A chip guiding jig, a test socket and a test device

Abstract

The present disclosure provides a chip guiding jig, a test socket and a test device. The chip guiding jig is used for positioning and installing a chip in cooperation with the test socket. The chip guiding jig comprises a base, a guiding structure and a first alignment compensation structure. The guiding structure is arranged on the base and defines a guiding channel for guiding the chip into the test socket. The guiding structure is arranged to be movable relative to the base in at least one of a first direction and a second direction. The first alignment compensation structure is arranged on the guiding structure and is used for adjusting the position of the guiding structure relative to the test socket. In the present disclosure, the first alignment compensation structure can automatically correct the position of the guiding structure in the first direction and / or the second direction, so that the guiding channel of the guiding structure is aligned with the test socket. This ensures that the chip can be accurately loaded into the correct position in the test socket after passing through the guiding channel, so as to form a good contact with the test socket, thereby improving the test success rate and efficiency.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of semiconductor technology, and in particular, to a chip guiding jig, a test socket and a test device. BACKGROUND

[0002] In the production process of chips, in order to ensure the stability and reliability of the product in actual use, performance testing (such as aging testing) needs to be performed on the chips. During the testing process, it is necessary to ensure that the chip particles are in good contact with the test socket in the test board, so as to avoid testing failure.

[0003] In the related art, a down pressure jig is usually used to press open the test slot of the test board, and then the chip loading operation is performed. The positioning of the chip particles in the chip test socket mainly relies on the positioning of the pressure head of the down pressure jig. If the position of the pressure head is not accurate, it may cause problems such as misalignment and warping of the chip, resulting in testing failure and affecting the testing efficiency. SUMMARY

[0004] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the protection scope of the claims.

[0005] In a first aspect, the present disclosure provides a chip guiding jig for positioning and installing a chip in cooperation with a test socket. The chip guiding jig comprises:

[0006] a base body;

[0007] a guiding structure arranged on the base body, the guiding structure being configured to define a guiding channel for guiding the chip into the test socket, the guiding structure being arranged to be movable relative to the base body in at least one of a first direction and a second direction, the first direction and the second direction being perpendicular to a guiding direction of the guiding channel;

[0008] a first alignment compensation structure arranged on the guiding structure, the first alignment compensation structure being configured to generate an interaction force between the guiding structure and the test socket to adjust the position of the guiding structure relative to the test socket.

[0009] In some possible embodiments, the first alignment compensation structure comprises a first deviation correction surface formed on an outer wall of the guiding structure.

[0010] The first deviation correction surface is configured to generate a deviation correction force in at least one of the first direction and the second direction by physical contact with the test socket.

[0011] In some possible embodiments, the first deviation correction surface comprises a first guiding inclined surface formed on the outer wall of the guiding structure, the first guiding inclined surface being inclined from an outer side to an inner side of the guiding channel along the guiding direction of the guiding channel, constituting a reverse conical guiding surface.

[0012] In some possible embodiments, the base body comprises a trigger structure, the guide structure is movably connected to the trigger structure, and the guide structure is arranged to be movable relative to the trigger structure in at least one of the first direction and the second direction.

[0013] In some possible embodiments, the trigger structure is in a cylindrical shape, and a part of the inner wall of the trigger structure is outwardly protruded to form a support structure.

[0014] A part of the outer wall of the guide structure is outwardly protruded to form a matching structure, and the support structure and the matching structure are arranged to be at least partially opposite to each other along the guide direction of the guide channel, and the support structure and the matching structure are in rolling connection or sliding connection.

[0015] In some possible embodiments, a part of the surface of the support structure facing the matching structure is recessed to form a first groove along the guide direction of the guide channel.

[0016] A part of the surface of the matching structure facing the support structure is recessed to form a second groove.

[0017] The first groove and the second groove are arranged to be engaged, and a rolling structure is arranged in the first groove and the second groove.

[0018] In some possible embodiments, the rolling structure is in a spherical shape or a cylindrical shape.

[0019] In some possible embodiments, the base body further comprises a first mounting structure, and the first mounting structure is connected to the trigger structure.

[0020] A first reset member is arranged between the first mounting structure and the guide structure, and the first reset member is configured to provide a force to the guide structure to reset the guide structure to an initial position relative to the trigger structure.

[0021] In some possible embodiments, the first reset member comprises:

[0022] A first telescopic spring, and a telescopic direction of the first telescopic spring is parallel to the guide direction of the guide channel.

[0023] At least one ball is arranged between an end of the first telescopic spring and the guide structure, and / or at least one ball is arranged between an end of the first telescopic spring and the first mounting structure.

[0024] In some possible embodiments, a diameter of the ball is greater than an inner diameter of the first telescopic spring.

[0025] In some possible embodiments, the base body further comprises a second mounting structure, and the second mounting structure is movably connected to the first mounting structure and / or the trigger structure.

[0026] In the guide direction of the guide channel, the second mounting structure is arranged to be closer to or farther away from the trigger structure.

[0027] The second mounting structure is configured to be movable relative to the first mounting structure in at least one of the first direction and the second direction.

