Wafer detection mechanism and wafer loading device

Abstract

The invention discloses a wafer detection mechanism and a wafer loading device.The wafer detection mechanism comprises a wafer feeding mechanism, a first detection mechanism and a turnover detection mechanism, the wafer feeding mechanism is used for conveying wafers to the first detection mechanism, the first detection mechanism conveys the wafers to the turnover detection mechanism after detecting the wafers, and the turnover detection mechanism is used for detecting the wafers; the turnover detection mechanism is used for carrying out turnover detection on the wafer; the first detection mechanism comprises a first visual detection camera and a bearing platform, the first visual detection camera is located above the bearing platform, a first light source is arranged above the bearing platform, a second light source is arranged below the bearing platform, and the brightness of the first light source is larger than that of the second light source. According to the invention, the surface damage of the wafer is displayed more clearly, so that the identification is more clear, and the problem that the existing visual camera can only supplement light on a single side and is difficult to shoot tiny damage, so that the detection effect is poor is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a wafer detection mechanism and a wafer loading device. Background Art

[0002] During the production process, wafers are generally stored in wafer boxes. The wafer box consists of a support frame and a box cover. On the support frame of the wafer box, there are multiple crystal slots for clamping wafers in sequence from bottom to top. The wafers are clamped in the crystal slots through the edges, and then stacked on the support frame from bottom to top, and then the box cover is closed to seal. When storing wafers, an automated wafer clamping device is used for clamping. During this process, if the wafers in the wafer box are stacked, tilted, missing, or protrude from the support frame, there is a risk of wafer damage.

[0003] The existing publication number CN116190278B discloses a wafer detection mechanism and a wafer loading device, wherein the wafer detection mechanism is used to detect wafers in a wafer box, and the wafer detection mechanism includes a detection component, and the detection component includes a first pair of opposing sensors and a second pair of opposing sensors. The first pair of opposing sensors is used to detect single wafers, left and right tilts, and missing wafers. The second pair of opposing sensors cooperates with the first pair of opposing sensors to detect wafer stacking, wafer protrusion from the wafer box, and wafer forward and backward tilting; it also includes a lifting component, the detection component is arranged on the lifting component, and the lifting component drives the detection component to move up and down; the two groups of opposing sensors are driven by the lifting component to scan the wafers in the wafer box from bottom to top to detect whether the wafers in the wafer box are stacked, tilted, missing, or protruding from the wafer box.

[0004] Although the existing technology can realize the detection of wafers, the existing technology uses a through-beam sensor, which mainly detects defects in the wafer and is difficult to detect damage on the wafer surface. For this reason, we propose a wafer detection mechanism and a wafer loading device. Summary of the Invention

[0005] The object of the present invention is to provide a wafer detection mechanism and a wafer loading device to solve the problems in the prior art.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: a wafer detection mechanism, comprising a wafer loading mechanism, a first detection mechanism and a flip detection mechanism,

[0007] The wafer loading mechanism is used to transport the wafer to the first detection mechanism, which detects the wafer and then transports the wafer to the flip detection mechanism, which performs flip detection on the wafer;

[0008] The first detection mechanism includes a first visual detection camera and a supporting platform, the first visual detection camera is located above the supporting platform, a first light source is provided above the supporting platform, and a second light source is provided below the supporting platform, and the brightness of the first light source is greater than the brightness of the second light source;

[0009] The flip detection mechanism includes a conveyor line, a second visual detection camera and a flip assembly, and the second visual detection camera and the flip assembly are sequentially arranged on the conveyor line.

[0010] Preferably, the wafer loading mechanism includes a conveying frame, an active roller is rotatably installed at one end of the conveying frame, fixed plates are slidably installed on both sides of the other end of the conveying frame, the conveying frame is installed with a tensioning adjustment member for adjusting the fixed plate, a driven roller is rotatably installed between the two fixed plates, a conveyor belt is sleeved on the outer side of the active roller and the driven roller, a first driving component for driving the active roller to rotate is installed on one side of the conveying frame, and a partition baffle is installed on the conveying frame above the conveyor belt.

[0011] Preferably, the wafer detection mechanism includes a detection frame, and two parallel first linear modules are installed on the top of the detection frame. The two first linear modules jointly drive the second linear module to move back and forth, the second linear module drives the third linear module, and the third linear module drives the first visual detection camera and the suction cup to move up and down.

