Server cabinet, server and server control method

Abstract

The invention discloses a server cabinet, a server and a server control method, and relates to the technical field of server equipment.The server cabinet comprises a liquid storage tank and partition plates, a liquid storage cavity is defined by the liquid storage tank, equipment to be cooled is placed in the liquid storage cavity, and the multiple partition plates are selectively installed in the liquid storage cavity to divide the liquid storage cavity into multiple independent cavities. And the unused liquid storage space is isolated through the partition plate, so that the filling volume of the cooling liquid is reduced. Each independent cavity is correspondingly provided with at least one liquid inlet and at least one liquid outlet, and it is guaranteed that cooling liquid can be accurately injected and recycled in each cavity. The partition plate is arranged in the liquid storage cavity of the liquid storage tank, and the liquid inlet and the liquid outlet which are communicated with the liquid storage cavity are formed, so that the technical problem that cooling liquid is wasted due to the fact that the size of to-be-cooled equipment is not matched with that of the liquid storage cavity of the liquid storage tank is solved, and the technical effect of saving the cooling liquid is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of server equipment, and in particular to a server cabinet, a server, and a server control method. Background Art

[0002] Currently, server liquid cooling technology has become an important means of improving cooling efficiency and reducing energy consumption in high-density data centers. In traditional liquid cooling system designs, the equipment to be cooled is placed in a liquid tank, which contains a reservoir containing coolant. The low-temperature coolant exchanges heat with the hot equipment to be cooled. The heated coolant then flows out of the tank, where it is cooled, and then flows back into the tank. This cycle repeats, cooling the equipment to be cooled and preventing equipment failures caused by heat generated by server operation.

[0003] However, existing technologies commonly suffer from a mismatch between the size of the device being cooled and the reservoir. Specifically, when the volume of the device being cooled is smaller than the reservoir, the coolant must fill the entire reservoir. This excess coolant not only increases the initial cost of the system but also consumes additional energy during the coolant circulation process, reducing the energy efficiency of the entire liquid cooling system. Furthermore, coolant evaporation and maintenance costs increase with the total amount of coolant, further exacerbating resource waste. Summary of the Invention

[0004] The present application provides a server cabinet, a server, and a server control method to at least solve the problem in the related art of waste of coolant caused by mismatch between the size of the device to be cooled and the liquid storage cavity of the liquid storage tank.

[0005] The present application provides a server cabinet, comprising: a liquid storage tank and a plurality of partitions, wherein the liquid storage tank encloses a liquid storage cavity with an opening at the top; at least one of the plurality of partitions can be selectively installed in the liquid storage cavity to separate the liquid storage cavity into at least two independent chambers; the liquid storage tank is provided with a plurality of liquid inlets and a plurality of liquid outlets, and each chamber is correspondingly provided with at least one liquid inlet and at least one liquid outlet, and each liquid inlet and each liquid outlet are connected to the liquid path of the liquid storage cavity.

[0006] Furthermore, in the server cabinet, multiple liquid inlets and multiple liquid outlets are sequentially arranged on the liquid storage tank along a first direction, and each partition is perpendicular to the first direction, wherein the first direction is an extension direction of the liquid storage tank.

[0007] Furthermore, a plurality of card slots are provided on the inner wall of the liquid storage tank and arranged perpendicular to the first direction. The plurality of card slots are arranged at intervals along the first direction. At least one liquid inlet and at least one liquid outlet are provided between two adjacent card slots. The card slots are used to be connected with the partition.

[0008] Furthermore, the server cabinet also includes multiple seals, each card slot is provided with at least one seal, and the partition is arranged in cooperation with the seals in the card slot; and / or, the server cabinet also includes multiple fixing frames, and the multiple fixing frames and the multiple liquid outlets are arranged at one end of the liquid storage tank near the opening in a one-to-one correspondence; the liquid storage tank is provided with multiple liquid level sensors at one end near the opening, and each liquid inlet and each liquid outlet is provided with a flow regulating valve, and the multiple flow regulating valves are arranged one-to-one correspondingly with the multiple liquid level sensors, and each flow regulating valve is configured to adjust the size of its opening based on the signal of the liquid level sensor.

[0009] Furthermore, the server cabinet also includes a liquid supply device, which includes a liquid supply pipe and multiple liquid inlet pipes. The liquid supply pipe is connected to each liquid inlet pipe respectively, and the multiple liquid inlet pipes are arranged in a one-to-one correspondence with the multiple liquid inlets.

[0010] Furthermore, each liquid inlet pipe is passed through the liquid storage tank and at least partially extends into the liquid storage cavity, and a plurality of liquid inlet holes are provided on the liquid inlet pipe, wherein the apertures of the plurality of liquid inlet holes gradually increase in the direction away from the liquid inlet port; and / or, the plurality of liquid inlet holes are arranged in sequence at intervals along the direction in which the liquid inlet pipe extends; and / or, the plurality of liquid inlet holes include a main liquid inlet hole and an auxiliary liquid inlet hole, and the aperture of the main liquid inlet hole is larger than the aperture of the auxiliary liquid inlet hole.

[0011] Furthermore, the server cabinet also includes a drain pipe, and a plurality of drain ports are provided at the bottom of the liquid storage tank. The plurality of drain ports are provided in one-to-one correspondence with the plurality of liquid inlets. The drain pipe is connected to each drain port, wherein each drain port is provided with a flow control valve.

[0012] Furthermore, the server cabinet also includes a cabinet body and a cover plate, which is detachably arranged on the top of the cabinet body so that the cover plate and the cabinet body enclose an installation cavity for placing a liquid storage tank, and the cabinet body is provided with a plurality of through holes connected to the outside of the installation cavity so that the cooling liquid inside the liquid storage cavity is connected to the liquid path of the external liquid supply device.

