Wafer chucking apparatus and method

Abstract

The application relates to the field of wafer manufacturing, in particular to a wafer adsorption device. The wafer under a rotating tower is adsorbed and rotated to the next station, characterized in that the wafer adsorption device comprises a rotating tower, the rotating tower has a horizontal rotating axis, a plurality of suction nozzles are arranged around the rotating axis; an adsorption mechanism is arranged corresponding to any suction nozzle, the adsorption mechanism comprises an adsorption hole arranged at the end of any suction nozzle, an air ring coaxial with the rotating axis and communicated with the adsorption hole, and an air shaft; the air ring corresponding to the suction nozzle is arranged in multiple, the multiple air rings are axially sleeved on the outer wall of the air shaft and can rotate relative to the air shaft, the outer wall of any air ring is radially provided with a first adsorption interface for connecting an external vacuum device, and the inner wall of the air ring is provided with an annular air groove communicated with the first adsorption interface; the suction nozzle is installed at one end of the air shaft, an air channel is arranged on the air shaft, and the two ends of the air channel are communicated with the air groove and the adsorption hole respectively; any first adsorption interface has unique air groove, air channel and adsorption hole corresponding communication.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wafer manufacturing, in particular to a wafer adsorption device and method. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafer adsorption device is the core device to realize the accurate transfer of wafers between processes. In the prior art, the wafer adsorption device usually adopts a turret structure, and the wafers are adsorbed and transferred to the next station by multiple suction nozzles in turn. However, the traditional device has the following technical defects:

[0003] 1. Multiple suction nozzles share the same gas path system, and only a single electromagnetic valve is used to control the vacuum suction, which leads to poor synchronization of the suction action of each suction nozzle, and the phenomenon of vacuum leakage or unstable suction force is easy to occur, which directly affects the reliability of wafer transfer.

[0004] 2. During the product handover process, the top pin, the lower suction nozzle of the side turret, the upper suction nozzle of the side turret, and the suction nozzle of the turret are in a straight line. However, in the actual production process, the top pin needs to be directly below the product, but even with visual correction, it is difficult for the wafer platform to place the product directly above the top pin, resulting in that the wafer and the suction nozzle of the turret are not in the same straight line.

[0005] 3. There is a lack of buffering mechanism during the suction nozzle pressing process, and the impact force caused by rigid contact is easy to cause damage to the wafer surface, especially for wafers with thin thickness, which has a significant impact on yield. SUMMARY

[0006] The purpose of the present application is to provide a wafer adsorption device and method to solve the problems in the prior art.

[0007] The technical solution of the present application is: a wafer adsorption device, comprising a turret, the turret has a horizontal rotating axis, and a plurality of suction nozzles are installed around the rotating axis;

[0008] An adsorption mechanism is provided corresponding to any suction nozzle, the adsorption mechanism comprises an adsorption hole opened at the end of any suction nozzle, a gas ring and a gas shaft which are coaxial with the rotating axis and communicate with the adsorption hole;

[0009] The gas ring corresponding to the suction nozzle is provided in plurality, the plurality of gas rings are sleeved on the outer wall of the gas shaft in the axial direction and can rotate relative to the gas shaft, the outer wall of any gas ring is provided with a first adsorption interface in the radial direction, which is used to connect an external vacuum device, and the inner wall of the gas ring is provided with a gas groove of annular structure which communicates with the first adsorption interface;

[0010] The suction nozzle is installed at one end of the gas shaft, a gas channel is opened on the gas shaft, and the two ends of the gas channel communicate with the gas groove and the adsorption hole, respectively;

[0011] Any of the first adsorption interfaces has a corresponding communication with a unique gas groove, gas channel and adsorption hole.

[0012] Preferably, the gas channel is composed of two parts, including a first gas channel opened along the radial direction, and a second gas channel opened along the axial direction and communicated with the end of the first gas channel, the end of the second gas channel away from the first gas channel is coaxially provided with a shunt disc, the shunt disc is fixed with the gas shaft, the shunt disc has a diameter larger than the end face of the gas shaft, and the suction nozzle is mounted on the shunt disc.

