Protective cover, manufacturing method of protective cover, photoelectric co-packaging structure and manufacturing method of photoelectric co-packaging structure

Abstract

The invention relates to a protective cover and a manufacturing method thereof, and a photoelectric co-packaging structure and a manufacturing method thereof. The protective cover comprises a cover body, the cover body comprises a blocking part, the blocking part is made of a composite material comprising an inorganic material and an organic material, the cover body comprises an upper surface and a lower surface which are oppositely distributed along a first direction, and the lower surface of the cover body is used for covering an optical element area of an optical integrated chip; and the first groove is located in the blocking part, and the first groove extends to the interior of the cover body from the lower surface of the cover body in the first direction. According to the invention, the mechanical strength of the cover body is obviously increased, so that the plastic package material is effectively prevented from overflowing to the optical element area in the plastic package process, and meanwhile, the controllability of the manufacturing process of the protective cover and the photoelectric co-package structure is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a protective cover and a manufacturing method thereof, and an optoelectronic co-packaging structure and a manufacturing method thereof. Background Art

[0002] With the rapid development of big data models and AI technologies, data-intensive networks are posing challenges to bandwidth density, communication latency, and power efficiency, driving the development of optoelectronic co-packaging technology. Optoelectronic co-packaging integrates silicon photonic modules and electronic chips using advanced packaging techniques to form an optoelectronic co-packaging structure. This optoelectronic co-packaging structure shortens the distance between the electronic chip and the silicon photonic module, thereby improving the efficiency of signal transmission between the chip and the module.

[0003] In the process of forming the optoelectronic co-packaging structure through optoelectronic co-packaging technology, in order to integrate the optical element protection process and the plastic packaging process, a protective cover is generally used to cover the optical element before the plastic packaging process is implemented to protect the optical element. After the plastic packaging process is completed, the protective cover is removed to expose the optical element, and finally the optical path is connected by placing an inserted optical fiber array element. However, due to the poor controllability of the current processing process of the protective cover, it eventually does not match the size of the inserted optical fiber array element, affecting the smooth implementation of the packaging process and the yield of the optoelectronic co-packaging structure. Moreover, the mechanical properties of the current protective cover are poor, and it cannot effectively block the plastic packaging material during the plastic packaging process, which can easily cause the plastic packaging material to overflow into the optical element area, thereby causing pollution to the optical element area and affecting the smooth implementation of subsequent processes.

[0004] Therefore, how to enhance the mechanical properties of the protective cover to reduce the overflow of the plastic packaging material into the optical element area during the plastic packaging process, and at the same time improve the controllability of the process technology of the protective cover and the optoelectronic co-packaging structure, thereby improving the performance and manufacturing yield of the optoelectronic co-packaging structure, is a technical problem that needs to be solved urgently. Summary of the Invention

[0005] The present invention provides a protective cover and a manufacturing method thereof, an optoelectronic co-packaging structure and a manufacturing method thereof, which are used to enhance the mechanical properties of the protective cover, thereby reducing the overflow of the molding compound into the optical element area during the molding process, and at the same time improving the controllability of the manufacturing process of the protective cover and the optoelectronic co-packaging structure, thereby improving the performance and manufacturing yield of the optoelectronic co-packaging structure.

[0006] According to some embodiments, the present invention provides a protective cover comprising:

[0007] A cover body, comprising a barrier portion, wherein the barrier portion is made of a composite material including an inorganic material and an organic material, and the cover body comprises an upper surface and a lower surface that are oppositely distributed along a first direction, wherein the lower surface of the cover body is used to cover the optical element area of ​​the optical integrated chip;

[0008] The first groove is located inside the blocking portion, and the first groove extends from the lower surface of the cover along the first direction to the inside of the cover.

[0009] In some embodiments, the inorganic material includes any one or a combination of two or more of silicon, silicon oxide, silicon carbide, gallium nitride, gallium arsenide, indium phosphide, and lithium tantalate;

[0010] The organic material includes epoxy resin.

[0011] In some embodiments, the cover further comprises:

[0012] The supporting portion is used to support the blocking portion, and the material of the supporting portion is silicon.

[0013] In some embodiments, the support portion extends along a second direction, and the support portion includes a front surface and a back surface that are oppositely distributed along the first direction, and the second direction is parallel to the upper surface of the cover;

[0014] The blocking portion covers the front surface of the supporting portion.

[0015] In some embodiments, the blocking portion has a plurality of first grooves therein, each of the first grooves penetrates the blocking portion along the first direction, and the plurality of first grooves are arranged at intervals along the second direction.

[0016] In some embodiments, the support portion comprises:

[0017] a transverse support portion extending along a second direction, the transverse support portion comprising a top surface and a bottom surface relatively distributed along the first direction, the second direction being parallel to the upper surface of the cover;

[0018] The longitudinal support portion is vertically connected to the middle of the top surface of the transverse support portion along the first direction, and the blocking portion covers the top surface of the transverse support portion and is distributed on two opposite sides of the longitudinal support portion along the second direction.

[0019] In some embodiments, the blocking portion has a plurality of first grooves therein, each of the first grooves passes through the blocking portion along the first direction, and the plurality of first grooves are distributed on opposite sides of the longitudinal supporting portion along the second direction.

[0020] In some embodiments, the support portion comprises:

[0021] a transverse support portion extending along a second direction, the transverse support portion comprising a top surface and a bottom surface relatively distributed along the first direction, the second direction being parallel to the upper surface of the cover;

[0022] an end longitudinal support portion, perpendicularly connected to an end of the transverse support portion along the first direction;

[0023] The middle longitudinal support portion is vertically connected to the middle of the top surface of the lateral support portion along the first direction, and the blocking portion covers the top surface of the lateral support portion and fills between the end longitudinal support portion and the middle longitudinal support portion.

[0024] In some embodiments, the blocking portion has a plurality of first grooves therein, each first groove passes through the blocking portion along the first direction, and the plurality of first grooves are distributed on opposite sides of the middle longitudinal support portion along the second direction.

[0025] In some embodiments, the support portion has a plurality of second grooves spaced apart along a second direction, and each second groove penetrates the support portion along the first direction, and the second direction is parallel to the upper surface of the cover;

[0026] The blocking portion is filled in the second groove, and a surface of the blocking portion is flush with a surface of the supporting portion.

[0027] In some embodiments, the blocking portion has a plurality of first grooves therein, the plurality of first grooves are distributed in a one-to-one correspondence within the plurality of second grooves, and the first grooves do not penetrate the blocking portion along the first direction.

[0028] According to other embodiments, the present invention further provides a method for manufacturing a protective cover, comprising the following steps:

[0029] forming a cover, the cover including a barrier portion, the barrier portion being made of a composite material including an inorganic material and an organic material, and the cover including an upper surface and a lower surface oppositely distributed along a first direction, the lower surface of the cover being used to cover an optical element region of the optical integrated chip;

[0030] A first groove is formed inside the blocking portion, and the first groove extends from the lower surface of the cover along the first direction to the inside of the cover.

[0031] In some embodiments, the inorganic material includes any one or a combination of two or more of silicon, silicon oxide, silicon carbide, gallium nitride, gallium arsenide, indium phosphide, and lithium tantalate;

[0032] The organic material includes epoxy resin.

[0033] In some embodiments, the specific steps of forming the cover include:

[0034] forming a flat support portion, the support portion being made of silicon, the support portion extending along a second direction, and the support portion including a front surface and a back surface that are oppositely distributed along the first direction, the second direction being parallel to the upper surface of the cover;

[0035] A composite material is deposited on the front surface of the support portion to form the blocking portion, so as to constitute the cover body including the support portion and the blocking portion.

[0036] In some embodiments, the specific steps of forming the first groove inside the blocking portion include:

[0037] The blocking portion is grooved starting from a surface of the blocking portion facing away from the supporting portion to form a plurality of first grooves, each of the first grooves passes through the blocking portion along the first direction, and the plurality of first grooves are spaced apart along the second direction.

[0038] In some embodiments, the specific steps of forming the cover include:

[0039] forming a support portion including a transverse support portion and a longitudinal support portion, wherein the transverse support portion extends along a second direction, the transverse support portion includes a top surface and a bottom surface that are oppositely distributed along the first direction, the longitudinal support portion is perpendicularly connected to a middle portion of the top surface of the transverse support portion along the first direction, and the second direction is parallel to the upper surface of the cover body;

[0040] Composite material is deposited on the top surface of the lateral support portion to form the blocking portion covering the surface of the lateral support portion and distributed on opposite sides of the longitudinal support portion along the second direction, so as to constitute the cover body including the support portion and the blocking portion.

