Sublimation printing head integrated heat pipe and liquid cooling heat dissipation structure
By integrating heat pipes and liquid cooling structures into the thermal sublimation print head, the problem that traditional heat dissipation methods cannot meet high power density requirements is solved, achieving efficient heat dissipation and stable printing.
Patent Information
- Application Number
- CN202510931049.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-07
- Publication Date
- 2025-10-10
AI Technical Summary
The heat dissipation method of traditional thermal sublimation print heads cannot meet the requirements of high power density and high load conditions, resulting in degraded print quality, limited speed and reduced equipment stability.
The heat dissipation structure adopts heat pipe and liquid cooling. By embedding a ring heat pipe in the main body of the print head mounting plate and building in a coolant flow channel, active cooling of the heat pipe condensation section is achieved, thereby improving the heat dissipation performance.
It effectively improves the heat dissipation performance of the print head, ensures the stability and reliability of the printing process, and adapts to the heat dissipation requirements of various printing scenarios.
Smart Images
Figure CN120756213A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of printing equipment, in particular to a heat pipe integrated into a thermal sublimation print head and a liquid-cooled heat dissipation structure. BACKGROUND
[0002] With the wide application of thermal sublimation printing technology in high-resolution, high-speed, high-load continuous printing scenarios (such as industrial barcode label printing, receipt / invoice printing, medical film imaging, photo-level images, etc.), the working temperature and heat dissipation efficiency of the thermal sublimation print head (TPH) as the core heating component have become the key bottleneck restricting the printing performance, stability and service life. The working principle of the thermal sublimation print head is a printing method that heats the ribbon (usually containing yellow, magenta, cyan and black) to sublimate into a gaseous state, and then directly penetrates into the fibers of the printing medium (such as paper, cloth, etc.). In this process, the color molecules of the ribbon will directly change from solid to gas at high temperature and penetrate into the micropores of the medium to form a high-quality image with continuous color tones. In order to meet the high-resolution, high-speed printing requirements, a very high density of small heating points is integrated on the print head. In the high-frequency, continuous, and large-scale printing mode, these dense heat points will generate a large amount of highly concentrated heat energy. If the heat is not dissipated in time, it will cause problems such as degradation of printing quality, limitation of printing speed, thermal damage to components, and decline in equipment stability.
[0003] The traditional heat dissipation of the thermal sublimation print head mainly relies on air convection (heat sink + fan) or a small amount of passive heat dissipation conduction of metal. However, in the face of current and future higher power density and high-load working conditions, the traditional air cooling method has significant shortcomings, and therefore, in order to break through the performance limit of existing thermal sublimation printing technology and meet the stringent requirements of ultra-high printing speed, extremely long continuous working time, small device space, and ultra-quiet operation, etc.
[0004] Therefore, there is an urgent need for a heat pipe integrated into a thermal sublimation print head and a liquid-cooled heat dissipation structure with higher heat dissipation efficiency, stronger space adaptability, and more accurate temperature control. SUMMARY
[0005] The technical problem to be solved by the present application is to provide a heat pipe integrated into a thermal sublimation print head and a liquid-cooled heat dissipation structure, which effectively overcomes the defects of the prior art.
[0006] The technical solution of the present application to solve the above technical problem is as follows:
[0007] A heat dissipation structure integrating a thermal sublimation print head with an integrated heat pipe and liquid cooling comprises a heat-conducting print head mounting plate body and a heat pipe. The print head mounting plate body is in the shape of an elongated strip, and the print head is arranged along the length direction of the print head mounting plate body and mounted on one side of the print head mounting plate body. The heat pipe is an annular tube and is embedded in the periphery of the print head mounting plate body along the length direction of the print head mounting plate body. The evaporation section of the heat pipe fits the print head, a coolant flow channel is provided inside the print head mounting plate body, and the condensation section of the heat pipe is close to the coolant flow channel. A liquid inlet joint and a liquid outlet joint connected to the coolant flow channel are respectively provided on one side of the print head mounting plate body.
[0008] On the basis of the above technical solution, the present invention can also be improved as follows.
[0009] Furthermore, there are a plurality of heat pipes, which are parallel to each other and spaced apart between the two sides of the print head mounting plate body.
[0010] Furthermore, the print head mounting plate body is made of aluminum alloy or copper alloy metal.
