioning grooves 81 are respectively provided on the opposite side walls of the chip 8. When adjacent chips 8 abut against each other, the positioning grooves 81 of adjacent chips 8 are connected to each other.

[0029] See also Figure 2 and Figure 3The separation cover 3 is fixed to the flow channel 2 by screws or bolts. The separation cover 3 covers the flow channel groove 21, so that an air-filled cavity 4 is formed between the inner wall of the separation cover 3 and the flow channel 2, and the air-filled cavity 4 is connected to the flow channel groove 21. The separation cover 3 has two opposite side walls with communication ports 31, and the two communication ports 31 are respectively connected to the air-filled cavity 4. The chip 8 of the previous process enters the air-filled cavity 4 through the communication port 31 located above, and then exits the air-filled cavity 4 through the communication port 31 located below and is transmitted to the next process. The flow channel 2 is provided with an air jet hole 22, which is located on the side of the flow channel 21 away from the slot opening and communicates with the flow channel 21. The opening of the air jet hole 22 is located away from the middle of the flow channel 21. There are multiple air jet holes 22, which are evenly spaced along the length of the flow channel 2. The wall of the flow channel 21 on the side of the slot opening is provided with an air diffusion groove 25, which communicates with the air jet hole 22.

[0030] See also Figure 3 and Figure 4 A transmission groove 23 is provided in the flow channel 2, extending along the length of the flow channel 2 and communicating with the air injection hole 22. An air inlet 24 is provided on the side of the flow channel 2 facing away from the flow channel groove 21, communicating with the transmission groove 23, and connecting with an external air pipe.

[0031] See also Figure 2 and Figure 4 When in use, the inert gas is fed into the transmission slot 23 through the air inlet 24, and then the transmission slot 23 disperses the inert gas to the jet holes 22, and the inert gas is ejected through the jet holes 22 and enters the gas diffusion slot 25 (the gas diffusion slot 25 is in the Figure 3 At this time, a portion of the inert gas flows along the length of the flow channel 2 through the gas diffusion groove 25; then it overflows through the connecting port 31 to blow and cover the chips 8 of the previous and next processes. The other portion of the inert gas flows into the inflation chamber 4 through the positioning groove 81 of the chip 8. The existence of the inflation chamber 4 allows the inert gas to evenly cover the chip 8, forming a protective gas film around the chip 8, protecting the side of the chip 8 facing away from the air injection hole 22 and the pin portion. The inert gas can protect the chip 8 and reduce thermal oxidation of the metal conductive parts and pins on the surface of the chip 8. In the embodiment of the present application, nitrogen is used as the inert gas, and the nitrogen is heated to the same temperature as the chip 8 after heating before it is introduced.

[0032] In the embodiment of the present application, the flow channel 2 is generally made of a material that is resistant to high temperatures and has good thermal conductivity, such as ceramic or aluminum alloy. Figure 3The shape and size of the nozzles (marked in the middle) are compatible with chip 8 to ensure stable placement. The gas injection holes 22 are circular or elliptical, and their size and distribution density are designed based on the size of chip 8 and actual needs. The transmission groove 23 functions to evenly distribute the inert gas to each nozzle hole 22. It can be straight or curved, as long as it ensures smooth gas flow. The gas inlet 24 is connected to an external inert gas supply device, allowing inert gas to be delivered via a pipeline.

[0033] The implementation principle of the high-temperature anti-oxidation testing device for integrated circuit chips in the first embodiment of the present application is as follows: The high-temperature testing and sorting equipment for integrated circuit chips 8 of this embodiment realizes an automated process for high-temperature testing and sorting of chips 8 by sequentially connecting the various devices on the body 1. The feeding device 11 transports the chips 8 to the heating device 12 for heating, the heat preservation device 14 preheats the chips 8 to be tested, the buffer device 13 adjusts the test sequence of the chips 8 and evenly transports the chips 8 to the heat preservation device 14, the testing device 15 detects the performance of the chips 8, and the cooling device 16 cools the chips 8. At the same time, the design of the flow channel 2 and the separation cover 3 allows the inert gas to cover and protect the chips 8, reducing the possibility of oxidation of the metal conductive parts and pins on the surface of the chip 8 at high temperatures, thereby ensuring the accuracy of the test results and improving the reliability of the product, which is a significant improvement and upgrade compared to the existing technology.

