System and method for detecting resistance value of element on substrate

Abstract

The invention relates to the technical field of resistance testing, and particularly discloses a detection system for the resistance value of an element on a substrate, which comprises a resistance value detection module, a marking device, a blanking execution mechanism and an intelligent control module, and is characterized in that the intelligent control module is configured as follows: (a) calculating the qualified rate of the whole substrate; and (b) if the sum of the small occupancy and the qualified component occupancy is greater than or equal to a reworking threshold value, feeding into a reworkable storage area, and feeding the rest into a non-reworkable storage area. The method for detecting the resistance value of the element on the substrate comprises the following steps: S1, acquiring the resistance value of the element by a probe; s2, marking elements with abnormal resistance values by using different colors; s3, the qualified rate and the small value occupancy rate of the substrate are calculated; and S4, a discharging executing mechanism is controlled to convey the substrates with the substrate qualified rate larger than or equal to the substrate qualified threshold value to a qualified area. The scheme is used for solving the problems that in the prior art, substrate high-density element resistance value detection efficiency is low, the manual sorting error rate is high, and an automatic detection system cannot intelligently decide reworking or scrapping according to the resistance value deviation direction.

Description

Technical Field

[0001] The present invention relates to the technical field of resistance testing, and in particular to a system and method for detecting the resistance of a component on a substrate. Background Art

[0002] With the rapid development of the electronic information manufacturing industry, resistors are an important part of electronic components, and the accurate and rapid detection of their resistance as an electrical variable is particularly important. In conventional resistor value detection, using a multimeter for resistance detection is the most common method.

[0003] Driven by semiconductor micro-nano processing technology, functional thin films (platinum, nickel-chromium alloy or tantalum nitride, etc.) are deposited on various insulating substrates (such as alumina ceramics, glass, quartz or polymers) through vacuum magnetron sputtering, combined with photolithography and selective etching technology to form precise circuit patterns, and finally realize high-density arrayed thin film resistor units (resistance units are also called resistance elements) on a single substrate.

[0004] If the resistance of these high-density array resistors is tested individually using a multimeter, the test will inevitably suffer from low accuracy, slow speed, and cumbersome manual operation. Furthermore, due to the small size of the components on the substrate, manual operation can easily scratch the components due to positioning errors. Furthermore, manual operation can easily result in incorrect recording of test results, leading to inaccurate laser resistance trimming of the components in subsequent processes. Whether using multimeter spot checks or full inspection, to improve the pass rate and product accuracy after shipment, components with measured resistance values ​​less than the component's reference value must be trimmed after resistance testing is completed. However, resistance trimming and resistance testing are typically performed in different processes, requiring manual positioning of the substrate and manual control of the resistance trimmer to trim specific components. This approach is not conducive to accelerating production.

[0005] Therefore, there is an urgent need to develop a system that can replace manual resistance detection of high-density components arrayed on a substrate. Although the existing technology has a disclosed technology for chip resistor detection methods, systems and devices with patent publication number CN105738747B, which proposes a process of "normal temperature resistance measurement → high voltage loading → resistance measurement after high voltage", abnormal resistance is determined by comparing the resistance difference before and after high voltage, and a technical solution is used to cut through the abnormal resistance using laser equipment. However, this method of measuring resistance and directly laser-piercing unqualified components will damage components whose scrap rate could be reduced by resistance adjustment, and thus cannot be applied to measure and determine the resistance of components on substrates after etching. Summary of the Invention

[0006] The present invention aims to provide a system and method for detecting the resistance of components on a substrate, so as to solve the problems in the prior art of low efficiency in detecting the resistance of high-density components on a substrate, high error rate in manual sorting, and the inability of the automated detection system to intelligently decide whether to rework or scrap based on the direction of resistance deviation.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions: A system for detecting resistance of components on a substrate, comprising: A resistance detection module, including a probe, for measuring the resistance of components on the substrate; A marking device is used to mark abnormal states such as no resistance, small resistance, and large resistance of components with different colors after detection; Unloading actuator, connecting qualified area, reworkable storage bin, and non-reworkable storage bin; The intelligent control module is configured to: (a) calculate the qualified rate of the entire board substrate after the resistance value of all components on the entire board substrate is detected, and the substrates with a qualified rate ≥ the substrate qualified threshold are sent to the qualified area; (b) for the substrates with a qualified rate less than the threshold, if the value is too small and the occupancy rate + the qualified component occupancy rate ≥ the rework threshold, they are sent to the rework storage area, and the rest are sent to the non-rework storage area.