[0041] In some embodiments, the specific steps of forming the first groove inside the blocking portion include:

[0042] The blocking portion is grooved starting from the surface of the blocking portion facing away from the lateral supporting portion to form a plurality of first grooves, each of the first grooves passes through the blocking portion along the first direction, and the plurality of first grooves are distributed on opposite sides of the longitudinal supporting portion along the second direction.

[0043] In some embodiments, the specific steps of forming the cover include:

[0044] providing a silicon substrate;

[0045] Patterning the silicon substrate to form a plurality of isolation trenches in the silicon substrate, wherein the plurality of isolation trenches separate the silicon substrate into a middle longitudinal support portion and end longitudinal support portions distributed around the periphery of the middle longitudinal support portion, and the remaining silicon substrate below the isolation trenches serves as a transverse support portion to constitute a support portion including the transverse support portion, the end longitudinal support portions, and the middle longitudinal support portion, wherein the end longitudinal support portion is perpendicularly connected to the end portion of the transverse support portion along the first direction, and the middle longitudinal support portion is perpendicularly connected to the middle portion of the transverse support portion along the first direction, and the second direction is parallel to the upper surface of the cover body;

[0046] A composite material is deposited on the support portion to form the blocking portion covering the top surface of the lateral support portion and filling between the end longitudinal support portion and the middle longitudinal support portion, so as to constitute the cover body including the support portion and the blocking portion.

[0047] In some embodiments, the specific steps of forming the first groove inside the blocking portion include:

[0048] The blocking portion is grooved starting from the surface of the blocking portion facing away from the lateral support portion to form a plurality of first grooves, each of the first grooves passes through the blocking portion along the first direction, and the plurality of first grooves are distributed on opposite sides of the middle longitudinal support portion along the second direction.

[0049] In some embodiments, the specific steps of forming the cover include:

[0050] providing a silicon substrate;

[0051] patterning the silicon substrate to form a plurality of second trenches in the silicon substrate;

[0052] Depositing a composite material in the second groove to form the blocking portion that fills the second groove;

[0053] The silicon substrate below the second trench is removed, and the remaining silicon substrate is used as a supporting portion to form the cover body including the supporting portion and the blocking portion.

[0054] In some embodiments, the specific steps of forming the first groove inside the blocking portion include:

[0055] The blocking portion is grooved to form a plurality of first grooves, wherein the plurality of first grooves are distributed in a one-to-one correspondence within the plurality of second grooves, and the first grooves do not penetrate the blocking portion along the first direction.

[0056] According to some further embodiments, the present invention further provides a method for manufacturing an optoelectronic co-packaging structure, comprising the following steps:

[0057] forming an optical integrated chip, the optical integrated chip comprising a front surface and a back surface opposite to each other along a first direction, the optical integrated chip comprising an optical element region and an electrical chip region located outside the optical element region along a second direction, the optical element region being provided with a built-in optical element, the second direction being parallel to the front surface of the optical integrated chip;

[0058] Mounting an electronic chip on the electrical chip region on the front side of the optical integrated chip, and electrically connecting the electronic chip and the optical integrated chip;

[0059] Mounting a protective cover on the optical element area on the front side of the optical integrated chip, wherein the structure of the protective cover is as described above;

[0060] forming a plastic sealing layer for sealing the electronic chip on the front surface of the optical integrated chip, wherein the upper surface of the cover is exposed to the surface of the plastic sealing layer;

[0061] A portion of the protective cover is removed to form an opening exposing the optical element area, and the remaining portion of the blocking portion is located on the side of the plastic packaging layer.

[0062] In some embodiments, the cover further includes a supporting portion extending along the second direction, the supporting portion including a front surface and a back surface relatively distributed along the first direction, the blocking portion covers the front surface of the supporting portion, and the blocking portion has two first grooves inside, each of the first grooves passes through the blocking portion along the first direction, and the two first grooves are arranged at intervals along the second direction, and the second direction is parallel to the upper surface of the cover; the specific steps of attaching the protective cover to the optical element area on the front surface of the optical integrated chip include:

[0063] The protective cover is mounted on the optical element region with the blocking portion facing the optical integrated chip, and the blocking portion between the two first grooves covers the optical element.

[0064] In some embodiments, the specific step of removing part of the protective cover includes:

[0065] removing the supporting portion to expose the blocking portion;

[0066] The barrier portion between the two first trenches is removed by an adsorption process.

[0067] In some embodiments, the cover body further includes a support portion and two second grooves located in the support portion and spaced apart along a second direction, each second groove penetrates the support portion along the first direction, the blocking portion is filled in the second groove, and the surface of the blocking portion is flush with the surface of the support portion, the interior of the blocking portion has two first grooves, the two first grooves are distributed in the two second grooves in a one-to-one correspondence, and the first groove does not penetrate the blocking portion along the first direction, and the second direction is parallel to the upper surface of the cover body; the specific steps of attaching the protective cover to the optical element area on the front side of the optical integrated chip include:

[0068] The protective cover is mounted on the optical element region in a direction in which the first grooves face the optical integrated chip, and the supporting portion between two first grooves covers the optical element.

[0069] In some embodiments, the specific step of removing part of the protective cover includes:

[0070] performing a groove process on the blocking portion in the second groove to form a third groove communicating with the first groove;

[0071] The blocking portion and the supporting portion between the two first grooves are removed by using an adsorption process.

[0072] According to some further embodiments, the present invention further provides an optoelectronic co-packaging structure, which is formed using the above-described method for manufacturing an optoelectronic co-packaging structure; the optoelectronic co-packaging structure comprises:

[0073] An optical integrated chip comprising a first main surface and a second main surface disposed opposite to each other along a first direction, the optical integrated chip comprising an optical element region and an electrical chip region located outside the optical element region along a second direction, wherein a built-in optical element is disposed within the optical element region, and the second direction is parallel to the first main surface of the optical integrated chip;

[0074] an electronic chip mounted on the electrical chip region of the first main surface of the optical integrated chip and electrically connected to the optical integrated chip;

[0075] A plastic encapsulation layer is located on the first main surface of the optical integrated chip and encapsulates the electronic chip. The plastic encapsulation layer has an opening that penetrates the plastic encapsulation layer along the first direction and exposes the optical element area. Part of the blocking portion is located on the side of the plastic encapsulation layer facing the opening.

[0076] In some embodiments, the blocking portion directly covers the side of the plastic packaging layer facing the opening.

[0077] In some embodiments, further comprising:

[0078] The supporting portion covers the side surface of the plastic sealing layer facing the opening, the blocking portion covers the surface of the supporting portion facing away from the plastic sealing layer, and the material of the supporting portion is silicon.

[0079] In some embodiments, a thickness of the supporting portion along the second direction is greater than a thickness of the blocking portion along the second direction.

[0080] The protective cover and its manufacturing method, optoelectronic co-packaging structure and its manufacturing method provided by the present invention provide a blocking portion in the cover body of the protective cover and a first groove inside the blocking portion. Since the blocking portion is formed by a composite material including inorganic materials and organic materials, the mechanical strength of the cover body is significantly increased, thereby effectively preventing the molding material from overflowing into the optical element area during the molding process, and at the same time improving the controllability of the process technology of the protective cover and the optoelectronic co-packaging structure, thereby improving the performance and manufacturing yield of the optoelectronic co-packaging structure.

