IC reliability test machine and test method

Abstract

The application discloses an IC integrated circuit reliability test machine and a test method, and belongs to the technical field of circuit testing.The IC integrated circuit reliability test machine comprises a rack, a conveying assembly is installed in the rack, supporting seats are fixed on the two sides of the rack, an installation assembly is fixedly installed on the supporting seat, a test assembly is installed on the installation assembly, side supporting plates are installed on the upper surfaces of the two sides of the rack, and a cleaning assembly is installed on the side supporting plate.The application solves the problem that the test port of an integrated circuit may be contaminated by impurities in the actual use process of the prior art, and the application cleans dust and impurities on the IC integrated circuit through the set wiping sponge and brush, guarantees the cleanliness of the surface of the IC integrated circuit, ensures that the IC integrated circuit is not interfered by impurities during the test, improves the reliability of the IC integrated circuit test, guarantees the accuracy of IC integrated circuit wiring, and makes the test result more reliable.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit testing, in particular to an IC integrated circuit reliability test machine and a test method. BACKGROUND

[0002] An integrated circuit is a kind of micro electronic device or component. By using a certain process, transistors, resistors, capacitors, inductors and other components and wiring interconnections required in a circuit are interconnected together on a small piece or several small pieces of semiconductor wafer or dielectric substrate. After the integrated circuit is completed, it needs to be tested for reliability.

[0003] A Chinese patent with publication number CN116736077A discloses an integrated circuit reliability test device, which comprises: a test main control module for controlling the operation of the entire test device; a signal generator module for generating various test signals to test the performance of the integrated circuit; a signal acquisition and analysis module for receiving the signals output by the integrated circuit and performing digital processing and analysis to obtain the performance indicators of the integrated circuit; a temperature control module for temperature stress testing of the integrated circuit by controlling the temperature environment to detect the performance changes of the integrated circuit under different temperatures; a carrier plate module for installing the integrated circuit to be tested; compared with the prior art, the patent has high test efficiency, high test precision, wide test range, comprehensive reliability test, easy system upgrade, and easy operation and maintenance.

[0004] In actual use, the test port of the integrated circuit may have impurities, which may hinder the test; therefore, the existing needs are not met, and the IC integrated circuit reliability test machine and test method are proposed. SUMMARY

[0005] The present application aims to provide an IC integrated circuit reliability test machine and test method, which cleans the dust and impurities on the IC integrated circuit by the wiping sponge and brush, ensures the cleanliness of the IC integrated circuit surface, so that the IC integrated circuit is not disturbed by impurities during testing, improves the reliability of the IC integrated circuit test, and accurately positions the wiring end of the IC integrated circuit by the laser positioning device at the bottom of the rotating plate, so that the test head can accurately contact the wiring end of the IC integrated circuit, ensures the accuracy of the IC integrated circuit wiring, and makes the test result more reliable, solving the problems in the above background art.

[0006] In order to achieve the above object, the present application provides the following technical scheme: IC integrated circuit reliability test machine, including rack, side support plate and support seat, the rack is installed with conveying assembly, conveying assembly is equipped with the placement groove, both sides of the rack are fixed with support seat, the support seat is fixedly installed with installation assembly, the installation assembly is installed with test assembly, both sides of the upper surface of the rack are installed with side support plate, the side support plate is installed with cleaning assembly, the right side of the cleaning assembly is provided with heating cavity.

[0007] Preferably, the installation assembly comprises a support column, a top plate, an installation plate, a support rod, a test system and a moving assembly, the support column is fixedly installed with the top plate, the lower surface of the top plate is fixed with the support rod, the bottom of the support rod is fixed on the installation plate, the installation plate is provided with the test system, and the side edge of the installation plate is provided with the moving assembly.

[0008] Preferably, the test system comprises:

[0009] A data acquisition unit is configured to acquire IC integrated circuit test data in real time.

[0010] A data processing unit is configured to process instantaneous interference signals by using a sliding average filter and to normalize data.

[0011] A data analysis unit is configured to analyze IC integrated circuit performance by using processed data and to evaluate the reliability of the IC integrated circuit.

[0012] A report generation unit is configured to generate a test report containing test conditions, key data charts, failure analysis conclusions and improvement suggestions.

[0013] Preferably, the moving assembly comprises a connecting plate, a second moving block, a second threaded rod and a fourth motor, the connecting plate is fixed on the side edge of the installation plate, the second threaded rod is rotatably installed on the connecting plate, one end of the second threaded rod is installed on the output end of the fourth motor through the connecting plate, and the second moving block is movably installed on the second threaded rod.

[0014] Preferably, the conveying assembly comprises a first motor, a driving shaft, a belt, a rack and a driven shaft, the first motor is installed on the outside of the rack, the output end of the first motor is connected with the driving shaft, the driving shaft is rotatably installed on the inside of the rack, the belt is installed on the driving shaft, one end of the belt away from the driving shaft is installed on the driven shaft, the driven shaft is installed on the inside of the rack, and the two ends of the belt are provided with the racks.

[0015] Preferably, the cleaning assembly comprises a mounting shaft, a gear, a mounting piece, a mounting frame, a wiping sponge and a brush, the two ends of the mounting shaft are provided with gears, the mounting piece is fixedly installed on the middle of the mounting shaft, four mounting frames are installed on the mounting piece at equal distances, and the wiping sponge and the brush are respectively installed on the mounting frames.