[0011] Furthermore, an annular heat pipe groove corresponding to and engaging with the heat pipes is provided on the periphery of the print head mounting plate body.
[0012] Furthermore, the print head mounting plate body is provided with a plurality of print head mounting holes extending through both sides thereof at intervals along its length direction, and bolts connected to the print heads are provided through the print head mounting holes.
[0013] Furthermore, the print head mounting plate body is a rectangular seat, and a rectangular limiting portion is vertically provided at the long side edge of one side thereof. The print head is arranged in the installation area defined by the limiting portion and one side of the print head mounting plate body in the longitudinal direction.
[0014] Furthermore, an electrical interface for installing a temperature measuring element is provided on one side of the print head mounting plate body in the longitudinal direction.
[0015] Furthermore, the above-mentioned cooling liquid flow channel is arranged inside the above-mentioned print head mounting plate body near its other surface, and extends between the two ends of the above-mentioned print head mounting plate body. The above-mentioned liquid inlet joint and liquid outlet joint are respectively provided at both ends of one side of the above-mentioned print head mounting plate body, and a section of the above-mentioned heat pipe close to the other surface of the above-mentioned print head mounting plate body is set as a condensation section.
[0016] Furthermore, the above-mentioned cooling liquid flow channels are provided with two groups, one group is close to the other side of the above-mentioned print head mounting plate body, and the other group is close to one side of the above-mentioned print head mounting plate body, and the two groups of the above-mentioned cooling liquid flow channels are interconnected.
[0017] Furthermore, the coolant flow channel is in a straight, serpentine or spiral shape.
[0018] The beneficial effect of the present invention is that by embedding a heat pipe in the main body of the print head mounting plate and building in a coolant flow channel, active cooling of the heat pipe condensation section is achieved, thereby improving the overall heat dissipation performance of the print head and ensuring the stability and reliability of the printing process. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the structure of the thermal sublimation print head integrated with the heat pipe and liquid cooling heat dissipation structure and the print head installation of the present invention;
[0020] Figure 2 It is a schematic structural diagram of the heat dissipation structure of the thermal sublimation print head integrated with heat pipe and liquid cooling of the present invention;
[0021] Figure 3 A cross-sectional view of a heat dissipation structure integrating a heat pipe and liquid cooling for a thermal sublimation print head according to the present invention;
[0022] Figure 4 It is a structural schematic diagram of the serpentine coolant flow channel in the heat dissipation structure of the thermal sublimation print head integrated with the heat pipe and liquid cooling of the present invention.
[0023] In the accompanying drawings, the components represented by the reference numerals are as follows:
[0024] 1. Print head mounting plate body; 2. Heat pipe; 3. Coolant flow channel; 11. Liquid inlet connector; 12. Liquid outlet connector; 13. Heat pipe slot; 14. Print head mounting hole; 15. Limiting part; 16. Electrical interface. DETAILED DESCRIPTION
[0025] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.
[0026] Example
[0027] like Figure 1 、 2As shown in Figures 3 and 4, the heat dissipation structure of the thermal sublimation print head integrated with heat pipe and liquid cooling in this embodiment includes a heat-conducting print head mounting plate body 1 and a heat pipe 2. The print head mounting plate body 1 is in the shape of an elongated strip, and the print head is arranged along the length direction of the print head mounting plate body and mounted on one side of the print head mounting plate body 1. The heat pipe 2 is an annular tube and is embedded in the outer periphery of the print head mounting plate body 1 along the length direction of the print head mounting plate body 1. The evaporation section of the heat pipe 2 is attached to the print head (indicated by the dotted line A in the figure), a coolant flow channel 3 is provided inside the print head mounting plate body 1, and the condensation section of the heat pipe 2 is close to the coolant flow channel 3. A liquid inlet joint 11 and a liquid outlet joint 12 connected to the coolant flow channel 3 are respectively provided on one side of the print head mounting plate body 1.
