High-quality adapter daughter board applied between SOP devices

Abstract

The invention discloses a high-quality transfer daughter board applied between SOP devices, and relates to the technical field of printed boards, the daughter board comprises a daughter board substrate, board welding pads and elliptical through holes; the daughter board substrate comprises a target surface and a switching surface, the target surface is provided with a plurality of target bonding pads meeting replacement requirements, the target surface and the switching surface are provided with a plurality of device pin bonding pads, the wires extend to the inner sides of the target bonding pads and then are additionally provided with connecting wires which are in a 45-degree scattering shape and have preset lengths, and the terminals of the connecting wires are fixed through dragging via holes; the plate welding pad extends from the switching surface to the target surface along with the side surface of the daughter board substrate, and the part, located on the side surface of the daughter board substrate, of the plate welding pad shrinks inwards to form a semicircular hole; the number of the plate welding pads corresponds to the number of the target pads; the number of the elliptical through holes is at least two, and the elliptical through holes penetrate through the daughter board substrate and are symmetrically arranged; the problems that the welding quality of the adapter plate and the mother board is not stable, and welding is not firm are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit boards, and more particularly to a high-quality transfer daughter board used between SOP devices. Background Art

[0002] With the continuous advancement of modern information processing technology and the increase in demand and functions, the design and processing of printed circuit boards are gradually developing towards high density and multi-layer. Once the printed circuit board is completed, if there is a change in device selection, or the need to increase functions, or the iteration of design ideas, etc., the printed circuit board can only be redesigned and re-produced. Once the devices on the printed circuit board have completed the patch and soldering process, it will also involve the situation of flipping the soldered devices. The reliability and stability of the devices that need to be reused after flipping will also pose considerable risks. As the complexity of printed circuit board design increases, the economic and time costs incurred in the processes of remaking the printed circuit board and flipping the devices will become increasingly high.

[0003] Currently, the main solution to the above situation is to add a transfer daughterboard to the corresponding device that needs to be modified. By adjusting the internal interconnection relationship of the daughterboard, the electrical properties and functions can be changed by adding a daughterboard based on the original design. This enables the repeated use of the motherboard and the devices on it, and increases the adaptability of the motherboard. This not only simplifies and improves the efficiency of device selection and design version iteration verification, but also reduces the design and board manufacturing costs of new functional printed circuit boards, as well as the losses caused by the flipping and scrapping of original printed circuit boards and soldered devices. According to the current main design method of transfer daughterboards between devices, the A side (front) of the transfer daughterboard is designed to be the standard package of the new SOP device to be replaced; the B side (back) is designed to be the same size as the SOP device on the original motherboard. The new physical connection method is achieved through the internal interconnection of the daughterboard, and the transfer function is achieved by direct butt welding of the B side pads. In actual welding operation, the two printed circuit boards are welded together by directly applying solder paste to the welding surface, manually comparing them with the naked eye, and then using a hot air gun to blow welding. Conventional design and welding have the following three disadvantages: 1. In terms of design: the front and back pads are designed as conventional pads. However, after welding and use, as the daughter board is welded and subjected to various forces and the daughter board is repeatedly used, the pads on the mating surface are prone to tearing and falling off. 2. Since the pads on the B side of the daughterboard are not visible, the welding surface cannot be effectively observed during butt welding, which may cause the welding surface to be skewed or deviated, and solder may not fully cover the pads, resulting in cold solder joints and leaks. 3. Since the butt welding surfaces are at the same level, the solder cannot be effectively accumulated and solidified, resulting in a weak welding between the daughter board and the mother board. Summary of the Invention

