Double pass vacuum lamination process for hybrid substrate multi-layer copper embedded PCBs

Abstract

The application discloses a double-pass vacuum pressing process for mixed substrate multilayer copper-embedded PCB and relates to the technical field of printed circuit process technology. A positioning interface is formed around the copper-embedded groove, guide channels are arranged on the groove wall and groove bottom, a circumferential groove is processed on the outer periphery of the copper-embedded part, a detachable holding layer is used for light holding, initial positioning information of the copper-embedded part and the communication state of the guide channels are collected. The pre-permeated resin fills along the guide channels and is discharged under reduced pressure, the holding position of the copper-embedded part and the gas stagnation identification mark are confirmed according to the gas outlet state of the guide channels and the interface wetting state. The second pass pressing is implemented by combining soft pressing surfaces, the pressing force is transmitted to the positioning interface, the resin is discharged along the guide channels, and the interface shaping result and the interlayer bonding state are output. The detachable holding layer is removed and is stably and non-destructively confirmed, the position of the copper-embedded part is compared with the interface shaping result, and the interlayer bonding state is uniformly written into a pressing parameter card for subsequent reuse and release.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of printed circuit process, in particular to a double-pass vacuum lamination process for hybrid substrate multilayer copper-embedded PCB. BACKGROUND

[0002] In high heat flux density and high reliability concurrent applications, hybrid substrate multilayer copper-embedded line structure is used to establish a low-thermal-resistance heat conduction channel between the device heat source and the heat dissipation path, while taking into account the transmission requirements of high speed and large current, typical scenarios include vehicle-mounted power control, radio frequency front end, satellite payload and high-density power board, etc.

[0003] The existing process usually adopts the common practice of pocket milling and then vacuum lamination, which promotes resin flow and cures copper-embedded parts by means of overall pressure and temperature curve, but the industry generally focuses on the empirical adjustment of total pressure and temperature window, lacks pre-configuration of geometric contact boundary and dispersion path before lamination, and rarely uses the same reference coordinate to collect position and connectivity information; under the combined influence of the differences in rheology and thermal expansion of mixed media under heating, geometric mutations of copper-embedded parts, local pressure concentration, and disordered migration of residual gas, closed airbags and local non-wetting are prone to occur in the first stage, and early defects are prone to be cured into thin gaps and steps that are difficult to recover in the second stage, subsequent reflow soldering and thermal cycling accelerate the evolution of interface microcracks and interlayer peeling, and the continuity of power path heat conduction and high-speed link impedance is simultaneously damaged; at the same time, the existing lamination pad material is mainly for pressure equalization, lacking design for conformal pressure transmission and surface shaping for positioning boundaries, and the detection side is mostly discrete image or example curve, lacking quantitative mapping with manufacturing records as reference, resulting in batch judgment relying on experience, batch reuse lacking callable entries, and good rate, reliability and traceability being difficult to achieve.

[0004] In the double-pass vacuum lamination scenario of mixed substrate multilayer copper-embedded circuit structure, the first-pass heating and pressure reduction jointly cause the resin viscosity to rapidly decrease and form a significant drag and pressure gradient. When the geometric corners and rough distribution of the groove wall and groove bottom change the local flow field, the copper-embedded piece appears to float or move laterally under the condition of no stable contact boundary constraint. At the same time, if a guide channel for dispersion and pilot filling is not established before lamination, and a detachable holding layer is not formed to provide reversible holding, residual gas will be trapped at the copper and dielectric interface and accompanied by non-wetting areas, forming invisible air gaps and step topographies that are difficult to directly observe with the naked eye. After entering the second pass, the hard loading of conventional uniform pressure cannot repair the first-pass displacement and gas retention, but rather further solidifies it as a long-term weakness of the interface topography and bonding ability. When subsequent reflow soldering or power thermal shock is experienced, these invisible thin gaps become the preferred path for thermal stress and moisture intrusion, inducing interlayer delamination and thermal conduction path mismatch, and causing impedance jumps and increased radiation noise near the dielectric constant discontinuity in structures containing high-speed traces. Ultimately, this results in increased solder repair, accelerated aging, reduced overall thermal stability, and reduced signal margin. In addition, due to the lack of initial positioning information of the copper-embedded piece and the pre-acquisition of the guide channel connection state under the same reference coordinate, and the lack of a process link for compliant pressure transmission and interface shaping of the positioning interface, the manufacturing end cannot transfer the key results of the first and second passes into reusable parameter records, leading to the inability to stably reproduce the qualified interface topography and interlayer bonding strength between different batches. Quality judgment and process release remain in the long-term experience judgment, and technical risks are transferred to the assembly and service stages, making it difficult to correct in a timely manner. SUMMARY

[0005] (I) Technical problems solved

[0006] To solve the technical problems in the background art, the present application provides a double-pass vacuum lamination process for mixed substrate multilayer copper-embedded PCB, which acquires the initial positioning information of the copper-embedded piece and the connection state of the guide channel. The pre-soaked resin fills along the guide channel and is dispersed under reduced pressure. The guide channel gas state and interface wetting state are used to confirm the copper-embedded piece holding position and gas retention identification mark. The second pass is implemented by a soft pressure surface combination, allowing the pressure to be transmitted at the positioning interface, and the resin to be discharged along the guide channel. The interface shaping result and interlayer bonding state are output. The detachable holding layer is removed and stabilized and non-destructively confirmed. The copper-embedded piece position and interface shaping result are compared, and the interlayer bonding state is written into the lamination parameter card for subsequent reuse and release; thereby solving the technical problems described in the background art.

[0007] (II) Technical solutions

[0008] To achieve the above object, the present application is implemented by the following technical solutions:

[0009] The double-pass vacuum lamination process of hybrid substrate multilayer copper-embedded PCB includes forming a positioning interface around the copper-embedding groove, setting a guide channel on the groove wall and groove bottom, and processing a circumferential groove on the outer periphery of the copper-embedded part, and holding the copper-embedded part with a detachable holding layer, and synchronously recording the initial positioning information of the copper-embedded part and the communication state of the guide channel.

[0010] The pre-infiltration resin is filled in the groove bottom and periphery along the guide channel in advance, and the detachable holding layer is kept under reduced pressure conditions; the holding position of the copper-embedded part and the gas stagnation identification mark are confirmed according to the gas outlet state of the guide channel and the interface wetting state, and are recorded synchronously.

[0011] The soft pressing surface combination is replaced for the second pass pressing, so that the pressure is transmitted on the positioning interface, and the resin is discharged along the guide channel; the holding position of the copper-embedded part, the gas outlet state of the guide channel and the interface wetting state are inputted to generate the interface shaping result and the interlayer bonding state.

[0012] After removing the detachable holding layer, the steady-state processing is carried out and the lossless confirmation is carried out, the holding position of the copper-embedded part is compared with the interface shaping result, and the interlayer bonding state is written into the lamination parameter card, and the initial positioning information of the copper-embedded part and the communication state of the guide channel are archived.

[0013] Further, the positioning interface forms a clean contact surface after being etched or plasma cleaned and removing surface contamination;

[0014] The continuity of the guide channel to the groove wall and the groove bottom is verified for communicability, and the same tool reference coordinate is recorded as the communication state of the guide channel, and the initial positioning information of the copper-embedded part and the reference coordinate are archived synchronously.

[0015] Further, the guide channel is shaped by machining or laser processing and avoids the key traces leading to the outer periphery, and the circumferential groove is uniformly arranged along the outer periphery of the positioning interface and is consistent with the groove wall topography;

[0016] The initial positioning information of the copper-embedded part includes a position vector, an initial positioning error and a grasping coefficient, and is associated with the communication state of the guide channel.

[0017] Further, the detachable holding layer is selected from a material with low residue and temperature-controllable release or mechanical peeling, and is arranged on the groove bottom in the vicinity of the positioning interface to lightly hold the copper-embedded part;

[0018] When removed, the holding position is released along a preset path and recorded as a removal record set with the same reference coordinate, and the holding position of the copper-embedded part is continuously measured before and after removal.