[0034] Example 2 The difference between this embodiment and the above embodiment is that: Figure 5 and Figure 6 The flow channel 2 of the test device 15 is the first flow channel 26. The test device 15 includes a test piece 151, a test seat 152, a lifting seat 153, a lifting cylinder 154, a stopper 155, and a positioning column 156 (the positioning column 156 is in the Figure 7 ), first cylinder 157, second cylinder 158.

[0035] See also Figure 5 and Figure 7 , the test seat 152 is fixedly mounted on the body 1 (body 1 is Figure 1 The test piece 151 is installed at the bottom of the test seat 152. The test piece 151 is used to directly contact the pin part of the chip 8 to perform electrical performance testing. The test piece 151 can be made of a probe made of high-purity metal to ensure that the electrical signal of the chip 8 can be accurately obtained.

[0036] The test base 152 defines a passage opening 1521, the size and shape of which are compatible with the test piece 151, through which the test piece 151 passes. The first flow channel 26 is fixedly mounted on the lifting base 153. The lifting base 153 and the first flow channel 26 each define a test hole 7. The test holes 7 of the lifting base 153 and the first flow channel 26 are interconnected, allowing the test portion of the test piece 151 to pass through the test hole 7, thereby contacting the test portion of the test piece 151 with the pins of the chip 8.

[0037] Lifting cylinder 154 is mounted on test base 152. The piston rod of lifting cylinder 154 extends downward, and the end of the piston rod of lifting cylinder 154 is fixedly connected to lifting base 153. During use, lifting cylinder 154 is controlled to enter a forward stroke, which controls the downward movement of lifting base 153, driving the pins of chip 8 to contact the test portion of test piece 151. Lifting cylinder 154 is controlled to enter a reverse stroke, which controls the upward movement of lifting base 153, driving the pins of chip 8 to separate from the test portion of test piece 151.

[0038] Two fixing plates are symmetrically fixed on the test seat 152. A plurality of fixing rods are fixedly connected between the fixing plates. The support seat 1522 is fixedly connected to the fixing rods. The first cylinder 157 and the second cylinder 158 are respectively mounted and fixed on the support seat 1522. The stopper 155 is fixedly connected to the end of the piston rod of the first cylinder 157. The stopper 155 is located between the support seat 1522 and the cooling device 16 (the cooling device 16 is located at the bottom of the support seat 1522). Figure 1 During use, the first cylinder 157 is controlled to enter a forward stroke, driving the stopper 155 downward. The stopper 155 blocks the chip 8 and restricts the chip 8 from being transferred to the next process. The first cylinder 157 is controlled to enter a reverse stroke, driving the stopper 155 upward. The stopper 155 distributes the chip 8, and the chip 8 can now be transferred to the next process.

[0039] The piston rod end of the second cylinder 158 is fixedly connected to an inverted U-shaped linkage plate 1581. Positioning posts 156 are fixed to this linkage plate 1581 on one side of the second cylinder 158. Two symmetrical positioning posts 156 correspond to and align with the positioning slots 81 on either side of the chip 8. These posts 156 are used to precisely position the chip 8 during testing, ensuring test accuracy. During testing, the chip 8 is conveyed toward the first flow channel 26. The first cylinder 157 controls the stopper 155 to block the chip 8. When the chip 8 reaches the test position, the second cylinder 158 pushes the linkage plate 1581, extending the positioning posts 156. The positioning posts 156 then insert into the positioning slots 81 of the chip 8. The outer periphery of the positioning posts 156 abuts against the adjacent side walls of the two positioning slots 81 of the chip 8, positioning the chip 8. The lift cylinder 154 then drives the lift base 153 downward, allowing the test piece 151 to contact the chip 8 for testing.

[0040] The implementation principle of the high-temperature anti-oxidation testing device for integrated circuit chips in the second embodiment of the present application is as follows: This embodiment features an optimized design for the test device 15. The coordination of the lift base 153 and lift cylinder 154 allows precise control of the contact between the test piece 151 and the chip 8, improving test accuracy. The provision of the stopper 155 and positioning post 156 ensures accurate positioning and orderly movement of the chip 8 during testing, further ensuring test stability and reliability. This improvement allows the test device 15 to better function within the overall high-temperature testing and sorting equipment for integrated circuit chips 8, significantly improving test efficiency and product quality compared to existing technologies.

[0041] Example 3 The difference between this embodiment and the above embodiment is that: Figure 8 and Figure 9 The spacing between adjacent jet holes 22 gradually decreases from the position of the connecting openings 31 on both sides to the middle position of the flow channel groove 21. A vent pipe 5 is slidably connected in the flow channel 2 (the vent pipe 5 is in the Figure 10 There are two vent pipes 5 and they are symmetrically arranged.

