Reversible wafer clamping device and control method

Abstract

The invention relates to a turnover wafer clamping device and a control method. The turnover wafer clamping device comprises a bearing plate, a positioning assembly, a fixing assembly and a turnover assembly. The positioning assembly comprises a positioning clamping jaw arranged on the bearing plate and positioning pin sets arranged on the two sides of the bearing plate, the positioning clamping jaw can move in a reciprocating mode along the axis of the bearing plate and is used for clamping the wafer frame in a limiting mode, and the positioning clamping jaw and the positioning pin sets are matched to conduct positioning adjustment on the wafer frame. The fixing assembly comprises a fixing clamping jaw which is arranged on the bearing plate and can reciprocate along the axis of the bearing plate, and the fixing clamping jaw is located between the positioning clamping jaw and the positioning pin set and used for fixing and clamping the wafer frame after the positioning assembly positions and adjusts the wafer frame. The overturning assembly comprises a servo motor, the movable end of the servo motor is connected with the bearing plate, and the servo motor is used for driving the positioning assembly and the fixing assembly to rotate so as to overturn the wafer frame.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a flippable wafer clamping device and a control method. Background Art

[0002] In the existing chip packaging process, during the existing wafer placement and transfer, the transportation of the wafer frame between the material box and each workstation mostly relies on grasping and releasing in a single direction, and there is a lack of precise positioning constraints on the wafer frame. As a result, the wafer frame is prone to position deviation when flowing through multiple stations, and high-precision alignment cannot be achieved, affecting the stability and yield of subsequent processes. Summary of the Invention

[0003] The purpose of the present invention is to provide a flippable wafer clamping device and control method, which can integrate a positioning component, a fixing component and a flipping component on the same carrier plate, and use the combined limitation of the positioning claws and the positioning pin group to achieve accurate positioning of the wafer frame; and then ensure that the wafer frame always remains stable during the flipping or transportation process through the secondary clamping fixed claws; the servo motor drives the carrier plate to rotate around the axis, which can flexibly complete the flipping operation of the wafer frame, solving the problem of inaccurate positioning and inability to flip the wafer frame in the prior art.

[0004] To achieve the above object, according to a first aspect of the present invention, there is provided a reversible wafer clamping device, comprising:

[0005] Loading plate;

[0006] A positioning assembly, comprising a positioning jaw disposed on the carrier plate and a positioning pin group disposed on both sides of the carrier plate, wherein the positioning jaw can reciprocate along the axis of the carrier plate and is used to limit and clamp the wafer frame, and the positioning jaw cooperates with the positioning pin group to adjust the positioning of the wafer frame;

[0007] A fixing assembly, comprising a fixing jaw disposed on the carrier plate and reciprocating along the axis of the carrier plate, the fixing jaw being located between the positioning jaw and the positioning pin group, and being used to fix and clamp the wafer frame after the positioning assembly positions and adjusts the wafer frame;

[0008] The flip assembly includes a servo motor, wherein the movable end of the servo motor is connected to the carrier plate and is used for driving the positioning assembly and the fixing assembly to rotate so as to flip the wafer frame.

[0009] Optionally, the positioning pin set includes:

[0010] A first positioning pin is provided corresponding to the positioning groove on the edge of the wafer frame, and the first positioning pin cooperates with the positioning groove to position the wafer frame in the horizontal direction;

[0011] The second positioning pin is recessed inwardly along its circumference to form a guide positioning groove. The second positioning pin cooperates with the edge of the wafer frame to position the wafer frame in the vertical direction.

[0012] Optionally, the positioning component further includes:

[0013] A first clamping cylinder is provided on one side of the carrier plate and can reciprocate along the axis of the carrier plate to drive the positioning claws to limit and clamp the wafer frame;

[0014] A traveling cylinder is provided on one side of the carrier plate, wherein a movable end of the traveling cylinder contacts and is not connected to the first clamping cylinder, and is used to push the first clamping cylinder to move toward the wafer frame;

[0015] A return spring is provided at one end of the first clamping cylinder and the supporting plate away from the positioning clamping claw, and is used for driving the first clamping cylinder to return to its original position.