[0028] In the heat dissipation structure of the thermal sublimation print head integrated with heat pipes and liquid cooling in this embodiment, the heat pipe 2 is mounted around the periphery of the print head mounting plate body 1 in a surrounding embedded manner (circling the length of the print head mounting plate body 1), and the print head is mounted on one side of the print head mounting plate body 1 in the length direction. This allows one section of the heat pipe 2 (the evaporation section) to be as close to and in close contact with the print head as possible. The embedded design of the heat pipe 2 achieves rapid heat conduction from the print head, avoiding local overheating. At the same time, the coolant flow channel 3 designed inside the print head mounting plate body 1 is used to pass coolant, effectively and actively cooling the condensation section of the heat pipe 2. Compared with traditional print head cooling technology, this has the following technical advantages:
[0029] 1) The structure is compact, and the heat pipe 2 and the coolant flow channel 3 are integrated into the periphery and interior of the print head mounting plate body 1, saving space and facilitating modular installation.
[0030] 2) The embedded design of the heat pipe 2 enables rapid heat conduction to the print head, avoiding local overheating.
[0031] 3) The coolant flow channel 3 directly cools the condensing section of the heat pipe 2, greatly improving the overall heat dissipation efficiency.
[0032] As a preferred embodiment, a plurality of heat pipes 2 are provided, which are parallel to each other and spaced apart between the two sides of the print head mounting plate body 1 .
[0033] In the above embodiment, the number of heat pipes 2 can be flexibly configured according to the actual printing power to adapt to various printing scenarios and ensure good heat dissipation effect.
[0034] Preferably, the print head mounting plate body 1 is made of aluminum alloy or copper alloy metal, which has better thermal conductivity.
[0035] As a preferred embodiment, the periphery of the print head mounting plate body 1 is provided with an annular heat pipe groove 13 corresponding to and engaged with the heat pipe 2 .
[0036] In the above embodiment, the shape and size of the heat pipe slot 13 match the heat pipe 2, achieving good and stable embedding of the heat pipe 2 on the outer periphery of the print head mounting plate body 1, so that the assembly structure is relatively compact.
[0037] In the present embodiment, the heat pipe slot 13 is exposed at both ends of the other side of the print head mounting plate body 1, and the middle region of the other side is shielded by the shielding surface designed integrally with the print head mounting plate body 1.
[0038] In the present embodiment, the above-mentioned print head mounting plate body 1 is provided with a plurality of print head mounting holes 14 penetrating both sides thereof at intervals along the length direction thereof, and the above-mentioned print head mounting holes 14 are provided with bolts for connecting the print head. By penetrating the print head mounting hole 14 with the bolt, stable assembly with the print head is achieved, and the structure is stable and compact.
[0039] Preferably, the above-mentioned print head mounting plate body 1 is a cuboid seat body, and a long rectangular limiting portion 15 is vertically provided at the long edge of one side of the length direction thereof, and the print head is arranged in the mounting area defined by the limiting portion 15 and one side of the length direction of the print head mounting plate body 1. The design of the limiting portion 15 forms a mounting area for assembling the print head on one side of the print head mounting plate body 1, and the assembly of the print head can be positioned by using the limiting portion 15, so that the mounting position is more accurate.
[0040] As a preferred embodiment, one side of the length direction of the above-mentioned print head mounting plate body 1 is provided with an electrical interface 16 for mounting a temperature measuring element.
[0041] In the above embodiment, the design of the electrical interface 16 facilitates the installation of the temperature measuring element, real-time monitoring of the temperature of the print head mounting plate body 1, and intelligent temperature control adjustment. This design supports the access of an intelligent temperature control system, improving the stability and safety of the printing process.
[0042] As a preferred embodiment, the above-mentioned cooling liquid flow channel 3 is arranged inside the above-mentioned print head mounting plate body 1 close to the other side thereof and extends between the two ends of the above-mentioned print head mounting plate body 1, and the two ends of one side of the above-mentioned print head mounting plate body 1 are respectively provided with the liquid inlet joint 11 and the liquid outlet joint 12, and one section of the above-mentioned heat pipe 2 close to the other side of the above-mentioned print head mounting plate body 1 is a condensation section.
[0043] In the above embodiment, the cooling liquid flow channel 3 extends between the two ends of the print head mounting plate body 1, and has a large cooling range, which can achieve good cooling effect on the condensation section of the heat pipe 2.
[0044] Preferably, the coolant flow channels 3 are provided in two groups, one of which is located near the other side of the print head mounting plate body 1, and the other is located near one side of the print head mounting plate body 1. The two groups of coolant flow channels 3 are interconnected. One group of coolant flow channels 3 is located near the condensation section of the heat pipe 2, achieving a better cooling effect on the condensation section. The design of the other group of coolant flow channels 3 provides a wider cooling range and better cooling effect.