[0028] In some possible embodiments, the base further comprises a second extension spring, a direction of extension of the second extension spring is parallel to the direction of guidance of the guidance channel, and two ends of the second extension spring are connected to the second mounting structure and the trigger structure respectively.

[0029] According to a second aspect of the present disclosure, a test socket is provided, comprising:

[0030] The chip carrier fixture comprises a plurality of side walls for defining a chip accommodating cavity;

[0031] The second alignment compensation structure is arranged on the side wall of the chip carrier fixture, and is configured to generate an interaction force with the guidance structure of the chip guidance fixture to adjust the position of the guidance structure relative to the test socket.

[0032] The chip guidance fixture is the chip guidance fixture according to the first aspect.

[0033] In some possible embodiments, the second alignment compensation structure comprises a second deviation rectifying surface formed on the inner side wall of the chip carrier fixture, and the second deviation rectifying surface is configured to provide a deviation rectifying force to the guidance structure in at least one of the first direction and the second direction by physical contact with the guidance structure.

[0034] In some possible embodiments, the second deviation rectifying surface comprises a second guidance inclined surface formed on the inner side wall of the chip carrier fixture, the second guidance inclined surface is inclined from the inner side to the outer side of the chip carrier fixture, and constitutes a reverse conical guiding surface.

[0035] According to a third aspect of the present disclosure, a test device is provided, comprising a chip guidance fixture and a test socket, the chip guidance fixture is configured to cooperate with the test socket to position and mount a chip.

[0036] The chip guidance fixture is the chip guidance fixture according to the first aspect of the present disclosure, and / or the test socket is the test socket according to the second aspect of the present disclosure.

[0037] In the chip guidance fixture provided by the present disclosure, the first alignment compensation structure is arranged in the chip guidance fixture, and the second alignment compensation structure is arranged on the test socket, the first alignment compensation structure can automatically rectify the position of the guidance structure in at least one of the first direction and the second direction, so that the guidance channel of the guidance structure is aligned with the test socket, and the chip can be accurately loaded at a correct position in the test socket after passing through the guidance channel, so as to form a good contact with the test socket, and improve the test success rate and efficiency.

[0038] Other aspects can become apparent from a review of the drawings and detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0039] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. In the drawings, like reference numerals are used to represent like elements throughout. The accompanying drawings are of some, but not necessarily all, embodiments of the present disclosure. Other embodiments of the present disclosure can be obtained from an extension of the drawings.

[0040] Figure 1 is a structural schematic diagram of a chip guiding jig according to an exemplary embodiment;

[0041] Figure 2 is a structural schematic diagram of a chip guiding jig (excluding a pressing plate) according to an exemplary embodiment;

[0042] Figure 3 is a structural schematic diagram of a chip guiding jig according to an exemplary embodiment; Figure 2 is a sectional view in the A-A direction of FIG. 1;

[0043] Figure 4 is an exploded view of a chip guiding jig (a pressing plate is not shown) according to an exemplary embodiment;

[0044] Figure 5 is a sectional view in the A-A direction of FIG. 2 of a testing device (a pressing plate is not shown) according to an exemplary embodiment; Figure 2

[0045] Figure 6 is a bottom view of a guiding structure according to an exemplary embodiment.

[0046] Reference Signs:

[0047] a, chip guiding jig; b, testing socket;

[0048] 1, base; 2, guiding structure; 3, first alignment compensation structure; 4, pressing plate; 5, second alignment compensation structure; 6, chip carrier jig;

[0049] 11, triggering structure; 12, first mounting structure; 13, second mounting structure; 14, rolling structure; 15, first reset member; 16, second extension spring;

[0050] 111, support structure; 112, first groove;

[0051] 151, first extension spring; 152, ball;

[0052] ​21, mating structure; 22, guide channel;

[0053] 211, second groove body;

[0054] 31, first deviation rectifying surface;

[0055] 311, first guide inclined surface;

[0056] 41, fixing groove; 42, fixing through hole;

[0057] 51, second deviation rectifying surface;

[0058] 511, second guide inclined surface. DETAILED DESCRIPTION

[0059] To make the objects, technical solutions, and advantages of the embodiments of the present disclosure clearer, the following will be combined with the accompanying drawings for the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments. Obviously, the described embodiments are only some but not all of the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present disclosure. It should be noted that, in the case of no conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other at will.

[0060] Figure 1 is a structural schematic diagram of a chip guide jig a according to an exemplary embodiment; Figure 2 is a structural schematic diagram of the chip guide jig a (except the pressing plate) according to an exemplary embodiment; Figure 3 is a structural schematic diagram of the chip guide jig a according to an exemplary embodiment; Figure 2 is a sectional view in A-A direction of the chip guide jig a according to an exemplary embodiment; Figure 4 is an exploded view of the chip guide jig a (the pressing plate is not shown) according to an exemplary embodiment; Figure 5 is a sectional view in A-A direction of the test device (the pressing plate is not shown) according to an exemplary embodiment; Figure 2 is a sectional view in A-A direction of the test device (the pressing plate is not shown) according to an exemplary embodiment; Figure 6 is a bottom view of the guide structure according to an exemplary embodiment. According to an exemplary embodiment of the present disclosure, the embodiment provides a chip guide jig a for chip positioning and installation in cooperation with a test socket b, as shown in Figure 2 and Figure 3 The chip guide jig a includes a base body 1, a guide structure 2, and a first alignment compensation structure 3.

