Semiconductor pick-and-place device and test sorting machine

Abstract

The invention provides a semiconductor taking and placing device, which comprises a material tray assembly, a vacuum breaking assembly and a driving assembly, and is characterized in that the material tray assembly comprises a plurality of material grooves, a cavity and a vacuum device, and each material groove is used for placing a semiconductor; the cavity is communicated with a plurality of material grooves, a plurality of vacuum breaking nozzles are arranged in the cavity, and each vacuum breaking nozzle is communicated with the corresponding material groove; the vacuum device is communicated with the cavity and is used for outputting first gas to each material groove, and the first gas is used for vacuumizing each material groove and enabling the semiconductors to be adsorbed to the material grooves; the vacuum breaking assembly is used for being aligned with any vacuum breaking nozzle and outputting second gas to the corresponding material groove, and the second gas is used for conducting vacuum breaking on the corresponding material groove and enabling the semiconductor to be taken out of the material groove; the driving assembly is used for driving the material disc assembly to move so that any vacuum breaking nozzle can be aligned with the vacuum breaking assembly. In addition, the invention further provides a test sorting machine.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor pick-and-place device and a test sorting machine. Background Art

[0002] Fast and stable semiconductor pick-and-place technology is a crucial foundation for high-quality, high-yield output in high-temperature turret test and sorting machines. Existing technology uses controlled tray movement to direct the delivery of multiple troughs on the tray to the retrieving station. However, semiconductors are not fixed within the troughs during tray movement. High-speed movement can easily cause semiconductors to jump or tip over, impacting the high-quality, high-yield output of the test and sorting machine. Summary of the Invention

[0003] In view of this, it is necessary to provide a semiconductor pick-and-place device and a test sorter to stably place semiconductors on a tray assembly that can be driven to move, and to smoothly remove the stably placed semiconductors from the tray assembly.

[0004] In the first aspect, an embodiment of the present application provides a semiconductor picking and placing device, which includes a material tray assembly, a vacuum breaking assembly and a drive assembly. The material tray assembly includes a plurality of material slots, a cavity connected to the plurality of material slots, and a vacuum device, each material slot is used to place a semiconductor; a plurality of vacuum breaking nozzles corresponding to the plurality of material slots are provided inside the cavity, each vacuum breaking nozzle is connected to a corresponding material slot; the vacuum device is connected to the cavity, and is used to output a first gas to each material slot, and the first gas is used to vacuum each material slot and allow the semiconductor to be adsorbed on the material slot; the vacuum breaking assembly is used to align with any vacuum breaking nozzle and output a second gas to the corresponding material slot, and the second gas is used to break the vacuum of the corresponding material slot so that the semiconductor can be taken out of the material slot; the drive assembly is used to drive the material tray assembly so that any vacuum breaking nozzle is aligned with the vacuum breaking assembly.

[0005] In a second aspect, an embodiment of the present application provides a test sorter, which includes a sorter body and the above-mentioned semiconductor pick-and-place device arranged on the sorter body.

[0006] The above-mentioned semiconductor picking and placing device and test sorting machine, by setting a material tray assembly, a vacuum breaking assembly and a drive assembly, utilizes vacuum adsorption and vacuum breaking control to ensure the stable adsorption of semiconductors in the material trough, effectively prevents the semiconductors placed in the material trough from jumping or tipping over, and realizes the smooth picking and placing of semiconductors, thereby improving the quality and output of the test sorting machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0008] Figure 1 A three-dimensional diagram of a semiconductor pick-and-place device provided in an embodiment of the present application.

[0009] Figure 2 This is an exploded view of the semiconductor pick-and-place device provided in an embodiment of the present application.

[0010] Figure 3 A three-dimensional diagram of the vacuum breaking nozzle provided in an embodiment of the present application.

[0011] Figure 4 This is a first partial cross-sectional view of the tray assembly provided in an embodiment of the present application.

[0012] Figure 5 A second partial cross-sectional view of the tray assembly provided in an embodiment of the present application.

[0013] Figure 6 A perspective view of a tray assembly provided in accordance with an embodiment of the present application.

[0014] Figure 7 This is a first schematic diagram of the vacuum breaking assembly provided in an embodiment of the present application.

[0015] Figure 8 This is a second schematic diagram of the vacuum breaking assembly provided in an embodiment of the present application.

[0016] Figure 9 A schematic diagram of a vacuum breaking assembly provided in another embodiment of the present application.

[0017] Figure 10 This is a structural block diagram of the semiconductor pick-and-place device provided in an embodiment of the present application.

[0018] Figure 11 This is a structural block diagram of the test sorting machine provided in an embodiment of the present application.