[0013] Preferably, the outer wall of the gas shaft is sleeved with a driver, the execution end of the driver is fixed with the shunt disc, the shunt disc can be driven to rotate around the rotation axis, the suction nozzle is mounted on the end of the shunt disc away from the driver along the radial direction, the shunt disc is provided with a third gas channel, one end of the third gas channel is communicated with the second gas channel, and the other end is communicated with a second adsorption interface arranged on the outer wall of the shunt disc, the second adsorption interface is communicated with the suction nozzle through a hose.

[0014] Preferably, a plurality of the gas rings are arranged along the length direction of the gas shaft, a first sealing groove is opened on the end face of any of the gas rings abutting against the adjacent gas ring, and a second sealing groove is opened on the inner wall of any of the gas rings parallel to the gas groove.

[0015] Preferably, the rotary tower is arranged on a moving platform, the moving platform includes a first moving mechanism capable of moving along a first direction, and a second moving mechanism capable of moving along a second direction perpendicular to the first direction.

[0016] Preferably, the first moving mechanism includes a first guide rail arranged along the first direction and a first sliding block matched with the first guide rail, and the second moving mechanism is mounted on the first sliding block.

[0017] The second moving mechanism includes a second guide rail arranged along the second direction and a second sliding block matched with the second guide rail, the second guide rail is arranged on the first sliding block, and the rotary tower is arranged on the second sliding block.

[0018] Preferably, the suction nozzle is connected with the shunt disc through a buffer assembly, the buffer assembly includes a first buffer mechanism, the first buffer mechanism includes a first buffer base, a first buffer piece and a first linear motion piece, the first buffer base is slidably connected with the suction nozzle through the first linear motion piece, and the two ends of the first buffer piece are respectively abutted against the first buffer base and the suction nozzle.

[0019] Preferably, the buffer assembly includes a second buffer mechanism, the second buffer mechanism includes a second buffer base, a second buffer piece and a second linear motion piece, the second buffer base is fixed on the shunt disc, the first buffer base is slidably connected with the second linear motion piece, and the two ends of the second buffer piece are respectively abutted against the first buffer base and the second buffer base.

[0020] Preferably, the first linear motion member and the second linear motion member are ball spline.

[0021] A wafer adsorption method, comprising the following steps:

[0022] Step one, the turret drives the suction nozzle to run to the adsorption station, the first moving mechanism and the second moving mechanism drive the turret to move under the guidance of the vision device, so that the wafer to be adsorbed is located directly below the suction nozzle;

[0023] Step two, the suction nozzle moves downward under the driving of the suction nozzle pressing mechanism, while the external vacuum equipment transmits negative pressure to the adsorption hole through the first adsorption interface corresponding to the suction nozzle via the air groove and air channel;

[0024] Step three, when the adsorption hole of the suction nozzle abuts against the wafer, the first buffer mechanism and the second buffer mechanism act, the first buffer member and the second buffer member are compressed, so that the pressure of the suction nozzle on the wafer remains stable;

[0025] Step four, after the wafer is firmly adsorbed, the suction nozzle is reset upward, and then the turret drives the suction nozzle to carry the wafer to the next station.

[0026] Compared with the prior art, the advantages of the present application are:

[0027] (1) The present application adopts an independent vacuum control system, sets an independent negative pressure channel composed of a dedicated air ring, air channel and adsorption interface for each suction nozzle, and realizes the independent control of each first adsorption interface, solving the mutual interference problem caused by the sharing of the same air path by multiple suction nozzles in the prior art.

[0028] (2) The turret is integrally installed on a two-dimensional moving platform, so that it can move in the first direction and the second direction, and can be accurately positioned in the horizontal plane. Thus, the position of the suction nozzle in the horizontal direction is accurately adjusted, ensuring that it moves to the top of the wafer to be adsorbed, solving the problem of poor adsorption effect caused by initial position deviation, and improving the compatibility and adsorption success rate of wafers in different positions.