[0004] The object of the present invention is to provide a high-quality adapter board for use between SOP devices, which solves the problems of unstable welding quality and unreliable welding between the adapter board and the motherboard.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions: This application provides a high-quality adapter board for use between SOP devices, including: The daughterboard substrate includes a target surface and a transfer surface. The target surface is provided with a plurality of target pads that meet the replacement requirements. The target surface and the transfer surface are respectively provided with a plurality of device pin pads corresponding to the number of target pads. Each device pin pad is connected to the target pad at the corresponding position through a trace. After the trace extends to the inner side of the target pad, a connection trace with a preset length and a 45-degree scattering shape is added. The terminal of the connection trace is fixed by a pull-through hole. The board welding pads extend from the transfer surface along the side of the daughterboard substrate to the target surface, and the side portion of the board welding pad located on the daughterboard substrate shrinks inward to form a semicircular hole, and is embedded in the semicircular notch opened in the daughterboard substrate through the semicircular hole; the number of the board welding pads corresponds to the number of the target pads; There are at least two elliptical through holes, which penetrate the daughter board substrate and are symmetrically arranged.

[0006] On the basis of the above technical solution, the present invention can also be improved as follows.

[0007] Furthermore, the daughterboard substrate is penetrated by a plurality of signal lead-out vias, and the device pin pads on the target surface and the device pin pads on the transfer surface are electrically connected through the signal lead-out vias.

[0008] Furthermore, the portion of the board welding pad located on the transfer surface forms a transfer pad, and the portion of the board welding pad located on the target surface forms a fixing portion.

[0009] Furthermore, multiple groups of connection pads are provided on the target surface and the transfer surface. Each group of connection pads is electrically connected through a through hole penetrating the daughterboard substrate, and the connection pads on the target surface are also electrically connected to the fixing part through wiring.

[0010] Furthermore, a stabilizing pad is provided on the target surface, and the stabilizing pad is electrically connected to the transfer pad via a through hole penetrating the daughterboard substrate.

[0011] Furthermore, the transfer pads and target pads are symmetrically arranged on both sides of the daughterboard substrate, and the transfer pads and target pads on the same side are staggered.

[0012] Furthermore, the diameter of the semicircular hole is half of the width of the transfer pad, and the center of the semicircular hole is located at the midpoint of the width of the transfer pad.

[0013] Furthermore, the outer diameters of the device pin pads and the connection pads are 0.1 mm to 0.6 mm.

[0014] Furthermore, the major diameter of the elliptical through hole is 0.2 mm to 1.2 mm, and the minor diameter of the elliptical through hole is 0.1 mm to 1 mm.

[0015] Furthermore, the two elliptical through holes are respectively located at the ends of the transfer pads at the bottom or top of both sides of the daughterboard substrate, and partially overlap with the transfer pads.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects: In this application, the inter-board welding pads are redesigned, that is, the board welding pads are extended from the transfer surface along the side of the daughter board substrate to the target surface, thereby extending the welding surface from the docking surface to the side, and adding side pads that allow tin creeping, which solves the problems of unreliable welding and easy breakage of the welding surface, and improves the reliability and stability of welding.

[0017] In this application, the inter-board docking pads are treated to prevent them from falling off, and the newly added pulling vias effectively pull the pads, so that this daughter board can play a protective role under various usage stress conditions and when the pads are torn due to repeated welding, which greatly improves the use strength and service life of the daughter board, solves the product quality problems caused by versatility, and improves the reliability of the daughter board.

[0018] In this application, observable inspection is achieved through the designed elliptical through-hole, which ensures the accuracy of the welding position of the pads that need to be connected between the daughter board and the mother board, effectively avoiding the pad position offset caused by blind alignment during pressing. At the same time, the elliptical through-hole can also be used to observe whether the solder paste on the connecting surface is sufficient and uniform, thereby ensuring reliable welding quality and reducing welding risks. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings: Figure 1 Schematic diagram of the structure of the target surface in an embodiment of the present invention; Figure 2 A schematic structural diagram of a transfer surface in an embodiment of the present invention; Figure 3 Schematic diagram of the three-dimensional structure of the daughter board substrate in an embodiment of the present invention.