[0016] Preferably, the test assembly comprises a mounting sleeve, a movable assembly, a test head, a laser positioning device, a rotating plate, a rotating column, a third motor and a stop block, the movable assembly is mounted in the mounting sleeve, the test head is mounted on the movable assembly, the bottom of the mounting sleeve is provided with the rotating column, the rotating column is provided with a protrusion, the lower surface of the mounting sleeve is fixed with the stop block on both sides of the rotating column, the rotating column passes through the rotating plate and is connected with the output end of the third motor, the rotating plate is fixed on the rotating column, and the bottom of the rotating plate is provided with the laser positioning device.

[0017] Preferably, the movable assembly comprises a second motor, a first threaded rod, a movable pipe, a first moving block, a sliding rod and a clamping block, the output end of the second motor is connected with the first threaded rod, the corresponding surface of the first threaded rod is provided with the sliding rod, the first threaded rod and the sliding rod are movably provided with the first moving block, the first moving block is mounted on the movable pipe, and the movable pipe is mounted on the clamping block.

[0018] Preferably, the brush is used for cleaning dust and impurities through various fiber bristles and electrostatic adsorption; the brush comprises an electrostatic bristle area, a micron fiber bristle area, a nanometer fiber bristle area, an electrostatic release layer, an elastic support layer and a brush base;

[0019] The electrostatic bristle area is provided with electrostatic adsorption bristles, which are used for electrostatic adsorption of dust through the electrostatic adsorption bristles; the micron fiber bristle area is provided with micron-level fiber bristles, which are used for cleaning larger particle impurities;

[0020] The nanometer fiber bristle area is provided with nanometer-level fiber bristles, which are used for cleaning smaller particle impurities; the elastic support layer is arranged between the micron fiber bristle area and the nanometer fiber bristle area and the brush base, is made of elastic rubber strips, and is used for elastically supporting the micron fiber bristles and the nanometer fiber bristles of the micron fiber bristle area and the nanometer fiber bristle area, so that the fiber bristles are prevented from curling;

[0021] The electrostatic release layer is provided with conductive fibers, the conductive fibers are arranged at intervals with the electrostatic adsorption bristles, one end of the conductive fibers is electrically connected with an electrostatic conduction belt, the electrostatic conduction belt is electrically connected with a voltage resistance switch, and the voltage resistance switch is electrically connected with an electrostatic release grounding end;

[0022] During the cleaning process, the voltage resistance switch is turned off, the electrostatic release layer is not conductive with the electrostatic release grounding end, the electrostatic bristle area is not released, and the dust is electrostatically adsorbed through the electrostatic adsorption bristles;

[0023] After the cleaning is completed, the voltage resistance switch is turned on, the electrostatic conduction belt is conductive with the electrostatic release grounding end, the electrostatic release layer releases the static electricity to the electrostatic release grounding end through the electrostatic conduction belt; after the electrostatic bristle area is released, the electrostatically adsorbed dust after the cleaning is more easily removed for dust collection and treatment.

[0024] Preferably, the laser positioning device comprises:

[0025] The precise bidirectional grating, the positioning protractor, the laser ray mechanism, the reflected photoelectric conversion mechanism and the detection positioning control module; the precise bidirectional grating is arranged on the positioning protractor, and the longitudinal and transverse bidirectional gratings with the center point of the positioning protractor as the center are arranged to detect the longitudinal coordinate and the transverse coordinate of the IC integrated circuit positioning point respectively.

[0026] The positioning protractor is arranged as a ring scale, and is arranged on the bottom surface of the laser positioning device to detect the rotation angle of the IC integrated circuit.

[0027] The laser ray mechanism emits the positioning detection laser line to the IC integrated circuit positioning point; the IC integrated circuit positioning point reflects the laser line, and the reflected laser line is irradiated to the reflected photoelectric conversion mechanism through the precise bidirectional grating.

[0028] The reflected photoelectric conversion mechanism receives the reflected laser line of the IC integrated circuit positioning point, and converts the positioning detection laser line optical signal into a positioning detection electrical signal through photoelectric conversion.

[0029] The detection positioning control module calculates the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning protractor according to the positioning detection electrical signal.

[0030] The center point of the positioning protractor is taken as the coordinate origin of the spatial positioning coordinate system, and the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning protractor is calculated.

[0031] The distance from the IC integrated circuit positioning point to the center point of the positioning protractor, and the angle between the line connecting the IC integrated circuit positioning point and the center point of the positioning protractor and the line connecting the center point of the positioning protractor and the center point of the test head are calculated, and the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning protractor is obtained in combination with the direction of the IC integrated circuit positioning point relative to the center point of the positioning protractor, so as to determine whether the IC integrated circuit and the test head are precisely aligned, and to improve the positioning accuracy of the IC integrated circuit test.

[0032] Compared with the prior art, the present application has the following advantages:

[0033] The dust and impurities on the IC integrated circuit are cleaned by the wiping sponge and the brush, the brush can clean the larger impurities on the surface of the IC integrated circuit, and the wiping sponge can wipe the impurities that are not easy to be cleaned on the surface of the IC integrated circuit, so as to ensure the cleanliness of the surface of the IC integrated circuit, prevent the IC integrated circuit from being disturbed by impurities during testing, improve the reliability of the IC integrated circuit test, and accurately position the wiring end of the IC integrated circuit through the laser positioning device arranged at the bottom of the rotating plate, so that the test head can accurately contact the wiring end of the IC integrated circuit, ensure the accuracy of the IC integrated circuit wiring, and make the test result more reliable. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 The overall schematic diagram of the IC integrated circuit reliability test machine of the present application;