[0081] In some embodiments of the present invention, a supporting portion for supporting the blocking portion is provided in the cover body, and the material of the supporting portion is silicon, that is, the proportion of silicon in the entire protective cover is increased. Therefore, after the protective cover is attached to the optical element area of ​​the optical integrated chip, the degree of warping of the optical integrated chip in the plastic packaging process can be improved, reduced, or even suppressed, thereby helping to improve the performance and yield of the optoelectronic co-packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0082] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly describes the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0083] Figure 1 This is a schematic diagram of the first structure of the protective cover in a specific embodiment of the present invention;

[0084] Figure 2 This is a schematic diagram of a second structure of the protective cover in a specific embodiment of the present invention;

[0085] Figure 3 This is a schematic diagram of the third structure of the protective cover in a specific embodiment of the present invention;

[0086] Figure 4 This is a schematic diagram of the fourth structure of the protective cover in a specific embodiment of the present invention;

[0087] Figure 5is a schematic diagram of a fifth structure of a protective cover in a specific embodiment of the present invention;

[0088] Figure 6 is a flow chart of a method for manufacturing a protective cover in a specific embodiment of the present invention;

[0089] Figure 7 is a structural schematic diagram after a blocking portion is formed on a supporting portion in a specific embodiment of the present invention;

[0090] Figure 8 is a schematic structural diagram after a first groove is formed in the barrier portion in a specific embodiment of the present invention;

[0091] Figure 9 This is a schematic diagram of a structure after a plurality of independent protective covers are formed in a specific embodiment of the present invention;

[0092] Figure 10 This is a schematic structural diagram of a silicon substrate in a specific embodiment of the present invention;

[0093] Figure 11 is a schematic structural diagram after forming the support portion and the second groove in a specific embodiment of the present invention;

[0094] Figure 12 is another structural schematic diagram after a blocking portion is formed on the supporting portion in a specific embodiment of the present invention;

[0095] Figure 13 This is a schematic diagram of a structure after removing the blocking portion on the surface of the support portion in a specific embodiment of the present invention;

[0096] Figure 14 is a schematic structural diagram after the remaining silicon substrate below the second trench is removed in a specific embodiment of the present invention;

[0097] Figure 15 is another structural schematic diagram after the first groove is formed in the blocking portion in a specific embodiment of the present invention;

[0098] Figure 16 is another structural schematic diagram after a plurality of independent protective covers are formed in a specific embodiment of the present invention;

[0099] Figure 17 is a flow chart of a method for manufacturing an optoelectronic co-packaging structure according to a specific embodiment of the present invention;

[0100] Figure 18 1 is a schematic structural diagram of a specific embodiment of the present invention after a protective cover is attached to an optoelectronic integrated chip;

[0101] Figure 19 This is a schematic diagram of a structure after a plastic sealing layer is formed in a specific embodiment of the present invention;

[0102] Figure 20 This is a schematic diagram of a structure after the thinned plastic sealing layer is exposed in a specific embodiment of the present invention;

[0103] Figure 21 is a structural schematic diagram of an optoelectronic co-packaging structure formed in a specific embodiment of the present invention;

[0104] Figure 22 is a schematic structural diagram of a specific embodiment of the present invention after another protective cover is attached to the optoelectronic integrated chip;

[0105] Figure 23 is another structural schematic diagram after the plastic sealing layer is formed in a specific embodiment of the present invention;

[0106] Figure 24 This is another structural schematic diagram after the plastic sealing layer is thinned in a specific embodiment of the present invention;

[0107] Figure 25 is a schematic structural diagram of a specific embodiment of the present invention after a third groove is formed in the blocking portion;

[0108] Figure 26 is another structural schematic diagram of the optoelectronic co-packaging structure formed in a specific embodiment of the present invention;

[0109] Figure 27 This is another structural diagram of the optoelectronic co-packaging structure in a specific embodiment of the present invention;

[0110] Figure 28 It is another structural schematic diagram of the optoelectronic co-packaging structure in a specific embodiment of the present invention. DETAILED DESCRIPTION

[0111] The following describes in detail the specific embodiments of the protective cover and its manufacturing method, the optoelectronic co-packaging structure and its manufacturing method provided by the present invention in conjunction with the accompanying drawings.

[0112] This embodiment provides a protective cover. Figure 1 This is a schematic diagram of the first structure of the protective cover in a specific embodiment of the present invention. Figure 1 As shown, the protective cover includes:

[0113] A cover body, comprising a barrier portion 10, wherein the barrier portion 10 is made of a composite material including an inorganic material and an organic material, and the cover body includes an upper surface and a lower surface that are oppositely distributed along a first direction D1, and the lower surface of the cover body is used to cover the optical element area of ​​the optical integrated chip;

[0114] The first groove 11 is located inside the blocking portion 10 , and the first groove 11 extends from the lower surface of the cover along the first direction D1 to the inside of the cover.

[0115] Specifically, the cover includes the upper surface and the lower surface that are relatively distributed along the first direction D1, and the lower surface of the cover is used to cover the optical element area of ​​the optical integrated chip, and is used to prevent the molding compound from overflowing onto the optical element area during the process of molding the electronic chip on the optical integrated chip, thereby preventing the optical element area from being contaminated by the molding compound. The first groove 11 is located inside the blocking portion 10, and the first groove 11 extends from the lower surface of the cover along the first direction D1 toward the inside of the cover, so that the blocking portion at the side wall of the first groove 11 can be used to prevent the molding compound from overflowing, and the protective cover can be split through the first groove 11 after the molding process is completed to remove part of the protective cover, thereby exposing the optical element area of ​​the optical integrated chip, so as to facilitate the implementation of subsequent processes (for example, providing an inserted optical fiber or laser array structure on the optical element area). The blocking portion 10 is composed of a composite material including inorganic materials and organic materials, thereby significantly increasing the overall mechanical strength of the cover body, and can effectively block or even prevent the molding material from overflowing into the optical element area during the molding process, while improving the controllability of the protective cover and the optoelectronic co-packaging structure process, thereby improving the performance and manufacturing yield of the optoelectronic co-packaging structure.

[0116] In one example, the first groove 11 is a cylindrical groove or a prismatic groove.

[0117] In some embodiments, the inorganic material includes any one or a combination of two or more of silicon, silicon oxide, silicon carbide, gallium nitride, gallium arsenide, indium phosphide, and lithium tantalate;

[0118] The organic material includes epoxy resin.

[0119] Specifically, inorganic materials such as silicon, silicon oxide, silicon carbide, gallium nitride, gallium arsenide, indium phosphide, and lithium tantalate can enhance the mechanical strength of the barrier portion. By adding these inorganic materials to epoxy resin or epoxy resin with fillers (e.g., silica fillers), the barrier portion 10 with enhanced mechanical strength can be formed. This method is simple and easy to operate, thus enabling effective application in actual production operations. The relative ratio of the inorganic and organic materials can be adjusted based on the specific type and amount of the molding compound used in the molding process, the size of the optical element region, and other requirements.

[0120] In some embodiments, the cover further comprises:

[0121] The support portion 12 is used to support the blocking portion 10 , and the material of the support portion 12 is silicon.

[0122] Specifically, by providing the support portion 12 for supporting the blocking portion 10 and using silicon to form the support portion 12, the proportion of silicon in the entire protective cover is increased. After the protective cover is attached to the optical element area of ​​the optical integrated chip, the degree of warping of the optical integrated chip during the plastic packaging process can be reduced or even suppressed, thereby helping to improve the performance and yield of the optoelectronic co-packaging structure.

[0123] In some embodiments, the support portion 12 extends along a second direction D2, and the support portion 12 includes a front surface and a back surface that are oppositely distributed along the first direction D1, and the second direction D2 is parallel to the upper surface of the cover;

[0124] The blocking portion 10 covers the front surface of the supporting portion 12 .

[0125] In some embodiments, the barrier portion 10 has a plurality of first grooves 11 therein, each of the first grooves 11 passes through the barrier portion 10 along the first direction D1 , and the plurality of first grooves 11 are arranged at intervals along the second direction D2 .

[0126] For example, if Figure 1As shown, the cover body of the protective cover includes the support portion 12 and the blocking portion 10 located on the front of the support portion 12, the back of the support portion 12 serves as the upper surface of the cover body, and the surface of the blocking portion 10 facing away from the support portion 12 serves as the lower surface of the cover body. The multiple mentioned in this specific embodiment refers to more than two. In one example, the interior of the blocking portion 10 has two first grooves 11 that penetrate the blocking portion 10 along the first direction D1, and the two first grooves 11 are arranged at intervals along the second direction D2, so that the cross-section of the blocking portion 10 with two first grooves 11 is M-shaped. When the protective cover is covered on the first main surface of the optical integrated chip (i.e., the surface on which the optical element is exposed on the optical integrated chip), the blocking portion 10 between the two first grooves 11 (i.e., the middle position of the blocking portion 10) is used to align with the optical element in the optical element area, and the projection of the edge position of the blocking portion 10 on the first main surface of the optical integrated chip is a closed ring and is distributed around the periphery of the optical element area. This structure not only prevents the molding compound from overflowing into the optical component area through the blocking portion 10 on the sidewall of the first groove 11, but also allows the blocking portion 10 to be segmented by the first groove 11, allowing a portion of the protective cover to be removed, thereby exposing the optical component area of ​​the optical integrated chip. Furthermore, the M-shaped blocking portion 10 offers simple processing and high controllability, facilitating mass production of the protective cover.