[0045] In this embodiment, the cooling liquid flow channel 3 adopts a variety of shapes of flow channels, specifically, a straight type, a serpentine type (such as Figure 4 In this embodiment, the projected area of the coolant channel 3 covers more than 90% of the heat pipe groove 13.
[0046] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0048] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.
[0049] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0050] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.
[0051] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.
Claims
1. A heat dissipation structure integrating heat pipe and liquid cooling for a thermal sublimation print head, characterized by: The invention comprises a heat-conducting print head mounting plate body (1) and a heat pipe (2), wherein the print head mounting plate body (1) is in the shape of an elongated strip, and a print head is arranged along the length direction of the print head mounting plate body (1) and mounted on one side of the print head mounting plate body (1), and the heat pipe (2) is an annular tube and is embedded around the periphery of the print head mounting plate body (1) along the length direction of the print head mounting plate body (1), and the evaporation section of the heat pipe (2) is attached to the print head, and a coolant flow channel (3) is provided inside the print head mounting plate body (1), and the condensation section of the heat pipe (2) is close to the coolant flow channel (3), and a liquid inlet joint (11) and a liquid outlet joint (12) connected to the coolant flow channel (3) are respectively provided on one side of the print head mounting plate body (1).
2. The heat dissipation structure of a thermal sublimation print head with integrated heat pipe and liquid cooling according to claim 1, characterized in that: The heat pipes (2) are provided in plurality and are parallel to each other and distributed at intervals between the two sides of the print head mounting plate body (1).
3. The heat dissipation structure of a thermal sublimation print head with integrated heat pipe and liquid cooling according to claim 2, characterized in that: The print head mounting plate body (1) is made of aluminum alloy or copper alloy metal.
4. The heat dissipation structure of a thermal sublimation print head with integrated heat pipe and liquid cooling according to claim 1, characterized in that: The periphery of the print head mounting plate main body (1) is provided with an annular heat pipe groove (13) corresponding to and engaging with the heat pipe (2) on a one-to-one basis.
5. The heat dissipation structure of a thermal sublimation print head integrated with a heat pipe and liquid cooling according to claim 4, characterized in that: The print head mounting plate body (1) is provided with a plurality of print head mounting holes (14) passing through both sides thereof at intervals along its length direction, and bolts connected to the print heads are passed through the print head mounting holes (14).
6. The heat dissipation structure of a thermal sublimation print head integrated with a heat pipe and liquid cooling according to claim 5, characterized in that: The print head mounting plate body (1) is a rectangular parallelepiped seat, and a rectangular limiting portion (15) is vertically provided at the edge of the long side of one side thereof. The print head is arranged in an installation area defined by the limiting portion (15) and one side of the print head mounting plate body (1) in the longitudinal direction.
7. The heat dissipation structure of a thermal sublimation print head integrated with a heat pipe and liquid cooling according to claim 1, characterized in that: An electrical interface (16) for installing a temperature measuring element is provided on one side of the print head mounting plate body (1) in the longitudinal direction.
8. A heat dissipation structure integrating heat pipes and liquid cooling for a thermal sublimation print head according to any one of claims 1 to 7, characterized in that: The cooling liquid flow channel (3) is arranged in a portion of the inside of the print head mounting plate body (1) close to the other side thereof, and extends between the two ends of the print head mounting plate body (1). The two ends of one side of the print head mounting plate body (1) are respectively provided with the liquid inlet joint (11) and the liquid outlet joint (12). A section of the heat pipe (2) close to the other side of the print head mounting plate body (1) is set as a condensation section.
9. The heat dissipation structure of a thermal sublimation print head integrated with a heat pipe and liquid cooling according to claim 8, characterized in that: The cooling liquid flow channels (3) are provided with two groups, one of which is close to the other side of the print head mounting plate body (1), and the other is close to one side of the print head mounting plate body (1), and the two groups of cooling liquid flow channels (3) are interconnected.
10. The heat dissipation structure of a thermal sublimation print head integrated with a heat pipe and liquid cooling according to claim 8, characterized in that: The cooling liquid flow channel (3) is in one of the following shapes: straight, serpentine, and spiral.