Photoelectric conversion device, electronic apparatus, and electronic system

Abstract

The invention discloses a photoelectric conversion device, electronic equipment and an electronic system, and relates to the technical field of electronic equipment, the photoelectric conversion device comprises a first electrical interface, a first switching chip, an optical module and a configuration module, the first switching chip is used for splitting a first high-speed signal into a plurality of second high-speed signals, the first switching chip has a plurality of signal transmission modes, and the configuration module is used for configuring the second high-speed signals. In different signal transmission modes, the first exchange chip is used for splitting the first high-speed signal into different numbers of second high-speed signals. The configuration module is used for reading the identifier of the connector, configuring the signal transmission mode of the first switching chip according to the identifier, and converting the low-speed signal into a low-voltage differential signal. The optical module is used for converting the first high-speed signal into a first optical signal and outputting the first optical signal, and converting the low-voltage differential signal into a second optical signal and outputting the second optical signal. The technical problem that the scale of the electronic system is limited is solved, and the technical effect of increasing the scale of the electronic system is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to photoelectric conversion devices, electronic equipment, and electronic systems. Background Art

[0002] Traditional PCIe (Peripheral Component Interconnect Express) signals only support electrical transmission. Existing interconnect technologies primarily rely on traces on circuit boards, interconnecting heterogeneous resources between different boards using copper cables. This necessitates integrating heterogeneous units such as the CPU (central processing unit), GPU (graphics processing unit), and storage devices into the overall system to directly interconnect PCIe devices. However, as the length of the copper cable increases, the signal transmission rate decreases, and the cable is susceptible to electromagnetic interference, resulting in signal attenuation or instability. Therefore, if the copper cable is too long, signal attenuation will lead to increased data transmission errors, affecting the stability and reliability of the network and limiting the scale of electronic systems. Summary of the Invention

[0003] The present application provides a photoelectric conversion device, an electronic device, and an electronic system to at least solve the problem of limited scale of electronic systems in related technologies.

[0004] The present application provides a photoelectric conversion device, comprising: a first electrical interface, a first switching chip, an optical module and a configuration module, wherein the first electrical interface supports connection with a connector, the first switching chip is connected between the first electrical interface and the optical module, and the configuration module is connected between the first switching chip and the first electrical interface. The first electrical interface is used to transmit a first high-speed signal and a low-speed signal. The first switching chip is used to split the first high-speed signal into a plurality of second high-speed signals, wherein the first switching chip has a plurality of signal transmission modes, and under different signal transmission modes, the first switching chip is used to split the first high-speed signal into a different number of second high-speed signals. The configuration module is used to read the identifier of the connector, configure the signal transmission mode of the first switching chip according to the identifier, and convert the low-speed signal into a low-voltage differential signal. The optical module is used to convert the first high-speed signal into a first optical signal and output it, and to convert the low-voltage differential signal into a second optical signal and output it.

[0005] The present application further provides an electronic device, comprising: an electronic device and the photoelectric conversion device provided in some of the above embodiments, wherein the electronic device comprises a connector, and the first electrical interface of the photoelectric conversion device is connected to the connector.

[0006] The present application also provides an electronic system, comprising: a first electronic device, a second electronic device, and an optical fiber, wherein the first electronic device is the electronic device provided in some of the above embodiments; the second electronic device includes a second optical module, and one end of the optical fiber is connected to the optical module of the first electronic device, and the other end is connected to the second optical module of the second electronic device.

[0007] Through the present application, the first switching chip can split the first high-speed signal into multiple second high-speed signals, and the optical module can convert the second high-speed signal into a first optical signal output. When the optoelectronic conversion device is applied to an electronic device, the electronic device and other devices can interact through optical signals. Among them, the optical signal has low loss during transmission, which can increase the signal transmission distance, thereby increasing the distance between the electronic device and other electronic devices, which is conducive to expanding the scale of the electronic system. In addition, the configuration module can obtain the identifier of the connector through the first electrical interface, and configure the first switching chip to different signal transmission modes according to the identifier of the connector, so that the first switching chip can transmit first high-speed signals of different modes, and then the optoelectronic conversion device can be adapted to different external electronic devices, thereby increasing the adaptation range of the optoelectronic conversion device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0009] Figure 1 A structural block diagram of an electronic system provided in an embodiment of the present application; Figure 2 A structural block diagram of an electronic device provided in an embodiment of the present application; Figure 3 Another structural block diagram of an electronic device provided in an embodiment of the present application; Figure 4 A schematic structural diagram of a photoelectric conversion device provided in an embodiment of the present application; Figure 5 Schematic diagram of signal transmission of a photoelectric conversion device; Figure 6 for Figure 3 A structural block diagram of the photoelectric conversion device in FIG. Figure 7 for Figure 3 Another structural block diagram of the photoelectric conversion device in; Figure 8 Another structural block diagram of an electronic device provided in some embodiments of the present application; Figure 9 A schematic structural diagram of a housing of an electronic device provided in some embodiments of the present application; Figure 10 This is another structural block diagram of an electronic system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0010] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0011] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0012] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0013] Figure 1 This is a structural block diagram of an electronic system 3000 provided in an embodiment of the present application.

[0014] See also Figure 1 The electronic system 3000 includes a first electronic device 3100, a second electronic device 3200 and a signal transmission component 3300. The first electronic device 3100 and the second electronic device 3200 are connected via the signal transmission component 3300, so that signals can be transmitted between the first electronic device 3100 and the second electronic device 3200.

[0015] In some examples, the electronic system 3000 may be a computing device, which may further include a cabinet, the first electronic device 3100 may be a server, and the second electronic device 3200 may be a server. The first electronic device 3100 and the second electronic device 3200 may be disposed in the same cabinet.

[0016] In other examples, the electronic system 3000 may be a computing system, which may include multiple computing devices, which may include cabinets. The first electronic device 3100 and the second electronic device 3200 may be disposed in cabinets of different computing devices.

