Grounding material and preparation method thereof
By mixing highly conductive metal powder, carbon nanotubes and conductive polymers with epoxy resin and polyurethane to prepare grounding materials, the problems of insufficient conductivity and corrosion resistance of existing grounding materials are solved, and high-performance and long-life grounding materials are achieved.
Patent Information
- Application Number
- CN202510863378.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-25
- Publication Date
- 2025-10-03
AI Technical Summary
Existing grounding materials have poor electrical conductivity, poor corrosion resistance, and a short service life, especially in harsh environments where their performance cannot be maintained for a long time.
The grounding material is prepared by mixing high-conductivity metal powder with nano-carbon tubes and conductive polymer to form a composite conductive agent, combining it with epoxy resin and polyurethane resin matrix and micro-silicate filler, and adopting a heating and curing process.
The prepared grounding material has excellent electrical conductivity, good corrosion resistance and environmental adaptability, is suitable for various harsh environments, extends service life and reduces costs.
Smart Images
Figure CN120737543A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of material technology, and in particular to a grounding material and a preparation method thereof. Background Art
[0002] With the continuous development of modern technology, the use of power equipment, communication equipment and electronic equipment has become more and more extensive, and the safety and stability of their grounding systems have become top priority.
[0003] Existing grounding materials mostly use metals, carbon materials or synthetic conductive substances, but these traditional materials have problems such as high cost, unstable conductivity, and poor durability. Especially in harsh soil conditions, the performance of grounding materials often cannot be maintained for a long time.
[0004] Therefore, there is an urgent need for a new type of grounding material that can ensure high grounding performance while having stronger environmental adaptability and longer service life. Summary of the Invention
[0005] The present invention provides a grounding material and its preparation method, aiming to address the problems of poor conductivity, poor corrosion resistance, and short service life of existing grounding materials. The material, prepared through a specific chemical composition and preparation process, can improve the safety and reliability of grounding systems.
[0006] In a first aspect, an embodiment of the present application provides a grounding material, including:
[0007] Composite conductive agent, resin matrix, hygroscopic additive and micro-silicate filler.
[0008] In a possible implementation, the composite conductive agent is composed of highly conductive metal powder, carbon nanotubes, and conductive polymer.
[0009] In one possible implementation, the resin matrix is a mixture of epoxy resin and polyurethane.
[0010] In one possible implementation, the electrical conductivity of the grounding material is greater than or equal to 10 4 S / m.
[0011] In a second aspect, an embodiment of the present application provides a method for preparing a grounding material, the method comprising:
[0012] The highly conductive metal powder is mixed with carbon nanotubes and a conductive polymer in a mass ratio of 1:2:1, and dispersed by ultrasonic treatment to fully mix the mixture to obtain a composite conductive agent material;
[0013] Epoxy resin and polyurethane are mixed in a mass ratio of 1:1, an appropriate amount of solvent is added, and the mixture is stirred evenly to obtain a resin matrix;
[0014] The composite conductive material, the resin matrix and the micro-silicate filler are mixed in a mass ratio of 2:3:1, an appropriate amount of a hygroscopic auxiliary agent is added, and the mixture is uniformly mixed using a high-speed stirrer to obtain a slurry;
[0015] The slurry is poured into a mold and formed through a heating and curing process to obtain a grounding material.
[0016] In a possible embodiment, when the molding is performed by a heating and curing process, the curing temperature is 80°C.
[0017] In one possible implementation, the curing time is 4 hours.
[0018] In a third aspect, an embodiment of the present application provides a grounding device, which is made of the grounding material described in the first aspect, or the grounding device is made of the grounding material prepared by the preparation method described in the second aspect.
[0019] In a fourth aspect, an embodiment of the present application provides an electronic device, which is grounded by the grounding device described in the third aspect.