[0019] Further, the pre-infiltration resin is compatible with the mixed medium and the surface of the copper-embedded part, and has low volatility and controllable rheology.

[0020] Pre-filling the groove bottom and the periphery along the guide channel under reduced pressure, and generating the copper-embedded part holding position and the gas stagnation identification mark according to the binary rule based on the reference record of the gas outlet state and the interface wetting state of the guide channel.

[0021] Further, the soft pressure surface combination is composed of a compliant pad layer, an isolation medium and a pressure bearing sheet, which is placed in the corresponding area of the positioning interface to form a compliant pressure transmission.

[0022] In the second pressing process, the two-pass pressure field is collected to form a pressure sampling set, which is combined with the compliant mapping, the target pressure distribution and the communication state of the guide channel to generate a two-pass integrated input package.

[0023] Further, based on the two-pass integrated input package, reshaping is performed on the positioning interface to obtain a reshaping curvature set composed of interface curvature radius and wetting coverage, and the interface reshaping result is derived in the same reference coordinate; the interlayer bonding state is calculated synchronously and the bonding sufficiency index is attached, all of which are recorded in the same field.

[0024] Further, after removing the detachable holding layer, a steady state processing is performed, and stress decay and position convergence curves are recorded in the same reference coordinate according to the predetermined temperature and load sequence to form a steady state record set; at the same time, the communication state of the guide channel is reviewed to remain connected and archived synchronously.

[0025] Further, non-destructive imaging is used to obtain measured curvature radius and measured wetting coverage in the same reference coordinate, and mapping comparison is performed with the corresponding fields of the reshaping curvature set to generate a non-destructive confirmation set; and a one-to-one reference relationship is established between the measured interlayer bonding state and the corresponding fields of the interface reshaping result.

[0026] Further, the non-destructive confirmation set, the steady state record set, the interface reshaping result, the interlayer bonding state, the two-pass pressure field and the like are written into the pressure bonding parameter card with the same name and quantity.

[0027] The pressure bonding parameter card solidifies the entries including release judgment value, multiplexing score and consistency confidence, and is associated with the initial positioning information of the copper-embedded part and the communication state of the guide channel.

[0028] (Three) beneficial effects

[0029] The present application provides a two-pass vacuum pressing process for mixed substrate multi-layer copper-embedded PCB, which has the following beneficial effects:

[0030] By forming a positioning interface around the copper-embedded slot, continuously arranging a guide channel, processing a circumferential groove, and lightly holding with a detachable holding layer, combined with collecting initial positioning information of the copper-embedded part and the communication state of the guide channel, the starting geometry and dispersion path are clear and reusable, the copper-embedded part is constrained in the benefit area before heating, floating and lateral movement are inhibited, and the causes of early invisible air gap are reduced, and the initial positioning information of the copper-embedded part and the communication state of the guide channel are recorded with the same reference coordinate.

[0031] The pre-penetrated resin is used to fill along the guide channel and is preferentially dispersed under reduced pressure, combined with the same reference recording of the guide channel gas state and the interface wetting state, the copper-embedded part holding position and air stagnation identification marker are generated in time, the resin front and gas migration sequence are ordered, thereby reducing the probability of regenerating the cavity before the second process and improving the controllability of subsequent shaping, while reducing the dependence on additional adjustment factors.

[0032] In the second process, a soft pressure surface combination is introduced and the positioning interface is used as the force reference, relying on the second process to integrate the compliant mapping, target pressure distribution and second pressure field in the input package to construct a pressure consistency index, while constraining the dispersion potential to the main path of the guide channel, so that the pressure and flow are directed to the same benefit area, and the material system is not changed to achieve gentle pressure transmission and stable dispersion, so that the key area avoids pressure spikes and the channel is occupied by resin.

[0033] According to the controlled advancement of the interface curvature radius and wetting coverage of the shaping curvature set, the interface shaping result is output and the interlayer bonding state and bonding sufficiency index are updated synchronously, the copper and medium interface obtains the double effect of smooth transition and true adhesion, the stress concentration and microcrack propagation in the thermal cycle tend to converge, the high-speed impedance transition is smoothed, and the power density and signal quality are considered, thereby improving long-term reliability and thermal path continuity.

[0034] The detachable holding layer is removed by a reversible path, and position convergence and residual stress attenuation are achieved through a steady-state recording set, while the guide channel communication state is not damaged, the copper-embedded part position is kept stable near the positioning interface, the interface shaping result formed by the second process is consolidated in the time dimension, and the risk of re-instability in the later stage of assembly and reflow process is reduced, so that the benefits of the previous process can be maintained in the life stage. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 It is a two-process vacuum lamination process flow diagram of the mixed substrate multilayer copper-embedded PCB of the application. DETAILED DESCRIPTION

[0036] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort should fall within the protection scope of the present application.

[0037] Please refer to Figure 1 The present application provides a double-pass vacuum lamination process for a hybrid substrate multilayer copper-embedded PCB, comprising,

[0038] Step one, through the integrated prefabrication and checking of the positioning interface, the guide channel, the circumferential groove and the detachable holding layer, the initial positioning information of the copper-embedded part and the communication state of the guide channel are output, and both are transmitted to step two as the only reference.

[0039] The copper-embedded groove causes local geometric and material property discontinuity. If a stable contact boundary and dispersion path are not established before lamination, the resin drag in the heating stage will cause micro-displacement of the copper-embedded part and blocked exhaust, and then be solidified as steps and thin gaps in the subsequent curing. In order to suppress this chain, it is necessary to clearly answer the questions of where to contact stably, where to pass freely and where to allow the resin to arrive first before heating and decompression, and to convert the answers into measurable and transmissible markers.

[0040] First, the positioning interface is defined by geometric-energy joint constraint, so that the copper-embedded part tends to the position of minimum energy without external force disturbance. Then, the guide channel is constructed by flow-communication index, so that the subsequent gas and resin migration follows the low-resistance path. Then, the circumferential groove enhances the anti-disturbance engagement and maps the geometric features into measurable contact energy. Finally, the detachable holding layer provides reversible holding and buffering, and solidifies the measured position and communication markers into the initial positioning information of the copper-embedded part and the communication state of the guide channel.

[0041] The positioning interface is not simply a boundary, but an interface entity that carries contact energy, curvature and disturbance response. In order to make the copper-embedded part still close to the design reference without external force and slight disturbance, the curvature and adhesion work of the positioning interface are pre-set based on the energy functional, so that the geometric and material contact forms a stable attractive basin before lamination.

[0042] Specifically, the target functional characterizes the design advantages and disadvantages of the positioning interface, which is in the form of:

[0043]

[0044] In the formula: the total amount of interface potential energy is a non-negative real number, representing the potential energy level of the positioning interface under the current geometric and material combination; the curvature weight coefficient , is a positive real number, adjusting the influence of curvature energy on the overall objective; interface curvature energy , is a non-negative real number; adhesion weight coefficient , is a positive real number, emphasizing the contribution of adhesion work to stability;

[0045] adhesion work , is a non-negative real number, measuring the bonding ability of the copper-embedded part and the substrate on the positioning interface.

[0046] Therefore, by minimizing the objective function , the contact boundary with smooth curvature and sufficient adhesion is preferentially obtained when processing the positioning interface; thus, the copper-embedded part is locked in the neighborhood of the designed position by both geometric and energy factors before subsequent heating.

[0047] In order to convert this result into collectible data, the initial positioning vector is recorded, and the initial positioning error is expressed as the deviation from the reference, defined as:

[0048]

[0049] , the measured positioning vector , is a two-dimensional or three-dimensional real vector, recording the measured position of the copper-embedded part; the reference positioning vector , is a two-dimensional or three-dimensional real vector, representing the reference position of the positioning interface; the initial positioning error , is a non-negative real number, measuring the deviation between the copper-embedded part and the reference.