[0029] (3) The suction nozzle is connected to the shunt disc through the buffer assembly comprising the first buffer mechanism and the second buffer mechanism. When the suction nozzle contacts the wafer and continues to travel, the first buffer member and the second buffer member are compressed in turn, converting the rigid impact force of the suction nozzle on the wafer into controllable elastic force. The impact is effectively absorbed, and the pressure of the suction nozzle on the wafer remains stable and uniform, greatly reducing the risk of wafer damage or poor adsorption caused by excessive or uneven pressure. BRIEF DESCRIPTION OF DRAWINGS

[0030] The present application will be further described below in conjunction with the drawings and examples:

[0031] Figure 1 Figure 1 is a first perspective view of a wafer adsorption device according to the present application;

[0032] Figure 2 Figure 2 is a second perspective view of a wafer adsorption device according to the present application;

[0033] Figure 3 Figure 3 is an installation structure of an air ring according to the present application;

[0034] Figure 4 Figure 4 is a cross-sectional view of the wafer adsorption device according to the present application; Figure 3 Figure 5 is a cross-sectional view of the wafer adsorption device according to the present application;

[0035] Figure 5 Figure 6 is a cross-sectional view of the wafer adsorption device according to the present application; Figure 4 Figure 7 is an enlarged view of a partial section of the wafer adsorption device according to the present application;

[0036] Figure 6 Figure 8 is a cross-sectional view of the air ring according to the present application;

[0037] Figure 7 Figure 9 is a cross-sectional view of the air shaft according to the present application;

[0038] Figure 8 Figure 10 is a first perspective view of a moving platform according to the present application;

[0039] Figure 9 Figure 11 is a second perspective view of a moving platform according to the present application;

[0040] Figure 10 Figure 12 is a structure view of a buffer assembly according to the present application;

[0041] Wherein: 1, suction nozzle, 2, air ring, 21, first adsorption interface, 22, air groove, 23, first sealing groove, 24, second sealing groove, 3, air shaft, 31, first air duct, 32, second air duct, 4, driver, 5, flow divider, 51, second adsorption interface, 6, moving platform, 61, first moving mechanism, 611, first guide rail, 612, first sliding block, 62, second moving mechanism, 621, second guide rail, 622, second sliding block, 7, buffer assembly, 71, first buffer mechanism, 711, first buffer base, 712, first buffer piece, 713, first linear motion piece, 72, second buffer mechanism, 721, second buffer base, 722, second buffer piece, 723, second linear motion piece. DETAILED DESCRIPTION

[0042] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0043] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more, unless otherwise explicitly limited.

[0044] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0045] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0046] The content of the present application will be further described in detail below in combination with specific embodiments:

[0047] As Figure 1 and Figure 2As shown in the figure, a wafer suction device is arranged with an expansion die mechanism, which is used to suck and rotate the wafer on the lower expansion die mechanism to the next station. The turret has a horizontal rotation axis, a plurality of suction nozzles 1 are evenly installed around the rotation axis in the radial direction, and the turret can drive the suction nozzles 1 to rotate around the rotation axis, so that different suction nozzles 1 enter the suction station arranged with the corresponding expansion die mechanism in turn. The suction nozzles 1 can move downward under the drive of the suction nozzle lower pressing mechanism, so as to abut and suck the wafer on the expansion die mechanism.

[0048] The suction mechanism is arranged corresponding to any suction nozzle 1, which is used to form a suction channel, and the suction nozzle 1 generates negative pressure after the external vacuum equipment is connected.

[0049] In the prior art, a plurality of suction nozzles 1 are connected to the same gas circuit and driven by a single electromagnetic valve to suck and break, which easily leads to unstable suction. Therefore, in the present application, the suction mechanism includes a suction hole opened at the end of any suction nozzle 1, a gas ring 2 and a gas shaft 3 which are connected to the suction hole and coaxial with the rotation axis.

