Bonding copper wire bonding quality detection method based on multi-dimensional data analysis

Abstract

The invention discloses a bonding copper wire bonding quality detection method based on multidimensional data analysis, and relates to the technical field of bonding copper wire bonding quality detection.The method comprises the steps that a bonding copper wire surface tension calculation index is constructed, an index calculation logic relation is determined based on the bonding copper wire surface tension calculation index, and a bonding copper wire bonding quality detection result is obtained; the set surface tension of the bonding copper wire at different temperatures is obtained from a cloud end based on a multi-dimensional detection index, the multi-dimensional detection index comprises a first rare earth content and a second distance value, and the surface tension calculation index of the bonding copper wire and the set surface tension of the bonding copper wire obtained by the cloud end are matched at the same temperature; and obtaining a result whether the bonding quality of the current bonding copper wire is qualified or not. The invention provides an efficient and accurate bonding quality detection method, which can improve the production efficiency and the product quality in the electronic manufacturing industry.

Description

Technical Field

[0001] The present invention relates to the technical field of copper bonding wire bonding quality detection, in particular to a copper bonding wire bonding quality detection method based on multidimensional data analysis. Background Art

[0002] In modern industrial production, bonding technology is widely used in the manufacturing of electronic components. Bonding is the process of connecting conductive wires or metal sheets to chips or substrates. Its quality directly affects the reliability and performance stability of electronic components. Therefore, how to accurately and efficiently detect bonding quality has become a major issue facing the electronics manufacturing industry. Traditional bonding quality inspection methods rely primarily on manual visual inspection, which is subject to human subjective factors, inefficient, and prone to errors. Therefore, how to improve the accuracy and efficiency of bonding quality inspection through multidimensional data analysis is one of the most pressing issues. Summary of the Invention

[0003] The object of the present invention is to provide a method for detecting the bonding quality of bonding copper wires based on multidimensional data analysis, so as to solve the problems raised in the prior art.

[0004] To achieve the above object, the present invention provides the following technical solution: a method for detecting the bonding quality of copper wires based on multidimensional data analysis, the method comprising: Construct the surface tension calculation index of bonding copper wire; Determining an indicator calculation logic relationship based on the surface tension calculation indicator of the bonding copper wire, wherein the indicator calculation logic relationship refers to a relationship formula for determining a surface tension calculation indicator result of the bonding copper wire based on multiple indicator input data; Obtaining, from the cloud, set surface tensions of the bonding copper wire at different temperatures based on multi-dimensional detection indicators, wherein the multi-dimensional detection indicators include a first rare earth content and a second distance value, wherein the first rare earth content is determined based on the total weight of the current bonding copper and the amount of addition output by the rare earth addition device, and the second distance value refers to the distance between the current bonding copper rare earth element particles confirmed by scanning the image and is determined based on the current distance between the bonding copper rare earth element particles; The surface tension calculation index of the bonding copper wire is matched with the set surface tension of the bonding copper wire obtained from the cloud at the same temperature to obtain the result of whether the bonding quality of the current bonding copper wire is qualified.

[0005] According to the above technical solution, the multiple indicator input data include: surface tension of copper, universal gas constant, real-time temperature of bonding copper wire, specific surface area of ​​bonding copper wire, and molar fraction of component Cu in surface phase and bulk phase; Among them, the specific surface area of ​​the bonding copper wire and the surface phase and bulk phase are detected by a specific surface area detector; the real-time temperature of the bonding copper wire is detected by an optical fiber sensor; and the molar fraction of the component Cu in the surface phase and bulk phase is calculated based on the surface phase and bulk phase.

[0006] According to the above technical solution, the index calculation logic relationship specifically refers to: ; in, Refers to the surface tension calculation index of bonding copper wire; Refers to the surface tension of copper; R is the universal gas constant; T is the real-time temperature of the bonding copper wire; is the specific surface area of ​​the bonding copper wire; and are the mole fractions of Cu in the surface phase and bulk phase, respectively.

[0007] According to the above technical solution, the first rare earth content is determined based on the total weight of the current bonded copper and the addition amount output by the rare earth adding device, including: adding rare earth elements to the bonded copper using a rare earth adding device, and reading the total weight of the bonded copper after the addition is completed to determine it as a first mass value; calling the weighing sensor data of the rare earth adding device, identifying the data before and after the rare earth element is added, calculating the amount of rare earth element added, and determining it as the second mass value; The second mass value is divided by the first mass value and multiplied by 100% to obtain the result as the first rare earth content. Based on the current equipment production number, the normal rare earth content of the bonding copper is obtained from the cloud and determined as the second rare earth content. The first rare earth content and the second rare earth content are compared and analyzed, and the upper and lower limit thresholds of the comparative analysis are set as follows: If the first rare earth content is greater than the second rare earth content, , or the first rare earth content is less than the second rare earth content , determine that there is an abnormality in the current rare earth adding device, suspend the current rare earth adding device, switch to the spare rare earth adding device to clean up the rare earth elements of the bonded copper and start working again.