[0050] The positioning interface with smooth and high adhesion is obtained by minimizing the energy objective, and the geometric result is mapped to the core quantity of the initial positioning information of the copper-embedded part. , is a directly citable quantity for the pre-compression check in Step 2.

[0051] The purpose of the guide channel is to provide a low-resistance path for the subsequent gas migration and pre-infiltration resin orientation. To avoid the case where the channel exists but is not connected in the overall topology, the connectivity target is measured comprehensively:

[0052]

[0053] , the connectivity weight coefficient , is a positive real number, emphasizing the priority of connectivity rate; the connectivity rate , is a real number between 0 and 1, representing the connectivity proportion of the guide channel from the groove bottom to the outer edge; the bending weight coefficient , is a positive real number, suppressing excessive bending of the channel;

[0054] bendability , is a real number not less than 1; resistance weight coefficient , is a positive real number, balancing flow resistance; dissipation resistance , is a non-negative real number, representing the ease of flow of gas and pre- infiltration resin in the channel.

[0055] Therefore, when designing the guide channel, the reduction of the communication target is the guideline, and the high accessibility, low bendability, and low resistance morphology are preferred. Subsequently, the communication function records the real communication relationship, and the communication rate is used as the core quantity of the guide channel communication state, which reserves direct reference for step two to determine the guide channel gas state. After forming the positioning interface, micro-etching or plasma cleaning is used to remove oxidation / pollution, and then contact consistency sampling is performed;

[0056] In order to form a measurable coordinate system consistent with the positioning interface, the communication function is co-located with the initial positioning vector in the same reference system, so that subsequent images or detection data can be superimposed and compared under the same reference. The communication-resistance joint target is used to unify the morphology design of the guide channel, and the guide channel communication state is clearly defined as the communication rate and the combination of the communication function , which provides direct criteria for step two of dissipation release and gas stagnation identification.

[0057] The circumferential groove located on the outer periphery of the copper-embedded part is a key geometric feature for resisting resin shear and micro-disturbance torque. In order to convert the geometric feature into measurable and comparable disturbance resistance, the gripping coefficient is introduced to couple the adhesion work and the normal contact force, and to map the amplification effect of the groove wall morphology on the disturbance resistance:

[0058]

[0059] In the formula: adhesion work , is a non-negative real number, measuring the adhesion ability on the positioning interface; contact friction coefficient , is a real number from 0 to 1, representing the friction characteristics of the circumferential groove side wall and the copper-embedded part; normal contact force , describes the normal compression degree of the copper-embedded part on the positioning interface; disturbance torque , approximately represents the small disturbance during heating or handling; morphology amplification factor , is a real number greater than 0, embodying the amplification effect of the circumferential groove geometric angle and the side wall roughness on the gripping.

[0060] Therefore, by improving the gripping coefficient The design principle can significantly improve the anti-deviation ability of the copper-embedded part to perturbation without changing the material system; thereby the initial positioning error in the initial positioning information of the copper-embedded part At the processing end, it is depressed to a more controllable range. Further, the gripping coefficient As an auxiliary field in the initial positioning information of the copper-embedded part, the initial positioning vector And the initial positioning error At the same time, the contact is recorded as the same record object as the geometric position. The geometric characteristics of the circumferential groove are quantified as And recorded in the same channel as the position error, so that the anti-interference ability directly participates in the subsequent release judgment and process reuse.

[0061] The detachable holding layer is used to gently hold the copper-embedded part during the prefabrication stage, providing the necessary holding force and achieving non-destructive removal before entering the next stage. To achieve both, a holding stability index is constructed With unified compliance, material stiffness and initial error constraints:

[0062]

[0063] Wherein: the material stiffness of the holding layer provides the support ability required for holding; the compliance of the holding layer measures the compliance of the holding layer under stress; the initial positioning error is the position deviation amount of the technical point A; the error tolerance is a positive real number that defines the upper limit of the acceptable initial deviation; the holding stability index is a non-negative real number that comprehensively evaluates whether the holding meets the dual requirements of holding and reversibility.

[0064] Therefore, when the holding stability index is sufficient to ensure stable holding and reserve reversible disconnection margin, the state of recording the initial positioning information of the copper-embedded part is recognized as transmissible; further, the connectivity rate and the connectivity function jointly generate the guided channel connectivity state, and the holding layer state is recorded in the same record.

[0065] In order to ensure the integration of data exchange with step two, the output is stored in groups in the form of copper-embedded part initial positioning information and guided channel connectivity state , with unified measurement reference and time stamp to avoid name and semantic drift. Through the holding stability index The rigidity-flexibility ratio and position tolerance of the uniform holding layer are unified, so that the light holding neither introduces new stress concentration nor realizes non-destructive removal before entering the next step, while integrating the position information and communication information related thereto into the same name set output.

[0066] Around the positioning interface, the guide channel, the circumferential groove, the detachable holding layer, the geometric contact, the topological connectivity and the reversible holding are coupled into the same pre-action chain: through minimizing the target functional Obtain a smooth and high adhesion positioning interface by minimizing the connectivity target Obtain a high-accessible low-resistance guide channel through the grip coefficient Convert the geometric advantage of the circumferential groove into the anti-interference ability through the holding stability index Coordinate the rigidity-flexibility relationship and reversible disassembly of light holding. All the above quantitative objects are written into the initial positioning information of the copper-embedded part and the communication state of the guide channel, and are archived together with the same reference, providing input without secondary explanation for the directional filling and pressure reduction dispersion coordination of the pre-permeation resin in step two.

[0067] The directional filling and pressure reduction dispersion coordination of the pre-permeation resin is based on the existing input of the initial positioning information of the copper-embedded part and the communication state of the guide channel, and organizes the pilot flow of the pre-permeation resin in the guide channel and the preferential dispersion of the stagnant gas in parallel, so that the guide channel gas state and the interface wetting state reach a determinable and deliverable state before warming up. The pre-permeation resin requires compatibility with mixed media, low volatility, and controllable rheology under reduced pressure;

[0068] Step two, use the guide channel to build a computable pilot flow and preferential dispersion order, so that the pre-permeation resin fills the bottom and the periphery under reduced pressure, generates the guide channel gas state and the interface wetting state in real time, and gives the determination of the copper-embedded part holding position and the gas stagnation identification marker under the holding position of the detachable holding layer.

[0069] If the guiding channel communication state is not used as the criterion to organize the precursor flow, the advance of the pre-penetrated resin will be bifurcated by the coupling effect of local pressure gradient and interfacial tension, and the gas will be trapped in the neighborhood of the positioning interface. Once the trapped gas is solidified into a thin gap, it will accumulate fatigue in the subsequent thermal process. Therefore, it is necessary to convert the antecedent quantities such as accessibility, connectivity function, grabbing coefficient, and holding stability index into process quantities that can be used to schedule the flow field and determine the release, so as to solidify the order of dispersion first, wetting follow-up, and position holding not deviated into the process normal. First, the guiding channel communication state is used as the basis to construct the resin advance potential energy along the main direction of the connectivity function, so that the resin volume flow density and the pressure gradient are strictly in the same direction; then the outgassing flux is used to induce the outgassing state of the guiding channel, and an integrated judgment is made through the pre-penetration release degree; on this basis, the surface energy is used to decompose the driving interface wetting state, and the spatial distribution of wetting is mapped into the boundary that can be received by the subsequent pressing; finally, the grabbing coefficient and the equivalent stiffness of the holding layer are used to dynamically verify the position of the copper-embedded part, so as to ensure that it still maintains the original position under the action of flow shear and floating.

