Vibration reduction mechanism and wafer transfer device

Abstract

The invention provides a vibration reduction mechanism and a wafer transfer device, and belongs to the semiconductor precision vibration reduction technology, and the vibration reduction mechanism comprises a vibration isolation air bag unit and a vibration control driver; the multiple vibration control drivers are arranged on the periphery of the vibration isolation air bag unit through the vibration control vertical plates. The vibration isolation air bag units achieve passive vibration reduction on a supported body above through flexible deformation. A driver rotor of the vibration control driver is connected to the side end face of the supported body, and active vibration reduction is achieved by actively controlling lifting. According to the invention, a passive vibration reduction mode of the vibration isolation air bag unit and an active vibration isolation mode of the vibration control driver are adopted, so that the vibration reduction effect on a supported body is effectively improved, and a stable vibration reduction supporting scheme is provided for overlay alignment detection, wafer quantity detection, wafer processing, chip packaging and detection, high-end precise instruments and the like; and popularization and application in the fields of semiconductor detection, manufacturing and high-end precise instrument driving are facilitated.

Description

Technical Field

[0001] The present invention belongs to semiconductor precision vibration reduction technology, and in particular relates to a vibration reduction mechanism and a wafer transfer device. Background Art

[0002] In semiconductor testing or processing equipment, the wafer stage requires high stability and vibration control within a certain range. Therefore, vibration absorption or isolation mechanisms are required.

[0003] However, existing vibration absorption and isolation are passive, such as using vibration isolation airbags, vibration isolation airbag tubes, etc., which still cannot meet the needs of current high-precision machines. Therefore, it is necessary to design a new type of vibration isolation wafer machine. Summary of the Invention

[0004] In order to overcome the deficiencies of the prior art, the present invention provides a vibration reduction mechanism and a wafer transfer device, which can solve the above-mentioned problems.

[0005] A vibration reduction mechanism includes a vibration isolation airbag unit and a vibration reduction driver; multiple vibration reduction drivers are arranged on the periphery of the vibration isolation airbag unit through vibration reduction vertical plates; the vibration isolation airbag unit achieves passive vibration reduction of the supported object above through flexible deformation; the driver mover of the vibration reduction driver is connected to the side end surface of the supported object, and active vibration reduction is achieved by actively controlling the lifting and lowering.

[0006] Furthermore, the vibration isolation airbag unit includes an outer airbag, a float, a vibration isolation air valve assembly and a vibration isolation top plate; the float is coaxially embedded in the outer airbag and passively floats and rises, the vibration isolation air valve assembly is connected to the outer airbag to adjust the internal pressure of the vibration isolation airbag unit, and the vibration isolation top plate is horizontally arranged on the top of the float to support the supported object.

[0007] Furthermore, the vibration damping driver includes a driving stator and a driving mover; the driving stator is connected to the middle side boss of the stator fixing plate or the vibration damping vertical plate, and the driving mover is connected to the side of the supported body on one side adjacent to the vibration isolation airbag unit.

[0008] Furthermore, the supported body is a horizontally arranged driving beam, and a group of vibration isolation airbag units and a vibration control driver are respectively arranged at both ends of the driving beam.

[0009] The present invention also provides a wafer transfer device, including a wafer rack, a first Y-axis drive module and a second Y-axis drive module, the first Y-axis drive module and the second Y-axis drive module are supported on the wafer rack using the aforementioned vibration reduction mechanism; the two ends of the X-axis drive module are longitudinally driven and arranged between the two Y-axis drive modules, and the wafer integrated carrier with lifting and XY leveling is transversely driven and arranged on the X-axis drive module.

[0010] Compared with the existing technology, the beneficial effect of the present invention is that: the vibration reduction mechanism of the present application adopts the dual modes of passive vibration reduction of the vibration isolation airbag unit and active vibration isolation of the vibration control driver, which effectively improves the vibration reduction effect on the supported body, and provides a stable vibration reduction support solution for overlay alignment detection, wafer quantity detection, wafer processing, chip packaging and detection, high-end precision instruments, etc., which is convenient for promotion and application in the fields of semiconductor detection, manufacturing and high-end precision instrument driving. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic diagram of the vibration reduction mechanism; Figure 2 for Figure 1 A top view of Figure 3 A schematic diagram of two sets of vibration reduction mechanisms supporting a supported object; Figure 4 Schematic diagram of a wafer transfer device.

