Optical module

Abstract

The optical module provided by the invention comprises an optical fiber adapter, an optical accommodating component and a light emitting component. The optical accommodation component includes a first housing and an optical assembly disposed within the first housing. A first connecting hole and a second connecting hole are formed in one side of the first shell; the first connecting hole is connected with the first light receiving component, and the second connecting hole is connected with the second light receiving component. The optical assembly comprises a first displacement prism, a reflector, a first optical filter, a wavelength division multiplexer and a second displacement prism, so that corresponding devices in the optical assembly can be utilized to correspondingly transmit optical receiving signals with different wavelengths input through the optical fiber adapter to the first optical receiving component or the second optical receiving component; and transmitting a light emitting signal generated by the light emitting component to the optical fiber adapter by using a corresponding device in the optical assembly, and outputting the light emitting signal through the optical fiber adapter. In this way, the optical module integrates receiving and transmitting of multi-wavelength optical signals, and the requirement for multiple transmission channels in the optical module is met.

Description

optical modules

[0001] This application claims the priority of application number 202411365289.7 filed with the China Patent Office on September 27, 2024; the priority of application number 202311542497.5 filed with the China Patent Office on November 17, 2023; and the priority of application number 202410765686.7 filed with the China Patent Office on June 13, 2024; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0004] Summary of the Invention

[0005] In some embodiments, the present disclosure provides an optical module, comprising:

[0006] an optical fiber adapter, one end of which is used to connect to an external optical fiber and is configured to transmit an optical transmit signal and an optical receive signal;

[0007] The optical receiving component has one end connected to the other end of the optical fiber adapter, and includes a first housing and an optical assembly disposed within the first housing. One end of the first housing is connected to the optical fiber adapter; a first connecting hole and a second connecting hole are formed in the first housing; the first connecting hole is connected to the first light receiving component, and the second connecting hole is connected to the second light receiving component;

[0008] Among them, the optical components include:

[0009] a first displacement prism, wherein a first reflection surface of the first displacement prism is located on a transmission light path of the optical fiber adapter;

[0010] a first filter located on the reflected light path of the second reflecting surface of the first displacement prism;

[0011] a first reflector, located on the reflected light path of the first filter;

[0012] A wavelength division multiplexer having a light input port formed on a first side and a first output end and a second output end formed on a second side; the light input port is located on a reflected light path of the reflector;

[0013] a second displacement prism, wherein a first emitting surface of the second displacement prism is located on an output light path of the first output end;

[0014] The first light receiving component is located on the reflected light path of the second emitting surface of the second displacement prism; the second light receiving component is located on the output light path of the second output end;

[0015] A light emitting component, one end of which is connected to the other end of the first housing; a light emitting signal generated by the light emitting component is transmitted to the optical fiber adapter through the first housing;

[0016] The optical emitting component includes a second cavity and a first laser assembly and a second laser assembly disposed in the second cavity; the second cavity includes two connected side walls, the first laser assembly and the second laser assembly are distributed on the sides of the two connected side walls, the first laser assembly generates a first wavelength optical signal, and the second laser assembly generates a second wavelength optical signal;

[0017] Multiple rows of pins are respectively arranged on the two connected side walls, and the pins in the bottom row on the two connected side walls include high-frequency pins, and the ends of the high-frequency pins extend into the second cavity; a light outlet is arranged at one end of the second cavity, and the light outlet is optically connected to the first laser assembly of the optical accommodating component and the second laser assembly is electrically connected to the corresponding high-frequency pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] FIG1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0020] FIG2 is a partial structural diagram of a host computer according to some embodiments;

[0021] FIG3 is a structural diagram of an optical module according to some embodiments;

[0022] FIG4 is an exploded view of an optical module according to some embodiments;

[0023] FIG5A is a first diagram illustrating the internal structure of an optical module according to some embodiments;

[0024] FIG5B is a second diagram of the internal structure of an optical module according to some embodiments;

[0025] FIG6 is a diagram illustrating the internal structure of another optical module according to some embodiments;

[0026] FIG7A is an exploded view of the internal structure of an optical module according to some embodiments;

[0027] FIG7B is an exploded view of the internal structure of another optical module according to some embodiments;

[0028] FIG8A is an exploded view of a fiber optic adapter and a first housing according to some embodiments;

[0029] FIG8B is a cross-sectional view of a structure within an optical module according to some embodiments;

[0030] FIG9A is a structural diagram 1 of a first housing according to some embodiments;

[0031] FIG9B is an exploded view of a first housing according to some embodiments;

[0032] FIG9C is a second structural diagram of a first housing according to some embodiments;

[0033] FIG9D is a diagram illustrating a first housing in use according to some embodiments;

[0034] FIG9E is a second diagram of a first housing in use according to some embodiments;

[0035] FIG10A is a cross-sectional view of an optical receiving component according to some embodiments;

[0036] FIG10B is a cross-sectional view of another optical receiving component according to some embodiments;

[0037] FIG11A is an exploded view of the internal structure of an optical module according to some embodiments;

[0038] FIG11B is an exploded view of the internal structure of another optical module according to some embodiments;

[0039] FIG12A is a structural diagram of another first housing according to some embodiments;

[0040] FIG12B is a cross-sectional view of another first housing according to some embodiments;

[0041] FIG13A is a diagram illustrating another embodiment of a first housing in use; FIG13A is a diagram illustrating another embodiment of a first housing in use;

[0042] FIG13B is a diagram illustrating another embodiment of the optical assembly in the first housing in use; FIG13B is a diagram illustrating another embodiment of the optical assembly in the first housing in use;

[0043] FIG13C is a second diagram illustrating another use state of the optical assembly within the first housing according to some embodiments;

[0044] FIG14A is a first cross-sectional view of another optical receiving component according to some embodiments;

[0045] FIG14B is a second cross-sectional view of another optical receiving component according to some embodiments;

[0046] FIG15A is a diagram illustrating another first housing in use according to some embodiments;

[0047] FIG15B is a diagram illustrating another optical component in an optical module in use according to some embodiments;

[0048] FIG16A is a structural diagram 1 of a light emitting component according to some embodiments;

[0049] FIG16B is a second structural diagram of a light emitting component according to some embodiments;

[0050] FIG16C is an exploded view of a light emitting component according to some embodiments;

[0051] FIG17A is a partial structural diagram 1 of a light emitting component according to some embodiments;

[0052] FIG17B is a second partial structural diagram of a light emitting component according to some embodiments;

[0053] FIG17C is a third partial structural diagram of a light emitting component according to some embodiments;

[0054] FIG17D is a first cross-sectional view of a light emitting component according to some embodiments;

[0055] FIG17E is a second cross-sectional view of a light emitting component according to some embodiments;

[0056] FIG17F is a third cross-sectional view of a light emitting component according to some embodiments;

[0057] FIG18A is a transmission optical path diagram of an optical transmission signal according to some embodiments;

[0058] FIG18B is a transmission optical path diagram of another optical transmission signal according to some embodiments;

[0059] FIG19A is a structural diagram 1 of a mounting bracket according to some embodiments;

[0060] FIG19B is a second structural diagram of a mounting bracket according to some embodiments;

[0061] FIG20A is a partial view of yet another light emitting component according to some embodiments;

[0062] FIG20B is a partial view of another light emitting component according to some embodiments;

[0063] FIG21A is an exploded view of another light emitting component according to some embodiments;

[0064] FIG21B is a structural diagram of another multiplexing component according to some embodiments;

[0065] 21C is a cross-sectional view of another multiplexing assembly according to some embodiments. DETAILED DESCRIPTION

[0066] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0067] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0068] In optical communications, information is transferred between information processing devices by loading it onto light and leveraging its propagation speed. This information-carrying light is called an optical signal. Transmitting optical signals through optical information transmission equipment reduces optical power loss, enabling long-distance transmission. Furthermore, optical information transmission equipment, such as optical fiber, is less expensive than electrical information transmission equipment, such as copper wire. Therefore, optical communications technology enables high-speed, long-distance, and low-cost information transmission.

[0069] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions. Optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can identify and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert optical and electrical signals.

[0070] Optical modules can enable mutual conversion between optical and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output ends of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0071] Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the optical module's host computer. Furthermore, the optical signal input or output end of an optical module is referred to as an optical port, while the electrical signal input or output end of an optical module is referred to as an electrical port.

[0072] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in Figure 1, the optical communication system primarily includes a remote information processing device 1000, a local information processing device 2000, an optical module host computer 100, an optical module 200, an optical fiber 101, and a network cable 103. The optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0073] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby achieving long-distance information transmission with low power loss.

[0074] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fibers 101 and the optical module 200 are detachably connected; in some embodiments, the optical fibers 101 and the optical module 200 are non-detachably connected.

[0075] The host computer 100 is configured to provide a data signal to the optical module 200 , or receive a data signal from the optical module 200 , or monitor or control the working state of the optical module 200 .

[0076] The host computer 100 includes a housing for accommodating the optical module 200 and an optical module interface 102 provided on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0077] The host computer 100 also includes an external electrical interface that can be connected to an electrical signal network. In some embodiments, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect to the network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0078] One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 via the optical fiber 101.

[0079] In some embodiments, a first optical signal from a remote information processing device 1000 propagates through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000.

[0080] In some embodiments, the optical module is a tool for converting optical signals into electrical signals. During the conversion between optical signals and electrical signals, the information does not change, but the encoding or decoding method of the information changes.

[0081] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT) or a data center server.

[0082] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed within the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and is fixed by the cage 106;

[0083] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0084] In some embodiments, an electrical connector is disposed inside the cage 106 , and the electrical connector is configured to connect to an electrical port of the optical module 200 .

[0085] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100 , and the cage 106 fixes the optical module 200 . The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107 .

[0086] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100 , and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , thereby establishing an electrical signal connection between the optical module 200 and the host computer 100 .

[0087] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 establishes an optical signal connection with the optical fiber 101 .

[0088] Figure 3 is a structural diagram of an optical module according to some embodiments, and Figure 4 is an exploded view of an optical module according to some embodiments. As shown in Figures 3 and 4, in some embodiments, optical module 200 includes a housing, which includes an upper housing 201 and a lower housing 202. Upper housing 201 covers lower housing 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the housing forms a single opening that serves as both an electrical port and an optical port.

[0089] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0090] The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the above shell. The upper shell 201 and the lower shell 202 can encapsulate and protect the above components.

[0091] The direction of the line connecting the two openings 203 and 204 can be aligned with or inconsistent with the length of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 (the right end in FIG3 ), and the opening 204 is also located at the end of the optical module 200 (the left end in FIG3 ). Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located at the side of the optical module 200.

[0092] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0093] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0094] As shown in Figures 3 and 4, in some embodiments, the optical module includes a circuit board 300 disposed in a housing. The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips may include a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier (LA), a clock and data recovery chip (CDR), a power management chip, and a digital signal processing (DSP) chip.

[0095] In some embodiments, the circuit board may include a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0096] In some embodiments, the circuit board may further include a flexible circuit board, which may be used independently or in conjunction with a rigid circuit board.

[0097] In some embodiments, a gold finger is formed on the surface of the end portion of the circuit board 300. The gold finger is composed of a plurality of independent pins.

[0098] In some embodiments, the gold finger 310 is arranged on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4); in some implementations, the gold finger 301 is arranged on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required.

[0099] In some implementations, the circuit board's gold fingers extend from electrical port 204 and plug into an electrical connector on the host computer 100. The circuit board is inserted into cage 106, with gold fingers 301 providing electrical connection to the electrical connector within cage 106. Gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (I2C) signal transmission, and data signal transmission.

[0100] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0101] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0102] In some embodiments, the optical module 200 includes an optical receiving component 500 on which a light receiving component may be disposed. For example, the optical receiving component 500 may be provided with one or more light receiving components.

[0103] In some embodiments, the optical module 200 includes a light emitting component 400 . The light emitting component 400 can be connected to the optical receiving component 500 .

