Photoelectric conversion devices, electronic equipment and electronic systems

Abstract

This application discloses a photoelectric conversion device, electronic device, and electronic system, relating to the field of electronic equipment technology. The device includes: a first electrical interface, a first switching chip, an optical module, and a configuration module. The first switching chip is used to split a first high-speed signal into multiple second high-speed signals. The first switching chip has multiple signal transmission modes, and under different signal transmission modes, the first switching chip is used to split the first high-speed signal into different numbers of second high-speed signals. The configuration module is used to read the connector's identifier, configure the signal transmission mode of the first switching chip according to the identifier, and convert low-speed signals into low-voltage differential signals. The optical module is used to convert the first high-speed signal into a first optical signal and output it, and to convert the low-voltage differential signal into a second optical signal and output it. This solves the technical problem of limited scale in electronic systems and achieves the technical effect of increasing the scale of electronic systems.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to photoelectric conversion devices, electronic equipment and electronic systems. Background Technology

[0002] Traditional PCIe (Peripheral Component Interconnect Express, a high-speed serial computer expansion bus standard) signals only support dielectric transmission. Current interconnect technologies primarily connect via traces on circuit boards, using copper cables to interconnect heterogeneous resources between different boards. This necessitates integrating heterogeneous units such as CPUs (central processing units), GPUs (graphics processing units), and storage devices into the entire machine to achieve direct interconnection of PCIe devices. However, as the length of the copper cable increases, the signal transmission rate decreases, and copper cables are susceptible to electromagnetic interference, leading to signal attenuation or instability. Therefore, excessively long copper cables result in signal attenuation, increasing the data transmission error rate and affecting network stability and reliability, thus limiting the scale of electronic systems. Summary of the Invention

[0003] This application provides a photoelectric conversion device, electronic device, and electronic system to at least solve the problem of the limited size of electronic systems in the related art.

[0004] This application provides a photoelectric conversion device, including: a first electrical interface, a first switching chip, an optical module, and a configuration module. The first electrical interface supports connection to a connector. The first switching chip is connected between the first electrical interface and the optical module. The configuration module is connected between the first switching chip and the first electrical interface. The first electrical interface is used to transmit a first high-speed signal and a low-speed signal. The first switching chip is used to split the first high-speed signal into multiple second high-speed signals. The first switching chip has multiple signal transmission modes, and under different signal transmission modes, the first switching chip is used to split the first high-speed signal into different numbers of second high-speed signals. The configuration module is used to read the connector's identifier, configure the signal transmission mode of the first switching chip according to the identifier, and convert the low-speed signal into a low-voltage differential signal. The optical module is used to convert the first high-speed signal into a first optical signal and output it, and to convert the low-voltage differential signal into a second optical signal and output it.

[0005] This application also provides an electronic device, including: an electronic device and the photoelectric conversion device provided in some of the above embodiments. The electronic device includes a connector, and a first electrical interface of the photoelectric conversion device is connected to the connector.

[0006] This application also provides an electronic system, including: a first electronic device, a second electronic device, and an optical fiber. The first electronic device is the electronic device provided in some of the above embodiments. The second electronic device includes a second optical module, with one end of the optical fiber connected to the optical module of the first electronic device and the other end connected to the second optical module of the second electronic device.

[0007] This application allows a first switching chip to split a first high-speed signal into multiple second high-speed signals, and an optical module to convert the second high-speed signals into a first optical signal for output. When the photoelectric conversion device is applied to electronic devices, the electronic devices can interact with other devices via optical signals. Optical signals experience lower transmission loss, thus increasing the signal transmission distance and consequently the distance between electronic devices, thereby expanding the scale of the electronic system. Furthermore, the configuration module can obtain the connector's identifier through the first electrical interface and configure the first switching chip to different signal transmission modes based on the identifier. This enables the first switching chip to transmit different modes of the first high-speed signal, allowing the photoelectric conversion device to be adapted to different external electronic devices, thereby increasing its compatibility. Attached Figure Description

[0008] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 A structural block diagram of an electronic system provided in an embodiment of this application;

[0010] Figure 2 This is a structural block diagram of an electronic device provided in an embodiment of this application;

[0011] Figure 3 This is another structural block diagram of an electronic device provided in an embodiment of this application;

[0012] Figure 4 This is a schematic diagram of the structure of a photoelectric conversion device provided in an embodiment of this application;

[0013] Figure 5 This is a schematic diagram of signal transmission in a photoelectric conversion device;

[0014] Figure 6 for Figure 3 A structural block diagram of the photoelectric conversion device in the diagram;

[0015] Figure 7 for Figure 3 Another structural block diagram of the photoelectric conversion device in the diagram;

[0016] Figure 8 This is another structural block diagram of an electronic device provided in some embodiments of this application;

[0017] Figure 9 A schematic diagram of the structure of a housing for an electronic device provided in some embodiments of this application;

[0018] Figure 10 This is another structural block diagram of an electronic system provided in an embodiment of this application. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0020] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0021] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] Figure 1 This is a structural block diagram of an electronic system 3000 provided in an embodiment of this application.

[0023] Please see Figure 1 The electronic system 3000 includes a first electronic device 3100, a second electronic device 3200, and a signal transmission device 3300. The first electronic device 3100 and the second electronic device 3200 are connected through the signal transmission device 3300, thereby enabling signal transmission between the first electronic device 3100 and the second electronic device 3200.

[0024] In some examples, electronic system 3000 can be a computing device, which may also include a server rack. First electronic device 3100 can be a server, and second electronic device 3200 can be a server. First electronic device 3100 and second electronic device 3200 can be housed in the same server rack.

[0025] In other examples, electronic system 3000 may be a computing system, which may include multiple computing devices, each including a cabinet, and a first electronic device 3100 and a second electronic device 3200 may be housed within the cabinets of different computing devices.

