Loading cavity structure with lug detection function

Abstract

The invention discloses a loading cavity structure with a lug detection function, and belongs to the technical field of semiconductor detection, the cavity structure comprises a cavity, the cavity is provided with an inlet and an outlet allowing a wafer to enter and leave, bracket assemblies are arranged in the cavity, and the bracket assemblies are symmetrically arranged on the two sides of a wafer moving path and used for jointly supporting the wafer. And a laser sensor is arranged outside the cavity and is used for carrying out lug detection on the front and back positions of the wafer in the moving direction. The vacuum transmission system can be suitable for efficient and stable transmission of wafers in a vacuum environment, and the technical problem that the wafers deviate from the bracket and are not detected in time in an existing vacuum transmission system is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor detection, and in particular relates to a loading chamber structure with a convex piece detection function. Background Art

[0002] During the wafer manufacturing process, when the wafer arrives at the equipment end and enters the equipment for process processing, a robot or manual labor is required to place the wafer inside into the equipment's Loadlock (transfer chamber). When the robotic arm places the wafer in the corresponding slot, the vibration of the motor and the inertia during movement may cause the material box (wafer rack) to tilt downward toward the feed end of the wafer rack when the robotic arm is leveled. When manually placing the wafer, it is impossible to put it in a horizontal position like the robot and then enter the slot. It is possible that the wafer rack will be pressed down at the feed end of the wafer rack, causing its feed end to tilt downward. In the above situations, the wafer will protrude from the slot and form a bulge on the wafer rack.

[0003] Most existing technologies rely on maintenance personnel visually inspecting wafer alignment after the system has been running for a period of time. This is time-consuming and labor-intensive. Furthermore, due to the compact structure and numerous components of most LL cavities, the wafer's position on its carrier is difficult to observe. Maintenance personnel can easily misjudge the wafer's status, resulting in significant financial losses.

[0004] US Patent Publication No. US12330289B2 discloses a method for determining the center position of a semiconductor wafer. The method uses an actuator at the end of a robotic arm to carry the semiconductor wafer. The actuator has a specific aperture, which is partially obstructed when the wafer is loaded. The system moves the robotic arm to align the aperture with a sensor, which detects changes in obstruction and simultaneously records the position data. Based on this information, a processor dynamically calculates the actual center coordinates of the wafer and ultimately precisely places the wafer at the target location, ensuring that its calculated center coincides with the preset center. The core technology lies in leveraging the inherent structure of the actuator combined with real-time obstruction detection to achieve dynamic positioning and precise alignment of the wafer center. The applicant believes that this solution still has room for improvement: the integrated actuator at the end of the robotic arm makes it difficult for the robotic arm to enter and exit narrow wafer transport channels and has limited requirements for the chamber entrance and exit structures. The overall system is complex, requiring the coordinated calculation and diagnosis of multiple parameters, making it difficult to maintain. Therefore, a solution that can monitor wafer position in real time and promptly detect protrusion problems is urgently needed. Summary of the Invention

[0005] The object of the present invention is to provide a loading chamber structure with a convex piece detection function and a wafer convex piece detection method, which has the advantages of real-time monitoring of wafer position, timely detection of convex piece problems and improved detection efficiency.

[0006] The technical solutions adopted by the present invention to achieve the above-mentioned purpose are: A loading chamber structure with a convex piece detection function includes: a cavity, the cavity is provided with an inlet and an outlet allowing wafers to enter and exit, a bracket assembly is provided in the cavity, the bracket assembly is symmetrically arranged on both sides of the wafer movement path, and is used to jointly support the wafer; a laser sensor is provided outside the cavity, and the laser sensor is used to detect convex pieces at the front and rear positions in the wafer movement direction.

[0007] Preferably, the inlet direction is different from the outlet direction, so that the path of the wafer entering the cavity intersects with the path of the wafer leaving the cavity and there is an angle between them. The angle is an obtuse angle, and each bracket assembly is distributed along the straight line where the bisector of the angle is located.

[0008] Preferably, the bracket assembly includes a support plate, and a support plate of a bracket assembly is provided with a limiting column on the edge so that the wafer is limited to deviate a specified distance on one side in the moving path, and the specified distance range is 1mm to 4mm.