[0012] Preferably, the flip assembly includes a bracket, the bracket is equipped with a flip cylinder, the bracket is equipped with a buffer limiter for limiting the flip cylinder, the flip cylinder drives the lifting cylinder to rotate, and the lifting cylinder drives the first suction cup assembly to move.

[0013] A wafer loading device uses the wafer detection mechanism described above, including a loading mechanism and a carrying frame. The loading mechanism includes a support frame, an insertion component is installed in the middle of the support frame, a lifting and adjusting component is installed on the support frame at the insertion component, horizontal moving components are installed on both sides of the support frame at the insertion component, and a support plate is installed on the support frame at the horizontal moving component.

[0014] Preferably, the lifting adjustment component includes a base, the base is equipped with a first sliding frame, the first sliding frame is slidably equipped with a lifting support bracket, the lifting support bracket is provided with an avoidance hole for avoiding the insertion component, the top of the lifting support bracket is equipped with a third photoelectric sensor for sensing the wafer, and the four corners of the top of the lifting support bracket are equipped with support columns;

[0015] The first sliding frame is rotatably mounted with a screw, the lifting support bracket is mounted with a nut that cooperates with the screw, one end of the screw is mounted with a driven bevel gear, the base is mounted with a second drive assembly, and the second drive assembly drives a driving bevel gear that meshes with the driven bevel gear of the screw;

[0016] A first photoelectric sensor and a second photoelectric sensor are installed on one side of the first sliding frame, and a first sensing plate that cooperates with the first photoelectric sensor and the second photoelectric sensor is installed on the lifting support bracket;

[0017] A fourth photoelectric sensor is installed on the side of the lifting support frame away from the first sensing plate, the first sliding frame is installed with a second sensing plate connected to the fourth photoelectric sensor, and the second sensing plate is provided with a plurality of notches at equal intervals.

[0018] Preferably, the insertion component includes a base, two parallel side plates are installed on the top of the base, a rotating shaft is installed between the two side plates, a second synchronous pulley is installed at both ends of the rotating shaft, a first synchronous pulley is installed in the middle of the rotating shaft, and a third drive component is installed on the top of the base; a plurality of lower guide wheels are installed at the lower part of each side plate, a plurality of transmission shafts are installed at the upper part of each side plate, a transmission wheel and a silicone wheel are respectively installed at both ends of the transmission shaft, a plurality of upper guide wheels are installed at the middle and upper part of each side plate, and the second synchronous pulley, the transmission wheel, the upper guide wheel and the lower guide wheel are connected by a synchronous belt.

[0019] Preferably, the horizontal moving assembly includes a bottom plate and a top plate, and the bottom plate and the top plate are connected by a guide assembly. A lifting cylinder for driving the top plate to rise and fall is installed on the top of the bottom plate, and two parallel sliding plates are installed on the top of the top plate. A second sliding frame is slidably installed between the two sliding plates, and a limiting block is installed on the top of the second sliding frame. A push-pull cylinder for driving the second sliding frame to move back and forth is installed on the top of the top plate.

[0020] Preferably, the supporting frame includes a frame body, and the three side plates of the frame body are all installed with limiting plates. The limiting plates are provided with multiple limiting protrusions at equal intervals, and limiting slots are formed between adjacent limiting protrusions. The frame body is located on the side without the limiting plate and is equipped with a movable rod for protecting the wafer through a pin shaft.

[0021] Preferably, the frame body is provided with baffles on both sides of the limit plate, the limit plate and the limit protrusion are provided with protective pads at the limit slot, the movable rod is provided with a magnet at one end away from the pin shaft, and the frame body is provided with a magnetic block that cooperates with the magnet.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The wafer loading mechanism is used to transport the wafer to the first detection mechanism. After the first detection mechanism detects the wafer, the wafer is transported to the flip detection mechanism, and the flip detection mechanism performs flip detection on the wafer; a first light source is provided above the supporting platform, and a second light source is provided below the supporting platform. The brightness of the first light source is greater than that of the second light source. By using the first light source and the second light source, the damage on the surface of the wafer can be made more clearly apparent, thereby making the identification clearer, solving the problem that the existing visual camera can only fill in light on one side, and it is difficult to capture small damage, resulting in poor detection effect.

