Chip management method, system and storage medium

Abstract

The application discloses a kind of chip management method, system and storage medium, belong to chip management technical field.The method includes the following steps: S1: chip and wafer management data are entered into database;S2: test data are bound with the ID of chip and are marked test condition and then imported into database;S3: parameter group is selected in parameter interface, and test frequency is filtered, then dynamic stacking generates management graph.The application effectively manages data, discards the traditional, cumbersome, complex local storage data file mode, further prevents the loss of file.Convenient for users to find and extract data, can quickly retrieve the required data, save search time, improve work efficiency.For R&D personnel, the generation and download function of graph provide a better data analysis platform for R&D personnel, save data processing steps.

Description

Technical Field

[0001] This invention relates to the field of chip management technology, and in particular to a chip management method, system and storage medium. Background Technology

[0002] Currently, with the rapid development of the semiconductor industry, chip research and development has entered a new phase, and a large amount of test data is constantly being generated. Therefore, the standardized management of chips is gradually becoming more systematic.

[0003] Traditional chip data management methods rely heavily on local file storage (such as Excel spreadsheets and text files), which suffers from problems such as data fragmentation, low storage efficiency, and susceptibility to data loss. Especially in chip R&D and manufacturing, which involve massive amounts of parameter data (such as test files in .s2p and .xls formats), wafer batch information, and experimental notes, traditional methods struggle to achieve efficient data integration and rapid retrieval, forcing R&D personnel to spend significant time on data organization and cross-file matching. Furthermore, local storage lacks a unified security management mechanism, making data vulnerable to loss due to accidental operations or hardware failures, and it struggles to support multi-user collaborative operations, severely hindering R&D efficiency. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a chip management method, system and storage medium.

[0005] The objective of this invention is achieved through the following technical solution: The first aspect of this invention provides a chip management method, comprising the following steps:

[0006] S1: Input the management data of chips and wafers into the database;

[0007] S2: Bind the test data to the chip ID, label the test conditions, and then import it into the database;

[0008] S3: Select parameter groups in the parameter interface, filter the test frequency, and then dynamically stack to generate management curves.

[0009] Preferably, the management data includes model number, batch number, and experimental remarks information; step S1 further includes the following steps:

[0010] A distributed architecture is used to build a database management system. MySQL operation statements are used to enable users to add, delete, modify, and query chip and wafer information, and to complete the database entry of chip and wafer information.

[0011] Preferably, step S2 further includes the following steps:

[0012] The parameter files in .s2p and .xls formats are parsed using a parsing algorithm to extract the parameter data. Each parameter column is then matched against the corresponding columns in the predefined chip information table and chip parameter table in the MySQL database. The parsed parameter data is written to the database line by line using MySQL insert statements. During file upload, the parameter file is labeled with a chip ID, and this chip ID is bound to the ID column in the chip information table via a MySQL foreign key attribute, enabling multi-table join queries. Simultaneously, test condition information is associated with the parameter data and stored in the database.

[0013] Preferably, step S3 further includes the following steps:

[0014] Based on the user's input query conditions, test parameter information is extracted from the database and grouped according to the test conditions to generate a front-end table; the test frequency range and checkbox filtering conditions selected by the user through the front-end interface are received, and the filtered frequency data and corresponding values ​​are combined into (x,y) coordinate format to generate a one-dimensional array; the one-dimensional array is grouped and reorganized according to the chip ID and test conditions to form a list of data with a two-dimensional array structure; the two-dimensional array is passed to the front-end curve generation module, and interactive curve graphics are generated based on the ECharts plugin, supporting users to dynamically scale the curve, save the image, and stack multiple curves.

[0015] Preferably, the MySQL operation statements include INSERT, DELETE, UPDATE, and SELECT statements, and the chip information and wafer information are associated through a primary key-foreign key relationship.