[0017] In some other embodiments, the first electronic device 3100 may be a server, and the second electronic device 3200 may include a PCIe (Peripheral Component Interconnect Express) endpoint (EP) device. For example, the PCIe endpoint device may include at least one of a graphics card, a high-speed digitizer, a network adapter, a RAID (Redundant Array of Independent Disks) controller, a professional graphics card, a GPU (Graphics Processing Unit), an SSD (Solid State Drive), a high-speed network card, and a video capture card.

[0018] In some examples, the signal transmission component 3300 may be a copper cable. For example, the copper cable may be a DAC (Direct Attach Cable), where the DAC may be used to transmit high-speed signals, such as PCIe signals or PCIe Gen5 x16 signals.

[0019] As copper cables increase in length, the signal transmission rate decreases. Furthermore, copper cables are susceptible to electromagnetic interference, which can lead to signal attenuation or instability. Therefore, if the copper cables are too long, signal attenuation can lead to increased data transmission errors, affecting network stability and reliability and limiting the scalability of electronic system 3000.

[0020] Based on this, an embodiment of the present application provides an electronic device 2000.

[0021] Figure 2 This is a structural block diagram of an electronic device 2000 provided in an embodiment of the present application. Figure 2 In the figure, the bidirectional arrows indicate that signals can be transmitted in both directions between the two devices.

[0022] See also Figure 2The electronic device 2000 includes an electronic device 2100 and a photoelectric conversion device 1000. The electronic device 2100 includes a connector 2110, and the photoelectric conversion device 1000 is connected to the connector 2110. The first high-speed signal output by the electronic device 2100 through the connector 2110 can be transmitted to the photoelectric conversion device 1000. The photoelectric conversion device 1000 is used to convert the first high-speed signal into a first optical signal and output it.

[0023] The electronic device 2100 may output a first high-speed signal through the connector 2110 , wherein the first high-speed signal may be a PCIe signal.

[0024] In some examples, the electronic device 2100 may include: a mainboard assembly, wherein the mainboard assembly includes an electronic device 2120 and a second circuit board, the electronic device 2120 and the connector 2110 may be arranged on the second circuit board, and the electronic device 2120 may be connected to the connector 2110.

[0025] The electronic device 2120 may include a first type of electronic device that can output a PCIe signal in x16 mode, where x16 mode means that the PCIe signal needs to be transmitted through 16 signal transmission channels. The PCIe signal in x16 mode can be simplified to a PCIe x16 signal.

[0026] For example, the first type of electronic device may include: a CPU (central processing unit).

[0027] Illustratively, the connector 2110 includes a plurality of pins, at least some of which are connected to the electronic device 2120 .

[0028] Among the multiple pins of the connector 2110, some pins are high-speed pins and some pins are low-speed pins, wherein the high-speed pins are used to transmit the first high-speed signal and the low-speed pins are used to transmit the low-speed signal, wherein the high-speed pins can be connected to the electronic device 2120.

[0029] In some examples, the low-speed pins of the connector 2110 can be used to transmit low-speed signals, such as a PERIPERIPHERAL COMPONENT INTERCONNECT EXPRESS RESET (PCIe reset) signal and a PRSNT (Presence Detect) signal.

[0030] For example, connector 2110 may be a PCIe slot.

[0031] Figure 3This is another structural block diagram of an electronic device 2000 provided in an embodiment of the present application. Figure 4 This is a structural schematic diagram of a photoelectric conversion device 1000 provided in an embodiment of the present application.

[0032] See also Figure 3 The optoelectronic conversion device 1000 includes: a first electrical interface 100, a first switching chip 200, an optical module 300, and a configuration module 400. The first switching chip 200 is connected between the first electrical interface 100 and the optical module 300, and the configuration module 400 is connected between the first switching chip 200 and the first electrical interface 100.

[0033] See also Figure 4 The photoelectric conversion device 1000 may further include a first circuit board 500 , wherein the first electrical interface 100 , the first switching chip 200 , the optical module 300 and the configuration module 400 may be disposed on the first circuit board 500 .

[0034] The first electrical interface 100 is used to transmit a first high-speed signal, and the first electrical interface 100 supports connection with the connector 2110 .

[0035] For example, the first electrical interface 100 can be coupled to the connector 2110, where "coupled" can indicate, for example, that two or more components are in direct physical or electrical contact, or it can mean that two or more components are not in direct contact with each other but still cooperate or interact with each other. The first electrical interface 100 can be directly connected to the connector 2110, or it can be indirectly connected to the connector 2110 through other structures.

[0036] For example, the first electrical interface 100 may include a plurality of terminals, and the plurality of terminals are connected to a plurality of pins of the connector 2110 in a one-to-one correspondence.

[0037] Among the multiple terminals of the first electrical interface 100 , some terminals are used to transmit high-speed signals, and the other terminals are used to transmit low-speed signals.

[0038] In some examples, the terminal may include gold fingers, and the plurality of gold fingers of the first electrical interface 100 may be sequentially arranged along a portion of the edge of the first circuit board 500 .

[0039] The first switching chip 200 is connected between the first electrical interface 100 and the optical module 300 .

[0040] For example, the first switching chip 200 may be a PCIe switch chip. For example, the PCIe switch is a Broadcom PEX89032 chip. The PCIe switch is configured as a PEX89032 chip in non-transparent bridging (NTB) mode.

[0041] The first switching chip 200 is used to split the first high-speed signal into multiple second high-speed signals, wherein the multiple second high-speed signals can support signal isolation and independent clock domain management.

[0042] The first switching chip 200 has multiple signal transmission modes. In different signal transmission modes, the first switching chip 200 is used to split the first high-speed signal into different numbers of second high-speed signals. The number of second high-speed signals is related to the number of optical modules 300 and the type of external electronic device connected to the electronic device 2000.

[0043] For example, the first high-speed signal may include a PCIe x16 signal, and when the electronic device 2000 interacts with other devices via an x8 signal, the PCIe x16 signal may be split by the first switching chip 200 into two first sub-signals, wherein the first sub-signal is an x8 signal.