[0104] In some embodiments, the light emitting component 400 and the optical receiving component 500 are physically separated from the circuit board 300, and the light emitting component 400 and the optical receiving component 500 can be electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0105] In some embodiments, one end of the optical receiving component 500 can be connected to the optical fiber adapter 700, and the other end of the optical receiving component 500 can be connected to the optical transmitting component 400. The transmitted optical signal generated by the optical transmitting component 400 is first transmitted to the optical receiving component 500, then transmitted to the optical fiber adapter 700 through the optical receiving component 500, and finally output through the optical fiber adapter 700. The external input received optical signal is input into the optical receiving component 500 through the optical fiber adapter 700, so that both the transmitted optical signal and the received optical signal pass through the optical fiber adapter 700, thereby allowing the uplink optical signal and the downlink optical signal of the optical module to share the optical fiber 101.

[0106] In some embodiments, the optical emitting component 400 can generate optical transmit signals of multiple wavelengths and combine the optical transmit signals of multiple wavelengths into a single optical transmit signal. The optical receiving component 500 can be provided with multiple optical receiving components, enabling the optical receiving component 500 to receive optical receive signals comprising multiple wavelengths. For example, the optical emitting component 400 generates optical transmit signals of three wavelengths, each having different rates, such as a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal having different rates. The optical receiving component 500 can receive optical receive signals of three wavelengths, each having different rates, such as a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal having different rates.

[0107] In some embodiments, the wavelength range of the first wavelength optical signal is 1340-1344 nm, such as the wavelength of the first wavelength optical signal is 1342 nm. In some examples of the present disclosure, the wavelength range of the first wavelength optical signal is shown as a specific example only. In some examples, the first wavelength optical signal may also be an optical signal of other wavelength ranges.

[0108] In some examples, the wavelength range of the second wavelength optical signal is 1575-1580 nm, such as the wavelength of the second wavelength optical signal is 1577 nm. In some examples of the present disclosure, the wavelength range of the second wavelength optical signal is shown as a specific example only. In some examples, the second wavelength optical signal may also be an optical signal of other wavelength ranges.

[0109] The wavelength range of the third wavelength optical signal is 1480-1500 nm, for example, the wavelength of the third wavelength optical signal is 1490 nm. In some examples of the present disclosure, the wavelength range of the third wavelength optical signal is shown as a specific example only. In some examples, the third wavelength optical signal may also be an optical signal of other wavelength ranges.

[0110] The wavelength range of the fourth wavelength optical signal is 1260-1280 nm, for example, the wavelength of the fourth wavelength optical signal is 1270 nm. In some examples of the present disclosure, the wavelength range of the fourth wavelength optical signal is shown as a specific example only. In some examples, the fourth wavelength optical signal may also be an optical signal of other wavelength ranges.

[0111] The wavelength range of the fifth wavelength optical signal is 1284-1288 nm, for example, the wavelength of the fifth wavelength optical signal is 1286 nm. In some examples of the present disclosure, the wavelength range of the fifth wavelength optical signal is shown as a specific example only. In some examples, the fifth wavelength optical signal may also be an optical signal of other wavelength ranges.

[0112] The wavelength range of the sixth wavelength optical signal is 1290-1330 nm, for example, the wavelength of the sixth wavelength optical signal is 1310 nm. In some examples of the present disclosure, the wavelength range of the sixth wavelength optical signal is shown as a specific example only. In some examples, the sixth wavelength optical signal may also be an optical signal of other wavelength ranges.

[0113] It can be understood that the numerical values ​​and numerical ranges involved in some embodiments of the present disclosure are approximate values. Due to the influence of manufacturing process and measurement errors, there may be a certain range of errors. Those skilled in the art can consider this part of the error to be negligible.

[0114] In some embodiments, the optical transmission component 400 can generate optical transmission signals of two wavelengths, and the rates of the optical transmission signals of the two wavelengths can be different. For example, the optical transmission component 400 can generate a first wavelength optical signal and a second wavelength optical signal at different rates, or the optical transmission component 400 can generate a first wavelength optical signal and a third wavelength optical signal at different rates, or the optical transmission component 400 can generate a second wavelength optical signal and a third wavelength optical signal at different rates.

[0115] In some embodiments, the optical receiving component 500 can receive optical signals of two wavelengths, and the rates of the optical signals of the two wavelengths can be different. For example, the optical receiving component 500 can receive optical signals of a fourth wavelength and a fifth wavelength at different rates, or the optical receiving component 500 can receive optical signals of a fourth wavelength and a sixth wavelength at different rates, or the optical receiving component 500 can receive optical signals of a fifth wavelength and a sixth wavelength at different rates.

[0116] FIG5A is a first diagram of the internal structure of an optical module according to some embodiments, and FIG5B is a second diagram of the internal structure of an optical module according to some embodiments. As shown in FIG5A and FIG5B , in some embodiments, the optical accommodating component 500 may include a first shell 510 and a first upper cover 520, and the first shell 510 and the first upper cover 520 are connected to form a first cavity. A first light receiving component 530, a second light receiving component 540, and a third light receiving component 550 are provided on the side wall of the first shell 510. A accommodating cavity is formed inside the first cavity, and the accommodating cavity is used to accommodate devices and realize connection or communication between devices. Exemplarily, a displacement prism, a reflector, etc. are provided in the accommodating cavity.

[0117] In some embodiments, an inner cavity is provided on the first shell 510 , so that the first upper cover 520 covers the first shell 510 to form an accommodating cavity; the first upper cover 520 is located on a side of the first shell 510 facing the cover plate 2011 .

[0118] In some embodiments, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 may be disposed on the same side of the first housing 510. Of course, in some embodiments, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 may be located on different sides of the first housing 510.

[0119] In some embodiments, one end of the first housing 510 is connected to the fiber optic adapter 700, and the other end of the first housing 510 is connected to the light emitting component 400. A first light receiving component 530, a second light receiving component 540, and a third light receiving component 550 are disposed on one side of the first housing 510. This allows the fiber optic adapter 700, the light emitting component 400, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 to be encapsulated within the first housing 510, thereby optically connecting the fiber optic adapter 700, the light emitting component 400, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 to the first receiving cavity. The light emitting component 400, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 can each be electrically connected to the circuit board 300 via a flexible circuit board.

[0120] In some embodiments, the optical transmission component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 covers and connects to the second housing 410 to form a second cavity. A plurality of pins 430 are provided on the sidewalls of the second housing 410. Within the second housing 410 are located components for generating and transmitting optical transmission signals. The pins 430 connect to a flexible printed circuit board (FPCB) for electrical connection to the circuit board 300. For example, one end of the second housing 410 connects to the other end of the first housing 510; the second upper cover 420 is located on the side of the second housing 410 facing the base plate 2021.

[0121] In some embodiments, multiple rows of pins are respectively disposed on two connected side walls of the second housing 410 , and the pins in the bottom row of the two connected side walls include high-frequency pins.

[0122] In some embodiments, the bottom of the first housing 510 is provided with an inclined surface 510a, which slopes from the bottom of the first housing 510 toward the other end of the first housing 510 to facilitate the avoidance of tooling associated with assembling the light emitting component 400. For example, when the second upper cover 420 and the second housing 410 are connected by seam welding, the inclined surface 510a avoids the seam welding machine.

[0123] In some embodiments, the optical module includes multiple flexible circuit boards. For example, the light emitting component 400 is electrically connected to the circuit board 300 via two flexible circuit boards, and the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 are electrically connected to the circuit board 300 via corresponding flexible circuit boards.

[0124] Figure 6 illustrates the internal structure of another optical module according to some embodiments. As shown in Figure 6 , a first light receiving component 530 and a second light receiving component 540 may be disposed on one side of the first housing 510, thereby encapsulating the fiber optic adapter 700, the optical emitting component 400, the first light receiving component 530, and the second light receiving component 540 within the first housing 510. In some embodiments, the first light receiving component 530 and the third light receiving component 550 may be disposed on one side of the first housing 510, or the second light receiving component 540 and the third light receiving component 550 may be disposed on one side of the first housing 510.

[0125] Figure 7A is an exploded view of the internal structure of an optical module according to some embodiments, and Figure 7B is an exploded view of the internal structure of another optical module according to some embodiments. As shown in Figures 7A and 7B, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 can be coaxially packaged.

[0126] In some embodiments, a first connection hole 511 may be formed on a side wall of the first housing 510 , the first connection hole 511 being connected to the first accommodating cavity, and the first light receiving component 530 is embedded in the first connection hole 511 .

[0127] In some embodiments, a second connection hole 512 may be formed on a side wall of the first housing 510 , the second connection hole 512 communicating with the first accommodating cavity 512 , and the second light receiving component 540 is embedded in the second connection hole 512 . The second connection hole 512 may be located on the side of the first connection hole 511 .

[0128] In some embodiments, a third connection hole 513 may be formed on the side wall of the first housing 510, the third connection hole 513 communicating with the first accommodating cavity. The third light receiving component 550 is embedded in the second connection hole 512. The third connection hole 513 may be located on the side of the second connection hole 512.

[0129] In some embodiments, if two light receiving components are assembled on the first housing 510 , one connecting hole may be sealed when the first housing 510 is molded or sealed using a sealant after molding.

[0130] In some embodiments, the other end of the first housing 510 is formed with a notch 510b, which may be located to the side of the third connection hole 513. A connection seat 5101 is formed within the notch 510b. One end of the connection seat 5101 is connected to the side wall of the first housing 510, and the other end of the connection seat 5101 is connected to the second housing 410. Exemplarily, the connection seat 5101 is integrally formed with the first housing 510. A fifth connection hole 5102 is provided on the connection seat 5101, which connects the first housing 510 and the second housing 410.

[0131] Figure 8A is an exploded view of a fiber optic adapter and a first housing according to some embodiments. Figure 8B is a cross-sectional view of the internal structure of an optical module according to some embodiments, and Figure 8B illustrates the cross-sectional structure of the fiber optic adapter. As shown in Figures 8A and 8B, a fourth connection hole 514 is formed on the sidewall of one end of the first housing 510, communicating with the first accommodating cavity. A connecting sleeve 515 is disposed at one end of the first housing 510, communicating with the fourth connection hole 514. One end of the connecting sleeve 515 is connected to the fiber optic adapter 700, and the other end of the connecting sleeve 515 is connected to the outer wall of the first housing 510.

[0132] In some embodiments, a first lens 516 may be disposed within the fourth connection hole 514. The first lens 516 is configured to converge the optical transmit signal and collimate the optical receive signal. Exemplarily, the fourth connection hole 514 includes a lens mounting hole 5141, which is a stepped hole formed on the fourth connection hole 514. A lens mounting seat 5161 is disposed on the first lens 516 and is embedded within the lens mounting hole 5141 to securely connect the first lens 516 to the first housing 510. A step is formed on the outer side of one end of the lens mounting seat 5161 to facilitate movement and clamping, thereby facilitating assembly of the first lens 516.

[0133] Figure 9A is a structural diagram of a first housing according to some embodiments, Figure 9B is an exploded view of a first housing according to some embodiments, and Figure 9C is a structural diagram of a first housing according to some embodiments. As shown in Figures 9A-9C, a receiving cavity 517 is formed within the first housing 510, and a first connection hole 511, a second connection hole 512, a third connection hole 513, and a fourth connection hole 514 are respectively connected to the receiving cavity 517.

[0134] In some embodiments, a first displacement prism 561, a first reflector 562, a first filter 563, a wavelength division multiplexer 564, a second displacement prism 565, a third displacement prism 566, or a fourth displacement prism 567 may be disposed within the accommodating cavity 517. A first mounting surface 518 may be formed on the top of the first housing 510, and the first mounting surface 518 supports and connects to the first upper cover 520.

[0135] FIG9D is a first diagram illustrating a first housing in use according to some embodiments, and FIG9E is a second diagram illustrating a first housing in use according to some embodiments. As shown in FIG9A-9E , the housing chamber 517 may include a first housing chamber 5171, a second housing chamber 5172, and a third housing chamber 5173. The first housing chamber 5171, the second housing chamber 5172, and the third housing chamber 5173 divide the housing chamber 517 to facilitate assembly of components such as the first displacement prism 561 within the housing chamber 517. For example, the first displacement prism 561, the first reflector 562, the first optical filter 563, and the wavelength division multiplexer 564 are disposed within the first housing chamber 5171, the second displacement prism 565 and the third displacement prism 566 are disposed within the second housing chamber 5172, and the fourth displacement prism 567 is disposed within the third housing chamber 5173.