[0070] The accessibility advance of the precursor flow and the construction of the resin driving field: when the guiding channel communication state gives the accessibility and the topological trunk, the advance potential energy should be concentrated in the trunk direction, so that the pre-penetrated resin reaches the bottom and the periphery of the groove first. In order to ensure that the resin volume flow density obeys the topological trunk, the advance term is constructed in the form of tangential projection, so that it is in the same direction as the spatial gradient of the pressure field , and the gain is modulated by the accessibility, so as to realize the calculable precursor advance. The core relationship is expressed as:

[0071]

[0072] In the formula: the resin volume flow density : is a non-negative real number representing the volume flow intensity of the pre-penetrated resin on the unit cross section; the resin permeability : is a positive real number representing the equivalent permeability of the guiding channel and the bottom texture to the resin penetration;

[0073] The tangential unit vector : is a unit vector set representing the tangential direction along the main direction of the connectivity function ;

[0074] The pressure field : is a real-valued scalar field representing the spatial pressure distribution under the condition of pressure reduction; the topological gain coefficient : is a non-negative real number that converts the main concentration of the connectivity function into the advance gain; the pressure gradient , the gradient of the pressure field in space;

[0075] The accessibility Real number between 0 and 1, indicating the degree of communication of the guiding channel from the groove bottom to the outer edge.

[0076] By introducing the gain modulation term , the resin volume flow density obtains stronger propulsion in the direction of better topological connectivity; thus, the pre-infiltrated resin can fill the geometric dead angle in advance and compress the gas occupation; further, it creates a visible boundary for continuous observation of the out-gas state of the guiding channel. To align the coordinates with the initial positioning information of the copper-embedded part, the flow collection records the cross-section sequence with the initial positioning vector as the origin, avoiding misjudgment caused by inconsistent reference systems. By multiplicative coupling of the dynamic term and the topological quantity, the resin propulsion priority is established, and the connectivity rate is directly reflected in the resin volume flow density , reducing the uncertainty of subsequent judgment.

[0077] As the pre-infiltrated resin advances, the gas moves out along the guiding channel, and an operable out-gas state of the guiding channel must be constructed to determine whether to switch to the covering and heating. For this purpose, the exhaust index is defined as the normalized ratio of the channel normal gas flux to the equivalent resin flux:

[0078]

[0079] In the formula: the exhaust index : a non-negative real number, measuring the release capacity of the average out-gas intensity per unit length of the guiding channel relative to the equivalent flux of the resin; the channel length : a positive real number, the curve length of the connectivity function ; the gas velocity vector : a vector field representing the local flow rate of the gas in the channel; the normal unit vector : a set of unit vectors, the outer normal direction of the channel cross section; the channel cross-sectional area : a positive real number, the equivalent flow cross section of the channel.

[0080] Thus, the exhaust index and the accessibility rate together constitute the core measure of the out-gas state of the guiding channel; further, the pre-infiltration release degree is defined to integrally determine whether to enter the covering and heating:

[0081]

[0082] In the formula: the pre-infiltration release degree : a non-negative real number, comprehensively describing the joint maturity of exhaust, connectivity, and wetting; the contact angle : a real number between 0 and , describing the instantaneous wetting of the pre-infiltrated resin at the positioning interface; the accessibility rate : Real number between 0 and 1, indicating the connectivity of the guiding channel; venting index : Non-negative real number, indicating the average venting capacity per unit length.

[0083] Therefore, when the pre-permeation release degree reaches the established interface tolerance condition, the stagnation gas recognition marker is marked as no stagnation gas, otherwise the stagnation gas position index is generated and the pre-permeation is maintained. When the guiding channel venting state is continuous dispersion and the interface wetting state is locally still gas signal under the condition of no wetting, it is marked as existing; otherwise, it is not;

[0084] where, interface tolerance : Positive real number, process constant as the release boundary; stagnation gas recognition marker : Discrete state quantity, recording the existence and space index of stagnation gas.

[0085] Superimpose the physically measurable venting index and the topologically solvable accessibility , and introduce the contact angle as the wetting maturity multiplier, so that the release criterion is simple and traceable, and the stagnation gas recognition marker forms a clear output.

[0086] After the guiding channel venting state reaches the robust interval, the improvement of the interface wetting state determines the integrity of the subsequent solidified interface. To combine the surface energy of the positioning interface and the texture effect of the circumferential groove into an operable wetting potential, define the wetting potential as the combination of three-phase surface energy and texture factor:

[0087]

[0088] In the formula: wetting potential : Real number, positive value represents energy driving of spreading advantage, negative value represents energy driving of spreading disadvantage; solid-gas surface energy : Represents the interfacial energy between the solid surface of the positioning interface and the gas; solid-liquid surface energy : Represents the interfacial energy between the solid of the positioning interface and the pre-permeation resin; liquid-gas surface energy : Represents the interfacial energy between the pre-permeation resin and the gas; texture influence coefficient : Positive real number, maps the promotion of circumferential groove and groove bottom texture to effective wetting into a coefficient; contact angle : Real number between 0 and , describing the wetting dynamics.

[0089] Therefore, by adjusting the geometric origin and surface treatment combination of the texture influence coefficient , the wetting potential The favorable interval is reached at the end of the guiding channel and the corner of the positioning interface; thus the pre-wetting resin forms a continuous thin layer at these key positions and eliminates micro voids; further the wetting space distribution is mapped as wetting map Recorded as a surface function:

[0090]

[0091] In the formula: wetting map : real number, representing the average wetting sufficiency on the surface of the positioning interface; surface : real number, representing the average wetting sufficiency on the surface of the positioning interface; surface : positive real number, referring to the inspected area of the positioning interface;

[0092] Through the wetting potential and the wetting map The three-phase surface energy and the texture effect are combined into a recordable index pair, which makes the interface wetting state have a dual expression of space and energy, and is convenient for receiving the pressure distribution together in the next step. During pre-wetting, the pre-wetting resin will exert flow shear and buoyancy on the copper-embedded part, and if the holding position stability is not checked, the holding position of the copper-embedded part may deviate from the initial positioning information of the copper-embedded part.

[0093] Based on the grasping coefficient of step one and the stiffness of the holding layer material and the compliance of the holding layer , the equivalent stiffness of the holding layer is defined as:

[0094]

[0095] Wherein, the equivalent stiffness of the holding layer : positive real number, which converts the stiffness and flexibility matching of the detachable holding layer into a single force parameter;

[0096] On this basis, the stability index is used to comprehensively check the force margin:

[0097]

[0098] In the formula; stability index : positive real number, indicating that the holding position of the copper-embedded part can be confirmed when it is greater than the stability limit; contact friction coefficient : real number between 0 and 1, indicating the friction characteristics of the positioning interface and the copper-embedded part; normal contact force : non-negative real number, from the clamping and self-weight normal compression; initial positioning error : non-negative real number, from the positioning deviation amount of step one, used for linearizing the holding position restoring force; equivalent shear force ​: Non-negative real number, the flow force obtained by integrating the resin shear stress; buoyancy force : A non-negative real number, representing the buoyancy component introduced by the density difference.

[0099] To concretize the equivalent shear force According to the contact surface being inspected Integral of shear stress on:

[0100]

[0101] In the formula; contact surface : Positive real number, representing the force-bearing surface of the pre-impregnated resin and the copper-embedded component during relative sliding; resin shear stress : Non-negative real number, related to the dynamic viscosity of the resin Local shear related to velocity gradient; resin dynamic viscosity : Positive real number, representing the rheological characteristics of the pre-permeation resin.

[0102] Therefore, when the stability index Not lower than the stability limit If the copper insert remains in the correct position, confirm that the requirement is met; otherwise, maintain the detachable retaining layer and retract to the pilot propulsion stage until the exhaust index is reached. With wetting mapping Achieving interface tolerance The combination of conditions. Among them, the stability limit. : Positive real number, used as the process boundary for stability.

[0103] A ternary disturbance rejection mechanism of gripping-friction-holding is used to balance the dual-source disturbance of shearing-floating, forming a determinable position for the copper-embedded component, and this state, along with a gas stagnation identification mark, is recorded. This is output together for direct reference in the next step.