[0044] For another example, the first high-speed signal may include a PCIe x16 signal. When the electronic device 2000 interacts with other devices via an x4 signal, the PCIe x16 signal may be split into four first sub-signals by the first switching chip 200, and the first sub-signals are x4 signals.

[0045] See also Figure 3 The configuration module 400 is connected to the first switching chip 200 and the first electrical interface 100 . The configuration module 400 is used to read the identifier of the connector 2110 and configure the signal transmission mode of the first switching chip 200 according to the identifier.

[0046] Specifically, the first switching chip 200 needs to be configured with different signal transmission modes according to the types of external electronic devices connected to the electronic device 2000 , and the connector 2110 can be designed with different identifiers according to the types of external electronic devices.

[0047] The configuration module 400 will configure the first switching chip 200 to different signal transmission modes according to the identifier of the connector 2110 it reads, so that the first switching chip 200 can input or output different numbers of second high-speed signals, and the number of second high-speed signals output by the first switching chip 200 can match the external electronic device, thereby increasing the adaptability range of the optoelectronic conversion device 1000.

[0048] In addition, the configuration module 400 is further configured to convert the low-speed signal into a low-voltage differential signal.

[0049] The low-speed signal may include a PREST signal and a PRSNT signal. The PREST signal may be used to indicate whether the external electronic device connected to the photoelectric conversion apparatus 1000 is in place. The PRSNT signal may be used to reset the external electronic device.

[0050] For example, the electronic device 2000 includes a BMC, and the BMC can be connected to the configuration module 400 through the connector 2110 and the first electrical interface 100 .

[0051] The optical module 300 is configured to convert a first high-speed signal into a first optical signal and output the first optical signal, and to convert a low voltage differential signal into a second optical signal and output the second optical signal.

[0052] By providing the optical module 300, the optoelectronic conversion device 1000 can convert the first type of signal into a first optical signal. This optical signal has minimal transmission loss, thereby improving signal stability and reliability. When the optoelectronic conversion device 1000 is applied to the electronic device 2000, it can increase the distance between the electronic device 2000 and external devices, thereby facilitating an increase in the scale of the electronic system 3000.

[0053] In addition, the optical module 300 can also convert the low-speed signal sent by the configuration module 400 into a second optical signal and send it to an external electronic device, so that the electronic device 2000 can control the external electronic device through the optoelectronic conversion device 1000.

[0054] Among them, the optical module 300 can also convert the low voltage differential signal into a second optical signal to interact with other devices, increasing the types of signals transmitted by the optoelectronic conversion device 1000, making it easier for the electronic device 2000 to control external electronic devices through the optoelectronic conversion device 1000.

[0055] In the optoelectronic conversion device 1000 , a signal can be transmitted from the first electrical interface 100 to the optical module 300 , or from the optical module 300 to the first electrical interface 100 .

[0056] Figure 5 Schematic diagram of signal transmission of the photoelectric conversion device 1000.

[0057] See also Figure 5 When the signal is transmitted from the first electrical interface 100 to the optical module 300, the first electrical interface 100 is used to receive the first high-speed signal S1 and the low-speed signal S3 sent by the connector 2110, and send the first high-speed signal S1 to the first switching chip 200, and send the low-speed signal S3 to the configuration module 400.

[0058] The first switching chip 200 is configured to receive a first high-speed signal S1 , split the first high-speed signal S1 into a plurality of second high-speed signals S11 , and send the split signals to the optical module 300 .

[0059] The optical module 300 is configured to receive the second high-speed signal S11 , convert the second high-speed signal S11 into a first optical signal S2 , and output the first optical signal S2 .

[0060] The configuration module 400 is used to receive the low-speed signal S3, convert the low-speed signal S3 into a low-voltage differential signal (LVDS) S33, and send the low-voltage differential signal S33 to the optical module 300. The optical module 300 is further configured to receive the low voltage differential signal S33 , convert the low voltage differential signal S33 into a second optical signal S4 , and output the second optical signal S4 .

[0061] When the signal is transmitted from the optical module 300 to the first electrical interface 100, the optical module 300 is used to receive multiple first optical signals S2, and convert the multiple first optical signals S2 into multiple second high-speed signals S11 respectively, and send the second high-speed signal S11 to the first switching chip 200, and the optical module 300 receives the second optical signal S4, converts the second optical signal S4 into a low voltage differential signal S33, and sends it to the configuration unit 420.

[0062] The first switching chip 200 is configured to receive a plurality of second high-speed signals S11 , merge the plurality of second high-speed signals S11 into a first high-speed signal S1 , and send the first high-speed signal S1 to the first electrical interface 100 .

[0063] The configuration unit 420 is configured to convert the low voltage differential signal S33 into a low speed signal S3 and send the low speed signal S3 to the first electrical interface 100 .

[0064] The first electrical interface 100 is used to receive a first high-speed signal S1 and a low-speed signal S3 , and send them to the connector 2110 .

[0065] The photoelectric conversion device 1000 can be used as a signal output device, so that the electronic device 2000 can output signals externally through the photoelectric conversion device 1000 , or as a signal input device, so that the electronic device 2000 can input signals internally through the photoelectric conversion device 1000 .

[0066] In some embodiments, the plurality of signal transmission modes include a first signal transmission mode and a second signal transmission mode.

[0067] In which, in the first signal transmission mode, when the signal is transmitted from the first electrical interface 100 to the optical module 300, the first switching chip 200 is used to split the first high-speed signal into two second high-speed signals; when the signal is transmitted from the optical module 300 to the first electrical interface 100, the first switching chip 200 is used to merge the two second high-speed signals into a first high-speed signal.

[0068] For example, the first high-speed signal is a PCIe x16 signal. In the first signal transmission mode, the PCIe x16 signal is split into two x8 signals. In the second signal transmission mode, the PCIe x16 signal is split into four x4 signals.

