Jacking mechanism for chip production and jacking method thereof

Abstract

The invention belongs to the technical field of electrical element production, and particularly relates to a device specially suitable for processing wafers in the semiconductor processing process, in particular to a jacking mechanism for chip production and a jacking method thereof. The jacking mechanism for chip production comprises a frame, an outer sleeve and an inner core rod, and the top of the inner core rod is provided with an umbrella rib-shaped ejector pin and a driving piece. The umbrella-rib-shaped ejector pin is unfolded in the radial direction to support the four right angles of the crystal grain, so that the stripping force is concentrated in the right-angle area instead of the whole surface of the crystal grain, the microcrack at the edge of the crystal grain caused by whole-surface jacking is avoided, and the structural integrity of a subsequent chip is guaranteed. Heat of the heating block is transmitted to contact point glue only through the umbrella-rib-shaped ejector pin, the heat influence range is remarkably reduced, and accidental falling caused by glue softening of adjacent crystal grains is prevented. Meanwhile, stripping is started from the right-angle positions of the crystal grains through the umbrella-rib-shaped ejector pins, the glue melting area is gradually expanded from outside to inside, violent springback caused by instant overall separation of the blue film is avoided, and therefore the risk of displacement of the peripheral crystal grains is eliminated.

Description

Technical Field

[0001] The present invention belongs to the technical field of electrical component production, and specifically relates to a device specially suitable for processing chips in a semiconductor processing process, and more particularly to a lifting mechanism and a lifting method for chip production. Background Art

[0002] During the chip manufacturing process, each crystal on the wafer is cut and separated to form an independent chip. The crystal removal process requires peeling the target crystal from the carrier blue film.

[0003] In the related art, in order to fix the wafer on the blue film, the wafer is fixed by gluing. When the die is separated, the blue film is heated by a pin of the same size as the die to accelerate the separation of the die from the blue film. However, this lifting mechanism has the following problems: First, when separating the die from the wafer, the die is pushed by a pin. When the die is separated from the blue film, the blue film instantly separates from the entire back of the die. The peeling force can easily cause cracks at the right angles of the edges of the brittle die, affecting the quality of the chip.

[0004] Second, because the ejector pins are in contact with the entire back side of the die, the blue film needs to be lifted to a higher height during separation, causing the blue film to be stretched, which in turn affects the positioning of the adjacent die. At the same time, when the blue film rebounds, it will cause the surrounding die to be dislocated, increasing the difficulty of lifting the subsequent die.

[0005] Third, because the ejector pin heats the glue in the contact area, the area outside the contact area is also heated by the residual heat, which reduces the adhesion between the adjacent die and the blue film. During the blue film rebound process, the adjacent die may accidentally fall off.

[0006] Therefore, how to avoid damage to the right angle of the grain edge when the grain is separated from the blue film while preventing the deformation of the blue film from affecting the initial position of the remaining grains is a technical problem that needs to be solved urgently.

[0007] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the Invention

[0008] The embodiments of the present disclosure at least provide a lifting mechanism and a lifting method for chip production.

[0009] In a first aspect, an embodiment of the present disclosure provides a lifting mechanism for chip production, comprising: frame; an outer sleeve disposed on top of the frame; An inner core rod, which passes through the outer sleeve and extends into the frame, and an umbrella-shaped thimble is provided on the top of the inner core rod; Wherein, a heating block is provided on the top of the inner core rod, and the rib-shaped thimble is made of a heat-conducting material, and the rib-shaped thimble is used to transfer the heat generated by the heating block to the rib-shaped thimble; A driving member is used to drive the inner core rod to rise so as to extend the rib-shaped ejector pin from the through hole at the top of the outer sleeve. The rib-shaped ejector pin opens radially outward to support the four right angles of the grain of the wafer above the blue film, and melt the glue corresponding to the contact point between the rib-shaped ejector pin and the blue film, so as to separate the grain from the wafer.