[0136] In some embodiments, the wavelength division multiplexer 564 includes a first side 5641 and a second side 5642 opposite to the first side 5641. A light inlet may be formed on the first side 5641, and the light inlet is used to input a received optical signal. The second side 5642 may be provided with a filter, which can transmit a received optical signal of a preset wavelength and reflect received optical signals of other wavelengths, so as to form the output end of the wavelength division multiplexer 564 using the filter. Exemplarily, the second side 5642 may be provided with a plurality of filters, each of which can transmit a received optical signal of a preset wavelength and reflect received optical signals of other wavelengths. Of course, in one embodiment, a filter may also be provided on the first side 5641, which can transmit a received optical signal of a preset wavelength and reflect received optical signals of other wavelengths.

[0137] In some embodiments, the wavelength division multiplexer 564 is longitudinally arranged in the first accommodating cavity 5171, so that the first side 5641 faces the side wall of the first shell 510 to which the optical fiber adapter 700 is not connected, and the second side 5642 faces the side wall of the first shell 510 to which the optical fiber adapter 700 is not connected, that is, the first side 5641 and the second side 5642 do not face the side wall of the first shell 510 to which the optical fiber adapter 700 is connected.

[0138] In some embodiments, the first side 5641 is located on the side where the first reflector 562 is located, and the light input port of the wavelength division multiplexer 564 is located on the reflection light path of the first reflector 562, so that the received optical signal reflected by the first reflector 562 is input to the wavelength division multiplexer 564. Based on the wavelength of the received optical signal input to the wavelength division multiplexer 564, the wavelength division multiplexer 564 outputs the received optical signals of different wavelengths from the output ends formed by the corresponding optical filters. Exemplarily, three optical filters are provided on the second side 5642, so that the wavelength division multiplexer 564 forms three output ends on the second side 5642, which are respectively referred to as the first output end, the second output end, and the third output end. The first output end can be used to output the fourth wavelength optical signal, the second output end can be used to output the fifth wavelength optical signal, and the third output end can be used to output the fifth wavelength optical signal.

[0139] In some embodiments, a first side of the first accommodating cavity 5171 communicates with the fourth connection hole 514. A second accommodating cavity 5172 is disposed on a second side of the first accommodating cavity 5171. A first baffle 5174 is disposed between the second accommodating cavity 5172 and the first accommodating cavity 5171. The first baffle 5174 defines a first through cavity 5175, which communicates between the first accommodating cavity 5171 and the second accommodating cavity 5172. The top of the first baffle 5174 is supported and connected to the first upper cover 520.

[0140] In some embodiments, a third accommodating cavity 5173 is set on the third side of the first accommodating cavity 5171, a second baffle 5176 is set between the first accommodating cavity 5171 and the third accommodating cavity 5173, and a second through cavity 5177 is opened on the second baffle 5176, and the second through cavity 5177 connects the first accommodating cavity 5171 and the third accommodating cavity 5173.

[0141] In some embodiments, the second accommodating cavity 5172 extends from one end of the first shell 510 to the other end of the first shell 510, and the other end of the second accommodating cavity 5172 extends to the side of the missing corner 510b; the third accommodating cavity 5173 is located on the side of the fifth connecting hole 5102, and the third accommodating cavity 5173 is connected to the fifth connecting hole 5102.

[0142] In some embodiments, the sides of the second displacement prism 565 and the third displacement prism 566 are against the side walls connected to the first baffle 5174, and the first baffle 5174 fixedly supports the second displacement prism 565 and the third displacement prism 566; the first filter 563 is set on the second baffle 5176, and the second baffle 5176 fixedly supports the first filter 563.

[0143] In some embodiments, the first reflection surface of the second displacement prism 565 is located on the output light path of the first output end of the demultiplexer 564 , and the second reflection surface of the second displacement prism 565 is located on the input light path of the first light receiving component 530 .

[0144] In some embodiments, the first reflection surface of the third displacement prism 566 is located on the output light path of the third output end of the demultiplexer 564 , and the second reflection surface of the third displacement prism 566 is located on the input light path of the third light receiving component 550 .

[0145] In some embodiments, there is a gap between the second displacement prism 565 and the third displacement prism 566 , the output light path of the first output end of the demultiplexer 564 passes through the gap, and the first output end of the demultiplexer 564 is located on the input light path of the second light receiving component 540 .

[0146] In some embodiments, the fourth displacement prism 567 is used to adjust the optical path of the light emitting signal, so as to facilitate the fifth connecting hole 5102 to be closer to the center line of the first shell 510 to adapt to the light emitting component 400, and make the assembly of the light emitting component 400 and the optical accommodating component 500 more concentrated, so as to facilitate reducing the space occupied by assembling the light emitting component 400 and the optical accommodating component 500 in the optical module, and adapt to the requirements of multiple transmission channels of the optical module.

[0147] In some embodiments, a mounting base 568 may be provided within the accommodating cavity 517. The bottom of the mounting base 568 is connected to the bottom of the first accommodating cavity 5171, and the side of the mounting base 568 securely supports the first reflector 562. For example, the first reflector 562 is first secured to the mounting base 568, then positioned to a predetermined position through optical coupling, and then secured to the mounting base 568. The mounting base 568 facilitates movement of the first reflector 562 and securement of the first reflector 562 within the first accommodating cavity 5171.

[0148] In some embodiments, an opening 519 may be formed on the fourth side of the first accommodating cavity 5171. The opening 519 is located on the side of the mounting base 568, and a sealing plate 5191 is disposed within the opening 519. The opening 519 on the fourth side of the first accommodating cavity 5171 facilitates the secure installation of the mounting base 568, thereby facilitating the securement of the first reflector 562 within the first accommodating cavity 5171. When the first reflector 562 is positioned in a preset position through optical coupling, an optical securing device directs light for optical securing onto the mounting base 568 through the opening 519, thereby securing the mounting base 568 to the bottom plate of the first accommodating cavity 5171. After the mounting base 568 is optically secured to the first accommodating cavity 5171, the sealing plate 5191 is secured to the opening 519.

[0149] Figure 10A is a cross-sectional view of an optical accommodating component according to some embodiments, and Figure 10B is a cross-sectional view of another optical accommodating component according to some embodiments. Figure 10A shows an optical path for transmitting a light receiving signal and a light transmitting signal in the optical accommodating component, and Figure 10B shows another optical path for transmitting a light receiving signal and a light transmitting signal in the optical accommodating component. In some embodiments, the light emission signal output by the light emitting component 400 is transmitted to the incident surface of the fourth displacement prism 567 through the fifth connecting hole 5102, transmitted through the incident surface of the fourth displacement prism 567 to the first reflecting surface of the fourth displacement prism 567, reflected by the first reflecting surface of the fourth displacement prism 567 to the second reflecting surface of the fourth displacement prism 567, and transmitted to the light exit surface of the fourth displacement prism 567, transmitted through the light exit surface of the fourth displacement prism 567 to the first filter 563, transmitted through the first filter 563, transmitted to the first displacement prism 561 and output from the fourth connecting hole 514 along the output light path of the first displacement prism 561, and converged by the first lens 516 to be transmitted to the optical fiber adapter 700.

[0150] In some embodiments, the optical receiving signal is transmitted to the first lens 516 through the optical fiber adapter 700, collimated by the first lens 516 and transmitted to the light incident surface of the first displacement prism 561, transmitted to the first reflection surface of the first displacement prism 561 through the light incident surface of the first displacement prism 561, reflected by the first reflection surface of the first displacement prism 561 and transmitted to the second reflection surface of the first displacement prism 561, reflected by the second reflection surface of the first displacement prism 561 and transmitted to the light exit surface of the first displacement prism 561, transmitted through the light exit surface of the first displacement prism 561 to the first filter 563, reflected by the first filter 563 and transmitted to the first reflection mirror 562, and reflected by the first reflection mirror 562 and transmitted to the wavelength division multiplexer 564. If the received optical signal includes a fourth wavelength optical signal, the fourth wavelength optical signal is transmitted via the first output port of the wavelength division multiplexer 564 to the first reflection surface of the second displacement prism 565, reflected from the first reflection surface of the second displacement prism 565 and transmitted to the second reflection surface of the second displacement prism 565, and finally transmitted via the second reflection surface of the second displacement prism 565 to the first optical receiving component 530. If the received optical signal includes a fifth wavelength optical signal, the fifth wavelength optical signal is transmitted via the second output port of the wavelength division multiplexer 564 to the second optical receiving component 540. If the received optical signal includes a sixth wavelength optical signal, the sixth wavelength optical signal is transmitted via the wavelength division multiplexer 564 to the first reflection surface of the third displacement prism 566, reflected from the first reflection surface of the third displacement prism 566 and transmitted to the second reflection surface of the third displacement prism 566, and finally reflected from the second reflection surface of the third displacement prism 566 to the third optical receiving component 550.

[0151] In some embodiments, when a second light receiving component 540 and a third light receiving component 550 are set on the first shell 510, the fifth wavelength optical signal output by the wavelength division multiplexer 564 is transmitted to the second light receiving component 540, and the sixth wavelength optical signal output by the wavelength division multiplexer 564 is transmitted to the third light receiving component 550 via the third displacement prism 566.

[0152] In some embodiments, when a first light receiving component 540 and a third light receiving component 550 are set on the first shell 510, the fourth wavelength optical signal output by the wavelength division multiplexer 564 is transmitted to the first light receiving component 540 via the second displacement prism 565, and the sixth wavelength optical signal output by the wavelength division multiplexer 564 is transmitted to the third light receiving component 550 via the third displacement prism 566.

[0153] In some embodiments, the receiving rates of the photodetector in the first light receiving component 530, the receiving rates of the photodetector in the second light receiving component 540, and the receiving rates of the photodetector in the third light receiving component 550 are different. For example, the receiving rate of the photodetector in the second light receiving component 540 is greater than the receiving rate of the photodetector in the first light receiving component 530, and the receiving rate of the photodetector in the second light receiving component 540 is greater than the receiving rate of the photodetector in the third light receiving component 550. This ensures that the optical path of the fifth wavelength optical signal with the highest transmission rate from the output of the wavelength division multiplexer 564 to the photodetector is relatively short and the optical path is simplest, so that the photodetector in the second light receiving component 540 can receive the optical signal with high coupling efficiency. For example, the receiving rate of the photodetector in the first light receiving component 530 is 10G, the receiving rate of the photodetector in the second light receiving component 540 is 50G, and the receiving rate of the photodetector in the third light receiving component 550 is 2.5G.

[0154] In some embodiments, a filter 541 may be provided at the light input front end of the second light receiving component 540. The filter 541 is used to filter out clutter in the optical signal incident to the second light receiving component 540, thereby improving the quality of the optical signal incident to the second light receiving component 540.

[0155] In some embodiments, an isolator 569 may be provided in the fifth connection hole 5102. The isolator 569 is used to prevent the optical emission signal reflected by the fourth displacement prism 567 from re-entering the second housing 410, thereby reducing the impact of the reflected optical emission signal on the optical emission signal generated by the optical emission component 400.

[0156] Figure 11A is an exploded view of the internal structure of an optical module according to some embodiments, and Figure 11B is an exploded view of the internal structure of another optical module according to some embodiments. In some embodiments, as shown in Figures 11A and 11B, a first light receiving component 530 and a second light receiving component 540 may be provided on one side of the first housing 510.

[0157] In some embodiments, as shown in FIG11A , a third light receiving component 550 may be provided on the other side of the first housing 510 . Of course, as shown in FIG11B , no third light receiving component 550 may be provided on the other side of the first housing 510 .

[0158] In some embodiments, a first light receiving component 530 may be provided on one side of the first shell 510, and a third light receiving component 550 may not be provided on the other side of the first shell 510; or, a second light receiving component 540 may be provided on one side of the first shell 510, and a third light receiving component 550 may not be provided on the other side of the first shell 510.

[0159] Figure 12A is a structural diagram of another first housing according to some embodiments, and Figure 12B is a cross-sectional view of another first housing according to some embodiments. In some embodiments, as shown in Figures 12A and 12B, the first housing 510 includes a fifth sidewall 5103, a sixth sidewall 5104, a seventh sidewall 5105, and an eighth sidewall 5106. The fifth sidewall 5103, the sixth sidewall 5104, the seventh sidewall 5105, and the eighth sidewall 5106 surround the sidewalls that form the accommodating cavity 517.