[0069] Among them, when the electronic device 2000 is externally connected to a server including a CPU through the optoelectronic conversion device 1000, the external electronic device interacts with other devices through a PCIe x16 signal, and the identifier of the connector 2110 is a first identifier. When the identifier read by the configuration module 400 is the first identifier, the configuration module 400 can configure the first switching chip 200 to the first signal transmission mode.

[0070] When the electronic device 2000 is connected to an EP device via the optoelectronic conversion device 1000 and the EP device interacts with other devices via a PCIe x8 signal, the identifier of the connector 2110 can be a second identifier, and the configuration module 400 can configure the first switching chip 200 to a first signal transmission mode. When the signal is transmitted from the first electrical interface 100 to the optical module 300, the first switching chip 200 can split the first high-speed signal into two second high-speed signals, and the optical module 300 can convert the two second high-speed signals into two first optical signals, respectively. The two optical signals can be sent to the two external electronic devices. When the signal is transmitted from the first electrical interface 100 to the optical module 300, the first switching chip 200 can merge the four second high-speed signals into a first high-speed signal.

[0071] When the electronic device 2000 is connected to an EP device via the optoelectronic conversion device 1000 and the EP device interacts with other devices via a PCIe x4 signal, the identifier of the connector 2110 is a third identifier. When the identifier read by the configuration module 400 is the third identifier, the configuration module 400 can configure the first switching chip 200 to the second signal transmission mode. For example, when a signal is transmitted from the first electrical interface 100 to the optical module 300, the first switching chip 200 can split the first high-speed signal into four second high-speed signals, and the optical module 300 can convert the four second high-speed signals into four first optical signals, respectively. The four optical signals can be sent to four external electronic devices. When a signal is transmitted from the optical module 300 to the first electrical interface 100, the first switching chip 200 can merge the four second high-speed signals into a first high-speed signal.

[0072] Among them, the first switching chip 200 can be configured as a first signal transmission mode and a second signal transmission mode, so that the optoelectronic conversion device 1000 can be connected to at least two external devices, thereby improving the adaptability of the optoelectronic conversion device 1000 and making the optoelectronic conversion device 1000 adaptable to device clusters of different sizes.

[0073] Figure 6 for Figure 3 1000 is a block diagram of the structure of the photoelectric conversion device 1000.

[0074] See also Figure 6 In some embodiments, there are multiple optical modules 300. In any signal transmission mode, when a signal is transmitted from the first electrical interface 100 to the optical module 300, one optical module 300 is used to receive at least one second high-speed signal. When a signal is transmitted from the optical module 300 to the first electrical interface 100, one optical module is used to receive at least one first optical signal.

[0075] When a signal is transmitted from the first electrical interface 100 to the optical module 300, one optical module 300 can receive one second high-speed signal, or two or more second high-speed signals. Similarly, when a signal is transmitted from the optical module 300 to the first electrical interface 100, one optical module 300 can receive one first optical signal, or two or more first optical signals.

[0076] By providing a plurality of optical modules 300 , at least part of the second high-speed signal can be transmitted to different optical modules 300 , thereby improving the signal isolation effect of different optical modules 300 .

[0077] See also Figure 6In some embodiments, the number of optical modules 300 is two. In the first signal transmission mode, when the signal is transmitted from the first electrical interface 100 to the optical module 300, one optical module 300 is used to receive a second high-speed signal. When the signal is transmitted from the optical module 300 to the first electrical interface 100, one optical module 300 is used to receive a first optical signal.

[0078] In the related art, the optical module used in the device has a small number of optical transmission channels. By providing two optical modules 300, the number of optical transmission channels in each optical module 300 can be reduced, thereby facilitating the connection of the optoelectronic conversion device 1000 with other electronic devices.

[0079] For example, the optical module 300 may include at least one of a QSFP (quad small form-factor pluggable plus) optical module and an OSFP (octal small form factor pluggable) optical module.

[0080] Among them, QSFP optical modules or OSFP optical modules are commonly used optical modules in existing electronic devices. By designing the optical module 300 as a QSFP optical module or an OSFP optical module, the optoelectronic conversion device 1000 can be easily connected to the optical modules of other electronic devices.

[0081] For example, the second high-speed signal is a PCIe x8 signal, and the first high-speed signal is a PCIe x16 signal.

[0082] Figure 7 for Figure 3 Another structural block diagram of the photoelectric conversion device 1000 in FIG.

[0083] See also Figure 7 In some embodiments, the optical module 300 includes a photoelectric conversion unit 310 and an optical interface 320 , wherein the photoelectric conversion unit 310 is connected to the first switching chip 200 , the configuration module 400 and the optical interface 320 .

[0084] The optical interface 320 includes multiple first optical transmission channels and multiple second optical transmission channels, both of which are connected to the photoelectric conversion unit 310. The first optical transmission channels are used to transmit the first optical signal, and the second optical transmission channels are used to transmit the second optical signal.

[0085] When a signal is transmitted from the optical module 300 to the first electrical interface 100, the photoelectric conversion unit 310 is configured to receive a second high-speed signal, convert the second high-speed signal into a first optical signal, and transmit the first optical signal to a plurality of first optical transmission channels. Furthermore, the photoelectric conversion unit 310 may also be configured to receive a low voltage differential signal, convert the low voltage differential signal into a second optical signal, and transmit the second optical signal to a second optical transmission channel.

[0086] The multiple first optical transmission channels are used to receive and output first optical signals.

[0087] The plurality of second optical transmission channels are used to receive and output second optical signals.

[0088] When a signal is transmitted from the optical module 300 to the first electrical interface 100 , the plurality of first optical transmission channels are used to receive the plurality of first optical signals and send them to the optoelectronic conversion unit 310 .

[0089] The multiple second optical transmission channels are used to receive multiple second optical signals and send them to the photoelectric conversion unit 310 .

[0090] The optoelectronic conversion unit 310 is configured to receive multiple first optical signals, convert each of the multiple first optical signals into multiple second high-speed signals, and send the second high-speed signals to the first switching chip 200. Furthermore, the optoelectronic conversion unit 310 is configured to receive multiple second optical signals, convert each of the second optical signals into low-voltage differential signals, and send the low-voltage differential signals to the configuration module 400.