[0009] Preferably, there are at least two groups of laser sensors, each group has two laser sensors and is located on both sides of the wafer, at least one group of laser sensors is arranged along the path of the wafer entering the cavity, and at least one group of laser sensors is arranged along the path of the wafer leaving the cavity.

[0010] Preferably, the emitting end of the laser sensor is arranged perpendicular to the wafer. When the wafer is supported by the bracket assembly, the detection range of the laser sensor is the position of the wafer offset by a fixed distance on one side along its moving direction, and the fixed distance range is 1mm to 4mm.

[0011] Preferably, there are at least two cavities stacked up and down, and the bracket assemblies in each cavity are arranged at equal intervals in the stacking direction, so that multiple parallel wafers can be loaded in the same cavity.

[0012] Preferably, the cavity has a cover plate, an opening is provided on the cover plate, transparent glass is provided in the opening, the transparent glass is located between the opening and the laser sensor, and the laser sensor detects convex pieces on the wafer through the transparent glass.

[0013] Preferably, a pressing piece is provided in the opening, and the transparent glass is installed inside the opening through the pressing piece to achieve sealing of the cavity at the opening.

[0014] Preferably, the bracket assembly further comprises a mounting block, the support plates are connected to the inner wall of the cavity via the mounting block, and the symmetrically arranged support plates are independent of each other and do not contact each other.

[0015] Preferably, a wafer bump detection method is applied to the aforementioned loading chamber structure with a bump detection function, comprising the following steps: Step 1: A robotic arm carries a wafer into the chamber from an entrance and places the wafer on a bracket assembly; Step 2: A laser sensor detects bumps along the wafer's travel path. When the laser sensor detects a wafer bump exceeding a preset distance, an alarm signal is triggered. Step 3: The robotic arm carries the inspected wafer out of the chamber from an exit.

[0016] Compared with the existing technology, the present invention has the following beneficial effects: the separate inlet and outlet design avoids path overlap, shortens the transmission cycle and improves throughput; the external laser sensor is easy to maintain and avoids vacuum contamination; the symmetrical bracket and the laser sensor work together to achieve left and right limiting and front and back monitoring, and the detection is more comprehensive; the obtuse angle path and angle bisector support layout reduce mechanical complexity and offset risk; the limit column constrains offset with a simple mechanical structure to reduce cost; the swivel drives the sensor arc trajectory detection to improve efficiency and accuracy; the pneumatically driven swivel realizes dynamic detection and cleans transparent glass, improving stability; the multi-cavity stacking design improves space utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a loading chamber with a convex piece detection function; Figure 2 Schematic diagram of the arrangement of two groups of laser sensors; Figure 3 This is a schematic diagram of the position of the transparent glass and the laser sensor; Figure 4 A schematic diagram of a carrier assembly supporting a wafer; Figure 5 Schematic diagram of the import and export directions; Figure 6 This is a schematic structural diagram of a pressing member according to a second embodiment of the present invention; Figure 7 Schematic diagram of the structure of the baffle and the spring in the third embodiment of the present invention; Figure 8 Schematic diagram of the position of the sheet and the laser sensor in the third embodiment of the present invention.

[0018] Reference numerals: cavity 1; cover plate 11; inlet 21; outlet 22; bracket assembly 3; support plate 31; limiting column 32; mounting block 33; laser sensor 4; transparent glass 5; pressing member 6; inner ring 61; outer ring 62; swivel 7; sheet 71; air pipe 72; spring 73; baffle 8. DETAILED DESCRIPTION

[0019] The technical solution of the present invention is further described in detail below with reference to the specific embodiments and the accompanying drawings: Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] Example 1: A loading chamber structure with a protrusion detection function includes: a cavity 1, the cavity 1 is provided with an inlet 21 and an outlet 22 for allowing wafers to enter and exit, a bracket assembly 3 is provided in the cavity 1, the bracket assembly 3 is symmetrically arranged on both sides of the wafer movement path, and is used to jointly support the wafer, and a laser sensor 4 is provided outside the cavity 1, and the laser sensor 4 is used to detect protrusions at the front and rear positions in the moving direction of the wafer. When the robot carries the wafer into the cavity 1 through the inlet 21, the symmetrically arranged bracket assemblies 3 jointly support the edge of the wafer. During the transmission process, the laser sensor 4 continuously monitors the projected position of the front and rear edges of the wafer in the moving direction. If the installation position of the wafer on the bracket assembly 3 is offset by a certain distance, its edge will block the sensor detection area, triggering a signal to determine the offset.