[0013] Furthermore, a plurality of mounting brackets for supporting the liquid storage tank are provided at the bottom of the liquid storage tank, so that the bottom of the liquid storage tank is spaced apart from the bottom of the cabinet.

[0014] Another aspect of the present application provides a server for controlling the above-mentioned server cabinet. The server includes: multiple flow regulating valves and a power supply device. A flow regulating valve is provided at each liquid inlet, and the opening of each flow regulating valve can be adjusted.

[0015] The power supply device is arranged at one end of the liquid storage tank near the opening. The power supply device includes a detection device and multiple power supply sockets that are interconnected. The power supply sockets are used to be electrically connected to the equipment to be cooled so that the detection device can obtain the power of the equipment to be cooled and the temperature of the heat-generating components of the equipment to be cooled; the control module is respectively connected to the power supply device and multiple flow regulating valves to control the opening of each flow regulating valve according to the power of the equipment to be cooled and the temperature of the heat-generating components of the equipment to be cooled.

[0016] Furthermore, the server further comprises: a plurality of position sensors and a plurality of card slots, each of which is provided with a position sensor, and the position sensor is used to detect the position of the partition in the card slot.

[0017] Another aspect of the present application also provides a server control method, which is applicable to the above-mentioned server. The server control method includes: obtaining the power of the device to be cooled; judging whether the power of the device to be cooled is within a preset range, so as to adjust the opening angle of the flow regulating valve of the liquid inlet accordingly; when the power of the device to be cooled exceeds the preset range, controlling the opening angle of the flow regulating valve of the liquid inlet to increase or decrease.

[0018] Furthermore, the server control method includes: when the power of the device to be cooled is higher than a preset range, controlling the opening angle of the flow regulating valve to increase; when the power of the device to be cooled is lower than the preset range, controlling the opening angle of the flow regulating valve of the liquid inlet to decrease.

[0019] Furthermore, when the power of the device to be cooled is within a preset range, the server control method also includes: obtaining the temperature of the device to be cooled; judging whether the temperature of the device to be cooled is within the preset range, so as to adjust the opening angle of the flow regulating valve at the liquid outlet accordingly; when the temperature of the device to be cooled is outside the preset range, controlling the opening angle of the flow regulating valve at the liquid inlet to increase or decrease; otherwise, keeping the opening angle of the flow regulating valve at the liquid inlet unchanged.

[0020] Furthermore, when the temperature of the device to be cooled is outside the preset range, the server control method includes: when the temperature of the device to be cooled is higher than the preset range, controlling the opening angle of the flow regulating valve of the liquid inlet to increase; when the temperature of the device to be cooled is lower than the preset range, controlling the opening angle of the flow regulating valve of the liquid inlet to decrease.

[0021] Through the present application, since the liquid storage tank is enclosed to form a liquid storage cavity with an opening at the top, the server waiting for the cooling equipment is placed in the liquid storage cavity, and multiple partitions can be selectively installed in the liquid storage cavity according to actual needs, dividing the liquid storage cavity into multiple independent chambers, and dynamically adjusting the amount of coolant used according to the number of servers and the heat generation. When the number of servers is small or the heat generation is low, the unused liquid storage space is isolated by partitions, reducing the filling volume of the coolant. Each independent chamber is correspondingly provided with at least one liquid inlet and at least one liquid outlet, and they are all connected to the liquid path inside the liquid storage cavity. It ensures that the coolant can be accurately injected and recovered in each chamber, reducing unnecessary coolant consumption. Therefore, the technical problem of coolant waste caused by the mismatch in the size of the liquid storage cavity of the server and the cabinet can be solved, and the technical effect of saving coolant can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 A three-dimensional schematic diagram of a liquid storage tank of an embodiment of a server cabinet provided in an embodiment of the present application from one angle;

[0024] Figure 2 A three-dimensional schematic diagram of a liquid storage tank of an embodiment of a server cabinet provided in an embodiment of the present application, viewed from another angle;

[0025] Figure 3 A three-dimensional schematic diagram of a liquid supply device of an embodiment of a server cabinet provided in an embodiment of the present application;

[0026] Figure 4 A three-dimensional schematic diagram of a drain pipe of a server cabinet according to an embodiment of the present application;

[0027] Figure 5 A three-dimensional schematic diagram of an embodiment of a server cabinet provided in an embodiment of the present application;

[0028] Figure 6 A flow chart of a server control method provided in an embodiment of the present application.

[0029] The above drawings include the following reference numerals:

[0030] 100, liquid storage tank; 101, liquid storage cavity; 110, card slot; 200, partition; 300, liquid supply device; 301, liquid inlet; 310, liquid supply pipe; 320, liquid inlet pipe; 321, liquid inlet hole; 321a, main liquid inlet hole; 321b, auxiliary liquid inlet hole; 400, liquid outlet pipe; 401, liquid outlet; 500, fixing bracket; 600, power supply device; 700, drain pipe; 701, drain outlet; 810, cabinet; 811, through hole; 820, cover. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0032] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0033] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0034] An embodiment of the present application provides a server cabinet, and the device is described in detail in combination with the structure and working principle of the server cabinet.

[0035] like Figures 1 to 5 As shown, one aspect of the present application provides a server cabinet, including a liquid storage tank 100, which encloses a liquid storage cavity 101 with an opening on the top; a plurality of partitions 200, at least one of the plurality of partitions 200 can be selectively installed in the liquid storage cavity 101 to separate the liquid storage cavity 101 into at least two independent chambers; a plurality of liquid inlets 301 and a plurality of liquid outlets 401 are provided on the liquid storage tank 100, and each chamber is correspondingly provided with at least one liquid inlet 301 and at least one liquid outlet 401, and each liquid inlet 301 and each liquid outlet 401 are connected to the liquid path of the liquid storage cavity 101.