[0091] Among them, the optical module 300 can convert the signal between electrical signals and optical signals through the optoelectronic conversion unit 310, and the first optical signal and the second optical signal are transmitted through the first optical transmission channel and the second optical transmission channel respectively, so that the first high-speed signal and the low-speed signal can be output together after being converted into optical signals, thereby realizing time division multiplexing of the first high-speed signal and the low-speed signal.

[0092] See also Figure 6 In some embodiments, the first electrical interface 100 includes a plurality of first terminals 110 and a plurality of second terminals 120, wherein the first terminal 110 is connected between the first switching chip 200 and the connector 2110, and the first terminal 110 is used to transmit a first high-speed signal, and the second terminal 120 is connected between the configuration module 400 and the connector 2110, and the second terminal 120 is used to transmit a low-speed signal.

[0093] When a signal is transmitted from the optical module 300 to the first electrical interface 100 , the first terminal 110 is used to receive a first high-speed signal sent by the connector 2110 and send the signal to the first switching chip 200 .

[0094] The second terminal 120 is used to receive the low-speed signal sent by the connector 2110 and send it to the configuration unit 420 .

[0095] With this configuration, the first high-speed signal and the low-speed signal are transmitted through the first terminal 110 and the second terminal 120 respectively, thereby enabling simultaneous transmission of the first high-speed signal and the low-speed signal.

[0096] See also Figure 6 In some embodiments, the configuration module 400 includes: a storage unit 410 and a configuration unit 420 .

[0097] The storage unit 410 is used to store multiple groups of configuration parameters, each group of configuration parameters includes dynamic channel allocation rules.

[0098] For example, the storage unit 410 is provided on the first circuit board 500 (eg Figure 4 shown).

[0099] For example, the storage unit 410 may be a Flash memory, wherein the Flash memory is also called a flash memory, or simply referred to as flash memory.

[0100] The multiple sets of configuration parameters correspond one-to-one to the identifiers of the connectors 2110 , and the dynamic channel allocation rules correspond to the signal transmission modes.

[0101] For example, the multiple groups of configuration parameters include a first group of configuration parameters and a second group of configuration parameters, the first group of configuration parameters corresponds to the first identifier, and the second group of configuration parameters corresponds to the second identifier.

[0102] In some examples, the configuration parameters may also include a PCIe link operating mode, a dynamic channel allocation rule, an NTB address mapping table, and preset SerDes (serial transceiver) equalization parameters.

[0103] For example, PCIe link operating modes can include Upstream, Downstream, and Fabric. Upstream is used to indicate whether the electronic device 2100 connected to the photoelectric conversion device 1000 is an upstream device, and Downstream is used to indicate whether the electronic device 2100 connected to the photoelectric conversion device 1000 is a downstream device. Fabric is used to indicate the link mode of the electronic device 2100.

[0104] The configuration unit 420 is connected to the first electrical interface 100 and the storage unit 410 .

[0105] For example, the configuration unit 420 can be connected to the storage unit 410 via an SPI bus. The exemplary SPI (serial peripheral interface) bus may include a CLK (clock) line, a MOSI (master out slave in) line, a MISO (master in slave out) line, and a CS (chip select) line.

[0106] The configuration unit 420 is configured to read the identifier of the connector 2110 , obtain the dynamic channel allocation rule from the storage unit 410 according to the identifier, and configure the signal transmission mode of the first switching chip according to the dynamic channel allocation rule. Among them, the configuration unit 420 can be connected to the connector 2110 through the first electrical interface 100, and then the configuration unit 420 can read the identifier of the connector 2110 through the first electrical interface 100, and then the configuration unit 420 obtains the corresponding configuration parameters in the storage unit 410 according to the identifier of the connector 2110, and configures the first switching chip 200 according to the configuration parameters.

[0107] During the configuration process, the configuration unit 420 writes a control word into the configuration register of the first switching chip 200 to trigger its internal state machine to perform link training.

[0108] Among them, by setting the configuration unit 420 and the storage unit 410, the configuration unit 420 can obtain configuration parameters from the storage unit 410 to configure the first switching chip 200, so that the signal transmission mode of the first switching chip 200 matches the electronic device 2120 connected to the connector 2110.

[0109] For example, the configuration unit 420 may include a field-programmable gate array (FPGA) or a complex programmable logic device (CPLD).

[0110] When the first switching chip 200 enters the NTB working mode, the parsing engine of the first switching chip 200 decodes the input PCIe TLP (Transaction Layer Packet) in real time and determines the data flow to be directed to the corresponding optical module 300.

[0111] In some examples, the configuration unit 420 is further connected to the optical module 300 and the second terminal 120 .

[0112] When the signal is transmitted from the optical module 300 to the first electrical interface 100, after the configuration unit 420 receives the low-speed signal from the second terminal 120, the configuration unit 420 can convert the low-speed signal into a 600Mbps low-voltage differential signal through encoding and send it to the optical module 300. The optical module 300 can convert the low-voltage differential signal into a second optical signal.

[0113] When a signal is transmitted from the optical module 300 to the first electrical interface 100, the optical module 300 receives the second optical signal and converts the second optical signal into a low-voltage differential signal and sends it to the configuration unit 420. The configuration unit 420 can convert the low-voltage differential signal into a low-speed signal and send it to the second terminal 120. The second terminal 120 is used to receive the low-speed signal and send it to the connector 2110.

[0114] With this configuration, the electronic device 2100 can output or receive low-speed signals through the photoelectric conversion device 1000 , thereby facilitating the electronic device 2100 to monitor and manage the status of the photoelectric conversion device 1000 and the electronic device connected to the photoelectric conversion device 1000 .

[0115] In some embodiments, the photoelectric conversion device 1000 may further include a clock generator 600, which is disposed on the first circuit board 500 (eg, Figure 4 As shown in FIG, the clock generator 600 may be connected to the second terminal 120 of the first electrical interface 100. For example, the plurality of second terminals 120 include a CLK terminal, and the clock generator 600 is connected to the CLK terminal.