[0021] The above solution utilizes a separate inlet 21 and outlet 22 design, avoiding the robot's reversal caused by overlapping wafer entry and exit paths in conventional single-side inlet solutions, shortening the single transfer cycle and improving the overall system throughput. Furthermore, the laser sensor 4 is mounted outside the chamber 1, eliminating the need for contact with the internal vacuum environment. This prevents vacuum contamination from sensor materials and facilitates subsequent maintenance and debugging, resolving the issue of difficult maintenance of components within the compact chamber 1. Combining the physical limits of the symmetrical brackets with the active detection of the laser sensor 4, a coordinated control system for left and right support limits and front and rear real-time monitoring during wafer transfer is established. This provides a more comprehensive approach than single-direction detection, reducing the risk of equipment failure caused by protrusions.

[0022] The orientation of the inlet 21 is different from that of the outlet 22, so that the path for the wafer to enter the cavity 1 intersects with the path for the wafer to leave the cavity 1 and there is an angle between them. The angle is an obtuse angle, and each bracket assembly 3 is distributed along the straight line where the bisector of the angle is located. When the bracket assembly 3 is distributed along the bisector, the support point is located on the symmetrical center line of the wafer movement path. The wafer is evenly stressed on both sides during the entry and exit process, avoiding the accumulation of unilateral offsets caused by sudden changes in the path. When the wafer moves in an obtuse angle path, the symmetrical support of the bracket assembly 3 can offset the inertial offset trend caused by the path turning. Compared with the existing technology, traditional wafer transmission paths usually adopt a straight line or right-angle turning design, which requires the robot to frequently adjust its posture and the support point distribution is asymmetric. This solution reduces the complexity of mechanical movement by combining the obtuse angle path with the angle bisector support layout, and offsets the offset risk caused by the path turning through symmetrical support. Through the above technical solution, the present application can reduce the probability of position deviation of the wafer during the turning process, reduce the number of times the robot posture is adjusted, and at the same time maintain the balance state of the wafer in the moving path through the symmetrical support structure, avoiding the protrusion problem caused by unilateral force.

[0023] The bracket assembly 3 includes a support plate 31. Each support plate 31 of the bracket assembly 3 is provided with a limiting post 32 on its edge, which limits the wafer from deflecting on one side of the wafer along its travel path by a specified distance, ranging from 1 mm to 4 mm. The limiting post 32 is a cylindrical protrusion fixed to the edge of the support plate 31. Specifically, it can be formed from stainless steel and then attached to the edge of the support plate 31 by threading or welding. The bracket assembly 3 supports the wafer through the symmetrically arranged support plates 31. When the robot places the wafer on the support plate 31, the limiting post 32 maintains parallel contact with the edge of the wafer. During the wafer's transport along the travel path, if the wafer deflects laterally due to robot error, the limiting post 32 will contact the edge of the wafer and prevent it from deflecting further than the specified distance. The distance between the limiting post 32 and the edge of the wafer is set, for example, between 1 mm and 4 mm. This distance range allows for slight position fluctuations during normal wafer movement while preventing the wafer from escaping the support area due to excessive deflection.

[0024] The limiting posts 32 on the single support plate 31 allow the wafer to pass through while also physically restricting the wafer from unilateral deviation with a simple mechanical structure, reducing the risk of the wafer becoming unsupported without the need for additional electronic detection equipment. Furthermore, the integrated design of the limiting posts 32 and support plate 31 reduces the complexity of the components within the vacuum chamber 1, facilitating a stable seal in a vacuum environment.

[0025] There are at least two groups of laser sensors 4, each consisting of two laser sensors 4 located on either side of the wafer. At least one group of laser sensors 4 is arranged along the path the wafer enters chamber 1, and at least one group of laser sensors 4 is arranged along the path the wafer leaves chamber 1. Laser sensor 4 is a device that uses a laser beam for non-contact position detection. Specifically, it can be implemented as a reflective sensor with separate transmitting and receiving ends. The wafer edge position is determined by detecting whether the laser beam is blocked.