[0024] 2. A second visual inspection camera and a flip assembly are sequentially arranged on the conveyor line. The flip assembly receives the wafer from the suction cup of the wafer inspection mechanism and turns the wafer over through the flip assembly to prepare for subsequent inspection of the other side.

[0025] 3. The conveying frame is located above the conveyor belt and is equipped with a partition baffle. The conveyor belt can be separated by the partition baffle, and two rows of wafers can be transported at the same time, which is highly efficient. Without increasing the conveyor line, the conveyance of multiple rows of wafers is realized, and the space occupied by the overall equipment does not increase.

[0026] 4. The first sliding frame is slidably installed with a lifting support bracket. The lifting support bracket can drive the carrying frame to rise, so that the wafers can be inserted one by one. The lifting support bracket is provided with an avoidance hole for avoiding the insertion component to prevent the insertion component from affecting the lifting of the lifting support bracket. A third photoelectric sensor for sensing the wafer is installed on the top of the lifting support bracket to confirm whether a wafer is inserted.

[0027] 5. The first sliding frame is equipped with a second sensing plate and a fourth photoelectric sensor. The second sensing plate has multiple notches at equal intervals. These notches mainly cooperate with the various slots of the supporting frame to achieve one-by-one sensing. The third drive assembly can drive the silicone wheel to rotate, thereby achieving horizontal movement of the wafer. The middle part of the side plate has an inward concave structure, which is mainly used to cooperate with the lifting and lowering of the lifting support bracket. The lifting cylinder drives the top plate to rise, which can lift the supporting frame on the support plate and make the supporting frame detach from the support plate. Then, the push-pull cylinder drives the second sliding frame to move, and the supporting frame can be sent to the lifting support bracket of the lifting adjustment assembly, so that it can be used for wafer loading.

[0028] 6. The limiting plate and the limiting protrusion are located in the limiting slot and are equipped with protective pads. The protective pads can protect the edges of the wafer to prevent the edges of the wafer from being damaged. A magnet is installed at the end of the movable rod away from the pin shaft, and the frame body is provided with a magnetic block that cooperates with the magnet; when the movable rod is rotated to a vertical state, the movable rod can block the open end of the supporting frame to prevent the wafer from slipping from the open end, which increases the safety of the wafer. The existing supporting frames are all open structures and do not provide protection for the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0030] Figure 1 It is a structural schematic diagram of the present invention;

[0031] Figure 2 It is a structural schematic diagram of the wafer loading mechanism of the present invention;

[0032] Figure 3 It is a structural schematic diagram of the first detection mechanism of the present invention;

[0033] Figure 4 It is a structural schematic diagram of the flip assembly of the present invention;

[0034] Figure 5 It is a structural schematic diagram of the loading mechanism of the present invention;

[0035] Figure 6 It is a schematic structural diagram of the lifting and adjusting assembly, the insertion assembly and the horizontal movement assembly of the present invention;

[0036] Figure 7 It is a structural schematic diagram of the lifting and adjusting assembly and the insertion assembly of the present invention;

[0037] Figure 8 It is a structural schematic diagram of the lifting and adjusting assembly of the present invention;

[0038] Figure 9 It is a schematic structural diagram of the insertion assembly of the present invention;

[0039] Figure 10 It is a structural schematic diagram of the horizontal moving assembly of the present invention;

[0040] Figure 11 It is a structural schematic diagram of the load-bearing frame of the present invention;

[0041] Figure 12 It is a structural schematic diagram of the limiting plate of the present invention.