[0026] In other embodiments, the first electronic device 3100 may be a server, and the second electronic device 3200 may include a PCIe (Peripheral Component Interconnect Express) endpoint (EP) device. For example, the PCIe endpoint device may include at least one of the following: a graphics card, a high-speed digitizer, a network adapter, a RAID (Redundant Array of Independent Disks) controller, a professional graphics card, a GPU (Graphics Processing Unit), an SSD (Solid State Drive), a high-speed network card, and a video capture card.

[0027] In some examples, the signal transmission element 3300 can be a copper cable. For example, the copper cable can be a DAC (Direct Attach Cable), where the DAC can be used to transmit high-speed signals, such as PCIe signals or PCIe Gen5 x16 signals.

[0028] As the length of the copper cable increases, the signal transmission rate decreases, and the copper cable becomes more susceptible to electromagnetic interference, leading to signal attenuation or instability. Therefore, if the copper cable is too long, signal attenuation will increase the data transmission error rate, thereby affecting the stability and reliability of the network and limiting the scale of the electronic system 3000.

[0029] Based on this, this application provides an electronic device 2000.

[0030] Figure 2 This is a structural block diagram of an electronic device 2000 provided in an embodiment of this application. It should be noted that, in... Figure 2In the diagram, a double-headed arrow indicates that signals can be transmitted bidirectionally between two devices.

[0031] Please see Figure 2 The electronic device 2000 includes an electronic device 2100 and a photoelectric conversion device 1000. The electronic device 2100 includes a connector 2110, and the photoelectric conversion device 1000 is connected to the connector 2110. The first high-speed signal output by the electronic device 2100 through the connector 2110 can be transmitted to the photoelectric conversion device 1000, which converts the first high-speed signal into a first optical signal and outputs it.

[0032] The electronic device 2100 can output a first high-speed signal through the connector 2110, wherein the first high-speed signal can be a PCIe signal.

[0033] In some examples, electronic device 2100 may include a motherboard assembly, wherein the motherboard assembly includes electronic device 2120 and a second circuit board, electronic device 2120 and connector 2110 may be disposed on the second circuit board, and electronic device 2120 may be connected to connector 2110.

[0034] The electronic device 2120 may include a first type of electronic device that can output a PCIe signal in x16 mode. Here, x16 mode refers to the PCIe signal being transmitted through 16 signal transmission channels. The x16 mode PCIe signal can be simplified to a PCIe x16 signal.

[0035] For example, the first type of electronic device may include: CPU (central processing unit).

[0036] For example, connector 2110 includes a plurality of pins, at least a portion of which are connected to electronic device 2120.

[0037] Among the multiple pins of connector 2110, some pins are high-speed pins and some pins are low-speed pins. The high-speed pins are used to transmit a first high-speed signal, and the low-speed pins are used to transmit a low-speed signal. The high-speed pins can be connected to electronic device 2120.

[0038] In some examples, the low-speed pins of connector 2110 can be used to transmit low-speed signals. For example, low-speed signals may include the PERST (peripheral component interconnect express reset, PCIe reset) signal and the PRSNT (presence detect) signal.

[0039] For example, connector 2110 can be a PCIe slot.

[0040] Figure 3 This is another structural block diagram of an electronic device 2000 provided in an embodiment of this application. Figure 4 This is a schematic diagram of the structure of a photoelectric conversion device 1000 provided in an embodiment of this application.

[0041] Please see Figure 3 The photoelectric conversion device 1000 includes: a first electrical interface 100, a first switching chip 200, an optical module 300, and a configuration module 400. The first switching chip 200 is connected between the first electrical interface 100 and the optical module 300, and the configuration module 400 is connected between the first switching chip 200 and the first electrical interface 100.

[0042] Please see Figure 4 The photoelectric conversion device 1000 may further include a first circuit board 500. The first electrical interface 100, the first switching chip 200, the optical module 300, and the configuration module 400 may be disposed on the first circuit board 500.

[0043] The first electrical interface 100 is used to transmit a first high-speed signal, and the first electrical interface 100 supports connection with connector 2110.

[0044] For example, the first electrical interface 100 can be coupled to the connector 2110. "Coupled" can indicate, for example, that two or more components have direct physical or electrical contact, or it can mean that two or more components do not have direct contact but still cooperate or interact with each other. The first electrical interface 100 can be directly connected to the connector 2110, or it can be indirectly connected to the connector 2110 through other structures.

[0045] For example, the first electrical interface 100 may include multiple terminals, which are connected one-to-one with multiple pins of the connector 2110.

[0046] Among the multiple terminals of the first electrical interface 100, some terminals are used to transmit high-speed signals, and other terminals are used to transmit low-speed signals.

[0047] In some examples, the terminals may include gold fingers, and multiple gold fingers of the first electrical interface 100 may be arranged sequentially along a portion of the edge of the first circuit board 500.

[0048] The first switching chip 200 is connected between the first electrical interface 100 and the optical module 300.

[0049] For example, the first switching chip 200 can be a PCIe switch chip. For instance, the PCIe switch is a Broadcom PEX89032 chip. The PCIe switch, specifically the PEX89032 chip, is configured in non-transparent bridging (NTB) mode.

[0050] The first switching chip 200 is used to split the first high-speed signal into multiple second high-speed signals, wherein the multiple second high-speed signals can support signal isolation and independent clock domain management.

[0051] The first switching chip 200 has multiple signal transmission modes. Under different signal transmission modes, the first switching chip 200 is used to split the first high-speed signal into different numbers of second high-speed signals. The number of second high-speed signals is related to the number of optical modules 300 and the type of external electronic device connected to the electronic device 2000.

[0052] For example, the first high-speed signal may include a PCIe x16 signal, and when the electronic device 2000 interacts with other devices through the x8 signal, the PCIe x16 signal can be split into two first sub-signals by the first switching chip 200, wherein the first sub-signal is the x8 signal.