[0061] As shown in Figure 2 and Figure 3As shown, the guide structure 2 is disposed in the substrate 1. The guide structure 2 defines a guide channel 22 for guiding the chip into the test socket b. The guide structure 2 is configured to move relative to the substrate 1 in a first direction and / or a second direction, both of which are perpendicular to the conduction direction of the guide channel 22. The guide structure 2 is a cylindrical structure with a hollow portion. Figure 3 The Z-direction through guide structure shown in the figure has a hollow portion used to define the guide channel 22 for guiding the chip into the test socket b.

[0062] like Figure 3 As shown, the first alignment compensation structure 3 is disposed on the guide structure 2. The first alignment compensation structure 3 is used to generate an interaction force with the test socket b to adjust the position of the guide structure 2 relative to the test socket b. In one example, the first alignment compensation structure 3 can be a wedge, arc-shaped protrusion, etc., disposed on the outer wall of the cylindrical structure (i.e., the guide structure) to perform alignment compensation through physical contact. In another example, the first alignment compensation structure 3 can be a magnet or an electromagnetic coil. One of the magnet and the electromagnetic coil is disposed on the chip guide fixture a, and the other is disposed on the test socket b. When the chip guide fixture a approaches the test socket b, the magnetic force between the magnet and the electromagnetic coil can drive the guide structure to adjust its position to complete the alignment compensation.

[0063] When placing the chip guide fixture a and the test socket b together, it is difficult to ensure that the chip guide fixture a and the test socket b are in a perfect matching position due to various influencing factors such as mechanical errors. However, in this disclosure, by setting a first alignment compensation structure 3 on the guide structure, when a positional deviation occurs between the chip guide fixture a and the test socket b, such as... Figure 5 As shown, during the process of guiding the chip under pressure, the guide structure 2 can adjust its own position by the interaction force generated by the misalignment between it and the test socket b, so that the position of the guide structure 2 can be corrected back to the correct mating position.

[0064] In one example, such as Figure 2 As shown, the first direction is the length direction of the base 1 ( Figure 2 The x-direction shown in the figure), the second direction is the width direction of base 1 ( Figure 2 As shown in the y-direction, the first and second directions are perpendicular to each other. During the test, the length direction of the chip is parallel to the length direction of the substrate, and the width direction of the chip is parallel to the width direction of the substrate.

[0065] In one exemplary embodiment, such as Figure 2 and Figure 3As shown, the first alignment compensation structure 3 includes a first deviation rectifying surface 31 formed on the outer wall of the guide structure 2, which is configured to generate a deviation rectifying force in the first direction and / or the second direction by physically contacting the test socket b.

[0066] In an example, the first deviation rectifying surface 31 can also be configured to repel the test socket b magnetically. In this example, by passing currents with opposite flow directions through the first deviation rectifying surface 31 and the test socket b, the first deviation rectifying surface 31 and the test socket b are given repulsive electromagnetic forces, so as to have the same effect as physical contact, while also reducing friction between the first deviation rectifying surface 31 and the test socket b, and reducing loss. In this example, in addition to passing currents with opposite flow directions through the first deviation rectifying surface 31 and the test socket b to make them repel each other magnetically, the same-pole magnetic material or the like can also be used, which will not be described in detail here.

[0067] In an example embodiment, as shown in Figure 3 The first deviation rectifying surface 31 includes a first guide inclined surface 311 formed on the outer wall of the guide structure 2, which is inclined from the outer side to the inner side of the guide channel 22 in the guide direction (Z direction shown in Figure 3 The first guide inclined surface 311 constitutes a reverse conical guide surface.

[0068] When the position between the chip guide fixture a and the test socket b deviates, the projection of the guide structure 2 on the horizontal plane of the test socket b will overlap. When the chip guide fixture a approaches the test socket b, the reverse conical guide surface of the guide structure 2 will contact the corresponding structure of the test socket b. Due to the characteristics of the reverse conical guide surface, a force along the normal direction of the inclined surface will be generated at the contact point, which enables the test socket b to provide a force for rectifying the deviation of the chip guide fixture a, and the first guide inclined surface 311 can limit the displacement direction of the chip guide fixture a to complete the deviation rectification of the guide structure 2.