[0116] After the optoelectronic conversion device 1000 is powered on, the clock generator 600 is started and sends a 100 MHz reference clock to each clock domain.

[0117] For example, the clock generator 600 may be an RC21008 chip.

[0118] In some embodiments, the optoelectronic conversion device 1000 may further include a second switching chip 700, which may be connected to the second terminal 120 of the first electrical interface 100. For example, the plurality of second terminals may include an I2C (inter-integrated circuit) terminal, and the second switching chip 700 may be connected to the I2C terminal. The second switching chip 700 and the I2C terminal are connected via an I2C bus.

[0119] The second switching chip 700 can be connected to the configuration unit 420, the clock generator 600, the first switching chip 200 and the storage unit 410 respectively through multiple I2C buses. Multiple I2C paths can be expanded through the second switching chip 700, thereby solving the problem of multiple device address conflicts.

[0120] For example, the second switching chip 700 may be a PCA9548 chip.

[0121] In some embodiments, the optoelectronic conversion device 1000 may further include a FRU (field replaceable unit), wherein the FRU may be connected to the second terminal 120 of the first electrical interface 100, and the FRU may store the correspondence between the identifier and the electronic device 2100 or even more information, so that the device information of the optoelectronic conversion device 1000 can be read by setting the FRU.

[0122] In some examples, connector 2110 may be one of a PCIe slot and an MCIO (mini cool edge I / O, multi-channel input / output) slot.

[0123] Figure 8 This is another structural block diagram of an electronic device 2000 provided in some embodiments of the present application.

[0124] See also Figure 8 In some embodiments, the photoelectric conversion device 1000 further includes: an adapter component 800, the adapter component including a second electrical interface 810, an adapter module 820 and a third electrical interface 830, the second electrical interface 810 is connected to the first electrical interface 100, the adapter module 820 is connected between the second electrical interface 810 and the third electrical interface 830, and the third electrical interface 830 is used to connect to the connector 2110, wherein the second electrical interface 810 and the third electrical interface 830 are different.

[0125] In some examples, the first electrical interface 100 is a PCIe male connector, and the connector 2110 is an MCIO female connector. The first electrical interface 100 can only adapt to a PCIe female connector, but cannot adapt to an MCIO female connector.

[0126] The second electrical interface 810 is a PCIe female connector, and thus the second electrical interface 810 can be connected to the first electrical interface 100. The third electrical interface 830 can be a MCIO male connector, and thus the third electrical interface 830 can be electrically connected to the connector 2110. Signals can be transmitted between the second electrical interface 810 and the third electrical interface 830 via the adapter module 820. In this way, the first electrical interface 100 can be connected to the connector 2110 via the adapter assembly 800.

[0127] In other examples, the first electrical interface 100 is an MCIO male connector, and the connector 2110 is a PCIe female connector. The first electrical interface 100 can only adapt to an MCIO female connector and cannot adapt to a PCIe female connector.

[0128] The second electrical interface 810 is a female MCIO connector, and thus the second electrical interface 810 can be connected to the first electrical interface 100. The third electrical interface 830 can be a male PCIe connector, and thus the third electrical interface 830 can be electrically connected to the connector 2110. Signals can be transmitted between the second electrical interface 810 and the third electrical interface 830 via the adapter module 820. In this way, the first electrical interface 100 can be connected to the connector 2110 via the adapter assembly 800.

[0129] In summary, by providing the adapter component 800 , the first electrical interface 100 of the photoelectric conversion device 1000 can be connected to the connector 2110 that is not compatible with the first electrical interface 100 through the adapter component 800 , thereby improving the adaptability of the photoelectric conversion device 1000 .

[0130] In some embodiments, the adapter module includes an adapter card and multiple adapter lines arranged on the adapter card, the second electrical interface and the third electrical interface are arranged on the adapter card, and the multiple adapter lines are connected between the second electrical interface and the third electrical interface.

[0131] For example, the adapter card may include a third circuit board, the second electrical interface 810 and the third electrical interface 830 may be arranged on the third circuit board, there are multiple adapter lines, and the two ends of the adapter lines are respectively connected to the second electrical interface 810 and the third electrical interface 830, so that communication can be achieved between the second electrical interface 810 and the third electrical interface 830.

[0132] In other embodiments, the adapter module includes an adapter harness, which includes a plurality of adapter cables connected between the second electrical interface 810 and the third electrical interface 830 .

[0133] The adapter module is designed in the form of an adapter harness, so that the positions of the second electrical interface 810 and the third electrical interface 830 can be flexibly adjusted, thereby improving the adaptability of the adapter assembly 800.

[0134] See you later Figure 4 In some embodiments, the first circuit board 500 includes a main body 510 and an electrical connection portion 520. The first switching chip 200, the optical module 300, and the configuration module 400 are disposed on the main body 510. The main body 510 can support the first switching chip 200, the optical module 300, and the configuration module 400.

[0135] The main body 510 includes a first edge 511 and a second edge 512, and the extension directions of the first edge 511 and the second edge 512 are different, wherein the electrical connection portion 520 is arranged along a portion of the first edge 511, the optical module 300 is arranged in the main body 510 and protrudes from the second edge 512, and the first electrical interface 100 is arranged on the electrical connection portion 520.

[0136] For example, the main body 510 may be rectangular or approximately rectangular.

[0137] The electrical connection portion 520 is in a strip shape, and the first electrical interface 100 may include a plurality of gold fingers, which are sequentially arranged along the extension direction of the electrical connection portion 520. The electrical connection portion 520 may be plugged into the connector 2110.

[0138] Part of the optical module 300 may protrude from the second edge 512 . In this case, the vertical projection of the optical module 300 on the first circuit board 500 is located outside the first circuit board 500 , thereby facilitating connection between the optical module 300 and the optical fiber.

