Optical module heat dissipation device and high-speed optical module

Abstract

The utility model relates to the technical field of communication, in particular to an optical module heat dissipation device and a high-speed optical module.The optical module heat dissipation device comprises a shell and further comprises a circuit board assembly part, a heat conduction cover plate and a heat dissipation assembly, the circuit board assembly part is arranged in the shell, the heat conduction cover plate is arranged at the top of the circuit board assembly part, and the heat dissipation assembly is arranged in the shell. Fixing bosses are arranged on the periphery of the bottom of the heat conduction cover plate, the heat conduction cover plate is detachably connected with the circuit board assembly part through the fixing bosses, and the heat dissipation assembly is arranged on the top of the shell. The objective of the utility model is to solve the problem of poor heat dissipation performance of a high-power-consumption device of an optical module.

Description

Technical Field

[0001] This utility model relates to the field of communication technology, and more specifically, to an optical module heat dissipation device and a high-speed optical module. Background Technology

[0002] With the continuous development of the digital age, the demand for optical modules in data centers, 5G networks, and AI fields is constantly increasing, and optical modules are continuously evolving towards higher speeds and higher integration. Good heat dissipation technology enables optical modules to operate stably at higher performance levels, preventing performance degradation or damage due to overheating.

[0003] Currently, heat dissipation for high-speed optical modules typically involves adding heat sink fins to the upper cover of the optical module to increase its heat dissipation area. However, this method primarily relies on heat conduction through thermally conductive materials and protrusions extending from the upper cover. These protrusions are usually integrated with the upper cover and made of the same material, resulting in poor thermal conductivity. Furthermore, as the power of optical module chips increases, existing heat dissipation methods are insufficient to meet the heat dissipation requirements of high-power devices, leading to poor overall heat dissipation performance of the optical modules. Utility Model Content

[0004] The purpose of this invention is to provide a heat dissipation device for optical modules and a high-speed optical module, so as to solve the problem of poor heat dissipation performance of high-power optical modules in the background art.

[0005] To achieve the above objectives, the first aspect of this utility model provides a heat dissipation device for an optical module, including a housing, a circuit board assembly, a heat-conducting cover, and a heat dissipation component. The circuit board assembly is disposed inside the housing, the heat-conducting cover is disposed on the top of the circuit board assembly, and fixed bosses are provided around the bottom of the heat-conducting cover. The heat-conducting cover is detachably connected to the circuit board assembly through the fixed bosses, and the heat dissipation component is disposed on the top of the housing.

[0006] Furthermore, the heat dissipation assembly includes a cover and a heat dissipation component, the heat dissipation component being spaced apart on the top of the heat-conducting cover, and the heat dissipation component being fixedly connected to the cover.

[0007] Furthermore, a first thermally conductive material is filled between the heat sink and the thermally conductive cover plate.

[0008] Furthermore, the heat sink includes a base and heat sink fins, with the heat sink fins fixedly connected to the top of the base.

[0009] Furthermore, the heat dissipation fins are provided in a plurality of units, and the plurality of heat dissipation fins are equally spaced between the base and the cover.

[0010] Furthermore, the housing includes a first base and a second base, the first base being connected to a base plate, and the second base being detachably connected to the first base.

[0011] Furthermore, the heat-conducting cover plate is made of metallic copper.

[0012] Furthermore, the circuit board assembly includes a circuit board and a power consumption component, the power consumption component being disposed on the top of the circuit board, and the circuit board being in contact with the fixed boss.

[0013] Furthermore, the bottom of the heat-conducting cover is filled with a second heat-conducting material.

[0014] The second aspect of this utility model provides a high-speed optical module, including the optical module heat dissipation device described in the first aspect of this utility model, wherein an unlocking component is slidably connected to one side of the housing.