[0160] In some embodiments, a fourth connection hole 514 may be formed on the fifth sidewall 5103 .

[0161] In some embodiments, a first connection hole 511 and a second connection hole 512 may be formed on the sixth sidewall 5104. In another embodiment, a third connection hole 513 may be formed on the sixth sidewall 5104.

[0162] In some embodiments, a fifth connection hole 5102 may be formed on the seventh sidewall 5105 .

[0163] In some embodiments, a third connection hole 513 may be formed on the eighth sidewall 5106. In another embodiment, a first connection hole 511 and a second connection hole 512 may be formed on the eighth sidewall 5106.

[0164] Figure 13A is a usage status diagram of another first shell according to some embodiments, Figure 13B is a usage status diagram 1 of another optical component in the first shell according to some embodiments, Figure 13C is a usage status diagram 2 of another optical component in the first shell according to some embodiments, and Figures 13A-13C show the arrangement of another optical component.

[0165] In some embodiments, the first lens 516 is disposed in the accommodating cavity 517 and is located at an edge of the fourth connecting hole 514 .

[0166] In some embodiments, the wavelength division multiplexer 564 is laterally disposed in the accommodating cavity 517 with the first side 5641 facing the fifth side wall 5103 and the second side 5642 facing the seventh side wall 5105. The light input port of the wavelength division multiplexer 564 is located in the transmission light path of the first lens 516.

[0167] In some embodiments, a filter 5643 may be provided on the first side 5641 . The filter 5643 may transmit the optical signal with the fifth wavelength, so as to form a fifth output end on the first side 5641 through the filter 5643 .

[0168] In some embodiments, a filter 5644 may be provided on the second side 5642 . The filter 5644 may transmit the optical signal with a fourth wavelength, so as to form a fourth output end on the second side 5642 through the filter 5644 .

[0169] In some embodiments, a filter 5645 may be provided on the second side 5642 . The filter 5645 may transmit the optical signal with a sixth wavelength, so as to form a sixth output end on the second side 5642 through the filter 5645 .

[0170] In some embodiments, a filter 5646 may be provided on the second side 5642. The filter 5646 may transmit the optical transmission signal, thereby forming an optical port on the second side 5642 through the filter 5646. The optical transmission signal may be incident on the wavelength division multiplexer 564 through the optical port, and the optical transmission signal may be output from the optical input port of the first side 5641.

[0171] In some embodiments, a second reflector 5601 may be provided in the accommodating cavity 517 , and the second reflector 5601 is located on the transmission light path of the filter 5644 and on the input light path of the first light receiving component 530 .

[0172] In some embodiments, a third reflector 5602 may be provided in the accommodating cavity 517 , and the third reflector 5602 is located on the transmission light path of the filter 5643 and on the input light path of the second light receiving component 540 .

[0173] In some embodiments, a fourth reflector 5603 may be provided in the accommodating cavity 517 , and the fourth reflector 5603 is located on the transmission light path of the filter 5645 and on the input light path of the third light receiving component 550 .

[0174] In some embodiments, a filter 531 is provided on the first light receiving component 530 , and the filter 531 is located on the reflected light path of the second reflector 5601 .

[0175] In some embodiments, the filter 541 is located in the reflected light path of the third reflector 5602 .

[0176] In some embodiments, a filter 5604 may be disposed in the accommodating cavity 517 . The filter 5604 is located between the fourth reflector 5603 and the filter 5645 . The filter 5604 filters the received light signal output by the filter 5645 . Exemplarily, the filter 5604 is connected to the fourth reflector 5603 .

[0177] Figure 14A is a first cross-sectional view of another optical accommodating component according to some embodiments, and Figure 14A shows an optical path for transmitting a light receiving signal and a light transmitting signal in the optical accommodating component; Figure 14B is a second cross-sectional view of another optical accommodating component according to some embodiments, and Figure 14B shows an optical path for transmitting a light receiving signal and a light transmitting signal in the optical accommodating component.

[0178] In some embodiments, as shown in Figures 13B, 13C, 14A and 14B, the optical transmission signal output by the optical transmission component 400 is transmitted to the filter 5646 through the fifth connecting hole 5102, passes through the filter 5646 and is incident on the wavelength division multiplexer 564, is output through the light input port of the wavelength division multiplexer 564 and transmitted to the first lens 516, and is converged by the first lens 516 and transmitted to the optical fiber adapter 700.

[0179] In some embodiments, as shown in Figures 13B and 14A, a first light receiving component 530, a second light receiving component 540, and a third light receiving component 550 are disposed on the first housing 510. The received optical signal is transmitted through the fiber optic adapter 700 to the first lens 516, collimated by the first lens 516, and transmitted to the light input port of the wavelength division multiplexer 564. The received optical signal then enters the wavelength division multiplexer 564 through the light input port. If the received optical signal includes a fourth wavelength optical signal, the fourth wavelength optical signal is output from the fourth output port of the wavelength division multiplexer 564 and transmitted to the second reflector 5601. After being reflected by the second reflector 5601, the signal is transmitted to the first light receiving component 530. If the received optical signal includes a fifth wavelength optical signal, the fifth wavelength optical signal is output from the fifth output port of the wavelength division multiplexer 564 and transmitted to the third reflector 5602. After being reflected by the third reflector 5602, the signal is transmitted to the second light receiving component 540. If the optical receiving signal includes the sixth wavelength optical signal, the sixth wavelength optical signal is output from the sixth output terminal of the wavelength division multiplexer 564 and transmitted to the fourth reflector 5603 , and is reflected by the fourth reflector 5603 and transmitted to the third optical receiving component 550 .

[0180] In some embodiments, as shown in Figures 13C and 14B, a first light receiving component 530 and a second light receiving component 540 are disposed on the first housing 510. The received optical signal is transmitted through the fiber optic adapter 700 to the first lens 516, collimated by the first lens 516, and transmitted to the light input port of the wavelength division multiplexer 564. The received optical signal then enters the wavelength division multiplexer 564 through the light input port. If the received optical signal includes a fourth wavelength optical signal, the fourth wavelength optical signal is output from the fourth output port of the wavelength division multiplexer 564 and transmitted to the second reflector 5601. After being reflected by the second reflector 5601, it is transmitted to the first light receiving component 530. If the received optical signal includes a fifth wavelength optical signal, the fifth wavelength optical signal is output from the fifth output port of the wavelength division multiplexer 564 and transmitted to the third reflector 5602. After being reflected by the third reflector 5602, it is transmitted to the second light receiving component 540.

[0181] In some embodiments, when a second light receiving component 540 and a third light receiving component 550 are provided on the first shell 510, if the light receiving signal includes a fifth wavelength light signal, the fifth wavelength light signal is output from the fifth output end of the wavelength division multiplexer 564 and transmitted to the third reflector 5602, and is reflected by the third reflector 5602 and transmitted to the second light receiving component 540; if the light receiving signal includes a sixth wavelength light signal, the sixth wavelength light signal is output from the sixth output end of the wavelength division multiplexer 564 and transmitted to the fourth reflector 5603, and is reflected by the fourth reflector 5603 and transmitted to the third light receiving component 550.

[0182] Figure 15A is a diagram illustrating another first housing in use according to some embodiments, and Figure 15B is a diagram illustrating another optical assembly in use according to some embodiments. In some embodiments, as shown in Figures 15A and 15B, another arrangement of optical assemblies is illustrated.

[0183] In some embodiments, the wavelength division multiplexer 564 is disposed laterally within the accommodating cavity 517, and the first reflector 562 and the first filter 563 are disposed between the first side 5641 and the first lens 516. The first filter 563 is located in the transmission light path of the first lens 516, and the first reflector 562 is located in the reflection light path of the first filter 563.

[0184] In some embodiments, a filter 5647 may be provided on the first side 5641 . The filter 5647 may transmit the fourth wavelength optical signal, so as to form a seventh output end on the first side 5641 through the filter 5647 .

[0185] In some embodiments, a filter 5648 may be provided on the second side 5642 . The filter 5648 may transmit the optical signal with the fifth wavelength, so as to form an eighth output end on the second side 5642 through the filter 5648 .

[0186] In some embodiments, a filter 5649 may be provided on the second side 5642 . The filter 5649 may transmit the optical signal with the fifth wavelength, so as to form a ninth output end on the second side 5642 through the filter 5649 .

[0187] In some embodiments, a fifth reflector 5605 may be disposed in the accommodating cavity 517. The fifth reflector 5605 is located on the reflected light path of the first reflector 562 and on the input light path of the wavelength division multiplexer 564. The light input port of the wavelength division multiplexer 564 is located on the reflected light path of the fifth reflector 5605.

[0188] In some embodiments, a sixth reflector 5607 may be provided in the accommodating cavity 517 , and the sixth reflector 5607 is located on the side of the first side 5641 . The sixth reflector 5607 is located on the transmission light path of the filter 5647 and on the input light path of the first light receiving component 530 .

[0189] In some embodiments, a beam splitter prism 5606 may be disposed within the accommodating cavity 517 and disposed on the side of the second side 5642. Exemplarily, the beam splitter prism 5606 includes a first reflective surface and a second reflective surface. The first reflective surface of the beam splitter prism 5606 is located on the transmission light path of the optical filter 5648 and on the input light path of the second light receiving component 540, thereby reflecting the received light signal that has passed through the optical filter 5648 to the second light receiving component 540. The second reflective surface of the beam splitter prism 5606 is located on the projection light path of the optical filter 5649 and on the input light path of the third light receiving component 550, thereby reflecting the received light signal that has passed through the optical filter 5649 to the third light receiving component 550. The beam splitter prism 5606 can transmit the received light signals of the two wavelengths output by the wavelength division multiplexer 564 to different directions.

[0190] In some embodiments, the optical transmission signal output by the optical transmission component 400 is transmitted to the first filter 563 through the fifth connection hole 5102 , transmitted to the first lens 516 through the first filter 563 , and converged by the first lens 516 to be transmitted to the optical fiber adapter 700 .

[0191] In some embodiments, the optical receive signal is transmitted through the fiber optic adapter 700 to the first lens 516, then transmitted through the first lens 516 to the first filter 563. It is reflected from the first filter 563 and transmitted to the first reflector 562. It is reflected from the first reflector 562 and transmitted to the fifth reflector 5605. It is then reflected from the fifth reflector 5605 and transmitted to the wavelength division multiplexer 564. If the optical receive signal includes an optical signal with a fourth wavelength, the fourth wavelength is transmitted through the seventh output port of the wavelength division multiplexer 564 to the sixth reflector 5607. It is reflected from the sixth reflector 5607 and transmitted to the first optical receiving component 530. If the optical receive signal includes an optical signal with a fifth wavelength, the fifth wavelength is transmitted through the eighth output port of the wavelength division multiplexer 564 to the first reflective surface of the beam splitter 5606. It is reflected from the first reflective surface of the beam splitter 5606 and transmitted to the second optical receiving component 540. If the optical receiving signal includes the sixth wavelength optical signal, the sixth wavelength optical signal is transmitted to the second reflection surface of the beam splitter prism 5606 via the ninth output terminal of the wavelength division multiplexer 564 , and is reflected by the second reflection surface of the beam splitter prism 5606 and transmitted to the third optical receiving component 550 .

[0192] In some embodiments, a filter 5608 is disposed between the first reflective surface of the beam splitter 5606 and the filter 5648. The filter 5608 can filter stray light in the fifth wavelength optical signal, thereby improving the quality of the optical signal received by the second optical receiving component 540.

[0193] In some embodiments, a filter 5609 is disposed between the second reflective surface of the beam splitter 5606 and the filter 5649. The filter 5609 can filter stray light in the sixth wavelength optical signal, thereby improving the quality of the optical signal received by the third optical receiving component 550.

[0194] Figure 16A is a structural diagram of a light emitting component according to some embodiments, Figure 16B is a structural diagram of a light emitting component according to some embodiments, and Figure 16C is an exploded view of a light emitting component according to some embodiments. As shown in Figures 16A-16C, the light emitting component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 covers and connects to the second housing 410 to form a second cavity.