[0016] Optionally, the air pressure of the first clamping cylinder used for clamping the positioning clamping claws is 0.2MPa-0.3MPa.

[0017] Optionally, the fixing assembly further includes:

[0018] A fixed plate, disposed on the other side of the supporting plate and capable of reciprocating along the axis of the supporting plate;

[0019] Two second clamping cylinders are respectively arranged on both sides of the fixed plate, and are used to drive the fixed clamping claws to fix and clamp the wafer frame;

[0020] The telescopic cylinder is arranged on the other side of the supporting plate and its movable end is connected to the fixed plate, and is used to push the second clamping cylinder to move toward the wafer frame.

[0021] Optionally, the reversible wafer clamping device further includes:

[0022] The detection optical fiber is arranged at the other end of the carrier plate and located on both sides of the positioning clamping claws, and is used to detect whether the wafer frame is accurately positioned.

[0023] Optionally, the reversible wafer clamping device further includes an overload protection component, and the overload protection component includes:

[0024] Fixed base;

[0025] A support frame is provided on the fixed base and can reciprocate along the axis direction of the bearing plate, the flip assembly is provided on one side of the support frame, and the bearing plate is provided on the other side of the support frame;

[0026] A tension spring, horizontally arranged between the support frame and the fixed base, for driving the support frame to return to its original position;

[0027] A shielding sheet is provided on the fixed base;

[0028] A slot-shaped photoelectric sensor is arranged on the support frame, and the shielding piece cooperates with the slot-shaped photoelectric sensor to perform a signal alarm.

[0029] According to a second aspect of the present invention, a control method for a reversible wafer clamping device is provided, comprising the following steps:

[0030] Controlling the positioning claws to cooperate with the positioning pin group to clamp and position the wafer frame;

[0031] After the wafer frame is accurately positioned and adjusted, the fixed clamping claws are controlled to fix and clamp the wafer frame;

[0032] The servo motor controlling the flipping assembly cooperates with the carrying plate to drive the positioning assembly and the fixing assembly to rotate so as to flip the wafer frame.

[0033] Optionally, controlling the positioning claw to cooperate with the positioning pin group to clamp and position the wafer frame includes the following steps:

[0034] Controlling the travel cylinder of the positioning assembly to push the first clamping cylinder of the positioning assembly forward so that the positioning claw reaches the edge of the target wafer frame;

[0035] Controlling the first clamping cylinder to clamp the positioning claw so that the positioning claw can limit and clamp the wafer frame;

[0036] The traveling cylinder is controlled to return to its original position so that the positioning clamp is retracted, and at the same time, the wafer frame is positioned in cooperation with the positioning pin group.

[0037] Optionally, after the wafer frame is accurately positioned and adjusted, controlling the fixed clamping claws to fixedly clamp the wafer frame comprises the following steps:

[0038] Controlling the detection optical fiber of the clamping device to detect whether the wafer frame is accurately positioned;

[0039] After the wafer frame is accurately positioned and adjusted, the telescopic cylinder of the fixing assembly is controlled to extend to push the second clamping cylinder of the fixing assembly forward so that the fixing claw reaches the edge of the target wafer frame;

[0040] The second clamping cylinder is controlled to clamp the fixed clamping claw to fix the wafer frame.

[0041] The beneficial effects of the present invention are: by integrating the positioning component, the fixing component and the flipping component on the same carrier plate, the combined limiting of the positioning claws and the positioning pin group is used to achieve accurate positioning of the wafer frame; and then the secondary clamping fixed claws are used to ensure that the wafer frame always remains stable during the flipping or transportation process; the servo motor drives the carrier plate to rotate around the axis, which can flexibly complete the flipping operation of the wafer frame, solving the problem of inaccurate positioning and inability to flip the wafer frame in the prior art.