[0015] The beneficial effects of this utility model include:

[0016] 1. This utility model, by setting a heat-conducting cover plate and a heat dissipation component, replaces the traditional heat-conducting boss with an independent heat-conducting cover plate on the top of the circuit board assembly, resulting in a higher thermal conductivity and better heat dissipation effect. The fixing bosses around the bottom of the heat-conducting cover plate directly contact the circuit board assembly, which can conduct heat from the circuit board assembly and dissipate it through the heat dissipation component while fixing the heat-conducting cover plate, thereby improving the thermal conductivity of high-power devices and achieving a better heat dissipation effect. At the same time, the independently set heat-conducting cover plate is convenient for processing and maintenance. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments of this utility model will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the optical module provided in an embodiment of the present utility model;

[0019] Figure 2 An exploded view of the optical module provided in an embodiment of this utility model;

[0020] Figure 3 An assembly diagram of the heat-conducting cover plate provided in an embodiment of this utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the heat-conducting cover plate provided in Embodiment 1 of this utility model;

[0022] Figure 5 This is a schematic diagram of the structure of the heat-conducting cover plate provided in Embodiment 2 of this utility model;

[0023] Icons: 1-House, 11-Cover, 12-Heat sink, 121-Base, 122-Heat sink fins, 13-First base, 14-Second base, 2-Heat conduction cover, 21-Fixing boss, 3-Circuit board assembly, 31-Circuit board, 32-Power consumption component, 4-Unlocking component. Detailed Implementation

[0024] The technical solutions of the present invention will now be described with reference to the accompanying drawings in the embodiments of the present invention.

[0025] It should be noted that similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] Please see Figures 1 to 3As shown, the first aspect of this utility model provides a heat dissipation device for an optical module, including a housing 1, a circuit board assembly 3, a heat-conducting cover 2, and a heat dissipation component. The circuit board assembly 3 is disposed inside the housing 1, and the heat-conducting cover 2 is disposed on top of the circuit board assembly 3. The bottom of the heat-conducting cover 2 has fixing bosses 21 on all four sides. The heat-conducting cover 2 is detachably connected to the circuit board assembly 3 through the fixing bosses 21. The heat dissipation component is disposed on top of the housing 1. Specifically, the housing 1 serves as the external support structure for the entire optical module, providing heat dissipation for the internal circuit board assembly 3. The heat-conducting cover 2 and the heat dissipation assembly provide installation space; the circuit board assembly 3 integrates high-power devices, which generate a large amount of heat during operation; the heat-conducting cover 2 contacts the circuit board assembly 3 through a fixing boss 21, which is used to fix the heat-conducting cover 2 and conduct the heat from the circuit board assembly 3 through the heat dissipation assembly; the cross-sectional shape of the heat-conducting cover 2 includes, but is not limited to, rectangle, circle, and ellipse, and the height of its bottom fixing boss 21 must match the height of the high-power devices on the circuit board assembly 3; the heat-conducting cover 2 can be made of, for example, rectangular, circular, and elliptical shapes. Figure 4 The single-protrusion structure shown is relatively simple, has low processing costs, and is suitable for situations where heat distribution is relatively concentrated and a single high-power device generates significant heat; alternatively, structures such as... Figure 5 The stepped boss structure shown increases the cross-sectional area of ​​the heat-conducting cover plate 2, thereby reducing thermal resistance and enhancing heat dissipation. The number of steps can be increased according to needs and gaps. The number of bosses can also be increased according to actual needs. For example, a double boss structure can conduct heat more evenly and efficiently when there are two main heat-generating areas or relatively dispersed components on the circuit board assembly 3. A multi-boob design can precisely correspond to multiple high-power components, achieving refined heat dissipation. The area of ​​the heat-conducting cover plate 2 can be adjusted according to actual needs, and the larger the area, the better the heat dissipation effect. It should be noted that the number of heat-conducting cover plates 2 can also be adjusted according to the number of high-power components on the circuit board assembly 3. The heat dissipation component is installed on the top of the housing 1. Its principle is to utilize the natural convection principle of rising hot air. For example, heat dissipation fins, fans, and other heat dissipation devices will dissipate the heat conducted from the heat-conducting cover plate 2 into the air.