[0008] The principles and advantages of this solution are: 1. Whole-board grading decision-making mechanism: By calculating the substrate pass rate and rework threshold, automatic substrate grading is achieved, significantly improving the recycling rate of unqualified substrates. At the same time, the entire system automatically detects resistance values, automatically marks, and automatically determines the pass rate, thereby reducing or even avoiding the low efficiency and high error rate caused by manual inspection; ‌2. Dynamic threshold compensation technology‌: Using "underperforming component percentage + qualified component percentage" as the rework determination value, compared with the traditional single qualified rate standard, the accuracy of identifying repairable substrates is greatly improved, avoiding the scrapping of entire boards due to local defects.

[0009] Preferably, it also includes a laser resistance trimming module; The intelligent control module is configured to include a triggered resistance adjustment mode and a full-range resistance adjustment mode. In the triggered resistance adjustment mode, when the qualified rate is greater than or equal to the substrate qualified threshold, the laser resistance adjustment module is triggered to perform laser adjustment only on the qualified components whose resistance is lower than the reference value to increase the component resistance. In the full-range resistance adjustment mode, after the component resistance is detected, the laser resistance adjustment module is used to perform laser adjustment on the qualified components whose resistance is lower than the reference value to increase the component resistance.

[0010] This solution uses two resistance adjustment modes, allowing the intelligent control module to flexibly select according to actual production needs. For new products still in the R&D stage or substrates with a significantly low overall board pass rate, the trigger resistance adjustment mode can be selected. In this trigger resistance adjustment mode, the resistance adjustment of a few qualified components on substrates that will be scrapped in the future can be avoided, thereby saving costs and improving detection efficiency. For substrates with relatively stable quality, the full-range resistance adjustment mode is adopted to ensure that after the positioning mechanism drives the probe to detect the resistance value of the component each time, the laser resistance adjustment module can be quickly used to adjust the resistance of the component that can be adjusted to the reference value. This enables the timely addition of laser resistance adjustment when needed during the resistance detection process, greatly improving production efficiency and helping to reduce energy consumption.

[0011] Selectively trimming low-resistance components among qualified components significantly improves the resistance consistency of the entire board while reducing ineffective laser operations. Furthermore, the integration of resistance detection and laser resistance trimming in this solution avoids the problems of low efficiency and high cost associated with separate resistance detection and laser resistance trimming processes. Preferably, the intelligent control module also includes a resistance trimming evaluation submodule, which is configured to perform the following operations before the laser resistance trimming module is activated: (a) Obtaining circuit images of components and performing defect analysis to identify pattern defect distribution and circuit breakpoint locations; (b) Correlate the measured resistance value of the component with the image defect analysis results to predict the failure risk during the resistance adjustment process; (c) If any of the following conditions are met, the component is considered as a non-adjustable resistance component and is skipped: Defect distribution results in no effective resistance adjustment path; The line breakpoint is located in the critical resistance adjustment area.

[0012] This solution uses a resistance trimming evaluation submodule to avoid wasted work in the laser resistance trimming module, thereby further reducing energy consumption and improving production efficiency. In addition, the defect distribution situation can facilitate staff to update and upgrade the process according to the defect situation, as well as update and optimize the circuit graphic layout.

[0013] Preferably, the probes are arranged in parallel in multiple groups, each group has 2 probes (each group of probes is also referred to as a probe group herein), each group of probes corresponds to one component, and the parallel arrangement of multiple groups can increase the resistance test speed.