[0019] Component numbers

[0020]

[0021]

[0022] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of this application more clear, the present application is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] The terms "first," "second," "third," "fourth," and the like (if any) in the specification and claims of this application and in the accompanying drawings are used to distinguish similar program objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate. In other words, the described embodiments are implemented according to an order other than that illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, may also encompass other content. For example, a process, method, system, product, or apparatus comprising a series of steps or units need not be limited to only those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to these processes, methods, products, or apparatus.

[0025] It should be noted that the descriptions of "first", "second", etc. in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0026] Please see Figure 11 , which is a structural block diagram of the test sorting machine provided in an embodiment of the present application. The present application provides a test sorting machine 1000. The test sorting machine 1000 includes a sorting machine body 200 and a semiconductor pick-and-place device 100. Among them, the semiconductor pick-and-place device 100 is arranged on the sorting machine body 200. In the present application, the test sorting machine 1000 can be a high-temperature turret test sorting machine, which is used to perform performance tests on semiconductors (not shown), such as electrical performance tests, high-temperature tests, etc. The semiconductor pick-and-place device 100 is used to place semiconductors, or for the sorting machine body 200 to take out semiconductors from the semiconductor pick-and-place device 100 through devices such as test arms for picking up and placing semiconductors.

[0027] Please see Figure 10, which is a block diagram of the structure of the semiconductor pick-and-place device provided in an embodiment of the present application. This application provides a semiconductor pick-and-place device 100. The semiconductor pick-and-place device 100 is disposed in a sorting machine body 200 and includes a tray assembly 1, a vacuum breaker assembly 2, and a drive assembly 3. The drive assembly 3 is connected to the tray assembly 1 and is used to drive the tray assembly 1 to move.

[0028] like Figure 1 and Figure 2 As shown, the material tray assembly 1 includes a base 11, a plurality of material troughs 120, a cavity 13 and a vacuum device 14. Among them, the base 11 is used to support the plurality of material troughs 120. Each material trough 120 is used to place a semiconductor. A cavity 13 is formed between the base 11 and the plurality of material troughs 120. The cavity 13 is connected to the plurality of material troughs 120 and is connected to the vacuum device 14. In this embodiment, the plurality of material troughs 120 are integrated to form the material tray 12, and a plurality of mounting holes are provided on the side facing the base 11, so as to be mounted on the base 11 through a plurality of mounting parts corresponding to the plurality of mounting holes. In other embodiments, the plurality of material troughs 120 can be independently mounted on the base 11 respectively. In this application, the mounting parts can be screws, plug-in rods, etc., and the matching method of the mounting holes and the mounting parts can be a screwing method, a plug-in method, etc.

[0029] A plurality of vacuum-breaking nozzles 131 corresponding one-to-one to the plurality of material troughs 120 are provided inside the cavity 13. Each vacuum-breaking nozzle 131 connects the corresponding material trough 120 and the side of the base 11 facing away from the corresponding material trough 120. Specifically, each material trough 120 is provided with an air hole 120a1. Each air hole 120a1 is connected one-to-one to the cavity 13. The base 11 is provided with a plurality of countersunk holes 1100. Each countersunk hole 1100 is connected one-to-one to the cavity 13 and corresponds one-to-one to the plurality of air holes 120a1. Each vacuum-breaking nozzle 131 is located in a group of corresponding air holes 120a1 and corresponding countersunk holes 1100 and connects the corresponding material trough 120 and the side of the base 11 facing away from the corresponding material trough 120. More specifically, each material trough 120 is provided with an air trough wall 120a, and the side of the base 11 facing the plurality of material troughs 120 is provided with a countersunk hole groove 110. Each of the air holes 120a1 is located on the corresponding air trough wall 120a. The countersunk trough 110 is provided with a plurality of countersunk holes 1100. In the present application, the apertures of the air holes 120a1 and the countersunk holes 1100 are respectively adapted to the vacuum breaking nozzles 131. The air holes 120a1 pass through the air trough wall 120a, and the countersunk holes 1100 pass through the countersunk trough 110, so that each vacuum breaking nozzle 131 is arranged between the base and the corresponding material trough through the corresponding air holes and the corresponding countersunk holes, thereby connecting the corresponding material trough 120 and the side of the material tray assembly 1 facing away from the corresponding material trough 120.