[0010] In an optional embodiment, the rib-shaped ejector pin includes: a needle rod, the bottom of which is elastically connected to the top surface of the inner core rod via a buffer spring; Four top claws, the four top claws are rotatably arranged on the top of the needle rod and arranged along the circumference of the needle rod; After the rib-shaped ejector pin extends from the through hole at the top of the outer sleeve, the four ejector claws open radially outward to support the four right angles of the crystal grain of the wafer above the blue film.

[0011] In an optional embodiment, a slot is provided at the lower end of the top claw; An insert block is provided on the top of the needle bar; The inserting block of the needle rod is connected to the slot of the top claw via a first rotating shaft.

[0012] In an optional embodiment, the driving member includes: a linear drive portion, which is disposed in the frame; A sliding portion provided on the linear drive portion Wherein, the inner core rod is arranged on the top of the sliding part; When the linear driving part drives the sliding part to move up and down, the inner core rod is driven to move up and down synchronously.

[0013] In an optional embodiment, a guide rod is further provided on the top of the frame; The bottom of the outer sleeve is sleeved on the guide rod and is slidably connected to the frame through the guide rod; The inner wall of the frame is provided with a linkage member; When the sliding part rises, the linkage is triggered to drive the outer sleeve to rise, so as to drive the rib-shaped ejector pins to contract radially inward through the outer sleeve, so as to gradually separate the blue film facing the rib-shaped ejector pins from the four right angles of the grain inward.

[0014] In an optional embodiment, the linkage member is configured to amplify the rising distance of the sliding portion and transmit it to the outer sleeve, so that the rising speed V1 of the outer sleeve is greater than the rising speed V2 of the inner core rod.

[0015] In an optional embodiment, the linkage comprises: Support frame; A V-shaped lever plate, which is rotatably connected to the support frame via a second rotation axis; The first arm plate of the V-shaped lever plate is arranged toward the sliding portion, and the second arm plate of the V-shaped lever plate abuts against the bottom of the outer sleeve; Furthermore, the length of the first arm plate is smaller than the length of the second arm plate.

[0016] In an optional embodiment, a negative pressure pipeline is provided in the wall of the outer sleeve; One end of the negative pressure pipeline is connected to an external negative pressure source, and the other end is connected to the outside through a through hole in the outer sleeve where the umbrella-shaped ejector pin is not installed, so that negative pressure is generated between the top surface of the outer sleeve and the blue film.

[0017] In a second aspect, the embodiments of the present disclosure further provide a lifting method applied to the aforementioned lifting mechanism for chip production, the lifting method comprising: The blue film with the wafer bonded to it is placed on top of the lifting mechanism for chip production through an external conveying mechanism; The position of the frame is adjusted by an external position adjustment structure so that the rib-shaped ejector pins of the inner core rod are opposite to the corresponding grains; The heating block starts to heat up and transfers the heat to the rib-shaped thimbles; The driving member drives the inner core rod to rise, so that the rib-shaped ejector pins extend from the through holes at the top of the outer sleeve. The rib-shaped ejector pins open radially outward and support the four right angles of the grain. The glue corresponding to the contact point between the rib-shaped ejector pin and the blue film is melted by the rib-shaped ejector pin, and the driving part continues to drive the rib-shaped ejector pin to continue to rise until the die is separated from the wafer and falls off.

[0018] In an optional embodiment, the driving member includes: a linear drive portion, which is disposed in the frame; A sliding portion provided on the linear drive portion Wherein, the inner core rod is arranged on the top of the sliding part; When the linear drive portion drives the sliding portion to move up and down, the inner core rod is simultaneously driven to move up and down; A guide rod is also provided on the top of the frame; The bottom of the outer sleeve is sleeved on the guide rod and is slidably connected to the frame through the guide rod; The inner wall of the frame is provided with a linkage member; The driving member drives the inner core rod to rise so that the rib-shaped ejector pins extend from the through holes at the top of the outer sleeve, the rib-shaped ejector pins open radially outward, and support the four right angles of the grain, and the step further includes: When the sliding part rises, the linkage is triggered to drive the outer sleeve to rise, so as to drive the rib-shaped ejector pins to contract radially inward through the outer sleeve, so as to gradually separate the blue film facing the rib-shaped ejector pins from the four right angles of the grain inward.