[0026] When the wafer enters the cavity 1 through the robot, the four groups of laser sensors arranged along the entry path perform synchronous detection on the front and back ends of the wafer. If the position deviation of the wafer exceeds a certain range after being loaded on the support plate 31, the laser beam will be blocked and a signal will be triggered. Similarly, when the wafer leaves the cavity 1, another group of laser sensors 4 arranged along the exit path monitors both sides of the wafer in real time. Since the two groups of sensors cover different movement stages respectively, detection blind spots can be avoided. This solution realizes full dynamic monitoring of the wafer when entering and exiting the cavity 1 through the coordinated layout of multiple groups of sensors, effectively solving the problem of wafer deviation not being discovered in time due to transmission errors of the robot.

[0027] The emitting end of the laser sensor 4 is arranged perpendicular to the wafer. When the wafer is supported by the bracket assembly 3, the detection range of the laser sensor 4 is the position of the wafer offset by a fixed distance on one side along its moving direction, and the fixed distance range is 1mm to 4mm. The arrangement of the emitting end perpendicular to the wafer means that the projection direction of the laser beam forms a 90-degree angle with the wafer plane. Specifically, this can be achieved by adjusting the angle of the laser sensor 4 using a mounting bracket. This arrangement ensures that the detection beam forms a stable contact area with the edge of the wafer. The detection range is the position of the wafer offset by a fixed distance on one side, which means that the detection area of ​​the laser sensor 4 covers the preset offset range of the wafer edge in the moving direction. Specifically, this can be achieved by adjusting the transmitting power or receiving sensitivity of the laser sensor 4. This range is set to 1mm to 4mm to balance the detection accuracy and the false alarm rate.

[0028] As the wafer is supported by the carrier assembly 3 and transported along the moving path, the laser beam emitted by the laser sensor 4 is projected onto the detection area at the wafer edge. If the wafer deviates unilaterally, its edge will exceed the detection range of the laser sensor 4. The unobstructed portion of the laser beam is captured by the receiver, generating a signal change. When the deviation reaches the upper limit of the fixed distance range, the system determines that the protrusion is abnormal and triggers an alarm mechanism.

[0029] There are at least two cavities 1 stacked up and down, and the bracket assemblies 3 in each cavity 1 are arranged at equal intervals in the stacking direction, so that multiple parallel wafers can be loaded in the same cavity 1.

[0030] The chamber 1 has a cover plate 11 with an opening in it. A transparent glass 5 is positioned within the opening. The transparent glass 5 is positioned between the opening and the laser sensor 4. The laser sensor 4 detects wafer bumps through the transparent glass 5. The cover plate 11 is a closed structure covering the top of the chamber 1.

[0031] The cover plate 11 provides a detection channel for the laser sensor 4 through an opening, and the transparent glass 5 is embedded in the opening and covers its opening area. The laser sensor 4 is installed on the outside of the cavity 1 and aligned with the opening. The laser beam it emits penetrates the transparent glass 5 and irradiates the wafer surface. The reflected signal is used to determine whether the wafer is offset. The transparent glass 5 is fixed to the opening by a clamping member 6. For example, an annular metal pressure ring is used in conjunction with a sealing rubber ring to press the edge of the glass against the inner wall of the opening. This prevents leakage of the vacuum environment inside the cavity 1 due to the existence of the opening while achieving the optical detection function. Traditional detection solutions usually directly open an exposed detection hole on the surface of the cavity 1 or use a non-sealed structure to install the sensor, making the vacuum environment susceptible to external contamination or pressure imbalance. However, this solution, through the combination of transparent glass 5 and clamping member 6, retains the detection capability of the laser sensor 4 and maintains the vacuum integrity of the cavity 1 through physical isolation and sealing structure, resolving the contradiction between detection function and sealing requirements. Non-contact detection is achieved, which is suitable for semiconductor process scenarios with strict vacuum requirements.

[0032] A pressing member 6 is provided in the opening, and the transparent glass 5 is installed inside the opening through the pressing member 6 to achieve sealing of the cavity 1 at the opening.

[0033] The bracket assembly 3 further includes a mounting block 33 , through which the support plates 31 are connected to the inner wall of the cavity 1 , and the symmetrically arranged support plates 31 are independent of each other and do not contact each other.

[0034] A wafer bump detection method is applied to the above-mentioned loading chamber structure with a bump detection function, comprising the following steps: Step 1: The robot carries the wafer into the chamber 1 from the entrance 21 and places the wafer on the bracket assembly 3 Step 2: The laser sensor 4 detects wafer protrusions along the moving path. When the laser sensor 4 detects that the wafer protrusion exceeds a preset distance, an alarm signal is triggered. Step 3: The robot carries the detected wafer out of the chamber 1 from the exit 22.