[0030] like Figure 3-Figure 5As shown, the vacuum breaker nozzle 131 includes a first end 1311 and a second end 1312, which are interconnected, and a nozzle through-hole 1313. The first end 1311 is mounted on the corresponding air hole 120a1, and the second end 1312 is tightly fitted into the corresponding counterbore 1100. The nozzle through-hole 1313 extends through the vacuum breaker nozzle 131 along the nozzle through-hole arrangement direction Z, connecting the first end 1311 and the second end 1312. This allows each vacuum breaker nozzle 131 to connect the corresponding material trough 120 with the side of the base 11 facing away from the corresponding material trough 120. Along the diameter of the air hole 120a1, a distance is provided between the first end 1311 and the corresponding air hole 120a1, allowing the cavity 13 to connect to each material trough 120. In the present application, the cooperation relationship between the second end 1312 of each vacuum breaking nozzle 131 and the corresponding counterbore 1100 can be that the second end 1312 is detachably and tightly fitted in the corresponding counterbore 1100, or the second end 1312 is interference fit in the corresponding counterbore 1100.

[0031] Furthermore, along the arrangement direction Z of the nozzle through-hole, the first end 1311 is not exposed outside the corresponding gas trough wall 120a. That is, along the arrangement direction Z of the nozzle through-hole, the distance between each gas trough wall 120a and the countersunk groove 110 is greater than the distance between the first end 1311 and the countersunk groove 110. This prevents mechanical contact, such as collision and friction, between the vacuum breaker nozzle 131 and the semiconductor when the semiconductor is placed in the material trough 120, thereby preventing damage to the vacuum breaker nozzle 131 and the semiconductor. At the same time, the gas trough wall 120a can, to a certain extent, shield the vacuum breaker nozzle 131 from foreign matter, such as tiny particles, that is present during semiconductor testing, thereby reducing the possibility of clogging the vacuum breaker nozzle 131 and ensuring that the vacuum breaker nozzle 131 can subsequently smoothly break the vacuum in the corresponding material trough 120. In this application, the axis perpendicular to the gas trough wall 120a and the arrangement direction Z of the nozzle through-hole are parallel to each other.

[0032] Furthermore, the side of each countersunk hole 1100 facing the plurality of material troughs 120 limits the second end 1312 within the corresponding countersunk hole 1100, and the side away from the plurality of material troughs 120 is adapted to the nozzle through hole 1313, so as to block the second end 1312 of each vacuum breaking nozzle 131 and make each countersunk hole 1100 only connected to the nozzle through hole 1313, so as to reduce the situation where the leakage of the first gas affects the semiconductor adsorption effect in the corresponding material trough 120.

[0033] The vacuum device 14 is a vacuum inlet nozzle for outputting a first gas to each material tank 120 through the cavity 13. The first gas is used to evacuate each material tank 120 and adsorb the semiconductor therein. Specifically, the vacuum device 14 is externally connected to a first gas supply device (not shown), which provides the first gas. In this application, the first gas is a negative pressure gas. Accordingly, the first gas supply device is a gas supply device capable of providing negative pressure gas.

[0034] Please see Figure 6 , which is a perspective view of the material tray assembly provided in an embodiment of the present application. A cavity 111 is provided inside the base 11. The countersunk groove 110 is also provided with a through hole. The cavity 111 is interconnected with the cavity 13 through the through hole. Specifically, the cavity 111 includes a first cavity 111a and a second cavity 111b that are relatively arranged. The through hole includes a plurality of first through holes 111a1 connected to the first cavity 111a, and a plurality of second through holes 111b1 connected to the second cavity 111b. Each first through hole 111a1 and each second through hole 111b1 are respectively surrounded by a portion of the countersunk hole 1100, so that the gas entering the cavity 13 is evenly distributed in the cavity 13 and output to the material trough 120. The vacuum device 14 is connected to the cavity 111 and continuously outputs the first gas to each material trough 120, so that when the vacuum of the designated material trough 120 is broken, the remaining material troughs 120 can still adsorb semiconductors.

[0035] Furthermore, the first cavity 111a and the second cavity 111b are two cavities arranged side by side along the arrangement direction of the plurality of material slots 120. Both ends of the first cavity 111a and the second cavity 111b extend through the base 11 and are blocked by a blocking device 111c, respectively. This ensures that when the vacuum device 14 continuously outputs the first gas to each material slot 120, leakage of the first gas will not affect the adsorption effect of the semiconductor in the corresponding material slot 120.

[0036] Furthermore, in order to reserve space for installing the vacuum device 14 on the base 11, the material tray 12 can cover part of the base 11. Then, the vacuum device 14 is arranged in the partial area of ​​the base 11 not covered by the material tray 12, and is located on the same side as the material tray 12, so that the first gas supply equipment can be connected to the vacuum device 14 through the reserved space to output the first gas to each material trough 120.