[0035] Figure 2 The conveying assembly schematic diagram of the IC integrated circuit reliability test machine of the present application;

[0036] Figure 3 The cleaning assembly schematic diagram of the IC integrated circuit reliability test machine of the present application;

[0037] Figure 4 The mounting assembly schematic diagram of the IC integrated circuit reliability test machine of the present application;

[0038] Figure 5 The testing assembly schematic diagram of the IC integrated circuit reliability test machine of the present application;

[0039] Figure 6 The moving assembly schematic diagram of the IC integrated circuit reliability test machine of the present application;

[0040] Figure 7 The testing system schematic diagram of the IC integrated circuit reliability test machine of the present application;

[0041] Figure 8 The testing flow chart of the IC integrated circuit reliability test machine of the present application;

[0042] Figure 9 The brush structure schematic diagram of the IC integrated circuit reliability test machine of the present application;

[0043] Figure 10 The laser positioning device structure schematic diagram of the IC integrated circuit reliability test machine of the present application.

[0044] In the figure: 1, rack; 2, conveying assembly; 21, first motor; 22, driving shaft; 23, belt; 24, rack; 25, driven shaft; 3, placing groove; 4, side support plate; 5, cleaning assembly; 51, mounting shaft; 52, gear; 53, mounting; 54, mounting frame; 55, wiping sponge; 56, brush; 561, electrostatic brush area; 562, micron fiber brush area; 563, nanofiber brush area; 564, electrostatic discharge layer; 565, elastic support layer; 566, brush base; 6, test assembly; 61, mounting sleeve; 62, movable assembly; 621, second motor; 622, first threaded rod; 623, movable tube; 624, first moving block; 625, slide rod; 626, clamping block; 63, test head; 64, laser positioning device; 641, precision bidirectional grating; 642, positioning protractor; 643, laser ray mechanism; 644, reflected photoelectric conversion mechanism; 645, detection positioning control module; 65, rotating plate; 66, rotating column; 67, third motor; 68, stop block; 7, support seat; 8, mounting assembly; 81, support column; 82, top plate; 83, mounting plate; 84, support rod; 85, test system; 86, moving assembly; 861, connecting plate; 862, second moving block; 863, second threaded rod; 864, fourth motor; 9, heating cavity. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0046] In order to solve the problem that the test port of the integrated circuit may be contaminated and hinder the test in the actual use of the prior art, please refer to Figures 1-10 The technical solutions are provided in the embodiments as follows:

[0047] IC integrated circuit reliability test machine, including frame 1, side support plate 4 and support seat 7, frame 1 is installed with conveying assembly 2, conveying assembly 2 is equipped with placing groove 3, both sides of frame 1 are fixed with support seat 7, support seat 7 is fixedly installed with installation assembly 8, installation assembly 8 is installed with test assembly 6, both sides of the upper surface of frame 1 are installed with side support plate 4, side support plate 4 is installed with cleaning assembly 5, the right side of cleaning assembly 5 is provided with heating cavity 9, IC integrated circuit is placed in placing groove 3, IC integrated circuit is heated after passing through heating cavity 9, is cleaned after passing through cleaning assembly 5 and is transmitted to test assembly 6 for testing, the reliability of IC integrated circuit under high temperature environment can be tested by high-temperature treatment of IC integrated circuit through heating cavity 9, potential hidden dangers such as material degradation, welding point failure and internal circuit thermal migration caused by thermal stress can be found in advance, so as to improve the durability and reliability of IC integrated circuit, through simulating extreme high-temperature environment, defects in IC integrated circuit design can be identified and solved, the stability and reliability of IC integrated circuit in actual use are ensured, potential defects of IC integrated circuit can also be identified through high-temperature simulation, the failure rate is reduced, so as to improve the overall quality of product and user satisfaction, the performance stability and durability of IC under long-time high-temperature condition are evaluated, so as to prolong its service life.

[0048] Installation assembly 8 includes support column 81, top plate 82, mounting plate 83, support rod 84, test system 85 and moving assembly 86, support column 81 is fixedly installed with top plate 82, the lower surface of top plate 82 is fixed with support rod 84, the bottom of support rod 84 is fixed on mounting plate 83, mounting plate 83 is equipped with test system 85, the side of mounting plate 83 is equipped with moving assembly 86.

[0049] Test system 85 includes:

[0050] Data acquisition unit, for real-time acquisition of IC integrated circuit test data tested by test assembly 6;

[0051] Data processing unit, for adopting sliding average filtering to process instantaneous interference signal and normalizing data;

[0052] Data analysis unit, for analyzing IC integrated circuit performance using processed data and evaluating reliability of IC integrated circuit;

[0053] Report generation unit, for generating test report containing test conditions, key data chart, failure analysis conclusion and improvement suggestion.

[0054] In the analysis of the collected test voltage, current, temperature raw parameters, the distribution characteristics of the performance indicators are determined by calculating the mean and variance of the key parameters, and through electrical measurement, spectrum analysis and other methods, early defects, random faults during use and wear period aging problems can be quickly identified, the fault diagnosis efficiency is significantly improved, the parameter drift is observed through time series analysis, the early failure characteristics of the IC integrated circuit are identified, the main fault types are located using the Pareto chart, and the analysis result of the IC integrated circuit is obtained. The time sequence change of the key parameters (such as voltage, current, temperature) can be recorded continuously, the gradual failure mode that is difficult to be found by traditional static test can be captured, the statistical analysis of parameter drift can identify potential failure risks in advance, and through time series analysis combined with Pareto chart, the early failure characteristics of the IC integrated circuit can be efficiently identified and the fault location can be optimized.