[0020] The embodiment of the present application provides a grounding material and a preparation method thereof, which comprises the following steps: mixing highly conductive metal powder with carbon nanotubes and conductive polymer in a mass ratio of 1:2:1, dispersing the mixture by ultrasonic treatment, and fully mixing the mixture to obtain a composite conductive agent material; mixing epoxy resin and polyurethane in a mass ratio of 1:1, adding an appropriate amount of solvent, and stirring the mixture to obtain a resin matrix; mixing the composite conductive agent material, the resin matrix, and the micro-silicate filler in a mass ratio of 2:3:1, adding an appropriate amount of hygroscopic additive, and uniformly mixing the mixture using a high-speed stirrer to obtain a slurry; pouring the slurry into a mold, and forming the mixture through a heating and curing process to obtain a grounding material. The grounding material prepared by the above method comprises a composite conductive agent, a resin matrix, a hygroscopic additive, and a micro-silicate filler. The grounding material can ensure high grounding performance while having stronger environmental adaptability and a longer service life. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0022] Figure 1 A schematic flow chart of a method for preparing a grounding material provided in this application.
[0023] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION
[0024] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
[0025] First, the application background of this application is explained as follows:
[0026] With the rapid development of modern technology, the use of power, communications, and electronic equipment has become increasingly prevalent. The proper operation and safety of these devices are highly dependent on the stability and reliability of their grounding systems. The primary function of a grounding system is to safely direct excess current into the ground, preventing equipment damage and personal injury. Therefore, the selection and performance of grounding materials are crucial to the safety of the entire system.
[0027] Traditional grounding materials typically use metals (such as copper and aluminum), carbon materials, or synthetic conductive substances. While these materials can meet grounding requirements to a certain extent, they also have some significant shortcomings. First, while metals such as copper and aluminum have excellent electrical conductivity, they are relatively expensive, significantly increasing the economic burden when used on a large scale. Furthermore, metals are susceptible to oxidation and corrosion in corrosive environments, resulting in decreased conductivity and material loss.
[0028] While carbon materials and synthetic conductive substances offer alternatives in some areas, their conductivity can be unstable, especially over long periods of use or under extreme environmental conditions. This poor durability is particularly pronounced in harsh soil conditions, such as those with high salinity, strong acidity or alkalinity, or extreme temperatures, where traditional grounding materials often fail to maintain their performance over time. This degradation can lead to increased ground resistance, reducing the effectiveness and safety of the grounding system.
[0029] Therefore, developing new grounding materials to overcome the shortcomings of these traditional materials is crucial. Ideal grounding materials should possess superior electrical conductivity, good corrosion resistance, strong environmental adaptability, and be cost-effective. Such materials should not only maintain stable performance in a variety of harsh environments but also reduce overall system maintenance and replacement costs, ensuring the long-term reliability and safety of the grounding system.
[0030] Based on the above technical problems, the inventors found that in the process of studying the preparation of grounding materials, a composite conductive material is obtained by uniformly mixing highly conductive metal powder with carbon nanotubes and conductive polymers; then, epoxy resin and polyurethane are added with an appropriate amount of solvent and stirred evenly to obtain a resin matrix; finally, the composite conductive material, the resin matrix and micro-silicate filler are mixed in a mass ratio of 2:3:1, an appropriate amount of hygroscopic additive is added, and a high-speed stirrer is used to uniformly mix to obtain a slurry; finally, the slurry is poured into a mold and formed by a heating and curing process to obtain a grounding material. This material has the advantages of excellent electrical conductivity, strong environmental adaptability, good corrosion resistance, low cost, etc., and is suitable for grounding systems in various harsh environments. Based on this, the present application provides a grounding material and a preparation method thereof.
[0031] The grounding material and preparation method provided in this application are suitable for the grounding protection field of power, communication and electronic equipment, especially grounding materials with higher conductivity and better environmental adaptability, which are not limited in this application.
[0032] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.
[0033] Figure 1 A schematic diagram of a process for preparing a grounding material provided in this application is shown in FIG. Figure 1 As shown, the method includes:
[0034] S101: Highly conductive metal powder is mixed with carbon nanotubes and conductive polymer in a mass ratio of 1:2:1, and dispersed by ultrasonic treatment to fully mix the powder and obtain a composite conductive material.
[0035] S102: Epoxy resin and polyurethane are mixed in a mass ratio of 1:1, an appropriate amount of solvent is added, and the mixture is stirred evenly to obtain a resin matrix.