[0127] Figure 2 Schematic diagram of the second structure of the protective cover in a specific embodiment of the present invention. Figure 2 As shown, the support portion includes:

[0128] a transverse support portion 20 extending along a second direction D2, wherein the transverse support portion 20 includes a top surface and a bottom surface that are oppositely distributed along the first direction D1, and the second direction D2 is parallel to the upper surface of the cover;

[0129] The longitudinal support portion 21 is vertically connected to the middle of the top surface of the transverse support portion 20 along the first direction D1, and the blocking portion 10 covers the top surface of the transverse support portion 20 and is distributed on opposite sides of the longitudinal support portion 21 along the second direction D2.

[0130] In some embodiments, the blocking portion 10 has a plurality of first grooves 11 therein, each first groove 11 passes through the blocking portion 10 along the first direction D1, and the plurality of first grooves 11 are distributed on opposite sides of the longitudinal supporting portion 21 along the second direction D2.

[0131] For example, if Figure 2As shown, the support portion, made of silicon, includes a transverse support portion 20 and a longitudinal support portion 21 connected vertically, resulting in an overall T-shape. The blocking portions 10 cover the top surface of the transverse support portion 20 and are located on opposite sides of the longitudinal support portion 21 along the second direction D2, so that the side surfaces of the blocking portions 10 are flush with the side surfaces of the transverse support portion 20, and the surface of the blocking portion 10 facing away from the transverse support portion 20 is flush with the surface of the longitudinal support portion 21 facing away from the transverse support portion 20. By providing the support portion including the transverse support portion 20 and the longitudinal support portion 21, the silicon content in the protective cover can be further increased, which not only further enhances the effect of suppressing warping of the optical integrated chip, but also helps to further improve the mechanical strength and overall structural stability of the protective cover. In one example, the interior of the blocking portion 10 has two first grooves 11 that penetrate the blocking portion 10 along the first direction D1, and the two first grooves 11 are distributed on opposite sides of the longitudinal support portion 21 along the second direction D2, so that the cross-section of the blocking portion 10 having the two first grooves 11 and the longitudinal support portion 21 as a whole is M-shaped. When the protective cover is covered on the first main surface of the optical integrated chip (i.e., the surface on which the optical elements are exposed on the optical integrated chip), the longitudinal support portion 21 is used to align with the optical elements in the optical element area, and the projection of the blocking portion 10 on the first main surface of the optical integrated chip is in the shape of a closed ring and is distributed around the periphery of the optical element area. With the above structure, the blocking portion 10 at the side wall of the first groove 11 can prevent the plastic encapsulation material from overflowing into the optical element area, and the first groove 11 can be used to remove part of the protective cover, thereby exposing the optical element area of ​​the optical integrated chip.

[0132] Figure 3 : is a third structural diagram of the protective cover in a specific embodiment of the present invention, Figure 4 : is a fourth structural diagram of the protective cover in a specific embodiment of the present invention. In some other embodiments, the support portion includes:

[0133] a transverse support portion 20 extending along a second direction D2, wherein the transverse support portion 20 includes a top surface and a bottom surface that are oppositely distributed along the first direction D1, and the second direction D2 is parallel to the upper surface of the cover;

[0134] An end longitudinal support portion 31 , perpendicularly connected to an end of the transverse support portion 20 along the first direction D1;

[0135] The middle longitudinal support portion 30 is vertically connected to the middle of the top surface of the transverse support portion 20 along the first direction D1, and the blocking portion 10 covers the top surface of the transverse support portion 20 and fills between the end longitudinal support portion 31 and the middle longitudinal support portion 30.

[0136] In some embodiments, the barrier portion 10 has a plurality of first grooves 11 therein, each of the first grooves 11 passes through the barrier portion 10 along the first direction D1, and the plurality of first grooves 11 are distributed on opposite sides of the middle longitudinal support portion 30 along the second direction D2.

[0137] For example, if Figure 3 and Figure 4As shown, the support portion, made of silicon, includes the transverse support portion 20, the end longitudinal support portions 31, and the middle longitudinal support portion 30, both of which are perpendicularly connected to the transverse support portion 20. The end longitudinal support portions 31 are distributed around the periphery of the middle longitudinal support portion 30. The blocking portion 10 covers the top surface of the transverse support portion 20 and fills the space between the end longitudinal support portions 31 and the middle longitudinal support portion 30. The surface of the blocking portion 10 facing away from the transverse support portion 20, the surface of the end longitudinal support portion 31 facing away from the transverse support portion 20, and the surface of the middle longitudinal support portion 30 facing away from the transverse support portion 20 are flush. By providing the support portion including the transverse support portion 20, the end longitudinal support portion 31, and the middle longitudinal support portion 30, the silicon content in the protective cover can be further increased, which not only further enhances the effect of suppressing warping of the optical integrated chip, but also helps to further improve the mechanical strength and overall structural stability of the protective cover. In one example, the barrier portion 10 has two first grooves 11 extending through the barrier portion 10 along the first direction D1, and the two first grooves 11 are located on opposite sides of the middle longitudinal support portion 30 along the second direction D2. As a result, the barrier portion 10 having the two first grooves 11, the end longitudinal support portions 31, and the middle longitudinal support portion 30 have an M-shaped cross-section. When the protective cover is placed over the first principal surface of the optical integrated chip (i.e., the surface of the optical integrated chip where the optical elements are exposed), the middle longitudinal support portion 30 is configured to align with the optical elements within the optical element region. The projections of the end longitudinal support portions 31 and the barrier portion 10 covering the side surfaces of the end longitudinal support portions 31 on the first principal surface of the optical integrated chip form a closed ring and are distributed around the periphery of the optical element region. By adopting the above structure, the end longitudinal support portion 31 at the side wall of the first groove 11 and the blocking portion 10 covering the side of the end longitudinal support portion 31 can be used to prevent the plastic packaging material from overflowing into the optical element area, and the first groove 11 can be used to separate the end longitudinal support portion 31 and the middle longitudinal support portion 30 to remove part of the protective cover, thereby exposing the optical element area of ​​the optical integrated chip.

[0138] In one example, the thickness of the lateral support portion 20 can be adjusted according to the thickness of the electronic chip mounted on the optical integrated chip. For example, when the thickness of the electronic chip mounted on the optical integrated chip is thin, the thickness of the lateral support portion 20 along the first direction D1 can be increased (e.g., Figure 4As shown in FIG, the thickness of the transverse support portion 20 along the first direction D1 can be reduced (as shown in FIG, 2 ). Figure 3 As shown), the lateral support portion 20 can be removed simultaneously when the plastic encapsulation layer is subsequently thinned, thereby simplifying the manufacturing process of the optoelectronic co-packaging structure.

[0139] Figure 5 This is a fifth structural diagram of a protective cover according to a specific embodiment of the present invention. In some embodiments, the support portion 12 has a plurality of second grooves 50 spaced apart along a second direction D2, and each second groove 50 extends through the support portion 12 along the first direction D1. The second direction D2 is parallel to the upper surface of the cover.

[0140] The blocking portion 10 is filled in the second groove 50 , and a surface of the blocking portion 10 is flush with a surface of the supporting portion 12 .

[0141] In some embodiments, the barrier portion 10 has a plurality of first grooves 11 therein. The first grooves 11 are distributed in the second grooves 50 in a one-to-one correspondence, and the first grooves 11 do not penetrate the barrier portion 10 along the first direction D1.

[0142] For example, if Figure 5As shown, the support portion 12 made of silicon has two second grooves 50 arranged at intervals along the second direction D2 and penetrating the support portion 12 along the first direction D1. The blocking portion 10 is filled in the second groove 50, and the surface of the blocking portion 10 is flush with the surface of the support portion 12. In one example, the interior of the blocking portion 10 has two first grooves 11, and the two first grooves 11 are distributed in the two second grooves 50 in a one-to-one correspondence, and the first grooves 11 do not penetrate the blocking portion 10 along the first direction D1, so that the protective cover is M-shaped as a whole. When the protective cover is covered on the first main surface of the optical integrated chip (i.e., the surface of the optical element exposed on the optical integrated chip), the support portion 12 between the two first grooves 11 is used to align with the optical element in the optical element area, and the edge of the support portion 12 is projected on the first main surface of the optical integrated chip in a closed ring shape and distributed around the periphery of the optical element area. By adopting the above structure, the support portion 12 at the side wall of the first groove 11 and the blocking portion 10 covering the side of the support portion 12 can be used to prevent the plastic packaging material from overflowing into the optical element area, and the first groove 11 can be used to split the cover body to remove part of the protective cover, thereby exposing the optical element area of ​​the optical integrated chip.