[0019] The beneficial effect of the present invention is that the lifting mechanism and lifting method for chip production support the four right angles of the grain after the umbrella-shaped ejector pins are expanded radially, so that the peeling force is concentrated on the right-angle area rather than the entire surface of the grain, avoiding micro cracks on the edge of the grain caused by lifting the entire surface, and ensuring the integrity of the subsequent chip structure. The heat of the heating block is only transferred to the contact point glue through the ejector claws, which significantly reduces the range of heat influence and prevents accidental falling off caused by the softening of the glue of adjacent grains. At the same time, the umbrella-shaped ejector pins start the peeling from the right angle of the grain, and the glue melting area gradually expands from the outside to the inside, avoiding the violent rebound caused by the instantaneous overall detachment of the blue film, thereby eliminating the risk of displacement of the surrounding grains.

[0020] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited herein and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 A schematic structural diagram of a chip production lifting mechanism provided by an embodiment of the present disclosure; Figure 2 A cross-sectional view of a lifting mechanism for chip production provided by an embodiment of the present disclosure; Figure 3 A schematic diagram of the connection between the sliding portion and the inner rod provided in an embodiment of the present disclosure; Figure 4 A schematic diagram of an umbrella-shaped ejector pin provided in an embodiment of the present disclosure extending from a via hole; Figure 5 A schematic diagram of a state in which a chip production lifting mechanism according to an embodiment of the present disclosure lifts a die; Figure 6 A flowchart of a lifting method for a lifting mechanism for chip production provided in an embodiment of the present disclosure; Figure 7 A schematic diagram of bonding a wafer and a blue film provided in an embodiment of the present disclosure.

[0024] In the figure: 100, frame; 110, guide rod; 120, linkage member; 121, support frame; 122, V-shaped lever plate; 123, second rotating shaft; 200, outer sleeve; 210, through hole; 220, negative pressure pipeline; 300, inner core rod; 310, umbrella-shaped ejector pin; 311, ejector claw; 3111, slot; 312, needle rod; 3121, insert block; 313, first rotating shaft; 314, buffer spring; 320, heating block; 400, driving member; 410, linear driving part; 420, sliding part; 500, blue film; 600, grain. DETAILED DESCRIPTION

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0026] In this document, when it is mentioned that a first component is located on a second component, this may mean that the first component may be directly formed on the second component, or that a third component may be interposed between the first component and the second component. In addition, in the drawings, the thickness of components may be exaggerated or reduced in order to effectively describe technical content.

[0027] As used herein, when an element or layer is referred to as being "located on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly located on, engaged, connected, attached to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0028] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." when following a list of elements modify the entire list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0029] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limiting. As used herein, the singular articles "a", "an" and "the" may also be intended to include plural forms, unless this document clearly indicates otherwise. The terms "comprise", "include" and "have" are inclusive and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the particular order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0030] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations, aspects, or designs. Instead, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0031] Research has found that the size of the ejector pin in the existing technology is the same as the size of the grain. When separating the grain from the blue film, the blue film instantly detaches from the entire back of the grain. The peeling force can easily cause cracks at the right angles of the edge of the brittle grain. At the same time, when the ejector pin heats the glue area of ​​the blue film, it can easily melt the glue area of ​​the surrounding grains, thereby causing the adhesion of the adjacent grains to decrease. When the blue film is deformed, the grains are prone to dislocation or falling off.

[0032] Based on the above research, the embodiment of the present disclosure provides a lifting mechanism and a lifting method for chip production, which supports the four right angles of the grain 600 after the umbrella-shaped ejector pins 310 are radially expanded, thereby avoiding micro cracks on the edge of the grain 600 caused by lifting the entire surface, and ensuring the integrity of the subsequent chip structure. At the same time, the heat of the heating block 320 is only transferred to the contact point glue through the ejector claws 311, which significantly reduces the heat impact range and prevents accidental falling off caused by the softening of the glue of adjacent grains 600.