[0195] In some embodiments, the second housing 410 includes a bottom plate 411, a first side wall 412, a second side wall 413, a third side wall 414, and a fourth side wall 415. The first side wall 412, the second side wall 413, the third side wall 414, and the fourth side wall 415 are sequentially connected, and their bottoms are respectively connected to the bottom plate 411 to form a second inner cavity. The top supports of the first side wall 412, the second side wall 413, the third side wall 414, and the fourth side wall 415 are connected to the second upper cover 420; the bottom plate 411 is used to support the device. In some embodiments, the second housing 410 is a housing integrally formed of metal material. The third side wall 414 is arranged along the width direction of the second housing 410, and the fourth side wall 415 is arranged along the length direction of the second housing 410.

[0196] In some embodiments, the first sidewall 412 is located at one end of the second housing 410. A sixth connection hole 4121 is provided on the first sidewall 412. The sixth connection hole 4121 communicates with the second inner cavity and serves as a light outlet for the second cavity. The sixth connection hole 4121 connects to the first housing 510, connecting the second housing 410 to the accommodating cavity 517 through the sixth connection hole 4121. For example, the other end of the connecting base 5101 is embedded with the sixth connection hole 4121. In some embodiments, a boss 4122 is provided on the outer side of the first sidewall 412. One end of the sixth connection hole 4121 extends through the boss 4122, and the end of the connecting base 5101 is embedded with the connecting boss 4122.

[0197] In some embodiments, the second sidewall 413 is located in the notched corner 510 b , which is the sidewall of the second sidewall 413 close to the first housing 510 .

[0198] In some embodiments, the third sidewall 414 is located at the other end of the first housing 510 , and the third sidewall 414 is close to the circuit board 300 .

[0199] In some embodiments, a plurality of pins are disposed on the third sidewall 414 , and the plurality of pins are connected to the circuit board 300 via a flexible circuit board.

[0200] In some embodiments, a plurality of pins are disposed on each of the third sidewall 414 and the fourth sidewall 415. For example, two rows of pins are disposed on each of the third sidewall 414 and the fourth sidewall 415, each row of pins including a plurality of pins 430. For ease of description, the row of pins on the third sidewall 414 and the fourth sidewall 415 closest to the bottom plate 411 is referred to as the bottom row of pins on the third sidewall 414 and the fourth sidewall 415. The pins 430 on the third sidewall 414 and the pins 430 on the fourth sidewall 415 are each electrically connected to the circuit board 300 via a corresponding flexible circuit board.

[0201] In some embodiments, a first laser assembly 440 may be disposed in the second housing 410 to generate a first wavelength optical signal. The first laser assembly 440 may be located at a side where the second sidewall 413 and the third sidewall 414 meet.

[0202] In some embodiments, a second laser assembly 450 may be disposed in the second housing 410 , and the second laser assembly 450 may be configured to generate an optical signal of a second wavelength. The second laser assembly 450 may be located on the side of the fourth sidewall 415 .

[0203] In some embodiments, a third laser assembly 460 may be disposed within the second housing 410 to generate an optical signal at a third wavelength. The third laser assembly 460 may be located adjacent to the fourth sidewall 415. For example, the third laser assembly 460 may be located adjacent to the junction of the fourth sidewall 415 and the first sidewall 412.

[0204] In some embodiments, a first laser assembly 440, a second laser assembly 450, and a third laser assembly 460 are disposed within the second housing 410. The first laser assembly 440 is located on the sides of the second sidewall 413 and the third sidewall 414; the second laser assembly 450 and the third laser assembly 460 are located on the sides of the fourth sidewall 415, and the third laser assembly 460 is located on the side of the second laser assembly 450 away from the third sidewall 414. The third laser assembly 460 is located on the side of the first sidewall 412. This allows the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 to be distributed on the sides of two connected sidewalls of the second housing 410, forming a triangular distribution, thereby reducing the packaging volume of the light emitting component 400.

[0205] In some embodiments, a first laser assembly 440 is disposed in the width direction of the second housing 410 to reduce the width dimension of the second housing 410. Furthermore, a second laser assembly 450 or a third laser assembly 460 is disposed in the length direction of the second housing 410 to allow a sufficient number of laser assemblies to be disposed in the second housing 410, thereby reducing the overall dimension of the second housing 410 and facilitating a reduction in the dimension of the light emitting component 400.

[0206] In some embodiments, the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 have different transmission rates. For example, the transmission rate of the first laser assembly 440 is greater than the transmission rate of the second laser assembly 450, and the transmission rate of the second laser assembly 450 is greater than the transmission rate of the third laser assembly 460. For example, the transmission rate of the first laser assembly 440 is 50G, the transmission rate of the second laser assembly 450 is 10G, and the transmission rate of the third laser assembly 460 is 2.5G, etc.

[0207] In some implementations, a second filter 416 may be disposed on the side of the light outlet of the second housing 410 , and the second filter 416 is located on the side of the sixth connection hole 4121 . The second filter 416 may be located on the output optical path of the first laser assembly 440 , the second laser assembly 450 , or the third laser assembly 460 . The second filter 416 is used to adjust the transmission direction of the first wavelength optical signal, the second wavelength optical signal, or the third wavelength optical signal. For example, the second filter 416 transmits the first wavelength optical signal and the second wavelength optical signal to shift the first wavelength optical signal and the second wavelength optical signal in the width direction of the second housing 410 ; the second filter 416 reflects the third wavelength optical signal to change the transmission direction of the third wavelength optical signal.

[0208] In some implementations, a third optical filter 417 may be disposed on the side of the light outlet of the second housing 410, and the third optical filter 417 is located on the side of the sixth connection hole 4121. The third optical filter 417 may be located on the output optical path of the first laser assembly 440 or the second laser assembly 450. The third optical filter 417 transmits the first wavelength optical signal to shift the first wavelength optical signal in the width direction of the second housing 410; the third optical filter 417 reflects the second wavelength optical signal to change the transmission direction of the second wavelength optical signal.

[0209] In some embodiments, a second optical filter 416 and a third optical filter 417 may be disposed on the side of the light outlet of the second housing 410. The second optical filter 416 and the third optical filter 417 are disposed side by side on the side of the sixth connection hole 4121. The second optical filter 416 and the third optical filter 417 are used to change the transmission optical paths of the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal, allowing the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal to pass through the sixth connection hole 4121.

[0210] In some embodiments, the second filter 416 and the third filter 417 can be arranged on the side where the first side wall 412 and the second side wall 413 meet, so that the second filter 416, the third filter 417 and the first laser assembly 440 are arranged compactly, which facilitates controlling the length direction of the second shell 410.

[0211] In some embodiments, second filter 416 is located at the intersection of the output optical path of first laser assembly 440 and the output optical path of third laser assembly 460; third filter 417 is located at the intersection of the output optical path of first laser assembly 440 and the output optical path of second laser assembly 450. First laser assembly 440 is located on the transmissive side of third filter 417, second laser assembly 450 is located on the reflective side of third filter 417, and third laser assembly 460 is located on the reflective side of second filter 416. Exemplarily, second filter 416 includes a first optical surface and a second optical surface, which are primary optical surfaces of second filter 416; third filter 417 includes a third optical surface and a fourth optical surface, which are primary optical surfaces of third filter 417. The first optical surface faces third laser assembly 460, the second optical surface faces third filter 417, the third optical surface faces second laser assembly 450, and the fourth optical surface faces first laser assembly 440.

[0212] In some embodiments, a mounting bracket 470 may be provided within the second housing 410. The mounting bracket 470 is disposed on the side of the sixth connection hole 4121 and is fixed within the second housing 410. The mounting bracket 470 supports and connects the second optical filter 416 and the third optical filter 417. The second optical filter 416 and the third optical filter 417 are fixed within the second housing 410 via the mounting bracket 470, facilitating the fixing of the second optical filter 416 and the third optical filter 417 within the second housing 410.

[0213] In some embodiments, a second lens 4181 is provided on the transmission optical path from the first laser assembly 440 to the third filter 417 , and the second lens 4181 collimates the first wavelength optical signal.

[0214] In some embodiments, a third lens 4182 is provided on the transmission optical path from the second laser assembly 450 to the third filter 417 , and the third lens 4182 collimates the second wavelength optical signal.

[0215] In some embodiments, a fourth lens 4183 is provided on the transmission optical path from the third laser assembly 460 to the second filter 416 , and the fourth lens 4183 collimates the third wavelength optical signal.

[0216] Figure 17A is a partial structural diagram 1 of a light emitting component according to some embodiments, Figure 17B is a partial structural diagram 2 of a light emitting component according to some embodiments, Figure 17C is a partial structural diagram 3 of a light emitting component according to some embodiments, Figure 17D is a cross-sectional view 1 of a light emitting component according to some embodiments, Figure 17E is a cross-sectional view 2 of a light emitting component according to some embodiments, and Figure 17F is a cross-sectional view 3 of a light emitting component according to some embodiments; Figures 17A to 17F show the internal structure of a light emitting component.

[0217] In some embodiments, the first laser assembly 440 includes a first substrate 441 and a first laser chip 442. The first laser chip 442 is mounted on the first substrate 441 and integrates an electro-absorption modulated laser and a semiconductor optical amplifier. A stratum 4410, a first high-frequency pad 4411, a first LD pad 4412, and a first SOA pad 4413 may be formed on the first substrate 441. The first laser chip 442 is mounted on the stratum 4410, with the first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 located on the sides of the first laser chip 442. The first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 are respectively wire-bonded to the first laser chip 442.

[0218] In some embodiments, a first high-frequency pin 4301, a first SOA pin 4302, and a first LD pin 4303 may be disposed on the third sidewall 414. The first high-frequency pin 4301, the first SOA pin 4302, and the first LD pin 4303 are embedded in the third sidewall 414, with their ends extending into the inner cavity of the second housing 410. The first high-frequency pin 4301, the first SOA pin 4302, and the first LD pin 4303 are insulated from the third sidewall 414 by an insulating layer. The first high-frequency pin 4301 is located in the bottom row of pins on the third sidewall 414. The first high-frequency pin 4301 is electrically connected to the first high-frequency pad 4411, the first SOA pin 4302 is electrically connected to the first SOA pad 4413, and the first LD pin 4303 is electrically connected to the first LD pad 4412.

[0219] In some embodiments, one end of the first high-frequency pin 4301 is connected to the first high-frequency pad 4411 by a wire, one end of the first SOA pin 4302 is connected to the first SOA pad 4413 by a wire, and one end of the first LD pin 4303 is connected to the first LD pad 4412 by a wire; the other end of the first high-frequency pin 4301, the other end of the first SOA pin 4302 and the other end of the first LD pin 4303 are electrically connected to the circuit board 300 through a flexible circuit board.

[0220] In some embodiments, the height of the first high-frequency pin 4301 on the third sidewall 414 is lower than the height of the first SOA pin 4302 and the first LD pin 4303 on the third sidewall 414, that is, the first high-frequency pin 4301 is closer to the bottom plate 411. A first ground pin 4304 may be disposed on the third sidewall 414. The first ground pin 4304 is located to the side of the first high-frequency pin 4301 and is electrically connected to the third sidewall 414.

[0221] In some embodiments, a first adapter board 481 may be disposed within the second housing 410. A circuit pattern is disposed on the first adapter board 481 to electrically connect the first high-frequency pin 4301 to the first laser assembly 440. The first adapter board 481 may also be used to impedance match the first laser chip 442 to ensure impedance continuity of the high-frequency transmission link.

[0222] In some embodiments, a first high-frequency transmission line 4811 may be formed on the front surface of the first adapter plate 481. A first ground layer 4812 is provided on one side of the first high-frequency transmission line 4811, and a second ground layer 4813 is provided on the other side of the first high-frequency transmission line 4811. One end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pin 4301. Exemplarily, one end of the first high-frequency transmission line 4811 is wire-bonded to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is soldered to the first high-frequency pin 4301; the ground layer 4110 is wire-bonded to the first ground layer 4812 and the second ground layer 4813.

