Layout method, device and system of cabin driving and berthing controller and medium
Through the layout method of priority sorting and distance adjustment, the serious problem of high-speed signal crosstalk in the cabin mooring controller was solved, and signal integrity and transmission smoothness were achieved.
Patent Information
- Application Number
- CN202510702161.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-28
- Publication Date
- 2025-10-10
AI Technical Summary
In the cabin and mooring controller of new energy vehicles, since multiple functions are integrated on a single PCB board, high-speed signal crosstalk is severe and signal integrity does not meet requirements.
By obtaining the lines between the SoC module and each connector in the cabin mooring controller, the high-speed signal priority of the overlapping lines is determined, and the connectors are arranged in descending order of priority and from near to far from the SoC module. The distance between the SoC module and the connector and the line spacing are adjusted to reduce crosstalk.
It achieves the signal integrity requirements on the PCB board, reduces the crosstalk between high-speed signals, and ensures smooth signal transmission.
Smart Images
Figure CN120756385A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of vehicle technology, and in particular to a layout method, device, system and medium of a cabin mooring controller. Background Art
[0002] With the development of new energy vehicles, the functions of internal automotive controllers are becoming increasingly complex, and signal rates are increasing. In the traditional domain controller design of Hongqi models, the intelligent cockpit domain controller is primarily responsible for driving the central control, LCD instrument panel, head-up display system, and rear armrest screen, while the intelligent vehicle control platform controller is responsible for vehicle control, vehicle functions and management, driving and parking, and intelligent driving backup. The cockpit driving and parking controller, however, integrates the existing intelligent cockpit domain controller, intelligent driving controller, and intelligent vehicle control platform controller into a single controller, simultaneously implementing functions such as body comfort, air conditioning, infotainment, gateway, and powertrain control.
[0003] However, when integrating multiple functions on a single PCB, improper PCB layout can easily lead to severe crosstalk between multiple high-speed signals and substandard signal integrity. Summary of the Invention
[0004] In view of this, the purpose of the embodiments of the present invention is to provide a layout method, device, system and medium for a cabin mooring controller to solve one or more technical problems existing in the prior art and at least provide a beneficial option or create conditions.
[0005] In one aspect, an embodiment of the present invention provides a method for configuring a cabin mooring controller, the method comprising the following steps: Obtain the lines between the SoC module and each connector in the cabin mooring controller; If it is determined that there are overlapping lines, the high-speed signals corresponding to the overlapping lines are determined, the priority of each high-speed signal is obtained, the multiple lines are arranged in descending order of the priority of the high-speed signals, and the connectors connected to the lines are arranged in order from near to far from the SoC module; If it is determined that the distance between the SoC module and the connector exceeds a distance threshold, determining the priority of the lines between the SoC module and each connector, and adjusting the SoC module according to the priority to arrange the SoC module closer to the connector with a higher priority; After arranging the module circuits corresponding to the connectors, the spacing between the lines interconnecting the SoC module and the module circuits is adjusted so that the spacing between the lines meets the set spacing.
[0006] Optionally, obtaining the priority of each high-speed signal includes: Obtaining the type of the high-speed signal, and increasing the priority score of the high-speed signal according to the type of the high-speed signal; Obtain the rate of the high-speed signal. If it is confirmed that the rate of the high-speed signal is higher than the rate threshold, increase the priority score of the high-speed signal. Increase the priority score of the high-speed signal based on its eye width, insertion loss, and return loss; The priority scores of the high-speed signals are accumulated to obtain the priority of the high-speed signal.
[0007] Optionally, increasing the priority score of the high-speed signal according to the type of the high-speed signal includes: Obtain the type of the high-speed signal. If it is confirmed that the type of the high-speed signal belongs to the SoC minimum system, increase the priority score of the high-speed signal. The priority score of a high-speed signal is increased according to the number of high-speed signals of the same type.
[0008] Optionally, the method further includes: If there are no overlapping lines, arrange the connectors so that the wiring between the connectors and the circuits of each module is smooth.