[0014] Preferably, the resistance detection module includes a positioning mechanism and a probe mounted on the execution end thereof, and the probe and the marking device are integrated on the execution end of the positioning mechanism, thereby ensuring the implementation of the solution and reducing the floor space occupied.

[0015] Preferably, an elastic buffer is provided between the probe and the execution end of the positioning mechanism to reduce damage to the component during the resistance test.

[0016] Preferably, it also includes a visual recognition module, which includes a camera and an image processing unit. The camera is used to collect image data of the substrate, and the image processing unit identifies the coordinates of the midpoint position of the component electrode based on the collected image data; the intelligent control module controls the two probes of the probe group to adjust the spacing according to the acquired coordinate data, so as to adaptively detect the resistance values ​​of components of different sizes.

[0017] Preferably, the visual recognition module captures component circuit images through a camera, and the intelligent control module associates the image data with the corresponding resistance test results and stores them in a database; it also includes a human-computer interaction interface module, which visually displays the test results of the components of the entire board, wherein: the corresponding component resistance values ​​in the test results are qualified, no value, small value, and large value, and are all represented by corresponding colors. When a single component unit is selected, the corresponding circuit image can be retrieved, wherein the circuit image data comes from the database.

[0018] This technical solution, through the collaborative work of a visual recognition module and an intelligent control module, achieves precise association and storage of component resistance data and circuit images, significantly enhancing the intelligent level of the inspection system and enabling fully automated digital management. Specific technical benefits include: 1) establishing a comprehensive process defect database through the automatic matching of circuit images and resistance data; 2) the visual interaction design of the human-machine interface enables operators to quickly locate abnormal components, facilitating the analysis of similar defects; and 3) the complete data set is traceable, providing reliable data support for process optimization.

[0019] The present invention also provides a method for detecting the resistance of a component on a substrate, comprising the following steps: S1. Obtain the resistance value of each component on the substrate through the probe; S2. Use different colors to mark abnormal components with no resistance, small resistance, or large resistance. S3, the intelligent control module calculates the qualified rate and the percentage of the minimum value of the substrate. The qualified rate is the percentage of qualified components. S4. The intelligent control module controls the blanking actuator to send substrates with a whole-board substrate qualification rate ≥ a substrate qualification threshold to the qualified area, and send substrates with a smaller value occupancy rate + a qualified component occupancy rate ≥ a rework threshold to a reworkable storage area, and the rest to a non-reworkable storage area.

[0020] Preferably, before measuring the resistance, the midpoint position of the component electrode is identified by the visual recognition module, and the intelligent control module controls the probes to dynamically adjust the spacing between each group of probes according to the midpoint position of the electrode.

[0021] Preferably, for substrates with a qualified rate ≥ a set threshold, after the resistance detection is completed, the intelligent control module triggers the laser resistance trimming module to perform laser trimming only on the qualified components whose resistance is lower than the reference value to increase the component resistance.

[0022] The present invention has the following advantages: 1. Improved detection accuracy and closed-loop quality: This system uses multiple sets of probes in the resistance detection module in conjunction with image acquisition by the visual recognition module to accurately locate the component array distribution on the substrate. It also obtains the circuit image of the component through image acquisition by the visual recognition module, facilitating the laser resistance trimming module to perform selective adjustments based on the detection data. This creates a "measurement-marking-correction" closed-loop control system for qualified components on qualified substrates, significantly improving the resistance consistency of the entire board.

[0023] 2. Dual-channel visual identification: Different colors are used to directly mark and distinguish components on the substrate with no value / too small value / too large value. At the same time, the human-machine interface module synchronously displays the corresponding color marking after the resistance measurement is completed, which makes it convenient for operators to quickly identify abnormal components and visualize the proportion of different types of unqualified components in the human-machine interface module. It is convenient for staff to quickly adjust the etching of the previous process according to the proportion and location of unqualified components, thereby improving production quality.

