Shell, preparation method thereof and electronic equipment

Abstract

The invention provides a shell, a preparation method thereof and electronic equipment. The preparation method comprises the steps that a base material layer is provided, the base material layer comprises at least one fiber resin layer, and when the base material layer comprises at least two fiber resin layers, the at least two fiber resin layers are arranged in a stacked mode; the fiber resin layer comprises fiber cloth and thermoplastic resin, and the thermoplastic resin wraps the surface of the fiber cloth; forming an appearance layer on the surface of the base material layer; and hot bending forming is conducted, so that the base material layer forms a shell body of a 3D structure, the shell of the 3D structure is obtained, the shell comprises the shell body and an appearance layer, and the appearance layer is arranged on the surface of the shell body. The preparation method of the shell is simple in process and low in cost, and a more delicate appearance effect can be achieved.

Description

Technical Field

[0001] The present application relates to the field of electronics, and in particular to a housing, a method for preparing the housing, and an electronic device. Background Art

[0002] With the technological trend of electronic devices such as mobile phones becoming lighter and thinner, the back shells of electronic devices, such as mobile phone back shells, have gradually begun to use fiber composite materials (referred to as fiber mobile phone back shells). Fiber composite materials are composite materials formed by combining long fiber materials and resins, and have the characteristics of being light and thin. Fiber mobile phone back shells in related art generally use thermosetting resin materials, generally epoxy resins, that is, the fiber composite materials of mobile phone back shells in related art are fiber-thermosetting resin composite materials. Fiber-thermosetting resin prepregs are soft films or have a viscous surface before being formed and cured. If it is necessary to use this material to prepare a back cover with a 3D structure and an appearance layer, since the silk screen transfer process can only be processed on a flat surface, the common silk screen transfer process cannot be used to achieve the appearance effect on a 3D structure. Therefore, it is necessary to first hot press to form the back shell with a 3D structure, and then use a complex spraying + rubbing process on the back shell to form the appearance effect. The spraying + rubbing process to form the appearance effect is relatively complex and has a low yield, which greatly increases the cost of the back shell. Summary of the Invention

[0003] The embodiment of the present application provides a method for preparing a shell, which has a simple process, low cost, and can achieve a more refined appearance effect.

[0004] In a first aspect, an embodiment of the present application provides a method for preparing a housing, the method comprising:

[0005] Providing a substrate layer, the substrate layer comprising at least one fiber resin layer. When the substrate layer comprises at least two fiber resin layers, the at least two fiber resin layers are stacked; the fiber resin layer comprises fiber cloth and thermoplastic resin, and the thermoplastic resin wraps the surface of the fiber cloth;

[0006] forming an appearance layer on the surface of the substrate layer; and

[0007] Hot bending is performed to form the base material layer into a shell body with a 3D structure, thereby obtaining a shell with a 3D structure. The shell includes a shell body and an appearance layer, and the appearance layer is arranged on the surface of the shell body.

[0008] In a second aspect, an embodiment of the present application provides a shell, which is prepared by the shell preparation method described in the embodiment of the first aspect of the present application.

[0009] In a third aspect, an embodiment of the present application provides a housing, comprising:

[0010] A shell body, the shell body comprising at least one fiber resin layer. When the shell comprises at least two fiber resin layers, the at least two fiber resin layers are stacked; the fiber resin layer comprises fiber cloth and thermoplastic resin, the thermoplastic resin wrapping the surface of the fiber cloth; the shell body comprising a connected raised portion and a flat portion, the flat portion being arranged around the periphery of the raised portion, and the raised portion protruding from the flat portion; and

[0011] An exterior layer is provided on the surface of the shell body, and covers the raised portion and the planar portion.

[0012] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising:

[0013] Display screen;

[0014] The housing according to the second or third aspect of the present application, wherein the housing is disposed opposite to the display screen; and

[0015] A processor is provided between the display screen and the housing, and the processor is electrically connected to the display screen, and is used to control the display screen to perform display.

[0016] The shell of the present invention includes a stacked shell body and an exterior layer. The shell body includes at least one fiber resin layer. When the shell includes at least two fiber resin layers, the at least two fiber resin layers are stacked. The fiber resin layer includes fiber cloth and thermoplastic resin, and the thermoplastic resin wraps the surface of the fiber cloth. The fiber resin layer of the present invention is prepared using fiber cloth and thermoplastic resin. The thermoplastic resin can soften at high temperatures and has good reshapeability (i.e., good secondary molding properties) and deformability. Therefore, the exterior layer can be first formed on a 2D planar substrate layer, and then hot-bending is performed to form the substrate layer into a shell body having a 3D structure. Compared to forming the exterior layer on a 3D structure, forming the exterior layer on a planar substrate layer is simpler and less expensive. For example, the exterior layer can be formed using a silk screen transfer process. In addition, the exterior layer can be formed on a large planar substrate layer and then cut into predetermined sizes, thereby enabling the simultaneous preparation of exterior layers for multiple shells, greatly improving the processing efficiency of the shell and significantly reducing the production cost of the shell. Furthermore, when using a fiber-thermosetting resin shell with a texture, the texture needs to be formed by rubbing using a soft silicone mold. During the rubbing process, in order to make the silicone mold fit the 3D shape of the shell, the soft silicone mold must be deformed to fit the shape of the shell. The printed texture has the risk of deformation. Therefore, a simpler texture effect is usually chosen, and the applied appearance layer can be first formed on a substrate layer with a 2D structure, and then the substrate layer is hot-bent to obtain a 3D structure. Therefore, the texture of the appearance layer is not easily deformed, and a more refined appearance effect can be prepared, such as a finer texture structure, so that the shell has a better appearance expression. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a structural schematic diagram of a shell according to an embodiment of the present application.

[0019] Figure 2 1 is a schematic plan view of a housing according to an embodiment of the present application.

[0020] Figure 3 The shell of one embodiment of the present application is along Figure 2 Schematic diagram of the cross-sectional structure in the AA direction.

[0021] Figure 4 yes Figure 3Enlarged view of the dotted box I in the middle.

[0022] Figure 5 The shell body of one embodiment of the present application is along Figure 2 Schematic diagram of the cross-sectional structure in the AA direction.

[0023] Figure 6 It is a partial cross-sectional view of the corresponding flat portion of the shell according to one embodiment of the present application.

[0024] Figure 7 It is a partial cross-sectional view of the corresponding plane portion of the shell of another embodiment of the present application.

[0025] Figure 8 It is a schematic flow chart of a method for preparing a shell according to an embodiment of the present application.

[0026] Figure 9 It is a structural schematic diagram of a hot bending mold according to an embodiment of the present application.

[0027] Figure 10 It is a schematic diagram of the exploded structure of a hot bending mold according to an embodiment of the present application.