[0033] The defects in the above solutions are the results obtained by the inventors after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present disclosure in this article should be the contributions made by the inventors to the present disclosure during the disclosure process.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.

[0035] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0036] See also Figure 1 and Figure 2At least one embodiment provides a lifting mechanism for chip production, comprising: a frame 100; an outer sleeve 200, which is arranged on the top of the frame 100; an inner core rod 300, which passes through the outer sleeve 200 and extends into the frame 100, and an umbrella-shaped ejector pin 310 is provided on the top of the inner core rod 300; wherein a heating block 320 is provided on the top of the inner core rod 300, and the umbrella-shaped ejector pin 310 is made of a heat-conducting material, and the umbrella-shaped ejector pin is used to generate heat from the heating block 320. The heat is transferred to the rib-shaped ejector pins 310; the driving member 400 is used to drive the inner core rod 300 to rise so as to extend the rib-shaped ejector pins 310 from the through-holes 210 at the top of the outer sleeve 200, and the rib-shaped ejector pins 310 are opened radially outward to support the four right angles of the grain 600 of the wafer above the blue film 500, and melt the glue corresponding to the contact points between the rib-shaped ejector pins 310 and the blue film 500, so as to separate the grain 600 from the wafer.

[0037] The schematic diagram of the wafer and the blue film 500 being bonded is shown in FIG. Figure 7 As shown, the model of the blue film is Nitto No. 319Y-4M, and the peeling temperature of the blue film is 100-120°C.

[0038] By radially expanding the rib-shaped ejector pins 310 to support the four right angles of the die 600, the peeling force is concentrated in the right-angle area rather than the center of the die 600, avoiding micro-cracks on the edge of the die 600 caused by lifting the entire surface, and ensuring the integrity of the subsequent chip structure. The heat of the heating block 320 is only transferred to the contact point glue through the top claws 311, significantly reducing the range of heat influence and preventing accidental detachment caused by the softening of the glue of adjacent die 600. At the same time, the rib-shaped ejector pins 310 initiate peeling from the right angle of the die 600, and the melted glue area gradually expands from the outside to the inside, avoiding the violent rebound caused by the instantaneous separation of the blue film 500 as a whole, thereby eliminating the risk of displacement of the surrounding die 600.

[0039] It should be noted that a plurality of resistance wires are provided in the heating block 320 , and the heating block 320 is heated by the resistance wires, thereby transferring heat to the top claws 311 to heat the glue between the blue film 500 and the die 600 .

[0040] Please continue reading Figure 1 and Figure 2 The rib-shaped ejector pin 310 includes: a needle rod 312, the bottom of which is elastically connected to the top surface of the inner core rod 300 through a buffer spring 314; four top claws 311, which are rotatably arranged on the top of the needle rod 312 and are arranged along the circumference of the needle rod 312; after the rib-shaped ejector pin 310 extends from the through hole 210 at the top of the outer sleeve 200, the four top claws 311 are opened radially outward (the opening direction is as shown in FIG. Figure 1As shown in F), the four right angles of the crystal grain 600 of the wafer above the blue film 500 are supported, and the support state is as shown in FIG. Figure 4 shown.

[0041] In the inner core rod 300 Figure 4 When the rib-shaped ejector pin 310 rises in the direction indicated by F1, it extends from the through hole 210 of the outer sleeve 200. At this time, the ejector claw 311 moves along the Figure 4 Expand in the direction shown by F2.

[0042] It should be noted that the opening angle of the top claw 311 is adapted to the size of the die 600, and the separation requirements of dies 600 of different sizes can be met by replacing the umbrella-shaped ejector pins 310 of different sizes. The opening angle of the top claw 311 can be limited by the cooperation of the limit block and the limit groove.