[0024] 3. Fully automatic digital management: Each component is associated with: circuit image, process parameters and revision records. The production traceability chain is established through timestamp indexing. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The present invention is a flowchart of a method for detecting the resistance of a component on a substrate according to an embodiment of the present invention.

[0026] Figure 2 This is a processing flow after the entire board substrate qualification rate detection is completed in a trigger resistance adjustment mode in a method for detecting the resistance of components on a substrate according to an embodiment of the present invention.

[0027] Figure 3 This is a test result diagram of multiple PT100 arrays on a substrate in Example 1, where the pass rate after substrate testing is greater than the substrate pass threshold.

[0028] Figure 4 This is a test result diagram of multiple PT100 arrays on a substrate in Example 1, when the substrate is tested with a small occupancy rate + a qualified component occupancy rate ≥ the rework threshold.

[0029] Figure 5 This is a test result diagram of Example 1 where multiple PT100 arrays are placed on a substrate. After the substrate is tested, the proportion of values ​​that are too large and the proportion of values ​​that are not are too high make the substrate unqualified.

[0030] Figure 6 This is a schematic diagram of the local three-dimensional structure of the parallel robot according to an embodiment of the present invention.

[0031] Figure 7 for Figure 6 After performing the end angle adjustment in the figure, a schematic diagram of the probe, laser resistance trimming module, camera of the visual recognition module and marking device is displayed.

[0032] Figure 8 A three-dimensional structural diagram of the connection relationship between the probe and the elastic buffer.

[0033] Explanation of the reference numerals: parallel robot 1 , execution end 2 of the parallel robot, probe 21 , elastic buffer 211 , laser resistance trimming module 22 , camera 23 of the visual recognition module, marking device 24 . DETAILED DESCRIPTION

[0034] The following is further described in detail through specific implementation methods: The embodiment is basically as shown in the attached Figures 1 to 8 shown.

[0035] A system for detecting the resistance of components on a substrate includes a loading module, a visual recognition module, a resistance detection module, a marking device, a laser resistance trimming module, a blanking actuator, an intelligent control module, and a human-computer interaction interface module. The modules are described in detail as follows: Loading module: It includes a loading storage bin and a loading actuator. The loading actuator is used to transfer the substrates in the loading storage bin to the detection area. After the sensor in the detection area senses the presence of the substrate, it triggers the subsequent visual recognition module to capture the image data of the substrate in the detection area.

[0036] Visual recognition module: includes a camera 23 and an image processing unit. The camera is used to collect image data of the substrate. The image processing unit identifies the coordinates of the midpoint position of the component electrode based on the collected image data combined with a feature extraction algorithm. The intelligent control module controls the two probes of the probe group to adjust the spacing based on the acquired coordinate data to adaptively detect the resistance values ​​of components of different sizes. At the same time, the visual recognition module collects component circuit images through a camera, and the intelligent control module associates the image data with the corresponding resistance test results and stores them in a database.

[0037] Resistance detection module: includes a positioning mechanism 1 and a probe 21 mounted on its actuator end 2. The positioning mechanism 1 is a parallel robot. The probes 21 are arranged in multiple groups in parallel. The attached figure takes three groups of probes 21 as an example. Each group of probes 21 has two probes. The two probes 21 correspond to one component and are used to test the resistance of one component. The probes 21, the laser resistance trimming module 22, the camera 23 of the visual recognition module, and the marking device 24 are all integrated on the actuator end 2 of the parallel robot 1. An elastic buffer 211 is provided between each probe 21 and the actuator end 2 to ensure soft contact when the probe 21 contacts the component. In this embodiment, the elastic buffer 211 is a spring. The probe 21 is vertically slidably connected to the actuator end 2 of the parallel robot via a fixed connecting rod. The elastic buffer 211 is mounted on the connecting rod. One end of the elastic buffer 211 abuts against the top of the probe 21 and the other end abuts against the actuator end 2 of the parallel robot 1.