[0028] Figure 11 This is a schematic diagram of the exploded structure of a base material layer / appearance layer set in a hot bending mold according to one embodiment of the present application.

[0029] Figure 12 This is a schematic structural diagram of an embodiment of the present application in which an appearance layer of multiple shells is formed on a large substrate layer.

[0030] Figure 13 It is a schematic flow chart of a method for preparing a shell according to another embodiment of the present application.

[0031] Figure 14 It is a schematic flow chart of a method for preparing a shell according to another embodiment of the present application.

[0032] Figure 15 It is a schematic flow chart of a method for preparing a shell according to another embodiment of the present application.

[0033] Figure 16 It is a schematic flow chart of a method for preparing a shell according to another embodiment of the present application.

[0034] Figure 17 It is a structural diagram of an electronic device according to an embodiment of the present application.

[0035] Figure 18 This is a schematic diagram of a partially exploded structure of an electronic device according to an embodiment of the present application.

[0036] Figure 19 This is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0037] Description of reference numerals:

[0038] 100-shell, 10-shell body, 11-fiber resin layer, 12-raised portion, 121-first sub-portion, 122-second sub-portion, 123-through hole, 13-plane portion, 20-appearance layer, 21-shielding ink layer, 22-first texture layer, 23-coating layer, 24-varnish layer, 25-second texture layer, 100a-hot bending mold, 10a-concave mold, 20a-convex mold, 30a-mold cavity, 10b-base material layer, 300-electronic device, 310-display screen, 320-middle frame, 330-processor, 350-memory, 370-camera module, 101-light-transmitting portion. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0040] The terms "second," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish between different objects, not to describe a particular order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0041] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0042] It should be noted that, for the convenience of explanation, in the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0043] With the technological trend of electronic devices such as mobile phones becoming lighter and thinner, the back shells of electronic devices, such as mobile phone back shells, have gradually begun to use fiber composite materials (referred to as fiber mobile phone back shells). Fiber composite materials are composite materials formed by combining long fiber materials and resins, and have the characteristics of being light and thin. Fiber mobile phone back shells in related art generally use thermosetting resin materials, generally epoxy resins, that is, the fiber composite materials of mobile phone back shells in related art are fiber-thermosetting resin composite materials. Fiber-thermosetting resin prepregs are soft films or have a viscous surface before being formed and cured. If it is necessary to use this material to prepare a back cover with a 3D structure and an appearance layer, since the silk screen transfer process can only be processed on a flat surface, the common silk screen transfer process cannot be used to achieve the appearance effect on a 3D structure. Therefore, it is necessary to first hot press to form the back shell with a 3D structure, and then use a complex spraying + rubbing process on the back shell to form the appearance effect. The spraying + rubbing process to form the appearance effect is relatively complex and has a low yield, which greatly increases the cost of the back shell.

[0044] In view of this, embodiments of the present application provide a housing, a method for preparing the same, and an electronic device.

[0045] Figure 1 1 is a schematic structural diagram of a housing 100 according to an embodiment of the present application. Figure 2 FIG. 1 is a schematic plan view of a housing 100 according to an embodiment of the present application. Figure 3 The housing 100 of one embodiment of the present application is along Figure 2 Schematic diagram of the cross-sectional structure in the AA direction. Figure 4 yes Figure 3 Enlarged view of the dotted box I in the middle. Figure 5 The shell body 10 of one embodiment of the present application is along Figure 2 Schematic diagram of the cross-sectional structure in the AA direction.

[0046] See Figures 1 to 5 , an embodiment of the present application provides a shell 100, which includes a shell body 10 and an appearance layer 20, the shell body 10 includes at least one fiber resin layer 11, when the shell 100 includes at least two fiber resin layers 11, at least two fiber resin layers 11 are stacked; the fiber resin layer 11 includes fiber cloth and thermoplastic resin, and the thermoplastic resin wraps the surface of the fiber cloth; the shell body 10 includes a connected protrusion 12 and a plane portion 13, the plane portion 13 is arranged around the outer periphery of the protrusion 12, and the protrusion 12 protrudes from the plane portion 13; the appearance layer 20 is arranged on the surface of the shell body 10, and the appearance layer 20 covers the protrusion 12 and the plane portion 13.

[0047] It can be understood that the shell 100 is a 3D structure and the shell body 10 is a 3D structure.

[0048] The housing 100 of the present application can be applied to portable electronic devices such as mobile phones, tablet computers, laptop computers, desktop computers, smart bracelets, smart watches, e-readers, game consoles, etc. Optionally, the housing 100 of the present application can be the back cover (battery cover), middle frame, decorative part, protective shell, protective lens or decorative part of the camera module, etc. of the electronic device. In the drawings and descriptions of the present application, the housing 100 is illustrated and introduced as the back cover of an electronic device (such as a mobile phone), which should not be understood as a limitation on the housing 100 and the electronic device of the embodiment of the present application. It should be noted that the protective shell refers to a sleeve provided on at least part of the periphery of the electronic device for protecting the electronic device, and can be independent of the protective parts, protective sleeves, etc. of the electronic device.

[0049] It is understood that the shell body 10 and the exterior layer 20 are stacked along the thickness direction of the shell 100. The shell body 10 can be used to achieve the mechanical strength support and protection function of the shell 100, and the exterior layer 20 can be used to give the shell 100 a good appearance effect such as texture and color. In addition, it can also make the shell 100 have better wear resistance.

[0050] It can be understood that the fiber resin layer 11 of the present application is a fiber thermoplastic resin layer.

[0051] It should be noted that the fiber resin layer 11 of the shell body 10 can be, but is not limited to, one layer, two layers, three layers, four layers, five layers, six layers, seven layers, eight layers, nine layers, etc. The thickness can be specifically designed according to the thickness of the single fiber resin layer 11 and the overall thickness of the shell body 10.

[0052] It should be noted that the arrangement direction of the protrusions 12 and the planar portion 13 intersects with the stacking direction of the at least two fiber resin layers 11. In other words, the protrusions 12 and the planar portion 13 are both composed of at least one fiber resin layer 11.

[0053] It should be noted that the raised portion 12 and the planar portion 13 are integrally structured and distinct from the housing body 10. There is no clear boundary between the raised portion 12 and the planar portion 13; this is merely an artificial division for ease of description. The raised portion 12 and the planar portion 13 are formed in the same manufacturing process.

[0054] Optionally, the shell body 10 of the present application is made by hot bending of a base material layer.

[0055] Optionally, when the housing 100 serves as the back cover of an electronic device, the raised portion 12 has a through hole, and the inner side of the raised portion 12 is used to set a mounting bracket (DECO), which is used to install a camera module of the electronic device, and the camera module is set corresponding to the through hole.