[0069] In an example, as shown in Figure 3 and Figure 6As shown, the first guide bevel 311 is provided with four, four first guide bevel 311 is arranged on the four outer walls of the guide structure 2, four first guide bevel 311 away from the end of the guide structure 2 enclosed into a rectangular profile, the long side of the rectangular profile is parallel to the first direction, the short side of the rectangular profile is parallel to the second direction. When the short side of the rectangular profile deviates from the test socket b, in the process of moving the guide structure 2 towards the test socket b, the first guide bevel 311 corresponding to the aforementioned short side outside the test socket b will contact the test socket b, at the same time the test socket b will give the aforementioned first guide bevel 311 a correction force along the first direction, the guide structure 2 will move along the first direction under the action of the correction force, so that the short side outside the test socket b moves to the range of the test socket b. In another example, when the long side of the rectangular profile deviates from the test socket b, in the process of moving the guide structure 2 towards the test socket b, the first guide bevel 311 corresponding to the aforementioned long side outside the test socket b will contact the test socket b, at the same time the test socket b will give the aforementioned first guide bevel 311 a correction force along the second direction, the guide structure 2 will move along the second direction under the action of the correction force, so that the short side outside the test socket b moves to the range of the test socket b.

[0070] In an exemplary embodiment, as shown in Figure 2 and Figure 3 The base 1 includes a trigger structure 11 for unlocking the clamping mechanism of the test socket b. The guide structure 2 is movably connected with the trigger structure 11, and the guide structure 2 is arranged to be capable of moving relative to the trigger structure 11 along the first direction and / or the second direction.

[0071] In order to fix the chip after being mounted on the test socket b, the test socket b is provided with a clamping mechanism (not shown in the figure) with an opening area smaller than the area of the chip. Therefore, when mounting the chip, the trigger structure 11 needs to unlock and open the opening of the clamping mechanism, so that the chip can be placed into the test socket b. When the trigger structure 11 unlocks the clamping mechanism, the trigger structure 11 is in a fixed state, so the guide structure 2 needs to be movably connected with the trigger structure 11, so that the guide structure 2 can move relative to the trigger structure 11 along the first direction and / or the second direction to complete the correction.

[0072] In an exemplary embodiment, as shown in Figure 2 The trigger structure 11 is in the shape of a cylinder, and part of the inner wall of the trigger structure 11 is protruded to form a support structure 111. Part of the outer wall of the guide structure 2 is protruded outward to form a matching structure 21. Along the direction of the guide channel 22, the support structure 111 and the matching structure 21 are at least partially arranged opposite to each other, and the support structure 111 and the matching structure 21 are in rolling connection or sliding connection.

[0073] AsFigure 2 and Figure 3 As shown in FIG. 2, the guide structure 2 is located in the inner hollow part of the cylindrical trigger structure 11, and is restricted in the inner hollow part of the trigger structure 11 without being taken out by the support force provided by the support structure 111 to the cooperation structure 21. There is a gap between the cooperation structure 21 on the guide structure 2 and the inner wall of the trigger structure 11, so in actual use, the guide structure 2 can not only move along the guide direction of the guide channel 22 in the pressing process, but also can be displaced along the first direction and / or the second direction to complete the deviation correction due to the rolling connection or sliding connection between the support structure 111 and the cooperation structure 21.

[0074] The number of support structures 111 and cooperation structures 21 can be set to be multiple according to the actual structure.

[0075] In an example, as shown in FIG. 2, the support structure 111 and the cooperation structure 21 are respectively provided with two symmetrical ones, and the two support structures 111 are respectively corresponding to the positions of the two cooperation structures 21. By setting two groups of symmetrical support structures 111 and cooperation structures 21, the support force received by the guide structure 2 can be more symmetrical, and the guide structure 2 can be placed more stably in the trigger structure 11 without deviation. Figure 3 In an example embodiment, the support structure 111 is in sliding connection with the cooperation structure 21. When the support structure 111 and the cooperation structure 21 are in sliding connection, it is usually necessary to spray solid lubricant on the surface where the support structure 111 and the cooperation structure 21 contact, or use polytetrafluoroethylene composite material and other materials with self-lubricating properties to reduce the friction coefficient and reduce the loss.

[0076] In an example embodiment, as shown in FIG. 2 and FIG. 3, along the guide direction of the guide channel 22, the part of the surface of the support structure 111 facing the cooperation structure 21 is recessed to form a first groove body 112; the part of the surface of the cooperation structure 21 facing the support structure 111 is recessed to form a second groove body 211; the first groove body 112 and the second groove body 211 are snap-fitted, and the rolling structure 14 is arranged in the first groove body 112 and the second groove body 211.

[0077] Figure 3 Figure 4 As shown in FIG. 2 and FIG. 3, along the guide direction of the guide channel 22, the part of the surface of the support structure 111 facing the cooperation structure 21 is recessed to form a first groove body 112; the part of the surface of the cooperation structure 21 facing the support structure 111 is recessed to form a second groove body 211; the first groove body 112 and the second groove body 211 are snap-fitted, and the rolling structure 14 is arranged in the first groove body 112 and the second groove body 211.

[0078] ​​In the process of deviation correction of the guide structure 2, the guide structure 2 will be displaced relative to the trigger structure 11, and thus the friction between the opposite surfaces of the supporting structure 111 and the cooperating structure 21 will occur and loss will be generated. By opening the first groove 112 on the supporting structure 111, opening the second groove 211 on the cooperating structure 21, and clamping the rolling structure 14 between the two, the sliding friction can be converted into rolling friction, thereby reducing the wear between the guide structure 2 and the trigger structure 11, and improving the service life of the chip guide jig a. And the design of the groove can be used to accommodate the rolling structure 14, preventing the rolling structure 14 from falling off during movement.