[0143] This embodiment also provides a method for manufacturing a protective cover. Figure 6 This is a flow chart of the manufacturing method of the protective cover in a specific embodiment of the present invention. The structure of the protective cover manufactured in this specific embodiment can be seen in Figure 1-Figure 5 .like Figures 1-6 As shown, the manufacturing method of the protective cover includes the following steps:

[0144] Step S61: forming a cover, wherein the cover includes a barrier portion 10, wherein the barrier portion 10 is made of a composite material including an inorganic material and an organic material, and the cover includes an upper surface and a lower surface that are oppositely distributed along a first direction D1, wherein the lower surface of the cover is used to cover the optical element area of ​​the optical integrated chip;

[0145] In step S62 , a first groove 11 is formed inside the blocking portion 10 , and the first groove 11 extends from the lower surface of the cover along the first direction D1 to the inside of the cover.

[0146] In some embodiments, the inorganic material includes any one or a combination of two or more of silicon, silicon oxide, silicon carbide, gallium nitride, gallium arsenide, indium phosphide, and lithium tantalate;

[0147] The organic material includes epoxy resin.

[0148] Figure 7 Schematic diagram of a structure after forming a blocking portion on the support portion in a specific embodiment of the present invention. In some embodiments, the specific steps of forming the cover include:

[0149] A flat support portion 12 is formed. The support portion 12 is made of silicon and extends along a second direction D2. The support portion 12 includes a front surface and a back surface that are oppositely distributed along the first direction D1. The second direction D2 is parallel to the upper surface of the cover.

[0150] Depositing composite material on the front surface of the support portion 12 to form the barrier portion 10, so as to form the cover including the support portion 12 and the barrier portion 10, as shown in FIG. Figure 7 shown.

[0151] Figure 8 FIG. 1 is a schematic structural diagram of a specific embodiment of the present invention after forming a first groove in the barrier portion. In some embodiments, the specific steps of forming the first groove 11 inside the barrier portion 10 include:

[0152] The blocking portion 10 is grooved starting from the surface of the blocking portion 10 away from the supporting portion 12 to form a plurality of first grooves 11, each of which penetrates the blocking portion 10 along the first direction D1, and the plurality of first grooves 11 are arranged at intervals along the second direction D2. Figure 8 shown.

[0153] Figure 9 1 is a schematic diagram of a structure after forming a plurality of independent protective covers in a specific embodiment of the present invention. For example, after forming the flat support portion 12, the composite material including the inorganic material and the organic material is deposited on the front surface of the support portion 12 to form the blocking portion 10 covering the front surface of the support portion 12. Figure 7 Then, a plurality of first grooves 11 are formed in the blocking portion 10 by dry etching, wet etching, laser grooving or blade cutting, and each of the first grooves 11 passes through the blocking portion 10 along the first direction D1, as shown. Figure 8 After that, after the carrier film 90 is attached to the back of the support portion 12, the blocking portion 10 and the support portion 12 are cut using a cutting process to form a plurality of independent protective covers, see Figure 1 and Figure 9 .

[0154] In some other embodiments, the specific steps of forming the cover include:

[0155] A support portion is formed including a transverse support portion 20 and a longitudinal support portion 21, wherein the transverse support portion 20 extends along a second direction D2, the transverse support portion 20 includes a top surface and a bottom surface that are oppositely distributed along the first direction D1, and the longitudinal support portion 21 is perpendicularly connected to the middle portion of the top surface of the transverse support portion 20 along the first direction D1, and the second direction D2 is parallel to the upper surface of the cover;

[0156] The composite material is deposited on the top surface of the lateral support portion 20 to form the blocking portion 10 covering the surface of the lateral support portion 20 and distributed on the opposite sides of the longitudinal support portion 21 along the second direction D2, so as to form the cover including the support portion and the blocking portion 10. Figure 2 shown.

[0157] In some other embodiments, the specific steps of forming the first groove 11 inside the blocking portion 10 include:

[0158] The blocking portion 10 is grooved starting from the surface of the blocking portion 10 facing away from the lateral supporting portion 20 to form a plurality of first grooves 11, each of the first grooves 11 passes through the blocking portion 10 along the first direction D1, and the plurality of first grooves 11 are distributed on opposite sides of the longitudinal supporting portion 21 along the second direction D2.

[0159] For example, a silicon substrate is etched to form a support portion including the lateral support portion 20 and the longitudinal support portion 21. Thereafter, the composite material including the inorganic material and the organic material is deposited on the top surface of the lateral support portion 20 to form the blocking portion 10 covering the surface of the lateral support portion 20 and distributed on the opposite sides of the longitudinal support portion 21 along the second direction D2. Next, a plurality of the first grooves 11 are formed in the blocking portion 10 by dry etching, wet etching, laser grooving or blade cutting, etc. Each of the first grooves 11 passes through the blocking portion 10 along the first direction D1, and a plurality of the first grooves 11 are distributed on the opposite sides of the longitudinal support portion 21 along the second direction D2, as shown in FIG. Figure 2 shown.

[0160] In some further embodiments, the specific steps of forming the cover include:

[0161] providing a silicon substrate;

[0162] The silicon substrate is patterned to form a plurality of isolation trenches in the silicon substrate, wherein the plurality of isolation trenches separate the silicon substrate into a central longitudinal support portion 30 and end longitudinal support portions 31 distributed around the periphery of the central longitudinal support portion 30. The silicon substrate remaining below the isolation trenches serves as a transverse support portion 20, thereby constituting a support portion including the transverse support portion 20, the end longitudinal support portions 31, and the central longitudinal support portion 30. The end longitudinal support portion 31 is perpendicularly connected to the end of the transverse support portion 20 along the first direction D1, and the central longitudinal support portion 30 is perpendicularly connected to the middle of the transverse support portion 20 along the first direction D1. The second direction D2 is parallel to the upper surface of the cover body.

[0163] A composite material is deposited on the support portion to form the blocking portion 10 covering the top surface of the lateral support portion 20 and filling between the end longitudinal support portion 31 and the middle longitudinal support portion 30 to form the cover body including the support portion and the blocking portion 10.

[0164] In some other embodiments, the specific steps of forming the first groove 11 inside the blocking portion 10 include:

[0165] The blocking portion 10 is grooved starting from the surface of the blocking portion 10 away from the transverse supporting portion 20 to form a plurality of first grooves 11, each of which penetrates the blocking portion 10 along the first direction D1, and the plurality of first grooves 11 are distributed on opposite sides of the middle longitudinal supporting portion 30 along the second direction D2. Figure 3 or Figure 4 shown.

[0166] For example, the support portion including the lateral support portion 20, the end longitudinal support portion 31 and the middle longitudinal support portion 30 is formed by etching the silicon substrate, see Figure 3 . Then, the composite material including the inorganic material and the organic material is deposited on the top surface of the transverse support portion 20 to form the blocking portion 10 covering the surface of the transverse support portion 20 and filling the space between the end longitudinal support portion 31 and the middle longitudinal support portion 30. Then, a plurality of first grooves 11 are formed in the blocking portion 10 by dry etching, wet etching, laser grooving or blade cutting, etc. Each of the first grooves 11 passes through the blocking portion 10 along the first direction D1, and a plurality of the first grooves 11 are distributed on opposite sides of the middle longitudinal support portion 30 along the second direction D2, as shown in FIG. Figure 3 shown.

[0167] Figure 10 is a structural diagram of a silicon substrate in a specific embodiment of the present invention, Figure 11 This is a schematic diagram of the structure after the support portion and the second groove are formed in a specific embodiment of the present invention. Figure 12 is another structural schematic diagram after a blocking portion is formed on the supporting portion in a specific embodiment of the present invention, Figure 13 1 is a schematic diagram of a structure after removing the blocking portion on the surface of the support portion in a specific embodiment of the present invention. Figure 14 is a schematic diagram of the structure after removing the remaining silicon substrate below the second trench in a specific embodiment of the present invention. In some further embodiments, the specific steps of forming the cover body include:

[0168] Provide a silicon substrate 100, such as Figure 10 As shown;

[0169] The silicon substrate 100 is patterned to form a plurality of second trenches 50 in the silicon substrate 100. Figure 11 As shown;

[0170] The composite material is deposited in the second groove 50 to form the barrier portion 10 that fills the second groove 50. Figure 13 As shown;

[0171] The silicon substrate 100 below the second trench 50 is removed, and the remaining silicon substrate 100 is used as the support portion 12 to form the cover including the support portion 12 and the barrier portion 10. Figure 14 shown.