[0056] The shell 100 of the embodiment of the present application includes a shell body 10 and an appearance layer 20 that are stacked. The shell body 10 includes at least one fiber resin layer 11. When the shell 100 includes at least two fiber resin layers 11, at least two fiber resin layers 11 are stacked; the fiber resin layer 11 includes fiber cloth and thermoplastic resin, and the thermoplastic resin wraps the surface of the fiber cloth. The fiber resin layer 11 of the present application is prepared by fiber cloth and thermoplastic resin. Thermoplastic resin can soften at high temperature and has good reshapeability (that is, good secondary molding properties) and deformation ability. Therefore, the appearance layer 20 can be formed on the substrate layer of the 2D planar structure first, and then hot bending can be performed to form the substrate layer into a shell body 10 with a 3D structure; compared with forming the appearance layer 20 on the 3D structure, the appearance layer 20 is formed on the substrate layer of the planar structure, and the process is simpler and the cost is lower. For example, the appearance layer 20 can be formed by a silk screen transfer process; in addition, the appearance layer 20 can also be formed on a substrate layer of a large planar structure, and then cut into a preset size, so that the appearance layer 20 of multiple shells 100 can be prepared at one time, which greatly improves the processing efficiency of the shell 100 and greatly reduces the preparation cost of the shell 100. Furthermore, when using a fiber-thermosetting resin shell 100 with a texture, the texture needs to be formed by rubbing using a soft silicone mold. During the rubbing process, in order to make the silicone mold fit the 3D shape of the shell 100, the soft silicone mold must be deformed to fit the shape of the shell 100. The rubbing texture has the risk of deformation. Therefore, a relatively simple texture effect is usually selected, and the applied appearance layer 20 can be first formed on a substrate layer with a 2D structure, and then the substrate layer is hot-bent to obtain a 3D structure. Therefore, the texture of the appearance layer 20 is not easy to deform, and a more refined appearance effect can be prepared, such as a finer texture structure, so that the shell 100 has a better appearance expression.

[0057] In some embodiments, the thermoplastic resin has a glass transition temperature greater than 100°C.

[0058] Specifically, the glass transition temperature of the thermoplastic resin can be, but is not limited to, greater than 100°C, greater than or equal to 110°C, greater than or equal to 120°C, greater than or equal to 130°C, greater than or equal to 140°C, greater than or equal to 150°C, greater than or equal to 160°C, greater than or equal to 170°C, etc.

[0059] In this embodiment, if the glass transition temperature of the thermoplastic resin is too low, the durability and stability of the shell 100 in a high temperature and high humidity environment are reduced. When the shell 100 is subjected to a 100°C water boiling reliability test, it may soften and deform, and fail the water boiling test; if the glass transition temperature of the thermoplastic resin is too high, the shell 100 requires a higher temperature for hot bending. When the shell 100 includes an appearance layer 20, the appearance layer 20 cannot withstand high temperatures, the texture on the appearance layer 20 is easily deformed, and the coating layer on the appearance layer 20 is easily deformed, cracked, and wrinkled, etc., which reduces the appearance effect of the shell 100 and reduces the production yield of the shell 100.

[0060] Furthermore, in some embodiments, the glass transition temperature Tg of the thermoplastic resin is in the range of 110°C ≤ Tg ≤ 150°C.

[0061] Specifically, the glass transition temperature Tg of the thermoplastic resin may be, but is not limited to, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C, 150°C, etc.

[0062] In the embodiments of the present application, when a numerical value range from a to b is involved, unless otherwise specified, it means that the numerical value can be any numerical value between a and b, including the endpoint numerical value a and the endpoint numerical value b.

[0063] In this embodiment, the glass transition temperature Tg of the thermoplastic resin is in the range of 110°C ≤ Tg ≤ 150°C. This ensures that the housing 100 has greater durability and stability in high-temperature and high-humidity environments, and reduces the risk of deformation, cracking, and wrinkling of the exterior layer 20 during the production of the housing 100. This improves the production yield of the housing 100 and reduces the production cost of the housing 100.

[0064] In some embodiments, the thermoplastic resin includes at least one of polyamide and polycarbonate. Thermoplastic resins such as polyamide and polycarbonate have a relatively suitable glass transition temperature. Using them to form the housing body 10 can improve the durability and stability of the housing 100 in high-temperature and high-humidity environments. They also reduce the risk of deformation, cracking, and wrinkling of the exterior layer 20 during the production of the housing 100, thereby improving the production yield of the housing 100 and reducing the production cost of the housing 100. Furthermore, thermoplastic resins such as polyamide and polycarbonate are relatively low in cost, further reducing the cost of the housing 100.

[0065] In some embodiments, the fiber cloth can be, but is not limited to, at least one of glass fiber cloth, ultra-high molecular weight polyethylene fiber cloth (UPE fiber for short), carbon fiber cloth, aramid fiber cloth, poly(p-phenylene benzobisoxazole) fiber cloth (PBO fiber for short), liquid crystal polymer cloth (LCP fiber for short), ceramic fiber cloth, basalt fiber cloth, etc.

[0066] Alternatively, the fiber cloth may be formed by weaving or spinning.

[0067] Please see again Figure 5 In some embodiments, the raised portion 12 includes a first sub-portion 121 and a second sub-portion 122 that are bent and connected to each other. The first sub-portion 121 has a through hole 123, and the second sub-portion 122 is arranged around the outer periphery of the first sub-portion 121. The end of the second sub-portion 122 facing away from the first sub-portion 121 is bent and connected to the planar portion 13.

[0068] It can be understood that the first sub-portion 121 , the second sub-portion 122 and the planar portion 13 are bent and connected in sequence.

[0069] It can be understood that the first sub-portion 121 and the second sub-portion 122 form a 3D shape similar to a crater.

[0070] Optionally, the first sub-portion 121 , the second sub-portion 122 and the planar portion 13 have equal thickness, that is, the shell body 10 has equal thickness, and the protrusion 12 is recessed from one side of the base material layer and formed on the other side.

[0071] It can be understood that the first sub-portion 121 , the second sub-portion 122 and the planar portion 13 are all annular structures.

[0072] Optionally, the shape of the first sub-portion 121 may be, but is not limited to, at least one of a circular ring, a rectangle, a rectangle with arc-shaped chamfers, and the like.

[0073] Optionally, the shape of the second sub-portion 122 may be, but is not limited to, at least one of a circular ring, a rectangle, a rectangle with arc-shaped chamfers, and the like.

[0074] Optionally, along the arrangement direction of the first sub-portion 121 , the second sub-portion 122 and the planar portion 13 , the second sub-portion 122 has an arc-shaped structure.

[0075] Optionally, the shape of the planar portion 13 may be, but is not limited to, at least one of a circular ring, a rectangle, a rectangle with arc-shaped chamfers, and the like.