[0037] Please see Figure 7 and Figure 8 , Figure 7 and Figure 8The diagram illustrates different states of the vacuum breaker assembly 2 in one embodiment. The vacuum breaker assembly 2 is used to align any vacuum breaker nozzle 131 with the corresponding material tank 120 to deliver the second gas. Specifically, the drive assembly 3 drives the tray assembly 1 to move the vacuum breaker nozzle 131 toward the vacuum breaker assembly 2. The second gas is used to break the vacuum in the corresponding material tank 120, allowing the semiconductor to be removed from the tank 120.

[0038] The vacuum breaking component 2 includes a solenoid valve 23, and an air inlet nozzle 21 and an air outlet 22 that are interconnected. Among them, the air inlet nozzle 21 is a vacuum breaking air inlet nozzle, which is used to connect to an external second gas supply device (not shown). The second gas is provided by the second gas supply device. In this application, the second gas is a positive pressure gas. Accordingly, the second gas supply device is a gas supply device that can provide positive pressure gas. The second gas is a positive pressure gas and can be mixed with the first gas to break the corresponding material trough 120.

[0039] The solenoid valve 23 is used to control the opening of the air inlet nozzle 21 and transmit the second gas to the air outlet 22, or to control the closing of the air inlet nozzle 21 and not transmit the second gas to the air outlet 22. Specifically, the drive component 3 drives the tray component 1 to move to the second end 1312 of any vacuum breaking nozzle 131 to align with the air outlet 22. When any vacuum breaking nozzle 131 is aligned with the air outlet 22, the solenoid valve 23 controls the opening of the air inlet nozzle 21 to connect the vacuum breaking component 2 to the second gas supply device. In this application, the vacuum breaking nozzle 131 aligned with the air outlet 22 can be customized according to the needs of taking and placing semiconductors, and the vacuum breaking nozzle 131 that needs to be aligned with the specified material slot 120 can be achieved to achieve the effect of flexibly taking out any semiconductor from the semiconductor taking and placing device 100.

[0040] It can be understood that since each vacuum breaking nozzle 131 is lower than the gas channel wall 120a of the corresponding material channel 120, the second gas can be more evenly distributed in the corresponding material channel 120 from the gas channel wall 120a, thereby breaking the vacuum of the corresponding material channel 120 more quickly and effectively, so that the semiconductor can be smoothly taken out.

[0041] Please see Figure 9 , which is a schematic diagram of a vacuum breaking component provided in another embodiment of the present application. Figure 9 The vacuum breaking assembly 2 and Figure 7-Figure 8 The difference between the vacuum breaking components 2 shown is that Figure 9 The vacuum breaker assembly 2 shown has two air outlets 22. Accordingly, the vacuum breaker assembly 2 can be aligned with the vacuum breaker nozzles 131 corresponding to any one or two corresponding slots 120 in the tray 12 according to the arrangement of the air outlets 22, thereby breaking the vacuum in any one or two corresponding slots 120 and removing the corresponding semiconductors.

[0042] It is understood that when the vacuum breaker assembly 2 has multiple gas outlets 22, the number and arrangement of the gas outlets 22 can be set accordingly according to the arrangement of the material slots 120 in the material tray 12. Accordingly, the vacuum breaker assembly 2 can be easily aligned with the vacuum breaker nozzles 131 corresponding to one or more material slots 120 from which semiconductors are to be removed, thereby enabling batch removal of multiple semiconductors placed in the semiconductor loading and placing device 100. For example, if the material slots 120 are arranged in an array of three rows and ten columns on the material tray 12, then the gas outlets 22 in the vacuum breaker assembly 2 can be arranged in three rows and one column, that is, the vacuum breaker assembly 2 has three gas outlets 22 arranged in parallel. Accordingly, when it is desired to take out any material slot 120, any two adjacent material slots 120 in the same row, or any semiconductor in any row of material slots 120, the driving component 3 can be used to drive the material tray component 1 to move to the vacuum breaking nozzle 131 corresponding to any material slot 120, the vacuum breaking nozzle 131 corresponding to any two adjacent material slots 120 in the same row, or the vacuum breaking nozzle 131 corresponding to any row of material slots 120 to align with any air outlet 22 of the vacuum breaking component 2, any two adjacent air outlets 22 in the same row, or all air outlets 22, thereby realizing the removal of more than 100 different numbers of semiconductors placed in the semiconductor placement device.

[0043] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0044] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the unit is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other forms.

[0045] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected to achieve the purpose of the solution of this embodiment according to actual needs.

[0046] In addition, the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist independently, or two or more units may be integrated into one unit. The above-mentioned integrated units may be implemented in the form of hardware or software functional units.