[0009] Optionally, the connectors include a main connector, an Ethernet connector, a video connector, a USB connector, an antenna connector, an A2B connector, a GNSS connector, and an audio connector; in S200, arranging the connectors connected to the respective lines in order from near to far from the SoC module includes: Arranging the plurality of lines in descending order of priority of high-speed signals to obtain an order of connectors connected to each line; Corresponding layout areas are set up on the PCB board in sequence, and connectors connected to various lines are arranged in the corresponding layout areas in sequence.
[0010] Optionally, the method further includes: If it is determined that the distances between the SoC module and each connector are within the distance threshold, the SoC module is arranged so that the distance deviations between the SoC module and each connector are lower than the deviation threshold.
[0011] Optionally, adjusting the spacing between circuits interconnecting the SoC module and each module circuit so that the spacing between the circuits meets a set spacing includes: Determine the width of the lines that interconnect the SoC module with the circuits of each module; Adjust the spacing between adjacent lines so that the spacing between lines is at least 3 times the line width.
[0012] In another aspect, an embodiment of the present invention provides a layout device for a cabin mooring controller, comprising: The first module is used to obtain the lines between the SoC module and each connector in the cabin mooring controller; The second module is configured to, if it is determined that overlapping lines exist, determine the high-speed signals corresponding to the overlapping lines, obtain the priority of each high-speed signal, arrange the multiple lines in descending order of priority of the high-speed signals, and arrange the connectors connected to the lines in order from closest to farthest from the SoC module; a third module, configured to, if it is determined that the distance between the SoC module and the connector exceeds a distance threshold, determine the priority of the lines between the SoC module and each connector, and adjust the SoC module according to the priority, so as to arrange the SoC module closer to the connector with a higher priority; The fourth module is used to adjust the spacing between the circuits interconnecting the SoC module and each module circuit after arranging the module circuits corresponding to each connector, so that the spacing between the circuits meets the set spacing.
[0013] In another aspect, an embodiment of the present invention provides a layout system for a cabin mooring controller, including: at least one processor; at least one memory for storing at least one program; When the at least one program is executed by the at least one processor, the at least one processor implements the above method.
[0014] On the other hand, an embodiment of the present invention provides a computer-readable storage medium storing a program executable by a processor. When the program is executed by the processor, it is used to perform the above method.
[0015] The embodiments of the present invention include the following beneficial effects: The present invention obtains the lines between the SoC module and each connector in the cabin mooring controller. If it is determined that there are overlapping lines, the high-speed signals corresponding to the overlapping lines are determined, the priority of each high-speed signal is obtained, and the multiple lines are arranged in descending order according to the priority of the high-speed signal. The connectors connected to each line are arranged in order from near to far from the SoC module, so that the wiring between the connector and each module is smooth. If it is determined that the distance between the SoC module and the connector exceeds the distance threshold, the priority of the line between the SoC module and each connector is determined, and the SoC module is adjusted according to the priority to adjust the SoC module to be arranged close to the connector with a higher priority. After arranging the module circuits corresponding to each connector, the spacing between the lines interconnecting the SoC module and each module circuit is adjusted so that the spacing between the lines meets the set spacing. The present invention meets the signal integrity requirements of the PCB routing and reduces the crosstalk between multiple high-speed signals by implementing the SoC module, the connector and each module circuit on a single PCB board. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 11 is a schematic flow chart of the steps of a method for arranging a cabin mooring controller according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the top-layer layout of a PCB board provided by an embodiment of the present invention; Figure 3 This is a schematic diagram of the bottom layer layout of a PCB board provided by an embodiment of the present invention; Figure 4 This is a structural block diagram of a layout device of a cabin mooring controller provided by an embodiment of the present invention. DETAILED DESCRIPTION
[0017] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.
[0018] It should be noted that although the device schematics illustrate a modular division and the flowcharts illustrate a logical sequence, in some cases, the steps shown or described may be performed in a different order than the modular division in the device or the sequence in the flowcharts. The terms "first," "second," and so on in the specification, claims, and drawings are used to distinguish similar items and are not necessarily used to describe a specific order or precedence.