[0008] According to the above technical solution, the scanning image refers to the situation where, when it is determined that there is no abnormality in the rare earth content added to the current bonding copper, the system controls the bonding copper wire production equipment to fuse the rare earth element with the bonding copper, determines that the rare earth element and the bonding copper are completely fused and cooled, starts the ultrasonic scanning tomography, scans the internal image of the bonding copper that has been completely fused, and determines it as the initial scanning image; Based on the initial scan image, the system reads the defect scanning parameters of the ultrasonic scanning tomography imager, determines it as the first defect parameter, obtains the defect parameter threshold set for the bonding copper wire, determines it as the second defect parameter, matches the first defect parameter with the second defect parameter, and if the first defect parameter is greater than the second defect parameter, it is determined that there is an abnormality in the current fusion of the rare earth element and the bonding copper, and feedback is sent to the administrator port for re-fusion; if the first defect parameter is less than or equal to the second defect parameter, the initial scan image is confirmed as the scan image.

[0009] According to the above technical solution, the second distance value refers to the distance between the current bonded copper rare earth element particles confirmed by scanning the image, and the determination based on the current distance between the bonded copper rare earth element particles includes: Based on the scanned image, the distance between the current bonded copper rare earth element particles is analyzed and determined as the first distance group. The data in the first distance group are matched with each other, and the upper and lower limit thresholds of the distance are set as follows. , for any two data in the first distance group, calculate the distance difference and get the absolute positive value of the distance difference. If the percentage of the absolute positive value of any two distance differences is greater than , or the absolute positive value of any two distance differences has a percentage less than , it is determined that the current rare earth particles are unevenly distributed inside the particle; If the percentage of the absolute positive value of the difference between any two distances in the first distance group is less than or equal to , and the percentage of the absolute positive value of the difference between any two distances in the first distance group is greater than or equal to , calculate the average distance of the absolute positive values ​​of all distance differences in the current first distance group, and determine it as the second distance value. The system obtains the normal rare earth particle distance of the bonded copper through the cloud and determines it as the third distance value. The second distance value is matched with the third distance value, and the upper and lower limit thresholds of the distance matching are set respectively , if the second distance value is greater than the third distance value , or the second distance value is less than the third distance value , determine that the current rare earth particles are unevenly distributed inside the particle, and feedback to the administrator port for re-integration; if the second distance value is less than or equal to the third distance value , and the second distance value is greater than or equal to the third distance value , determine that the current rare earth particles are evenly distributed inside the particle; after determining that the current rare earth particles are evenly distributed inside the particle, expansion pretreatment is performed.

[0010] According to the above technical solution, the expansion pretreatment includes: After determining that the current rare earth particles are evenly distributed inside the product, the system controls the bonding copper wire production equipment to draw the bonding copper with the current uniform rare earth particles to form bonding copper wire, and samples the formed bonding copper wire; The heater, the laser ranging sensor, and the optical fiber sensor are started; the current temperature and the sampled length of the bonding copper wire are obtained and determined as the first bonding copper wire temperature and the first bonding copper wire length; the linear expansion coefficient of the same type of bonding copper wire in the low temperature range and the linear expansion coefficient of the medium temperature range are obtained from the cloud based on the first rare earth content and the second distance value, and the linear expansion coefficients of the first temperature range and the second temperature range are determined; The system sends a control command to the heater to heat. When the heater feedback heats to the first temperature range, the laser ranging sensor and the optical fiber sensor detect the current temperature and length of the bonding copper wire and determine them as the second bonding copper wire temperature and the second bonding copper wire length. After the detection is completed, the system sends a control command to the heater again to heat it. When the heater feedback is heated to the second temperature range, the laser ranging sensor and the optical fiber sensor detect the current temperature and length of the bonding copper wire and determine it as the third bonding copper wire temperature and the third bonding copper wire length.