[0139] In some examples, the photoelectric conversion device 1000 may further include a heat sink 840, which is connected to the optical module 300 so that the heat sink 840 can dissipate heat from the optical module 300. For example, the heat sink 840 may include a plurality of heat dissipation fins.

[0140] In some examples, the photoelectric conversion device 1000 may further include a buck converter and a ceramic capacitor array, and the first electrical interface 100 may further include a power terminal. The power terminal may be connected to a power module in the electronic device 2000 via a connector 2110, so that the power module can power the components on the first circuit board 500 via the power terminal. The buck converter and the ceramic capacitor array may be provided to achieve ripple suppression.

[0141] In some examples, the photoelectric conversion device 1000 may further include an electrostatic protection module. The electrostatic protection module is disposed on the first circuit board 500 and uses an ESD (electrostatic discharge) resistor that can withstand 3kV contact discharge.

[0142] An electrostatic protection module is provided on one side of the optical module 300 , so that the electrostatic protection module can reduce static electricity generated when the optical fiber is plugged in and out of the optical module 300 .

[0143] An electrostatic protection module is provided on one side of the first electrical interface 100 , so that the electrostatic protection module can reduce static electricity generated when the first electrical interface 100 is plugged in or unplugged.

[0144] In some examples, the optical module 300 may further include a temperature compensation circuit including an NTC (negative temperature coefficient) thermistor. The bias current may be adjusted in real time by setting the NTC thermistor.

[0145] In some examples, the optical module 300 may also include a temperature sensor and an optical power sensor, and the photoelectric conversion device 1000 may also include a voltage sensor, which is arranged on a circuit board. The temperature sensor, optical power sensor, and voltage sensor can be connected to the I2C switch via the I2C bus, and report the detection parameters to the BMC via the I2C switch and the second terminal 120.

[0146] Figure 9 This is a structural schematic diagram of a housing 900 of an electronic device 2000 provided in some embodiments of the present application.

[0147] See also Figure 9 When the photoelectric conversion device 1000 is used in an electronic device 2000, the electronic device 2000 further includes a housing 900. The housing 900 defines a storage space, and the electronic device 2100 is disposed in the storage space. The housing 900 is provided with an opening 910. The photoelectric conversion device 1000 is disposed in the storage space, and the optical interface 320 of the optical module 300 of the photoelectric conversion device 1000 is exposed through the opening 910.

[0148] The optical interface 320 is exposed in the opening 910 of the housing 900 , so that the housing 900 can support the photoelectric conversion device 1000 and facilitate the connection between the optical fiber and the optical interface 320 .

[0149] In some examples, the housing 900 may include a first panel, which may be a front panel of the electronic device 2000 .

[0150] In some examples, the housing 900 is provided with a plurality of opening groups 920, each opening group 920 includes at least one opening 910, wherein a photoelectric conversion device 1000 (eg Figure 7 ) optical interface 320 (as shown) Figure 7 ) is arranged in an opening 910 in an opening group 920.

[0151] For example, one optoelectronic conversion device 1000 includes two optical interfaces 320 , and one opening group 920 includes two openings 910 .

[0152] For example, one optoelectronic conversion device 1000 includes four optical interfaces 320 , and one opening group 920 includes four openings 910 .

[0153] In some examples, the width of the first panel in the first direction F1 is greater than the width of the first panel in the second direction F2. When an opening group 920 includes multiple openings 910, the multiple openings 910 in an opening group 920 can be arranged sequentially along the second direction F2.

[0154] In some examples, the plurality of openings 910 can be divided into a first opening group 930 and a second opening group 940, each including at least one opening group 920. The first opening group 930 and the second opening group 940 are respectively disposed at both ends of the first panel in the first direction F1.

[0155] For example, the first opening group 930 may include three opening groups 920 , and the second opening group 940 may include three opening groups 920 .

[0156] In some examples, the electronic device 2000 may further include a baffle, which may be disposed within the opening 910 . The baffle may be located within the gap between the optical interface 320 and the edge of the opening 910 , thereby reducing the shaking of the optical interface 320 and improving the stability of the installation of the photoelectric conversion device 1000 .

[0157] Figure 10 This is another structural block diagram of an electronic system 3000 provided in an embodiment of the present application.

[0158] See also Figure 10 The electronic device 2000 described above can be applied to an electronic system 3000. In the electronic system 3000, the first electronic device 3100 can be the electronic device 2000 provided in the embodiment of the present application, and the second electronic device 3200 includes a second optical module 3210. The signal transmission element 3300 can include an optical fiber, one end of which is connected to the optical module 300 of the photoelectric conversion device 1000 of the first electronic device 3100, and the other end of which is connected to the second optical module 3210 of the second electronic device 3200.

[0159] Since the electronic system 3000 provided in the embodiment of the present application includes all the structures of the photoelectric conversion device 1000 provided in some of the above embodiments, and therefore, since the electronic system 3000 provided in the embodiment of the present application includes all the beneficial effects of the photoelectric conversion device 1000 provided in some of the above embodiments, they will not be described in detail here.

[0160] In some embodiments, the second electronic device 3200 may include an EP device. In this example, the first electronic device 3100 may be a server including a CPU, and the second electronic device 3200 may be an EP device.

[0161] See you later Figure 1In other embodiments, the second electronic device 3200 may be the electronic device 2000 provided in the embodiments of the present application. The second electronic device 3200 includes a photoelectric conversion device 1000, and the two ends of the optical fiber are respectively connected to the optical module 300 of the photoelectric conversion device 1000 of the first electronic device 3100 and the optical module 300 of the photoelectric conversion device 1000 of the second electronic device 3200. The optical module 300 of the photoelectric conversion device 1000 of the second electronic device 3200 may serve as a second optical module 3210.

[0162] For example, the electronic device 2120 of the electronic apparatus 2100 of the first electronic device 3100 and the second electronic device 3200 may include a CPU.