[0172] Figure 15 1 is another structural diagram after forming the first groove in the barrier portion in a specific embodiment of the present invention. In some further embodiments, the specific steps of forming the first groove 11 inside the barrier portion 10 include:

[0173] The blocking portion 10 is grooved to form a plurality of first grooves 11, and the plurality of first grooves 11 are distributed in the plurality of second grooves 50 in a one-to-one correspondence, and the first grooves 11 do not penetrate the blocking portion 10 along the first direction D1. Figure 15 shown.

[0174] Figure 16 1 is another structural diagram after forming multiple independent protective covers in a specific embodiment of the present invention. For example, a silicon substrate 100 having a thickness of more than 1 mm is provided, such as Figure 10 Next, the silicon substrate 100 is cut with a blade to form the second groove 50, as shown. Figure 11 Afterwards, the composite material including the inorganic material and the organic material is deposited on the silicon substrate 100 to form the barrier portion 10 that fills the second groove 50 and covers the surface of the silicon substrate 100, as shown. Figure 12 The blocking portion 10 is thinned by a grinding process to remove the blocking portion 10 covering the surface of the silicon substrate 100. Figure 13 Remove the silicon substrate 100 below the second groove 50 and use the remaining silicon substrate 100 as the support portion 12, as shown. Figure 14 Then, a plurality of first grooves 11 are formed in the blocking portion 10 by dry etching, wet etching, laser grooving or blade cutting, and the plurality of first grooves 11 are distributed in the plurality of second grooves 50 in a one-to-one correspondence, as shown. Figure 15 After that, after the carrier film 90 is attached to the back of the support portion 12, the blocking portion 10 and the support portion 12 are cut using a cutting process to form a plurality of independent protective covers, see Figure 5 and Figure 16 .

[0175] This specific embodiment also provides a method for manufacturing an optoelectronic co-packaging structure. Figure 17 FIG. 1 is a flow chart of a method for manufacturing a photovoltaic co-packaging structure according to a specific embodiment of the present invention. Figure 17 As shown, the manufacturing method of the optoelectronic co-packaging structure includes the following steps:

[0176] Step S171, forming an optical integrated chip, the optical integrated chip including a front side and a back side relative to each other along a first direction, the optical integrated chip including an optical element region and an electrical chip region located outside the optical element region along a second direction, the optical element region having a built-in optical element, the second direction being parallel to the front side of the optical integrated chip;

[0177] Step S172, mounting an electronic chip on the electrical chip region on the front side of the optical integrated chip, and electrically connecting the electronic chip and the optical integrated chip;

[0178] Step S173, attaching a protective cover to the optical element area on the front side of the optical integrated chip, wherein the structure of the protective cover is as described above;

[0179] Step S174, forming a plastic sealing layer on the front surface of the optical integrated chip to seal the electronic chip, wherein the top surface of the electronic chip and the upper surface of the cover are exposed to the surface of the plastic sealing layer;

[0180] Step S175 , removing a portion of the protective cover to form an opening exposing the optical element area, and the remaining portion of the blocking portion is located on the side surface of the plastic packaging layer.

[0181] Figure 18is a schematic structural diagram of a specific embodiment of the present invention after a protective cover is attached to an optoelectronic integrated chip. Figure 19 is a structural schematic diagram after the plastic sealing layer is formed in a specific embodiment of the present invention, Figure 20 is a schematic diagram of a structure after the thinned plastic sealing layer is exposed in a specific embodiment of the present invention, Figure 21 Schematic diagram of a photovoltaic co-packaging structure formed in a specific embodiment of the present invention. In some embodiments, the cover further includes a support portion 12 extending along a second direction D2. The support portion 12 includes a front surface and a back surface that are relatively distributed along the first direction D1. The blocking portion 10 covers the front surface of the support portion 12. The blocking portion 10 has two first grooves 11 inside. Each first groove 11 passes through the blocking portion 10 along the first direction D1, and the two first grooves 11 are arranged at intervals along the second direction D2. The second direction D2 is parallel to the upper surface of the cover. Figure 1 The specific steps of attaching the protective cover to the optical element area on the front side of the optical integrated chip 180 include:

[0182] The protective cover is mounted on the optical element region with the blocking portion 10 facing the optical integrated chip 180, and the blocking portion 10 between the two first grooves 11 covers the optical element 181. Figure 18 shown.

[0183] In some embodiments, the specific step of removing part of the protective cover includes:

[0184] The support portion 12 is removed to expose the blocking portion 10;

[0185] The blocking portion 10 between the two first grooves 11 is removed by an adsorption process.

[0186] For example, the optical integrated chip 180 includes an optical element region and an electrical chip region outside the optical element region. After mounting an electronic chip (such as a control chip 182 and a memory chip 183) on the electrical chip region of the optical integrated chip 180, the protective cover is bonded to the optical element region by gluing the blocking portion 10 toward the optical integrated chip 180, and the blocking portion 10 between the two first grooves 11 covers the optical element 181. Figure 18 Next, the optical integrated chip 180 is injected with a molding compound to form the molding layer 190 that molds the electronic chip and the protective cover, as shown. Figure 19Afterwards, the plastic layer 190 and the protective cover are thinned by grinding or other processes to remove the support portion 12 and part of the plastic layer 190 to expose the blocking portion 10, for example, grinding until the first groove 11 is exposed, as shown. Figure 20 As shown. Since the first groove 11 passes through the blocking portion 10 along the first direction D1, after removing the support portion 12, the blocking portion 10 between the two first grooves 11 is separated from the blocking portion 10 covering the side of the plastic encapsulation layer 190, so that the blocking portion 10 between the two first grooves 11 can be removed by an adsorption process to form an opening 210 exposing the optical element area, as shown. Figure 21 shown.

[0187] Figure 22 is a schematic structural diagram of another protective cover attached to the optoelectronic integrated chip in a specific embodiment of the present invention. Figure 23 is another structural schematic diagram after the plastic sealing layer is formed in a specific embodiment of the present invention, Figure 24 This is another structural diagram after the plastic sealing layer is thinned in a specific embodiment of the present invention. Figure 25 is a schematic structural diagram after forming a third groove in the barrier portion in a specific embodiment of the present invention, Figure 26 : is another structural schematic diagram of the optoelectronic co-packaging structure formed in a specific embodiment of the present invention. In other embodiments, the cover further includes a support portion 12 and two second grooves 50 located in the support portion 12 and spaced apart along the second direction D2. Each second groove 50 penetrates the support portion 12 along the first direction D1. The blocking portion 10 is filled in the second groove 50, and the surface of the blocking portion 10 is flush with the surface of the support portion 12. The blocking portion 10 has two first grooves 11 inside. The two first grooves 11 are distributed in the two second grooves 50 in a one-to-one correspondence. The first grooves 11 do not penetrate the blocking portion 10 along the first direction D1. The second direction D2 is parallel to the upper surface of the cover. Figure 5 The specific steps of attaching the protective cover to the optical element area on the front side of the optical integrated chip 180 include:

[0188] The protective cover is mounted on the optical element region with the first groove 11 facing the optical integrated chip 180, and the support portion 12 between the two first grooves 11 covers the optical element 181. Figure 22 shown.

[0189] In some other embodiments, the specific steps of removing part of the protective cover include:

[0190] The blocking portion 10 in the second groove 50 is grooved to form a third groove 250 communicating with the first groove 11. Figure 25 As shown;

[0191] Adopting an adsorption process to remove the blocking portion 10 and the supporting portion 12 between the two first grooves 11, as shown in FIG. Figure 26 shown.

[0192] For example, the optical integrated chip 180 includes an optical element region and an electrical chip region outside the optical element region. After mounting an electronic chip (such as a control chip 182 and a memory chip 183) on the electrical chip region of the optical integrated chip 180, the protective cover is adhered to the optical element region with the first groove 11 facing the optical integrated chip 180 by gluing, and the support portion 12 between the two first grooves 11 covers the optical element 181, as shown in FIG. Figure 22 Next, the optical integrated chip 180 is injected with a molding compound to form the molding layer 190 that molds the electronic chip and the protective cover, as shown. Figure 23 Afterwards, the plastic sealing layer 190 and the protective cover are thinned by grinding or other processes, and a portion of the plastic sealing layer 190 is removed to expose the blocking portion 10, as shown. Figure 24 As shown. Since the first groove 11 does not penetrate the blocking portion 10 along the first direction D1, it is necessary to use a laser grooving process to groove the blocking portion 10 to form a third groove 250 connected to the first groove 11, as shown. Figure 25 After forming the third groove 250, the cover between the two first grooves 11 is separated from the cover covering the side of the plastic layer 190, so that the blocking portion 10 and the supporting portion 12 between the two first grooves 11 can be removed by an adsorption process to form an opening 210 exposing the optical element area. Figure 26 shown.