[0011] According to the above technical solution, the third expansion coefficient and the fourth expansion coefficient are calculated based on the linear expansion coefficient formula; The third expansion coefficient includes: ; in, Refers to the third expansion coefficient; 、 Refers to the length of the first bonding copper wire and the length of the second bonding copper wire respectively; 、 Refers to the first bonding copper wire temperature and the second bonding copper wire temperature respectively; The fourth expansion coefficient includes: ; in, Refers to the fourth expansion coefficient; Refers to the length of the third bonding copper wire; Refers to the third bonding copper wire temperature; Compare the linear expansion coefficient of the first temperature section with the third expansion coefficient, and set the upper and lower limit thresholds of the first expansion to be ; If the linear expansion coefficient of the first temperature section is less than the third expansion coefficient , or the linear expansion coefficient of the first temperature section is greater than the third expansion coefficient , determine that the current bonding copper wire is a substandard product and feedback is sent to the administrator port; Compare the linear expansion coefficient of the second temperature section with the fourth expansion coefficient, and set the upper and lower limit thresholds of the second expansion as follows: ; If the linear expansion coefficient of the second temperature section is less than the fourth expansion coefficient , or the linear expansion coefficient of the second temperature section is greater than the fourth expansion coefficient , determine that the current bonding copper wire is a substandard product and feedback is sent to the administrator port; If the linear expansion coefficient of the first temperature section is the third expansion coefficient to between or to Between, including the endpoints, the output first expansion weight is 1; if the linear expansion coefficient of the first temperature segment is the third expansion coefficient to Between, excluding the endpoints, the output first expansion weight is 2; if the linear expansion coefficient of the second temperature segment is the fourth expansion coefficient to between or to Between, including the endpoints, the output second expansion weight is 1; if the linear expansion coefficient of the second temperature segment is the fourth expansion coefficient to Between, excluding the endpoints, the output second expansion weight is 2; If and only if the sum of the first expansion weight and the second expansion weight is greater than or equal to 3, the current bonding copper wire is judged to be a qualified product; If it is determined that the current bonding copper wire is a qualified product, the collection of multiple indicator input data will begin.

[0012] According to the above technical solution, matching the calculated surface tension index of the bonding copper wire with the set surface tension of the bonding copper wire obtained from the cloud at the same temperature includes: Set the upper and lower thresholds of surface tension to If the calculated surface tension of the bonding copper wire is greater than the set surface tension of the bonding copper wire obtained from the cloud, , or the calculated surface tension index of the bonding copper wire is less than the set surface tension of the bonding copper wire obtained from the cloud , it is determined that the current bonding copper wire bonding quality is unqualified, and the intelligent bonding copper wire quality detection system controls the bonding copper wire production equipment to recycle the bonding copper wire corresponding to the current bonding copper wire sample detection to the abnormal product recycling area. If the surface tension calculation index of the bonding copper wire is less than or equal to the bonding copper wire set surface tension obtained from the cloud , and the calculated surface tension index of the bonding copper wire is greater than or equal to the set surface tension of the bonding copper wire obtained from the cloud , determine that the current bonding copper wire bonding quality is qualified.

[0013] According to the above technical solution, it also includes: the system transmits and displays the qualified data of the bonding copper wire bonding quality inspection to the console, marks the quality inspection time, and uploads and saves all data generated during the quality inspection process to the cloud as an execution log for viewing.

[0014] Compared with the prior art, the beneficial effects of the present invention are: the present application can comprehensively and objectively evaluate bonding quality. Through the analysis of multidimensional data, more bonding quality information can be obtained, thereby improving the accuracy and reliability of the evaluation, enabling real-time monitoring and early warning, timely detection of potential problems, and timely repairs to avoid the expansion and impact of quality problems. It can improve production efficiency and reduce production costs. The present application provides an efficient and accurate bonding quality detection method that can improve production efficiency and product quality in the electronics manufacturing industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The present invention is a flow chart of a method for detecting the bonding quality of copper wires based on multidimensional data analysis. DETAILED DESCRIPTION

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0017] Example: Figure 1 As shown, the present invention provides a method for detecting the bonding quality of bonding copper wires based on multidimensional data analysis, specifically comprising: This embodiment uses a multi-threaded solution for processing. First, the intelligent copper bonding wire quality detection system verifies that the copper bonding wire production equipment is powered on normally. Thread 1 is created and currently reads that rare earth elements are being added to the bonding copper. (Rare earth elements have high electronegativity and a large atomic radius. Trace amounts of rare earth elements can refine the grain size, improving the oxidation resistance and solderability of the copper wire. Adding an appropriate amount of rare earth elements also helps reduce the hardness of the copper wire. When the addition amount is 0.0002% to 0.0020% (mass fraction), it is more conducive to improving the solderability of the copper wire and making the device more reliable.) The intelligent copper bonding wire quality detection system activates the weighing sensor of the rare earth addition device. After the rare earth device completes adding the rare earth elements to the bonding copper, the total weight of the bonding copper is read and determined as the first mass value. The intelligent copper bonding wire quality detection system then connects to the weighing sensor to calculate the addition amount (original weight minus current weight) and determines it as the second mass value. The second mass value is divided by the first mass value and multiplied by 100%, and the result is determined as the first rare earth content. The intelligent bonding copper wire quality detection system reads the production number of the current bonding copper wire production equipment, obtains the normal rare earth content of the bonding copper from the cloud according to the current production number, determines the second rare earth content, and matches the first rare earth content with the second rare earth content, wherein, If the first rare earth content is greater than 180% of the second rare earth content, or less than 55% of the second rare earth content, the current rare earth dosing device is determined to be abnormal. The intelligent copper bonding wire quality inspection system will suspend the current rare earth dosing device and switch to the backup rare earth dosing device to clean the rare earth elements in the bonding copper and resume operation. If the retest confirms that the rare earth dosing device is abnormal, the maintenance department will be notified of the abnormal rare earth dosing device and its location, notifying maintenance personnel to perform repairs.