[0223] In some embodiments, a ground layer may be formed on the back of the first adapter board 481 , and via holes are respectively provided on the first ground layer 4812 and the second ground layer 4813 , and the first ground layer 4812 and the second ground layer 4813 are respectively connected to the ground layer on the back of the first adapter board 481 through the via holes.

[0224] In some embodiments, the second laser assembly 450 may include a second substrate 451 and a second laser chip 452. The second laser chip 452 is mounted on the second substrate 451 and may integrate an electro-absorption modulated laser and a semiconductor optical amplifier.

[0225] In some embodiments, a ground layer 4510, a second high-frequency pad 4511, a second LD pad 4512, and a second SOA pad 4513 may be formed on the second substrate 451. The second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are located on the sides of the second laser chip 452. The second laser chip 452 is mounted on the ground layer 4510, and the second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are respectively wire-bonded to the second laser chip 452.

[0226] In some embodiments, pins 430 may include a second high-frequency pin 4305, a second SOA pin 4306, and a second LD pin 4307. Second high-frequency pin 4305 is located in the bottom row of pins on third sidewall 414. Second high-frequency pin 4305 is electrically connected to second high-frequency pad 4511, second SOA pin 4306 is electrically connected to second SOA pad 4513, and second LD pin 4307 is electrically connected to second LD pad 4512.

[0227] In some embodiments, a second adapter plate 482 may be disposed within the second housing 410. A circuit board pattern may be disposed on the second adapter plate 482. The second adapter plate 482 is used to electrically connect the second high-frequency pin 4305 to the second laser assembly 450. The second adapter plate 482 may also be used to impedance match the second laser chip 452 to ensure impedance continuity of the high-frequency transmission link.

[0228] In some embodiments, the second high-frequency pin 4305 is embedded in and connected to the third sidewall 414 . The second high-frequency pin 4305 is insulated from the third sidewall 414 by an insulating layer. The second adapter plate 482 is disposed on a side of the third sidewall 414 .

[0229] In some embodiments, second SOA pin 4306 and second LD pin 4307 are embedded and connected to fourth sidewall 415. Second SOA pin 4306 and second LD pin 4307 are insulated from fourth sidewall 415 by an insulating layer. Second SOA pin 4306 is wire-bonded to second SOA pad 4513, and second LD pin 4307 is wire-bonded to second LD pad 4512.

[0230] In some embodiments, a second ground pin 4308 may be disposed on the third sidewall 414. The second ground pin 4308 is located on a side of the second high-frequency pin 4305 and is electrically connected to the third sidewall 414. For example, the second ground pin 4308 is located on a side of the second high-frequency pin 4305 that is close to the first high-frequency pin 4301.

[0231] In some embodiments, the second adapter plate 482 and the first adapter plate 481 are located on the same side wall of the second shell 410, which facilitates the assembly of the second adapter plate 482 and improves the assembly density of components in the second shell 410, thereby helping to reduce the size of the second shell 410.

[0232] In some embodiments, a second high-frequency transmission line 4821 may be formed on the front surface of the second adapter plate 482. A third ground layer 4822 is disposed on one side of the second high-frequency transmission line 4821, and a fourth ground layer 4823 is disposed on the other side of the second high-frequency transmission line 4821. One end of the second high-frequency transmission line 4821 is electrically connected to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is electrically connected to the second high-frequency pin 4305. Exemplarily, one end of the second high-frequency transmission line 4821 is bonded to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is soldered to the second high-frequency pin 4305. The ground layer 4510 electrically connects the third ground layer 4822 and the fourth ground layer 4823.

[0233] In some embodiments, a stratum may be formed on the back of the second adapter plate 482, and via holes are respectively provided on the third stratum 4822 and the fourth stratum 4823, and the third stratum 4822 and the fourth stratum 4823 are respectively connected to the stratum on the back of the second adapter plate 482 through the via holes.

[0234] In some embodiments, a third adapter plate 483 may be disposed within the second housing 410 , with a circuit pattern disposed thereon. The third adapter plate 483 is disposed between the second laser assembly 450 and the second adapter plate 482 , with the side of the third adapter plate 483 adjacent to the first laser assembly 440 . The third adapter plate 483 is used to achieve an electrical connection between the second laser assembly 450 and the second adapter plate 482 . The third adapter plate 483 can also be used to impedance match the second laser chip 452 to ensure impedance continuity of the high-frequency transmission link. The third adapter plate 483 helps reduce the length of the wire bonding between the second laser assembly 450 and the second adapter plate 482 , thereby reducing parasitic inductance and ensuring high-frequency signal transmission quality.

[0235] In some embodiments, a third high-frequency transmission line 4831 may be formed on the front surface of the third adapter plate 483. A fifth ground layer 4832 is provided on one side of the third high-frequency transmission line 4831, and a sixth ground layer 4833 is provided on the other side of the third high-frequency transmission line 4831. One end of the third high-frequency transmission line 4831 is electrically connected to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is electrically connected to the second high-frequency transmission line 4821. Exemplarily, one end of the second high-frequency transmission line 4821 is wired to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is wired to one end of the second high-frequency transmission line 4821; the fifth ground layer 4832 is wired to the third ground layer 4822, the sixth ground layer 4833 is wired to the fourth ground layer 4823, and the fifth and sixth ground layers 4832 and 4833 are each wired to the ground layer 4510.

[0236] In some embodiments, a third LD pad 4834 and a third SOA pad 4835 may be formed on the front surface of the third transfer board 483. The third LD pad 4834 and the third SOA pad 4835 are located near the first laser assembly 440. The first LD pad 4412 and the first LD pin 4303 are electrically connected to the third LD pad 4834, respectively, and the first SOA pad 4413 and the first SOA pin 4302 are electrically connected to the third SOA pad 4835, respectively. This allows the first laser assembly 440, the first LD pin 4303, and the first SOA pin 4302 to be electrically connected via the third transfer board 483, thereby facilitating control of the bonding arc height and facilitating bonding.

[0237] In some embodiments, capacitors are mounted on third LD pad 4834 and third SOA pad 4835, respectively. First LD pad 4412 and first LD pin 4303 are connected to the capacitors mounted on third LD pad 4834, respectively. First SOA pad 4413 and first SOA pin 4302 are wired to connect the capacitors mounted on third SOA pad 4835. A third adapter plate 483 is disposed at the junction of third sidewall 414 and fourth sidewall 415, enabling third adapter plate 483 to serve both first laser assembly 440 and second laser assembly 450, thereby facilitating coordinated use of space within second housing 410.

[0238] In some embodiments, the third laser assembly 460 may include a third substrate 461 and a third laser chip 462. A negative electrode pad 4611 and a positive electrode pad 4612 may be provided on the third substrate 461. The third laser chip 462 is mounted on the negative electrode pad 4611 and is wire-bonded to the positive electrode pad 4612. The pins 430 may include a third LD pin 4309 and a fourth LD pin 4310. The third LD pin 4309 is wire-bonded to the positive electrode pad 4612, and the fourth LD pin 4310 is wire-bonded to the negative electrode pad 4611. Exemplarily, the third LD pin 4309 and the fourth LD pin 4310 are embedded in the fourth sidewall 415. The ends of the third LD pin 4309 and the fourth LD pin 4310 extend into the inner cavity of the second housing 410, respectively. The third LD pin 4309 and the fourth LD pin 4310 are insulated from the fourth sidewall 415 by an insulating layer.

[0239] In some embodiments, the third laser assembly 460 may include a backlight detector 463 disposed on the third substrate 461 and located on the backlight side of the third laser chip 462. The backlight detector 463 is configured to receive backlight from the third laser chip 462 to monitor the third wavelength optical signal.

[0240] In some embodiments, the pins 430 may include an MPD pin 4311, which is wired to the backlight detector 463. Exemplarily, the MPD pin 4311 is embedded in the fourth sidewall 415, with the end of the MPD pin 4311 extending into the inner cavity of the second housing 410. The MPD pin 4311 is insulated from the fourth sidewall 415 by an insulating layer.

[0241] In some embodiments, a thermoelectric cooler (TEC) 490 may be disposed within the second housing 410 . The bottom of the TEC 490 is connected to the base plate 411 , and the top of the TEC 490 may support the first laser assembly 440 , the second laser assembly 450 , or the third laser assembly 460 . The sides of the TEC 490 include a first TEC pad 491 and a second TEC pad 492 , which are located on the sides of the second sidewall 413 .

[0242] In some embodiments, the pin 430 may include a first TEC pin 4312 and a second TEC pin 4313. The first TEC pin 4312 is electrically connected to the first TEC pad 491, and the second TEC pin 4313 is electrically connected to the second TEC pad 492. Exemplarily, the first TEC pin 4312 and the second TEC pin 4313 are embedded in the third sidewall 414, with their ends extending into the inner cavity of the second housing 410 and insulated from the third sidewall 414 by an insulating layer.

[0243] In some embodiments, a support plate 419 can be disposed within second housing 410 and positioned on top of TEC 490. The bottom of support plate 419 is connected to the top of TEC 490, while the top of support plate 419 can support and connect to first laser assembly 440, second laser assembly 450, or third laser assembly 460. In some embodiments, support plate 419 is electrically connected to the ground layer on the front surface of third adapter plate 483.

[0244] In some embodiments, a fourth adapter plate 484 may be disposed within the second housing 410. The fourth adapter plate 484 is disposed on the support plate 419 and has a circuit pattern disposed thereon. The fourth adapter plate 484 is used to electrically connect the TEC pads and TEC pins. For example, the fourth adapter plate 484 may include a fourth substrate 4841, on which a first metal layer 4842 and a second metal layer 4843 are disposed. The first and second metal layers 4842 and 4843 extend along the length of the fourth substrate 4841. The fourth adapter plate 484 is disposed on a side edge of the second sidewall 413 and is located on a side edge of the first laser assembly 440. One end of the first metal layer 4842 is wire-bonded to the first TEC pad 491, and the other end of the first metal layer 4842 is wire-bonded to the first TEC pin 4312. One end of the second metal layer 4843 is wire-bonded to the second TEC pad 492, and the other end of the second metal layer 4843 is wire-bonded to the second TEC pin 4313.

[0245] In some embodiments, a temperature sensor 4836 is further provided on the third adapter board 483. Exemplarily, the temperature sensor 4836 is a thermistor.

[0246] In some embodiments, pins 430 further include an RTH pin 4314 embedded in the third sidewall 414 . One end of the RTH pin 4314 extends into the inner cavity of the second housing 410 . The RTH pin 4314 is insulated from the third sidewall 414 by an insulating layer. One end of the RTH pin 4314 is electrically connected to the temperature sensor 4836 .

[0247] In some embodiments, a transfer pad 4837 may be formed on the third transfer board 483, and the transfer pad 4837 is located on the side of the temperature sensor 4836. The transfer pad 4837 is connected to the temperature sensor 4836 and the RTH pin 4314 by wire bonding. The transfer pad 4837 facilitates the transfer between the temperature sensor 4836 and the RTH pin 4314, thereby reducing the risk of heat being transferred to the RTH pin 4314 through the wire bonding when the temperature sensor 4836 is directly connected to the RTH pin 4314, which could cause the temperature sensor 4836 to detect inaccurate temperature in the second cavity.

[0248] In some embodiments, the inner side of the third sidewall 414 may be formed with a first side surface 4141, a second side surface 4142, a first stepped surface 4143, and a second stepped surface 4144. The first side surface 4141 is connected to the first stepped surface 4143, one end of the second stepped surface 4144 is connected to the first side surface 4141, and the other end of the second stepped surface 4144 is connected to the second side surface 4142. The first stepped surface 4143 is closer to the bottom plate 411 than the second stepped surface 4144. That is, the height of the first stepped surface 4143 in the second housing 410 is lower than the height of the second stepped surface 4144 in the second housing 410.

[0249] The first stepped surface 4143 supports and connects the first adapter plate 481 and the second adapter plate 482. One end of the first high-frequency pin 4301 and one end of the second high-frequency pin 4305 can each pass through the first side surface 4141. One end of the first high-frequency pin 4301 extends above the first adapter plate 481, while one end of the second high-frequency pin 4305 extends to the second adapter plate 482. One end of the RTH pin 4314 passes through the first side surface 4141, while one end of the first SOA pin 4302, one end of the first LD pin 4303, one end of the first TEC pin 4312, and one end of the second TEC pin 4313 can each pass through the second side surface 4142. The second ground pin 4308 is located between the first high-frequency pin 4301 and the second high-frequency pin 4305. The first ground pin 4304 is located on the side of the first high-frequency pin 4301 away from the second high-frequency pin 4305.