[0042] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 This is a first schematic structural diagram of a reversible wafer clamping device according to an embodiment of the present invention;

[0044] Figure 2 This is a second schematic structural diagram of a reversible wafer clamping device according to an embodiment of the present invention;

[0045] Figure 3 This is a schematic structural diagram of a positioning pin group of a reversible wafer clamping device according to an embodiment of the present invention;

[0046] Figure 4 This is a schematic structural diagram of an overload protection component of a reversible wafer clamping device according to an embodiment of the present invention;

[0047] Figure 5 This is a schematic flow chart of a control method for a reversible wafer clamping device according to an embodiment of the present invention;

[0048] Figure 6 for Figure 5 Schematic flow chart of step S10;

[0049] Figure 7 for Figure 5 Schematic flow chart of step S20;

[0050] In the figure: 1. Carrying plate; 2. Positioning assembly; 21. Positioning clamp; 22. Positioning pin group; 221. First positioning pin; 222. Second positioning pin; 223. Guide positioning groove; 23. First clamping cylinder; 24. Travel cylinder; 25. Return spring; 3. Fixing assembly; 31. Fixing clamp; 32. Fixing plate; 33. Second clamping cylinder; 34. Telescopic cylinder; 4. Flipping assembly; 41. Servo motor; 5. Wafer frame; 51. Positioning groove; 6. Detection optical fiber; 7. Overload protection assembly; 71. Fixed base; 72. Support frame; 73. Shielding plate; 74. Slot-shaped photoelectric sensor. DETAILED DESCRIPTION

[0051] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0052] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0053] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0054] See Figure 1, a preferred embodiment of the present application shows a flip wafer clamping device and control method, which includes a carrier plate 1, a positioning assembly 2, a fixing assembly 3 and a flip assembly 4. The positioning assembly 2 includes a positioning claw 21 provided on the carrier plate 1 and a positioning pin group 22 provided on both sides of the carrier plate 1. The positioning claw 21 can move back and forth along the axis of the carrier plate 1 and is used to limit and clamp the wafer frame 5. The positioning claw 21 cooperates with the positioning pin group 22 to position and adjust the wafer frame 5. The fixing assembly 3 includes a fixed claw 31 provided on the carrier plate 1 and can move back and forth along the axis of the carrier plate 1. The fixed claw 31 is located between the positioning claw 21 and the positioning pin group 22, and is used to fix and clamp the wafer frame 5 after the positioning assembly 2 positions and adjusts the wafer frame 5. The flip assembly 4 includes a servo motor 41. The movable end of the servo motor 41 is connected to the carrier plate 1, and is used to drive the positioning assembly 2 and the fixing assembly 3 to rotate to flip the wafer frame 5.

[0055] According to the solution of the embodiment of the present invention, the positioning component 2, the fixing component 3 and the flipping component 4 are integrated on the same carrier plate 1, and the combined limitation of the positioning clamp 21 and the positioning pin group 22 is used to achieve accurate positioning of the wafer frame 5; and then the secondary clamping fixing clamp 31 is used to ensure that the wafer frame 5 always remains stable during the flipping or transportation process; the servo motor 41 drives the carrier plate 1 to rotate around the axis, which can flexibly complete the flipping operation of the wafer frame 5, solving the problem of inaccurate positioning and inability to flip the wafer frame 5 in the prior art.

[0056] The following is a detailed description with specific embodiments:

[0057] Specifically, see Figure 2 and Figure 3 The positioning pin assembly 22 includes a first positioning pin 221 and a second positioning pin 222. The first positioning pin 221 is positioned corresponding to the positioning groove 51 on the edge of the wafer frame 5. The first positioning pin 221 cooperates with the positioning groove 51 to position the wafer frame 5 horizontally. The second positioning pin 222 is recessed inward along its circumference to form a guide positioning groove 223. The second positioning pin 222 cooperates with the edge of the wafer frame 5 to position the wafer frame 5 vertically. The first positioning pin 221 and the second positioning pin 222 cooperate to achieve full positioning of the wafer frame 5.

[0058] Specifically, the guide and positioning groove 223 has a trapezoidal cross-section, with the width of the groove opening of the guide and positioning groove 223 being greater than the width of the groove bottom. The groove bottom width of the guide and positioning groove 223 is consistent with the thickness of the edge of the wafer frame 5. This structure facilitates the automatic guidance and positioning of the wafer frame 5 during the guiding and positioning process, prevents the wafer frame 5 from getting stuck or shaking, and improves the stability and reliability of vertical positioning.