[0042] See also Figure 8 and Figure 10The flow channel 2 is provided with a connecting pipe 51, and the connecting pipe 51 is in a "U"-shaped structure. The two ends of the connecting pipe 51 are respectively connected to the ventilation pipe 5 and the transmission groove 23, and the connecting pipe 51 adopts an organ pipe structure on the side close to the ventilation pipe 5. A nozzle 52 is fixedly connected to the ventilation pipe 5. There are multiple nozzles 52 and they are evenly spaced in the length direction of the flow channel 2. The nozzles 52 are tilted toward the side of the flow channel groove 21, and the nozzles 52 are slidably connected to the flow channel 2. When in use, the inert gas in the transmission groove 23 enters the ventilation pipe 5 through the connecting pipe 51, and is then ejected through the nozzle 52, lifting the inflation chamber 4 (the inflation chamber 4 is in Figure 2 The concentration of the inert gas in the chip 8 is increased to improve the protection effect on the pins of the chip 8 and the side of the chip 8 facing away from the transmission slot 23.

[0043] See also Figure 10 and Figure 11 The flow channel 2 is provided with a control component 6. When the inert gas in the transmission groove 23 flows through the connecting pipe 51, the control component 6 controls the vent pipe 5 to slide back and forth along the axial direction, thereby lifting the inflation chamber 4 (the inflation chamber 4 is Figure 2 The uniformity of the inert gas in the (marked in the middle).

[0044] The control assembly 6 includes a control blade 61, a control shaft 62, a reciprocating screw 63 and a control block 64. The mounting block 511 is fixed to the outer peripheral side of the connecting pipe 51. The mounting block 511 is provided with a mounting groove 512, and the mounting groove 512 is connected to the connecting pipe 51. The control shaft 62 is rotatably connected to the mounting block 511, and the control shaft 62 passes through the mounting groove 512. The control shaft 62 is parallel to the ventilation pipe 5. The control blade 61 is fixedly connected to the outer peripheral side of the control shaft 62. There are multiple control blades 61 and they are evenly spaced along the circumferential direction. The control blade 61 close to the side of the connecting pipe 51 extends into the connecting pipe 51. When the inert gas passes through the connecting pipe 51, the inert gas impacts the control blade 61, pushing the control blade 61 to rotate, thereby driving the control shaft 62 to rotate.

[0045] A reciprocating screw 63 is rotatably connected to the flow channel 2 and is coaxially arranged and fixedly connected to the control shaft 62. A control block 64 is slidably connected to the flow channel 2 and is threadedly connected to the reciprocating screw 63. The control block 64 is also fixedly connected to the vent tube 5. The rotation of the control shaft 62 rotates the reciprocating screw 63, which in turn causes the control block 64 to slide axially and cyclically within the flow channel 2, thereby driving the vent tube 5 and the nozzle 52 to move together, allowing the inert gas to be sprayed more comprehensively and evenly onto the chip 8.

[0046] The implementation principle of the high-temperature anti-oxidation testing device for integrated circuit chips in the third embodiment of the present application is as follows: This embodiment, based on the previous embodiment, optimizes the layout of the air jet holes 22 and incorporates a slidable vent tube 5 and nozzle 52, allowing the inert gas to more evenly and comprehensively cover the chip 8, further enhancing the anti-oxidation effect. The control assembly 6 utilizes the power of gas flow to achieve automatic reciprocating motion of the vent tube 5, eliminating the need for an additional power source and reducing equipment cost and energy consumption. This improvement provides better protection for the chip 8 during high-temperature testing, improving test accuracy and product quality, and offers significant advantages over existing technologies.