[0050] Combined Figure 3 And Figure 4 As shown in the figure, the gas shaft 3 can rotate around the rotation axis under the drive of the driver 4, and the suction nozzles 1 are installed at one end of the gas shaft 3. The number of gas rings 2 corresponding to the suction nozzles 1 is multiple, and the plurality of gas rings 2 are axially sleeved on the outer wall of the gas shaft 3. The gas ring 2 is used to connect the external vacuum equipment, so that the outer wall of any gas ring 2 is provided with a first suction interface 21 in the radial direction for the external vacuum equipment to plug in, combined Figure 6 As shown in the figure, a gas groove 22 is opened on the inner wall of the gas ring 2, which is connected to the first suction interface 21. A gas channel is opened on the gas shaft 3, and the gas channel is arranged corresponding to any gas ring 2, and the two ends of any gas channel are respectively connected to the corresponding gas groove 22 and the suction hole of the suction nozzle 1. The first suction interface 21, the gas groove 22, the gas channel and the suction hole form a negative pressure channel for sucking the wafer. In this way, any first suction interface 21 is connected to only one gas groove 22, only one gas channel and only one suction hole. By controlling the on-off of any first suction interface 21, the vacuum suction of the corresponding single suction nozzle 1 can be realized.

[0051] Because the gas shaft 3 rotates with the driver 4, and the gas ring 2 needs to be connected to the external vacuum equipment, the connection between the gas ring 2 and the gas shaft 3 is a rotating connection through the bearing. After the wafer is sucked by the suction nozzle 1, it needs to be rotated to the subsequent station under the drive of the driver 4, and the negative pressure suction force needs to be continuously provided during this period. Therefore, the gas groove 22 is arranged in a ring structure, so that the gas groove 22 can still ensure the connection with the gas channel when the gas shaft 3 rotates.

[0052] In the present embodiment, in order to facilitate processing, the gas channel is composed of two parts, as shown in Figure 7The first air passage 31 is radially arranged along the air shaft 3, and the second air passage 32 is arranged along the axial direction of the air shaft 3 and communicates with the end of the first air passage 31. The end of the second air passage 32 away from the first air passage 31 is coaxially provided with a flow distribution disc 5. The flow distribution disc 5 is fixed to the end of the air shaft 3, and has a diameter larger than that of the end of the air shaft 3. The end surface of the flow distribution disc 5 away from the air shaft 3 is configured as a mounting surface of the suction nozzle 1. A plurality of suction nozzles 1 are uniformly mounted on the mounting surface of the flow distribution disc 5 along the radial direction around the rotation axis.

[0053] As shown in Figure 5 In order to ensure the air tightness between the air rings 2 and the air shaft 3, and to avoid the negative pressure of one first suction port 21 from communicating with other non-corresponding suction holes, a plurality of air rings 2 are arranged in close contact along the length direction of the air shaft 3. A first sealing groove 23 is arranged on the end surface of any air ring 2 abutting against the adjacent air ring 2. A second sealing groove 24 is arranged on the inner wall of the air ring 2 close to the air shaft 3 and parallel to the air groove 22. A sealing ring is embedded in the first sealing groove 23 and the second sealing groove 24, thereby realizing independent sealing between the air rings 2 and the air shaft 3.

[0054] When the suction nozzle 1 is driven by the driver 4 to the suction station, it may be deviated from the wafer below in the vertical direction, resulting in poor suction effect. Therefore, the turret is arranged on the moving platform 6, which can drive the turret to move along the horizontal plane, so that the suction nozzle 1 moves to the upper side of the wafer to be sucked. Figure 8 and Figure 9 As shown in

[0055] Specifically, the first moving mechanism 61 includes a first guide rail 611 arranged along the first direction and a first sliding block 612 arranged in cooperation with the first guide rail 611, and the second moving mechanism 62 is installed on the first sliding block 612. The second moving mechanism 62 includes a second guide rail 621 arranged along the second direction and a second sliding block 622 arranged in cooperation with the second guide rail 621. The second guide rail 621 is arranged on the first sliding block 612, and the turret is arranged on the second sliding block 622.