[0036] The server cabinet of the present application solves the technical problem of coolant waste caused by the mismatch in size between the equipment to be cooled and the liquid storage cavity 101 of the liquid storage tank 100 by setting a partition 200 in the liquid storage cavity 101 of the liquid storage tank 100, and setting a liquid inlet 301 and a liquid outlet 401 connected to the liquid storage cavity 101, thereby achieving the technical effect of saving coolant.

[0037] In the above embodiment, the liquid storage tank 100 encloses a liquid storage chamber 101 with an opening at the top. This design allows servers awaiting cooling to be placed within the liquid storage chamber, where they come into direct contact with the coolant, achieving efficient cooling. The top opening facilitates installation and maintenance of the equipment being cooled, while also allowing for controlled flow of coolant. Multiple partitions 200 can be selectively installed within the liquid storage chamber 101 according to actual needs, dividing the chamber into multiple independent chambers. This design overcomes the limitations of fixed liquid storage chamber sizes in traditional cabinets, allowing for dynamic adjustment of coolant usage based on the number and heat generation of the equipment being cooled. When the number of devices to be cooled is small or the heat generation is low, partitions can be used to isolate unused liquid storage space, reducing the required coolant volume and thus saving significant coolant resources. Each independent chamber is provided with at least one liquid inlet 301 and at least one liquid outlet 401, both of which are connected to the fluid path within the liquid storage chamber 101. This arrangement ensures accurate injection and recovery of coolant into and out of each chamber, preventing free flow of coolant within the cabinet and reducing unnecessary coolant consumption. Precise control of the inlet and outlet allows for fine-tuning of coolant supply based on the actual heat output of the equipment being cooled, improving cooling efficiency and reducing ineffective coolant use. The combination of multiple baffles 200 and the reservoir 100 enables dynamic adjustment of the reservoir volume, while the arrangement of the inlet 301 and outlet 401 ensures precise distribution and recovery of coolant. This synergistic effect allows the server cabinet to adaptively adjust coolant usage based on the layout and heat output requirements of different servers, avoiding coolant waste associated with fixed reservoir designs. In practical applications, the deployment and load of equipment being cooled are constantly changing. In traditional designs, the reservoir size is fixed, requiring the entire reservoir to be filled with coolant regardless of changes in the layout and heat output of the equipment being cooled. This undoubtedly increases coolant usage and maintenance costs. The server cabinet of the present application can accurately match the layout and heat generation of the equipment to be cooled through dynamic isolation of partitions, and distribute coolant on demand, thereby significantly reducing coolant waste, improving the energy efficiency of the cooling system, and reducing operating costs.

[0038] Specifically, in the server cabinet, multiple liquid inlets 301 and multiple liquid outlets 401 are arranged sequentially along a first direction on the liquid storage tank 100, with each partition 200 perpendicular to the first direction, where the first direction is the extension direction of the liquid storage tank 100. The liquid inlets 301 and liquid outlets 401 are arranged in an orderly manner along the extension direction of the liquid storage tank 100. This design ensures that each cavity divided by the partition 200 is provided with at least one liquid inlet 301 and at least one liquid outlet 401.

[0039] Specifically, the inner wall of the liquid storage tank 100 is provided with a plurality of slots 110 arranged perpendicular to a first direction. The slots are spaced apart along the first direction, and at least one liquid inlet 301 and at least one liquid outlet 401 are provided between two adjacent slots. The slots are configured to engage with the partition 200. The slots 110 are arranged along the inner wall of the liquid storage tank 100 and perpendicular to the first direction. The partition 200 engages with the slots 110, thereby dynamically separating the internal space of the liquid storage chamber 101. By combining the slots 110 with the partition 200, the chamber can be flexibly adjusted according to the number and size of the devices to be cooled, so that the coolant flows only in the area that needs cooling, reducing coolant overflow and waste.

[0040] Specifically, the server cabinet also includes multiple seals, with at least one seal provided in each slot, and the partitions cooperate with the seals in the slots. The server cabinet also includes multiple mounting brackets 500, which are arranged at the end of the liquid storage tank 100 near the opening, corresponding one-to-one with the multiple liquid outlets 401. The liquid storage tank 100 is provided with multiple liquid level sensors at the end near the opening. Each liquid inlet 301 and each liquid outlet 401 is provided with a flow control valve, which is arranged one-to-one with the multiple liquid level sensors. Each flow control valve is configured to adjust its opening based on the signal from the liquid level sensor. The seals form a good seal with the slots 110 and partitions 200. The mounting brackets 500 stably support the equipment to be cooled at the liquid outlet 401. The liquid level sensors and flow control valves together constitute an automatic control system. The seal ensures effective separation of the partition chamber; the fixing bracket 500 provides a stable installation support for the equipment to be cooled; and the flow control valve automatically adjusts its opening according to the information fed back by the liquid level sensor, accurately controlling the coolant flow and avoiding cooling failure or coolant overflow caused by excessively high or low liquid levels.