[0059] Specifically, see Figure 1The positioning assembly 2 also includes a first clamping cylinder 23, a travel cylinder 24 and a return spring 25. The first clamping cylinder 23 is arranged on one side of the carrier plate 1 and can move back and forth along the axis of the carrier plate 1, and is used to drive the positioning claw 21 to limit and clamp the wafer frame 5. The travel cylinder 24 is arranged on one side of the carrier plate 1, and the movable end of the travel cylinder 24 is in contact with the first clamping cylinder 23 but not connected, and is used to push the first clamping cylinder 23 to move toward the wafer frame 5. The return spring 25 is arranged on the end of the first clamping cylinder 23 and the carrier plate 1 away from the positioning claw 21, and is used to drive the first clamping cylinder 23 to return to its original position. The traveling cylinder 24 pushes the positioning clamp 21 to the edge of the wafer frame 5. After the positioning clamp 21 clamps the wafer frame 5 under the action of the first clamping cylinder 23, the traveling cylinder 24 resets and cooperates with the positioning pin group 22 to complete the position fine-tuning of the wafer frame 5. The reset spring 25 ensures that the first clamping cylinder 23 returns to its initial position after unloading, thereby realizing reliable repeated positioning action.

[0060] Furthermore, the air pressure of the first clamping cylinder 23 for clamping the positioning jaws 21 is 0.2MPa-0.3MPa. This configuration can provide sufficient clamping force to clamp the wafer frame 5 without affecting the position fine-tuning and precise positioning of the wafer frame 5, taking into account both clamping stability and flexible adjustability.

[0061] Specifically, see Figure 1 and Figure 2 The fixing assembly 3 also includes a fixing plate 32, a second clamping cylinder 33 and a telescopic cylinder 34. The fixing plate 32 is arranged on the other side of the carrier plate 1 and can move back and forth along the axis of the carrier plate 1. The two second clamping cylinders 33 are respectively arranged on both sides of the fixing plate 32, and are used to drive the fixed clamping claws 31 to fix and clamp the wafer frame 5. The telescopic cylinder 34 is arranged on the other side of the carrier plate 1 and its movable end is connected to the fixing plate 32, and is used to push the second clamping cylinder 33 to move toward the wafer frame 5. The telescopic cylinder 34 pushes the fixing plate 32 and the second clamping cylinder 33 toward the wafer frame 5, and the second clamping cylinder 33 then firmly clamps the wafer frame 5 to ensure that the relative position of the wafer frame 5 and the carrier plate 1 remain unchanged during the flipping or transfer process, thereby improving stability during movement.

[0062] Further, see Figure 1 and Figure 3 The reversible wafer clamping device also includes a detection optical fiber 6 and an overload protection component 7. The detection optical fiber 6 is arranged at the other end of the carrier plate 1 and on both sides of the positioning clamping claw 21 to detect whether the wafer frame 5 is positioned accurately. Figure 4The overload protection assembly 7 includes a fixed base 71, a support frame 72, a tension spring, a shielding piece 73 and a slot-shaped photoelectric sensor 74. The support frame 72 is arranged on the fixed base 71 and can move back and forth along the axis of the supporting plate 1. The flip assembly 4 is arranged on one side of the support frame 72, and the supporting plate 1 is arranged on the other side of the support frame 72. The tension spring is horizontally arranged between the support frame 72 and the fixed base 71 to drive the support frame 72 to return to its original position. The shielding piece 73 is arranged on the fixed base 71. The slot-shaped photoelectric sensor 74 is arranged on the support frame 72, and the shielding piece 73 cooperates with the slot-shaped photoelectric sensor 74 to generate a signal alarm.

[0063] The detection optical fiber 6 is used to monitor whether the wafer frame 5 has been accurately positioned by the positioning component 2 before the flipping action. If it has not reached the predetermined position, the subsequent action can be prevented to avoid mis-clamping or offset. The setting of the overload protection component 7 can make the support frame 72 and the carrier plate 1 retreat as a whole to provide buffer protection for the device when the device is pushed by an external force exceeding the set value. At this time, the shielding piece 73 is out of the detection range of the slot-type photoelectric sensor 74 and triggers an alarm. After receiving the signal, the system executes the protection logic to remind the staff. The tension spring can return the support frame 72 to its original position after the external force is removed, realizing dual mechanical and logical protection.