[0055] The moving assembly 86 comprises a connecting plate 861, a second moving block 862, a second threaded rod 863 and a fourth motor 864, the connecting plate 861 is fixed on the side edge of the mounting plate 83, the second threaded rod 863 is rotatably installed on the connecting plate 861, one end of the second threaded rod 863 is installed on the output end of the fourth motor 864, the second moving block 862 is movably installed on the second threaded rod 863, the fourth motor 864 is started to make the second threaded rod 863 rotate, and then the second moving block 862 is moved, so as to adjust the position of the test assembly 6 and realize the test of the IC integrated circuit.

[0056] The conveying assembly 2 comprises a first motor 21, a driving shaft 22, a belt 23, a rack 24 and a driven shaft 25, the first motor 21 is installed on the outer side of the rack 1, the output end of the first motor 21 is connected with the driving shaft 22, the driving shaft 22 is rotatably installed on the inner side of the rack 1, the belt 23 is installed on the driving shaft 22, one end of the belt 23 away from the driving shaft 22 is installed on the driven shaft 25, the driven shaft 25 is installed on the inner side of the rack 1, and the two ends of the belt 23 are provided with the racks 24. The first motor 21 is started to make the driving shaft 22 rotate, drive the belt 23 to work, and drive the placement groove 3 to move, so that the IC integrated circuit placed in the placement groove 3 moves, and the test of the IC integrated circuit is completed.

[0057] The cleaning assembly 5 comprises a mounting shaft 51, a gear 52, a mounting piece 53, a mounting frame 54, a wiping sponge 55 and a brush 56, the gear 52 is arranged at both ends of the mounting shaft 51, the mounting piece 53 is fixed in the middle of the mounting shaft 51, four mounting frames 54 are equidistantly arranged on the mounting piece 53, the wiping sponge 55 and the brush 56 are respectively arranged on the mounting frames 54, two of the wiping sponge 55 and the brush 56 are arranged, and the wiping sponge 55 and the brush 56 are arranged in an intersecting mode, the gear 52 is engaged on the rack 24, when the rack 24 moves with the belt 23, the gear 52 engaged on the rack 24 rotates, drives the mounting shaft 51 to rotate, so that the wiping sponge 55 and the brush 56 clean the dust and impurities on the IC integrated circuit, the brush 56 can clean the larger impurities on the surface of the IC integrated circuit, the wiping sponge 55 can wipe the impurities on the surface of the IC integrated circuit which are not easy to be cleaned, so that the cleanliness of the surface of the IC integrated circuit is ensured, the IC integrated circuit is not interfered by the impurities when the IC integrated circuit is tested, and the reliability of the IC integrated circuit test is improved.

[0058] The test assembly 6 comprises a mounting sleeve 61, a movable assembly 62, a test head 63, a laser positioning device 64, a rotating plate 65, a rotating column 66, a third motor 67 and a stop block 68, the movable assembly 62 is arranged in the mounting sleeve 61, the test head 63 is arranged on the movable assembly 62, the rotating column 66 is arranged at the bottom of the mounting sleeve 61, the protruding block is arranged on the rotating column 66, the stop block 68 is fixed on the lower surface of the mounting sleeve 61 and located on both sides of the rotating column 66, the rotating column 66 passes through the rotating plate 65 and is connected with the output end of the third motor 67, the rotating plate 65 is fixed on the rotating column 66, and the laser positioning device 64 is arranged at the bottom of the rotating plate 65.

[0059] The movable assembly 62 comprises a second motor 621, a first threaded rod 622, a movable pipe 623, a first moving block 624, a sliding rod 625 and a clamping block 626, the output end of the second motor 621 is connected with the first threaded rod 622, the corresponding surface of the first threaded rod 622 is provided with the sliding rod 625, the first moving block 624 is movably arranged on the first threaded rod 622 and the sliding rod 625, the first moving block 624 is arranged on the movable pipe 623, and the clamping block 626 is arranged on the movable pipe 623, the movable pipe 623 comprises a fixed pipe, a compression spring and an inner sleeve pipe, the fixed pipe is fixed on the first moving block 624, the inner sleeve pipe is movably arranged in the fixed pipe, the inner sleeve pipe and the fixed pipe are connected together through the compression spring, and the inner sleeve pipe is fixed on the clamping block 626.

[0060] IC integrated circuit is moved to the top of the test assembly 6, the wiring end of the IC integrated circuit is accurately positioned by the laser positioning device 64 arranged at the bottom of the rotating plate 65, after positioning is completed, the third motor 67 is started, the rotating column 66 is rotated, and then the rotating plate 65 is rotated to be away from the mounting sleeve 61, the stop block 68 cooperates with the protruding block to limit the rotation angle of the rotating plate 65, the test head 63 is fixed by the clamping block 626, the inner sleeve and the fixed tube are connected by the compression spring, so that the movable tube 623 can be telescopic, under the elasticity of the spring, the test head 63 can be clamped and fixed more tightly, then the second motor 621 is started to rotate the first threaded rod 622, and then the first moving block 624 is driven to move, the test head 63 is lowered to the positioned position, so that the test head 63 contacts the wiring end of the IC integrated circuit, and the IC integrated circuit is tested, the wiring end of the IC integrated circuit is accurately positioned by the laser positioning device 64 arranged at the bottom of the rotating plate 65, after positioning is completed, the rotating column 66 is rotated, and then the rotating plate 65 is rotated to be away from the mounting sleeve 61, then the second motor 621 is started to lower the test head 63 to the positioned position, so that the position of the test head 63 is consistent with the position positioned by the laser positioning device 64, accurate positioning is realized, the accuracy of the wiring of the IC integrated circuit is ensured, and the test result is more reliable