[0079] In order to enable the rolling structure 14 to smoothly roll in the first groove 112 and the second groove 211, the depth and width of the first groove 112 and the second groove 211 need to be limited, so that the width of the first groove 112 and the second groove 211 is greater than the width of the rolling structure 14, and the sum of the depths is less than the height of the rolling structure 14.

[0080] In an example, the width of the first groove 112 and the second groove 211 is 0.5 mm greater than the width of the rolling structure 14, and the depth of the first groove 112 and the second groove 211 is one third of the height of the rolling structure 14.

[0081] In an example embodiment, as shown in Figure 3 and Figure 4 The rolling structure 14 is in the shape of a ball or a cylinder.

[0082] When the guide structure 2 is displaced relative to the trigger structure 11, the rolling structure 14 in the shape of a ball or a cylinder can roll in the first groove 112 and the second groove 211 following the displacement, converting the sliding friction between the guide structure 2 and the trigger structure 11 into rolling friction, reducing the friction loss, and prolonging the service life of the product.

[0083] In an example embodiment, as shown in Figures 2 to 4 The base body 1 further comprises a first mounting structure 12 connected with the trigger structure 11; a first reset member 15 is arranged between the first mounting structure 12 and the guide structure 2, and the first reset member 15 is used to provide a force to the guide structure 2 to reset the guide structure 2 to the initial position relative to the trigger structure 11.

[0084] The first mounting structure 12 is fixedly connected with the triggering structure 11, and the method of fixedly connecting can be set at will, such as bolt connection, welding connection, and in the embodiment, the first mounting structure 12 is fixedly connected with the triggering structure 11 by bolts. In addition, the material of the first mounting structure 12 is generally set to be the same as that of the triggering structure 11, so as to ensure that the thermal expansion coefficients are consistent and the influence of temperature change on the structural precision is reduced. The shape of the first mounting structure 12 can be determined according to the overall structural layout, and can be a plate shape, a polygonal frame shape, etc.

[0085] In an example, the first mounting structure 12 is a hollow plate structure, and the shape of the hollow position of the first mounting structure 12 is the same as the shape of the cross section of the guide channel 22, for passing the chip.

[0086] In actual use, the guide structure 2 will displace to a certain extent when the chip guiding jig a is placed in cooperation with the test socket b. After the chip is placed, the chip guiding jig a will be disengaged from the current test socket b and moved to cooperate with other test sockets b which do not place chips. After the chip guiding jig a is moved, the cooperation position of the chip carrying jig 6 with the current test socket b can be different from the cooperation position with the previous test socket b, and therefore, the first reset member 15 is arranged, which can drive the guide structure 2 to be reset to the initial position relative to the triggering structure 11 after use, so as to facilitate the normal operation of the next correction action. Avoiding that the guide structure 2 affects the correction effect due to not being restored to the initial position, and avoiding that the position deviation between the guide structure 2 and the test socket b is too large, so that the guide structure 2 and the test socket b are extruded and damaged.

[0087] In an example embodiment, as shown in Figure 3 and Figure 4 The first reset member 15 includes a first telescopic spring 151 and at least one ball 152. The telescopic direction of the first telescopic spring 151 is parallel to the guide direction of the guide channel 22; the at least one ball 152 is arranged between the end of the first telescopic spring 151 and the guide structure 2, and / or the at least one ball 152 is arranged between the end of the first telescopic spring 151 and the first mounting structure 12. The diameter of the ball 152 is greater than the inner diameter of the first telescopic spring 151, and the first telescopic spring 151 can be arranged in different numbers as needed.

[0088] In an example, as shown in Figure 4As shown, the first telescopic springs 151 are provided in four, and the four first telescopic springs 151 are divided into two groups, and the two groups of first telescopic springs 151 are respectively located between the two matching structures 21 of the guide structure 2 and the first mounting structure 12. The side of the matching structure 21 facing the first mounting structure 12 is partially recessed to form a third groove, and the side of the first mounting structure 12 facing the matching structure 21 is partially recessed to form a fourth groove, and the third groove and the fourth groove are oppositely arranged. In this example, the third groove and the fourth groove are also provided with four respectively according to the number of first telescopic springs 151, and the positions of the third groove and the fourth groove correspond to the positions of the four first telescopic springs 151. Eight balls 152 are provided, and the eight balls 152 are respectively located in the third groove and the fourth groove, and the two ends of the four first telescopic springs 151 are in extrusion contact with the corresponding position of the ball 152, so that the four first telescopic springs 151 are fixed between the first mounting structure 12 and the guide structure 2.

[0089] When the guide structure 2 is displaced for deviation correction, the four first telescopic springs 151 will bend with the movement of the guide structure 2, and the balls 152 will rotate to avoid direct contact between the first telescopic springs 151 and the guide structure 2, thereby reducing the wear of the guide structure 2 and prolonging the service life of the guide structure 2. When the chip placement is completed, the guide structure 2 is lifted, and at this time, since the guide structure 2 no longer contacts the test socket b, the first telescopic spring 151 returns to its initial (unbent) state, and the guide structure 2 also returns to the initial position.