[0027] In practical application, the circuit board assembly 3 is first installed and fixed in a preset position inside the housing 1, ensuring normal electrical connection and stable physical structure. Then, based on the layout, height, and number of high-power devices on the circuit board assembly 3, a heat-conducting cover 2 with a suitable shape, boss structure, and area is configured. The fixing boss 21 of the heat-conducting cover 2 is aligned with the corresponding heat-generating area on the circuit board assembly 3, ensuring tight contact and achieving heat conduction connection. The heat-conducting cover 2 can be easily fixed with a snap-fit ​​structure or bolts, or it can be fixed with adhesive to ensure that the heat-conducting cover 2 does not shift during the operation of the optical module. Finally, a heat dissipation component is installed on the top of the housing 1. This embodiment mainly solves the technical problems of low heat conduction efficiency, uneven heat dissipation, and inconvenient maintenance for high-power devices in traditional optical module heat dissipation. Traditional optical modules often rely on simple heat-conducting protrusions on the circuit board 31, which have limited heat dissipation capacity and are difficult to meet the ever-increasing demand for high power consumption. In this embodiment, a heat-conducting cover plate 2 and a heat dissipation component are set. By setting an independent heat-conducting cover plate 2 on the top of the circuit board assembly 3 instead of the traditional heat-conducting protrusions, the fixed protrusions 21 on the bottom of the heat-conducting cover plate 2 contact the circuit board assembly 3, which can conduct heat from the circuit board assembly 3 and dissipate it through the heat dissipation component, thereby improving the heat conduction performance for high-power devices and achieving better heat dissipation effect. At the same time, the design of the detachable heat-conducting cover plate 2 makes the manufacturing process more convenient. In the later maintenance, technicians can quickly remove the heat-conducting cover plate 2 to inspect and replace the circuit board assembly 3 or other components, which greatly shortens the maintenance time, reduces maintenance costs, and improves the overall reliability and stability of the optical module.

[0028] Preferably, the heat dissipation assembly includes a cover 11 and heat dissipation components 12. The heat dissipation components 12 are spaced apart on the top of the heat-conducting cover plate 2, and the heat dissipation components 12 are fixedly connected to the cover 11. A first thermally conductive material is filled between the heat dissipation components 12 and the heat-conducting cover plate 2. The heat dissipation component 12 includes a base 121 and heat dissipation fins 122. The heat dissipation fins 122 are fixedly connected to the top of the base 121. A plurality of heat dissipation fins 122 are provided, and the plurality of heat dissipation fins 122 are equidistantly spaced between the base 121 and the cover 11. Specifically, the cover 11 is preferably made of sheet metal and is used to provide external protection for the heat dissipation assembly. The base 121 is preferably made of zinc alloy, and the heat dissipation fins 122 are preferably made of copper, aluminum, or metal with high thermal conductivity. The base 121 is made of a zinc alloy material. It receives heat from the first thermally conductive material and quickly distributes it to the heat dissipation fins 122, ensuring uniform heat distribution and preventing localized overheating. The first thermally conductive material, such as a paste or phase-change material, is filled between the heat sink 12 and the thermally conductive cover plate 2. This material conducts heat from the thermally conductive cover plate 2 to the heat sink 12, which then dissipates heat through the heat dissipation fins 122. In this embodiment, the zinc alloy base 121 and the high thermal conductivity heat dissipation fins 122 work together to achieve rapid and balanced heat diffusion and efficient heat dissipation. The first thermally conductive material fills the gaps in the heat conduction path, strengthening the heat transfer between the thermally conductive cover plate 2 and the heat sink 12, and significantly reducing thermal resistance. This solution enables the optical module to maintain a suitable internal temperature during high-power operation, reducing the risk of device aging and performance degradation due to overheating and extending the lifespan of the optical module.