[0018] If the first rare earth content is less than or equal to 180% of the second rare earth content, and the first rare earth content is greater than or equal to 55% of the second rare earth content, it is determined that there is no abnormality in the rare earth content added to the current bonding copper wire.

[0019] After determining that there is no abnormality in the rare earth content added to the current bonding copper, the intelligent bonding copper wire quality detection system controls the bonding copper wire production equipment to fuse the rare earth elements with the bonding copper. After determining that the rare earth elements and the bonding copper are completely fused and cooled, the intelligent bonding copper wire quality detection system starts the ultrasonic scanning tomography imager, which scans the internal image of the currently fused bonding copper (the rare earth elements and trace impurities such as lead in the copper form high-melting-point compounds, which are evenly distributed in the form of small dispersed particles inside the grain, while refining the grain, further improving the mechanical processing properties of the copper, and improving the oxidation resistance and solderability. Adding a certain amount of rare earth elements can prevent damage to the silicon wafer and also improve the arc-forming characteristics of the copper wire), which is determined as the initial scanning image. The intelligent bonding copper wire quality detection system reads the defect scanning parameters of the ultrasonic scanning tomography imager, determines it as the first defect parameter (the size of the defect), obtains the normal defect parameter threshold of the bonding copper wire, determines it as the second defect parameter, matches the first defect parameter with the second defect parameter, and if the first defect parameter is greater than the second defect parameter, it is determined that there is an abnormality in the current fusion of the rare earth element and the bonding copper. The intelligent bonding copper wire quality detection system controls the bonding copper wire production equipment to fuse the rare earth element with the bonding copper again and restarts the detection.

[0020] If the first defect parameter is less than or equal to the second defect parameter, the intelligent bonding copper wire quality detection system analyzes the distance between the current bonding copper rare earth element particles based on the scanned image and determines it as the first distance group. The data in the first distance group are matched with each other and the upper and lower limit thresholds of the distance are set respectively. , for any two data in the first distance group, calculate the distance difference and get the absolute positive value of the distance difference. If the percentage of the absolute positive value of any two distance differences is greater than , or the absolute positive value of any two distance differences has a percentage less than , it is determined that the current rare earth particles are unevenly distributed inside the particle; in this embodiment, Take 70% and 130%; where mutual matching means: if copper rare earth element particle distances a1, a2, and a3 appear, calculate the distance differences between a1 and a2, a1 and a3, and a2 and a3, and process them as absolute positive values ​​to obtain the differences |a1_2| (the absolute positive value of a1-a2), |a2_3| (the absolute positive value of a2-3), and |a1_3| (the absolute positive value of a1-a3). Then, divide |a1_2| by |a2_3|, |a2_3| by |a1_3|, and |a1_2| by |a1_3| and multiply by 100% to obtain the judgment result. If there are no distance anomalies in the first distance group (all distances are less than or equal to 130% and all distances are greater than or equal to 70%), the value (average) obtained by dividing (|a1_2| + |a2_3| + |a1_3|) by 3 is determined as the second distance value. If the percentage of the absolute positive value of the difference between any two distances in the first distance group is less than or equal to , and the percentage of the absolute positive value of the difference between any two distances in the first distance group is greater than or equal to , calculate the average distance of the absolute positive values ​​of all distance differences in the current first distance group, and determine it as the second distance value. The system obtains the normal rare earth particle distance of the bonded copper through the cloud and determines it as the third distance value. The second distance value is matched with the third distance value, and the upper and lower limit thresholds of the distance matching are set respectively , if the second distance value is greater than the third distance value , or the second distance value is less than the third distance value , determine that the current rare earth particles are unevenly distributed inside the particle, and feedback to the administrator port for re-integration; if the second distance value is less than or equal to the third distance value , and the second distance value is greater than or equal to the third distance value , determine that the current rare earth particles are evenly distributed inside the particle; after determining that the current rare earth particles are evenly distributed inside the particle, expansion pretreatment is performed.