[0020] Markings and corresponding parts names in the accompanying drawings: 1. Sub-board substrate; 2. Target surface; 3. Transfer surface; 4. Target pad; 5. Device pin pad; 7. Semicircular hole; 8. Elliptical through hole; 9. Transfer pad; 10. Fixing part; 11. Connecting pad; 12. Stability pad. DETAILED DESCRIPTION

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0023] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0024] In the description of the embodiments of the present invention, it should be noted that if the terms "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the invention is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0025] Furthermore, the use of terms such as "horizontal," "vertical," and "overhanging" does not necessarily imply that the component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0026] In the description of the embodiments of the present invention, "a plurality of" means at least two.

[0027] In the description of the embodiments of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0028] Example 1: In order to solve the problems of unstable welding quality and unreliable welding between the adapter board and the motherboard, this embodiment provides a high-quality adapter board for use between SOP devices, including: The daughterboard substrate 1 includes a target surface 2 and a transfer surface 3, such as Figure 1-Figure 3 As shown, the target surface 2 is provided with a plurality of target pads 4 that meet the replacement requirements, and the target surface 2 and the transfer surface 3 are respectively provided with a plurality of device pin pads 5 corresponding to the number of target pads 4. Each device pin pad 5 is connected to the target pad 4 at the corresponding position through a trace, and the trace extends to the inner side of the target pad 4 and then adds a 45-degree scattered connection trace with a preset length. The terminal of the connection trace is fixed by a pull-through hole.

[0029] The daughter board substrate 1 is penetrated by a plurality of signal lead-out holes, such as Figure 1-Figure 2 As shown, the device pin pads 5 on the target surface 2 and the device pin pads 5 on the transfer surface 3 are electrically connected through signal lead-out vias.

[0030] Specifically, at the edge of the pad extending to the target surface 2, a new 45-degree scattered line with a length of 0.1mm is added, and a via with a diameter of 0.1mm is added at the end of the line. This has the effect of pulling and fixing the entire pad, effectively preventing the pad from tearing and falling off due to stress and repeated welding and use of the adapter board.

[0031] Optionally, the portion of the board welding pad located on the transfer surface 3 forms a transfer pad 9, such as Figure 1-Figure 3 As shown, the portion of the board welding pad located on the target surface 2 forms the fixing portion 10 .

[0032] Furthermore, a plurality of connection pads 11 are provided on the target surface 2 and the transfer surface 3, such as Figure 1-Figure 3 As shown, each group of connection pads 11 is electrically connected through a through hole penetrating the daughterboard substrate 1, and the connection pads 11 located on the target surface 2 are also electrically connected to the fixing portion 10 through a trace; a stabilizing pad 12 is also provided on the target surface 2, as shown Figure 1 As shown, the stabilizing pad 12 is also electrically connected to the transfer pad 9 via a through hole (the hole in this pad is not necessarily required to be a plug hole) that passes through the daughterboard substrate 1.

[0033] Optionally, the transfer pads 9 and the target pads 4 are symmetrically arranged on both sides of the daughterboard substrate 1, and the transfer pads 9 and the target pads 4 on the same side are staggered, such as Figure 1-Figure 2 shown.

[0034] Among them, the transfer pads 9 and the target pads 4 are placed in a staggered manner, providing the necessary placement space for the anti-fall protection holes, signal lead-out vias and observation holes, as well as the signal interconnection routing space.

[0035] The above-mentioned high-quality transfer daughterboards used between SOP devices also include: The board welding pad extends from the transfer surface 3 along the side of the daughter board substrate 1 to the target surface 2, such as Figure 1-Figure 3 As shown, the board welding pad is located on the side portion of the daughter board substrate 1 and shrinks inward to form a semicircular hole 7, and is embedded in the semicircular notch opened in the daughter board substrate 1 through the semicircular hole 7; the number of board welding pads corresponds to the number of target pads 4.

[0036] Specifically, in order to solve the problem of unstable welding quality and unreliable welding between the adapter board and the motherboard, a method is adopted in which a metallized half hole is drilled on the outer edge of the pad on the transfer surface 3, and the pad is extended to 1 mm from the edge of the target surface 2 through the metallized hole wall. This realizes the function of effective solder climbing of the motherboard pad during welding (similar to the LCC situation), thereby enhancing the welding stability and reliability.