[0076] In this embodiment, the raised portion 12 includes a first sub-portion 121 and a second sub-portion 122, which are connected by a bend. The first sub-portion 121 has a through-hole 123, and the second sub-portion 122 is arranged around the outer periphery of the first sub-portion 121. The end of the second sub-portion 122 facing away from the first sub-portion 121 is bent and connected to the planar portion 13. When the housing 100 serves as the back cover of an electronic device, the first sub-portion 121 can be used to bond a mounting bracket for mounting a camera module. The camera module is arranged corresponding to the through-hole 123, which facilitates installation of the camera module.

[0077] In some embodiments, the thickness of the shell body 10 ranges from 0.3 mm to 0.6 mm. Specifically, the thickness of the shell body 10 can be, but is not limited to, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, etc. If the shell body 10 is too thin, it cannot provide adequate support and protection, and its mechanical strength cannot meet the requirements of the electronic device housing 100. If the shell body 10 is too thick, it increases the thickness and weight of the electronic device, hindering the thinness and lightness of the electronic device, affecting the feel of the electronic device, and poor user experience.

[0078] Optionally, the thickness of the fiber resin layer 11 ranges from 0.03 mm to 0.15 mm. Specifically, the thickness of the fiber resin layer 11 can be, but is not limited to, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, etc.

[0079] In some embodiments, the height h of the protrusion 12 (e.g., Figure 5 The range of the height h of the raised portion 12 along the thickness direction of the shell 100 is 0.5mm to 2.5mm. Specifically, the height h of the raised portion 12 along the thickness direction of the shell 100 can be, but is not limited to, 0.5mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.4mm, 1.6mm, 1.8mm, 2.0mm, 2.2mm, 2.4mm, 2.5mm, etc. If the height h of the raised portion 12 along the thickness direction of the shell 100 is too low, the three-dimensional effect of the shell body 10 will not be obvious, which is not conducive to improving the appearance of the shell body 10. If the height h of the raised portion 12 along the thickness direction of the shell 100 is too high, the overall proportions of the shell body 10 will be unbalanced, reducing the appearance of the shell body 10.

[0080] In some embodiments, along the direction parallel to the extension plane of the planar portion 13, the width (line width) w of the first sub-portion 121 (eg Figure 5 shown) ranges from 0.2mm to 10mm.

[0081] It can be understood that the distance between the inner wall of the through hole 123 and the second sub-portion 122 ranges from 0.2 mm to 10 mm.

[0082] Specifically, along a direction parallel to the extension plane of the planar portion 13, the width (line width) w of the first sub-portion 121 can be, but is not limited to, 0.2 mm, 0.35 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1.0 mm, 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, 2.0 mm, 2.2 mm, 2.4 mm, 2.5 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, etc. If the width w of the first sub-portion 121 is too narrow, it is not conducive to the installation of the camera module; if the width of the first sub-portion 121 is too wide, the overall proportions of the housing body 10 are unbalanced, which reduces the appearance of the housing body 10.

[0083] Figure 6 FIG. 1 is a partial cross-sectional view of the housing 100 corresponding to the planar portion 13 according to an embodiment of the present application.

[0084] See Figure 6 In some embodiments, the appearance layer 20 includes at least one of a shielding ink layer 21, a first texture layer 22 (also referred to as an inner texture layer), a coating layer 23, a varnish layer 24, and a second texture layer 25 (also referred to as an outer texture layer). The shielding ink layer 21 is arranged on one side of the shell body 10, and the first texture layer 22, the coating layer 23, the varnish layer 24, and the second texture layer 25 are stacked in sequence on the side of the shell body 10 away from the shielding ink layer 21. The first texture layer 22 is located between the shell body 10 and the coating layer 23.

[0085] The masking ink layer 21 is used to mask the fiber texture of the fiber cloth of the housing body 10, thereby enhancing the appearance of the housing 100. Optionally, the masking ink layer 21 is colored, thereby enabling the housing 100 to have different colors. Optionally, the color of the masking ink layer 21 can be, but is not limited to, at least one of red, orange, yellow, green, cyan, blue, purple, pink, black, white, gray, etc.

[0086] Optionally, the surface of the first texture layer 22 facing away from the shell body 10 has a first texture structure (not shown), and the first texture structure is a periodic grating structure, which can make the shell 100 have a texture light and shadow changing effect.

[0087] The coating layer 23 reflects light of different colors through the interference principle, thereby achieving a dazzling effect.

[0088] The varnish layer 24 can protect the coating layer 23 and improve the adhesion of the second texture layer 25 on the coating layer 23 .

[0089] Optionally, the surface of the second texture layer 25 facing away from the shell body 10 has a second texture structure (not shown). Optionally, the second texture structure can be, but is not limited to, a frosted texture, thereby giving the shell 100 a frosted or matte effect. In addition, it can better conceal the texture of the fiber cloth on the shell body 10, thereby improving the appearance of the shell 100.

[0090] In this embodiment, the appearance layer 20 includes a shielding ink layer 21, a first texture layer 22, a coating layer 23, a varnish layer 24 and a second texture layer 25. By shielding the ink layer 21, the first texture layer 22, the coating layer 23, the varnish layer 24 and the second texture layer 25, the shell 100 can have a better color effect and a double texture effect.

[0091] Figure 7 It is a partial cross-sectional view of the housing 100 corresponding to the planar portion 13 according to another embodiment of the present application.

[0092] See Figure 7 In other embodiments, the appearance layer 20 includes at least one of a shielding ink layer 21, a first texture layer 22, a coating layer 23, a varnish layer 24 and a second texture layer 25. The shielding ink layer 21, the first texture layer 22, the coating layer 23, the varnish layer 24 and the second texture layer 25 are stacked in sequence on the same side of the shell body 10, and the shielding ink layer 21 is located between the shell body 10 and the first texture layer 22.

[0093] In this embodiment, the appearance layer 20 includes a shielding ink layer 21, a first texture layer 22, a coating layer 23, a varnish layer 24 and a second texture layer 25. By shielding the ink layer 21, the first texture layer 22, the coating layer 23, the varnish layer 24 and the second texture layer 25, the shell 100 can have a better color effect and a double texture effect.

[0094] Compared with the scheme in which the shielding ink layer 21, the first texture layer 22, the coating layer 23, the varnish layer 24 and the second texture layer 25 are all arranged on the shell body 10, the scheme in which the shielding ink layer 21 is arranged on the side of the shell body 10 away from the first texture layer 22 can make the shell 100 have a better appearance effect. This is because the shielding ink layer 21 usually contains some particles, the surface is relatively rough, and there are protrusions, which will affect the appearance of the first texture layer 22.