[0053] For example, the first high-speed signal may include a PCIe x16 signal, and when the electronic device 2000 interacts with other devices through the x4 signal, the PCIe x16 signal can be split into four first sub-signals by the first switching chip 200, and the first sub-signals are x4 signals.

[0054] Please see Figure 3 The configuration module 400 is connected to the first switching chip 200 and the first electrical interface 100. The configuration module 400 is used to read the identifier of the connector 2110 and configure the signal transmission mode of the first switching chip 200 according to the identifier.

[0055] Depending on the type of external electronic device connected to the electronic device 2000, the first switching chip 200 needs to be configured with different signal transmission modes, and the connector 2110 can be designed with different identifiers depending on the type of external electronic device.

[0056] The configuration module 400 will configure the first switching chip 200 to different signal transmission modes according to the identifier of the connector 2110 it reads. Thus, the first switching chip 200 can input or output different numbers of second high-speed signals. In this way, the number of second high-speed signals output by the first switching chip 200 can be matched with the external electronic device, thereby increasing the adaptability range of the photoelectric conversion device 1000.

[0057] In addition, the configuration module 400 is also used to convert low-speed signals into low-voltage differential signals.

[0058] Low-speed signals may include the PERST and PRSNT signals. The PERST signal can be used to indicate whether the external electronic device connected to the photoelectric conversion device 1000 is in place. The PRSNT signal can be used to reset the external electronic device.

[0059] For example, electronic device 2000 includes BMC, which can be connected to configuration module 400 via connector 2110 and first electrical interface 100.

[0060] The optical module 300 is used to convert a first high-speed signal into a first optical signal and output it, and to convert a low-voltage differential signal into a second optical signal and output it.

[0061] By incorporating the optical module 300, the photoelectric conversion device 1000 can convert the first type of signal into a first optical signal. Since optical signals experience minimal transmission loss, this improves signal stability and reliability. When the photoelectric conversion device 1000 is applied to the electronic device 2000, it increases the distance between the electronic device 2000 and external devices, thereby facilitating an increase in the scale of the electronic system 3000.

[0062] In addition, the optical module 300 can convert the low-speed signal sent by the configuration module 400 into a second optical signal and send it to an external electronic device, so that the electronic device 2000 can control the external electronic device through the photoelectric conversion device 1000.

[0063] The optical module 300 can also convert low-voltage differential signals into second optical signals to interact with other devices, increasing the types of signals transmitted by the photoelectric conversion device 1000 and facilitating the electronic device 2000 to control external electronic devices through the photoelectric conversion device 1000.

[0064] In the photoelectric conversion device 1000, the signal can be transmitted from the first electrical interface 100 to the optical module 300, or from the optical module 300 to the first electrical interface 100.

[0065] Figure 5 This is a schematic diagram of the signal transmission of the photoelectric conversion device 1000.

[0066] Please see Figure 5 When a signal is transmitted from the first electrical interface 100 to the optical module 300, the first electrical interface 100 is used to receive the first high-speed signal S1 and the low-speed signal S3 sent by the connector 2110, and sends the first high-speed signal S1 to the first switching chip 200 and the low-speed signal S3 to the configuration module 400.

[0067] The first switching chip 200 is used to receive the first high-speed signal S1, split the first high-speed signal S1 into multiple second high-speed signals S11, and send them to the optical module 300.

[0068] The optical module 300 is used to receive the second high-speed signal S11, convert the second high-speed signal S11 into a first optical signal S2, and output the first optical signal S2.

[0069] The configuration module 400 is used to: receive the low-speed signal S3, convert the low-speed signal S3 into a low-voltage differential signal (LVDS) S33, and transmit the low-voltage differential signal S33 to the optical module 300.

[0070] The optical module 300 is also used to: receive the low-voltage differential signal S33, convert the low-voltage differential signal S33 into a second optical signal S4, and output the second optical signal S4.

[0071] When a signal is transmitted from the optical module 300 to the first electrical interface 100, the optical module 300 is used to receive multiple first optical signals S2, convert the multiple first optical signals S2 into multiple second high-speed signals S11 respectively, and send the second high-speed signals S11 to the first switching chip 200. The optical module 300 receives the second optical signal S4, converts the second optical signal S4 into a low-voltage differential signal S33, and sends it to the configuration unit 420.

[0072] The first switching chip 200 is used to receive multiple second high-speed signals S11, merge the multiple second high-speed signals S11 into a first high-speed signal S1, and send the first high-speed signal S1 to the first electrical interface 100.

[0073] Configuration unit 420 is used to convert low voltage differential signal S33 into low speed signal S3 and send it to first electrical interface 100.

[0074] The first electrical interface 100 is used to receive a first high-speed signal S1 and a low-speed signal S3, and send them to the connector 2110.

[0075] The photoelectric conversion device 1000 can be used as a signal output device, enabling the electronic device 2000 to output signals to the outside through the photoelectric conversion device 1000, or it can be used as a signal input device, enabling the electronic device 2000 to input signals to the inside through the photoelectric conversion device 1000.

[0076] In some embodiments, the multiple signal transmission modes include a first signal transmission mode and a second signal transmission mode.

[0077] In the first signal transmission mode, when the signal is transmitted from the first electrical interface 100 to the optical module 300, the first switching chip 200 is used to split the first high-speed signal into two second high-speed signals. When the signal is transmitted from the optical module 300 to the first electrical interface 100, the first switching chip 200 is used to merge the two second high-speed signals into the first high-speed signal.

[0078] For example, the first high-speed signal is a PCIe x16 signal. In the first signal transmission mode, the PCIe x16 signal is split into two x8 signals. In the second signal transmission mode, the PCIe x16 signal is split into four x4 signals.