[0021] Determine that the rare earth particles are evenly distributed inside the product, create thread 2, and the intelligent bonding copper wire quality detection system controls the bonding copper wire production equipment to draw the bonding copper with uniform rare earth particles. Determine that the bonding copper has been successfully stretched into a bonding copper wire. The bonding copper wire production equipment intercepts a section of the completed bonding copper wire (i.e., the sample to be tested) and transports it to the quality detection area. The intelligent bonding copper wire quality detection system obtains that the sample has arrived at the detection area and starts the heater, laser ranging sensor, and optical fiber sensor. The laser ranging sensor and optical fiber sensor detect the length and temperature of the unheated copper bonding wire, determining them as the first copper bonding wire length and temperature values ​​(initial length and initial temperature). Based on the first rare earth content and the second distance value, the normal low temperature range and its linear expansion coefficient, as well as the normal mid-temperature range and its linear expansion coefficient, are retrieved from the cloud to determine the first and second temperature range linear expansion coefficients. A control command is sent to the heater based on the first and second temperature ranges. When the heater feedback indicates heating within the first temperature range (low temperature range), the laser ranging sensor and optical fiber sensor detect the current copper bonding wire length and temperature, determining them as the second copper bonding wire length and temperature values. After the detection is complete, the intelligent copper bonding wire quality inspection system controls the heater again to heat the copper bonding wire. When the heater feedback indicates heating within the second temperature range (mid-temperature range), the laser ranging sensor and optical fiber sensor detect the current copper bonding wire length and temperature, determining them as the third copper bonding wire length and temperature values.

[0022] The linear expansion coefficient formula can be expressed as: , where ΔL is the length change, is the initial length, It is the temperature change. Since different materials have different linear expansion coefficients, measuring the linear expansion coefficient of the material can be used to make a preliminary evaluation of the thermal stability, strength, safety, and welding or welding of the product. The linear expansion coefficient when heated to the first temperature section (low temperature section) is calculated according to the linear expansion coefficient formula and determined as the third expansion coefficient. The third expansion coefficient includes: ; in, Refers to the third expansion coefficient; 、 Refers to the length of the first bonding copper wire and the length of the second bonding copper wire respectively; 、 Refers to the first bonding copper wire temperature and the second bonding copper wire temperature respectively; Compare the linear expansion coefficient of the first temperature section with the third expansion coefficient, and set the upper and lower limit thresholds of the first expansion to be ; If the linear expansion coefficient of the first temperature section is less than the third expansion coefficient , or the linear expansion coefficient of the first temperature section is greater than the third expansion coefficient , the current bonding copper wire is determined to be an unqualified product and feedback is sent to the administrator port; in this embodiment, 86% and 114% are used as the upper and lower limit thresholds of the first expansion, if the linear expansion coefficient of the first temperature segment is less than 86% of the third expansion coefficient, or the linear expansion coefficient of the first temperature segment is greater than 114% of the third expansion coefficient, and the current bonding copper wire is determined to be an unqualified product, the intelligent bonding copper wire quality detection system controls the bonding copper wire production equipment to feed back the bonding copper wire corresponding to the current bonding copper wire sample detection, and recycle it to the abnormal product recycling area.

[0023] The linear expansion coefficient when heated to the second temperature range (middle temperature range) is calculated according to the linear expansion coefficient formula and determined as the fourth expansion coefficient; The fourth expansion coefficient includes: ; in, Refers to the fourth expansion coefficient; Refers to the length of the third bonding copper wire; Refers to the third bonding copper wire temperature; Compare the linear expansion coefficient of the second temperature section with the fourth expansion coefficient, and set the upper and lower limit thresholds of the second expansion as follows: ; If the linear expansion coefficient of the second temperature section is less than the fourth expansion coefficient , or the linear expansion coefficient of the second temperature section is greater than the fourth expansion coefficient , the current bonding copper wire is determined to be an unqualified product and feedback is sent to the administrator port; in this embodiment, the second expansion upper and lower limit thresholds adopt the first expansion upper and lower limit thresholds. If the second expansion coefficient is less than 86% of the fourth expansion coefficient, or the second expansion coefficient is greater than 114% of the fourth expansion coefficient, the current bonding copper wire is determined to be an unqualified product. The intelligent bonding copper wire quality detection system controls the bonding copper wire production equipment to feed back the bonding copper wire corresponding to the current bonding copper wire sample detection, and recycle it to the abnormal product recycling area.