[0104] Through the above processing, the guiding channel is no longer just a geometric channel, but is endowed with calculable propulsion order and dispersion capability; the positioning interface and circumferential groove not only define the contact boundary, but also utilize wetting potential... With the coefficient of engagement It plays a role in energy and disturbance rejection; the detachable holding layer is no longer passively held in place, but rather through the equivalent stiffness of the holding layer. With stability index Intervention in holding position determination forms a basis from resin volumetric flow rate density. To exhaust index Then to wetting reflection With stability index The soft pressure surface combination is used to establish the conforming space pressure distribution and stress transmission on the positioning interface, so that the pre-penetrated resin completes residual dispersion and continuous flow along the guide channel, and a smooth, continuous and stable transition interface is formed at the copper and medium interface. The soft pressure surface combination is a three-layer structure of conforming pad, isolation medium and pressure bearing sheet, and the materials can be the conventional selection of elastomer conforming pad and metal / composite pressure bearing sheet.

[0105] On the premise of obtaining the copper-embedded part holding position, guide channel gas state and interface wetting state, the soft pressure surface combination is used to establish the conforming space pressure distribution and stress transmission on the positioning interface, so that the pre-penetrated resin completes residual dispersion and continuous flow along the guide channel, and a smooth, continuous and stable transition interface is formed at the copper and medium interface. The soft pressure surface combination is a three-layer structure of conforming pad, isolation medium and pressure bearing sheet, and the materials can be the conventional selection of elastomer conforming pad and metal / composite pressure bearing sheet;

[0106] Therefore, the copper-embedded part holding position is used as a constraint, and the guide channel gas state and interface wetting state are used as release and shaping boundary conditions to construct quantifiable pressure consistency indicators, dispersion potential and surface shaping energy, which are then converted into objective records of interface shaping results and interlayer bonding states.

[0107] Step three, accurate distribution of two-stage pressure by soft pressure surface combination, establishment of conforming contact on positioning interface, completion of residual dispersion and resin continuous flow relying on guide channel, obtaining of interface shaping results and interlayer bonding states, and formation of input-output relationship of the results with copper-embedded part holding position, guide channel gas state and interface wetting state in the same semantic space.

[0108] If the two-stage pressure action only pursues nominal uniform pressure, local overpressure and shear concentration near the positioning interface are easily caused, and then residual gas and thin gap are formed at the end of the guide channel; at the same time, if the shaping surface does not cooperate with the copper-embedded part holding position, the resin continuous flow will be forced to flow around, resulting in local regenerative cavity. Therefore, the conforming characteristics of the soft pressure surface combination are needed to reshape the pressure path, so that the pressure distribution and flow access are complementary to each other, and the interface topography is gently and continuously pushed to the target state through the minimization of surface shaping energy.

[0109] The copper-embedded part holding position determines the allowed domain of two-stage contact area and pressure depth; the guide channel gas state determines the main channel of low resistance dispersion; and the interface wetting state determines the interface sheet area that can continue to flow. Then, under the constraint of the three information, the two-stage pressure field is modulated by the soft pressure surface combination, the pressure consistency index is established and the conforming mapping is obtained; the dispersion potential is set and the tendency of resin reverse occupation of the channel is inhibited according to the connectivity and wetting information; finally, the interface shaping result is generated and the interlayer bonding state is updated by the surface shaping energy which coordinates the interface curvature, adhesion work and contact work.

[0110] Soft pressure surface compliance and pressure consistency configuration: under the participation of soft pressure surface combination, the two-stage pressure is not simply uniformly distributed, but needs to be smoothly transmitted near the positioning interface, so that the normal and tangential components after loading can not only adhere to the geometric constraints of the copper-embedded part to maintain position, but also not destroy the low-resistance path of the guide channel.

[0111] To this end, a pressure consistency index is constructed to measure the degree of compliance of the soft pressure surface combination to the target pressure distribution, and the selection and arrangement of the soft pressure surface combination are inversely deduced. The pressure consistency index is defined as:

[0112]

[0113] Two-stage pressure field , which is a non-negative real field representing the pressure distribution after loading of the soft pressure surface combination;

[0114] Compliance mapping , which describes the modulation ability of the local compliance characteristics of the soft pressure surface combination to pressure, such as recommended continuous type (anisotropic Helmholtz) compliance mapping, equivalent expression of kernel convolution type (convenient for fast implementation), and discrete matrix type (FE / grid implementation);

[0115] Target pressure distribution , which is a non-negative real field obtained by comprehensively considering the copper-embedded part to maintain position, the guide channel to discharge gas, and the interface wetting state, and needs to be satisfied by the pressure reference; pressure transmission weight , which is a positive real field that enhances the consistency requirement at the positioning interface and key transition zone; boundary smoothing coefficient , which is a positive real number that suppresses the normal pressure mutation at the positioning interface;

[0116] Pressure receiving domain , which is a geometric region, the integral domain; interface boundary , which is a curve or surface, the boundary of the positioning interface; normal vector , which is a unit vector representing the normal gradient direction.

[0117] Therefore, the process of minimizing the pressure consistency index is the process of matching the soft pressure surface combination with the required pressure transmission path; thereby obtaining gentle loading on the positioning interface and low disturbance coverage on the guide channel. To convert this index into usable data, sample the two-stage pressure field and the compliance mapping in the same reference to generate a pressure sample set, and record it in the same coordinate as the copper-embedded part to maintain position, forming an input set that can be directly compared.

[0118] Through the pressure consistency index The structure of the soft pressing surface combination converts the setting of the soft pressing surface combination from experience adjustment to the adaptive solution of the target pressure distribution, avoiding uncontrollable pressure peaks in critical areas.

[0119] Under the premise that the outgassing state of the guide channel is known and the interface wetting state can be determined, the residual gas needs to be migrated in advance to pre-impregnate the resin for subsequent filling. If the resin flux occupies the channel, a new gas stagnation will be formed at the channel bifurcation. Therefore, the dispersion potential is defined to quantify the tendency of outgassing priority on the channel. Set:

[0120]

[0121] where: the channel curve is a set of curves, the main path of the guide channel; the outgassing flux density is a non-negative real field describing the dispersion intensity of the gas in the local guide channel; the resin flux density is a non-negative real field describing the continuous flow intensity of the pre-impregnated resin in the local guide channel; the flux balance coefficient is a positive real number that inhibits the early occupation of the resin in the core area of the channel;

[0122] The positive operator takes the non-negative part of the expression to focus on punishing outgassing disadvantage; the channel weight is a positive real field that enhances the dispersion requirement in the segment of the channel intersection and leading to the outer edge.

[0123] Thus, the process of reducing the dispersion potential is equivalent to strengthening the dynamic order of gas first and resin later on the guide channel; and then cooperating with the pressure mild distribution of the aforementioned pressure consistency index to make the residual gas near the positioning interface stablely discharged along the established path. The potential energy calculation is consistent with the connectivity rate and the connectivity function in the same channel coordinates, and together with the pressure sampling set forms a two-stage integrated input package, providing complete input for surface shaping and combination promotion.

[0124] The outgassing priority process is converted into an optimized quantity by the dispersion potential , avoiding the regeneration cavity caused by the resin occupying the channel in reverse, and complementing the pressure consistency.

[0125] Interface surface shaping energy and smooth transition construction: when the pressure sampling set and the two-stage integrated input package have been collected, the interface needs to be pushed from a rough contact state to a smooth transition state, and the position with the copper insert is geometrically coherent. For this purpose, the shaping energy functional is introduced to unify the curvature, adhesion work and contact work into the same target; at the same time, the shaped surface is constrained not to destroy the connectivity advantage of the guide channel. Set the shaping energy functional :

[0126]

[0127] Smoothness coefficient of curvature , positive real number, emphasizes the roundness of the surface; interface curvature radius , real number, measures the local curvature of the interface; curvature weight , positive real number, strengthens the shaping at the corner of the copper-embedded edge and the material; adhesion enhancement coefficient , positive real number, improves the contribution of the adhesion work;

[0128] Adhesion work , non-negative real number, uses the previous definition and is updated in two steps; wetting coverage , real number between 0 and 1, is mapped from the wetting state of the interface; contact work coefficient , positive real number, quantifies the contribution of the pressure work to shaping; normal pressure component , non-negative real number, is obtained by decomposing the two-step pressure field ; normal displacement component , real number, locates the normal micro-displacement of the interface during shaping.