[0193] This embodiment also provides an optoelectronic co-packaging structure, which is formed by the manufacturing method of the optoelectronic co-packaging structure as described above. Figures 17-26 The schematic diagram of the optoelectronic co-packaging structure can be found in Figure 21 and Figure 26 . Figure 27 is another structural diagram of the optoelectronic co-packaging structure in a specific embodiment of the present invention, Figure 28 It is another structural schematic diagram of the optoelectronic co-packaging structure in a specific embodiment of the present invention.

[0194] like Figure 21 、 Figure 26 、 Figure 27 or Figure 28 As shown, the optoelectronic co-packaging structure includes:

[0195] An optical integrated chip 180 includes a first main surface and a second main surface that are oppositely distributed along a first direction D1. The optical integrated chip 180 includes an optical element region and an electrical chip region located outside the optical element region along a second direction D2. A built-in optical element 181 is disposed in the optical element region. The second direction D2 is parallel to the first main surface of the optical integrated chip 180.

[0196] an electronic chip mounted on the electrical chip region of the first main surface of the optical integrated chip 180 and electrically connected to the optical integrated chip 180;

[0197] The plastic encapsulation layer 190 is located on the first main surface of the optical integrated chip 180 and encapsulates the electronic chip. The plastic encapsulation layer 190 has an opening 210 that penetrates the plastic encapsulation layer 190 along the first direction D1 and exposes the optical element area. Part of the blocking portion 10 is located on the side of the plastic encapsulation layer 190 facing the opening 210.

[0198] In some embodiments, the blocking portion 10 directly covers the side of the plastic layer 190 facing the opening 210 .

[0199] In some embodiments, the optoelectronic co-packaging structure further comprises:

[0200] The support portion 12 covers the side of the plastic encapsulation layer 190 facing the opening 210 , and the blocking portion 10 covers the surface of the support portion 12 facing away from the plastic encapsulation layer 190 .

[0201] The material of the barrier portion 10 is a composite material including an inorganic material and an organic material, and the material of the support portion 12 is silicon.

[0202] In some embodiments, a thickness of the supporting portion 12 along the second direction D2 is greater than a thickness of the blocking portion 10 along the second direction D2 , so as to further suppress warping of the optical integrated chip 180 .

[0203] The protective cover and its manufacturing method, optoelectronic co-packaging structure and its manufacturing method provided in this specific embodiment provide a blocking portion in the cover body of the protective cover and a first groove inside the blocking portion. Since the blocking portion is formed of a composite material including inorganic and organic materials, the mechanical strength of the cover body is significantly increased, thereby effectively preventing the molding compound from overflowing into the optical element area during the molding process, while improving the controllability of the manufacturing process of the protective cover and the optoelectronic co-packaging structure, thereby improving the performance and manufacturing yield of the optoelectronic co-packaging structure.

[0204] In some embodiments of this specific embodiment, a supporting portion for supporting the blocking portion is provided in the cover body, and the material of the supporting portion is silicon, that is, the proportion of silicon in the entire protective cover is increased, so that after the protective cover is attached to the optical element area of ​​the optical integrated chip, the degree of warping of the optical integrated chip in the plastic packaging process can be improved, reduced, or even suppressed, thereby helping to improve the performance and yield of the optoelectronic co-packaging structure.

[0205] It should be noted that the terms "including," "having," and their variations, as used in this document, are intended to cover non-exclusive inclusions. Terms such as "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a specific order or precedence, unless the context clearly indicates otherwise. Such usage should be understood to be interchangeable where appropriate. The term "one or more" may be used to describe a feature, structure, or characteristic in the singular, or in the plural, depending at least in part on the context, to describe a feature, structure, or combination of features. The term "based on" should be understood as not necessarily intended to express an exclusive set of factors, but may alternatively, also depending at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, the embodiments of the present invention and the features therein may be combined with one another, unless there is a conflict. Furthermore, descriptions of well-known components and technologies have been omitted from the above description to avoid unnecessary confusion regarding the concepts of the present invention. In each of the above embodiments, each embodiment focuses on its differences from the other embodiments, and reference may be made to the same or similar parts between the embodiments.

[0206] The above description is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A protective cover, characterized in that: include: A cover body, comprising a barrier portion, wherein the barrier portion is made of a composite material including an inorganic material and an organic material, and the cover body comprises an upper surface and a lower surface that are oppositely distributed along a first direction, wherein the lower surface of the cover body is used to cover the optical element area of ​​the optical integrated chip; The first groove is located inside the blocking portion, and the first groove extends from the lower surface of the cover along the first direction to the inside of the cover.

2. The protective cover according to claim 1, wherein: The inorganic material includes any one of silicon, silicon oxide, silicon carbide, gallium nitride, gallium arsenide, indium phosphide and lithium tantalate, or a combination of two or more thereof; The organic material includes epoxy resin.

3. The protective cover according to claim 1, wherein: The cover also includes: The supporting portion is used to support the blocking portion, and the material of the supporting portion is silicon.

4. The protective cover according to claim 3, wherein: The support portion extends along a second direction, and the support portion includes a front surface and a back surface that are oppositely distributed along the first direction, and the second direction is parallel to the upper surface of the cover body; The blocking portion covers the front surface of the supporting portion.

5. The protective cover according to claim 4, wherein: The blocking portion has a plurality of first grooves therein, each of the first grooves passes through the blocking portion along the first direction, and the plurality of first grooves are arranged at intervals along the second direction.

6. The protective cover according to claim 3, wherein: The support portion includes: a transverse support portion extending along a second direction, the transverse support portion comprising a top surface and a bottom surface relatively distributed along the first direction, the second direction being parallel to the upper surface of the cover; The longitudinal support portion is vertically connected to the middle of the top surface of the transverse support portion along the first direction, and the blocking portion covers the top surface of the transverse support portion and is distributed on two opposite sides of the longitudinal support portion along the second direction.

7. The protective cover according to claim 6, wherein: The blocking portion has a plurality of first grooves therein, each of the first grooves passes through the blocking portion along the first direction, and the plurality of first grooves are distributed on two opposite sides of the longitudinal supporting portion along the second direction.

8. The protective cover according to claim 3, wherein: The support portion includes: a transverse support portion extending along a second direction, the transverse support portion comprising a top surface and a bottom surface relatively distributed along the first direction, the second direction being parallel to the upper surface of the cover; The end longitudinal support portion is vertically connected to the end of the transverse support portion along the first direction; the middle longitudinal support portion is vertically connected to the middle of the top surface of the transverse support portion along the first direction, and the blocking portion covers the top surface of the transverse support portion and fills between the end longitudinal support portion and the middle longitudinal support portion.

9. The protective cover according to claim 8, wherein: The blocking portion has a plurality of first grooves therein, each of the first grooves passes through the blocking portion along the first direction, and the plurality of first grooves are distributed on opposite sides of the middle longitudinal supporting portion along the second direction.

10. The protective cover according to claim 3, wherein: The support portion has a plurality of second grooves arranged at intervals along a second direction, and each of the second grooves penetrates the support portion along the first direction, and the second direction is parallel to the upper surface of the cover; The blocking portion is filled in the second groove, and a surface of the blocking portion is flush with a surface of the supporting portion.

11. The protective cover according to claim 10, wherein: The blocking portion has a plurality of first grooves therein, the plurality of first grooves are distributed in a one-to-one correspondence within the plurality of second grooves, and the first grooves do not penetrate the blocking portion along the first direction.

12. A method for manufacturing a protective cover, characterized in that: The steps include: forming a cover, the cover including a barrier portion, the barrier portion being made of a composite material including an inorganic material and an organic material, and the cover including an upper surface and a lower surface oppositely distributed along a first direction, the lower surface of the cover being used to cover an optical element region of the optical integrated chip; A first groove is formed inside the blocking portion, and the first groove extends from the lower surface of the cover along the first direction to the inside of the cover.

13. The method for manufacturing a protective cover according to claim 12, wherein: The inorganic material includes any one of silicon, silicon oxide, silicon carbide, gallium nitride, gallium arsenide, indium phosphide and lithium tantalate, or a combination of two or more thereof; The organic material includes epoxy resin.