[0036] S103: The composite conductive material, the resin matrix and the micro-silicate filler are mixed in a mass ratio of 2:3:1, an appropriate amount of a hygroscopic auxiliary agent is added, and the mixture is uniformly mixed using a high-speed stirrer to obtain a slurry.
[0037] S104: Pour the slurry into a mold and shape it through a heating and curing process to obtain a grounding material.
[0038] exist Figure 1Based on the embodiment, when forming is performed by the heating and curing process in S104, the curing temperature is 80° C. and the curing time is 4 hours.
[0039] The prepared grounding material comprises: a composite conductive agent, a resin matrix, a hygroscopic auxiliary agent and micro-sized silicate filler.
[0040] In one possible embodiment, the composite conductive agent is composed of highly conductive metal powder, carbon nanotubes, and conductive polymer.
[0041] In one possible embodiment, the resin matrix is a mixture of epoxy resin and polyurethane.
[0042] In one possible embodiment, the electrical conductivity of the grounding material is greater than or equal to 10 4 S / m.
[0043] The present application also provides a grounding device, which is made of the grounding material in the aforementioned embodiment, or the grounding device is made of the grounding material prepared by the aforementioned preparation method.
[0044] The present application also provides an electronic device, which is grounded via the aforementioned grounding device.
[0045] The following will introduce the application of the grounding material and the preparation method thereof provided by the present application in detail through specific examples.
[0046] Unless otherwise specified, the reagents, materials, and instruments used in the following examples are conventional reagents, conventional materials, and conventional instruments in the art and can be obtained commercially. The reagents involved can also be synthesized by conventional methods in the art.
[0047] Example 1
[0048] This embodiment provides a grounding material, and the preparation method thereof includes the following steps:
[0049] (1) 30g of highly conductive metal powder - copper powder (particle size ≤5 ) was mixed with 20 g of carbon nanotubes and 10 g of polypyrrole conductive polymer in a mass ratio of 1:2:1, and dispersed by ultrasonic treatment to fully mix to obtain a composite conductive agent material.
[0050] (2) Mix 40 g of epoxy resin and 40 g of polyurethane in a mass ratio of 1:1, add an appropriate amount of solvent, and stir evenly to obtain a resin matrix.
[0051] (3) The composite conductive material obtained in step (1), the resin matrix obtained in step (2), and 10 g of micro-silicate filler were mixed in a mass ratio of 2:3:1, 5 g of a hygroscopic auxiliary agent was added, and the mixture was uniformly mixed using a high-speed stirrer to obtain a slurry.
[0052] Example 2
[0053] This embodiment provides a grounding material, and its preparation method is basically the same as that of Example 1, except that:
[0054] (1) 40g of highly conductive metal powder - silver powder (particle size ≤3 ) was mixed with 15 g of carbon nanotubes and 5 g of polypyrrole conductive polymer in a mass ratio of 1:2:1, and dispersed by ultrasonic treatment to fully mix to obtain a composite conductive agent material.
[0055] (2) Mix 50g of epoxy resin and 50g of polyurethane in a mass ratio of 1:1, add an appropriate amount of solvent, and stir evenly to obtain a resin matrix.
[0056] (3) The composite conductive material obtained in step (1), the resin matrix obtained in step (2), and 15 g of micro-silicate filler were mixed in a mass ratio of 2:3:1, 3 g of a hygroscopic auxiliary agent was added, and the mixture was uniformly mixed using a high-speed stirrer to obtain a slurry.
[0057] Test Example 1
[0058] The four-probe method measures conductivity: First, four probes arranged in a straight line with equal spacing are pressed vertically onto the surface of the material to be tested. The four probes are usually made of materials with good conductive properties such as tungsten wire. Then, a constant current of known magnitude is passed between the two outer probes (i.e., the first and fourth probes). Then, a voltmeter with high input impedance is used to measure the potential difference between the two inner probes (the second and third probes). Finally, based on the geometric shape of the material, the spacing between the probes, and the measured current and potential difference, the conductivity is calculated using the conductivity calculation formula. ,in represents conductivity, I represents current, s represents the probe distance, and V represents the potential difference.