[0016] Preferably, the .s2p file is a Touchstone format file; the .xls file is an Excel format file, containing at least one of the chip and wafer process parameters and electrical characteristic parameters; the test condition information includes at least one of temperature range, voltage range, and test timestamp, and is bound and stored with the chip parameter data through a many-to-one relationship.

[0017] Preferably, the parsing algorithm includes:

[0018] The parsing of .s2p files uses regular expression matching and row / column splitting techniques;

[0019] The parsing of .xls files is based on the Apache POI library to extract data and dynamically map it to the database table structure.

[0020] Preferably, the front-end curve generation module achieves dynamic interaction in the following ways:

[0021] Based on the ECharts data visualization interface, convert two-dimensional arrays into curve coordinate points;

[0022] Implement user zooming / scaling operations on curve images using JavaScript event listeners;

[0023] Export the selected curve range as a PNG or JPG image using Canvas technology.

[0024] A second aspect of the present invention provides: a chip management system for implementing any of the above-described chip management methods, comprising:

[0025] The data entry module is used to enter management data of chips and wafers into the database;

[0026] The data binding module is used to bind test data to the chip's ID, annotate test conditions, and then import the data into the database.

[0027] The curve generation module is used to select parameter groups and filter test frequencies in the parameter interface, and then dynamically stack and generate management curves.

[0028] A third aspect of the present invention provides: a computer-readable storage medium storing computer-executable instructions, wherein when the computer-executable instructions are loaded and executed by a processor, any of the above-described chip management methods are implemented.

[0029] The beneficial effects of this invention are:

[0030] 1) Data is effectively managed, abandoning the traditional, cumbersome, and complex method of storing data files locally, further preventing file loss.

[0031] 2) It facilitates users in searching and retrieving data, enabling them to quickly retrieve the data they need, saving search time and improving work efficiency.

[0032] 3) For R&D personnel, the ability to generate and download graphs provides a better data analysis platform and saves data processing steps.

[0033] 4) Data is processed during import, saving staff operating steps. At the same time, the data processing function is integrated into the chip management system, making the management system more diverse and complete. Attached Figure Description

[0034] Figure 1 This is a flowchart of the chip management method. Detailed Implementation

[0035] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] See Figure 1 The first aspect of this invention provides: a chip management method, comprising the following steps:

[0037] S1: Input the management data of chips and wafers into the database;

[0038] S2: Bind the test data to the chip ID, label the test conditions, and then import it into the database;

[0039] S3: Select parameter groups in the parameter interface, filter the test frequency, and then dynamically stack to generate management curves.

[0040] In this embodiment, users are typically chip R&D personnel, chip production testing team members, department leaders, and relevant staff. Each user logs in according to their assigned role, and the system displays functional modules appropriate to that role. The primary function is to store chip information, facilitating CRUD operations for users. Secondly, for R&D personnel, it stores chip parameters and generates amplitude, phase, and other graphs, enabling data analysis and organization. It effectively stores chip and wafer data, and, combined with the high performance, stability, scalability, flexibility, and security of the MySQL database, provides excellent support for the construction and operation of the management system.

[0041] The curve generation method in this invention can dynamically stack multiple curves, allowing for curve stacking based on data generated from different chips and under different test conditions, not limited to different test conditions for the same chip. The parameter input section of this invention utilizes a specific algorithm to help testers derive p_1 data, avoiding the need for secondary data processing before importing. The overall system's data structure links each entity within the system, improving data query efficiency, standardizing chip management, saving staff time, and increasing efficiency, bringing significant convenience to the industry.

[0042] In some embodiments, the management data includes model number, batch number, and experimental remarks information; step S1 further includes the following steps:

[0043] A distributed architecture is used to build a database management system. MySQL operation statements are used to enable users to add, delete, modify, and query chip and wafer information, and to complete the database entry of chip and wafer information.

[0044] In this embodiment, the distributed architecture adopts the Java EE development approach.