[0024] Match the linear expansion coefficient of the first temperature segment with the third expansion coefficient. If the linear expansion coefficient of the first temperature segment is 93%-107% of the third expansion coefficient, set the first expansion weight to 2. If the linear expansion coefficient of the first temperature segment is 86%-93% or 107%-114% of the third expansion coefficient, set the first expansion weight to 1. Match the linear expansion coefficient of the second temperature segment with the fourth expansion coefficient. If the linear expansion coefficient of the second temperature segment is 93%-107% of the fourth expansion coefficient, set the second expansion weight to 2. If the linear expansion coefficient of the second temperature segment is 86%-93% or 107%-114% of the fourth expansion coefficient, set the second expansion weight to 1. The first expansion weight and the second expansion weight are added together. When the third expansion weight is greater than or equal to 3, it is determined that the current bonding copper wire is normal. When feedback indicates that the current bonding copper wire is normal, thread 3 is created. The intelligent bonding copper wire production equipment cools the bonding copper wire until the expansion coefficient is normal. The intelligent bonding copper wire quality detection system controls the bonding copper wire production equipment to start a specific surface area detector to detect multiple indicator input data, including: surface tension of copper, universal gas constant, real-time temperature of the bonding copper wire, specific surface area of ​​the bonding copper wire, and mole fraction of component Cu in the surface phase and bulk phase; The specific surface area of ​​the bonding copper wire and the surface and bulk phases are measured using a specific surface area detector. The specific surface area detector can use methods such as gas adsorption, liquid infiltration, and pore size distribution to determine its specific surface area. For example, gas adsorption is a commonly used method for measuring specific surface area, and commonly used adsorbents include nitrogen, argon, and ethylene. The pores in the sample can adsorb gas, and the adsorbed gas is compressed in the pores. At this point, the total number of molecules in the sample will be higher than the number of molecules before adsorption. The specific surface area of ​​the sample is calculated by measuring the pressure difference or volume of the adsorbed gas. The real-time temperature of the bonding copper wire is detected by a fiber optic sensor. The molar fraction of the component Cu in the surface and bulk phases is calculated based on the surface and bulk phases.

[0025] The indicator calculation logic relationship specifically refers to: ; in, Refers to the surface tension calculation index of bonding copper wire; Refers to the surface tension of copper; R is the universal gas constant; T is the real-time temperature of the bonding copper wire; is the specific surface area of ​​the bonding copper wire; and are the mole fractions of Cu in the surface phase and bulk phase, respectively.

[0026] In this embodiment, Taking 97.6% and 103.4% respectively, if the calculated surface tension index of the bonding copper wire is greater than 103.4% of the set surface tension of the bonding copper wire obtained from the cloud, or the calculated surface tension index of the bonding copper wire is less than 97.6% of the set surface tension of the bonding copper wire obtained from the cloud, the current bonding copper wire bonding quality is determined to be unqualified. The intelligent bonding copper wire quality inspection system controls the bonding copper wire production equipment to recycle the bonding copper wire corresponding to the current bonding copper wire sample inspection to the abnormal product recycling area. If the calculated surface tension index of the bonding copper wire is less than or equal to 103.4% of the set surface tension of the bonding copper wire obtained from the cloud, and the calculated surface tension index of the bonding copper wire is greater than or equal to 97.6% of the set surface tension of the bonding copper wire obtained from the cloud, the current bonding copper wire bonding quality is determined to be qualified. The intelligent bonding silver wire equipment system transmits the quality inspection data to the console and focuses on displaying the quality inspection time. The quality inspection data is uploaded and saved to the cloud as an execution log for review.

[0027] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A method for detecting the bonding quality of copper wires based on multidimensional data analysis, characterized in that: The method comprises: Construct the surface tension calculation index of bonding copper wire; Determining an indicator calculation logic relationship based on the surface tension calculation indicator of the bonding copper wire, wherein the indicator calculation logic relationship refers to a relationship formula for determining a surface tension calculation indicator result of the bonding copper wire based on multiple indicator input data; Obtaining, from the cloud, set surface tensions of the bonding copper wire at different temperatures based on multi-dimensional detection indicators, wherein the multi-dimensional detection indicators include a first rare earth content and a second distance value, wherein the first rare earth content is determined based on the total weight of the current bonding copper and the amount of addition output by the rare earth addition device, and the second distance value refers to the distance between the current bonding copper rare earth element particles confirmed by scanning the image and is determined based on the current distance between the bonding copper rare earth element particles; The surface tension calculation index of the bonding copper wire is matched with the set surface tension of the bonding copper wire obtained from the cloud at the same temperature to obtain the result of whether the bonding quality of the current bonding copper wire is qualified.

2. The method for detecting bonding quality of copper wires based on multidimensional data analysis according to claim 1, wherein: The plurality of index input data include: surface tension of copper, universal gas constant, real-time temperature of bonding copper wire, specific surface area of ​​bonding copper wire, and molar fraction of component Cu in surface phase and bulk phase; Among them, the specific surface area of ​​the bonding copper wire and the surface phase and bulk phase are detected by a specific surface area detector; the real-time temperature of the bonding copper wire is detected by an optical fiber sensor; and the molar fraction of the component Cu in the surface phase and bulk phase is calculated based on the surface phase and bulk phase.