[0061] Working principle: when the IC integrated circuit reliability test machine of the application is used, according to Figures 1-8 , the following steps are included:

[0062] S1: the IC integrated circuit is placed in the placing groove 3, the first motor 21 is started, the driving shaft 22 is rotated, the belt 23 is driven to work, the belt 23 is driven to move the placing groove 3, and the IC integrated circuit is driven to pass through the heating cavity 9 to heat and then is transmitted to the cleaning assembly 5;

[0063] S2: when the belt 23 moves, the rack 24 moves, the gear 52 meshed on the rack 24 rotates, the mounting shaft 51 is rotated, the wiping sponge 55 and the brush 56 clean the dust and impurities on the IC integrated circuit;

[0064] S3: after cleaning, the IC integrated circuit is moved to the top of the test assembly 6 by the belt 23, the wiring end of the IC integrated circuit is positioned by the laser positioning device 64, after positioning is completed, the third motor 67 is started to rotate the rotating plate 65 to be away from the mounting sleeve 61;

[0065] S4: the second motor 621 is started to rotate the first threaded rod 622, and then the first moving block 624 is driven to move, the test head 63 is lowered to the positioned position, so that the test head 63 contacts the wiring end of the IC integrated circuit, and the IC integrated circuit is tested;

[0066] S5: At this time, the data acquisition unit of the test system 85 collects the IC integrated circuit test data tested by the test head 63 in real time, processes the instantaneous interference signal by using the moving average filtering, and performs the normalization processing on the data;

[0067] S6: The processed data is used to analyze the performance of the IC integrated circuit, evaluate the reliability of the IC integrated circuit, and generate a test report containing the test conditions, key data charts, failure analysis conclusions and improvement suggestions after the evaluation is completed.

[0068] In summary, the IC integrated circuit reliability test machine of the application can test the reliability of the IC integrated circuit under high temperature environment by high temperature treatment of the IC integrated circuit by the heating cavity 9, can find potential hidden dangers in advance, such as material degradation caused by thermal stress, solder joint failure and internal circuit thermal migration, etc., thereby improving the durability and reliability of the IC integrated circuit, identifying and solving the defects in the design of the IC integrated circuit by simulating extreme high temperature environment, ensuring the stability and reliability of the IC integrated circuit in actual use, identifying potential defects of the IC integrated circuit by high temperature simulation, reducing the failure rate, thereby improving the overall quality of the product and user satisfaction, evaluating the performance stability and durability of the IC under long time high temperature condition, thereby prolonging the service life, cleaning the dust and impurities on the IC integrated circuit by the set wiping sponge 55 and brush 56, the brush 56 can clean the larger impurities on the surface of the IC integrated circuit, and the wiping sponge 55 can wipe the impurities on the surface of the IC integrated circuit which are not easy to be cleaned, ensuring the cleanliness of the surface of the IC integrated circuit, so that the IC integrated circuit is not disturbed by impurities during testing, improving the reliability of the IC integrated circuit test, and the laser positioning device 64 at the bottom of the rotating plate 65 accurately positions the wiring terminal of the IC integrated circuit, so that the test head 63 can accurately contact the wiring terminal of the IC integrated circuit, ensuring the accuracy of the IC integrated circuit wiring, and making the test result more reliable.

[0069] In another embodiment, the brush 56 cleans dust and impurities by various fiber bristles and electrostatic adsorption; the brush 56 comprises: an electrostatic bristle area 561, a micron fiber bristle area 562, a nanometer fiber bristle area 563, an electrostatic discharge layer 564, an elastic support layer 565, and a brush base 566.

[0070] The electrostatic bristle area 561 is provided with electrostatic adsorption bristles for electrostatic adsorption of dust by electrostatic adsorption bristles; the micron fiber bristle area 562 is provided with micron fiber bristles for cleaning larger particle impurities.

[0071] The nanofiber bristle area 563 is provided with nanoscale fiber bristles for cleaning smaller particle impurities; the elastic support layer 565 is arranged between the micron fiber bristle area 562 and the nanofiber bristle area 563 and the brush base 566, and is made of elastic rubber strips for elastically supporting the micron fiber bristles and nanofiber bristles of the micron fiber bristle area 562 and the nanofiber bristle area 563 to avoid curling of the fiber bristles;

[0072] The electrostatic discharge layer 654 is provided with conductive fibers arranged at intervals with the electrostatic adsorption bristles, one end of the conductive fibers is electrically connected to the electrostatic conduction band, the electrostatic conduction band is electrically connected to the voltage resistance switch, and the voltage resistance switch is electrically connected to the electrostatic discharge grounding end;

[0073] During cleaning, the voltage resistance switch is turned off, the electrostatic discharge layer 654 is not conductive with the electrostatic discharge grounding end, the electrostatic bristle area 561 is not discharged, and dust is electrostatically adsorbed by the electrostatic adsorption bristles;

[0074] After cleaning is completed, the voltage resistance switch is turned on, the electrostatic conduction band is conductive with the electrostatic discharge grounding end, the electrostatic discharge layer 654 discharges static electricity to the electrostatic discharge grounding end through the electrostatic conduction band; after the electrostatic bristle area 561 is discharged, the electrostatically adsorbed dust after cleaning is more easily removed for dust collection and processing.