[0095] Optionally, the shielding ink layer 21 may be, but is not limited to, a light-shielding ink that absorbs or reflects light. Optionally, the shielding ink layer 21 may be a single layer or multiple layers, for example, two, three, four, or five layers stacked together. A multi-layer shielding ink layer 21 provides a better shielding effect than a single layer. Optionally, the total thickness of the multi-layer shielding ink layer 21 is 5 μm to 50 μm. Specifically, the thickness of the multi-layer shielding ink layer 21 may be, but is not limited to, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 22 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, etc. Optionally, the thickness of a single-layer shielding ink layer 21 is 8 μm to 12 μm. Specifically, it may be, but is not limited to, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, etc.

[0096] Optionally, the first texture layer 22 can be formed by transferring a light-curing glue (such as UV glue) and then photocuring. For example, after UV glue is transferred to the surface of the shell 100, a light-curing texture layer is formed by photocuring. Optionally, the first texture layer 22 includes acrylic resin; that is, the light-curing glue is acrylic resin glue. Optionally, the thickness of the first texture layer 22 is 5μm to 10μm, specifically, it can be but not limited to 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, etc. If the thickness of the first texture layer 22 is too thin, it is not conducive to the formation of the first texture structure on the first texture layer 22; if the thickness of the first texture layer 22 is too thick, the thickness of the shell 100 is increased. When applied to the shell 100 of an electronic device, the thickness and weight of the electronic device are increased, affecting the feel and the user experience.

[0097] Optionally, the material of the coating layer 23 includes at least one of titanium oxide, silicon oxide, niobium oxide, zirconium oxide, etc. Optionally, the number of the coating layer 23 can be one or more layers. In one embodiment, the number of layers of the coating layer 23 can be 3 to 15 layers, specifically, but not limited to, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, etc. Optionally, the total thickness of the multilayer coating layer 23 ranges from 10 nm to 800 nm; specifically, the total thickness of the multilayer coating layer 23 can be, but not limited to, 10 nm, 30 nm, 50 nm, 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, 600 nm, 800 nm, etc.

[0098] Optionally, the varnish layer 24 is a transparent ink layer. The thickness of the varnish layer 24 ranges from 3 μm to 10 μm. Specifically, the thickness of the varnish layer 24 can be, but is not limited to, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm. If the varnish layer 24 is too thin, it will not protect the coating layer 23 or improve the adhesion of the second texture layer 25 to the coating layer 23. If the varnish layer 24 is too thick, it will increase the thickness of the housing 100, hindering the lightweight and thinness of the housing 100.

[0099] Optionally, the second texture layer 25 can be formed by transferring a light-curing glue (e.g., UV glue) and then light-curing it. For example, after UV glue is transferred to the surface of the shell 100, it is light-cured to form a light-cured texture layer. Optionally, the second texture layer 25 includes acrylic resin; that is, the light-curing glue is acrylic resin glue. Optionally, the thickness of the second texture layer 25 is 5μm to 20μm, specifically, it can be but not limited to 5μm, 6μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, etc. If the thickness of the second texture layer 25 is too thin, it is not conducive to the formation of the second texture structure on the second texture layer 25, and the wear resistance of the second texture layer 25 is reduced; if the thickness of the second texture layer 25 is too thick, the thickness of the shell 100 is increased. When applied to the shell 100 of an electronic device, the thickness and weight of the electronic device are increased, which affects the feel and the user experience is not good.

[0100] In some embodiments, the pencil hardness of the second texture layer 25 is greater than the pencil hardness of the first texture layer 22. The first texture layer 22 has a lower pencil hardness, which helps improve the adhesion of the coating layer 23 to the first texture layer 22. The second texture layer 25 has a higher pencil hardness, which can make the second texture layer 25 more wear-resistant, making the second texture structure less susceptible to wear and having a longer service life.

[0101] The shell 100 of the embodiment of the present application can be prepared by the method described in the following embodiments of the present application. In addition, it can also be prepared by other methods. The preparation method of the embodiment of the present application is merely one or more preparation methods of the shell 100 of the present application and should not be understood as a limitation on the shell 100 provided by the embodiment of the present application.

[0102] Figure 8 1 is a flow chart of a method for preparing the housing 100 according to an embodiment of the present application.

[0103] See Figure 8 , an embodiment of the present application provides a method for preparing a housing 100, the method comprising:

[0104] S201, providing a substrate layer, wherein the substrate layer includes at least one fiber resin layer 11. When the substrate layer includes at least two fiber resin layers 11, the at least two fiber resin layers 11 are stacked; the fiber resin layers 11 include fiber cloth and thermoplastic resin, and the thermoplastic resin wraps the surface of the fiber cloth;

[0105] For detailed descriptions of other aspects of the fiber resin layer 11 , the fiber cloth and the thermoplastic resin, please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0106] It should be noted that the substrate layer is a 2D planar structure.

[0107] S202, forming an exterior layer 20 on the surface of the substrate layer; and

[0108] Specifically, the exterior layer 20 is formed on the base layer to obtain a stacked structure of the base layer and the exterior layer 20 , ie, base layer / exterior layer 20 .

[0109] For detailed description of other aspects of the exterior layer 20 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0110] S203, performing hot bending forming (also known as hot pressing forming) to form the base material layer into a shell body 10 with a 3D structure, thereby obtaining a shell 100 with a 3D structure, wherein the shell 100 includes a shell body 10 and an appearance layer 20, and the appearance layer 20 is arranged on the surface of the shell body 10.

[0111] For detailed descriptions of other aspects of the shell 100 and the shell body 10 , please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0112] The substrate layer of the embodiment of the present application includes fiber cloth and thermoplastic resin. Thermoplastic resin can soften at high temperatures, has good reshapeability and deformability, and can be pressurized for secondary molding. Therefore, the method for preparing the shell 100 of the embodiment of the present application can first form the appearance layer 20 on the substrate layer with a 2D planar structure, and then heat-bend the stacked substrate layer and appearance layer 20 to obtain a 3D structure shell 100. Compared with forming the appearance layer 20 on a 3D structure, forming the appearance layer 20 on a planar substrate layer is simpler and less expensive. For example, the appearance layer 20 can be formed using a silk screen transfer process. In addition, the appearance layer 20 can be formed on a large planar substrate layer and then cut into preset sizes, thereby realizing the processing of the appearance layers 20 of multiple shells 100 at one time, greatly improving the processing efficiency of the shell 100 and significantly reducing the production cost of the shell 100. Furthermore, when using a fiber-thermosetting resin shell 100 with a texture, the texture needs to be formed by rubbing using a soft silicone mold. During the rubbing process, in order to make the silicone mold fit the 3D shape of the shell 100, the soft silicone mold must be deformed to fit the shape of the shell 100. The rubbing texture has the risk of deformation. Therefore, a relatively simple texture effect is usually selected, and the applied appearance layer 20 can be first formed on a substrate layer with a 2D structure, and then the substrate layer is hot-bent to obtain a 3D structure. Therefore, the texture of the appearance layer 20 is not easy to deform, and a more refined appearance effect can be prepared, such as a finer texture structure, so that the shell 100 has a better appearance expression.