[0045] In some embodiments, S2 further includes the following steps:

[0046] The parameter files in .s2p and .xls formats are parsed using a parsing algorithm to extract the parameter data. Each parameter column is then matched against the corresponding columns in the predefined chip information table and chip parameter table in the MySQL database. The parsed parameter data is written to the database line by line using MySQL insert statements. During file upload, the parameter file is labeled with a chip ID, and this chip ID is bound to the ID column in the chip information table via a MySQL foreign key attribute, enabling multi-table join queries. Simultaneously, test condition information is associated with the parameter data and stored in the database.

[0047] In this embodiment, parameter files in .s2p and .xls formats are parsed and read using a parsing algorithm. Each column corresponds one-to-one with the columns in the MySQL table storing chip information and chip parameters. Data is added to the MySQL database row by row using MySQL insert statements. During queries, the data is recombined based on the query conditions input from the front-end interface. When uploading files, a dedicated column is used to label the chip ID when the file information is entered into the database. This column is then bound to the ID column of the chip information table using a foreign key attribute in MySQL. This method effectively enables multi-table queries. Test conditions are then labeled and entered into the database.

[0048] In some embodiments, S3 further includes the following steps:

[0049] Based on the user's input query conditions, test parameter information is extracted from the database and grouped according to the test conditions to generate a front-end table; the test frequency range and checkbox filtering conditions selected by the user through the front-end interface are received, and the filtered frequency data and corresponding values ​​are combined into (x,y) coordinate format to generate a one-dimensional array; the one-dimensional array is grouped and reorganized according to the chip ID and test conditions to form a list of data with a two-dimensional array structure; the two-dimensional array is passed to the front-end curve generation module, and interactive curve graphics are generated based on the ECharts plugin, supporting users to dynamically scale the curve, save the image, and stack multiple curves.

[0050] In this embodiment, test parameter information is queried and grouped according to test conditions, then displayed in a table format on the front-end interface. Users simply select the corresponding checkboxes, filter the test frequencies, and pass them to the back-end code. The code combines the frequencies and their corresponding values ​​into (x, y) coordinates, then integrates all coordinates into a one-dimensional array (e.g., (x1, y1), (x2, y2)...). Finally, the elements in this array are grouped according to the chip ID and test conditions, resulting in a two-dimensional array list. This list is then passed to the front-end curve generation code to generate the corresponding curve graph. The curve display utilizes the echarts plugin, providing high flexibility in image display. Users can zoom in and out on the curve within a range and save the desired curve graph.

[0051] In some embodiments, the MySQL operation statements include INSERT, DELETE, UPDATE, and SELECT statements, and the chip information and wafer information are associated through a primary key-foreign key relationship.

[0052] In some embodiments, the .s2p file is a Touchstone format file; the .xls file is an Excel format file, containing at least one of the process parameters and electrical characteristic parameters of the chip and wafer; the test condition information includes at least one of temperature range, voltage range, and test timestamp, and is bound and stored with the chip parameter data through a many-to-one relationship.

[0053] In some embodiments, the parsing algorithm includes:

[0054] The parsing of .s2p files uses regular expression matching and row / column splitting techniques;

[0055] The parsing of .xls files is based on the Apache POI library to extract data and dynamically map it to the database table structure.

[0056] In some embodiments, the front-end curve generation module achieves dynamic interaction in the following ways:

[0057] Based on the ECharts data visualization interface, convert two-dimensional arrays into curve coordinate points;

[0058] Implement user zooming / scaling operations on curve images using JavaScript event listeners;

[0059] Export the selected curve range as a PNG or JPG image using Canvas technology.

[0060] A second aspect of the present invention provides: a chip management system for implementing any of the above-described chip management methods, comprising:

[0061] The data entry module is used to enter management data of chips and wafers into the database;

[0062] The data binding module is used to bind test data to the chip's ID, annotate test conditions, and then import the data into the database.