[0041] like Figure 3 Specifically, the server cabinet also includes a liquid supply device 300, which includes a liquid supply pipe 310 and multiple liquid inlet pipes 320. The liquid supply pipe 310 is connected to each liquid inlet pipe 320, and the multiple liquid inlet pipes 320 are arranged in a one-to-one correspondence with the multiple liquid inlets 301. The liquid supply device 300 is connected to each liquid inlet pipe 320 through the liquid supply pipe 310, and then forms a liquid supply link with the liquid inlet 301. This connection structure ensures that coolant can be continuously and stably supplied from the external liquid supply device to each partitioned chamber within the liquid storage tank 100, meeting the cooling needs of different areas.

[0042] Specifically, each liquid inlet pipe 320 is disposed on the liquid storage tank 100 and at least partially extends into the liquid storage cavity 101. The liquid inlet pipe 320 is provided with a plurality of liquid inlet holes 321, wherein the diameter of the plurality of liquid inlet holes 321 gradually increases as it moves away from the liquid inlet port 301. The plurality of liquid inlet holes 321 are sequentially spaced along the direction in which the liquid inlet pipe 320 extends. The plurality of liquid inlet holes 321 include a main liquid inlet hole 321a and auxiliary liquid inlet holes 321b, wherein the diameter of the main liquid inlet hole 321a is larger than the diameter of the auxiliary liquid inlet holes 321b. The liquid inlet pipe 320 is disposed on the liquid storage tank 100 and introduces the coolant into the liquid storage cavity 101 through the main liquid inlet holes 321a and the auxiliary liquid inlet holes 321b. The design of the main liquid inlet hole 321a and the auxiliary liquid inlet hole 321b can provide differentiated coolant injection amounts according to the distribution of heat-generating components inside the equipment to be cooled. The main liquid inlet hole 321a is responsible for centralized cooling of high-heating areas, while the auxiliary liquid inlet hole 321b evenly distributes the coolant, which improves the cooling effect while ensuring efficient use of the coolant.

[0043] like Figure 4 As shown, the server cabinet further includes a drain pipe 700. The bottom of the liquid storage tank 100 is provided with multiple drain ports 701, each corresponding to the multiple liquid inlets 301. The drain pipe 700 is connected to each drain port 701, and each drain port 701 is provided with a flow control valve. The drain pipe 700 is connected to the multiple drain ports 701 at the bottom of the liquid storage tank 100 and is provided with a flow control valve. The combination of the drain pipe 700 and the drain ports 701, coupled with the precise control of the flow control valve, allows for quick and efficient draining of coolant from a specific chamber, reducing coolant loss and maintenance time.

[0044] like Figure 5 As shown, specifically, the server cabinet also includes a cabinet body 810 and a cover plate 820. The cover plate 820 is removably mounted on the top of the cabinet body 810, so that the cover plate 820 and the cabinet body 810 enclose a mounting cavity for placing the liquid storage tank 100. The cabinet body 810 is provided with a plurality of through holes 811 that communicate with the outside of the mounting cavity, so that the coolant inside the liquid storage cavity 101 is in fluid communication with the external liquid supply device 300. The cabinet body 810 and the cover plate 820 form a closed space to accommodate the liquid storage tank 100, and the through holes 811 ensure that the coolant in the liquid storage cavity 101 can be connected to the external liquid supply device 300. The combination of the cabinet body 810 and the cover plate 820 provides a safe storage environment, protecting the internal equipment from external influences; and the presence of the through holes 811 ensures smooth circulation of the coolant, allowing the system to maintain a closed state while achieving effective replenishment and circulation of the coolant.

[0045] Specifically, the bottom of the liquid reservoir 100 is provided with multiple mounting brackets for supporting the liquid reservoir 100, thereby ensuring that the bottom of the liquid reservoir 100 is spaced apart from the bottom of the cabinet 810. The mounting brackets provide a certain distance between the bottom of the liquid reservoir 100 and the bottom of the cabinet 810. The installation of the mounting brackets helps improve the stability of the liquid reservoir. The resulting bottom spacing increases the flow space for the coolant, facilitating coolant circulation and heat dissipation, optimizing the cooling effect, and facilitating maintenance and cleaning.

[0046] Another aspect of the present application provides a server for controlling the above-mentioned server cabinet, the server comprising: a plurality of flow regulating valves, each of which is provided with a flow regulating valve at the liquid inlet 301, and the opening of each flow regulating valve being adjustable. A power supply device 600, the power supply device 600 being provided at one end of the liquid storage tank 100 close to the opening, the power supply device 600 comprising a detection device and a plurality of power sockets connected to each other, the power sockets being used to be electrically connected to the device to be cooled so that the detection device can obtain the power of the device to be cooled and the temperature of the heating component of the device to be cooled; a control module, respectively connected to the power supply device 600 and the plurality of flow regulating valves, to control the opening of each flow regulating valve according to the power of the device to be cooled and the temperature of the heating component of the device to be cooled.

[0047] The above embodiment provides a server that aims to improve cooling efficiency and reduce operating costs by dynamically adjusting the flow of coolant to adapt to different heat generation scenarios of the server. The system mainly includes a plurality of flow regulating valves, a power supply device 600 and a control module. Each liquid inlet 301 is equipped with a flow regulating valve, the opening of which can be adjusted according to the control instruction to accurately control the inflow of coolant. The power supply device 600 is installed at one end of the liquid storage tank 100 close to the opening. The power supply device integrates a detection device and a plurality of power sockets, which can provide power to the equipment to be cooled and collect the real-time power and temperature data of the heat-generating components of the equipment to be cooled at the same time. The control module is connected to the power supply device 600 and the flow regulating valve, and intelligently adjusts the opening of the flow regulating valve based on the power and temperature information collected in real time to ensure that the flow of coolant matches the heat load of the equipment to be cooled.