[0090] In an exemplary embodiment, as shown, Figures 2 to 4 The base body 1 further includes a second mounting structure 13, which is movably connected with the first mounting structure 12 and / or the trigger structure 11. In the direction of the guide channel 22, the second mounting structure 13 is arranged to move closer to or away from the trigger structure 11. In the first direction and / or the second direction, the second mounting structure 13 is arranged to move relative to the first mounting structure 12.

[0091] During the process of placing the chip guide jig a in the test socket b, the placement position may deviate, but the test socket b is fixedly arranged, so when the trigger structure 11 contacts the clamping mechanism of the test socket b, the trigger structure 11 will be displaced to a certain extent in at least one of the first direction and the second direction under the action of the test socket b. In this embodiment, the second mounting structure 13 is arranged to move relative to the first mounting structure 12, which can ensure that when the trigger structure 11 is displaced, the first mounting structure 12 connected with the trigger structure 11 can produce a corresponding displacement with the second mounting structure 13, so that no shear force is generated between the two, thereby avoiding damage to the first mounting structure 12 and the second mounting structure 13.

[0092] Meanwhile, when the trigger structure 11 is unlocked by the clamping mechanism of the test socket b, the trigger structure 11 will also be supported upward by the test socket b before the unlocking is completed, and thus a displacement upward will be generated. At this time, since the second mounting structure 13 is movably connected with the trigger structure 11 and / or the first mounting structure 12, the trigger structure 11 can be displaced in the guide direction of the guide channel 22, so as to avoid the extrusion between the trigger structure 11, the first mounting structure 12 and the second mounting structure 13, and prevent the trigger structure 11, the first mounting structure 12 and the second mounting structure 13 from being damaged under the long-term extrusion.

[0093] In an exemplary embodiment, as shown in Figure 4 the base body 1 further comprises a second extension spring 16, the extension direction of the second extension spring 16 is parallel to the guide direction of the guide channel 22, and the two ends of the second extension spring 16 are connected with the second mounting structure 13 and the trigger structure 11 respectively.

[0094] By arranging the second extension spring 16, the second mounting structure 13 can be controlled to move close to or away from the trigger structure 11 along the guide direction of the guide channel 22.

[0095] In an example, as shown in Figure 4 the second extension spring 16 is arranged in four, the first mounting structure 12 is provided with through holes corresponding to the positions of the four second extension springs 16, and the four second extension springs 16 pass through the corresponding through holes and are connected with the second mounting structure 13. Based on this structure, the trigger structure 11 can be controlled to move close to or away from the second mounting structure 13 along the guide direction of the guide channel 22.

[0096] In an exemplary embodiment, as shown in Figure 4 the first mounting structure 12 and the second mounting structure 13 are also provided with a ball 152, the first mounting structure 12 is provided with a fifth groove on the side facing the second mounting structure 13, the second mounting structure 13 is provided with a sixth groove on the side facing the first mounting structure 12, the positions of the fifth groove and the sixth groove correspond to each other, and the ball 152 is arranged in the fifth groove and the sixth groove.

[0097] When the first mounting structure 12 is displaced relative to the second mounting structure 13, the ball 152 can roll in the fifth groove and the sixth groove, so as to reduce the abrasion of the first mounting structure 12 and the second mounting structure 13 when they are relatively displaced, and improve the service life of the first mounting structure and the second mounting structure.

[0098] In an exemplary embodiment, as shown in Figure 1As shown, the chip guiding jig a further comprises a pressing plate 4, and a plurality of fixing grooves 41 are formed on the pressing plate 4, and a plurality of fixing through holes 42 for clamping the substrate 1 are formed in the fixing grooves 41.

[0099] The number and arrangement of the fixing grooves 41 and the fixing through holes 42 can be set according to the arrangement of the socket b to be tested. For example, Figure 1 and Figure 2 As shown, the projection area of the first mounting structure 12 on the horizontal plane is greater than the projection area of the fixing through hole 42 on the horizontal plane, and when the substrate 1 is placed, the trigger structure 11 is first inserted into the fixing through hole 42, at this time, the first mounting structure 12 is clamped on the bottom surface of the fixing groove 41, and then the second mounting structure 13 is fixed on the bottom surface of the fixing groove 41 by means of bolts or the like, thereby completing the installation of the substrate 1.

[0100] In an example, as shown, Figure 1 The fixing grooves 41 are provided in parallel, and nine fixing through holes 42 are uniformly arranged along the length direction of each fixing groove 41, and the substrate 1 is installed in the fixing groove 41 by the second mounting structure 13 and the bolt fixation. When the chip is placed, the pressing plate 4 is moved to drive all the substrates 1 and the guiding structure 2 to move, and since the arrangement has been set according to the arrangement of the socket b to be tested, only one pressing is required to complete the placement of the chip, thereby improving the work efficiency.