[0037] Among them, the width of the pad size is the same as that currently used, and the length dimension extends from the outside of the original pad to the edge of the printed circuit board, such as Figure 1-Figure 3 As shown, a metalized via (semicircular hole 7) is placed at the edge of the pad. The center of the hole is the intersection of the edge of the printed circuit board where the pad is located and the center of the pad width. The diameter of the via is 2 of the pad width. When the printed circuit board is processed, the side of the board is left with a tin-climbing metal wall after the metalized via is cut in half to improve the welding quality.

[0038] Optionally, the diameter of the semicircular hole 7 is half the width of the transfer pad 9, and the center of the semicircular hole 7 is located at the midpoint of the width of the transfer pad 9; the outer diameter of the device pin pad 5 and the connecting pad 11 is 0.1mm-0.6mm, which can be 0.2mm.

[0039] The above-mentioned high-quality transfer daughterboards used between SOP devices also include: Elliptical through hole 8, such as Figure 1-Figure 3 As shown, there are at least two elliptical through holes 8 , which pass through the daughterboard substrate 1 and are symmetrically arranged.

[0040] Among them, an elliptical non-metallized through hole (elliptical through hole 8) with a long diameter of 0.3mm and a short diameter of 0.2mm is added to the inner side of the target surface 2SOP device pad. The purpose is to facilitate the observation and correction of the alignment deviation and incomplete solder coverage of the solder joint surface between the daughter board and the mother board pad, replacing the previous experience-based treatment of soldering quality defects.

[0041] Optionally, the major diameter of the elliptical through hole 8 is 0.2mm-1.2mm, which may be 0.3mm, and the minor diameter of the elliptical through hole 8 is 0.1mm-1mm, which may be 0.2mm, and the two elliptical through holes 8 are respectively located at the ends of the transfer pads 9 at the bottom or top on both sides of the daughterboard substrate 1, and partially overlap with the transfer pads 9.

[0042] Example 2: The SOP device transfer board is a method for transferring SOP devices of different sizes and different internal interconnections by welding the transfer daughter board and the mother board together, so that the new device can be compatible with the original mother board without changing the mother board design; the present invention provides a daughter board design method for improving the transfer quality between SOP devices, ensuring the accuracy and correctness of the transfer board, while greatly improving the welding reliability between the daughter board and the mother board and the feasibility of the daughter board being reusable, such as Figure 1-Figure 3 As shown, the technical solution of the present invention is achieved as follows: 1. Design a new inter-board welding pad. The pad size and width are consistent with the current one. The length extends from the outside of the original pad to the edge of the printed board. At the same time, place a metalized via at the edge of the pad. The center of the hole is the intersection of the edge of the printed board where the pad is located and the center of the pad width. The diameter of the via is 2 of the pad width. When the printed board is processed, the side of the board is left with a tin-climbing metal wall after the metalized via is cut in half to improve the welding quality.

[0043] 2. On the non-inter-board pad direct welding surface (target surface 2), add a 45-degree scattered line with a length of 0.1mm from the half hole, and add a via with an inner diameter of 0.1mm and an outer diameter of 0.2mm at the end of the line. This via serves as a protective hole with a pulling effect to prevent the pad from falling off, to prevent the pad from being torn off due to various forces after the daughter board is welded and the daughter board is reused.

[0044] 3. On the inner side of the target surface 2SOP device pad, an elliptical non-metallized through hole with a long diameter of 0.3mm and a short diameter of 0.2mm is added to facilitate the observation and correction of the alignment deviation and incomplete solder coverage of the solder joint surface between the daughter board and the motherboard pad, replacing the previous experience-based handling of soldering quality defects.

[0045] Specifically, the present invention redesigns the welding pads between boards so that the welding surface extends from the butt surface to the side, adds side pads that allow tin creep, solves the problems of unstable welding and easy fracture of the welding surface, and improves the reliability and stability of welding.