[0079] In the case where the electronic device 2000 is connected to an external electronic device including a CPU via the photoelectric conversion device 1000, the external electronic device interacts with other devices via PCIe x16 signals. The identifier of the connector 2110 is the first identifier. When the identifier read by the configuration module 400 is the first identifier, the configuration module 400 can configure the first switching chip 200 to the first signal transmission mode.

[0080] When electronic device 2000 is connected to external electronic devices via photoelectric conversion device 1000, including EP devices, and the EP devices interact with other devices via PCIe x8 signals, the identifier of connector 2110 can be a second identifier. Configuration module 400 can configure first switching chip 200 to a first signal transmission mode. When a signal is transmitted from first electrical interface 100 to optical module 300, first switching chip 200 can split the first high-speed signal into two second high-speed signals. Optical module 300 can convert the two second high-speed signals into two first optical signals, which can then be sent to two external electronic devices respectively. When a signal is transmitted from first electrical interface 100 to optical module 300, first switching chip 200 can merge four second high-speed signals into a first high-speed signal.

[0081] When the electronic device 2000 is connected to an external electronic device via the photoelectric conversion device 1000, including an EP device, and the EP device interacts with other devices via a PCIe x4 signal, the identifier of the connector 2110 is a third identifier. If the identifier read by the configuration module 400 is the third identifier, the configuration module 400 can configure the first switching chip 200 to a second signal transmission mode. For example, when a signal is transmitted from the first electrical interface 100 to the optical module 300, the first switching chip 200 can split the first high-speed signal into four second high-speed signals. The optical module 300 can then convert the four second high-speed signals into four first optical signals, which can be sent to four external electronic devices respectively. When a signal is transmitted from the optical module 300 to the first electrical interface 100, the first switching chip 200 can merge the four second high-speed signals into a first high-speed signal.

[0082] The first switching chip 200 can be configured to a first signal transmission mode and a second signal transmission mode, so that the photoelectric conversion device 1000 can be connected to at least two external devices, thereby improving the adaptability of the photoelectric conversion device 1000 and enabling the photoelectric conversion device 1000 to adapt to equipment clusters of different sizes.

[0083] Figure 6 for Figure 3 The structural block diagram of the photoelectric conversion device 1000 in the middle.

[0084] Please see Figure 6 In some embodiments, there are multiple optical modules 300. In any signal transmission mode, when a signal is transmitted from the first electrical interface 100 to the optical module 300, one optical module 300 is used to receive at least one second high-speed signal. When a signal is transmitted from the optical module 300 to the first electrical interface 100, one optical module is used to receive at least one first optical signal.

[0085] Specifically, when a signal is transmitted from the first electrical interface 100 to the optical module 300, the optical module 300 can receive one second high-speed signal, or two or more second high-speed signals. Similarly, when a signal is transmitted from the optical module 300 to the first electrical interface 100, the optical module 300 can receive one first optical signal, or two or more first optical signals.

[0086] By setting up multiple optical modules 300, at least a portion of the second high-speed signal can be transmitted to different optical modules 300, thereby improving the signal isolation effect of different optical modules 300.

[0087] Please see Figure 6In some embodiments, the number of optical modules 300 is two. In the first signal transmission mode, when a signal is transmitted from the first electrical interface 100 to the optical module 300, one optical module 300 is used to receive a second high-speed signal. When a signal is transmitted from the optical module 300 to the first electrical interface 100, one optical module 300 is used to receive a first optical signal.

[0088] In some related technologies, the optical modules used in the equipment have a relatively small number of optical transmission channels. By setting up two optical modules 300, the number of optical transmission channels in each optical module 300 can be reduced, thereby facilitating the connection of the photoelectric conversion device 1000 with other electronic devices.

[0089] For example, optical module 300 may include at least one of QSFP (quad small form-factor pluggable plus) and OSFP (octal small form-factor pluggable).

[0090] Among them, QSFP optical modules or OSFP optical modules are commonly used optical modules in existing electronic devices. By designing the optical module 300 as a QSFP optical module or OSFP optical module, it is easy for the photoelectric conversion device 1000 to be connected to the optical modules of other electronic devices.

[0091] For example, the second high-speed signal is a PCIe x8 signal, and the first high-speed signal is a PCIe x16 signal.

[0092] Figure 7 for Figure 3 Another structural block diagram of the photoelectric conversion device 1000 in the middle.

[0093] Please see Figure 7 In some embodiments, the optical module 300 includes a photoelectric conversion unit 310 and an optical interface 320, wherein the photoelectric conversion unit 310 is connected to the first switching chip 200, the configuration module 400 and the optical interface 320.

[0094] The optical interface 320 includes multiple first optical transmission channels and multiple second optical transmission channels, both of which are connected to the photoelectric conversion unit 310. The first optical transmission channels are used to transmit first optical signals, and the second optical transmission channels are used to transmit second optical signals.

[0095] When a signal is transmitted from the optical module 300 to the first electrical interface 100, the photoelectric conversion unit 310 is used to: receive a second high-speed signal, convert the second high-speed signal into a first optical signal, and transmit the first optical signal to a plurality of first optical transmission channels. Furthermore, the photoelectric conversion unit 310 can also be used to: receive a low-voltage differential signal, convert the low-voltage differential signal into a second optical signal, and transmit the second optical signal to a second optical transmission channel.

[0096] Multiple first optical transmission channels are used to: receive first optical signals and output them.

[0097] Multiple second optical transmission channels are used to receive second optical signals and output them.

[0098] When a signal is transmitted from the optical module 300 to the first electrical interface 100, the multiple first optical transmission channels are used to: receive multiple first optical signals and send them to the photoelectric conversion unit 310.

[0099] Multiple second optical transmission channels are used to receive multiple second optical signals and send them to the photoelectric conversion unit 310.