[0042] Figure: 1. Wafer loading mechanism; 2. First inspection mechanism; 3. Turnover inspection mechanism; 4. Loading mechanism; 5. Carrying frame; 11. Conveying frame; 12. Tensioning adjustment member; 13. Fixing plate; 14. Driven roller; 15. Conveyor belt; 16. Separation baffle; 17. First drive assembly; 21. Inspection frame; 22. First linear module; 23. First visual inspection camera; 24. Second linear module; 25. Support platform; 26. Third linear module. 31. Conveyor line; 32. Second visual inspection camera; 33. Flip assembly; 331. Bracket; 332. Flip cylinder; 333. Buffer stopper; 334. Lifting cylinder; 335. First suction cup assembly; 41. Support frame; 42. Lifting adjustment assembly; 43. Insertion assembly; 44. Support plate; 45. Horizontal movement assembly; 4201. Base; 4202. First sliding frame; 4203. First photoelectric sensor; 4204. Screw; 42 05, first sensing plate; 4206, second photoelectric sensor; 4207, support column; 4208, third photoelectric sensor; 4209, second drive assembly; 4210, second sensing plate; 4211, fourth photoelectric sensor; 4212, lifting support bracket; 4301, base; 4302, third drive assembly; 4303, rotating shaft; 4304, first synchronous pulley; 4305, second synchronous pulley; 4306, lower guide wheel; 4307, Side panel; 4308, synchronous belt; 4309, upper guide wheel; 4310, transmission wheel; 4311, transmission shaft; 4312, silicone wheel; 451, bottom plate; 452, top plate; 453, lifting cylinder; 454, guide assembly; 455, sliding plate; 456, limit block; 457, second sliding frame; 458, push-pull cylinder; 51, frame body; 52, stop rod; 53, limit plate; 54, limit protrusion; 55, movable rod; 56, protective pad. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention.

[0044] See also Figure 1In an embodiment of the present invention, a wafer inspection mechanism and a wafer loading device include a wafer loading mechanism 1, a first inspection mechanism 2 and a flipping inspection mechanism 3; the wafer loading mechanism 1 is used to transport the wafer to the first inspection mechanism 2, and the first inspection mechanism 2 transports the wafer to the flipping inspection mechanism 3 after inspecting the wafer, and the flipping inspection mechanism 3 performs flipping inspection on the wafer.

[0045] like Figure 2 The first inspection mechanism 2 includes a first visual inspection camera 23 and a supporting platform 25. The first visual inspection camera 23 is located above the supporting platform 25. A first light source is provided above the supporting platform 25, and a second light source is provided below the supporting platform 25. The brightness of the first light source is greater than the brightness of the second light source. By using the first light source and the second light source, the surface damage of the wafer can be more clearly displayed, thereby making the identification clearer, solving the problem that the existing visual camera can only fill in light on one side, making it difficult to capture minor damage, resulting in poor detection effect.

[0046] like Figure 2 ; The wafer detection mechanism includes a detection frame 21, and two parallel first linear modules 22 are installed on the top of the detection frame 21. The two first linear modules 22 jointly drive the second linear module 24 to move back and forth, and the second linear module 24 drives the third linear module 26. The third linear module 26 drives the first visual inspection camera 23 and the suction cup to move up and down. The first linear module 22, the second linear module 24 and the third linear module 26 can realize the movement of the first visual inspection camera 23 and the suction cup in three-dimensional space, and the wafer can be transferred to the flip component 33 through the suction cup.

[0047] like Figure 1 The flip detection mechanism 3 includes a conveyor line 31, a second visual inspection camera 32 and a flip assembly 33. The second visual inspection camera 32 and the flip assembly 33 are sequentially arranged on the conveyor line 31. The flip assembly 33 receives the wafer from the suction cup of the wafer detection mechanism and flips the wafer through the flip assembly 33 to prepare for subsequent inspection of the other side.

[0048] like Figure 2; The wafer loading mechanism 1 includes a conveying frame 11, an active roller is rotatably installed at one end of the conveying frame 11, and fixed plates 13 are slidably installed on both sides of the other end of the conveying frame 11, and the conveying frame 11 is installed with a tensioning adjustment member 12 for adjusting the fixed plate 13, and a driven roller 14 is rotatably installed between the two fixed plates 13. The outer side of the active roller and the driven roller 14 is covered with a conveyor belt 15, and a first driving component 17 for driving the active roller to rotate is installed on one side of the conveying frame 11. The conveying frame 11 is located above the conveyor belt 15 and is installed with a partition baffle 16. The conveyor belt 15 can be separated by the partition baffle 16, and two rows of wafers can be transported at the same time, which is more efficient.

[0049] like Figure 1 and 4 The flip assembly 33 includes a bracket 331, the bracket 331 is equipped with a flip cylinder 332, the bracket 331 is equipped with a buffer limiter 333 for limiting the flip cylinder 332, the flip cylinder 332 drives the lifting cylinder 334 to rotate, and the lifting cylinder 334 drives the first suction cup assembly 335 to move.