[0064] It should be noted that the movement of the first clamping cylinder 23, the fixing plate 32 and the support frame 72 is achieved by moving the slide rail in conjunction with the moving slider, which will not be described in detail here.

[0065] See Figure 5 The embodiment of the present invention further provides a control method for a reversible wafer clamping device, comprising the following steps:

[0066] Step S10: Control the positioning claws 21 to cooperate with the positioning pin group 22 to clamp and position the wafer frame 5;

[0067] Step S20: After the wafer frame 5 is accurately positioned and adjusted, the fixed clamping claws 31 are controlled to fix and clamp the wafer frame 5;

[0068] Step S30 : controlling the servo motor 41 of the flipping assembly 4 to cooperate with the carrier plate 1 to drive the positioning assembly 2 and the fixing assembly 3 to rotate so as to flip the wafer frame 5 .

[0069] See Figure 6 , step S10 includes the following steps:

[0070] Step S101: Control the travel cylinder 24 of the positioning assembly 2 to push the first clamping cylinder 23 of the positioning assembly 2 forward so that the positioning claw 21 reaches the edge of the target wafer frame 5;

[0071] Step S102: Control the first clamping cylinder 23 to clamp the positioning claw 21 so that the positioning claw 21 can limit and clamp the wafer frame 5;

[0072] Step S103 : Controlling the travel cylinder 24 to return to its original position so as to retract the positioning jaws 21 and simultaneously cooperate with the positioning pin assembly 22 to position the wafer frame 5 .

[0073] See Figure 7 , step S20 includes the following steps:

[0074] Step S201: controlling the detection optical fiber 6 of the clamping device to detect whether the wafer frame 5 is positioned correctly;

[0075] Step S202: After the wafer frame 5 is accurately positioned and adjusted, the telescopic cylinder 34 of the fixing assembly 3 is controlled to extend to push the second clamping cylinder 33 of the fixing assembly 3 forward so that the fixing claw 31 reaches the edge of the target wafer frame 5;

[0076] Step S203 : controlling the second clamping cylinder 33 to clamp the fixed clamping claw 31 to fix the wafer frame 5 .

[0077] When the device is in use, the robotic arm moves the clamping device to the front of the magazine. The travel cylinder 24 pushes the positioning claw 21 to the edge of the target wafer frame 5. The first clamping cylinder 23 and the positioning pin group 22 cooperate to complete the positioning of the wafer frame 5. The detection optical fiber 6 confirms that the wafer frame 5 is in place. The telescopic cylinder 34 drives the second clamping cylinder 33 and the fixed claw 31 to clamp the wafer frame 5 for a second time. The robotic arm moves the clamping device to the target workstation for unloading. When the wafer frame 5 needs to be flipped, the servo motor 41 drives the carrier plate 1 to rotate around its axis to complete the flip of the wafer frame 5.

[0078] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A reversible wafer clamping device, characterized in that: include: Loading plate; A positioning assembly, comprising a positioning jaw disposed on the carrier plate and a positioning pin group disposed on both sides of the carrier plate, wherein the positioning jaw can reciprocate along the axis of the carrier plate and is used to limit and clamp the wafer frame, and the positioning jaw cooperates with the positioning pin group to adjust the positioning of the wafer frame; A fixing assembly, comprising a fixing jaw disposed on the carrier plate and reciprocating along the axis of the carrier plate, the fixing jaw being located between the positioning jaw and the positioning pin group, and being used to fix and clamp the wafer frame after the positioning assembly positions and adjusts the wafer frame; The flip assembly includes a servo motor, wherein the movable end of the servo motor is connected to the carrier plate and is used for driving the positioning assembly and the fixing assembly to rotate so as to flip the wafer frame.