[0100] The photoelectric conversion unit 310 is used to: receive multiple first optical signals, convert the multiple first optical signals into multiple second high-speed signals respectively, and send the second high-speed signals to the first switching chip 200. Furthermore, the photoelectric conversion unit 310 is used to: receive multiple second optical signals, convert the second optical signals into low-voltage differential signals respectively, and send the low-voltage differential signals to the configuration module 400.

[0101] The optical module 300 can convert the signal between electrical signal and optical signal through the photoelectric conversion unit 310, and the first optical signal and the second optical signal are transmitted through the first optical transmission channel and the second optical transmission channel respectively. Thus, the first high-speed signal and the low-speed signal can be output together after being converted into optical signals, thereby realizing the time division multiplexing of the first high-speed signal and the low-speed signal.

[0102] Please see Figure 6 In some embodiments, the first electrical interface 100 includes a plurality of first terminals 110 and a plurality of second terminals 120, wherein the first terminals 110 are connected between the first switching chip 200 and the connector 2110 and are used to transmit a first high-speed signal, and the second terminals 120 are connected between the configuration module 400 and the connector 2110 and are used to transmit a low-speed signal.

[0103] When a signal is transmitted from the optical module 300 to the first electrical interface 100, the first terminal 110 is used to receive the first high-speed signal sent by the connector 2110 and send it to the first switching chip 200.

[0104] The second terminal 120 is used to receive low-speed signals sent by connector 2110 and send them to configuration unit 420.

[0105] With this configuration, the first high-speed signal and the low-speed signal are transmitted through the first terminal 110 and the second terminal 120, respectively, thereby enabling the simultaneous transmission of the first high-speed signal and the low-speed signal.

[0106] Please see Figure 6 In some embodiments, the configuration module 400 includes a storage unit 410 and a configuration unit 420.

[0107] Storage unit 410 is used to store multiple sets of configuration parameters, each set of configuration parameters including dynamic channel allocation rules.

[0108] For example, storage unit 410 is disposed on first circuit board 500 (e.g., Figure 4 (As shown).

[0109] For example, storage unit 410 can be a Flash memory, also known as a flash memory or simply flash storage.

[0110] Multiple sets of configuration parameters correspond one-to-one with the identifiers of connector 2110, while the dynamic channel allocation rules correspond to the signal transmission modes.

[0111] For example, the multiple sets of configuration parameters include a first set of configuration parameters and a second set of configuration parameters, where the first set of configuration parameters corresponds to a first identifier and the second set of configuration parameters corresponds to a second identifier.

[0112] In some examples, configuration parameters may also include PCIe link operating mode, dynamic channel allocation rules, NTB address mapping table, and preset SerDes (serial transceiver) equalization parameters.

[0113] For example, the PCIe link operating modes may include Upstream, Downstream, and Fabric. Upstream indicates whether the electronic device 2100 connected to the optoelectronic conversion device 1000 is an upstream device, Downstream indicates whether the electronic device 2100 connected to the optoelectronic conversion device 1000 is a downstream device, and Fabric indicates the connection method of the electronic device 2100.

[0114] Configuration unit 420 is connected to first electrical interface 100 and storage unit 410.

[0115] For example, configuration unit 420 can be connected to storage unit 410 via SPI bus. The example SPI (serial peripheral interface) bus may include CLK (clock) line, MOSI (master outslave in) line, MISO (master inslave out) line and CS (Chip Select) line.

[0116] The configuration unit 420 is used to read the identifier of the connector 2110, obtain the dynamic channel allocation rule from the storage unit 410 according to the identifier, and configure the signal transmission mode of the first switching chip according to the dynamic channel allocation rule.

[0117] The configuration unit 420 can be connected to the connector 2110 through the first electrical interface 100. Then, the configuration unit 420 can read the identifier of the connector 2110 through the first electrical interface 100. Then, the configuration unit 420 obtains the corresponding configuration parameters from the storage unit 410 according to the identifier of the connector 2110, and configures the first switching chip 200 according to the configuration parameters.

[0118] During the configuration process, the configuration unit 420 writes a control word to the configuration register of the first switching chip 200, triggering its internal state machine to execute link training.

[0119] In this configuration, by setting up a configuration unit 420 and a storage unit 410, the configuration unit 420 can obtain configuration parameters from the storage unit 410 to configure the first switching chip 200, thereby making the signal transmission mode of the first switching chip 200 match the electronic device 2120 connected to the connector 2110.

[0120] For example, configuration unit 420 may include an FPGA (field-programmable gate array) or a CPLD (complex programmable logic device).

[0121] When the first switching chip 200 enters the NTB working mode, the parsing engine of the first switching chip 200 will decode the input PCIe TLP (Transaction Layer Packet) in real time and determine the data flow to be directed to the corresponding optical module 300.

[0122] In some examples, configuration unit 420 is also connected to optical module 300 and second terminal 120.

[0123] When a signal is transmitted from the optical module 300 to the first electrical interface 100, after the configuration unit 420 receives the low-speed signal from the second terminal 120, the configuration unit 420 can encode the low-speed signal into a 600Mbps low-voltage differential signal and send it to the optical module 300. The optical module 300 can then convert the low-voltage differential signal into a second optical signal.

[0124] When a signal is transmitted from the optical module 300 to the first electrical interface 100, after receiving the second optical signal, the optical module 300 converts the second optical signal into a low-voltage differential signal and sends it to the configuration unit 420. The configuration unit 420 can then convert the low-voltage differential signal into a low-speed signal and send it to the second terminal 120. The second terminal 120 is used to receive the low-speed signal and send it to the connector 2110.

[0125] With this configuration, the electronic device 2100 can output or receive low-speed signals through the photoelectric conversion device 1000, thereby facilitating the electronic device 2100 to monitor and manage the status of the photoelectric conversion device 1000 and the electronic equipment connected to the photoelectric conversion device 1000.