[0163] By providing a photoelectric conversion device 1000 within an electronic device 2000, the photoelectric conversion device 1000 can convert electrical signals into optical signals for output, allowing the electronic device 2000 to be connected to another electronic device 2000 via optical fiber. The low transmission loss of optical signals within optical fibers allows long-distance signal transmission between two electronic devices 2000 via optical fibers, breaking the traditional distance limitations of electrical signal transmission and enabling low-loss optical interconnection at the hundred-meter level. This can increase the distance between the two electronic devices 2000, thereby facilitating an increase in the scale of the electronic system 3000. Furthermore, due to the low loss of optical signals, signal stability and reliability can be improved.

[0164] The above is a detailed introduction to a photoelectric conversion device, electronic device, and electronic system provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A photoelectric conversion device, characterized in that: include: a first electrical interface, a first switching chip, an optical module, and a configuration module, wherein the first electrical interface supports connection with a connector, the first switching chip is connected between the first electrical interface and the optical module, and the configuration module is connected between the first switching chip and the first electrical interface; Wherein, the first electrical interface is used to transmit a first high-speed signal and a low-speed signal; The first switching chip is used to split the first high-speed signal into multiple second high-speed signals, wherein the first switching chip has multiple signal transmission modes, and in different signal transmission modes, the first switching chip is used to split the first high-speed signal into different numbers of second high-speed signals; The configuration module is used to read the identifier of the connector, configure the signal transmission mode of the first switching chip according to the identifier, and convert the low-speed signal into a low-voltage differential signal; The optical module is configured to convert the first high-speed signal into a first optical signal and output the first optical signal, and to convert the low voltage differential signal into a second optical signal and output the second optical signal.

2. The photoelectric conversion device according to claim 1, wherein The multiple signal transmission modes include a first signal transmission mode and a second signal transmission mode; Wherein, in the first signal transmission mode, the first switching chip is used to split the first high-speed signal into two second high-speed signals; In the second signal transmission mode, the first switching chip is used to split the first high-speed signal into four second high-speed signals.

3. The photoelectric conversion device according to claim 2, wherein There are multiple optical modules, and in any of the signal transmission modes, one optical module is used to receive at least one second high-speed signal.

4. The photoelectric conversion device according to claim 2, wherein The number of the optical modules is two; In the first signal transmission mode, one of the optical modules is used to receive one of the second high-speed signals; In the second signal transmission mode, one optical module is used to receive two second high-speed signals.

5. The photoelectric conversion device according to any one of claims 1 to 4, characterized in that The optical module includes a photoelectric conversion unit and an optical interface, the photoelectric conversion unit is connected to the first switching chip, the configuration module and the optical interface, and the photoelectric conversion unit is used to: convert the second high-speed signal into a first optical signal, and convert the low voltage differential signal into the second optical signal; The optical interface includes multiple first optical transmission channels and multiple second optical transmission channels, and the first optical transmission channels and the second optical transmission channels are both connected to the photoelectric conversion unit, wherein the first optical transmission channel is used to transmit the first optical signal, and the second optical transmission channel is used to transmit the second optical signal.

6. The photoelectric conversion device according to claim 5, wherein The first electrical interface includes multiple first terminals and multiple second terminals, wherein the first terminals are connected between the first switching chip and the connector, and the first terminals are used to transmit the first high-speed signals; the second terminals are connected between the configuration module and the connector, and the second terminals are used to transmit the low-speed signals.

7. The photoelectric conversion device according to any one of claims 1 to 4, characterized in that The configuration module includes: a storage unit, the storage unit being configured to store multiple groups of configuration parameters, each group of configuration parameters including a dynamic channel allocation rule; A configuration unit is connected to the first electrical interface and the storage unit, and is used to read the identifier of the connector, obtain the dynamic channel allocation rule from the storage unit according to the identifier, and configure the signal transmission mode of the first switching chip according to the dynamic channel allocation rule.

8. The photoelectric conversion device according to any one of claims 1 to 4, characterized in that Also includes: An adapter component includes a second electrical interface, an adapter module and a third electrical interface, the second electrical interface is connected to the first electrical interface, the adapter module is connected between the second electrical interface and the third electrical interface, and the third electrical interface is used to connect to the connector, wherein the second electrical interface and the third electrical interface are different.

9. The photoelectric conversion device according to claim 8, wherein The adapter module includes an adapter card and a plurality of adapter lines arranged on the adapter card. The second electrical interface and the third electrical interface are arranged on the adapter card. The plurality of adapter lines are connected between the second electrical interface and the third electrical interface.

10. The photoelectric conversion device according to claim 8, wherein The adapter module includes an adapter harness, and the adapter harness includes a plurality of adapter cables connected between the second electrical interface and the third electrical interface.

11. The photoelectric conversion device according to any one of claims 1 to 4, characterized in that: Also includes: A first circuit board, the first circuit board includes a main body and an electrical connection part, the first electrical interface, the first switching chip, the optical module and the configuration module are arranged on the main body, the main body includes a first edge and a second edge, the first edge and the second edge extend in different directions, wherein the electrical connection part is arranged along a portion of the first edge, the optical module is arranged on the main body and protrudes from the second edge, and the first electrical interface is arranged on the electrical connection part.

12. An electronic device, characterized in that: include: An electronic device comprising a connector; The photoelectric conversion device according to any one of claims 1 to 11, wherein the first electrical interface of the photoelectric conversion device is connected to the connector.

13. The electronic device according to claim 12, wherein: Also includes: The housing encloses a storage space in which the electronic device is disposed. The housing is provided with an opening in which the photoelectric conversion device is disposed in the storage space, and an optical interface of an optical module of the photoelectric conversion device is exposed at the opening.

14. An electronic system, characterized in that: a first electronic device, wherein the first electronic device is the electronic device according to claim 12 or 13; a second electronic device, the second electronic device comprising a second optical module; An optical fiber, one end of which is connected to the optical module of the first electronic device, and the other end of which is connected to the second optical module of the second electronic device.

15. The electronic system according to claim 14, wherein: Also includes: The second electronic device is the electronic device according to claim 12 or 13, and the optical module of the photoelectric conversion device of the second electronic device is the second optical module.

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