[0056] In addition, in order to buffer the pressure of the wafer when the suction nozzle 1 moves downward to suck the wafer, as shown in Figure 10As shown, in the present embodiment, the suction nozzle 1 is connected with the distribution plate 5 through the buffer assembly 7, after the suction nozzle 1 abuts against the wafer, the buffer assembly 7 buffers the wafer through its own deformation. The buffer assembly 7 comprises a first buffer mechanism 71, the first buffer mechanism 71 comprises a first buffer base 711, a first buffer piece 712 and a first linear motion piece 713. The first buffer base 711 can be arranged on the distribution plate 5 and is slidably connected with the suction nozzle 1 through the first linear motion piece 713, and the two ends of the first buffer piece 712 abut against the first buffer base 711 and the suction nozzle 1 respectively. In order to further enhance the buffering effect, in the preferred embodiment of the present application, the buffer assembly 7 further comprises a second buffer mechanism 72, the second buffer mechanism 72 comprises a second buffer base 721, a second buffer piece 722 and a second linear motion piece 723, the second buffer base 721 is fixed on the distribution plate 5, the first buffer base 711 is slidably arranged on the second linear motion piece 723, and the two ends of the second buffer piece 722 abut against the first buffer base 711 and the second buffer base 721 respectively. In the present application, the first linear motion piece 713 and the second linear motion piece 723 are both ball spline, and the first buffer piece 712 and the second buffer piece 722 are both spring.

[0057] When working, the following steps are included:

[0058] Step one, the turret drives the suction nozzle 1 to run to the adsorption station, the first moving mechanism 61 and the second moving mechanism 62 drive the turret to move horizontally under the guidance of the visual device, so that the wafer to be adsorbed is located directly below the suction nozzle 1.

[0059] Step two, the suction nozzle down driving mechanism drives the suction nozzle 1 located in the adsorption station to move downward, while the external vacuum equipment is started to generate negative pressure, and the generated negative pressure is transmitted to the adsorption hole on the suction nozzle 1 through the first adsorption interface 21 corresponding to the suction nozzle 1, the air groove 22, the second adsorption interface 51 and the hose in turn.

[0060] Step three, when the adsorption hole of the suction nozzle 1 abuts against the wafer, the suction nozzle down driving mechanism will continue to drive the suction nozzle 1 to press down a certain stroke, in which stroke, the first buffer piece 712 and the second buffer piece 722 will be compressed so that the pressure of the suction nozzle 1 on the wafer is converted into the elastic force of the first buffer piece 712 and the second buffer piece 722, thereby keeping the pressure of the suction nozzle 1 on the wafer stable.

[0061] Step four, after the wafer is adsorbed firmly, the suction nozzle 1 is reset upward, and then the driver 4 drives the suction nozzle 1 to carry the wafer to the next station.

[0062] The above examples are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and to implement it, and cannot limit the protection scope of the present application. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application, therefore, no matter from which point of view, the examples should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application.

Claims

1. A wafer chucking turret for chucking and rotating a wafer under the turret to a next station, characterized in that, The tumbler has a horizontal rotating axis, and a plurality of suction nozzles (1) are installed around the rotating axis; An adsorption mechanism is arranged corresponding to any suction nozzle (1), and the adsorption mechanism comprises an adsorption hole arranged at the end of any suction nozzle (1), an air ring (2) and an air shaft (3) which are coaxial with the rotating axis and communicate with the adsorption hole; The air ring (2) is arranged corresponding to the suction nozzle (1), and a plurality of air rings (2) are arranged along the axial direction of the air shaft (3) and can rotate relative to the air shaft (3), the outer wall of any air ring (2) is provided with a first adsorption interface (21) in the radial direction, which is used for connecting an external vacuum equipment, and the inner wall of the air ring (2) is provided with a ring-shaped air groove (22) which communicates with the first adsorption interface (21); The suction nozzle (1) is installed at one end of the air shaft (3), the air shaft (3) is provided with an air channel, and the two ends of the air channel communicate with the air groove (22) and the adsorption hole, respectively; Any first adsorption interface (21) has a corresponding communication with a unique air groove (22), an air channel and an adsorption hole.

2. The wafer chucking turntable according to claim 1, wherein, The air channel is composed of two parts, including a first air channel (31) arranged in the radial direction, and a second air channel (32) arranged in the axial direction and communicating with the end of the first air channel (31), one end of the second air channel (32) away from the first air channel (31) is coaxially provided with a shunt disc (5), the shunt disc (5) is fixed with the air shaft (3), the diameter of the shunt disc (5) is larger than that of the end face of the air shaft (3), and the suction nozzle (1) is installed on the shunt disc (5).