[0038] Marking device 24: integrated on the execution terminal 2 of the parallel robot 1, used to mark the abnormal states of no value, small value, and large value after the component resistance detection with different colors. For example, qualified components are not marked, no-value components are marked in red, small values ​​are marked in yellow, and large values ​​are marked in white.

[0039] Specifically, the marking device includes pens of three colors, and the intelligent control module controls the marking device to pop out the pen of the corresponding color and mark the corresponding component according to the detection result.

[0040] Laser resistance trimming module 22: When the intelligent control module is in the triggered resistance trimming mode, when the qualified rate ≥ the substrate qualified threshold, the intelligent control module triggers the laser resistance trimming module to perform laser trimming only on the qualified components whose resistance is lower than the reference value to increase the component resistance; when the intelligent control module is in the full-range resistance trimming mode, after the component resistance is detected, the qualified components whose resistance is lower than the reference value are laser trimmed to increase the component resistance. In the full-range resistance trimming mode, as long as the component resistance detection is completed and the component resistance can be increased to be close to the reference value through laser resistance trimming, the laser resistance trimming module will be started immediately after the component detection is completed, so that the laser resistance trimming is more timely, and the laser resistance trimming is embedded in the component resistance detection process on the substrate, greatly improving the detection-resistance trimming efficiency.

[0041] Unloading actuator: connects the qualified area, rework storage bin, and non-rework storage bin, and sends the substrate to the corresponding area according to the judgment results of the intelligent control module.

[0042] Intelligent control module: configured as: I) has trigger resistance mode and full range resistance mode, in the trigger resistance mode: after the resistance value of all elements on the whole plate substrate is detected, the qualified rate of the whole plate substrate is calculated, when the qualified rate of the substrate is greater than or equal to the substrate qualified threshold, the laser resistance adjusting module is triggered to adjust the resistance value of the element lower than the reference value in the qualified element, so that the resistance value of the element is increased to close to the reference value or reaches the reference value, after the laser resistance adjusting is completed, the substrate is sent to the qualified area by the discharging execution mechanism; In the full range resistance mode: after the element resistance value is detected, the laser resistance adjusting module is used to adjust the laser to adjust the element with a resistance value lower than the reference value in the qualified element to increase the element resistance value; II) for the substrate with a qualified rate less than the substrate qualified threshold, if the value is small and the qualified element has a rate of + qualified element rate≥rework threshold, the corresponding substrate is sent to the rework storage area by the discharging execution mechanism, and the rest is sent to the non-rework storage area.

[0043] III) has a resistance adjusting evaluation sub-module, which is configured to perform the following operations before the laser resistance adjusting module starts: (a) obtain the circuit image of the element and perform defect analysis, identify the pattern defect distribution and line breakpoint position; (b) correlate and calculate the measured resistance value of the element with the image defect analysis result to predict the failure risk in the resistance adjusting process; (c) when any of the following conditions is met, it is determined that the element cannot be adjusted and the element is skipped: Condition one, the defect distribution leads to no effective resistance adjusting path; Condition two, the line breakpoint is located in the key resistance adjusting area.

[0044] The man-machine interaction interface module: after the substrate image data is recognized by the visual recognition module, the array situation of the whole plate element is visualized and displayed in the display interface of the man-machine interaction module in the form of array topology. After the resistance value test is completed, the element units of the array are displayed in corresponding colors according to the resistance value test results, wherein the corresponding element resistance value in the test results is represented by corresponding colors (for example, qualified is represented by green, no value is represented by red, value is small is represented by yellow, and value is large is represented by white). When a single element unit is selected, the man-machine interaction interface module can review the corresponding circuit image, wherein the circuit image data is derived from the above-mentioned database.

[0045] The present application also provides a method for detecting the resistance value of elements on a substrate, comprising the following steps: Step one, parameter configuration, according to the related technical indicators of the to-be-tested element, then set the resistance value qualified range interval, element resistance value reference value, probe type, substrate qualified threshold, rework threshold and element measurement result display color in the parameter configuration sub-module provided in the man-machine interaction interface module.