[0075] The principle and effect include: the surface cleaning degree of IC integrated circuit test is very high; the brush 56 can clean dust and impurities through various fiber bristles and electrostatic adsorption; various dust can be cleaned; the brush 56 includes: electrostatic bristle area 561, micron fiber bristle area 562, nanometer fiber bristle area 563, electrostatic release layer 654, elastic support layer 565 and brush base 566; the electrostatic bristle area 561 is provided with electrostatic adsorption bristles, which are used for electrostatic adsorption of dust through electrostatic adsorption bristles; the micron fiber bristle area 562 is provided with micron-level fiber bristles, which are used for cleaning larger particle impurities; the nanometer fiber bristle area 563 is provided with nanometer-level fiber bristles, which are used for cleaning smaller particle impurities; dust can be cleaned more thoroughly; different particle size impurities can be cleaned; the elastic support layer 565 is arranged between the micron fiber bristle area 562 and the nanometer fiber bristle area 563 and the brush base 566, and is made of elastic rubber strip, which is used for elastically supporting micron fiber bristles and nanometer fiber bristles of the micron fiber bristle area 562 and the nanometer fiber bristle area 563 to avoid curling of the fiber bristles; and the surface of the IC integrated circuit can be protected from being scratched; the electrostatic release layer 654 is provided with conductive fibers, which are arranged at intervals between the electrostatic adsorption bristles; one end of the conductive fibers is electrically connected to the electrostatic conduction belt, the electrostatic conduction belt is electrically connected to the voltage resistance switch, and the voltage resistance switch is electrically connected to the electrostatic release grounding end; during cleaning, the voltage resistance switch is turned off, the electrostatic release layer 654 is not conductive to the electrostatic release grounding end, the electrostatic bristle area 561 is not electrostatically released, and dust is electrostatically adsorbed through the electrostatic adsorption bristles; after cleaning, the voltage resistance switch is turned on, the electrostatic conduction belt is conductive to the electrostatic release grounding end, and the electrostatic release layer 654 releases electrostatic through the electrostatic conduction belt; after the electrostatic release of the electrostatic bristle area 561, the electrostatically adsorbed dust after cleaning is easier to fall off for dust collection and treatment; the cleaning effect of the surface of the IC integrated circuit is significantly improved; the interference factors of the IC integrated circuit test are significantly reduced; and the surface protection effect during the IC integrated circuit test is significantly improved.

[0076] In another embodiment, the laser positioning device 64 includes:

[0077] The precise bidirectional grating 641 and the positioning scale disc 642, the laser ray mechanism 643 and the reflected photoelectric conversion mechanism 644 and the detection positioning control module 645; the precise bidirectional grating 641 is arranged on the positioning scale disc 642, which is a longitudinal and transverse bidirectional grating with the center point of the positioning scale disc 642 as the center, and detects the longitudinal coordinate and the transverse coordinate of the positioning point of the IC integrated circuit respectively.

[0078] The positioning scale disc 642 is provided as an annular scale disc and is arranged on the bottom surface of the laser positioning device, and is used for detecting the rotation angle of the IC integrated circuit.

[0079] The laser ray mechanism 643 emits a positioning probe laser line to the IC integrated circuit positioning point; the IC integrated circuit positioning point reflects the laser line, which is irradiated to the reflected photoelectric conversion mechanism 644 through the precision bidirectional grating 641;

[0080] The reflected photoelectric conversion mechanism 644 receives the IC integrated circuit positioning point reflected laser line, and converts the positioning point reflected laser line optical signal into a positioning detection electrical signal through photoelectric conversion;

[0081] The detection positioning control module 645 calculates the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning protractor 642 according to the positioning detection electrical signal;

[0082] The positioning protractor 642 center point is established as the coordinate origin of the spatial positioning coordinate system; the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning protractor 642 is calculated;

[0083] By calculating the distance from the IC integrated circuit positioning point to the center point of the positioning protractor 642, and the angle between the line connecting the IC integrated circuit positioning point to the center point of the positioning protractor 642 and the line connecting the center point of the positioning protractor 642 to the center point of the test head, and combining the direction of the IC integrated circuit positioning point relative to the center point of the positioning protractor 642, the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning protractor 642 is obtained, so as to determine whether the IC integrated circuit and the test head are precisely aligned, and to improve the positioning precision of the IC integrated circuit test.

[0084] The principle and effect include: IC integrated circuit is very precise, precise positioning is very critical in the testing process, the laser positioning device 64 includes: precise bidirectional grating 641 641, positioning protractor 642 642, laser ray mechanism 643 643 and reflected photoelectric conversion mechanism 644 644 and detection positioning control module 645 645; The precise bidirectional grating 641 is arranged on the positioning protractor 642, the longitudinal and transverse bidirectional grating with the center point of the positioning protractor 642 as the center, respectively detects the longitudinal coordinate and transverse coordinate of the IC integrated circuit positioning point; The precise bidirectional grating 641 is arranged in two directions grating ruler perpendicular to each other respectively measures the longitudinal coordinate and transverse coordinate of the positioning point; The positioning protractor 642 is arranged as a ring scale, arranged on the bottom surface of the laser positioning device, used to detect the rotation angle of the IC integrated circuit; The scale mark of the positioning protractor 642 is uniformly marked on the ring surface, the scale mark of the positioning protractor 642 corresponding to the reflected laser line of the IC integrated circuit positioning point, indicating the direction of the IC integrated circuit positioning point relative to the center point of the positioning protractor 642; The laser ray mechanism 643 emits positioning detection laser line to the IC integrated circuit positioning point; The reflected laser line of the IC integrated circuit positioning point is irradiated to the reflected photoelectric conversion mechanism 644 through the precise bidirectional grating 641; The reflected photoelectric conversion mechanism 644 receives the reflected laser line of the IC integrated circuit positioning point, and converts the reflected laser line of the positioning point into positioning detection electrical signal through photoelectric conversion; The detection positioning control module 645 calculates the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning protractor 642 according to the positioning detection electrical signal; Establishes the spatial positioning coordinate system with the center point of the positioning protractor 642 as the coordinate origin; With the center of the ring inner and outer circle as the center point of the positioning protractor 642; The calculation of the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning protractor 642 includes:

[0085]

[0086] Wherein, L represents the distance from the IC positioning point to the center point of the positioning protractor 642; W represents the angle between the line connecting the IC positioning point and the center point of the positioning protractor 642 and the line connecting the center point of the positioning protractor 642 and the center point of the test head; arcsin represents the inverse sine angle conversion calculation; x represents the horizontal coordinate of the IC positioning point on the surface of the test head; y represents the vertical coordinate of the IC positioning point on the surface of the test head; Ho represents the vertical distance between the center point of the positioning protractor 642 and the center point of the test head; by calculating the distance from the IC positioning point to the center point of the positioning protractor 642 and the angle between the line connecting the IC positioning point and the center point of the positioning protractor 642 and the line connecting the center point of the positioning protractor 642 and the center point of the test head, combined with the direction of the IC positioning point relative to the center point of the positioning protractor 642, the spatial coordinate position of the IC positioning point relative to the center point of the positioning protractor 642 is obtained, so as to determine whether the IC and the test head are precisely aligned; according to the three positioning principles of distance, angle and direction, accurate positioning during the IC testing process can be carried out; the positioning accuracy during the IC testing process is significantly improved.

[0087] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0088] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application.

Claims

1. An IC integrated circuit reliability test machine, comprising a rack (1), a side support plate (4) and a support seat (7), characterized in that, The rack (1) is provided with a conveying assembly (2), the conveying assembly (2) is provided with a placing groove (3), both sides of the rack (1) are fixedly provided with a supporting seat (7), the supporting seat (7) is fixedly provided with a mounting assembly (8), the mounting assembly (8) is provided with a testing assembly (6), both sides of the upper surface of the rack (1) are provided with a side supporting plate (4), the side supporting plate (4) is provided with a cleaning assembly (5), and the right side of the cleaning assembly (5) is provided with a heating cavity (9); The testing assembly (6) comprises a mounting sleeve (61), a movable assembly (62), a testing head (63), a laser positioning device (64), a rotating plate (65), a rotating column (66), a third motor (67) and a stop block (68), the movable assembly (62) is installed in the mounting sleeve (61), the testing head (63) is installed on the movable assembly (62), the rotating column (66) is installed at the bottom of the mounting sleeve (61), the rotating column (66) is provided with a protruding block, the stop block (68) is fixed at the lower surface of the mounting sleeve (61) and located at both sides of the rotating column (66), the rotating column (66) penetrates through the rotating plate (65) and is connected with the output end of the third motor (67), the rotating plate (65) is fixed on the rotating column (66), and the laser positioning device (64) is installed at the bottom of the rotating plate (65) The laser positioning device (64) comprises: a precision bidirectional grating (641), a positioning protractor (642), a laser ray mechanism (643), a reflected photoelectric conversion mechanism (644) and a detection positioning control module (645); the precision bidirectional grating (641) is arranged on the positioning protractor (642), and the longitudinal and transverse bidirectional gratings with the center point of the positioning protractor (642) as the center are arranged to detect the longitudinal coordinate and transverse coordinate of an IC integrated circuit positioning point respectively; The positioning protractor (642) is arranged as a ring scale disc and is arranged on the bottom surface of the laser positioning device (64) to detect the rotation angle of the IC integrated circuit; The laser ray mechanism (643) emits a positioning detection laser line to the IC integrated circuit positioning point; the IC integrated circuit positioning point reflects the laser line, and the reflected laser line is irradiated to the reflected photoelectric conversion mechanism (644) through the precision bidirectional grating (641); The reflected photoelectric conversion mechanism (644) receives the reflected laser line of the IC integrated circuit positioning point, and converts the positioning point reflected laser line optical signal into a positioning detection electrical signal through photoelectric conversion; The detection positioning control module (645) calculates the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning protractor (642) according to the positioning detection electrical signal, including: Wherein, L represents the distance from IC positioning point to the center point of positioning protractor (642); W represents the angle between the line connecting IC positioning point and the center point of positioning protractor (642) and the line between the center point of positioning protractor (642) and the center point of testing head; represents the inverse sine angle conversion calculation; x represents the horizontal coordinate of IC positioning point on the surface of testing head; y represents the vertical coordinate of IC positioning point on the surface of testing head; Ho represents the vertical distance between the center point of positioning protractor (642) and the center point of testing head; establishing a spatial positioning coordinate system with the center point of the positioning protractor (642) as the coordinate origin; and calculating the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning protractor (642). The distance between the positioning point of the IC integrated circuit and the center point of the positioning protractor (642) is calculated, and the angle between the line connecting the positioning point of the IC integrated circuit and the center point of the positioning protractor (642) and the line connecting the center point of the positioning protractor (642) and the center point of the test head is calculated, combined with the direction of the positioning point of the IC integrated circuit relative to the center point of the positioning protractor (642), to obtain the spatial coordinate position of the positioning point of the IC integrated circuit relative to the center point of the positioning protractor (642), so as to determine whether the IC integrated circuit and the test head are precisely aligned, and to improve the positioning accuracy of the IC integrated circuit test.