14. The method for manufacturing a protective cover according to claim 12, wherein: The specific steps of forming the cover body include: forming a flat support portion, the support portion being made of silicon, the support portion extending along a second direction, and the support portion including a front surface and a back surface that are oppositely distributed along the first direction, the second direction being parallel to the upper surface of the cover; A composite material is deposited on the front surface of the support portion to form the blocking portion, so as to constitute the cover body including the support portion and the blocking portion.

15. The method for manufacturing a protective cover according to claim 14, wherein: The specific steps of forming the first groove inside the blocking portion include: The blocking portion is grooved starting from a surface of the blocking portion facing away from the supporting portion to form a plurality of first grooves, each of the first grooves passes through the blocking portion along the first direction, and the plurality of first grooves are spaced apart along the second direction.

16. The method for manufacturing a protective cover according to claim 12, wherein: The specific steps of forming the cover body include: forming a support portion including a transverse support portion and a longitudinal support portion, wherein the transverse support portion extends along a second direction, the transverse support portion includes a top surface and a bottom surface that are oppositely distributed along the first direction, the longitudinal support portion is perpendicularly connected to a middle portion of the top surface of the transverse support portion along the first direction, and the second direction is parallel to the upper surface of the cover body; Composite material is deposited on the top surface of the lateral support portion to form the blocking portion covering the surface of the lateral support portion and distributed on opposite sides of the longitudinal support portion along the second direction, so as to constitute the cover body including the support portion and the blocking portion.

17. The method for manufacturing a protective cover according to claim 16, wherein: The specific steps of forming the first groove inside the blocking portion include: The blocking portion is grooved starting from the surface of the blocking portion facing away from the lateral supporting portion to form a plurality of first grooves, each of the first grooves passes through the blocking portion along the first direction, and the plurality of first grooves are distributed on opposite sides of the longitudinal supporting portion along the second direction.

18. The method for manufacturing a protective cover according to claim 12, wherein: The specific steps of forming the cover body include: providing a silicon substrate; The silicon substrate is patterned to form at least two isolation trenches in the silicon substrate, wherein the two isolation trenches separate the silicon substrate into a middle longitudinal support portion and end longitudinal support portions distributed around the periphery of the middle longitudinal support portion, and the remaining silicon substrate below the isolation trenches serves as a transverse support portion to constitute a support portion including the transverse support portion, the end longitudinal support portions, and the middle longitudinal support portion, wherein the end longitudinal support portion is perpendicularly connected to the end portion of the transverse support portion along the first direction, and the middle longitudinal support portion is perpendicularly connected to the middle portion of the transverse support portion along the first direction, and the second direction is parallel to the upper surface of the cover body; A composite material is deposited on the support portion to form the blocking portion covering the top surface of the lateral support portion and filling between the end longitudinal support portion and the middle longitudinal support portion, so as to constitute the cover body including the support portion and the blocking portion.

19. The method for manufacturing a protective cover according to claim 18, wherein: The specific steps of forming the first groove inside the blocking portion include: The blocking portion is grooved starting from the surface of the blocking portion facing away from the lateral support portion to form a plurality of first grooves, each of the first grooves passes through the blocking portion along the first direction, and the plurality of first grooves are distributed on opposite sides of the middle longitudinal support portion along the second direction.

20. The method for manufacturing a protective cover according to claim 12, wherein: The specific steps of forming the cover body include: providing a silicon substrate; patterning the silicon substrate to form at least two second trenches in the silicon substrate; Depositing a composite material in the second groove to form the blocking portion that fills the second groove; The silicon substrate below the second trench is removed, and the remaining silicon substrate is used as a supporting portion to form the cover body including the supporting portion and the blocking portion.

21. The method for manufacturing a protective cover according to claim 20, wherein: The specific steps of forming the first groove inside the blocking portion include: The blocking portion is grooved to form a plurality of first grooves, wherein the plurality of first grooves are distributed in a one-to-one correspondence within the plurality of second grooves, and the first grooves do not penetrate the blocking portion along the first direction.

22. A method for manufacturing an optoelectronic co-packaging structure, characterized in that: The steps include: forming an optical integrated chip, the optical integrated chip comprising a front surface and a back surface opposite to each other along a first direction, the optical integrated chip comprising an optical element region and an electrical chip region located outside the optical element region along a second direction, the optical element region being provided with a built-in optical element, the second direction being parallel to the front surface of the optical integrated chip; Mounting an electronic chip on the electrical chip region on the front side of the optical integrated chip, and electrically connecting the electronic chip and the optical integrated chip; Mounting a protective cover on the optical element area on the front side of the optical integrated chip, wherein the structure of the protective cover is as described in claim 1; forming a plastic sealing layer for sealing the electronic chip on the front surface of the optical integrated chip, wherein the upper surface of the cover is exposed to the surface of the plastic sealing layer; A portion of the protective cover is removed to form an opening exposing the optical element area, and the remaining portion of the blocking portion is located on the side of the plastic packaging layer.

23. The method for manufacturing an optoelectronic co-packaging structure according to claim 22, wherein: The cover body further includes a supporting portion extending along the second direction, the supporting portion including a front surface and a back surface oppositely distributed along the first direction, the blocking portion covering the front surface of the supporting portion, and the blocking portion having two first grooves therein, each of the first grooves penetrating the blocking portion along the first direction, and the two first grooves being arranged at intervals along the second direction, and the second direction being parallel to the upper surface of the cover body; The specific steps of attaching a protective cover to the optical element area on the front side of the optical integrated chip include: The protective cover is mounted on the optical element region with the blocking portion facing the optical integrated chip, and the blocking portion between the two first grooves covers the optical element.

24. The method for manufacturing an optoelectronic co-packaging structure according to claim 23, wherein: The specific steps of removing part of the protective cover include: removing the supporting portion to expose the blocking portion; The barrier portion between the two first trenches is removed by an adsorption process.

25. The method for manufacturing an optoelectronic co-packaging structure according to claim 22, wherein: The cover body further includes a support portion and two second grooves located in the support portion and spaced apart along a second direction, each second groove penetrating the support portion along the first direction, the blocking portion filling the second groove, and the surface of the blocking portion being flush with the surface of the support portion, the blocking portion having two first grooves inside, the two first grooves being distributed in a one-to-one correspondence within the two second grooves, and the first grooves not penetrating the blocking portion along the first direction, and the second direction being parallel to the upper surface of the cover body; The specific steps of attaching a protective cover to the optical element area on the front side of the optical integrated chip include: The protective cover is mounted on the optical element region in a direction in which the first grooves face the optical integrated chip, and the supporting portion between two first grooves covers the optical element.

26. The method for manufacturing an optoelectronic co-packaging structure according to claim 25, wherein: The specific steps of removing part of the protective cover include: performing a groove process on the blocking portion in the second groove to form a third groove communicating with the first groove; The blocking portion and the supporting portion between the two first grooves are removed by using an adsorption process.

27. An optoelectronic co-packaging structure, characterized in that: The method for manufacturing an optoelectronic co-packaging structure as claimed in claim 22 is used to form the structure; The optoelectronic co-packaging structure comprises: An optical integrated chip comprising a first main surface and a second main surface disposed opposite to each other along a first direction, the optical integrated chip comprising an optical element region and an electrical chip region located outside the optical element region along a second direction, wherein a built-in optical element is disposed within the optical element region, and the second direction is parallel to the first main surface of the optical integrated chip; an electronic chip mounted on the electrical chip region of the first main surface of the optical integrated chip and electrically connected to the optical integrated chip; A plastic encapsulation layer is located on the first main surface of the optical integrated chip and encapsulates the electronic chip. The plastic encapsulation layer has an opening that penetrates the plastic encapsulation layer along the first direction and exposes the optical element area. Part of the blocking portion is located on the side of the plastic encapsulation layer facing the opening.

28. The optoelectronic co-packaging structure according to claim 27, characterized in that: The blocking portion directly covers the side surface of the plastic packaging layer facing the opening.

29. The optoelectronic co-packaging structure according to claim 27, wherein: Also includes: The supporting portion covers the side surface of the plastic sealing layer facing the opening, the blocking portion covers the surface of the supporting portion facing away from the plastic sealing layer, and the material of the supporting portion is silicon.

30. The optoelectronic co-packaging structure according to claim 29, characterized in that: A thickness of the supporting portion along the second direction is greater than a thickness of the blocking portion along the second direction.

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