[0063] The curve generation module is used to select parameter groups and filter test frequencies in the parameter interface, and then dynamically stack and generate management curves.

[0064] A third aspect of the present invention provides: a computer-readable storage medium storing computer-executable instructions, wherein when the computer-executable instructions are loaded and executed by a processor, any of the above-described chip management methods are implemented.

[0065] The above description is merely a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related technologies or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A chip management method, characterized by: The method comprises the following steps: S1: inputting management data of the chip and wafer into a database; S2: binding test data with the ID of the chip and marking test conditions, and then importing the data into the database; S3: selecting a parameter group in a parameter interface, screening test frequencies, and then dynamically stacking to generate a management curve diagram. The S2 further comprises the following steps: The parameter data in the parameter file is extracted by analyzing the.s2p format and.xls format parameter files through an analysis algorithm, and each column of parameter is matched with the corresponding column of the chip information table and the chip parameter table in the MySQL database; the parameter data after analysis is written into the database in a row-by-row reading mode through the insertion statement of MySQL; in the process of file uploading, the chip ID is marked for the parameter file, and the chip ID is bound with the ID column in the chip information table through the foreign key attribute of MySQL, so that the multi-table association query is realized; at the same time, the test condition information is associated and stored with the parameter data in the database; The S3 further comprises the following steps: According to the query conditions input by the user, the test parameter information is extracted from the database, and a front-end table is generated according to the test conditions; the frequency data after screening is combined with the corresponding numerical value into (x, y) coordinate format to generate a one-dimensional array according to the test frequency range and the checkbox filtering conditions selected by the user through the front-end interface; the one-dimensional array is grouped and reorganized according to the chip ID and the test conditions to form list data in a two-dimensional array structure; the two-dimensional array is transmitted to the front-end curve generation module, and an interactive curve graph is generated based on the ECharts plug-in, which supports dynamic scaling, image saving and multiple curve stacking operations of the user on the curve; The front-end curve generation module realizes dynamic interaction in the following way: The two-dimensional array is converted into curve coordinate points based on the data visualization interface of ECharts; The scaling operation of the user on the curve image is realized through JavaScript event listening; The selected curve interval is exported as a PNG or JPG format image through Canvas technology.

2. The chip management method of claim 1, wherein: The management data comprises model number, batch number and experiment note information; the S1 further comprises the following steps: A distributed architecture is adopted to build a database management system, and the chip information and wafer information are input into the database through the MySQL operation statement to realize the functions of adding, deleting, modifying and querying the chip information and wafer information.

3. The chip management method of claim 2, wherein: The MySQL operation statement comprises INSERT, DELETE, UPDATE and SELECT statements, and the chip information and wafer information are associated through the primary key-foreign key relationship.

4. The chip management method of claim 1, wherein: The.s2p file is a Touchstone format file; the.xls file is an Excel format file, which comprises at least one of process parameters and electrical characteristic parameters of the chip and wafer; the test condition information comprises at least one of temperature range, voltage range and test timestamp, and is bound and stored with the chip parameter data in a many-to-one relationship.

5. The chip management method of claim 1, wherein: The analysis algorithm comprises: The analysis of the.s2p file adopts regular expression matching and row and column segmentation technology; The analysis of the.xls file is based on the Apache POI library to realize data extraction and dynamic mapping with a database table structure.

6. A chip management system, characterized by: The chip management method comprises the following steps: A data entry module is configured to enter management data of the chips and wafers into a database. A data binding module is configured to bind test data with IDs of the chips, mark test conditions, and then import the test data into the database. A curve generation module is configured to select a parameter group in a parameter interface, filter test frequencies, and then dynamically stack to generate a management curve diagram.

7. A computer-readable storage medium, characterized in that: The computer readable storage medium stores computer executable instructions, and when the computer executable instructions are loaded and executed by the processor, the chip management method according to any one of claims 1-5 is implemented.

Images