[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.
[0020] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner.In the following description, many specific details are provided so as to provide a full understanding of the embodiments of the present application. However, it will be appreciated by those skilled in the art that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps etc. can be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the application.
[0021] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically separate entities. That is, these functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.
[0022] The flowcharts shown in the accompanying drawings are for illustrative purposes only and do not necessarily include all contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may be decomposed, while others may be combined or partially combined. Therefore, the actual execution order may vary depending on the actual situation.
[0023] In this invention, to ensure signal integrity, the relevant requirements for PCB routing are as follows: The spacing between traces meets the 3W principle; The trace length should be as short as possible and should at least meet the trace length requirements of various signal lines; All types of signals need to have complete references and should not cross partitions; In order to address the deficiencies in the prior art, the present invention provides a layout method, device, system and medium for a cabin mooring controller.
[0024] like Figure 1 As shown, Figure 1 An embodiment of the present invention provides a layout method for a cabin mooring controller, the method comprising the following steps: S100, obtaining the lines between the SoC module and each connector in the cabin mooring controller; It should be noted that according to the priority calculation method of the present invention, the priority order of each module in the cabin mooring controller is as follows: SoC module, video module, Ethernet module, USB module, wireless communication module, and remaining modules. Specifically, first confirm the layout of the SoC pins and determine the connectors connected to each pin of the SoC module; S200, if it is determined that there are overlapping lines, determining the high-speed signals corresponding to the overlapping lines, obtaining the priority of each high-speed signal, arranging the multiple lines in descending order of the priority of the high-speed signals, and arranging the connectors connected to the lines in order from closest to the SoC module to farthest away; Specifically, if there is overlap in the lines, the high-speed signals corresponding to each line are identified, and the overlapping lines are sorted according to the priority of the high-speed signals. The connectors with high priority are arranged first to ensure that they are close to the SoC.
[0025] S300, if it is determined that the distance between the SoC module and the connector exceeds the distance threshold, determining the priority of the lines between the SoC module and each connector, and adjusting the SoC module according to the priority to arrange the SoC module closer to the connector with higher priority; Specifically, if it cannot be guaranteed that the distance between the SoC and various high-speed signal connectors is close, the high-speed signal priority is confirmed and the SoC module is placed close to the connector with high priority. The distance between the SoC module and each connector decreases as the priority of the corresponding line increases.
[0026] S400 , after arranging the module circuits corresponding to the connectors, adjusting the spacing between the interconnected lines between the SoC module and the module circuits so that the spacing between the lines meets the set spacing.
[0027] Specifically, arrange the module circuits corresponding to each connector; arrange the minimum system of the SoC module (including DDR, PMIC, memory chips, multiple controllers, etc.); if the high-speed signals connecting the SoC module to other module circuits cannot meet the 3W principle, adjust the layout until the 3W principle is met and complete the layout.
[0028] In the steps S100 to S400 shown in the embodiment of the present application, by obtaining the lines between the SoC module and each connector in the cabin mooring controller, if it is determined that there are overlapping lines, the high-speed signals corresponding to each overlapping line are determined, the priority of each high-speed signal is obtained, the multiple lines are arranged in descending order of the priority of the high-speed signal, and the connectors connected to each line are arranged in order from near to far from the SoC module; so that the wiring between the connector and each module is smooth. If it is determined that the distance between the SoC module and the connector exceeds the distance threshold, the priority of the line between the SoC module and each connector is determined, and the SoC module is adjusted according to the priority to adjust the SoC module to be arranged close to the connector with a higher priority; after arranging the module circuits corresponding to each connector, the spacing between the lines interconnecting the SoC module and each module circuit is adjusted so that the spacing between the lines meets the set spacing. The present invention meets the signal integrity requirements of the PCB routing and reduces the crosstalk between multiple high-speed signals by implementing the SoC module, the connector and each module circuit on a single PCB board.