2. The reversible wafer clamping device according to claim 1, characterized in that: The positioning pin set includes: A first positioning pin is provided corresponding to the positioning groove on the edge of the wafer frame, and the first positioning pin cooperates with the positioning groove to position the wafer frame in the horizontal direction; The second positioning pin is recessed inwardly along its circumference to form a guide positioning groove. The second positioning pin cooperates with the edge of the wafer frame to position the wafer frame in the vertical direction.

3. The reversible wafer clamping device according to claim 1, characterized in that: The positioning component also includes: A first clamping cylinder is provided on one side of the carrier plate and can reciprocate along the axis of the carrier plate to drive the positioning claws to limit and clamp the wafer frame; A traveling cylinder is provided on one side of the carrier plate, wherein a movable end of the traveling cylinder contacts and is not connected to the first clamping cylinder, and is used to push the first clamping cylinder to move toward the wafer frame; A return spring is provided at one end of the first clamping cylinder and the supporting plate away from the positioning clamping claw, and is used for driving the first clamping cylinder to return to its original position.

4. The reversible wafer clamping device according to claim 3, characterized in that: The air pressure of the first clamping cylinder for clamping the positioning clamping claws is 0.2MPa-0.3MPa.

5. The reversible wafer clamping device according to claim 1, wherein: The fixing assembly further comprises: A fixed plate, disposed on the other side of the supporting plate and capable of reciprocating along the axis of the supporting plate; Two second clamping cylinders are respectively arranged on both sides of the fixed plate, and are used to drive the fixed clamping claws to fix and clamp the wafer frame; The telescopic cylinder is arranged on the other side of the supporting plate and its movable end is connected to the fixed plate, and is used to push the second clamping cylinder to move toward the wafer frame.

6. The reversible wafer clamping device according to claim 3, characterized in that: Also includes: The detection optical fiber is arranged at the other end of the carrier plate and located on both sides of the positioning clamping claws, and is used to detect whether the wafer frame is accurately positioned.

7. The reversible wafer clamping device according to claim 1, wherein: Also included is an overload protection component, the overload protection component comprising: Fixed base; A support frame is provided on the fixed base and can reciprocate along the axis direction of the bearing plate, the flip assembly is provided on one side of the support frame, and the bearing plate is provided on the other side of the support frame; A tension spring, horizontally arranged between the support frame and the fixed base, for driving the support frame to return to its original position; A shielding sheet is provided on the fixed base; A slot-shaped photoelectric sensor is arranged on the support frame, and the shielding piece cooperates with the slot-shaped photoelectric sensor to perform a signal alarm.

8. A control method for a reversible wafer clamping device according to any one of claims 1 to 7, characterized in that: The steps include: Controlling the positioning claws to cooperate with the positioning pin group to clamp and position the wafer frame; After the wafer frame is accurately positioned and adjusted, the fixed clamping claws are controlled to fix and clamp the wafer frame; The servo motor controlling the flipping assembly cooperates with the carrying plate to drive the positioning assembly and the fixing assembly to rotate so as to flip the wafer frame.

9. The control method of the reversible wafer clamping device according to claim 8, characterized in that: The controlling of the positioning claws to cooperate with the positioning pin group to clamp and position the wafer frame includes the following steps: Controlling the travel cylinder of the positioning assembly to push the first clamping cylinder of the positioning assembly forward so that the positioning claw reaches the edge of the target wafer frame; Controlling the first clamping cylinder to clamp the positioning claw so that the positioning claw can limit and clamp the wafer frame; The traveling cylinder is controlled to return to its original position so that the positioning clamp is retracted, and at the same time, the wafer frame is positioned in cooperation with the positioning pin group.

10. The control method of the reversible wafer clamping device according to claim 8, characterized in that: After the wafer frame is accurately positioned and adjusted, controlling the fixed clamping claws to fix and clamp the wafer frame includes the following steps: Controlling the detection optical fiber of the clamping device to detect whether the wafer frame is accurately positioned; After the wafer frame is accurately positioned and adjusted, the telescopic cylinder of the fixing assembly is controlled to extend to push the second clamping cylinder of the fixing assembly forward so that the fixing claw reaches the edge of the target wafer frame; The second clamping cylinder is controlled to clamp the fixed clamping claw to fix the wafer frame.

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