[0046] Step 2: Resistance detection: The loading actuator grabs the substrate to be tested in the loading storage bin and sends it to the detection area. The midpoint position of the component electrode is obtained through identification and calibration by the visual recognition module, and then fed back to the intelligent control module. The intelligent control module controls the positioning actuator to carry a pre-set probe to measure the component and obtain the component resistance.

[0047] Step 3: The resistance detection module feeds back the resistance information obtained by the detection to the intelligent control module in real time according to the four conditions of qualified, no value, too large value, and too small value. The intelligent control module then collects and analyzes the data, and displays the corresponding color of the component units arrayed on the display screen of the human-computer interaction module according to the resistance test results. At the same time, the intelligent control module transmits the judged result information to the marking device in real time, and controls the marking device to mark the unqualified components with the corresponding set color.

[0048] Step 4. After the whole board component inspection is completed, the intelligent control module determines whether it is qualified according to the set substrate qualification threshold; if the qualification rate is greater than or equal to the substrate qualification threshold, it is judged to be qualified; after the substrate is judged to be qualified, the laser resistance adjustment module is triggered to adjust the components with resistance lower than the reference value among the qualified components, so that the component resistance is increased to close to the reference value or reaches the reference value. After the laser resistance adjustment is completed, the substrate is sent to the qualified area by the blanking actuator; for substrates with a qualification rate less than the substrate qualification threshold, if the value occupancy rate + qualified component occupancy rate ≥ the rework threshold, the blanking actuator is controlled to send the corresponding substrate to the rework storage area; substrates in other cases (such as substrates with too large values ​​or too many substrates without values) are sent to the non-rework storage area.

[0049] The following is a specific example: Example 1: For PT100 resistance testing: the qualified resistance range is set to 52-110Ω, and the display colors are set in the human-computer interaction interface module control program to green for qualified values, red for no value, yellow for small values, and white for large values; the board substrate is considered qualified only when the qualified rate of the entire board substrate is greater than or equal to 70% (the 70% is the qualified threshold for the substrate); otherwise, it is considered unqualified; the rework threshold is greater than or equal to the qualified threshold for the substrate. Assume that the rework threshold in this embodiment is 85%.

[0050] In the attached Figure 3 The substrate pass rate is over 70%. Each cell represents an independent component unit, with different colors representing different results. Green indicates a qualified resistance measurement, red indicates no resistance value, yellow indicates a low resistance value (the yellow area is relatively concentrated, and can be used to block surrounding qualified components in subsequent processes, allowing rework and etching of components in the yellow area), and white indicates a high resistance value. Click each component cell to view the corresponding circuit image.

[0051] In the attachedFigure 4 In the case that the qualified rate of the substrate is less than 70%, but the sum of the value small element rate and the qualified element rate is greater than or equal to 85%, the substrate is sent to the rework storage area by the unloading actuator, so as to facilitate subsequent rework processing.

[0052] In the attached Figure 5 In the case that the qualified rate of the substrate is less than 70%, but the sum of the value small element rate and the qualified element rate is greater than or equal to 85%, the substrate is sent to the rework storage area by the unloading actuator, so as to facilitate subsequent rework processing.

[0053] The above is only an embodiment of the present application, and the specific technical solutions and / or common knowledge of the scheme are not described in detail. It should be noted that for those skilled in the art, without departing from the technical solutions of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application, and these will not affect the effect and practicality of the present application. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode and the like recorded in the specification can be used to explain the content of the claims.

Claims

1. A system for detecting the resistance of components on a substrate, characterized in that: include: A resistance detection module, including a probe, for measuring the resistance of components on the substrate; A marking device is used to mark abnormal states such as no resistance, small resistance, and large resistance of components with different colors after detection; Unloading actuator, connecting qualified area, reworkable storage bin, and non-reworkable storage bin; The intelligent control module is configured to: (a) calculate the qualified rate of the entire board substrate after the resistance value of all components on the entire board substrate is detected, and the substrates with a qualified rate ≥ the substrate qualified threshold are sent to the qualified area; (b) for the substrates with a qualified rate less than the threshold, if the value is too small and the occupancy rate + the qualified component occupancy rate ≥ the rework threshold, they are sent to the rework storage area, and the rest are sent to the non-rework storage area.