[0101] According to an example embodiment of the present disclosure, the present embodiment provides a test socket b, as shown, Figure 5 The test socket b comprises a chip carrying jig 6 and a second alignment compensation structure 5. The chip carrying jig 6 comprises a plurality of side walls for defining a chip accommodating cavity. The second alignment compensation structure 5 is arranged on the side wall of the chip carrying jig 6, and the second alignment compensation structure 5 is used to generate an interaction force with the guiding structure 2 of the chip guiding jig a, so as to adjust the position of the guiding structure 2 relative to the test socket b.

[0102] The main function of the chip carrying jig 6 is to accommodate the chip and provide a test interface for the chip, and the size of the chip accommodating cavity surrounded by the plurality of side walls of the chip carrying jig 6 matches the size of the chip to be tested. The second alignment compensation structure 5 can generate an interaction force with the guiding structure 2, and when the guiding structure 2 in the chip guiding jig a used in cooperation with the test socket b is not provided with the first alignment compensation structure 3, the second alignment compensation structure 5 arranged on the test socket b can also provide a deviation correction force for the guiding structure 2 to complete the deviation correction of the guiding structure 2.

[0103] In an example embodiment, as shown, Figure 5As shown, the second alignment compensation structure 5 includes a second deviation correction surface 51 formed on the inner side wall of the chip carrier fixture 6, and the second deviation correction surface 51 is configured to provide a deviation correction force to the guide structure 2 in the first direction and / or the second direction through physical contact with the guide structure 2.

[0104] In an example, the second deviation correction surface 51 can also be configured to repel the guide structure 2 magnetically. In this example, by passing currents in opposite directions through the second deviation correction surface 51 and the guide structure 2, the second deviation correction surface 51 and the guide structure 2 have repelling electromagnetic forces, which have the same effect as physical contact, while also reducing friction between the second deviation correction surface 51 and the guide structure 2, thereby reducing losses. In this example, in addition to passing currents in opposite directions through the second deviation correction surface 51 and the guide structure 2 to cause them to have repelling magnetic forces, other ways such as using magnetic materials of the same polarity can also be used, which are not described here in more detail.

[0105] In an example embodiment, as shown in Figure 5 The second deviation correction surface 51 includes a second guide inclined surface 511 formed on the inner side wall of the chip carrier fixture 6, and the second guide inclined surface 511 is inclined from the inner side to the outer side of the chip carrier fixture 6, forming a reverse conical guide surface.

[0106] The second guide inclined surface 511 can be provided in multiple, and the multiple second guide inclined surfaces 511 are provided on each inner side wall of the chip carrier fixture 6, and the second guide inclined surfaces 511 are all outwardly folded, and the multiple second guide inclined surfaces 511 collectively form a reverse conical guide surface in the shape of a trumpet mouth. When the guide structure 2 comes into physical contact with the second guide inclined surface 511, the reverse conical guide surface formed by the multiple second guide inclined surfaces 511 provides a deviation correction force to the guide structure 2 to guide the guide structure 2 to move to the correct position.

[0107] According to an example embodiment of the present disclosure, the present embodiment provides a testing device, as shown in Figure 5 The testing device includes a chip guide fixture a and a testing socket b, and the chip guide fixture a is used to cooperate with the testing socket b to position and install a chip. The chip guide fixture a and the testing socket b involved in the present embodiment are the chip guide fixture a and the testing socket b in the foregoing embodiments.

[0108] In actual use, first, the chip guiding jig a is moved to a position corresponding to the test socket b, and then the chip guiding jig a is pressed down to make the chip guiding jig a connected with the test socket b. In the process of pressing down the chip guiding jig a, the trigger structure 11 will unlock the clamping mechanism of the test socket b and open the clamping mechanism, so that the chip can be placed into the test socket b. At the same time, the guiding structure 2 will move to a position perfectly corresponding to the test socket b under the action of the correction force provided by the first alignment compensation structure 3 and the second alignment compensation structure 5, so that the chip can be accurately installed at the target position. When the above work is completed, the chip can be loaded into the test socket b through the guiding channel 22 for testing.

[0109] In the description of the present specification, each embodiment or implementation is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between each embodiment can be referred to each other.

[0110] In the description of the present specification, the description of the terms "embodiment", "exemplary embodiment", "some implementations", "illustrative implementation", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the implementation or example are included in at least one implementation or example of the present disclosure.

[0111] In the present specification, the illustrative description of the above terms does not necessarily refer to the same implementation or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more implementations or examples in a suitable manner.

[0112] In the description of the present disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0113] It can be understood that the terms "first", "second", etc. used in the present disclosure can be used in the present disclosure to describe various structures, but these structures are not limited by these terms. These terms are only used to distinguish the first structure from another structure.

[0114] In one or more drawings, like reference numerals designate identical elements throughout the several views. For the sake of clarity, not every portion of the drawings can be shown to scale. Also, certain portions of the drawings can be exaggerated, including the size of structures, for purposes of illustration. Where appropriate, like reference numerals designate corresponding parts throughout the written description. For the purposes of the present disclosure, the term "or" as used herein means "any one of A or B." Additionally, the term "comprising" is used throughout the written description to mean that the written description includes the recited elements, but not excluding others. The term "coupled" is used herein to express either an indirect or direct electrical connection between two or more elements.