2. The IC integrated circuit reliability test machine and test method according to claim 1, wherein, The mounting assembly (8) comprises a support column (81), a top plate (82), a mounting plate (83), a support rod (84), a test system (85) and a moving assembly (86), the support column (81) is fixedly installed with the top plate (82), the lower surface of the top plate (82) is fixedly provided with the support rod (84), the bottom of the support rod (84) is fixed on the mounting plate (83), the mounting plate (83) is provided with the test system (85), and the side edge of the mounting plate (83) is provided with the moving assembly (86).

3. The IC integrated circuit reliability test machine and test method of claim 2, wherein, The test system (85) comprises: a data acquisition unit for acquiring IC integrated circuit test data in real time; a data processing unit for processing transient interference signals by using a sliding average filter and performing normalization processing on the data; a data analysis unit for analyzing the performance of the IC integrated circuit by using the processed data and evaluating the reliability of the IC integrated circuit; a report generation unit for generating a test report containing test conditions, key data charts, failure analysis conclusions and improvement suggestions.

4. The IC integrated circuit reliability test machine and test method of claim 2, wherein, The moving assembly (86) comprises a connecting plate (861), a second moving block (862), a second threaded rod (863) and a fourth motor (864), the connecting plate (861) is fixed on the side edge of the mounting plate (83), the second threaded rod (863) is rotatably installed on the connecting plate (861), one end of the second threaded rod (863) penetrates through the connecting plate (861) and is installed on the output end of the fourth motor (864), and the second moving block (862) is movably installed on the second threaded rod (863).

5. The IC integrated circuit reliability testing machine and testing method according to claim 1, wherein, The conveying assembly (2) comprises a first motor (21), a driving shaft (22), a belt (23), a rack (24) and a driven shaft (25), the first motor (21) is installed on the outer side of the rack (1), the output end of the first motor (21) is connected with the driving shaft (22), the driving shaft (22) is rotatably installed on the inner side of the rack (1), the belt (23) is installed on the driving shaft (22), one end of the belt (23) away from the driving shaft (22) is installed on the driven shaft (25), the driven shaft (25) is installed on the inner side of the rack (1), and the two ends of the belt (23) are provided with the racks (24).

6. The IC integrated circuit reliability test machine and test method of claim 1, wherein, The cleaning assembly (5) comprises a mounting shaft (51), a gear (52), a mounting piece (53), a mounting frame (54), a wiping sponge (55) and a brush (56), both ends of the mounting shaft (51) are provided with the gears (52), the middle of the mounting shaft (51) is fixedly provided with the mounting piece (53), four mounting frames (54) are equidistantly arranged on the mounting piece (53), and the wiping sponge (55) and the brush (56) are respectively arranged on the mounting frames (54).

7. The IC integrated circuit reliability test machine and test method of claim 1, wherein, The movable assembly (62) comprises a second motor (621), a first threaded rod (622), a movable pipe (623), a first moving block (624), a sliding rod (625) and a clamping block (626), the output end of the second motor (621) is connected with the first threaded rod (622), the corresponding surface of the first threaded rod (622) is provided with the sliding rod (625), the first threaded rod (622) and the sliding rod (625) are movably provided with the first moving block (624), the first moving block (624) is provided with the movable pipe (623), and the movable pipe (623) is provided with the clamping block (626).

8. The IC integrated circuit reliability test machine and test method of claim 6, wherein, The brush (56) sweeps dust and impurities through various fiber bristles and electrostatic adsorption; the brush (56) comprises an electrostatic bristle area (561), a micron fiber bristle area (562), a nanometer fiber bristle area (563), an electrostatic release layer (654), an elastic support layer (565) and a brush base (566); The electrostatic bristle area (561) is provided with electrostatic adsorption bristles, which are used for electrostatic adsorption of dust through electrostatic adsorption bristles; the micron fiber bristle area (562) is provided with micron-level fiber bristles, which are used for sweeping larger particle impurities; The nanometer fiber bristle area (563) is provided with nanometer-level fiber bristles, which are used for sweeping smaller particle impurities; the elastic support layer (565) is arranged between the micron fiber bristle area (562) and the nanometer fiber bristle area (563) and the brush base (566), and is made of elastic rubber strips, which are used for elastically supporting the micron fiber bristles and the nanometer fiber bristles of the micron fiber bristle area (562) and the nanometer fiber bristle area (563) to avoid curling of the fiber bristles; The electrostatic release layer (654) is provided with conductive fibers, which are arranged at intervals between the electrostatic adsorption bristles, one end of the conductive fibers is electrically connected with an electrostatic conduction belt, the electrostatic conduction belt is electrically connected with a voltage-resistant switch, and the voltage-resistant switch is electrically connected with an electrostatic release grounding end; During the cleaning process, the voltage-resistant switch is turned off, the electrostatic release layer (654) is not conductive with the electrostatic release grounding end, the electrostatic bristle area (561) is not electrostatically released, and dust is electrostatically adsorbed through the electrostatic adsorption bristles; After the cleaning is completed, the voltage-resistant switch is turned on, the electrostatic conduction belt is conductive with the electrostatic release grounding end, the electrostatic release layer (654) releases electrostatic through the electrostatic conduction belt to the electrostatic release grounding end; after the electrostatic bristle area (561) is electrostatically released, the electrostatically adsorbed dust after the cleaning is completed is more easily detached for dust collection and treatment.

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