[0048] During use of the above-described embodiment, after receiving power information from the power supply device 600 regarding the device to be cooled, the control module first determines whether the power is within a preset normal range. If the power of the device to be cooled exceeds the preset range, the control module instructs the flow control valve to open at an increased angle, thereby increasing the coolant flow rate and rapidly removing excess heat generated by the server. Conversely, if the power is below the preset range, the control module controls the flow control valve to open at a decreased angle, thereby reducing unnecessary coolant consumption. This dynamic flow control strategy, based on the power of the device to be cooled, can significantly improve cooling efficiency and reduce coolant waste.

[0049] Specifically, the server also includes multiple position sensors and multiple slots. Each slot 110 is equipped with a position sensor that detects the position of the partition 200 within the slot 110. Each slot 110 is equipped with a position sensor that detects the position of the partition 200 in real time, ensuring that each partition can be accurately identified. The partition position information detected by the position sensor is transmitted to the control module in real time. Using this position information, the control module can quickly identify layout changes in the equipment to be cooled, such as increases or decreases in the number of devices to be cooled and the division of the liquid storage chamber 101 into specific chambers. Based on this position information, the control module automatically adjusts the distribution of coolant between the different chambers. For example, if the number of devices to be cooled increases or high-heat-density devices are added, the control module adjusts the corresponding flow control valves to increase the coolant supply, ensuring adequate cooling for the high-load devices. If the number of devices to be cooled decreases or low-heat-density devices are replaced, the control module reduces the coolant supply to avoid unnecessary resource waste.

[0050] like Figure 6 As shown, another aspect of the present application also provides a server control method, which is applicable to the above-mentioned server, and the server control method includes: obtaining the power of the device to be cooled; judging whether the power of the device to be cooled is within a preset range, so as to adjust the opening angle of the flow regulating valve of the liquid inlet 301 accordingly; when the power of the device to be cooled exceeds the preset range, controlling the opening angle of the flow regulating valve of the liquid inlet 301 to increase or decrease. First, the control module obtains the real-time power information of the device to be cooled from the power supply device 600. If the power of the device to be cooled exceeds the preset range, the control module immediately adjusts the opening angle of the flow regulating valve to increase or decrease the flow of coolant to ensure that the server operates within a safe temperature range.

[0051] Specifically, the server control method includes: when the power of the device to be cooled is higher than the preset range, controlling the flow regulating valve opening angle to increase; when the power of the device to be cooled is lower than the preset range, controlling the flow regulating valve opening angle of the liquid inlet 301 to decrease.

[0052] Specifically, when the power of the device to be cooled is within a preset range, the server control method further includes: obtaining the temperature of the device to be cooled; determining whether the temperature of the device to be cooled is within a preset range, so as to adjust the opening angle of the flow regulating valve at the liquid outlet 401 accordingly; when the temperature of the device to be cooled is outside the preset range, controlling the opening angle of the flow regulating valve at the liquid inlet 301 to increase or decrease; otherwise, keeping the opening angle of the flow regulating valve at the liquid inlet 301 unchanged. When the power of the device to be cooled is within a preset range, the control module further obtains the temperature information of the device to be cooled. If the temperature of the device to be cooled is higher than a preset threshold, the control module will instruct the opening angle of the flow regulating valve to increase and increase the flow of coolant to cope with the increase in the internal temperature of the device to be cooled; on the contrary, if the temperature is lower than the set threshold, the opening angle of the flow regulating valve will be controlled to decrease to avoid energy waste caused by overcooling.

[0053] Specifically, when the temperature of the device to be cooled is outside the preset range, the server control method includes: when the temperature of the device to be cooled is higher than the preset range, controlling the opening angle of the flow regulating valve of the liquid inlet 301 to increase; when the temperature of the device to be cooled is lower than the preset range, controlling the opening angle of the flow regulating valve of the liquid inlet 301 to decrease.

[0054] Through the above-described specific implementation, this server cabinet control method implements intelligent flow regulation based on real-time power and temperature information from the equipment being cooled. This not only improves the efficiency and responsiveness of the cooling system, but also effectively controls coolant usage, reducing data center operating costs. Furthermore, by using position sensors to monitor the position of the partitions 200 in real time, the system can quickly adapt to changes in the layout of the equipment being cooled, enhancing the cooling system's flexibility and adaptability and ensuring efficient and stable server operation.

[0055] In the server cabinet, server, and server control method of the embodiments of the present application, during use, the liquid storage chamber 101 is designed as a spatially isolable structure. A sealing strip is embedded within the slot 110, and a position sensor is provided within the sealing strip. When a partition 200 is inserted into the sealing strip, the position sensor detects the partition 200. The control system then divides the area between the position of this position sensor and the position sensor within the adjacent sealing strip into an independent chamber, preventing coolant from flowing between the chambers. The distance between two adjacent slots 110 is set to accommodate the thickness of the device to be cooled.

[0056] The height of the liquid storage chamber 101 is designed to correspond to the height of the device to be cooled. When multiple devices to be cooled are placed in the liquid storage chamber 101, partitions 200 are provided between each device to isolate the devices to be cooled, thereby enabling independent cooling of each device. Furthermore, when the space occupied by the devices to be cooled within the liquid storage chamber 101 is smaller than the space of the liquid storage chamber 101, the partitions 200 can isolate the unused space of the liquid storage chamber 101, allowing the liquid storage chamber 101 without the devices to be cooled to be filled with coolant, thereby reducing operating costs.

[0057] The power supply device 600 is an intelligent PDU (Power Distribution Unit). The intelligent PDU is designed with power sockets, namely Port 1, Port 2, etc. Each power socket is affixed with a barcode label. The intelligent PDU can control the power supply sockets to be powered on and off through the system.