2. The system for detecting resistance of a component on a substrate according to claim 1, wherein: It also includes a laser resistance trimming module; The intelligent control module is configured to include a triggered resistance adjustment mode and a full-range resistance adjustment mode. In the triggered resistance adjustment mode, when the qualified rate is greater than or equal to the substrate qualified threshold, the laser resistance adjustment module is triggered to perform laser adjustment only on the qualified components whose resistance is lower than the reference value to increase the component resistance. In the full-range resistance adjustment mode, after the component resistance is detected, the laser resistance adjustment module is used to perform laser adjustment on the qualified components whose resistance is lower than the reference value to increase the component resistance.

3. The system for detecting resistance of a component on a substrate according to claim 2, wherein: The intelligent control module further includes a resistance trimming evaluation submodule, which is configured to perform the following operations before the laser resistance trimming module is started: (a) Obtaining circuit images of components and performing defect analysis to identify pattern defect distribution and circuit breakpoint locations; (b) Correlate the measured resistance value of the component with the image defect analysis results to predict the failure risk during the resistance adjustment process; (c) If any of the following conditions are met, the component is considered as a non-adjustable resistance component and is skipped: Defect distribution results in no effective resistance adjustment path; The line breakpoint is located in the critical resistance adjustment area.

4. The system for detecting resistance of a component on a substrate according to claim 3, wherein: The resistance detection module includes a positioning mechanism and a probe mounted on the execution end thereof, and the probe and the marking device are both integrated on the execution end of the positioning mechanism.

5. The system for detecting resistance of a component on a substrate according to claim 4, wherein: An elastic buffer is provided between the probe and the execution end of the positioning mechanism.

6. The system for detecting resistance of a component on a substrate according to claim 1, wherein: It also includes a visual recognition module, which includes a camera and an image processing unit. The camera is used to collect image data of the substrate, and the image processing unit identifies the coordinates of the midpoint position of the component electrode based on the collected image data; the intelligent control module controls the two probes of the probe group to adjust the spacing according to the acquired coordinate data.

7. The system for detecting resistance of a component on a substrate according to claim 6, wherein: The visual recognition module captures component circuit images through a camera, and the intelligent control module associates the image data with the corresponding resistance test results and stores them in a database; it also includes a human-computer interaction interface module, which visually displays the test results of the components of the entire board, wherein: the corresponding component resistance values ​​in the test results are qualified, no value, small value, and large value, and are all represented by corresponding colors. When a single component unit is selected, the corresponding circuit image can be viewed.

8. A method for detecting the resistance of a component on a substrate, characterized in that: The steps include: S1. Obtain the resistance value of each component on the substrate through the probe; S2. Use different colors to mark abnormal components with no resistance, small resistance, or large resistance. S3, the intelligent control module calculates the qualified rate and the percentage of the minimum value of the substrate. The qualified rate is the percentage of qualified components. S4. The intelligent control module controls the blanking actuator to send substrates with a whole-board substrate qualification rate ≥ a substrate qualification threshold to the qualified area, and send substrates with a smaller value occupancy rate + a qualified component occupancy rate ≥ a rework threshold to a reworkable storage area, and the rest to a non-reworkable storage area.

9. The method for detecting the resistance of a component on a substrate according to claim 8, wherein: Before measuring the resistance, the visual recognition module identifies the midpoint position of the component electrode, and the intelligent control module controls the probes to dynamically adjust the spacing between each group of probes based on the midpoint position of the electrode.

10. The method for detecting the resistance of a component on a substrate according to claim 8, wherein: For substrates with a qualified rate ≥ a set threshold, after the resistance detection is completed, the intelligent control module triggers the laser resistance trimming module to perform laser trimming only on the qualified components whose resistance is lower than the reference value to increase the component resistance.

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