[0050] like Figure 5-7 , a wafer loading device uses the wafer detection mechanism described above, including a loading mechanism 4 and a carrying frame 5, the loading mechanism 4 includes a supporting frame 41, the supporting frame 41 can support the carrying frame 5, the middle of the supporting frame 41 is equipped with an insertion component 43, the insertion component 43 can insert the detected wafer into the carrying frame 5 at the lifting and adjusting component 42, the supporting frame 41 is located at the insertion component 43. The supporting frame 41 is installed with a lifting and adjusting component 42 on both sides of the insertion component 43. The horizontal moving component 45 can realize the loading and unloading of the carrying frame 5, and the supporting frame 41 is installed with a support plate 44 at the horizontal moving component 45, and the carrying frame 5 can be supported by the support plate 44.

[0051] like Figure 8 ; The lifting adjustment component 42 includes a base 4201, on which a first sliding frame 4202 is installed, and a lifting support bracket 4212 is slidably installed on the first sliding frame 4202. The lifting support bracket 4212 rises to drive the carrying frame 5 to rise, thereby realizing the insertion of wafers one by one. The lifting support bracket 4212 is provided with an avoidance hole for avoiding the insertion component 43 to prevent the insertion component 43 from affecting the lifting and lowering of the lifting support bracket 4212. A third photoelectric sensor 4208 for sensing the wafer is installed on the top of the lifting support bracket 4212 to confirm whether a wafer has been inserted. Support columns 4207 are installed at the four corners of the top of the lifting support bracket 4212, and the support columns 4207 are used to support and limit the carrying frame 5;

[0052] The first sliding frame 4202 is rotatably mounted with a screw rod 4204, the lifting support bracket 4212 is mounted with a nut that cooperates with the screw rod 4204, one end of the screw rod 4204 is mounted with a driven bevel gear, and the base 4201 is mounted with a second drive assembly 4209, which drives a driving bevel gear that meshes with the driven bevel gear of the screw rod 4204; the lifting support bracket 4212 can be raised and lowered by the second drive assembly 4209;

[0053] like Figure 8 ; A first photoelectric sensor 4203 and a second photoelectric sensor 4206 are installed on one side of the first sliding frame 4202, and the lifting support bracket 4212 is installed with a first sensing plate 4205 that cooperates with the first photoelectric sensor 4203 and the second photoelectric sensor 4206; the highest and lowest positions of the lifting support bracket 4212 are limited.

[0054] like Figure 8 ; A fourth photoelectric sensor 4211 is installed on the side of the lifting support bracket 4212 away from the first sensing plate 4205, and the first sliding frame 4202 is installed with a second sensing plate 4210 and the fourth photoelectric sensor 4211. The second sensing plate 4210 is provided with multiple notches at equal intervals, and the multiple notches mainly cooperate with the various slots of the supporting frame 5 to realize one-by-one sensing.

[0055] like Figure 9 The insertion component 43 includes a base 4301, two parallel side plates 4307 are installed on the top of the base 4301, a rotating shaft 4303 is installed between the two side plates 4307, a second synchronous pulley 4305 is installed at both ends of the rotating shaft 4303, a first synchronous pulley 4304 is installed in the middle of the rotating shaft 4303, and a third driving component 4302 is installed on the top of the base 4301; a plurality of lower guide wheels 4306 are installed at the lower part of each side plate 4307, and a plurality of transmission Shaft 4311, a transmission wheel 4310 and a silicone wheel 4312 are respectively installed at both ends of the transmission shaft 4311, and multiple upper guide wheels 4309 are installed on the middle and upper part of each side plate 4307. The second synchronous pulley 4305, the transmission wheel 4310, the upper guide wheel 4309 and the lower guide wheel 4306 are connected by a synchronous belt 4308. The silicone wheel 4312 can be driven to rotate by the third drive component 4302, thereby realizing the horizontal movement of the wafer. The middle part of the side plate 4307 is a concave structure, which is mainly used to cooperate with the lifting and lowering of the lifting support bracket 4212.