[0126] In some embodiments, the photoelectric conversion device 1000 may further include a clock generator 600, the clock generator 600 being disposed on the first circuit board 500 (e.g., Figure 4 As shown, clock generator 600 can be connected to a second terminal 120 of first electrical interface 100. For example, among the plurality of second terminals 120 is a CLK terminal, to which clock generator 600 is connected.

[0127] After the photoelectric conversion device 1000 is powered on, the clock generator 600 starts and sends a 100 MHz reference clock to each clock domain.

[0128] For example, clock generator 600 can be an RC21008 chip.

[0129] In some embodiments, the photoelectric conversion device 1000 may further include a second switching chip 700, which may be connected to a second terminal 120 of the first electrical interface 100. For example, among the plurality of second terminals is an I2C (inter-integrated circuit) terminal, and the second switching chip 700 may be connected to the I2C terminal, with the second switching chip 700 and the I2C terminal connected via an I2C bus.

[0130] The second switching chip 700 can be connected to the configuration unit 420, the clock generator 600, the first switching chip 200 and the storage unit 410 through multiple I2C buses. Multiple I2C paths can be extended through the second switching chip 700, thereby solving the problem of address conflicts between multiple devices.

[0131] For example, the second switching chip 700 can be a PCA9548 chip.

[0132] In some embodiments, the photoelectric conversion device 1000 may further include an FRU (field replaceable unit), wherein the FRU may be connected to the second terminal 120 of the first electrical interface 100, and the FRU may store the correspondence between identifiers and electronic devices 2100 or even more information, so as to facilitate the reading of device information of the photoelectric conversion device 1000.

[0133] In some examples, connector 2110 can be one of a PCIe slot and an MCIO (mini cool edge I / O, multi-channel input / output) slot.

[0134] Figure 8 Another structural block diagram of an electronic device 2000 provided for some embodiments of this application.

[0135] Please see Figure 8 In some embodiments, the photoelectric conversion device 1000 further includes an adapter component 800, which includes a second electrical interface 810, an adapter module 820, and a third electrical interface 830. The second electrical interface 810 is connected to the first electrical interface 100, the adapter module 820 is connected between the second electrical interface 810 and the third electrical interface 830, and the third electrical interface 830 is used to connect to the connector 2110. The second electrical interface 810 and the third electrical interface 830 are different.

[0136] In some examples, the first electrical interface 100 is a PCIe male connector and the connector 2110 is an MCIO female connector. The first electrical interface 100 can only be adapted to the PCIe female connector and cannot be adapted to the MCIO female connector.

[0137] The second electrical interface 810 is a PCIe female connector, and can be connected to the first electrical interface 100. The third electrical interface 830 is an MCIO male connector, and can be electrically connected to connector 2110. Signal transmission between the second and third electrical interfaces 810 and 830 can be achieved via adapter module 820. Thus, the first electrical interface 100 can be connected to connector 2110 via adapter component 800.

[0138] In other examples, the first electrical interface 100 is an MCIO male connector and the connector 2110 is a PCIe female connector. The first electrical interface 100 can only be used with the MCIO female connector and cannot be used with the PCIe female connector.

[0139] The second electrical interface 810 is an MCIO female connector, and can be connected to the first electrical interface 100. The third electrical interface 830 is a PCIe male connector, and can be electrically connected to the connector 2110. Signal transmission between the second and third electrical interfaces 810 and 830 can be achieved via an adapter module 820. Thus, the first electrical interface 100 can be connected to the connector 2110 via the adapter assembly 800.

[0140] In summary, by setting up the adapter component 800, the first electrical interface 100 of the photoelectric conversion device 1000 can be connected to the connector 2110 that is not compatible with the first electrical interface 100, thereby improving the compatibility of the photoelectric conversion device 1000.

[0141] In some embodiments, the adapter module includes an adapter card and multiple adapter cables disposed on the adapter card, a second electrical interface and a third electrical interface are disposed on the adapter card, and the multiple adapter cables are connected between the second electrical interface and the third electrical interface.

[0142] For example, the adapter card may include a third circuit board, on which the second electrical interface 810 and the third electrical interface 830 may be disposed. There are multiple adapter traces, with both ends of the adapter traces connected to the second electrical interface 810 and the third electrical interface 830 respectively, thereby enabling communication between the second electrical interface 810 and the third electrical interface 830.

[0143] In other embodiments, the adapter module includes an adapter harness comprising multiple adapter cables connected between the second electrical interface 810 and the third electrical interface 830.

[0144] The adapter module is designed as an adapter harness, which allows the positions of the second electrical interface 810 and the third electrical interface 830 to be flexibly adjusted, thereby improving the adaptability of the adapter component 800.

[0145] Please see you later. Figure 4 In some embodiments, the first circuit board 500 includes a main body 510 and an electrical connection part 520, with the first switching chip 200, optical module 300, and configuration module 400 disposed on the main body 510. The main body 510 can support the first switching chip 200, optical module 300, and configuration module 400.

[0146] The main body 510 includes a first edge 511 and a second edge 512. The first edge 511 and the second edge 512 extend in different directions. The electrical connection part 520 is disposed along part of the first edge 511. The optical module 300 is disposed on the main body 510 and protrudes from the second edge 512. The first electrical interface 100 is disposed on the electrical connection part 520.

[0147] For example, the main body 510 can be rectangular or approximately rectangular.

[0148] The electrical connection portion 520 is strip-shaped, and the first electrical interface 100 may include multiple gold fingers arranged sequentially along the extension direction of the electrical connection portion 520. The electrical connection portion 520 can be inserted into the connector 2110.

[0149] In this case, a portion of the optical module 300 may protrude beyond the second edge 512. At this time, the portion of the optical module 300 that is vertically projected onto the first circuit board 500 is located outside the first circuit board 500, thereby facilitating the connection of the optical module 300 to the optical fiber.

[0150] In some examples, the photoelectric conversion device 1000 may also include a heat sink 840 connected to the optical module 300, thereby dissipating heat from the optical module 300. For example, the heat sink 840 may include multiple heat sink fins.