[0059] Test Example 2
[0060] ASTM B117 standard salt spray test for corrosion resistance: First, remove the sample from the salt spray chamber and slowly rinse the surface with running water at a temperature not exceeding 38°C to remove attached salt spray particles and corrosion products. After rinsing, blot dry with a clean soft cloth or dry in an environment with a temperature of 35±2°C and a humidity not exceeding 50%. After drying, inspect the surface of the material using a 5-10x magnifying glass to observe whether there is any corrosion.
[0061] Test Example 3
[0062] Thermal stability test: First, prepare the grounding material to be tested into samples of uniform specifications to ensure that the surface is clean and free of stains to prevent impurities from affecting the accuracy of the conductivity test. The sample is then placed in a programmable temperature-controlled high and low temperature cycle box, and the temperature control program is set: first, the temperature in the box is raised from room temperature (25±5℃) to 80℃ at a rate of no more than 5℃ / min. After reaching the target temperature, it is kept warm for 1-2 hours to make the sample temperature fully uniform; then it is cooled to -20℃ at the same rate and kept warm for the same time to complete a temperature cycle. During the test, the temperature cycle curve, the conductivity values measured at each time, and the ambient temperature and humidity data are recorded throughout the test. By comparing the conductivity parameters of the initial state and each cycle stage, the stability of the material in a high and low temperature alternating environment is evaluated.
[0063] The performance test results are as follows:
[0064] The grounding material in Example 1 has an electrical conductivity of 10 4 S / m, which is superior to existing similar grounding materials and has excellent corrosion resistance. After 1000 hours of salt spray test, there is no obvious corrosion mark on the surface and the electrical conductivity is still maintained at more than 90%.
[0065] The electrical conductivity of the grounding material in Example 2 was tested at a high temperature of 80°C and a low temperature of -20°C. The results showed that its electrical conductivity did not change significantly under different environments, demonstrating strong environmental adaptability.
[0066] By analyzing the above performance test results, it can be seen that the preparation method of the grounding material provided in this application, the grounding material prepared has excellent conductivity, corrosion resistance and environmental adaptability, is suitable for application in multiple fields such as electricity and communications, can greatly improve the safety and reliability of the grounding system, and has a low production cost and good market prospects.
[0067] Finally, it should be noted that those skilled in the art will readily identify other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art not disclosed herein. The present invention is not limited to the precise structure described above and illustrated in the accompanying drawings, and various modifications and variations may be made without departing from the scope thereof. The scope of the present invention is limited solely by the appended claims.
Claims
1. A grounding material, characterized in that: include: Composite conductive agent, resin matrix, hygroscopic additive and micro-silicate filler.
2. The grounding material according to claim 1, characterized in that The composite conductive agent is composed of highly conductive metal powder, nano carbon tubes and conductive polymer.
3. The grounding material according to claim 1 or 2, characterized in that: The resin matrix is a mixture of epoxy resin and polyurethane.
4. The grounding material according to claim 1 or 2, characterized in that: The electrical conductivity of the grounding material is greater than or equal to 10 4 S / m.
5. A method for preparing a grounding material, characterized in that: The method comprises: The highly conductive metal powder is mixed with carbon nanotubes and a conductive polymer in a mass ratio of 1:2:1, and dispersed by ultrasonic treatment to fully mix the mixture to obtain a composite conductive agent material; Epoxy resin and polyurethane are mixed in a mass ratio of 1:1, an appropriate amount of solvent is added, and the mixture is stirred evenly to obtain a resin matrix; The composite conductive material, the resin matrix and the micro-silicate filler are mixed in a mass ratio of 2:3:1, an appropriate amount of a hygroscopic auxiliary agent is added, and the mixture is uniformly mixed using a high-speed stirrer to obtain a slurry; The slurry is poured into a mold and formed through a heating and curing process to obtain a grounding material.
6. The method according to claim 5, characterized in that When forming by heat curing process, the curing temperature is 80℃.
7. The method according to claim 6, characterized in that The curing time is 4 hours.
8. A grounding device, characterized in that: The grounding device is made of the grounding material according to any one of claims 1 to 4, or the grounding device is made of the grounding material prepared by the preparation method according to any one of claims 5 to 7.
9. An electronic device, characterized in that: The electronic device is grounded via the grounding device according to claim 8.