[0029] In some embodiments, in S200, obtaining the priority of each high-speed signal includes: S210, obtaining a type of the high-speed signal, and increasing a priority score of the high-speed signal according to the type of the high-speed signal; Specifically, confirm whether the type of the high-speed signal belongs to the SoC minimum system, then determine the number of high-speed signals of the same type, and use this as a basis to increase the priority score of the high-speed signal; S220, obtaining the rate of the high-speed signal, and if it is determined that the rate of the high-speed signal is higher than the rate threshold, increasing the priority score of the high-speed signal; Specifically, determine whether the rate of the high-speed signal is higher than 1 Gbps. If so, increase the priority score by 1 point; otherwise, keep the priority score unchanged. S230, increasing the priority score of the high-speed signal according to the eye width, insertion loss, and return loss of the high-speed signal; Specifically, judging the eye diagram requirement of the high-speed signal, the eye width ≥ 0.5UI, the priority score is added by 2 points; the eye width ≥ 0.3UI, the priority score is added by 1 point; judging the insertion loss requirement of the high-speed signal, the insertion loss requirement ≥-6dB, the priority score is added by 2 points; judging the return loss requirement of the high-speed signal, the return loss requirement ≤-12dB, the priority score is added by 2 points. S240, the priority score of the high-speed signal is accumulated to obtain the priority of the high-speed signal.
[0030] After the priority score of the high-speed signal is accumulated, the priority of the high-speed signal is ranked according to the priority score from high to low.
[0031] In some embodiments, in S210, the priority score of the high-speed signal is increased according to the type of the high-speed signal, including: S211, the type of the high-speed signal is obtained, and if it is confirmed that the type of the high-speed signal belongs to the SoC minimum system, the priority score of the high-speed signal is increased; S212, the priority score of the high-speed signal is increased according to the number of the same type of high-speed signal.
[0032] Specifically, if it is confirmed that the type of the high-speed signal belongs to the SoC minimum system, the priority score is added by 1 point; otherwise, the priority score remains unchanged; then, the number of the same type of high-speed signal is judged, if the number ≥20, the priority score is added by 3 points; if the number ≥10, the priority score is added by 2 points; the number ≥5, the priority score is added by 1 point.
[0033] In some embodiments, in S200, the method further includes: If there is no coincident line, the connector is arranged to be smooth between the connector and the wiring of each module circuit.
[0034] Specifically, if there is no coincident line, the connector is arranged to be smooth between the connector and the wiring of each module circuit.
[0035] In some embodiments, the connector includes a main connector, an Ethernet connector, a video connector, a USB connector, an antenna connector, an A2B connector, a GNSS connector and an audio connector; in S200, the connectors connected by each line are arranged in order from near to far according to the distance from the SoC module, including: The plurality of lines are arranged in descending order of the priority of the high-speed signal to obtain the sorting of the connectors connected by each line; The corresponding arrangement area is set on the PCB in order according to the sorting, and the connectors connected by each line are arranged in the corresponding arrangement area in order.
[0036] Exemplarily, the multiple lines are arranged in descending order of priority of high-speed signals, and the resulting order is: main connector, Ethernet connector, video connector, USB connector, antenna connector, A2B connector, GNSS connector and audio connector; the main connector is placed in the upper right corner of the PCB board, the Ethernet connector is placed at the lower edge of the PCB board, the video connector is placed on both sides of the Ethernet connector, the USB connector is placed near the middle of the upper left corner of the PCB board, the antenna connector is placed on the right side of the PCB board, the A2B connector is placed in the upper left corner of the PCB board, the GNSS connector is placed in the upper right corner of the PCB board, and the audio connector is placed above the PCB board.
[0037] In some embodiments, in S300, the method further includes: If it is determined that the distances between the SoC module and each connector are within the distance threshold, the SoC module is arranged so that the distance deviations between the SoC module and each connector are lower than the deviation threshold.