[0056] like Figure 10The top plate 452 is provided with a lifting cylinder 453 for driving the top plate 452 to move up and down. Two parallel sliding plates 455 are installed on the top of the top plate 452. A second sliding frame 457 is slidably installed between the two sliding plates 455. A limiting block 456 is installed on the top of the second sliding frame 457. A push-pull cylinder 458 for driving the second sliding frame 457 to move back and forth is installed on the top of the top plate 452. The lifting cylinder 453 drives the top plate 452 to rise, which can lift the carrying frame 5 on the support plate 44 so that the carrying frame 5 is separated from the support plate 44. Then the push-pull cylinder 458 drives the second sliding frame 457 to move, and the carrying frame 5 can be sent to the lifting support bracket 4212 of the lifting adjustment assembly 42, so that it can be used for loading wafers.

[0057] like Figure 11 The carrying frame 5 includes a frame body 51, and the three side plates 4307 of the frame body 51 are all installed with limit plates 53. The limit plates 53 are evenly spaced with a plurality of limit protrusions 54, and a limit slot is formed between adjacent limit protrusions 54. The frame body 51 is located on the side without the limit plate 53 and is rotatably installed with a movable rod 55 for protecting the wafer through a pin; the frame body 51 is located on both sides of the limit plate 53 and is installed with a stop rod 52. The limit plate 53 and the limit protrusion The lever 54 is provided with a protective pad 56 at the limit slot, which can protect the edge of the wafer to prevent the edge of the wafer from being damaged. A magnet is installed at the end of the movable rod 55 away from the pin shaft, and the frame body 51 is provided with a magnetic block that cooperates with the magnet; when the movable rod 55 is rotated to a vertical state, the movable rod 55 can block the open end of the supporting frame 5 to prevent the wafer from slipping from the open end, and the safety of the wafer is higher. The existing supporting frames are all open structures and do not provide protection for the wafer.

[0058] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer inspection mechanism, characterized in that: It comprises a wafer loading mechanism (1), a first detection mechanism (2) and a flip detection mechanism (3), The wafer loading mechanism (1) is used to transport the wafer to the first detection mechanism (2); the first detection mechanism (2) detects the wafer and then transports the wafer to the flip detection mechanism (3); the flip detection mechanism (3) performs flip detection on the wafer; The first detection mechanism (2) comprises a first visual detection camera (23) and a supporting platform (25), wherein the first visual detection camera (23) is located above the supporting platform (25), a first light source is provided above the supporting platform (25), and a second light source is provided below the supporting platform (25), wherein the brightness of the first light source is greater than the brightness of the second light source; The flip detection mechanism (3) comprises a conveyor line (31), a second visual detection camera (32) and a flip assembly (33), wherein the second visual detection camera (32) and the flip assembly (33) are sequentially arranged on the conveyor line (31).

2. The wafer inspection mechanism according to claim 1, characterized in that: The wafer loading mechanism (1) includes a conveying frame (11), a driving roller is rotatably mounted on one end of the conveying frame (11), fixed plates (13) are slidably mounted on both sides of the other end of the conveying frame (11), a tensioning adjustment member (12) for adjusting the fixed plate (13) is mounted on the conveying frame (11), a driven roller (14) is rotatably mounted between the two fixed plates (13), a conveyor belt (15) is sleeved on the outer side of the driving roller and the driven roller (14), a first driving component (17) for driving the driving roller to rotate is mounted on one side of the conveying frame (11), and a partition baffle (16) is mounted on the conveying frame (11) above the conveyor belt (15).

3. The wafer inspection mechanism according to claim 1, wherein: The wafer detection mechanism includes a detection frame (21), and two parallel first linear modules (22) are installed on the top of the detection frame (21). The two first linear modules (22) jointly drive the second linear module (24) to move back and forth, and the second linear module (24) drives the third linear module (26). The third linear module (26) drives the first visual detection camera (23) and the suction cup to move up and down.

4. The wafer inspection mechanism according to claim 1, wherein: The flip assembly (33) comprises a bracket (331), the bracket (331) being equipped with a flip cylinder (332), the bracket (331) being equipped with a buffer stopper (333) for limiting the flip cylinder (332), the flip cylinder (332) driving the lifting cylinder (334) to rotate, and the lifting cylinder (334) driving the first suction cup assembly (335) to move.