[0129] Therefore, the process of minimizing the shaping energy functional is to push the surface to a larger curvature radius in the wettable area with the least contact work, and at the same time to improve the actual adhesion contribution of the interface; thus, the surface is transitioned from sharp corners to round connections, avoiding stress concentration in subsequent thermal cycles. For ease of recording and transmission, the curvature radius and the wetting coverage are discretized in the same interface curve, generating a shaping curvature set and recording it with the same coordinates as the pressure sampling set, so that the interface shaping result can be derived from a unified set expression. The shaping energy functional connects curvature, adhesion, and contact work, making the shaping behavior have a clear energy direction and a measurable goal, avoiding relying only on experience for local flattening.

[0130] Surface roundness is not enough to ensure long-term stability, and it also needs to be promoted from the perspective of bonding work and stress release path. Therefore, on the basis of the shaping curvature set, the bonding sufficiency index is defined, so that the interlayer bonding state is no longer a vague judgment, but a calculable and comparable quantity. Set:

[0131]

[0132] In the formula: the bonding sufficiency index is a real number, which measures the pros and cons of the interlayer bonding state; the bonding weight coefficient , a positive real number, to strengthen the positive contribution of adhesion and wetting to the bonding; stress weight coefficient , a positive real number, to characterize the adverse effect of tensile stress on bonding; tangential equivalent stress , a non-negative real field, to describe the tangential residual component of the interface;

[0133] Shear coupling factor , a positive real number, to map the shear effect to the equivalent failure tendency; bonding weight , a positive real number field, to enhance the bonding requirement in the key transition zone.

[0134] Thus, the bonding sufficiency index is improved

[0135] Further, the optimization direction of the pressure consistency index and the dissipation potential cooperates, neither sacrificing dissipation efficiency nor introducing new stress concentration at the pressure boundary. Finally, the bonding sufficiency index and the reshaped curvature are combined into the interface reshaping result, and the interfacial bonding state is recorded with the same name, which is directly recorded to the pressing parameter card as step four.

[0136] The bonding sufficiency index writes the combination of bonding promotion and stress pre-distribution into a unified index, making the interfacial bonding state comparable and traceable, facilitating subsequent steady-state and non-destructive confirmation.

[0137] Step three revolves around the combination of two-stage integration and interface reshaping of the soft pressure surface. First, the copper insert position, guided channel gas state, and interface wetting state are taken as the same group of input constraints, and then the pressure consistency index organizes the compliant pressure transmission of the soft pressure surface combination, the dissipation potential maintains the gas priority on the channel, the reshaping energy functional unifies the curvature, adhesion and contact work, and finally the bonding sufficiency index forms a quantitative characterization of the interfacial bonding state. This processing logic emphasizes the synergy of compliant pressure transmission, gas priority and surface reshaping to promote the interface to stability with reasonable stress and rheological order without changing the material system, thereby maintaining consistency and reviewability under mass production conditions.

[0138] The detachable holding layer is removed without introducing new disturbance, and the residual stress and rheological memory are released through a controlled steady-state path to make the copper-embedded part position converge stably at the positioning interface; the interface shaping result and the interlayer bonding state are compared in the same coordinate and semantic consistency by non-destructive imaging and field mapping, and the key quantities required for comparison are deposited together with the early records such as the guided channel connectivity state and the initial positioning information of the copper-embedded part into the pressing parameter card.

[0139] Step four, after removing the detachable holding layer and performing steady-state processing, the interface shaping result and the interlayer bonding state are updated with the non-destructive confirmation result of the same reference, and the consistency record and strategy item which can be directly written into the pressing parameter card are formed accordingly.

[0140] If the finished product is directly released after two processes, the untreated adhesive residue and shear memory may be reactivated under subsequent thermal load, inducing copper-embedded part position micro-drift and interface re-cracking; at the same time, if the non-destructive confirmation is only morphological interpretation without mapping with the same name quantity in step three, the traceability of the interface shaping result will be weakened. Therefore, the detachable holding layer needs to be removed in a reversible way to reduce the residual stress energy in a time-temperature-load multi-dimensional path, and the imaging quantity is corresponded with the predicted quantity in step three by consistency index, so that the judgment of the interlayer bonding state becomes a comparison driven by symbolic quantity. The detachable holding layer requires low residue, temperature-controlled release or mechanical peeling, and does not damage the positioning interface coating; the removal process records the tangential displacement trajectory to the removal record set with the same reference;

[0141] First, under the geometric constraints specified by the copper-embedded part holding position, the detachable holding layer is removed along a controlled path, and the contact energy change and tangential disturbance are recorded synchronously; then, according to the curvature and wetting distribution of the interface shaping result, a steady-state path is selected to dissipate the residual stress energy and maintain the connectivity advantage of the guided channel; finally, the measured curvature, wetting coverage and bonding sufficiency are mapped to the reference consistent with step three by non-destructive imaging, completing the consistency evaluation and entry deposition of the pressing parameter card.

[0142] Under the premise that the copper-embedded part holding position is used as a geometric constraint, the process of removing the detachable holding layer is designed as a controlled path, which aims to release the holding effect without damaging the interface shaping result.

[0143] To make the path calculable and assessable, the detachment path action quantity is defined, which takes into account the rate of detachment action, the change of interface adhesion work and tangential micro-displacement, so the following formula is introduced to define the detachment path action quantity :

[0144]

[0145] In the formula, the detachment path parameter , including, detachment progress, peeling angle, detachment load instruction and temperature program instruction, etc., are continuous differentiable functions, representing the process trajectory of removing the detachable holding layer; path rate , describing the instantaneous rate of detachment action; adhesion work variation , describing the adhesion energy release along the path; tangential micro-displacement , describing the interface tangential disturbance; path rate weight , is a positive real number, which inhibits the impact caused by too fast detachment;

[0146] adhesion release weight , is a positive real number, which limits the smoothness of adhesion energy release; tangential disturbance weight , is a positive real number, which punishes the accumulation of tangential disturbance; detachment termination time , is a positive real number, which describes the time length of the removal process.

[0147] Therefore, when planning the removal strategy according to the criterion of reducing the detachment path action , the detachment rate, adhesion release and tangential disturbance are synchronously constrained, so as to ensure that the copper-embedded part position will not deviate from the previous copper-embedded part holding position due to sudden micro-slippage. In order to collect data, the detachment path parameters and the tangential micro-displacement are discretized into time series and aligned with the reference coordinates of the initial positioning information of the copper-embedded part, and written into the removal record set, which contains the adhesion work variation and the micro-displacement trajectory, providing input for subsequent steady-state optimization.

[0148] By the detachment path action , the removal action is constrained to a smooth and reversible path, so that the removal of the detachable holding layer no longer depends on experience, avoiding secondary disturbance to the interface shaping result. After the removal is completed, for the curvature and wetting distribution recorded in the interface shaping result, a steady-state path is selected which can dissipate residual stress energy and does not destroy the connectivity state of the guide channel. For this purpose, the residual energy functional is constructed by integrating the stress energy density with the time weight kernel:

[0149]

[0150] In the formula: stress tensor field is a symmetric second-order tensor field, which describes the instantaneous stress in the steady-state process; compliance tensor is a fourth-order positive definite tensor, which maps the stress to the energy density; path weight kernel is a positive function, which adjusts the energy decay rate according to the temperature program path parameter ; domain is a geometric region, which is the integration domain; steady-state termination time is a positive real number, which describes the time course of steady-state.