[0012] In the figure, 10. Vibration isolation airbag unit; 11. External airbag; 12. Float; 13. Vibration isolation air valve assembly; 14. Vibration isolation top plate; 15. Vibration isolation bottom plate; 20. Vibration control driver; 21. Driving stator; 22. Driving mover; 23. Stator fixing plate; 24. Mover adapter plate; 25. Vibration control limit assembly; 26. Mover baffle; 30. Vibration control vertical plate; 40. Vibration-damping base plate; 50. supported body; 60. Protection plate; 100. Wafer rack; 200, Y-axis first drive module; 300, Y-axis second drive module; 400, X-axis drive module; 500, wafer integration stage; 600. Wedge-shaped height adjustment feet. DETAILED DESCRIPTION

[0013] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0014] Vibration reduction mechanism The vibration reduction mechanism includes a vibration isolation airbag unit 10 and a vibration damping driver 20 ; a plurality of the vibration damping drivers 20 are arranged on the outer periphery of the vibration isolation airbag unit 10 via vibration damping upright plates 30 .

[0015] Passive vibration reduction: The vibration isolation airbag unit 10 achieves passive vibration reduction of the supported object 50 above through flexible deformation.

[0016] Active vibration reduction: The driver mover of the vibration reduction driver 20 is connected to the side end surface of the supported body 50, and active vibration reduction is achieved by actively controlling the lifting and lowering.

[0017] Among them, the vibration isolation airbag unit 10 includes an outer airbag 11, a float 12, a vibration isolation air valve assembly 13 and a vibration isolation top plate 14; the float 12 is coaxially embedded in the outer airbag 11 and passively floats and rises, the vibration isolation air valve assembly 13 is connected to the outer airbag 11 for adjusting the internal pressure of the vibration isolation airbag unit 10, and the vibration isolation top plate 14 is horizontally arranged on the top of the float 12 for supporting the supported body 50.

[0018] The vibration isolation airbag unit 10 further includes a vibration isolation base plate 15 , the top surface of which is connected to the outer airbag 11 and is connected to the vibration reduction base plate 40 below via screws.

[0019] Among them, the vibration damping driver 20 includes a driving stator 21 and a driving mover 22; the driving stator 21 is connected to the middle side boss of the stator fixing plate 23 or the vibration damping vertical plate 30, and the driving mover 22 is connected to the side of the supported body 50 near one side of the vibration isolation airbag unit 10.

[0020] Furthermore, the vibration damping driver 20 further includes a mover adapter plate 24 , and the driving mover 22 is connected to the supported body 50 via the mover adapter plate 24 .

[0021] Furthermore, the vibration control driver 20 also includes a vibration control limiting component 25 , which is arranged on the outside of the stator fixing plate 23 , the mover adapter plate 24 or the driving mover 22 and is used for side limiting of the vibration control driver 20 .

[0022] Of course, in addition to hardware limiting, the vibration control limiting component 25 can also be set with photoelectric limiting.

[0023] Furthermore, the vibration control driver 20 further includes a mover baffle 26 , which is disposed outside the driving mover 22 and is used for limiting and stopping.

[0024] The vibration control driver 20 includes a driving stator 21 and a driving mover 22 in the form of a linear motor, a voice coil motor, a piezoelectric driver, etc. The illustrated example preferably uses a voice coil motor.

[0025] In the illustrated example, a group of vibration damping drivers 20 is respectively provided on two sides of each vibration isolation airbag unit 10 that are vertically adjacent to each other.

[0026] Furthermore, a protective plate 60 is provided on the outer side of the vibration damping driver 20. The protective plate 60 is used for protection and anti-peeping.

[0027] In a specific example, the supported body 50 is a horizontally arranged driving beam, and a group of vibration isolation airbag units 10 and a vibration control driver 20 are respectively arranged at both ends of the driving beam.