[0115] Finally, it should be noted that the above-described embodiments are merely intended to illustrate the technical solutions of the present disclosure, but not to limit the present disclosure; even though the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalent replacements; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A chip guiding jig, characterized by, A chip guiding jig for chip positioning and installation cooperating with a test socket, the chip guiding jig comprising: a base body; a guiding structure arranged on the base body, the guiding structure being configured to define a guiding passage for guiding a chip into the test socket, the guiding structure being arranged to be movable relative to the base body in at least one of a first direction and a second direction, the first direction and the second direction being perpendicular to a guiding direction of the guiding passage; a first alignment compensation structure arranged on the guiding structure, the first alignment compensation structure being configured to generate an interaction force with the test socket to adjust a position of the guiding structure relative to the test socket; wherein the base body comprises a trigger structure configured to unlock a clamping mechanism of the test socket; a part of an inner wall of the trigger structure is protruded to form a support structure, a part of an outer wall of the guiding structure is protruded to form a cooperating structure, the support structure and the cooperating structure are arranged at least partially opposite to each other along the guiding direction of the guiding passage, the support structure and the cooperating structure are connected in a rolling manner or a sliding manner, so that the guiding structure is capable of being displaced relative to the trigger structure along the first direction and / or the second direction to complete a deviation correction.

2. The chip orientation jig according to claim 1, wherein the first alignment compensation structure comprises a first deviation correction surface formed on the outer wall of the guiding structure; the first deviation correction surface is configured to generate a deviation correction force along at least one of the first direction and the second direction by physical contact with the test socket.

3. The chip orientation jig of claim 2, wherein the first deviation correction surface comprises a first guiding slope formed on the outer wall of the guiding structure, the first guiding slope is inclined from an outer side to an inner side of the guiding passage along the guiding direction of the guiding passage, constituting a reverse conical guiding surface.

4. The die orientation guide of claim 1, wherein the trigger structure is in a cylindrical shape.

5. The chip orientation jig according to claim 4, wherein a part of a surface of the support structure facing the cooperating structure is recessed to form a first groove along the guiding direction of the guiding passage; a part of a surface of the cooperating structure facing the support structure is recessed to form a second groove; the first groove and the second groove are arranged in a snap-fit manner, and a rolling structure is arranged in the first groove and the second groove.

6. The die orientation guide of claim 5, wherein, the rolling structure is in a spherical shape or a cylindrical shape.

7. The die orientation guide of any of claims 3-6, wherein, the base body further comprises a first mounting structure connected with the trigger structure; a first reset member is arranged between the first mounting structure and the guiding structure, the first reset member being configured to provide an acting force to the guiding structure to reset the guiding structure to an initial position relative to the trigger structure.

8. The die orientation guide of claim 7, wherein, the first reset member comprises: a first telescopic spring, a telescopic direction of the first telescopic spring being parallel to the guiding direction of the guiding passage; at least one ball arranged between an end of the first telescopic spring and the guiding structure, and / or arranged between an end of the first telescopic spring and the first mounting structure; wherein a diameter of the ball is greater than an inner diameter of the first telescopic spring.

9. The die orientation guide of claim 7, wherein, the base body further comprises a second mounting structure movably connected with the first mounting structure and / or the trigger structure. The second mounting structure is arranged to be relatively close to or away from the trigger structure in the guide direction of the guide channel. The second mounting structure is arranged to be movable relative to the first mounting structure in at least one of the first direction and the second direction.

10. The die orientation guide of claim 9, wherein, The base further comprises a second telescopic spring, the telescopic direction of the second telescopic spring is parallel to the guide direction of the guide channel, and two ends of the second telescopic spring are connected with the second mounting structure and the trigger structure respectively.

11. A test socket, comprising: Comprise: The chip carrier fixture comprises a plurality of side walls for defining a chip accommodating cavity; The second alignment compensation structure is arranged on the side wall of the chip carrier fixture, and is used to generate an interaction force with the guide structure of the chip guide fixture to adjust the position of the guide structure relative to the test socket. The chip guide fixture is any one of claims 1-10.

12. The test socket of claim 11, wherein, The second alignment compensation structure comprises a second deviation correction surface formed on the inner side wall of the chip carrier fixture, and the second deviation correction surface is configured to provide a deviation correction force to the guide structure in at least one of the first direction and the second direction by physical contact with the guide structure.

13. The test socket of claim 12, wherein, The second deviation correction surface comprises a second guide inclined surface formed on the inner side wall of the chip carrier fixture, the second guide inclined surface is inclined from the inner side to the outer side of the chip carrier fixture, and constitutes an inverted conical guide surface.

14. A test device, characterized by The chip guide fixture and the test socket are used to cooperate to position and install the chip. The chip guide fixture is any one of claims 1-10; and / or the test socket is any one of claims 11-13.

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