[0151] Thus, reduce the residual energy functional Means along the disengagement path parameter Select a more favorable temperature-load sequence, so that the stress tensor field Gradually attenuate and make the copper-embedded part position close to the copper-embedded part holding position. In practice, record the position convergence curve in the same coordinate system, calculate the difference vector between the terminal copper-embedded part position and the previous reference as the core field of the steady-state record set; At the same time, review the unblocked state of the guide channel. Reduce the residual energy functional Convert the steady state from the empirical heat preservation to the planning targeting energy attenuation, so that the position and stress converge synchronously and the channel advantage is retained.

[0152] After steady state, the measured curvature and wet coverage need to be mapped to the reference consistent with the interface shaping result, and the measured interlayer bonding state is quantitatively compared with the previously calculated bonding sufficiency index.

[0153] Therefore, a consistency index is introduced based on Bregman divergence, which comprehensively measures the deviation of curvature, wetness and bonding amount, so the consistency index is defined as :

[0154]

[0155] In the formula: , Bregman divergence , measure the deviation of two fields under the convex generator ; the measured curvature radius field is a positive real field, and the curvature radius distribution obtained by nondestructive imaging; the reference curvature radius field is a positive real field, and the curvature radius distribution from the interface shaping result;

[0156] wetting weight coefficient is a positive real number, which balances the importance of the wetness term; the measured wet coverage field is a real field between 0 and 1, which is the wet coverage distribution estimated by nondestructive imaging; the reference wet coverage field is a real field between 0 and 1, which is the coverage distribution mapped from the interface wetness state; the bonding weight coefficient is a positive real number, which enhances the influence of bonding deviation; the measured bonding sufficiency index is a real number, which is the bonding index measured by nondestructive measurement;

[0157] Therefore, reduce the consistency index , which means that the measured field and the reference field are highly consistent under the same reference; thus, the imaging result is no longer an isolated picture, but a field that can directly update the interface shaping result and the interlayer bonding state. Data level, Write lossless confirmation set, and superimpose with same coordinate to deposit subsequent parameters. Deposit consistency index Convert lossless imaging results into comparable numerical objects to make consistency an optimizable and traceable quantity.

[0158] When lossless confirmation set and steady-state record set are complete, it is necessary to deposit quantities directly related to process decisions into a unified format to the compaction parameter card, and give policy entries and confidence levels that can be referenced for subsequent batches. For this purpose, define the policy vector and the mapping operator, which will bring together the key objects into a parameterizable structure, and then calculate the confidence level:

[0159]

[0160] where: parameter card entry vector is a vector, the entry set that can be called in the compaction parameter card;

[0161] Policy mapping operator , maps the policy vector to the entry, which can be in the form of linear-projection combination, anisotropic kernel convolution + statistical summary, Bregman barycenter summary, and atlas topology mapping; the policy vector carries the key objects;

[0162] Conformal mapping is a positive real field, representing the transmission compliance of the soft compression surface combination; its specific form can be anisotropic Helmholtz type (PDE continuous form), anisotropic kernel convolution (Green kernel / Gaussian kernel implementation), or discrete matrix type (finite element / image grid implementation);

[0163] Target pressure distribution is a non-negative real field, a reference for target pressure; the two-way pressure field is a non-negative real field, the actual pressure distribution; the connectivity rate is a real number between 0 and 1, a core quantity that guides the connectivity state of the channel; the connectivity function represents the topology of the guide channel; the gripping coefficient is a positive real number, representing the anti-interference ability of the circumferential groove;

[0164] Holding stability index is a non-negative real number, describing the holding effect of the detachable holding layer; the interface curvature radius is a positive real field, the curvature quantity of the interface shaping result; the wetting coverage is a real field between 0 and 1, the coverage quantity of the interface wetting state; in order to facilitate process release, define the confidence level as the joint quantification of consistency and residual energy:

[0165]

[0166] Where: Consistency confidence level , a real number from 0 to 1, represents the reliability of a parameter entry; consistency weight , is a positive real number, which adjusts the influence of the consistency index; residual energy weight , being a positive real number, adjusts the effect of residual energy;

[0167] Therefore, through the parameter card entry vector With consistency confidence The combined output of the lamination parameter card not only records entries with consistent object names and clear meanings, but also carries confidence information that can be used to determine the release threshold. Entries and confidence levels are written to the same references as the copper embedding position, interface shaping results, and inter-layer bonding status, for direct reference in subsequent batches of the same type. By using mapping and confidence levels, scattered fields are consolidated into entries with decision-making significance, ensuring that the lamination parameter card has cross-batch transfer value.

[0168] The discussion revolves around steady-state processing, non-destructive verification, and parameter sedimentation, starting with the amount of action that escapes the path. The removal of the removable holding layer is defined as a smooth and reversible process, and then the residual energy functional is used. By planning stabilization as an energy decay task, the advantages of enabling the copper-embedded component to converge on the positioning interface and maintain the connectivity of the guide channel are realized. Through removal, stabilization, and non-destructive comparison, the reference is reduced to feasible evidence and reusable entries. Without changing the material system, a highly repeatable post-processing chain for lamination is constructed from the three perspectives of path, energy, and mapping.

[0169] The lossless confirmation set, the steady-state record set, the interface shaping results, and the inter-layer bonding state are transformed into release policy entries and reuse policy entries, along with the consistency confidence level. The record used as a reference is written into the compression parameter card.

[0170] If release and reuse still rely on human experience, previous efforts to guide the connectivity of the channel and maintain the position of the copper inserts will be difficult to reflect in consistent decision-making results; at the same time, if pressure consistency indicators are not included... With dissipated potential energy Introducing the release side may result in a situation where the shape is already smooth but the residual energy is still too high, which may induce the slow drift of the copper-embedded parts during subsequent hot loading.

[0171] To this end, it is necessary to synthesize the energy dimension and the consistency dimension with a resolvable decision function, so that the release and reuse have the same name input, the same semantic and the same format output; therefore, this step compresses the multi-source dimension with exponential mapping, and controls the strategy migration distance with divergence measure, so as to complete the calculable transition from the measured quantity to the release entry without introducing additional materials and equipment.

[0172] First, the strategy vector containing the conformal mapping , target pressure distribution , two-stage pressure field and the like is taken as input, and the consistency confidence is combined to construct the release decision function, so that the pressure consistency index and the dissipation potential are explicitly balanced; then the Bregman divergence between the parameter card entry vector and the reference entry vector is generated to generate the reuse score, and the visible level of the reuse entry is determined accordingly; finally, the decision value, the score and the key same name quantity are written into the compression parameter card to form the field that can be directly called for subsequent batches. The release must be carried out after the interface shaping result and the interlayer combination state are objectively evidenced, and the energy and channel information from step three are considered. In order to avoid mutual masking of multiple factors, the pressure mismatch and the gas outlet disadvantage are compressed in the form of exponential decay, and then multiplied by the consistency confidence to generate the decision value, so the release decision function is defined as:

[0173]

[0174] In the formula: the release decision value is a real number between 0 and 1, which measures whether the position of the copper-embedded part and the interface shaping result of this batch can be released;

[0175] The pressure item weight is a positive real number, which adjusts the influence of the pressure consistency index on the decision; the channel item weight is a positive real number, which adjusts the influence of the dissipation potential on the decision;

[0176] Therefore, when the lossless confirmation set gives the curvature radius consistent with the interface shaping result and the wetting coverage , and the consistency confidence is high, the release decision value will increase with the decrease of the pressure consistency index and the dissipation potential , thereby providing a single value expression for the release; therefore, the release is no longer dependent on the combination of discrete thresholds, but is integrated into a continuous and comparable decision quantity.

[0177] The processing mode is mapped to the reference acquisition pressure sampling set The two-dimensional integrated input package is mapped out And the Combined with the sufficiency index As a side field, the release strategy entry is formed together, and written into the compression parameter card. With the release judgment value The energy, pressure and channel three types of dimension are converged into a single decision variable, so that the release has the characteristics of same name input, synonymous output and measurable ratio.