[0113] It has been verified that, compared with the solution of using a fiber thermosetting resin layer to prepare a shell 100 with a 3D structure having an exterior layer 20, the preparation method of the shell 100 of the present application has higher efficiency and can reduce costs by more than 50%.

[0114] In some embodiments, in S203, hot bending is performed to form the base material layer into a shell body 10 with a 3D structure, thereby obtaining a shell 100 with a 3D structure, including: placing the stacked base material layer and the appearance layer 20 in a hot bending mold, performing hot bending to form the base material layer into a shell body 10 with a 3D structure, and demolding to obtain a shell 100 with a 3D structure.

[0115] As can be understood, during hot bending, the temperature is raised from room temperature to the desired bending temperature, then cooled to room temperature and demolded to obtain the 3D structured housing 100. During the high-temperature hot bending process, the thermoplastic resin in the substrate layer softens at high temperatures, possessing a certain degree of deformation capability, allowing it to be formed into the desired shape by applying pressure. Optionally, the temperature can be gradually lowered to room temperature in stages within the mold during the cooling process.

[0116] Figure 9Schematic diagram of the structure of a hot bending mold 100a according to an embodiment of the present application. Figure 10 Schematic diagram of the exploded structure of a hot bending mold 100a according to an embodiment of the present application. Figure 11 1 is a schematic diagram of an exploded structure of a base material layer 10b and an exterior layer 20 provided in a hot bending mold 100a according to an embodiment of the present application.

[0117] See Figures 9 to 11 The hot bending mold 100a includes a concave mold 10a and a convex mold 20a. The concave mold 10a and the convex mold 20a enclose a mold cavity 30a. The mold cavity 30a is used to set the stacked base material layer 10b and the appearance layer 20.

[0118] Optionally, the hot bending mold 100a can be, but is not limited to, at least one of a graphite mold and a metal mold. In other words, the die 10a can be, but is not limited to, at least one of a graphite mold and a metal mold; the punch 20a can be, but is not limited to, at least one of a graphite mold and a metal mold. The punch 20a has a shape that matches the crater (i.e., the raised portion 12) on the shell body 10, allowing the hot bending mold 100a to be used to form the raised portion 12.

[0119] Figure 12 1 is a schematic structural diagram of an embodiment of the present application in which the exterior layer 20 of a plurality of housings 100 is formed on a large substrate layer 10 b.

[0120] like Figure 12 As shown, in some embodiments, in S202, when forming the exterior layer 20 on the surface of the substrate layer 10b, a large substrate layer 10b is used to form multiple exterior layers 20 on the substrate, and then the substrate layer 10b and the exterior layers 20 are cut into small stacked substrate layers 10b and exterior layers 20. This can greatly improve the production efficiency of the housing 100 and reduce the production cost of the housing.

[0121] In some embodiments, in S203 , the temperature of the hot bending forming is in a range of 120° C. to 200° C.

[0122] Specifically, the temperature of hot bending can be, but is not limited to, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C, 180°C, 190°C, 200°C, etc.

[0123] In this embodiment, if the hot bending temperature is too low, the thermoplastic resin will not soften sufficiently, making it difficult to form, thereby reducing the accuracy of the 3D structure of the housing 100. Alternatively, higher pressure may be required to form the housing 100 with the desired 3D structure. Excessive pressure can easily cause deformation (e.g., texture deformation) of the exterior layer 20. If the hot bending temperature is too high, the exterior layer 20 cannot withstand the high temperature, and the texture on the exterior layer 20 may be easily deformed. The coating layer 23 on the exterior layer 20 may also be easily deformed, cracked, and wrinkled, thereby reducing the appearance of the housing 100 and the production yield of the housing 100.

[0124] In some embodiments, in S203 , the pressure of the hot bending forming is in a range of 0.1 MPa to 1 MPa.

[0125] Specifically, the pressure of hot bending can be, but is not limited to, 0.1 MPa, 0.2 MPa, 0.3 MPa, 0.4 MPa, 0.5 MPa, 0.6 MPa, 0.7 MPa, 0.8 MPa, 0.9 MPa, 1 MPa, etc.

[0126] In this embodiment, if the bending pressure is too low, the base layer 10b will not deform sufficiently, making it difficult to form, thereby reducing the accuracy of the 3D structure of the manufactured housing 100. If the bending pressure is too high, the texture of the exterior layer 20 will easily deform, and the coating layer 23 on the exterior layer 20 will easily deform, crack, and wrinkle. Both the base layer 10b and the exterior layer 20 will be damaged, reducing the appearance of the housing 100 and the production yield of the housing 100.

[0127] In some embodiments, the hot bending time ranges from 5 seconds to 500 seconds. Specifically, the hot bending time can be, but is not limited to, 5 seconds, 10 seconds, 20 seconds, 30 seconds, 50 seconds, 60 seconds, 90 seconds, 120 seconds, 150 seconds, 180 seconds, 240 seconds, 270 seconds, 300 seconds, 330 seconds, 360 seconds, 390 seconds, 420 seconds, 450 seconds, 480 seconds, 500 seconds, etc. In this embodiment, if the hot bending time is too short, the forming effect is poor, and it is difficult to obtain the housing 100 with the preset 3D structure; if the hot bending time is too long, energy consumption is increased, the production efficiency of the housing 100 is reduced, and the production cost of the housing 100 is increased.

[0128] Figure 13 1 is a flow chart of a method for preparing a housing 100 according to another embodiment of the present application.

[0129] See Figure 13 In some embodiments, after forming the appearance layer 20 on the surface of the substrate layer 10b and before performing the hot bending forming, the preparation method further includes:

[0130] S202 ′: forming a through hole 123 on the stacked base layer 10 b and the exterior layer 20 . The through hole 123 penetrates the base layer 10 b and the exterior layer 20 .

[0131] Optionally, a computer numerical control machining (CNC machining) is performed using a numerical control machine tool to form a through hole 123 penetrating the base material layer 10 b and the exterior layer 20 at a position corresponding to the protrusion 12 of the housing 100 .

[0132] Figure 14 1 is a flow chart of a method for preparing a housing 100 according to another embodiment of the present application.

[0133] See Figure 14 In other embodiments, after the hot bending forming, the preparation method includes:

[0134] S204 , forming a through hole 123 in the stacked shell body 10 and the exterior layer 20 , wherein the through hole 123 penetrates the shell body 10 and the exterior layer 20 .

[0135] Optionally, a CNC machine tool is used to perform Computer Numerical Control Machining (CNC machining) to form a through hole 123 penetrating the shell body 10 and the exterior layer 20 at a position corresponding to the raised portion 12 of the shell 100 .