[0151] In some examples, the photoelectric conversion device 1000 may further include a buck converter and a ceramic capacitor array, and the first electrical interface 100 may further include a power terminal, which can be connected to a power module within the electronic device 2000 via a connector 2110, thereby allowing the power module to supply power to the devices on the first circuit board 500 via the power terminal. The buck converter and ceramic capacitor array enable ripple suppression.

[0152] In some examples, the photoelectric conversion device 1000 may also include an electrostatic discharge (ESD) protection module. The ESD protection module is located on the first circuit board 500 and employs an ESD protection device capable of withstanding 3kV contact discharge.

[0153] An electrostatic discharge (ESD) protection module is provided on one side of the optical module 300, which can reduce the static electricity generated when the optical fiber is plugged into or unplugged from the optical module 300.

[0154] An electrostatic discharge (ESD) protection module is provided on one side of the first electrical interface 100, thereby reducing the static electricity generated by plugging and unplugging the first electrical interface 100.

[0155] In some examples, the optical module 300 may also include a temperature compensation circuit, which includes an NTC (negative temperature coefficient) thermistor, and the bias current can be adjusted in real time by setting the NTC thermistor.

[0156] In some examples, the optical module 300 may also include a temperature sensor and an optical power sensor, and the photoelectric conversion device 1000 may also include a voltage sensor. The voltage sensor is mounted on a circuit board. The temperature sensor, optical power sensor, and voltage sensor can be connected to an I2C switch via an I2C bus and report detection parameters to the BMC via the I2C switch and the second terminal 120.

[0157] Figure 9 This is a schematic diagram of the structure of the housing 900 of an electronic device 2000 provided in some embodiments of this application.

[0158] Please see Figure 9 When the photoelectric conversion device 1000 is applied to the electronic device 2000, the electronic device 2000 also includes a housing 900. The housing 900 forms a receiving space, and the electronic device 2100 is disposed in the receiving space. The housing 900 is provided with an opening 910, the photoelectric conversion device 1000 is disposed in the receiving space, and the optical interface 320 of the optical module 300 of the photoelectric conversion device 1000 is exposed to the opening 910.

[0159] The optical interface 320 is exposed within the opening 910 of the housing 900, so that the housing 900 can support the photoelectric conversion device 1000 and facilitate the connection of optical fiber and optical interface 320.

[0160] In some examples, housing 900 may include a first panel, which may be the front panel of electronic device 2000.

[0161] In some examples, the housing 900 is provided with a plurality of opening groups 920, and one opening group 920 includes at least one opening 910, wherein a photoelectric conversion device 1000 (e.g. Figure 7 The optical interface 320 (as shown) Figure 7 (As shown) is disposed within an opening 910 in an opening group 920.

[0162] For example, a photoelectric conversion device 1000 includes two optical interfaces 320 and an aperture group 920 includes two apertures 910.

[0163] For example, a photoelectric conversion device 1000 includes four optical interfaces 320, and an aperture group 920 includes four apertures 910.

[0164] In some examples, the width of the first panel in the first direction F1 is greater than the width of the first panel in the second direction F2. In the case where an opening group 920 includes multiple openings 910, the multiple openings 910 in an opening group 920 can be arranged sequentially along the second direction F2.

[0165] In some examples, the plurality of openings 910 can be divided into a first opening group 930 and a second opening group 940, each of which includes at least one opening group 920. The first opening group 930 and the second opening group 940 are respectively disposed at both ends of the first panel in the first direction F1.

[0166] For example, the first opening group 930 may include three opening groups 920, and the second opening group 940 may include three opening groups 920.

[0167] In some examples, the electronic device 2000 may also include a baffle that can be disposed within the opening 910. The baffle can be located in the gap between the optical interface 320 and the edge of the opening 910, thereby reducing the shaking of the optical interface 320 and improving the stability of the photoelectric conversion device 1000.

[0168] Figure 10 Another structural block diagram of an electronic system 3000 provided in an embodiment of this application.

[0169] Please see Figure 10 The aforementioned electronic device 2000 can be applied in electronic system 3000. In electronic system 3000, the first electronic device 3100 can be the electronic device 2000 provided in the embodiments of this application, and the second electronic device 3200 includes a second optical module 3210. The signal transmission device 3300 may include an optical fiber, one end of which is connected to the optical module 300 of the photoelectric conversion device 1000 of the first electronic device 3100, and the other end is connected to the second optical module 3210 of the second electronic device 3200.

[0170] Since the electronic system 3000 provided in this application embodiment includes all the structures of the photoelectric conversion device 1000 provided in some of the above embodiments, and therefore all the beneficial effects of the electronic system 3000 provided in this application embodiment including the photoelectric conversion device 1000 provided in some of the above embodiments will not be elaborated here.

[0171] In some embodiments, the second electronic device 3200 may include an EP device. In this example, the first electronic device 3100 may be a server including a CPU, and the second electronic device 3200 may be an EP device.

[0172] Please see you later. Figure 1In some other embodiments, the second electronic device 3200 may be the electronic device 2000 provided in the embodiments of this application. The second electronic device 3200 includes a photoelectric conversion device 1000, with the two ends of an optical fiber connected to the optical module 300 of the photoelectric conversion device 1000 of the first electronic device 3100 and the optical module 300 of the photoelectric conversion device 1000 of the second electronic device 3200, respectively. The optical module 300 of the photoelectric conversion device 1000 of the second electronic device 3200 may serve as a second optical module 3210.

[0173] For example, the electronic devices 2120 of the electronic devices 2100 of the first electronic device 3100 and the second electronic device 3200 may both include a CPU.