[0047] In the above embodiment, by setting up a material tray assembly, a vacuum breaking assembly and a driving assembly, vacuum adsorption and vacuum breaking control are used to ensure the stable adsorption of semiconductors in the material trough, effectively preventing the semiconductors placed in the material trough from jumping or tipping over, and achieving smooth placement of semiconductors, thereby improving the quality and output of the test sorting machine.

[0048] Obviously, those skilled in the art may make various modifications and variations to this application without departing from the spirit and scope of this application. Thus, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application is intended to include such modifications and variations.

[0049] The above examples are merely preferred embodiments of the present application and are not intended to limit the scope of the present application. Therefore, equivalent changes made according to the claims of the present application are still within the scope of the present application.

Claims

1. A semiconductor pick-and-place device, characterized in that: The semiconductor pick-and-place device comprises: The material tray assembly includes a plurality of material slots, a cavity connected to the plurality of material slots, and a vacuum device, each material slot is used to place a semiconductor; a plurality of vacuum breaking nozzles corresponding to the plurality of material slots are provided inside the cavity, each vacuum breaking nozzle is connected to a corresponding material slot; the vacuum device is connected to the cavity, and is used to output a first gas to each material slot, and the first gas is used to evacuate each material slot and adsorb the semiconductor to the material slot; a vacuum breaking assembly, configured to aim at any vacuum breaking nozzle and output a second gas to the corresponding material tank, wherein the second gas is used to break the vacuum of the corresponding material tank so that the semiconductor can be taken out of the material tank; The driving assembly is used to drive the material tray assembly to move so that any one of the vacuum breaking nozzles is aligned with the vacuum breaking assembly.

2. The semiconductor pick-and-place device according to claim 1, wherein: Each of the material troughs is provided with an air hole, each of the air holes is connected to the cavity one by one, and each of the vacuum breaking nozzles is located at a corresponding air hole and connected to a corresponding material trough.

3. The semiconductor pick-and-place device according to claim 2, wherein: The material tray assembly also includes a base for supporting the plurality of material troughs, and the cavity is formed between the base and the plurality of material troughs; the base is provided with a plurality of countersunk holes, each of which is connected to the cavity one by one and corresponds to a plurality of air holes one by one; each vacuum breaking nozzle is located in a group of corresponding air holes and corresponding countersunk holes and connects the corresponding material trough and the side of the base away from the corresponding material trough.

4. The semiconductor pick-and-place device according to claim 3, wherein: Each vacuum breaking nozzle includes a first end and a second end. The second end is tightly fitted in the corresponding counterbore. Along the aperture direction of the through-hole, there is a distance between the first end and the corresponding through-hole.

5. The semiconductor pick-and-place device according to claim 4, wherein: Each material trough is provided with an air trough wall, and each air hole is located in the corresponding air trough wall; the vacuum breaking nozzle is provided with a nozzle through hole connecting the first end and the second end; along the setting direction of the nozzle through hole, the first end is not exposed to the corresponding air trough wall.

6. The semiconductor pick-and-place device according to claim 3, wherein: The base is provided with a countersunk groove on one side facing the plurality of material troughs, a cavity is provided inside the base, and the countersunk groove is provided with the plurality of countersunk holes and through holes; the cavity is communicated with the cavity body through the through holes, the vacuum device is connected to the cavity, and continuously outputs the first gas to each material trough.

7. The semiconductor pick-and-place device according to claim 6, wherein: The cavity includes a first cavity and a second cavity arranged opposite to each other, and the through holes include a plurality of first through holes connected to the first cavity and a plurality of second through holes connected to the second cavity; each first through hole and each second through hole is respectively surrounded by a partial countersunk hole.

8. The semiconductor pick-and-place device according to claim 6, wherein: Both ends of the first cavity and the second cavity respectively pass through the base and are blocked by a blocking device respectively.

9. The semiconductor pick-and-place device according to claim 1, wherein: The vacuum breaking component includes a solenoid valve, and an air inlet nozzle and an air outlet that are interconnected; the solenoid valve is used to control the opening of the air inlet nozzle to transmit the second gas to the air outlet, or to control the closing of the air inlet nozzle to not transmit the second gas to the air outlet; when any vacuum breaking nozzle is aligned with the air outlet, the solenoid valve controls the opening of the air inlet nozzle.

10. The semiconductor pick-and-place device according to claim 1, wherein: The first gas is a negative pressure gas, and the second gas is a positive pressure gas.

11. A test sorting machine, characterized in that: The test sorting machine comprises: Sorting machine body; and A semiconductor pick-and-place device as described in any one of claims 1 to 10, arranged in the sorting machine body.

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