[0136] Compared to Figure 14 The plan, Figure 13 The raised portion 12 (i.e., the crater position) of the shell 100 obtained by the solution has better flatness and better appearance.

[0137] In addition, after the hot bending process, the preparation method further comprises: cutting the final shape of the housing 100 using a CNC machine tool so that the housing 100 can match the shape of the electronic device being used.

[0138] Figure 15 1 is a flow chart of a method for preparing a housing 100 according to another embodiment of the present application.

[0139] See Figure 15 In some embodiments, the method for preparing the housing 100 provided in the embodiments of the present application includes:

[0140] S301, providing a substrate layer 10b, wherein the substrate layer 10b includes at least one fiber resin layer 11. When the substrate layer 10b includes at least two fiber resin layers 11, the at least two fiber resin layers 11 are stacked; the fiber resin layers 11 include fiber cloth and thermoplastic resin, and the thermoplastic resin wraps the surface of the fiber cloth;

[0141] For detailed descriptions of other aspects of the substrate layer 10b, the fiber resin layer 11, the fiber cloth and the thermoplastic resin, please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0142] S302, forming a shielding ink layer 21 on one surface of the substrate layer 10b;

[0143] Optionally, a light-shielding ink adhesive layer is formed on one surface of the substrate layer 10 b by screen printing or other processes, and is heated and cured to obtain the shielding ink layer 21 .

[0144] For detailed description of other aspects of the shielding ink layer 21 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0145] S303, forming a first texture layer 22 on the surface of the substrate layer 10b away from the shielding ink layer 21;

[0146] Optionally, a UV glue layer is coated on the surface of the substrate layer 10b facing away from the masking ink layer 21, and a texture mold (such as a roller) is used to roll and transfer the UV glue layer to form a first texture structure on the UV glue layer. The UV glue layer is ultraviolet-cured to obtain a first texture layer 22 having a first texture structure.

[0147] For detailed description of other aspects of the first texture layer 22 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0148] S304, forming a coating layer 23 on the surface of the first texture layer 22 facing away from the base material layer 10b;

[0149] Optionally, at least one of magnetron sputtering, evaporation coating, physical vapor deposition vacuum coating (PVD vacuum coating), chemical vapor deposition and other processes is used to plate a coating layer 23 on the surface of the first texture layer 22 away from the substrate layer 10b.

[0150] For detailed description of other aspects of the coating layer 23 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0151] S305, forming a varnish layer 24 on the surface of the coating layer 23 facing away from the substrate layer 10b;

[0152] Optionally, a transparent ink adhesive layer is formed on the surface of the coating layer 23 facing away from the substrate layer 10 b by a process such as screen printing, and is heated and cured to obtain the varnish layer 24 .

[0153] For detailed description of other aspects of the varnish layer 24 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0154] S306, forming a second texture layer 25 on the surface of the varnish layer 24 facing away from the substrate layer 10b, thereby obtaining a laminated substrate layer 10b and an appearance layer 20, wherein the appearance layer 20 includes a shielding ink layer 21, a first texture layer 22, a coating layer 23, a varnish layer 24, and a second texture layer 25; and

[0155] Optionally, a UV glue layer is coated on the surface of the varnish layer 24 facing away from the substrate layer 10b, and a texture mold (such as a roller) is used to roll and transfer the UV glue layer to form a second texture structure on the UV glue layer. The UV glue layer is ultraviolet-cured to obtain a second texture layer 25 having a second texture structure.

[0156] For detailed description of other aspects of the second texture layer 25 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0157] It should be noted that, in this embodiment, S302 may be before S303 or after S306.

[0158] S307, hot-bending the stacked base material layer 10b and the texture layer to form the base material layer 10b into a shell body 10 with a 3D structure, thereby obtaining a shell 100 with a 3D structure, wherein the shell 100 includes a shell body 10 and an appearance layer 20, and the appearance layer 20 is arranged on the surface of the shell body 10.

[0159] For detailed description of other aspects of S307, please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0160] Figure 16 1 is a flow chart of a method for preparing a housing 100 according to another embodiment of the present application.

[0161] See Figure 16 In other embodiments, the method for preparing the housing 100 provided in the embodiments of the present application includes:

[0162] S401, providing a substrate layer 10b, wherein the substrate layer 10b includes at least one fiber resin layer 11. When the substrate layer 10b includes at least two fiber resin layers 11, the at least two fiber resin layers 11 are stacked; the fiber resin layers 11 include fiber cloth and thermoplastic resin, and the thermoplastic resin wraps the surface of the fiber cloth;

[0163] For detailed descriptions of other aspects of the fiber resin layer 11 , the fiber cloth and the thermoplastic resin, please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0164] S402, forming a shielding ink layer 21 on one surface of the substrate layer 10b;

[0165] For detailed description of other aspects of the shielding ink layer 21 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0166] S403, forming a first texture layer 22 on the surface of the shielding ink layer 21 facing away from the substrate layer 10b;

[0167] For detailed description of other aspects of the first texture layer 22 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0168] S404, forming a coating layer 23 on the surface of the first texture layer 22 facing away from the base material layer 10b;

[0169] For detailed description of other aspects of the coating layer 23 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0170] S405, forming a varnish layer 24 on the surface of the coating layer 23 facing away from the substrate layer 10b;

[0171] For detailed description of other aspects of the varnish layer 24 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0172] S406, forming a second texture layer 25 on the surface of the varnish layer 24 facing away from the substrate layer 10b, thereby obtaining a laminated substrate layer 10b and an appearance layer 20, wherein the appearance layer 20 includes a shielding ink layer 21, a first texture layer 22, a coating layer 23, a varnish layer 24, and a second texture layer 25; and

[0173] For detailed description of other aspects of the second texture layer 25 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0174] S407, hot-bending the stacked base material layer 10b and the texture layer to form the base material layer 10b into a shell body 10 with a 3D structure, thereby obtaining a shell 100 with a 3D structure, wherein the shell 100 includes a shell body 10 and an appearance layer 20, and the appearance layer 20 is arranged on the surface of the shell body 10.

[0175] For detailed description of other aspects of S307, please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0176] Please see again Figure 1 , an embodiment of the present application further provides a shell 100, and the shell 100 is prepared by the preparation method of the shell 100 described in the embodiment of the present application.

[0177] For detailed description of other aspects of the housing 100 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0178] See Figures 17 to 19 The embodiment of the present application also provides an electronic device 300, which includes a display screen 310, a shell 100 described in the embodiment of the present application, and a processor 330. The shell 100 is arranged back to back with the display screen 310, and the processor 330 is arranged between the display screen 310 and the shell 100. The processor 330 is electrically connected to the display screen 310 for controlling the display screen 310 to display.