[0174] Specifically, by incorporating a photoelectric conversion device 1000 within the electronic device 2000, the device converts electrical signals into optical signals for output. This allows the electronic device 2000 to connect to other electronic devices 2000 via optical fiber. The low transmission loss of optical signals within the fiber enables long-distance signal transmission between two electronic devices 2000, breaking the traditional limitations of electrical signal transmission distance and achieving low-loss optical interconnection at the hundred-meter level. This increases the distance between two electronic devices 2000, thereby facilitating the scaling up of the electronic system 3000. Furthermore, the low loss of optical signals improves signal stability and reliability.

[0175] The photoelectric conversion device, electronic device, and electronic system provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A photoelectric conversion device, characterized in that, include: The system comprises a first electrical interface, a first switching chip, an optical module, and a configuration module. The first electrical interface supports connection to a connector, the first switching chip is connected between the first electrical interface and the optical module, and the configuration module is connected between the first switching chip and the first electrical interface. The first electrical interface is used to transmit a first high-speed signal and a low-speed signal; The first switching chip is used to split the first high-speed signal into multiple second high-speed signals. The first switching chip has multiple signal transmission modes. Under different signal transmission modes, the first switching chip is used to split the first high-speed signal into different numbers of second high-speed signals. The configuration module is used to read the identifier of the connector, configure the signal transmission mode of the first switching chip according to the identifier, and convert the low-speed signal into a low-voltage differential signal. The optical module is used to convert the first high-speed signal into a first optical signal and output it, and to convert the low-voltage differential signal into a second optical signal and output it. The optical module includes a photoelectric conversion unit and an optical interface. The photoelectric conversion unit is connected to the first switching chip, the configuration module, and the optical interface. The photoelectric conversion unit is used to: convert the second high-speed signal into a first optical signal and convert the low-voltage differential signal into the second optical signal. The optical interface includes multiple first optical transmission channels and multiple second optical transmission channels. Both the first optical transmission channels and the second optical transmission channels are connected to the photoelectric conversion unit. The first optical transmission channels are used to transmit the first optical signal, and the second optical transmission channels are used to transmit the second optical signal.

2. The photoelectric conversion device according to claim 1, characterized in that, The multiple signal transmission modes include a first signal transmission mode and a second signal transmission mode; In the first signal transmission mode, the first switching chip is used to split the first high-speed signal into two second high-speed signals; In the second signal transmission mode, the first switching chip is used to split the first high-speed signal into four second high-speed signals.

3. The photoelectric conversion device according to claim 2, characterized in that, The number of optical modules is multiple, and in any of the signal transmission modes, one optical module is used to receive at least one of the second high-speed signals.

4. The photoelectric conversion device according to claim 2, characterized in that, The number of optical modules is two; In the first signal transmission mode, one of the optical modules is used to receive a second high-speed signal; In the second signal transmission mode, one of the optical modules is used to receive two of the second high-speed signals.

5. The photoelectric conversion device according to claim 1, characterized in that, The first electrical interface includes a plurality of first terminals and a plurality of second terminals, wherein the first terminals are connected between the first switching chip and the connector, and the first terminals are used to transmit the first high-speed signal; the second terminals are connected between the configuration module and the connector, and the second terminals are used to transmit the low-speed signal.

6. The photoelectric conversion device according to any one of claims 1-4, characterized in that, The configuration module includes: A storage unit is used to store multiple sets of configuration parameters, each set of configuration parameters including dynamic channel allocation rules; A configuration unit is connected to the first electrical interface and the storage unit. The configuration unit is used to read the identifier of the connector, obtain the dynamic channel allocation rule from the storage unit according to the identifier, and configure the signal transmission mode of the first switching chip according to the dynamic channel allocation rule.

7. The photoelectric conversion device according to any one of claims 1-4, characterized in that, Also includes: An adapter assembly includes a second electrical interface, an adapter module, and a third electrical interface. The second electrical interface is connected to the first electrical interface, and the adapter module is connected between the second electrical interface and the third electrical interface. The third electrical interface is used to connect to the connector, wherein the second electrical interface and the third electrical interface are different.

8. The photoelectric conversion device according to claim 7, characterized in that, The adapter module includes an adapter card and multiple adapter cables disposed on the adapter card. The second electrical interface and the third electrical interface are disposed on the adapter card, and the multiple adapter cables are connected between the second electrical interface and the third electrical interface.

9. The photoelectric conversion device according to claim 7, characterized in that, The adapter module includes an adapter harness, which includes multiple adapter cables connected between the second electrical interface and the third electrical interface.

10. The photoelectric conversion device according to any one of claims 1-4, characterized in that, Also includes: A first circuit board includes a main body and an electrical connection portion. A first electrical interface, a first switching chip, an optical module, and a configuration module are disposed on the main body. The main body includes a first edge and a second edge, which extend in different directions. The electrical connection portion is disposed along a portion of the first edge. The optical module is disposed on the main body and protrudes from the second edge. The first electrical interface is disposed on the electrical connection portion.

11. An electronic device, characterized in that, include: An electronic device, the electronic device including a connector; The photoelectric conversion device as described in any one of claims 1-10, wherein the first electrical interface of the photoelectric conversion device is connected to the connector.

12. The electronic device according to claim 11, characterized in that, Also includes: A housing that encloses a receiving space, in which the electronic device is disposed, and an opening is provided on the housing. The photoelectric conversion device is disposed within the receiving space, and the optical interface of the optical module of the photoelectric conversion device is exposed through the opening.

13. An electronic system, characterized in that, A first electronic device, wherein the first electronic device is the electronic device as described in claim 11 or 12; A second electronic device, the second electronic device including a second optical module; An optical fiber, one end of which is connected to the optical module of the first electronic device, and the other end of which is connected to the second optical module of the second electronic device.

14. The electronic system according to claim 13, characterized in that, Also includes: The second electronic device is the electronic device as described in claim 11 or 12, and the optical module of the photoelectric conversion device of the second electronic device is the second optical module.

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