[0043] Through the elastic connection design of the buffer spring 314 , when the top claw 311 contacts the die 600 at a right angle, the buffer spring 314 absorbs the impact energy, thereby preventing the rigid support from causing the brittle die 600 to break.

[0044] Please continue reading Figure 1 The lower end of the top claw 311 is provided with a slot 3111; the top of the needle rod 312 is provided with an insert block 3121; the insert block 3121 of the needle rod is connected to the slot 3111 of the top claw 311 through a first rotating shaft 313.

[0045] It should be noted that the size of the four top claws 311 after opening is adapted to the size of the die 600 .

[0046] In a preferred embodiment, a limiting block and a limiting groove may be respectively provided on the fitting surfaces of the slot 3111 and the inserting block 3121 , so as to limit the opening angle of the top claw 311 .

[0047] See also Figure 2 and Figure 3 , a linear drive portion 410 is provided in the frame 100; a sliding portion 420 is provided on the linear drive portion 410 wherein the inner core rod 300 is provided on the top of the sliding portion 420; the linear drive portion 410 drives the sliding portion 420 to move up and down (the lifting direction is as shown in FIG. Figure 2 When the inner core rod 300 is moved up and down synchronously (as shown in F in the middle), the inner core rod 300 is driven to move up and down synchronously.

[0048] In which, a guide rod 110 is also provided on the top of the frame 100; the bottom of the outer sleeve 200 is sleeved on the guide rod 110, and is slidably connected to the frame 100 through the guide rod 110; a linkage part 120 is provided on the inner wall of the frame 100; when the sliding part 420 rises, the linkage part 120 is triggered to drive the outer sleeve 200 to rise, so as to drive the rib-shaped ejector pin 310 to contract radially inward through the outer sleeve, so as to gradually separate the blue film 500 facing the rib-shaped ejector pin 310 from the four right angles inward of the grain 600.

[0049] In the inner core rod 300 Figure 5 When the crystal grain 600 is pushed in the direction indicated by F1, the linkage member 120 amplifies the travel of the sliding portion 420 and forces the rib ejector pins to contract radially (e.g. Figure 5 As shown in F2 in the figure, the blue film 500 adhesive layer is separated from the right angle inward and peeled off gradually, thereby reducing the deformation of the blue film 500 and eliminating the rebound caused by instantaneous separation and the damage to the right-angle edge of the die 600.

[0050] It should be noted that after the blue film 500 is separated from the die 600 , the blue film still maintains its integrity.

[0051] Specifically, the linkage member 120 is configured to amplify the rising distance of the sliding portion 420 and transmit it to the outer sleeve 200 , so that the rising speed V1 of the outer sleeve 200 is greater than the rising speed V2 of the inner core rod 300 .

[0052] Since the structure of the lifting mechanism for chip production is relatively compact, it is not appropriate to add an additional driving source. Therefore, in a preferred embodiment, the linkage 120 includes: a support frame 121; a V-shaped lever plate 122, which is rotatably connected to the support frame 121 through a second rotating shaft 123; the first arm plate of the V-shaped lever plate 122 is arranged toward the sliding portion 420, and the second arm plate of the V-shaped lever plate 122 is abutted against the bottom of the outer sleeve 200; and the length of the first arm plate is less than the length of the second arm plate.

[0053] The linkage member 120 uses a lever structure to amplify the stroke. Figure 4 When the direction F1 is raised, the first arm plate of the V-shaped lever plate 122 is touched, so that the V-shaped lever plate 122 moves along Figure 4 The outer sleeve 200 is driven by the rotation shown in F3, thereby completing the differential movement of the outer sleeve 200 and the inner core rod 300 based on the use of one driving member 400, reducing the use of the driving source.

[0054] It should be noted that the structural strength of the linkage member 120 meets the lifting requirement of the supporting outer sleeve 200 .

[0055] See also Figure 2 A negative pressure pipeline 220 is provided in the wall of the outer sleeve 200; one end of the negative pressure pipeline 220 is connected to an external negative pressure source, and the other end is connected to the outside through a through hole 210 in the outer sleeve 200 where the umbrella-shaped ejector pin 310 is not installed, so as to generate negative pressure between the top surface of the outer sleeve 200 and the blue film 500.