[0179] The electronic device 300 of the embodiment of the present application may be, but is not limited to, a portable electronic device 300 such as a mobile phone, a tablet computer, a laptop computer, a desktop computer, a smart bracelet, a smart watch, an e-reader, a game console, etc. It is understandable that the electronic device 300 described in this embodiment is merely one form of electronic device 300 to which the housing 100 is applied, and should not be construed as limiting the electronic device 300 provided in this application, nor should it be construed as limiting the housing 100 provided in each embodiment of this application.

[0180] For a detailed description of the housing 100 , please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0181] Optionally, the display screen 310 may be, but is not limited to, one or more of a liquid crystal display screen, a light emitting diode display screen (LED display screen), a micro light emitting diode display screen (Micro LED display screen), a sub-millimeter light emitting diode display screen (Mini LED display screen), an organic light emitting diode display screen (OLED display screen), etc.

[0182] Optionally, the processor 330 includes one or more general-purpose processors 330, where a general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC. The processor 330 is used to execute various types of digitally stored instructions, such as software or firmware programs stored in memory, which enables the computing device to provide a wide variety of services.

[0183] Optionally, the electronic device 300 of the present application further includes a memory 350. The memory 350 is electrically connected to the processor 330 and is used to store program codes required for the processor 330 to run, program codes required for controlling the display screen 310, display content of the display screen 310, and the like.

[0184] Optionally, the memory 350 may include volatile memory, such as random access memory (RAM); the memory 350 may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). The memory 350 may also include a combination of the above types of memory.

[0185] In some embodiments, the electronic device 300 of the embodiment of the present application further includes a middle frame 320 and a camera module 370. The middle frame 320 is disposed between the display screen 310 and the housing 100, and the side of the middle frame 320 is exposed to the housing 100 and the display screen 310. The middle frame 320 and the housing 100 enclose a housing space (not shown), which is used to accommodate the system-level chip, the memory 350, and the camera module 370. The camera module 370 is electrically connected to the system-level chip and is used to take pictures under the control of the system-level chip.

[0186] Optionally, the housing 100 has a light-transmitting portion 101, and the camera module 370 can capture images through the light-transmitting portion 101 on the housing 100. That is, the camera module 370 in this embodiment is a rear-facing camera module 370. It is understood that in other embodiments, the light-transmitting portion 101 can be provided on the display screen 310, that is, the camera module 370 is a front-facing camera module 370. In the schematic diagram of this embodiment, the light-transmitting portion 101 is illustrated as an opening. In other embodiments, the light-transmitting portion 101 may not be an opening, but may be made of a light-transmitting material, such as plastic or glass.

[0187] References to "embodiments" and "implementation methods" in this application mean that the specific features, structures or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrases in various locations in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments that are mutually exclusive with other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should be understood that the features, structures or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of this application, unless there is a contradiction between them.

[0188] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the above preferred implementation modes, ordinary technicians in this field should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for preparing a shell, characterized in that: The preparation method comprises: Providing a substrate layer, the substrate layer comprising at least one fiber resin layer. When the substrate layer comprises at least two fiber resin layers, the at least two fiber resin layers are stacked; the fiber resin layer comprises fiber cloth and thermoplastic resin, and the thermoplastic resin wraps the surface of the fiber cloth; forming an appearance layer on the surface of the substrate layer; and Hot bending is performed to form the base material layer into a shell body with a 3D structure, thereby obtaining a shell with a 3D structure. The shell includes a shell body and an appearance layer, and the appearance layer is arranged on the surface of the shell body.

2. The method for preparing a housing according to claim 1, wherein: The temperature of the hot bending forming is in the range of 120°C to 200°C.

3. The method for preparing a housing according to claim 1, wherein: The pressure of the hot bending forming is in the range of 0.1 MPa to 1 MPa.

4. The method for preparing a housing according to any one of claims 1 to 3, characterized in that: The appearance layer includes at least one of a shielding ink layer, a first texture layer, a coating layer, a varnish layer, and a second texture layer; The forming of the appearance layer on the surface of the substrate layer comprises: forming a shielding ink layer on one surface of the substrate layer; forming a first texture layer on a surface of the substrate layer facing away from the shielding ink layer or on a surface of the shielding ink layer facing away from the substrate layer; forming a coating layer on a surface of the first texture layer facing away from the substrate layer; forming a varnish layer on the surface of the coating layer facing away from the substrate layer; and A second texture layer is formed on the surface of the varnish layer facing away from the substrate layer.

5. A housing, characterized in that: The shell is prepared by the shell preparation method according to any one of claims 1 to 4.

6. A housing, characterized in that: The housing comprises: A shell body, the shell body comprising at least one fiber resin layer. When the shell comprises at least two fiber resin layers, the at least two fiber resin layers are stacked; the fiber resin layer comprises fiber cloth and thermoplastic resin, the thermoplastic resin wrapping the surface of the fiber cloth; the shell body comprising a connected raised portion and a flat portion, the flat portion being arranged around the periphery of the raised portion, and the raised portion protruding from the flat portion; and An exterior layer is provided on the surface of the shell body, and covers the raised portion and the planar portion.

7. The housing according to claim 6, wherein: The glass transition temperature of the thermoplastic resin is greater than 100°C.

8. The housing according to claim 6, wherein: The glass transition temperature Tg of the thermoplastic resin is in the range of 110°C≤Tg≤150°C.

9. The housing according to claim 6, wherein: The thermoplastic resin includes at least one of polyamide and polycarbonate.

10. The housing according to any one of claims 6 to 9, characterized in that: The raised portion includes a first sub-portion and a second sub-portion that are bent and connected. The first sub-portion has a through hole. The second sub-portion is arranged around the outer circumference of the first sub-portion. The end of the second sub-portion away from the first sub-portion is bent and connected to the planar portion.

11. The housing according to any one of claims 6 to 9, characterized in that: The exterior layer includes at least one of a shielding ink layer, a first texture layer, a coating layer, a varnish layer, and a second texture layer, wherein the shielding ink layer is disposed on one side of the shell body, and the first texture layer, the coating layer, the varnish layer, and the second texture layer are sequentially stacked on a side of the shell body facing away from the shielding ink layer, and the first texture layer is located between the shell body and the coating layer; Alternatively, the appearance layer includes at least one of a shielding ink layer, a first texture layer, a coating layer, a varnish layer and a second texture layer, and the shielding ink layer, the first texture layer, the coating layer, the varnish layer and the second texture layer are stacked in sequence on the same side of the shell body, and the shielding ink layer is located between the shell body and the first texture layer.

12. An electronic device, characterized in that: The electronic device comprises: Display screen; The housing according to any one of claims 5 to 11, wherein the housing is disposed opposite to the display screen; and A processor is provided between the display screen and the housing, and the processor is electrically connected to the display screen, and is used to control the display screen to perform display.

Images