[0047] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A high-temperature anti-oxidation test device for integrated circuit chips, characterized by: The machine body (1) comprises a feeding device (11), a heating device (12), a buffer device (13), a heat preservation device (14), a testing device (15), and a cooling device (16) which are sequentially connected along a chip (8) transmission path. There are multiple flow channels (2) which are respectively arranged on the heating device (12), the buffer device (13), the heat preservation device (14), and the testing device (15); the flow channel (2) is provided with a flow channel groove (21) for placing the chip (8); A partition cover (3) is provided on the heating device (12), the buffer device (13), and the heat-insulating device (14) and is located on the flow channel (2); the partition cover (3) covers the flow channel groove (21); an air-filled cavity (4) communicating with the flow channel groove (21) is formed between the inner wall of the partition cover (3) and the flow channel (2); and communication ports (31) for the entry and exit of the chip (8) are respectively provided on opposite sides of the partition cover (3); The flow channel (2) is provided with a plurality of air injection holes (22) located on a side of the flow channel groove (21) away from the groove opening. A transmission groove (23) communicating with the air injection holes (22) is provided in the flow channel (2). An air inlet (24) communicating with the transmission groove (23) and allowing inert gas to enter is provided on a side of the flow channel (2) facing away from the flow channel groove (21).

2. The high-temperature anti-oxidation testing device for integrated circuit chips according to claim 1, characterized in that: An air diffusion groove (25) communicating with the air injection hole (22) is provided on a groove wall on one side of the distribution groove opening of the flow channel groove (21).

3. The high-temperature anti-oxidation testing device for integrated circuit chips according to claim 2, characterized in that: The orifices of the air jet holes (22) are distributed in the middle of the flow channel groove (21).

4. The high-temperature anti-oxidation testing device for integrated circuit chips according to claim 3, characterized in that: The air injection holes (22) are evenly spaced along the conveying direction of the chip (8).

5. The high-temperature anti-oxidation testing device for integrated circuit chips according to claim 3, characterized in that: The spacing between adjacent air injection holes (22) gradually decreases from the positions of the communication openings (31) on both sides toward the middle position of the flow channel groove (21).

6. The high-temperature anti-oxidation testing device for integrated circuit chips according to claim 5, characterized in that: A vent pipe (5) is slidably and symmetrically arranged in the flow channel (2), and the flow channel (2) is provided with a connecting pipe (51) connecting the vent pipe (5) and the transmission groove (23); A plurality of nozzles (52) are evenly spaced and arranged on the ventilation pipe (5) to slide on the flow channel (2), and the nozzles (52) are arranged to be inclined toward one side of the flow channel groove (21); The flow channel (2) is provided with a control component (6), and the control component (6) controls the vent pipe (5) to slide back and forth in an axial direction.

7. The high-temperature anti-oxidation testing device for integrated circuit chips according to claim 6, characterized in that: The control assembly (6) includes a control blade (61), a control shaft (62), a reciprocating screw (63) and a control block (64); A mounting block (511) is provided on the outer peripheral side of the connecting pipe (51), and the mounting block (511) is provided with a mounting groove (512) connected to the connecting pipe (51), and the control shaft (62) is rotatably connected to the mounting block (511) and passes through the mounting groove (512); The control blades (61) are evenly spaced along the circumferential direction and arranged on the outer peripheral side of the control shaft (62), and the control blades (61) extend into the connecting pipe (51); The reciprocating screw (63) is rotatably connected to the flow channel (2), and the reciprocating screw (63) and the control shaft (62) are coaxially arranged and fixedly connected; The control block (64) is threadedly connected to the reciprocating screw (63), and the control block (64) is slidably connected in the flow channel (2) and connected to the ventilation pipe (5).

8. The high-temperature anti-oxidation testing device for integrated circuit chips according to claim 1, characterized in that: The flow channel (2) of the testing device (15) is a first flow channel (26); The testing device (15) includes a testing piece (151), a testing seat (152), a lifting seat (153), a lifting cylinder (154), a stopper (155), a positioning column (156), a first cylinder (157), and a second cylinder (158); The test piece (151) is arranged at the bottom of the test seat (152), the test seat (152) is arranged on the body (1), and the test seat (152) is provided with a through-hole (1521) for the test piece (151) to pass through; The first flow channel (26) is arranged on the lifting seat (153), and the lifting seat (153) and the first flow channel (26) are respectively provided with a test hole (7) that is interconnected and allows the test piece (151) to pass through; The lifting cylinder (154) is provided on the test seat (152), and the lifting cylinder (154) controls the lifting seat (153) to approach the test piece (151); A support seat (1522) is provided on the test seat (152), the first cylinder (157) and the second cylinder (158) are respectively provided on the support seat (1522), the stopper (155) is provided at the end of the piston rod of the first cylinder (157), and the stopper (155) is located between the support seat (1522) and the cooling device (16); A linkage plate (1581) is provided at the end of the piston rod of the second cylinder (158), and the positioning column (156) is symmetrically arranged on one side of the linkage plate (1581) distributed on the second cylinder (158).

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