3. The method for detecting bonding quality of copper wires based on multidimensional data analysis according to claim 1, wherein: The indicator calculation logic relationship specifically refers to: ； in, Refers to the surface tension calculation index of bonding copper wire; Refers to the surface tension of copper; R is the universal gas constant; T is the real-time temperature of the bonding copper wire; is the specific surface area of ​​the bonding copper wire; and are the mole fractions of Cu in the surface phase and bulk phase, respectively.

4. The method for detecting bonding quality of copper wires based on multidimensional data analysis according to claim 1, wherein: The first rare earth content is determined based on the total weight of the current bonded copper and the addition amount output by the rare earth addition device, including: adding rare earth elements to the bonded copper using a rare earth adding device, and reading the total weight of the bonded copper after the addition is completed to determine it as a first mass value; calling the weighing sensor data of the rare earth adding device, identifying the data before and after the rare earth element is added, calculating the amount of rare earth element added, and determining it as the second mass value; The second mass value is divided by the first mass value and multiplied by 100% to obtain the result as the first rare earth content. Based on the current equipment production number, the normal rare earth content of the bonding copper is obtained from the cloud and determined as the second rare earth content. The first rare earth content and the second rare earth content are compared and analyzed, and the upper and lower limit thresholds of the comparative analysis are set as follows: If the first rare earth content is greater than the second rare earth content, , or the first rare earth content is less than the second rare earth content , determine that there is an abnormality in the current rare earth adding device, suspend the current rare earth adding device, switch to the spare rare earth adding device to clean up the rare earth elements of the bonded copper and start working again.

5. The method for detecting bonding quality of copper wires based on multidimensional data analysis according to claim 1, wherein: The scanning image refers to the situation where, when it is determined that there is no abnormality in the rare earth content added to the current bonding copper, the system controls the bonding copper wire production equipment to fuse the rare earth element with the bonding copper, determines that the rare earth element and the bonding copper are completely fused and cooled, and starts the ultrasonic scanning tomography to scan the internal image of the bonding copper that has been completely fused, and determines it as the initial scanning image; Based on the initial scan image, the system reads the ultrasonic scanning tomography defect scanning parameters and determines them as the first defect parameters. It then obtains the defect parameter threshold set for the bonding copper wire and determines them as the second defect parameter. The first defect parameter is then matched with the second defect parameter. If the first defect parameter is greater than the second defect parameter, it is determined that there is an abnormality in the current fusion of the rare earth element and the bonding copper. This feedback is sent to the administrator port for re-fusion. If the first defect parameter is less than or equal to the second defect parameter, the initial scan image is confirmed as the scan image.

6. The method for detecting bonding quality of copper wires based on multidimensional data analysis according to claim 1, wherein: The second distance value refers to the distance between the current bonded copper rare earth element particles confirmed by scanning the image, and the determination based on the current distance between the bonded copper rare earth element particles includes: Based on the scanned image, the distance between the current bonded copper rare earth element particles is analyzed and determined as the first distance group. The data in the first distance group are matched with each other, and the upper and lower limit thresholds of the distance are set as follows. , for any two data in the first distance group, calculate the distance difference and get the absolute positive value of the distance difference. If the percentage of the absolute positive value of any two distance differences is greater than , or the absolute positive value of any two distance differences has a percentage less than , it is determined that the current rare earth particles are unevenly distributed inside the particle; If the percentage of the absolute positive value of the difference between any two distances in the first distance group is less than or equal to , and the percentage of the absolute positive value of the difference between any two distances in the first distance group is greater than or equal to , calculate the average distance of the absolute positive values ​​of all distance differences in the current first distance group, and determine it as the second distance value. The system obtains the normal rare earth particle distance of the bonded copper through the cloud and determines it as the third distance value. The second distance value is matched with the third distance value, and the upper and lower limit thresholds of the distance matching are set respectively , if the second distance value is greater than the third distance value , or the second distance value is less than the third distance value , determine that the current rare earth particles are unevenly distributed inside the particle, and feedback to the administrator port for re-integration; if the second distance value is less than or equal to the third distance value , and the second distance value is greater than or equal to the third distance value , determine that the current rare earth particles are evenly distributed inside the particle; after determining that the current rare earth particles are evenly distributed inside the particle, expansion pretreatment is performed.