[0035] Example 2: Based on the first embodiment of the present invention, a rotating ring 7 is provided outside the cavity 1. The rotating ring 7 is rotatable about its central axis and is mounted with two laser sensors 4. The two laser sensors 4 are symmetrically arranged along the plane containing the axis of the rotating ring 7. The laser sensors 4 emit laser light toward the edge of the wafer. Each laser sensor 4 has an arc-shaped movement trajectory between the two bracket assemblies 3. This movement trajectory is cocircular with the maximum allowable range of motion of the wafer on the bracket assemblies 3 in the projection direction. When the wafer deviates beyond the maximum range of motion in the movement direction, it blocks the laser light on the scanning path and triggers an alarm. The rotating ring 7 is provided with a rotation mechanism that drives the rotation.

[0036] The opening is an annular through groove, and the light-transmitting glass is annular, so that the circular trajectory of the laser can always pass through the light-transmitting glass.

[0037] The cavity 1 is fixed with baffles at both ends of the moving track, and a plate 71 is provided at the lower end of the rotating ring 7 to cooperate with the baffles to move the laser sensor 4 along the arc moving track to prevent the laser sensor 4 from scanning above the bracket assembly 3.

[0038] When the rotating mechanism drives the swivel 7 to rotate around its axis, it drives the two symmetrical laser sensors 4 to move along their respective arc-shaped moving trajectories, and performs continuous and linear protrusion detection on the front and rear positions of the wafer between the bracket assemblies 3. Without adding additional sensor arrangements, multi-position and continuous dynamic protrusion detection of the wafer can be achieved, which greatly improves the efficiency and accuracy of protrusion detection and reduces the possibility of missed detection.

[0039] This solution uses two sensors to detect multi-point wafer bumps in the front and rear directions of the wafer's movement. Combined with the technical solution of limiting the left and right positions of the wafer using limit posts 32, this allows dynamic detection of all wafer bump risk locations. This achieves high-precision, multi-point dynamic detection of wafer bumps while reducing hardware requirements and costs, significantly improving bump detection efficiency. The coordinated arrangement of the rotating ring 7 and the annular transparent glass 5 allows the two laser sensors 4 to share a single connection bracket, saving longitudinal space.

[0040] Example 3: On the basis of the second embodiment of the present invention, the clamping member 6 includes an inner ring 61 and an outer ring 62, and the rotating ring 7 forms an annular cavity with the inner ring 61, the outer ring 62 and the transparent glass 5. The rotating mechanism includes: an air pipe 72, one end of which is connected to the annular cavity and the other end is connected to the suction system. The sheet 71 is arranged at intervals along the moving trajectory. The sheet 71 is located in the annular cavity. There is an angle between the sheet 71 and the rotating ring 7 radially. When the suction system draws air through the air pipe 72, the airflow acts on the sheet 71 to make the rotating ring 7 rotate in one direction; the spring 73 is installed on the baffle 8 to provide the sheet 71 with a reset tension when the suction stops.

[0041] When the suction system is started, air continuously leaves the annular cavity from the air pipe 72 and forms an airflow, which acts on the sheet 71, causing the sheet 71 to drive the rotating ring to rotate unidirectionally. Under the restrictive effect of the baffle 8 on the sheet 71, the two laser sensors 4 move along their respective arc-shaped moving trajectories to detect the dynamic protrusions of the wafer. Under the action of continuous suction, the sheet 71 moves unidirectionally and squeezes the spring 73 of the baffle 8. After the suction is over, the sheet 71 loses its force, and the spring 73 recovers its deformation and acts on the sheet 71 to move in the opposite direction in the annular cavity, thereby driving the rotating ring 7 to rotate in the opposite direction, causing the laser sensor 4 to return to the initial detection position to obtain the displacement distance for the next dynamic protrusion detection.