[0029] Preferably, the housing 1 includes a first base 13 and a second base 14, the first base 13 being connected to the base 121, and the second base 14 being detachably connected to the first base 13; specifically, the first base 13 and the second base 14 are preferably bolted together to achieve the encapsulation of the housing 1; the first base 13 and the second base 14 are preferably made of zinc alloy material;

[0030] Preferably, the heat-conducting cover plate 2 is made of copper. Specifically, compared with the zinc alloy boss design in the prior art, the thermal resistance of the copper heat-conducting cover plate 2 is less than that of the zinc alloy boss, and the copper heat-conducting cover plate 2 has better thermal conductivity. The heat-conducting cover plate 2 can also be made of other metal materials with high thermal conductivity.

[0031] Preferably, the circuit board assembly 3 includes a circuit board 31 and a power consumption component 32. The power consumption component 32 is disposed on the top of the circuit board 31, and the circuit board 31 is in contact with the fixing boss 21. The bottom of the thermally conductive cover plate 2 is filled with a second thermally conductive material. Specifically, the second thermally conductive material can be the same material as the first thermally conductive material, or other thermally conductive materials can be selected according to actual needs. The filling of the second thermally conductive material can help conduct the heat on the circuit board assembly 3 to the thermally conductive cover plate 2, and then introduce it into the heat dissipation component through the first thermally conductive material, and then discharge it through the heat dissipation component, further enhancing the heat dissipation effect of the optical module heat dissipation device.

[0032] The second aspect of this utility model provides a high-speed optical module, including the optical module heat dissipation device described in the first aspect of this utility model. A unlocking member 4 is slidably connected to one side of the housing 1. Specifically, the unlocking member 4 is used to facilitate the insertion and removal of the optical module.

[0033] In addition to the above description, the following points need to be noted:

[0034] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0035] (2) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0036] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A heat dissipation device for an optical module, comprising a housing, characterized in that, It also includes a circuit board assembly, a heat-conducting cover plate, and a heat dissipation component. The circuit board assembly is located inside the housing. The heat-conducting cover plate is located on top of the circuit board assembly. The bottom of the heat-conducting cover plate is provided with fixing bosses around its perimeter. The heat-conducting cover plate is detachably connected to the circuit board assembly through the fixing bosses. The heat dissipation component is located on top of the housing.

2. The optical module heat dissipation device according to claim 1, characterized in that, The heat dissipation assembly includes a cover and heat dissipation components. The heat dissipation components are spaced apart on the top of the heat-conducting cover, and the heat dissipation components are fixedly connected to the cover.

3. The optical module heat dissipation device according to claim 2, characterized in that, A first thermally conductive material is filled between the heat sink and the thermally conductive cover plate.

4. The optical module heat dissipation device according to claim 2, characterized in that, The heat sink includes a base and heat sink fins, with the heat sink fins fixedly connected to the top of the base.

5. The optical module heat dissipation device according to claim 4, characterized in that, The heat dissipation fins are provided in a plurality of units, and the plurality of heat dissipation fins are equally spaced between the base and the cover.

6. The optical module heat dissipation device according to claim 4, characterized in that, The housing includes a first base and a second base, the first base being connected to a base plate, and the second base being detachably connected to the first base.

7. The optical module heat dissipation device according to claim 1, characterized in that, The heat-conducting cover plate is made of copper.

8. The optical module heat dissipation device according to any one of claims 1 to 7, characterized in that, The circuit board assembly includes a circuit board and a power consumption component. The power consumption component is located on the top of the circuit board, and the circuit board is in contact with the fixed boss.

9. The optical module heat dissipation device according to claim 8, characterized in that, The bottom of the heat-conducting cover is filled with a second heat-conducting material.

10. A high-speed optical module, characterized in that, The optical module heat dissipation device includes any one of claims 1 to 9, wherein an unlocking member is slidably connected to one side of the housing.

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