[0056] By applying negative pressure through the via 210 where the umbrella-shaped ejector pin is not installed, the top surface of the outer sleeve 200 generates an adsorption force on the blue film 500, thereby suppressing the overall fluctuation of the blue film 500 during the peeling process. At the same time, it also provides adsorption force for the peeling of the blue film 500, accelerates the separation of the blue film 500 and the grain 600, and reduces the deformation of the blue film 500.

[0057] The disclosed embodiment also provides a lifting method for a lifting mechanism used in chip production as described above, wherein the rib-shaped ejector pins 310 are radially expanded to support the four right angles of the grain 600, so that the peeling force is concentrated in the right-angle area rather than the center of the grain 600, thereby avoiding micro-cracks on the edge of the grain 600 caused by lifting the entire surface, and ensuring the integrity of the subsequent chip structure. The heat of the heating block 320 is only transferred to the contact point glue through the ejector claws 311, which significantly reduces the range of heat influence and prevents accidental falling off caused by the softening of the glue of adjacent grains 600. At the same time, the rib-shaped ejector pins 310 start peeling from the right angle of the grain 600, and the melted glue area gradually expands from the outside to the inside, avoiding the violent rebound caused by the instantaneous overall detachment of the blue film 500, thereby eliminating the risk of displacement of the surrounding grains 600.

[0058] Specifically, see Figure 6 , the jacking method includes: S110: placing the blue film 500 bonded with the wafer on top of a lifting mechanism for chip production through an external conveying mechanism; S120: Adjusting the position of the frame 100 through the external position adjustment structure so that the rib-shaped ejector pins 310 of the inner core rod 300 are opposite to the corresponding die 600; S130: The heating block 320 starts heating and transfers heat to the rib-shaped ejector pins 310; S140: The driving member 400 drives the inner core rod 300 to rise, so that the rib-shaped ejector pins 310 extend from the through-holes 210 at the top of the outer sleeve 200. The rib-shaped ejector pins 310 open radially outward and support the four right angles of the die 600. S150: The glue corresponding to the contact point between the rib-shaped ejector pin 310 and the blue film 500 is melted by the rib-shaped ejector pin 310 , and the driving member 400 continues to drive the rib-shaped ejector pin 310 to rise continuously until the die 600 is separated from the wafer.

[0059] It should be noted that after step S150 , the crystal 600 is sucked by the crystal extraction device disposed on top of the crystal 600 to complete the removal of the crystal 600 . At the same time, the driving member 400 drives the inner core rod 300 to descend, so that the umbrella-shaped ejector pin 310 is reset.

[0060] After the dies 600 on the blue film 500 are completely removed, the blue film 500 is removed from the external support frame, and the next wafer is placed in the external support frame to continue removing the material.

[0061] Among them, step S140 also includes: when the sliding part 420 rises, triggering the linkage part 120 to drive the outer sleeve 200 to rise, so as to shrink the rib-shaped ejector pin 310 radially inward, so as to gradually separate the blue film 500 corresponding to the rib-shaped ejector pin 310 from the four right angles of the grain 600 inward.