7. The method for detecting bonding quality of copper wires based on multidimensional data analysis according to claim 6, characterized in that: The expansion pretreatment comprises: After determining that the current rare earth particles are evenly distributed inside the product, the system controls the bonding copper wire production equipment to draw the bonding copper with the current uniform rare earth particles to form bonding copper wire, and samples the formed bonding copper wire; The heater, the laser ranging sensor, and the optical fiber sensor are started; the current temperature and the sampled length of the bonding copper wire are obtained and determined as the first bonding copper wire temperature and the first bonding copper wire length; the linear expansion coefficient of the same type of bonding copper wire in the low temperature range and the linear expansion coefficient of the medium temperature range are obtained from the cloud based on the first rare earth content and the second distance value, and the linear expansion coefficients of the first temperature range and the second temperature range are determined; The system sends a control command to the heater to heat. When the heater feedback heats to the first temperature range, the laser ranging sensor and the optical fiber sensor detect the current temperature and length of the bonding copper wire and determine them as the second bonding copper wire temperature and the second bonding copper wire length. After the detection is completed, the system sends a control command to the heater again to heat it. When the heater feedback is heated to the second temperature range, the laser ranging sensor and the optical fiber sensor detect the current temperature and length of the bonding copper wire and determine it as the third bonding copper wire temperature and the third bonding copper wire length.

8. The method for detecting bonding quality of copper wires based on multidimensional data analysis according to claim 7, characterized in that: Calculate the third expansion coefficient and the fourth expansion coefficient based on the linear expansion coefficient formula; The third expansion coefficient includes: ； in, Refers to the third expansion coefficient; 、 Refers to the length of the first bonding copper wire and the length of the second bonding copper wire respectively; 、 Refers to the first bonding copper wire temperature and the second bonding copper wire temperature respectively; The fourth expansion coefficient includes: ； in, Refers to the fourth expansion coefficient; Refers to the length of the third bonding copper wire; Refers to the third bonding copper wire temperature; Compare the linear expansion coefficient of the first temperature section with the third expansion coefficient, and set the upper and lower limit thresholds of the first expansion to be ; If the linear expansion coefficient of the first temperature section is less than the third expansion coefficient , or the linear expansion coefficient of the first temperature section is greater than the third expansion coefficient , determine that the current bonding copper wire is a substandard product and feedback is sent to the administrator port; Compare the linear expansion coefficient of the second temperature section with the fourth expansion coefficient, and set the upper and lower limit thresholds of the second expansion as follows: ; If the linear expansion coefficient of the second temperature section is less than the fourth expansion coefficient , or the linear expansion coefficient of the second temperature section is greater than the fourth expansion coefficient , determine that the current bonding copper wire is a substandard product and feedback is sent to the administrator port; If the linear expansion coefficient of the first temperature section is the third expansion coefficient to between or to Between, including the endpoints, the output first expansion weight is 1; if the linear expansion coefficient of the first temperature segment is the third expansion coefficient to Between, excluding the endpoints, the output first expansion weight is 2; if the linear expansion coefficient of the second temperature segment is the fourth expansion coefficient to between or to Between, including the endpoints, the output second expansion weight is 1; if the linear expansion coefficient of the second temperature segment is the fourth expansion coefficient to Between, excluding the endpoints, the output second expansion weight is 2; If and only if the sum of the first expansion weight and the second expansion weight is greater than or equal to 3, the current bonding copper wire is judged to be a qualified product; If it is determined that the current bonding copper wire is a qualified product, the collection of multiple indicator input data will begin.

9. The method for detecting bonding quality of copper wires based on multidimensional data analysis according to claim 1, wherein: The matching of the calculated surface tension index of the bonding copper wire with the set surface tension of the bonding copper wire obtained from the cloud at the same temperature includes: Set the upper and lower thresholds of surface tension to If the calculated surface tension of the bonding copper wire is greater than the set surface tension of the bonding copper wire obtained from the cloud, , or the calculated surface tension index of the bonding copper wire is less than the set surface tension of the bonding copper wire obtained from the cloud , it is determined that the current bonding copper wire bonding quality is unqualified, and the intelligent bonding copper wire quality detection system controls the bonding copper wire production equipment to recycle the bonding copper wire corresponding to the current bonding copper wire sample detection to the abnormal product recycling area. If the surface tension calculation index of the bonding copper wire is less than or equal to the bonding copper wire set surface tension obtained from the cloud , and the calculated surface tension index of the bonding copper wire is greater than or equal to the set surface tension of the bonding copper wire obtained from the cloud , determine that the current bonding copper wire bonding quality is qualified.

10. The method for detecting bonding quality of copper wires based on multidimensional data analysis according to claim 1, characterized in that: Also includes: The system transmits and displays the qualified data of the bonding copper wire bonding quality inspection to the console, marks the quality inspection time, and uploads and saves all the data generated during the quality inspection process to the cloud as an execution log for viewing.

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