[0058] After heat exchange in the cooling system, the coolant flows into the liquid storage chamber 101 through the liquid supply device 300. A flow regulating valve is provided at the liquid supply pipe 310 of the liquid supply device 300. The flow regulating valve automatically adjusts the opening angle under the control of the system. The coolant flows into the liquid inlet pipe 320 and flows into the liquid storage chamber 101 through the main liquid inlet hole 321a and the auxiliary liquid inlet hole 321b. The main liquid inlet hole 321a is located in the middle of the liquid inlet pipe 320. Its function is mainly to cool components with high heat generation, such as the central processing unit (CPU) and the graphics processing unit (GPU). The auxiliary liquid inlet hole 321b is used to cool accessory components.

[0059] The coolant flows upward through the reservoir 101, exchanging heat with the heat-generating components of the device being cooled, removing heat and cooling the device. The high-temperature coolant then flows out of the outlet 401 into the outlet pipe 400 and back into the cooling system, where it is cooled again.

[0060] The drain pipe 700 is used to drain the coolant in each cavity and drain the coolant in the device to be cooled. When draining begins, the flow control valve at the drain port 701 opens, and the coolant flows from the drain port 701 into the drain pipe 700.

[0061] The usage process of the server of the present application is as follows: first, after the device to be cooled is loaded into the chamber, the partition 200 is inserted into the card slot closest to the device, and the position sensor in the card slot detects a signal, which is recorded as position 1. The control system determines the unit between position 1 and the initial point as device unit 1 and displays it on the operation screen; the device to be cooled continues to be loaded into the liquid storage chamber 101 and the second partition 200 is inserted. The position sensor in the card slot detects a signal, which is recorded as position 2. The control system determines the chamber between position 2 and position 1 as device unit 2 and displays it on the operation screen, and so on.

[0062] After each device to be cooled is installed, plug the power cord into the intelligent PDU power socket. Scan and enter the device serial number and power socket barcode information for each device to be cooled into the control system. The device to be cooled in each unit is associated with the power socket location of the intelligent PDU. The control system's display screen allows you to control the power on and off of the device to be cooled in each unit.

[0063] Each chamber in the cabinet has a liquid inlet pipe 320. The opening and closing of each liquid inlet pipe 320 and the coolant flow rate are controlled by a flow control valve on each liquid inlet 301. A device unit can have only one liquid inlet pipe 320 or multiple liquid inlet pipes 320. Multiple flow control valves in the same device unit can be adjusted synchronously or in steps, automatically controlled by the control system. The flow control valves in different devices are independent of each other.

[0064] When the control button for the device unit is activated on the control system's display, the flow control valve at liquid inlet 301 opens, and the chamber begins to fill with liquid. After the liquid level sensor below liquid outlet 401 detects the coolant, the control system triggers the power plug of the smart PDU connected to the device unit to power on, and the cooling device begins to operate.

[0065] The intelligent PDU monitors the operating power of the equipment, and the flow control valve on the liquid inlet 301 adjusts the flow rate as the equipment power changes. The intelligent PDU provides real-time feedback of the detected equipment power to the control system. The control system determines the opening angle of the flow control valve or the coolant flow rate based on the preset equipment power range, and feeds back a signal to the flow control valve on the liquid inlet 301, which then executes the action. A liquid level sensor is also installed in the liquid storage chamber to monitor the amount of coolant evaporation. During normal operation of the equipment, if the liquid level sensor detects no coolant, an alarm will be issued to indicate that the coolant is too low and that coolant needs to be added.

[0066] The control method of the present application also includes that when the preset device power is 100W, the opening angle of the flow regulating valve is opened by 10 degrees relative to when it is fully closed, and when the device power increases by 100W, the opening angle of the flow regulating valve increases by 1 degree. When the server starts running, the control system collects the operating power of the device to be cooled, collects the temperature of the heat-generating components of the device to be cooled by connecting to the BMC (Baseboard Management Controller) management network port of the device to be cooled, and collects the temperature of the coolant through the temperature sensor below the chamber drain port 701. The preset data collection cycle is 1 week or real-time collection, which can be set by yourself. The control logic relationship of the control system is established through the data collected during the collection period, specifically:

[0067] 1. Record the power of the device to be cooled, the temperature of the heating components of the device to be cooled, and the opening angle of the flow control valve at the liquid inlet 301 at the collection time;

[0068] 2. Establish a relationship function between the opening angle of the flow control valve at the liquid inlet 301 and the power of the device to be cooled, and a relationship function between the opening angle of the flow control valve at the liquid inlet 301 and the temperature of the heat-generating component of the device to be cooled. Each relationship function is written into the control system logic, corresponding to the control logic for the opening angle of the flow control valve at the liquid inlet 301 and the power of the device to be cooled, and the control logic for the opening angle of the flow control valve at the liquid inlet 301 and the temperature of the heat-generating component of the device to be cooled.

[0069] 3. After the data collection cycle is complete and the relationship function is established, the equipment to be cooled is controlled using the new coolant flow control logic. The coolant flow control logic can be updated at any time by re-collecting data and establishing it. Each unit of the equipment to be cooled establishes its own coolant flow control logic.

[0070] 4. After the new coolant flow control logic is established, the cooling equipment controls the coolant flow process as follows:

[0071] 1) The intelligent PDU provides real-time feedback to the control system on the power socket power of each unit of the equipment to be cooled. The control system records four power data points per second, namely W1, W2, W3, and W4, and can take more values. The W1, W2, W3, and W4 of each power socket in each unit of the equipment to be cooled are compared and a change threshold is set. If the values ​​of W2-W1, W3-W2, and W4-W3 are all outside the set threshold range, the control system determines that the power of the equipment to be cooled is in a sudden change phase. If the values ​​of W2-W1, W3-W2, and W4-W3 are within the threshold, the control system determines that the power of the equipment to be cooled is in a stable state.