[0062] In summary, the present invention provides a chip production lifting mechanism and a lifting method thereof, wherein the chip production lifting mechanism comprises: a frame 100; an outer sleeve 200, which is arranged at the top of the frame 100; an inner core rod 300, which passes through the outer sleeve 200 and extends into the frame 100, and the top of the inner core rod 300 is provided with an umbrella-shaped ejector pin 310; wherein the top of the inner core rod 300 is provided with a heating block 320, the umbrella-shaped ejector pin 310 is made of a heat-conducting material, and the umbrella-shaped ejector pin is used to The heat generated by the heating block 320 is transferred to the rib-shaped ejector pins 310. The driving member 400 is used to drive the inner core rod 300 upward to extend the rib-shaped ejector pins 310 from the vias 210 at the top of the outer sleeve 200. The rib-shaped ejector pins 310 open radially outward to support the four right angles of the die 600 on the wafer above the blue film 500. The glue corresponding to the contact points between the rib-shaped ejector pins 310 and the blue film 500 melts to facilitate the separation and removal of the die 600 from the wafer. By radially expanding the rib-shaped ejector pins 310 to support the four right angles of the die 600, the peeling force is concentrated on the right-angle areas rather than the center of the die 600, avoiding micro-cracks at the edge of the die 600 caused by lifting the entire surface, thereby ensuring the integrity of the subsequent chip structure. Heat from the heating block 320 is transferred solely to the glue at the contact point via the ejector claws 311, significantly reducing the thermal impact zone and preventing accidental dislodging of adjacent die 600 due to softening of the glue. Simultaneously, the rib-shaped ejector pins 310 initiate peeling at right angles to the die 600, gradually expanding the melted glue area from the outside inward. This prevents the sudden and violent rebound caused by the entire blue film 500 detaching, thereby eliminating the risk of displacement of the surrounding die 600.

[0063] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0064] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used herein unless expressly indicated herein. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0065] Spatially relative terms, such as "inside," "outside," "below," "beneath," "down," "above," "on," etc., may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientations depicted in the figures, spatially relative terms may be intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as being "below" or "below" other elements or features will be oriented to be "above" the other elements or features. Thus, the example term "below" may encompass both above and below orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0066] In the above discussion, unless otherwise indicated, the terms "about," "approximately," "substantially," etc., when used to describe a numerical value, mean a variation of + / - 10% of the value.

[0067] With the above-described preferred embodiments of the present invention as a guide, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A lifting mechanism for chip production, characterized in that: include: frame(100); an outer sleeve (200) disposed on top of the frame (100); An inner core rod (300) passes through the outer sleeve (200) and extends into the frame (100), and an umbrella-shaped top pin (310) is provided on the top of the inner core rod (300); Wherein, a heating block (320) is provided on the top of the inner core rod (300), the rib-shaped top pin (310) is made of a heat-conducting material, and the rib-shaped top pin is used to transfer heat generated by the heating block (320) to the rib-shaped top pin (310); A driving member (400) for driving the inner core rod (300) to rise so as to extend the rib-shaped ejector pin (310) from the through hole (210) at the top of the outer sleeve (200), and the rib-shaped ejector pin (310) opens radially outward to support the four right angles of the crystal grain (600) of the wafer above the blue film (500), and melts the glue corresponding to the contact point between the rib-shaped ejector pin (310) and the blue film (500), so as to facilitate the separation and removal of the crystal grain (600) from the wafer; The rib-shaped ejector pin (310) comprises: A needle rod (312), the bottom of which is elastically connected to the top surface of the inner core rod (300) via a buffer spring (314); Four top claws (311), the four top claws (311) are rotatably arranged on the top of the needle rod (312) and are arranged along the circumference of the needle rod (312); After the umbrella-shaped ejector pin (310) extends from the through hole (210) at the top of the outer sleeve (200), the four ejector claws (311) open radially outward to support the four right angles of the crystal grain (600) of the wafer above the blue film (500); The lower end of the top claw (311) is provided with a slot (3111); An insert block (3121) is provided on the top of the needle rod (312); The inserting block (3121) of the needle bar is connected to the slot (3111) of the top claw (311) via a first rotating shaft (313).

2. The chip production lifting mechanism according to claim 1, wherein: The driving member (400) comprises: A linear drive unit (410) disposed within the frame (100); A sliding portion (420) is provided on the linear drive portion (410) Wherein, the inner core rod (300) is arranged on the top of the sliding portion (420); When the linear driving portion (410) drives the sliding portion (420) to move up and down, it simultaneously drives the inner core rod (300) to move up and down.