3. The wafer chucking turntable according to claim 2, wherein, The outer wall of the air shaft (3) is sleeved with a driver (4), the execution end of the driver (4) is fixed with the shunt disc (5), the shunt disc (5) can be driven to rotate around the rotating axis, the suction nozzle (1) is installed on one end of the shunt disc (5) away from the driver (4) in the radial direction, the shunt disc (5) is provided with a third air channel, one end of the third air channel communicates with the second air channel (32), and the other end communicates with a second adsorption interface (51) arranged on the outer wall of the shunt disc (5), the second adsorption interface (51) communicates with the suction nozzle (1) through a hose.

4. The wafer chucking turntable according to claim 3, wherein, A plurality of air rings (2) are arranged along the length direction of the air shaft (3), a first sealing groove (23) is arranged on the end face of any air ring (2) abutting against the adjacent air ring (2), and a second sealing groove (24) is arranged on the inner wall of any air ring (2) parallel to the air groove (22).

5. The wafer chucking turntable according to claim 4, wherein, The tumbler is arranged on a moving platform (6), the moving platform (6) comprises a first moving mechanism (61) capable of moving in a first direction, and a second moving mechanism (62) capable of moving in a second direction perpendicular to the first direction.

6. The wafer chucking turntable according to claim 5, wherein, The first moving mechanism (61) comprises a first guide rail (611) arranged in the first direction and a first sliding block matched with the first guide rail (611), and the second moving mechanism (62) is installed on the first sliding block; The second moving mechanism (62) comprises a second guide rail (621) arranged in the second direction and a second sliding block matched with the second guide rail (621), the second guide rail (621) is arranged on the first sliding block, and the tumbler is arranged on the second sliding block.

7. The wafer chucking turntable according to claim 6, wherein The nozzle (1) is connected with the distributor disc (5) through a buffering assembly (7), the buffering assembly (7) comprises a first buffering mechanism (71), the first buffering mechanism (71) comprises a first buffering base (711), a first buffering piece (712) and a first linear motion piece (713); the first buffering base (711) is slidably connected with the nozzle (1) through the first linear motion piece (713), and two ends of the first buffering piece (712) are respectively abutted against the first buffering base (711) and the nozzle (1).

8. The wafer chucking turntable according to claim 7, wherein, The buffering assembly (7) comprises a second buffering mechanism (72), the second buffering mechanism (72) comprises a second buffering base (721), a second buffering piece (722) and a second linear motion piece (723), the second buffering base (721) is fixed on the distributor disc (5), the first buffering base (711) is slidably connected with the second linear motion piece (723), and two ends of the second buffering piece (722) are respectively abutted against the first buffering base (711) and the second buffering base (721).

9. The wafer chucking turntable according to claim 7, wherein, The first linear motion piece (713) and the second linear motion piece (723) are both ball spline.

10. A method for wafer chucking, using a wafer chucking turntable as claimed in claim 8, characterized in that, The method comprises the following steps: Step one, the turret drives the nozzle (1) to run to the adsorption station, the first moving mechanism (61) and the second moving mechanism (62) drive the turret to move under the guidance of the visual device, so that the wafer to be adsorbed is located directly below the nozzle (1); Step two, the nozzle (1) moves downward under the driving of the nozzle pressing mechanism, and at the same time, the external vacuum equipment transmits negative pressure to the adsorption hole through the first adsorption interface (21) corresponding to the nozzle (1) via the air groove (22) and the air duct; Step three, when the adsorption hole of the nozzle (1) abuts against the wafer, the first buffering mechanism (71) and the second buffering mechanism (72) act, the first buffering piece (712) and the second buffering piece (722) are compressed, so that the pressure of the nozzle (1) on the wafer remains stable; Step four, after the wafer is firmly adsorbed, the nozzle (1) is reset upward, and then the turret drives the nozzle (1) to carry the wafer to run to the next station.

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