[0072] 2) During the power sudden change phase of the device to be cooled, the opening angle of the flow control valve at the liquid inlet 301 is automatically switched to the power control logic of the device to be cooled. When the device to be cooled is started or suddenly performs a large amount of calculations, the power of the device will increase sharply, and the heat generated by components such as the CPU and GPU will increase. The opening angle of the flow control valve at the liquid inlet 301 will increase as the power increases, the flow of coolant into the chamber will increase, the lift will increase, and the coolant will circulate quickly to quickly complete heat exchange with the heat-generating components of the device to be cooled, taking away heat and reducing the temperature. When the device to be cooled completes the calculation or stops running, the power of the device will decrease sharply, the heat generated by components such as the CPU and GPU will decrease, and there is no need for fast-flowing coolant for heat exchange. The opening angle of the flow control valve at the liquid inlet 301 will decrease synchronously with the decrease in power.

[0073] 3) When the power of the device being cooled suddenly increases, the thermistors used to monitor temperature, such as the CPU and GPU, remain at the previous temperature. However, the CPU and GPU have already experienced a temperature change. When the thermistors detect a temperature change, they convert the temperature signal into an electrical signal and feed it back to the device's Baseboard Management (BMC). The control system then reads the internal temperature information of the device being cooled through the BMC management network port. This monitoring method has a longer latency than directly obtaining power from the intelligent PDU power outlet. By the time the cabinet control system determines that the flow valve opening angle needs to be adjusted, the CPU and GPU temperatures have already risen.

[0074] 4) When the power of the equipment to be cooled drops suddenly, as in the case of a sudden increase, there will be a delay in the control system monitoring and feedback of the flow control valve opening angle through the equipment's BMC management network port. The equipment to be cooled no longer needs a large amount of heat exchange, but the temperature detected by the thermistor is still high, causing the control system to continue to control the flow valve to supply a large amount of liquid until the thermistor detects a low temperature.

[0075] 5) During the stationary operation phase of the device to be cooled, the liquid supply flow control valve opening angle is automatically controlled based on the temperature of the device's heat-generating components. Specifically, after the device completes startup and enters standby mode or continuous computing mode, the device's power is stable. To ensure high-performance operation while maintaining PUE (Power Usage Effectiveness), the coolant flow regulation switches to a logic based on the liquid supply flow control valve opening angle. During this phase, the device to be cooled operates continuously within a preset temperature range for its heat-generating components. The control system collects component temperature information through the device's BMC management network port. If the component temperature exceeds the preset range, the opening angle of the flow control valve at the liquid inlet 301 is increased. The control system collects the component temperature and determines whether the temperature has fallen within the preset range. If so, the flow control valve opening angle is maintained. If not, the flow control valve opening angle is further increased, and this process repeats until the temperature falls within the preset range. When the temperature of the heating component is lower than the preset temperature range, the opening angle of the flow control valve is reduced, and the control system collects the temperature of the heating component to determine whether the temperature rises to the preset temperature range. If so, the opening angle of the flow control valve is maintained. If not, the opening angle of the flow control valve is continued to be reduced, and this process is repeated until the temperature is within the preset temperature range.

[0076] 5) After the coolant completes heat exchange with the device to be cooled, it flows into the drain pipe 700 through the drain port 701 and returns to the cooling system for cooling again.

[0077] 6) When a unit needs to be removed for maintenance, the operator presses the stop button for that unit. The intelligent PDU automatically disconnects the power socket connected to the unit, the flow control valve in the liquid supply line automatically closes, and the liquid supply is discontinued. Simultaneously, the drain control valve at drain port 701 automatically opens, allowing the coolant to drain. After the coolant is drained, the unit drains the surface coolant in the chamber.

[0078] The above is a detailed introduction to a server cabinet, server, and server control method provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the method and core ideas of the present application. It should be noted that, for those skilled in the art, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A server cabinet, characterized in that: include: A liquid storage tank (100), wherein the liquid storage tank (100) encloses a liquid storage cavity (101) with an opening at the top; a plurality of partitions (200), at least one of the plurality of partitions (200) being selectively installed in the liquid storage chamber (101) to separate the liquid storage chamber (101) into at least two mutually independent chambers; The liquid storage tank (100) is provided with a plurality of liquid inlets (301) and a plurality of liquid outlets (401), each chamber is correspondingly provided with at least one liquid inlet (301) and at least one liquid outlet (401), and each liquid inlet (301) and each liquid outlet (401) are in fluid communication with the liquid storage chamber (101).

2. The server cabinet according to claim 1, wherein: The multiple liquid inlets (301) and the multiple liquid outlets (401) are respectively arranged in sequence on the liquid storage tank (100) along a first direction, and each of the partitions (200) is perpendicular to the first direction. Wherein, the first direction is the extension direction of the liquid storage tank (100).

3. The server cabinet according to claim 2, wherein: A plurality of slots (110) are provided on the inner wall of the liquid storage box (100) and are arranged perpendicular to the first direction. The plurality of slots are arranged at intervals along the first direction, and at least one liquid inlet (301) and at least one liquid outlet (401) are provided between two adjacent slots. The slots are used for being engaged with the partition plate (200).