3. The chip production lifting mechanism according to claim 2, wherein: A guide rod (110) is also provided on the top of the frame (100); The bottom of the outer sleeve (200) is sleeved on the guide rod (110) and is slidably connected to the frame (100) via the guide rod (110); The inner wall of the frame (100) is provided with a linkage member (120); When the sliding portion (420) rises, the linkage member (120) is triggered to drive the outer sleeve (200) to rise, so as to drive the rib-shaped ejector pin (310) to contract radially inward through the outer sleeve, so as to gradually separate the blue film (500) facing the rib-shaped ejector pin (310) from the four right angles of the grain (600) inward.

4. The chip production lifting mechanism according to claim 3, characterized in that: The linkage member (120) is configured to amplify the rising distance of the sliding portion (420) and transmit it to the outer sleeve (200), so that the rising speed V1 of the outer sleeve (200) is greater than the rising speed V2 of the inner core rod (300).

5. The chip production lifting mechanism according to claim 4, characterized in that: The linkage member (120) includes: Support frame (121); A V-shaped lever plate (122) rotatably connected to the support frame (121) via a second rotation shaft (123); The first arm plate of the V-shaped lever plate (122) is arranged toward the sliding portion (420), and the second arm plate of the V-shaped lever plate (122) abuts against the bottom of the outer sleeve (200); Furthermore, the length of the first arm plate is smaller than the length of the second arm plate.

6. The chip production lifting mechanism according to claim 1, wherein: A negative pressure pipeline (220) is provided in the wall of the outer sleeve (200); One end of the negative pressure pipeline (220) is connected to an external negative pressure source, and the other end is connected to the outside through a through hole (210) in the outer sleeve (200) where the umbrella-shaped ejector pin (310) is not installed, so that negative pressure is generated between the top surface of the outer sleeve (200) and the blue film (500).

7. A lifting method applied to the chip production lifting mechanism according to claim 1, characterized in that: The jacking method includes: The blue film (500) bonded with the wafer is placed above a lifting mechanism for chip production via an external conveying mechanism; The position of the frame (100) is adjusted by an external position adjustment structure so that the rib-shaped ejector pins (310) of the inner core rod (300) are opposite to the corresponding crystal grains (600); The heating block (320) starts heating and transfers the heat to the rib-shaped top pin (310); The driving member (400) drives the inner core rod (300) to rise, so that the rib-shaped ejector pin (310) extends from the through hole (210) at the top of the outer sleeve (200), and the rib-shaped ejector pin (310) opens radially outward and supports the four right angles of the grain (600); The glue corresponding to the contact point between the rib-shaped ejector pin (310) and the blue film (500) is melted by the rib-shaped ejector pin (310), and the rib-shaped ejector pin (310) is continuously driven to rise by the driving member (400) until the grain (600) is separated from the wafer and falls off.

8. The lifting method of the chip production lifting mechanism according to claim 7, characterized in that: The driving member (400) comprises: A linear drive unit (410) disposed within the frame (100); A sliding portion (420) is provided on the linear drive portion (410) Wherein, the inner core rod (300) is arranged on the top of the sliding portion (420); When the linear drive portion (410) drives the sliding portion (420) to move up and down, it simultaneously drives the inner core rod (300) to move up and down; A guide rod (110) is also provided on the top of the frame (100); The bottom of the outer sleeve (200) is sleeved on the guide rod (110) and is slidably connected to the frame (100) via the guide rod (110); The inner wall of the frame (100) is provided with a linkage member (120); The driving member (400) drives the inner core rod (300) to rise, so that the rib-shaped ejector pin (310) extends from the through hole (210) at the top of the outer sleeve (200), the rib-shaped ejector pin (310) opens radially outward, and the step of supporting the four right angles of the grain (600) also includes: When the sliding portion (420) rises, the linkage member (120) is triggered to drive the outer sleeve (200) to rise, so as to drive the rib-shaped ejector pin (310) to contract radially inward through the outer sleeve, so as to gradually separate the blue film (500) facing the rib-shaped ejector pin (310) from the four right angles of the grain (600) inward.

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