[0178] Batch process migration needs to judge whether the difference between the current parameter card entry vector And the reference entry vector Will destroy the prior results of guiding channel connectivity state and copper-embedded part holding position. In order to consider directionality and interpretability, Bregman divergence is used to describe the entry difference, and the index mapping compression is used to compress the multiplexing score, so it is defined as:

[0179]

[0180] In the formula: multiplexing score , is a real number between 0 and 1, which measures the reusability of the current batch entry to the reference entry; divergence compression coefficient , is a positive real number, which adjusts the attenuation strength of divergence in the score; : Bregman divergence , is a non-negative real number, which measures the directional difference of the entry vector under the convex generator ; reference entry vector , is a vector from the reference set of the same product family or the best historical batch.

[0181] Further, with the multiplexing score As the main criterion, the visible level of the multiplexing strategy entry is labeled to the compression parameter card. When the multiplexing score Is high, and the release judgment value Also remains high, it means that the current batch and the reference batch are consistent in positioning interface topography, channel topology and pressure transmission rule, and are suitable for execution according to the reference entry; then, when the multiplexing score Down, but the sufficiency index Is still good, the multiplexing can be limited to the selection entry of the soft compression surface combination, and the cautious call to the pre-permeation resin related entry is reserved. In the processing mode, in the same reference coordinate And Align, calculate the Bregman divergence Write the multiplexing score, and trigger the automatic labeling of the entry visible level together with the release judgment value . The feasibility of cross-batch migration is converted into comparable scores, making reuse no longer a replication of experience, but a selective activation based on divergence.

[0182] Release side with release determination value Converge consistency confidence With two key physical quantities, ensure that the force on the positioning interface and the dispersion result are equivalent to the release evidence; the reuse side with reuse score Parameter card item vector With reference item vector The directional deviation of is translated into visible level labels, so that the cross-batch migration of the item has a clear range and order. Provide directly usable evidence for subsequent mass production, and provide traceable semantically stable carriers for subsequent statistics or audits. In the form of judgment and divergence, the strategy is solidified, so that the post-pressing processing conclusion can be reviewed, reused, and mass-oriented without changing the material system.

[0183] Those skilled in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized in electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. The skilled person can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0184] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system, device and unit described above can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.

[0185] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the shown or discussed mutual ones can be indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other forms.

[0186] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may also be distributed to multiple network units. Part or all of the units can be selected to achieve the purpose of the embodiment of the present application according to actual needs.

[0187] The above is merely a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A double pass vacuum lamination process for hybrid substrate multilayer copper-embedded PCB, characterized in that: Comprising, Forming a positioning interface around the periphery of the copper-embedded slot, setting a guide channel on the slot wall and the slot bottom, and processing a circumferential groove on the periphery of the copper-embedded part, and holding the copper-embedded part with a detachable holding layer, and synchronously recording the initial positioning information of the copper-embedded part and the communication state of the guide channel; Filling the slot bottom and the periphery along the guide channel with pre-penetrated resin, and keeping the detachable holding layer under reduced pressure; confirming the holding position of the copper-embedded part and the gas stagnation identification mark according to the gas outlet state of the guide channel and the interface wetting state, and synchronously recording them; Replacing the soft pressing surface combination for the second pressing, so that the pressure is transmitted on the positioning interface, and the resin is discharged along the guide channel; taking the holding position of the copper-embedded part, the gas outlet state of the guide channel, and the interface wetting state as inputs, and taking the gas stagnation identification mark as an input, to generate the interface shaping result and the interlayer bonding state; After removing the detachable holding layer, performing steady-state processing and lossless confirmation, comparing the position of the copper-embedded part with the interface shaping result, and writing the interlayer bonding state into the pressing parameter card, and archiving the initial positioning information of the copper-embedded part and the communication state of the guide channel.

2. The double-pass vacuum pressing process for mixed substrate multi-layer copper-embedded PCB according to claim 1, characterized in that: The positioning interface forms a clean contact surface after micro-etching or plasma cleaning and removing surface contamination; The continuity of the guide channel to the slot wall and the slot bottom is verified for communicability, and the same tool reference coordinate is recorded as the communication state of the guide channel, and the initial positioning information of the copper-embedded part is synchronously archived with the reference coordinate.

3. The double-pass vacuum pressing process for mixed substrate multi-layer copper-embedded PCB according to claim 2, characterized in that: The guide channel is shaped by machining or laser processing and avoids the key traces leading to the outer edge, and the circumferential groove is uniformly arranged along the periphery of the positioning interface and is consistent with the slot wall topography; The initial positioning information of the copper-embedded part includes position vector, initial positioning error, and grabbing coefficient and is associated with the communication state of the guide channel.

4. The double-pass vacuum pressing process for mixed substrate multi-layer copper-embedded PCB according to claim 3, characterized in that: The detachable holding layer is selected from materials with low residue and temperature-controlled release or mechanical peeling, and is set on the slot bottom in the vicinity of the positioning interface to lightly hold the copper-embedded part; When removed, the holding position is released along a preset path and recorded as a removal record set with the same reference coordinate, and the holding position of the copper-embedded part is continuously measured before and after removal.

5. The double-pass vacuum pressing process for mixed substrate multi-layer copper-embedded PCB according to claim 4, characterized in that: The pre-penetrated resin is compatible with the mixed medium and the surface of the copper-embedded part, and has low volatility and controllable rheology; Under reduced pressure, the slot bottom and the periphery are filled along the guide channel first, and the gas outlet state of the guide channel and the interface wetting state are recorded with the same reference, and the holding position of the copper-embedded part and the gas stagnation identification mark are generated according to the binary rule.

6. The double-pass vacuum pressing process for mixed substrate multi-layer copper-embedded PCB according to claim 5, characterized in that: The soft pressing surface combination is composed of a conformable cushion, an isolation medium and a pressure bearing sheet, which is placed in the corresponding area of the positioning interface to form a conformable pressure transmission; In the second pressing process, the second pressure field is collected to form a pressure sampling set, which is combined with the conformable mapping, the target pressure distribution and the state of the guide channel to generate a second integrated input package.

7. The double-pass vacuum lamination process of the hybrid substrate multilayer copper-embedded PCB according to claim 6, characterized in that: Based on the second integrated input package, reshaping is performed on the positioning interface to obtain a reshaped curvature set composed of interface curvature radius and wetting coverage, and the interface reshaping result is derived in the same reference coordinate; The interlayer bonding state is calculated synchronously, and a bonding sufficiency index is attached, all of which are recorded in the same field.

8. The double-pass vacuum lamination process of the hybrid substrate multilayer copper-embedded PCB according to claim 7, characterized in that: After removing the detachable holding layer, a steady-state treatment is performed, and stress decay and position convergence curves are recorded in the same reference coordinate according to the predetermined temperature and load sequence to form a steady-state record set; at the same time, the guide channel connection state is reviewed to ensure that it remains connected and is archived synchronously.

9. The double-pass vacuum lamination process of the hybrid substrate multilayer copper-embedded PCB according to claim 8, characterized in that: Non-destructive imaging is used to obtain measured curvature radius and measured wetting coverage in the same reference coordinate, and they are mapped and compared with the corresponding fields of the reshaped curvature set to generate a non-destructive confirmation set; and a one-to-one reference relationship is established between the measured interlayer bonding state and the corresponding fields of the interface reshaping result.

10. The double-pass vacuum lamination process of the hybrid substrate multilayer copper-embedded PCB according to claim 9, characterized in that: The non-destructive confirmation set, the steady-state record set, and the interface reshaping result, the interlayer bonding state, and the second pressure field are written into a lamination parameter card with the same name and quantity; The lamination parameter card solidification includes release judgment value, multiplexing score and consistency confidence, pre-permeation release degree, wetting potential, wetting mapping, stability index, and is associated with the initial positioning information of the copper-embedded part and the state of the guide channel.

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