4. The server cabinet according to claim 3, wherein: The server cabinet further comprises a plurality of seals, at least one of the seals is provided in each of the slots, and the partition (200) is provided in cooperation with the seals in the slots; and / or, The server cabinet further comprises a plurality of fixing frames (500), wherein the plurality of fixing frames (500) are arranged on one end of the liquid storage tank (100) close to the opening in a one-to-one correspondence with the plurality of liquid outlets (401); A plurality of liquid level sensors are provided at one end of the liquid storage tank (100) close to the opening, and a flow regulating valve is provided at each of the liquid inlets (301) and each of the liquid outlets (401). The plurality of flow regulating valves are provided in a one-to-one correspondence with the plurality of liquid level sensors, and each of the flow regulating valves is configured to adjust the size of its opening based on a signal from the liquid level sensor.

5. The server cabinet according to claim 1, wherein: The server cabinet further comprises a liquid supply device (300), the liquid supply device (300) comprising a liquid supply pipe (310) and a plurality of liquid inlet pipes (320), the liquid supply pipe (310) being in communication with each of the liquid inlet pipes (320), and the plurality of liquid inlet pipes (320) being arranged in a one-to-one correspondence with the plurality of liquid inlets (301).

6. The server cabinet according to claim 5, wherein: Each of the liquid inlet pipes (320) is passed through the liquid storage box (100) and at least partially extends into the liquid storage cavity (101). A plurality of liquid inlet holes (321) are provided on the liquid inlet pipe (320). Wherein, the diameters of the plurality of liquid inlet holes (321) gradually increase in a direction away from the liquid inlet port (301); and / or, The plurality of liquid inlet holes (321) are sequentially spaced apart along the direction in which the liquid inlet pipe (320) extends; and / or, The multiple liquid inlet holes (321) include a main liquid inlet hole (321a) and an auxiliary liquid inlet hole (321b), and the aperture of the main liquid inlet hole (321a) is larger than the aperture of the auxiliary liquid inlet hole (321b).

7. The server cabinet according to claim 1, wherein: The server cabinet further comprises a drain pipe (700), a plurality of drain ports (701) are provided at the bottom of the liquid storage tank (100), the plurality of drain ports (701) are provided in a one-to-one correspondence with the plurality of liquid inlets (301), and the drain pipe (700) is communicated with each of the drain ports (701). Wherein, each of the liquid discharge ports (701) is provided with a flow control valve.

8. The server cabinet according to claim 1, wherein: The server cabinet further comprises a cabinet body (810) and a cover plate (820), wherein the cover plate (820) is detachably arranged on the top of the cabinet body (810), so that the cover plate (820) and the cabinet body (810) enclose a mounting cavity for placing the liquid storage tank (100), and the cabinet body (810) is provided with a plurality of through holes (811) communicating with the outside of the mounting cavity, so that the cooling liquid inside the liquid storage cavity (101) is connected to the liquid path of an external liquid supply device.

9. The server cabinet according to claim 8, wherein: The bottom of the liquid storage tank (100) is provided with a plurality of mounting brackets for supporting the liquid storage tank (100), so that the bottom of the liquid storage tank (100) and the bottom of the cabinet (810) are spaced apart.

10. A server for controlling the server cabinet according to any one of claims 1 to 9, characterized in that: The server includes: A plurality of flow regulating valves, each of the liquid inlets (301) is provided with a flow regulating valve, and the opening of each flow regulating valve is adjustable; a power supply device (600), the power supply device (600) being arranged at one end of the liquid storage tank (100) close to the opening, the power supply device (600) comprising a detection device and a plurality of power supply sockets connected to each other, the power supply sockets being used to be electrically connected to the device to be cooled so that the detection device can obtain the power of the device to be cooled and the temperature of the heating component of the device to be cooled; A control module is connected to the power supply device (600) and the plurality of flow regulating valves, respectively, to control the opening of each of the flow regulating valves according to the power of the device to be cooled and the temperature of the heating component of the device to be cooled.

11. The server according to claim 10, wherein: The server further includes: A plurality of position sensors and a plurality of card slots (110), wherein each card slot (110) is provided with a position sensor, and the position sensor is used to detect the position of the partition (200) in the card slot (110).

12. A server control method, applicable to the server according to claim 11, characterized in that: The server control method includes: Obtaining the power of the device to be cooled; Determining whether the power of the device to be cooled is within a preset range, so as to correspondingly adjust the opening angle of the flow regulating valve of the liquid inlet (301); When the power of the device to be cooled exceeds the preset range, the opening angle of the flow regulating valve of the liquid inlet (301) is controlled to increase or decrease.

13. The server control method according to claim 12, wherein: The server control method includes: When the power of the device to be cooled is higher than the preset range, controlling the opening angle of the flow regulating valve to increase; When the power of the device to be cooled is lower than the preset range, the opening angle of the flow regulating valve controlling the liquid inlet (301) is reduced.

14. The server control method according to claim 12, wherein: When the power of the device to be cooled is within the preset range, the server control method further includes: Obtaining the temperature of the device to be cooled; Determining whether the temperature of the device to be cooled is within a preset range, and adjusting the opening angle of the flow regulating valve at the liquid outlet (401) accordingly; When the temperature of the device to be cooled is outside the preset range, the opening angle of the flow regulating valve of the liquid inlet (301) is controlled to increase or decrease; otherwise, the opening angle of the flow regulating valve of the liquid inlet (301) is kept unchanged.

15. The server control method according to claim 14, characterized in that: When the temperature of the device to be cooled is outside the preset range, the server control method includes: When the temperature of the device to be cooled is higher than the preset range, the opening angle of the flow regulating valve of the liquid inlet (301) is controlled to increase; When the temperature of the device to be cooled is lower than the preset range, the opening angle of the flow regulating valve controlling the liquid inlet (301) is reduced.

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