[0250] In some embodiments, the pins extending through the first side surface 4141 form a first row of pins 430a, and the pins extending through the second side surface 4142 form a second row of pins 430b. That is, the pins disposed on the third side wall 414 are arranged in two rows. The pins in the first row of pins 430a are staggered with the pins in the second row of pins 430b to facilitate pin bonding and adaption to flexible printed circuit boards, while also reducing the risk of air leakage caused by deformation of the insulating layer used to secure the pins.

[0251] In some embodiments, the MPD pin 4311 and the second SOA pin 4306 are located in a row, and the second LD pin 4307 , the third LD pin 4309 , and the fourth LD pin 4310 are located in a row.

[0252] In some embodiments, the sixth connection hole 4121 is a stepped through hole that gradually becomes smaller from one side of the boss 4122 to the inside of the second housing 410. A sealing window 4123 is provided in the sixth connection hole 4121 at the boss 4122 to seal the sixth connection hole 4121.

[0253] Figure 18A is a transmission optical path diagram of an optical transmission signal according to some embodiments, and Figure 18B is a transmission optical path diagram of another optical transmission signal according to some embodiments, and Figure 18B shows the transmission optical path of another optical transmission signal. As shown in Figures 18A and 18B, the first wavelength optical signal generated by the first laser assembly 440 is transmitted to the second lens 4181, collimated by the second lens 4181, and then transmitted to the third filter 417. The optical signal is transmitted through the third filter 417 to the second filter 416, and then transmitted to the sixth connection hole 4121 through the second filter 416. The second wavelength optical signal generated by the second laser assembly 450 is transmitted to the third lens 4182, collimated by the third lens 4182, and then transmitted to the third filter 417. The optical signal is reflected by the third filter 417 and transmitted to the second filter 416. The optical signal is transmitted to the sixth connection hole 4121 through the second filter 416. The third wavelength optical signal generated by the third laser assembly 460 is transmitted to the fourth lens 4183, collimated by the fourth lens 4183, and then transmitted to the second filter 416. The optical signal is reflected by the second filter 416 and transmitted to the sixth connection hole 4121. The second filter 416 and the third filter 417 allow the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal to share a common optical path when outputting from the second housing 410 .

[0254] FIG19A is a first structural diagram of a mounting bracket according to some embodiments, and FIG19B is a second structural diagram of a mounting bracket according to some embodiments. As shown in FIG19A and FIG19B , mounting bracket 470 includes a bracket body 471, with a first support 472 and a second support 473 disposed on the sides of bracket body 471. The bottom of bracket body 471 is connected to support plate 419; one end of first support 472 is connected to bracket body 471, and the other end of first support 472 extends away from bracket body 471; one end of second support 473 is connected to bracket body 471, and the other end of second support 473 extends away from bracket body 471; a gap 474 is formed between first support 472 and second support 473. Gap 474 is configured to transmit the first wavelength optical signal and the third wavelength optical signal.

[0255] In some embodiments, a first support surface 4721 is provided on one side of the first support body 472, a second support surface 4722 is provided on the other side of the first support body 472, a third support surface 4731 is provided on one side of the second support body 473, and a fourth support surface 4732 is provided on the other side of the second support body 473. The first support surface 4721 and the third support surface 4731 are inclined at a first preset angle, while the second support surface 4722 and the fourth support surface 4732 are inclined at a second preset angle. The first support surface 4721 and the third support surface 4731 support and connect the second optical filter 416, while the second support surface 4722 and the fourth support surface 4732 support and connect the third optical filter 417, thereby facilitating the fixing of the second filter 416 and the third filter 417.

[0256] In some embodiments, the bracket body 471 is further provided with a first limiting surface 4711 and a second limiting surface 4712, respectively located on the side edges of the bracket body 471. The first limiting surface 4711 is located at one end of the first support surface 4721, and the second limiting surface 4712 is located at one end of the second support surface 4722. For example, one end of the first limiting surface 4711 and one end of the second limiting surface 4712 extend to the top of the bracket body 471, respectively, while the other ends of the first limiting surface 4711 and the other ends of the second limiting surface 4712 extend to the bottom of the bracket body 471. The first limiting surface 4711 is provided for retaining the second filter 416, while the second limiting surface 4712 is provided for retaining the third filter 417. The first limiting surface 4711 and the second limiting surface 4712 facilitate precise assembly of the second filter 416 and the third filter 417.

[0257] In some embodiments, a first driver chip 320, a second driver chip 330, a third driver chip 340, and an MCU 350 are provided on the circuit board 300. The first driver chip 320 is electrically connected to the first laser assembly 440 and the second light receiving component 540. The first driver chip 320 is used to drive the first laser assembly 440 to generate a first wavelength optical signal and receive and process the electrical signal output by the second light receiving component 540 when receiving the fifth wavelength optical signal; the second driver chip 330 is electrically connected to the second laser assembly 450 and the first light receiving component 530. The second driver chip 330 is used to drive the second laser assembly 450 to generate a second wavelength optical signal and receive and process the electrical signal output by the first light receiving component 530 when receiving the fourth wavelength optical signal; the third driver chip 340 is electrically connected to the third laser assembly 460 and the third light receiving component 550. The third driver chip 340 is used to drive the second laser assembly 450 to generate a third wavelength optical signal and receive and process the electrical signal output by the third light receiving component 550 when receiving the sixth wavelength optical signal. The MCU 350 is connected to the gold finger 310 and controls the connection between the first driver chip 320 , the second driver chip 330 and the third driver chip 340 .

[0258] Figure 20A is a partial view of another optical emitting component according to some embodiments, and Figure 20B is a partial view of another optical emitting component according to some embodiments. In some embodiments, as shown in Figures 20A and 20B , an opening 4100 is defined in the second housing 410, with the opening 4100 facing the first sidewall 412. The optical emitting component 400 may include an electrical connector 401, which is embedded in the connection opening 4100, with one end of the electrical connector 401 positioned within the second housing 410 and the other end positioned outside the second housing 420. A solder pad is formed on one end of the electrical connector 401 for electrically connecting to electrical components within the second housing 410; a solder pad is formed on the other end of the electrical connector 401 for electrically connecting to a flexible printed circuit board, thereby electrically connecting to the printed circuit board 300 via the flexible printed circuit board.

[0259] In some embodiments, the first laser assembly 440 is disposed at an edge of one end of the electrical connector 401. The first laser assembly 440 can bond wires to the electrical connector 401. For example, one side of the first laser assembly 440 can be adjacent to the fourth sidewall 415, and the backlight side of the first laser assembly 440 can be adjacent to the edge of one end of the electrical connector 401.

[0260] In some embodiments, the second laser assembly 450 is disposed at an edge of one end of the electrical connector 401. The second laser assembly 450 can be used to bond the electrical connector 401. For example, one side of the second laser assembly 450 can be adjacent to the second sidewall 413, and the backlight side of the second laser assembly 450 can be adjacent to an edge of the one end of the electrical connector 401.

[0261] In some embodiments, a third laser assembly 460 is disposed at an edge of one end of the electrical connector 401. The third laser assembly 460 can perform wire bonding to the electrical connector 401. Exemplarily, the third laser assembly 460 is located between the first laser assembly 440 and the third laser assembly 460, with the backlight side of the third laser assembly 460 proximate to the edge of the one end of the electrical connector 401.

[0262] In some embodiments, the optical transmission component 400 may include a multiplexing component 402. The multiplexing component 402 is disposed on a transmission optical path from the first laser component 440 to the sixth connection hole 4121 and is configured to adjust the transmission optical path of the optical transmission signals generated by the first laser component 440, etc., so that the optical transmission signals generated by the first laser component 440, etc. share a common optical path when output from the second housing 410.

[0263] In some embodiments, the wavelength combining component 402 may include a wavelength division multiplexer, a polarization component, or a polarization combining component.

[0264] In some embodiments, the wave combining assembly 402 may include a fourth filter 4021, which is located on the output optical path of the first laser assembly 440. Exemplarily, the fourth filter 4021 includes an incident surface and a filtering surface.

[0265] In some embodiments, the wave combiner 402 may include a fifth filter 4022, which is located in the output optical path of the third laser assembly 460. Exemplarily, the fifth filter 4022 includes an incident surface, a first filtering surface, a second filtering surface, and a light emitting surface.

[0266] In some embodiments, the wave combiner 402 may include a sixth filter 4023, which is located on the output optical path of the second laser assembly 450. Exemplarily, the sixth filter 4023 includes an incident surface, a first filtering surface, and a second filtering surface.

[0267] In some embodiments, the filtering surface of the fourth filter 4021 is connected to the second filtering surface of the fifth filter 4022 , and the first filtering surface of the fifth filter 4022 is connected to the second filtering surface of the sixth filter 4023 .

[0268] In some embodiments, the optical transmission component 400 may include a first isolator 403, which is disposed on the optical transmission path from the first laser assembly 440 to the fourth optical filter 4021. The first isolator 403 is configured to prevent optical signals reflected by the fourth optical filter 4021 from being retransmitted to the first laser assembly 440. Exemplarily, the first isolator 403 is located on the optical transmission path from the second lens 4181 to the fourth optical filter 4021.

[0269] In some embodiments, the optical transmission component 400 may include a second isolator 404, which is disposed on the optical transmission path from the second laser assembly 450 to the sixth optical filter 4023. The second isolator 404 is configured to prevent optical signals reflected by the sixth optical filter 4023 from being retransmitted to the second laser assembly 450. Exemplarily, the second isolator 404 is located on the optical transmission path from the third lens 4182 to the sixth optical filter 4023.

[0270] In some embodiments, the optical transmission component 400 may include a third isolator 405, which is disposed on the optical transmission path from the third laser assembly 460 to the fifth optical filter 4022. The third isolator 405 is configured to prevent optical signals reflected by the fifth optical filter 4022 from being retransmitted to the third laser assembly 460. Exemplarily, the third isolator 405 is located on the optical transmission path from the fourth lens 4183 to the fifth optical filter 4022.

[0271] In some embodiments, the first wavelength optical signal generated by the first laser assembly 440 is collimated by the second lens 4181 and then transmitted to the first isolator 403, transmitted through the first isolator 403 to the incident surface of the fourth filter 4021, transmitted through the incident surface of the fourth filter 4021 to the filtering surface of the fourth filter 4021, and sequentially transmitted through the filtering surface of the fourth filter 4021 and the second filtering surface of the fifth filter 4022, and output through the light output surface of the fifth filter 4022.

[0272] In some embodiments, the second wavelength optical signal generated by the second laser assembly 450 is collimated by the third lens 4182 and then transmitted to the second isolator 404. The second wavelength optical signal is transmitted through the second isolator 404 to the incident surface of the sixth filter 4023, transmitted through the incident surface of the sixth filter 4023 to the first filtering surface of the sixth filter 4023, reflected by the first filtering surface of the sixth filter 4023 and transmitted to the second filtering surface of the sixth filter 4023, and then transmitted through the second filtering surface of the sixth filter 4023 and the first filtering surface of the fifth filter 4022 in sequence to the second filtering surface of the fifth filter 4022. The second wavelength optical signal is reflected by the second filtering surface of the fifth filter 4022 and transmitted to the light exiting surface of the fifth filter 4022, and then output through the light exiting surface of the fifth filter 4022.

[0273] In some embodiments, the third wavelength optical signal generated by the third laser assembly 460 is transmitted to the third isolator 405 after being deflected by the fourth lens 4183, transmitted through the third isolator 405 to the incident surface of the fifth filter 4022, transmitted through the incident surface of the fifth filter 4022 to the first filtering surface of the fifth filter 4022, reflected by the first filtering surface of the fifth filter 4022 and transmitted to the second filtering surface of the fifth filter 4022, reflected by the second filtering surface of the fifth filter 4022 and transmitted to the light exiting surface of the fifth filter 4022, and output through the light exiting surface of the fifth filter 4022.