5. A wafer loading device, characterized in that: A wafer inspection mechanism according to any one of claims 1 to 4 is used, comprising a loading mechanism (4) and a carrying frame (5), wherein the loading mechanism (4) comprises a supporting frame (41), an insertion assembly (43) is installed in the middle of the supporting frame (41), a lifting adjustment assembly (42) is installed on the supporting frame (41) at the insertion assembly (43), horizontal moving assemblies (45) are installed on both sides of the supporting frame (41) at the insertion assembly (43), and a support plate (44) is installed on the supporting frame (41) at the horizontal moving assembly (45).

6. The wafer loading device according to claim 5, characterized in that: The lifting and adjusting component (42) comprises a base (4201), the base (4201) is equipped with a first sliding frame (4202), the first sliding frame (4202) is slidably equipped with a lifting support frame (4212), the lifting support frame (4212) is provided with an avoidance hole for avoiding the insertion component (43), a third photoelectric sensor (4208) for sensing the wafer is installed on the top of the lifting support frame (4212), and support columns (4207) are installed at the four corners of the top of the lifting support frame (4212); The first sliding frame (4202) is rotatably mounted with a screw rod (4204), the lifting support frame (4212) is mounted with a nut that matches the screw rod (4204), one end of the screw rod (4204) is mounted with a driven bevel gear, the base (4201) is mounted with a second driving assembly (4209), and the second driving assembly (4209) drives a driving bevel gear that meshes with the driven bevel gear of the screw rod (4204); A first photoelectric sensor (4203) and a second photoelectric sensor (4206) are installed on one side of the first sliding frame (4202), and a first sensing plate (4205) that cooperates with the first photoelectric sensor (4203) and the second photoelectric sensor (4206) is installed on the lifting support frame (4212); A fourth photoelectric sensor (4211) is installed on the side of the lifting support frame (4212) away from the first sensing plate (4205), and a second sensing plate (4210) is installed on the first sliding frame (4202) and the fourth photoelectric sensor (4211), and the second sensing plate (4210) is provided with a plurality of notches at equal intervals.

7. The wafer loading device according to claim 6, characterized in that: The insertion assembly (43) includes a base (4301), two parallel side plates (4307) are installed on the top of the base (4301), a rotating shaft (4303) is installed between the two side plates (4307), a second synchronous pulley (4305) is installed at both ends of the rotating shaft (4303), a first synchronous pulley (4304) is installed in the middle of the rotating shaft (4303), and a third driving assembly (4302) is installed on the top of the base (4301); the lower part of each side plate (4307) is A plurality of lower guide wheels (4306) are installed, a plurality of transmission shafts (4311) are installed on the upper part of each side plate (4307), a transmission wheel (4310) and a silicone wheel (4312) are installed at both ends of the transmission shaft (4311), a plurality of upper guide wheels (4309) are installed on the middle and upper part of each side plate (4307), and the second synchronous pulley (4305), the transmission wheel (4310), the upper guide wheel (4309) and the lower guide wheel (4306) are connected by a synchronous belt (4308).

8. The wafer loading device according to claim 1, wherein: The horizontal moving assembly (45) includes a bottom plate (451) and a top plate (452), wherein the bottom plate (451) and the top plate (452) are connected via a guide assembly (454), a lifting cylinder (453) for driving the top plate (452) to move up and down is installed on the top of the bottom plate (451), two parallel sliding plates (455) are installed on the top of the top plate (452), a second sliding frame (457) is slidably installed between the two sliding plates (455), a limiting block (456) is installed on the top of the second sliding frame (457), and a push-pull cylinder (458) for driving the second sliding frame (457) to move back and forth is installed on the top of the top plate (452).

9. The wafer loading device according to claim 5, wherein: The carrying frame (5) includes a frame body (51), and the three side plates (4307) of the frame body (51) are all installed with limit plates (53), and the limit plates (53) are provided with a plurality of limit protrusions (54) at equal intervals, and limit slots are formed between adjacent limit protrusions (54). The frame body (51) is located on a side without the limit plate (53) and is provided with a movable rod (55) for protecting the wafer through a pin shaft.

10. The wafer loading device according to claim 9, characterized in that: The frame body (51) is provided with blocking rods (52) on both sides of the limiting plate (53), and the limiting plate (53) and the limiting protrusion (54) are provided with protective pads (56) at the limiting slots. The movable rod (55) is provided with a magnet at one end away from the pin shaft, and the frame body (51) is provided with a magnetic block that cooperates with the magnet.

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