[0042] The above scheme realizes the reciprocating movement of the laser sensor 4 on its respective arc-shaped moving trajectory, and only requires a single suction to achieve it. Compared with the contact-type rotation drive method, it reduces the vibration interference transmission, which is beneficial to the position stability of the wafer on the bracket assembly 3 and reduces the risk of protrusions. In addition, the suction airflow drive method, while realizing the dynamic detection of the laser sensor 4 on the arc-shaped moving trajectory, the suction system continuously sucks the airflow in the annular cavity through the air pipe 72, which can be beneficial to cleaning the dust attached to the transparent glass 5 to achieve the cleaning of the transparent glass 5, which is beneficial to the passage of the laser of the laser sensor 4, reducing the risk of the laser being scattered by dust when passing through the transparent glass 5, and improving the accuracy of the dynamic protrusion detection of the laser sensor 4. At the same time, it can also clean the debris generated by the rotational friction between the rotating ring 7 and the clamping member 6, improve the rotation smoothness, avoid jamming, and improve the continuity and smoothness of dynamic detection.

[0043] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A loading chamber structure with a convex piece detection function, comprising a chamber (1), characterized in that: The cavity (1) is provided with an inlet (21) and an outlet (22) for allowing wafers to enter and exit. A bracket assembly (3) is provided in the cavity (1). The bracket assembly (3) is symmetrically arranged on both sides of the wafer movement path and is used to jointly support the wafer. A laser sensor (4) is provided outside the cavity (1). The laser sensor (4) is used to detect the front and rear positions of the wafer in the movement direction. The direction of the inlet (21) is different from the direction of the outlet (22), so that the path for the wafer to enter the cavity (1) intersects with the path for the wafer to leave the cavity (1) and there is an angle between them.

2. The loading chamber structure with a protrusion detection function according to claim 1, characterized in that: The included angle is an obtuse angle, and each of the bracket components (3) is distributed along a straight line where the angle bisector of the included angle lies.

3. The loading chamber structure with a protrusion detection function according to claim 1, characterized in that: The bracket assembly (3) comprises a support plate (31), and a limiting column (32) is provided on the edge of the support plate (31) of the bracket assembly (3), so that the wafer is limited to deviate by a specified distance on one side in the moving path, and the specified distance range is 1 mm to 4 mm.

4. The loading chamber structure with a protrusion detection function according to claim 1, characterized in that: There are at least two groups of laser sensors (4), each group of laser sensors (4) has two laser sensors (4) and is located on both sides of the wafer, at least one group of laser sensors (4) is arranged along a path for the wafer to enter the cavity (1), and at least one group of laser sensors (4) is arranged along a path for the wafer to leave the cavity (1).

5. The loading chamber structure with a protrusion detection function according to claim 1, characterized in that: The emitting end of the laser sensor (4) is arranged perpendicular to the wafer. When the wafer is supported by the bracket assembly (3), the detection range of the laser sensor (4) is a position where the wafer is offset by a fixed distance on one side along its moving direction, and the fixed distance range is 1 mm to 4 mm.

6. The loading chamber structure with a protrusion detection function according to claim 1, characterized in that: There are at least two cavities (1) stacked up and down, and the bracket assemblies (3) in each cavity (1) are arranged at equal intervals in the stacking direction, so that multiple parallel wafers can be loaded in the same cavity (1).

7. The loading chamber structure with a protrusion detection function according to claim 1, characterized in that: The cavity (1) has a cover plate (11), an opening is provided on the cover plate (11), a transparent glass (5) is provided in the opening, the transparent glass (5) is located between the opening and the laser sensor (4), and the laser sensor (4) detects convex pieces of the wafer through the transparent glass (5).

8. The loading chamber structure with a protrusion detection function according to claim 7, characterized in that: A pressing piece (6) is provided in the opening, and the transparent glass (5) is installed inside the opening via the pressing piece (6) to achieve sealing of the cavity (1) at the opening.

9. The loading chamber structure with a protrusion detection function according to claim 3, characterized in that: The bracket assembly (3) further comprises a mounting block (33), the support plate (31) being connected to the inner wall of the cavity (1) via the mounting block (33), and the symmetrically arranged support plates (31) being independent of each other and not in contact.

10. A wafer bump detection method, applied to the loading chamber structure with a bump detection function according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: The robot carries the wafer into the chamber from the entrance and places the wafer on the bracket assembly; Step 2: The laser sensor detects the wafer protrusion in the direction of the moving path. When the laser sensor detects that the wafer protrusion exceeds the preset distance, an alarm signal is triggered; Step 3: The robot carries the inspected wafer out of the chamber from the exit.

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