[0274] Figure 21A is an exploded view of another light emitting component according to some embodiments. In some embodiments, as shown in Figure 21A , a first mounting hole 4145 may be formed on the third sidewall 414, communicating with the inner cavity of the second housing 410. The light emitting component 400 may include a first laser assembly 440a, the front end of which is connected to the first mounting hole 4145, such that the light emitting end of the first laser assembly 440a is located within the second housing 410.

[0275] In some embodiments, a second mounting hole 4131 may be formed on the second sidewall 413, and the second mounting hole 4131 communicates with the inner cavity of the second housing 410. The light emitting component 400 may include a second laser assembly 450a, the front end of which is connected to the second mounting hole 4131, so that the light output end of the second laser assembly 450a is located within the second housing 410.

[0276] In some embodiments, a third mounting hole 4151 may be formed on the fourth sidewall 415, communicating with the inner cavity of the second housing 410. The light emitting component 400 may include a third laser assembly 460a, with the front end of the third laser assembly 460a connected to the third mounting hole 4151, such that the light emitting end of the third laser assembly 460a is located within the second housing 410.

[0277] In some embodiments, a combining component 402a is disposed in the second housing 410 , and the output end of the combining component 402a is located on the input optical path of the sixth connecting hole 4121 , so that the optical emission signals generated by the first laser component 440a and the like share a common optical path when outputting from the second housing 410 .

[0278] Figure 21B is a structural diagram of another wave combining assembly according to some embodiments, and Figure 21C is a cross-sectional view of another wave combining assembly according to some embodiments. In some embodiments, wave combining assembly 402 may include a seventh optical filter 4025, which is located on the output optical path of second laser assembly 450a and the input optical path of sixth connecting hole 4121. Seventh filter 4025 is configured to reflect and transmit the second wavelength optical signal generated by second laser assembly 450a to sixth connecting hole 4121, thereby allowing light transmitted in a direction perpendicular to the input optical path of sixth connecting hole 4121 to be input into sixth connecting hole 4121.

[0279] In some embodiments, the wavelength combining assembly 402 may include an eighth optical filter 4024. The eighth optical filter 4024 is located on the output optical path of the third laser assembly 460a and the input optical path of the sixth connecting hole 4121. The eighth optical filter 4024 is configured to reflect and transmit the third wavelength optical signal generated by the third laser assembly 460a to the sixth connecting hole 4121, thereby allowing light transmitted in a direction perpendicular to the input optical path of the sixth connecting hole 4121 to be input into the sixth connecting hole 4121.

[0280] In some embodiments, the first wavelength optical signal generated by the first laser assembly 440 a passes through the seventh filter 4025 and the eighth filter 4024 in sequence and is transmitted to the sixth connection hole 4121 .

[0281] In some embodiments, the combiner assembly 402 may include a connector 4026 that supports and connects the seventh filter 4025 and the eighth filter 4024 to facilitate fixing the seventh filter 4025 and the eighth filter 4024 in the second housing 420 .

[0282] In some embodiments, a first connecting surface 4026 a is formed on the connecting member 4026 , and the first connecting surface 4026 a supports and connects to the eighth filter 4024 .

[0283] In some embodiments, a second connecting surface 4026 b is formed on the connecting member 4026 , and the second connecting surface 4026 b supports and connects to the seventh filter 4025 .

[0284] In some embodiments, a third connecting surface 4026 c is formed on the connecting member 4026 , and the third connecting surface 4026 c faces the second laser assembly 450 a .

[0285] In some embodiments, a through hole 4026d may be formed on the connector 4026, and the through hole 4026d passes through the first connecting surface 4026a, the second connecting surface 4026b, and the third connecting surface 4026c. The through hole 4026d can reduce the loss of the first wavelength optical signal caused by the connector 4026.

[0286] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: An optical fiber adapter, one end of which is used to connect to an external optical fiber and is configured to transmit an optical transmission signal and an optical reception signal; An optical receiving component, one end of which is connected to the other end of the optical fiber adapter, comprises a first housing and an optical component arranged in the first housing, one end of the first housing is connected to the optical fiber adapter; a first connecting hole and a second connecting hole are formed on the first housing; The first connection hole is connected to the first light receiving component, and the second connection hole is connected to the second light receiving component; Wherein, the optical component comprises: a first displacement prism, wherein a first reflection surface of the first displacement prism is located on a transmission light path of the optical fiber adapter; A first filter is located on the reflected light path of the second reflecting surface of the first displacement prism; A first reflector, located on the reflected light path of the first filter; A wavelength division multiplexer, wherein a light input port is formed on a first side, and a first output end and a second output end are formed on a second side; the light input port is located on a reflection light path of the reflector; a second displacement prism, wherein a first emitting surface of the second displacement prism is located on an output light path of the first output end; The first light receiving component is located on the reflected light path of the second emitting surface of the second displacement prism; the second light receiving component is located on the output light path of the second output end; A light emitting component, one end of which is connected to the other end of the first housing; a light emitting signal generated by the light emitting component is transmitted to the optical fiber adapter through the first housing; The optical emitting component includes a second cavity and a first laser component and a second laser component arranged in the second cavity; the second cavity includes two connected side walls, the first laser component and the second laser component are distributed on the sides of the two connected side walls, the first laser component generates a first wavelength optical signal, and the second laser component generates a second wavelength optical signal; Multiple rows of pins are respectively arranged on the two connected side walls, and the pins in the bottom row on the two connected side walls include high-frequency pins, and the ends of the high-frequency pins extend into the second cavity; a light outlet is arranged at one end of the second cavity, and the light outlet is optically connected to the optical accommodation component, and the first laser component and the second laser component are respectively electrically connected to corresponding high-frequency pins.

2. The optical module according to claim 1, wherein: A first accommodating chamber, a second accommodating chamber and a third accommodating chamber are formed inside the first shell; The second accommodating cavity extends along one side of the first shell, a first baffle is provided between the first accommodating cavity and the second accommodating cavity, a first through cavity is provided on the first baffle, and the first accommodating cavity is connected to the second accommodating cavity through the first through cavity; the first connecting hole and the second connecting hole are respectively connected to the second accommodating cavity, and the second displacement prism is located in the second accommodating cavity; The third accommodating cavity is located at the side of the other end of the first housing, a second baffle is arranged between the first accommodating cavity and the third accommodating cavity, and a second through cavity is formed on the second baffle; a fifth connecting hole is formed on the side wall of the other end of the first housing, and the fifth connecting hole is connected to the third accommodating cavity; The optical component further includes a fourth displacement prism, which is disposed in the third accommodating cavity; one end of the fourth displacement prism is located on a side of the fifth connecting hole, and the other end is located on a side of the first filter.

3. The optical module according to claim 1, wherein: A third connecting hole is also formed on the first housing; the third connecting hole is connected to a third light receiving component; a third output terminal is also formed on the second side of the wavelength division multiplexer; Wherein, the optical component further comprises: A third displacement prism, wherein the first reflection surface of the third displacement prism is located on the output light path of the third output end; and the third light receiving component is located on the reflection light path of the second reflection surface of the third displacement prism.

4. The optical module according to claim 1, wherein: The optical emitting component includes a second shell, and the second cavity is formed in the second shell; a first adapter board and a second adapter board are arranged in the second shell; a plurality of rows of pins are arranged on the third side wall of the second shell, and the pins in the bottom row on the third side wall include a first high-frequency pin and a second high-frequency pin, and one end of the first high-frequency pin and one end of the second high-frequency pin pass through the third side wall and extend into the second shell; the first laser assembly generates a first wavelength optical signal, and the second laser assembly generates a second wavelength optical signal; The first adapter plate and the second adapter plate are arranged on the side of the third side wall, the first laser assembly is located on the side of the first adapter plate, the second laser assembly is located on the side of the second adapter plate, and the first laser assembly and the second laser assembly are distributed on the sides of two connected side walls of the second housing; A first high-frequency transmission line is arranged on the first adapter board, and a second high-frequency transmission line is arranged on the second adapter board; the first laser component and the first high-frequency pin are electrically connected to the first high-frequency transmission line respectively, and the second laser component and the second high-frequency pin are electrically connected to the second high-frequency transmission line respectively.

5. The optical module according to claim 4, wherein: A plurality of rows of pins are arranged on a fourth side wall of the second housing, and the second laser assembly is arranged on a side of the fourth side wall; A third adapter plate is also provided in the second shell, and the third adapter plate is provided between the second laser assembly and the second adapter plate and is located at the edge of the connection between two connected side walls of the second shell; a third high-frequency transmission line is provided on the third adapter plate, and one end of the third high-frequency transmission line is connected to the second laser assembly by bonding, and the other end of the third high-frequency transmission line is connected to the second high-frequency transmission line by bonding.

6. The optical module according to claim 4, wherein: The third side wall is provided with a first step surface and a first side surface, the bottom of the first side surface is connected to the first step surface; the first adapter board and the second adapter board are provided on the first step surface, one end of the first high-frequency pin passes through the first side surface and extends to the top of the first adapter board, and one end of the second high-frequency pin passes through the first side surface and extends to the top of the second adapter board; The first high-frequency pin is connected to the first high-frequency transmission line by soldering, and the second high-frequency pin is connected to the second high-frequency transmission line by soldering.

7. The optical module according to claim 6, wherein: A first ground layer and a second ground layer are arranged on the front side of the first adapter board, and a ground layer is arranged on the back side of the first adapter board; the first ground layer is arranged on one side of the first high-frequency transmission line, and the second ground layer is arranged on the other side of the first high-frequency transmission line; the first ground layer and the second ground layer are respectively connected to the ground layers through vias, and the ground layers are electrically connected to the first step surface.

8. The optical module according to claim 5, wherein: A TEC, a support plate and a fourth adapter plate are also arranged in the second housing, the bottom of the TEC is connected to the bottom plate of the second housing, the support plate is arranged on the top of the TEC, and the support plate supports the first laser assembly, the second laser assembly and the fourth adapter plate; A first TEC pad and a second TEC pad are disposed on the TEC, and the first TEC pad and the second TEC pad are disposed on the side of the second side wall of the second housing; The first metal layer and the second metal layer are arranged on the fourth adapter board, and the first TEC pin and the second TEC pin are also arranged on the third side wall. The first metal layer is respectively connected with the first TEC pad and the first TEC pin by wires, and the second metal layer is respectively connected with the second TEC pad and the second TEC pin by wires.

9. The optical module according to any one of claims 4 to 8, wherein: The second cavity is also provided with a third laser component, a second filter and a third filter; the third laser component generates a third wavelength optical signal; The second filter and the third filter are arranged side by side at the side of the light outlet, the first optical surface of the second filter faces the third laser assembly, the second optical surface of the second filter faces the third optical surface of the third filter, and the third optical surface faces the second laser assembly. The fourth optical surface of the third filter faces the first laser component; and the third laser component is electrically connected to a corresponding high-frequency pin.

10. The optical module according to claim 9, wherein: A first lens is disposed between the first laser assembly and the fourth optical surface, a second lens is disposed between the second laser assembly and the third optical surface, and a third lens is disposed between the third laser assembly and the first optical surface.

11. The optical module according to claim 9, wherein: A mounting bracket is also provided in the second cavity, and the mounting bracket includes a bracket body, a first support body, and a second support body; one end of the first support body is connected to the side of the bracket body, and the other end of the first support body extends away from the bracket body; one end of the second support body is connected to the side of the bracket body, and the other end of the second support body extends away from the bracket body; A gap is set between the first support body and the second support body, one side of the first support body and one side of the second support body support and connect the second filter, the other side of the first support body and the other side of the second support body support and connect the third filter; the first wavelength optical signal and the third wavelength optical signal pass through the gap.

12. The optical module according to claim 11, wherein: A first supporting surface is provided on one side of the first supporting body, and a second supporting surface is provided on the other side of the first supporting body; a third supporting surface is provided on one side of the second supporting body, and a fourth supporting surface is provided on the other side of the second supporting body; a first limiting surface and a second limiting surface are provided on the side edge of the bracket body; The first supporting surface and the third supporting surface support and connect the second optical filter, the second supporting surface and the fourth supporting surface support and connect the third optical filter, the first limiting surface limit-connects the second optical filter, and the second limiting surface limit-connects the third optical filter.

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