[0028] Wafer transfer device The wafer transfer device includes a wafer rack 100, a first Y-axis drive module 200 and a second Y-axis drive module 300. The first Y-axis drive module 200 and the second Y-axis drive module 300 are supported on the wafer rack 100 using the aforementioned vibration reduction mechanism; the X-axis drive module 400 is longitudinally driven at both ends and is arranged between the two Y-axis drive modules, and the wafer integrated carrier 500 with lifting and XY leveling is transversely driven and arranged on the X-axis drive module 400.

[0029] The first Y-axis driving module 200 and the second Y-axis driving module 300 are independently driven and can be calibrated in real time and periodically to eliminate the residual error caused by the non-orthogonality between the X-axis driving module 400 and the two Y-axis driving modules.

[0030] Wedge-shaped height adjustment feet 600 are provided at the four corners of the wafer rack 100 .

[0031] This solution is currently used in wafer nano-scale overlay detection systems and image and non-image wafer (including bright field and dark field) quantity detection systems. It will be extended to processing scenarios such as lithography, PCB, and IC substrates in the future.

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A vibration damping mechanism, characterized in that: The vibration reduction mechanism comprises a vibration isolation airbag unit (10) and a vibration control driver (20); a plurality of the vibration control drivers (20) are arranged on the periphery of the vibration isolation airbag unit (10) via vibration control vertical plates (30); The vibration isolation airbag unit (10) achieves passive vibration reduction of the supported body (50) above through flexible deformation; The driver mover of the vibration control driver (20) is connected to the side end surface of the supported body (50), and active vibration reduction is achieved by actively controlling the lifting and lowering.

2. The vibration damping mechanism according to claim 1, characterized in that: The vibration isolation airbag unit (10) comprises an outer airbag (11), a float (12), a vibration isolation air valve assembly (13) and a vibration isolation top plate (14); the float (12) is coaxially embedded in the outer airbag (11) and passively floats and rises; the vibration isolation air valve assembly (13) is connected to the outer airbag (11) and is used to adjust the internal pressure of the vibration isolation airbag unit (10); and the vibration isolation top plate (14) is horizontally arranged on the top of the float (12) and is used to support the supported body (50).

3. The vibration damping mechanism according to claim 1, wherein: The vibration damping driver (20) includes a driving stator (21) and a driving mover (22); the driving stator (21) is connected to a central side boss of a stator fixing plate (23) or a vibration damping vertical plate (30); and the driving mover (22) is connected to a side of a supported body (50) adjacent to a side of the vibration isolation airbag unit (10).

4. The vibration damping mechanism according to claim 3, characterized in that: The vibration control driver (20) further includes a mover adapter plate (24), and the driving mover (22) is connected to the supported body (50) via the mover adapter plate (24).

5. The vibration damping mechanism according to claim 4, characterized in that: The vibration control driver (20) further includes a vibration control limiting assembly (25), which is arranged on the outside of the stator fixing plate (23), the mover adapter plate (24) or the driving mover (22) and is used for side limiting of the vibration control driver (20).

6. The vibration damping mechanism according to claim 5, characterized in that: The vibration control driver (20) further includes a mover baffle (26), which is arranged outside the driving mover (22) and is used for limiting and stopping.

7. The vibration damping mechanism according to claim 5, characterized in that: A protection plate (60) is provided on the outer side surface of the vibration damping driver (20).

8. The vibration damping mechanism according to claim 7, characterized in that: The supported body (50) is a horizontally arranged driving beam, and a group of vibration isolation airbag units (10) and a vibration control driver (20) are respectively arranged at both ends of the driving beam.

9. A wafer transfer device, characterized in that: The wafer transfer device includes a wafer rack (100), a first Y-axis drive module (200) and a second Y-axis drive module (300), wherein the first Y-axis drive module (200) and the second Y-axis drive module (300) are supported on the wafer rack (100) by the vibration reduction mechanism described in any one of claims 1 to 8; the two ends of the X-axis drive module (400) are longitudinally driven and arranged between the two Y-axis drive modules, and the wafer integrated carrier (500) with lifting and XY leveling is transversely driven and arranged on the X-axis drive module (400).

Images