[0046] Among them, the inter-board docking pads have been treated to prevent falling off, and the newly added pulling holes effectively pull the pads, so that this daughter board can play a protective role under various usage stress conditions and when the pads are torn due to repeated welding. This greatly improves the use strength and service life of the daughter board, solves product quality problems caused by versatility, and improves the reliability of the daughter board.

[0047] Furthermore, this patent ensures the accuracy of the soldering position of the pads that need to be connected between the daughter board and the mother board through the designed observable inspection hole (elliptical through hole 8), effectively avoiding the pad position deviation caused by blind press-fitting. At the same time, the inspection hole can also be used to observe details such as whether the solder paste on the connecting surface is sufficient and uniform, thereby ensuring reliable welding quality and reducing welding risks.

[0048] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-quality adapter board used between SOP devices, characterized in that: include: A daughterboard substrate, the daughterboard substrate comprising a target surface and a transfer surface, the target surface being provided with a plurality of target pads meeting replacement requirements, the target surface and the transfer surface being respectively provided with a plurality of device pin pads corresponding to the number of the target pads, each of the device pin pads being connected to the target pad at a corresponding position via a trace, and the trace extending to the inner side of the target pad is then supplemented with a 45-degree scattered connection trace of a preset length, the terminal of the connection trace being fixed by a pull-through via; The board welding pads extend from the transfer surface along the side of the daughterboard substrate to the target surface, and the side portion of the board welding pad located on the daughterboard substrate shrinks inward to form a semicircular hole, and is embedded in the semicircular notch opened in the daughterboard substrate through the semicircular hole; the number of the board welding pads corresponds to the number of the target pads; At least two elliptical through holes are provided, and the elliptical through holes penetrate the daughter board substrate and are symmetrically arranged.

2. A high-quality transfer sub-board applied to SOP devices according to claim 1, characterized in that, The daughterboard substrate is penetrated by a plurality of signal lead-out vias, and the device pin pads located on the target surface and the device pin pads located on the transfer surface are electrically connected through the signal lead-out vias.

3. A high-quality transfer daughter board applied between SOP devices according to claim 1, characterized in that, The portion of the board welding pad located on the transfer surface forms a transfer pad, and the portion of the board welding pad located on the target surface forms a fixing portion.

4. A high-quality transfer sub-board applied to SOP devices according to claim 3, characterized in that, The target surface and the transfer surface are further provided with a plurality of connection pads, each group of the connection pads is electrically connected via a through hole penetrating the daughterboard substrate, and the connection pads on the target surface are also electrically connected to the fixing portion via wiring.

5. A high-quality transfer sub-board applied to SOP devices according to claim 3, characterized in that, A stabilizing pad is also provided on the target surface, and the stabilizing pad is electrically connected to the transfer pad via a through hole penetrating the daughterboard substrate.

6. A high-quality transfer daughter board applied between SOP devices according to claim 3, characterized in that, The transfer pads and the target pads are symmetrically arranged on both sides of the daughter board substrate, and the transfer pads and the target pads on the same side are staggered.

7. A high-quality transfer daughter board applied between SOP devices according to claim 3, characterized in that, The diameter of the semicircular hole is half of the width of the transfer pad, and the center of the semicircular hole is located at the midpoint of the width of the transfer pad.

8. A high-quality transfer daughter board applied between SOP devices according to claim 4, characterized in that, The outer diameters of the device pin pads and the connection pads are 0.1 mm to 0.6 mm.

9. A high-quality transfer daughter board applied to SOP devices according to any one of claims 3-8, characterized in that, The long diameter of the elliptical through hole is 0.2 mm to 1.2 mm, and the short diameter of the elliptical through hole is 0.1 mm to 1 mm.

10. A high-quality transfer daughter board for use between SOP devices according to claim 9, characterized in that, The two elliptical through holes are respectively located at the ends of the transfer pads at the bottom or top of both sides of the daughterboard substrate, and partially overlap with the transfer pads.

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