[0038] Specifically, it is determined whether the distances between the SoC and various high-speed signal connectors can be ensured to be relatively close. If so, the SoC modules are arranged so that the distances between the SoC modules and various high-speed signal connectors are relatively close.
[0039] In some embodiments, in S400, adjusting the spacing between circuits interconnecting the SoC module and each module circuit so that the spacing between the circuits meets a set spacing includes: Determine the width of the lines that interconnect the SoC module with the circuits of each module; Adjust the spacing between adjacent lines so that the spacing between lines is at least 3 times the line width.
[0040] Specifically, the 3W principle states that the spacing between traces must be at least three times the trace width. For example, if the trace width (W) is 0.2mm, the spacing between two adjacent traces must be at least 0.6mm (3 x 0.2mm). This principle is primarily intended to reduce electromagnetic interference (EMI) and crosstalk between traces.
[0041] The cabin mooring controller in the present invention has a double-sided layout, that is, the layout of components on both the top and bottom layers, mainly including the following circuits / components: connector, power module, CAN module, Ethernet module, SoC module, wireless communication module (WIFI and Bluetooth), video module, audio module, USB module, GNSS module; The following is a detailed description of the circuit layout of each part: The connector layout is described as follows: refer to Figure 2 and Figure 3, connectors include main connector, video connector, Ethernet connector, USB connector, antenna connector, A2B connector and GNSS connector, audio connector; The main connector is placed in the upper right corner of the PCB to ensure smooth flow of main power and facilitate circuit layout near the connector; The Ethernet connector is placed at the bottom edge of the PCB board, horizontally located in the center of the PCB board. Since the interconnection lines between the SoC and the Ethernet module exit from the bottom of the chip, the Ethernet connector is placed at the bottom of the PCB board to facilitate later wiring; The video connectors are placed on both sides of the Ethernet connector. Since the interconnection lines between the SoC and the video module are connected on both sides below the SoC, the video connectors are placed below the PCB board to facilitate later wiring. The USB connector is placed near the middle of the upper left corner of the PCB board. Since the interconnection line between the SoC module and the USB exits from the upper left corner, the USB connector is placed in the upper left corner for easy routing later. The antenna connector is placed on the right side of the PCB. Since the antenna routing requires clearance, it is placed in an area with sparse chips to facilitate isolation of the antenna part from other modules on the PCB during routing. The A2B connector and GNSS connector are placed in the upper left and upper right corners of the PCB, respectively. Since the GNSS connector occupies a larger space than the A2B connector and the space above the PCB is more crowded than the space below, this placement method can effectively utilize the layout space. The audio connector is placed above the PCB, keeping a distance from the main connector to provide enough space for the CAN module layout.
[0042] The layout of the power modules is described as follows: The power module includes a power inlet circuit, a primary power supply, and a secondary power supply; The power inlet circuit should be placed near the main connector along the edge of the board. ESD capacitors and TVS diodes should be placed close to the connector pins. Filter capacitors should be placed close to the device pins along the current flow direction. Large package capacitors should be placed on the top layer of the PCB, while small capacitors can be placed on the bottom layer to save space. The primary power supply should be arranged along the edge of the board, along the current flow direction. Chips, MOS tubes, inductors, and large package capacitors should be placed on the top layer of the PCB, and small capacitors should be placed on the bottom layer. The primary power supply should be arranged in a position that ensures that the main power flow is approximately "L" shaped on the PCB to facilitate power supply connection. The secondary power supply is placed close to the power-consuming chip, using large copper foil and multiple vias to ensure that the voltage drop and via current density meet the chip requirements.
[0043] For the CAN module, it mainly includes the following parts: The CAN module uses a double-sided layout to effectively utilize the bottom layer space. At the same time, multiple CAN channels are placed close to the connector pins to save space for other module layouts.
[0044] For the Ethernet module, it mainly includes the following parts: The Ethernet module includes a PHY chip and a Switch chip; 100Base-T1 and 1000Base-T1 use a double-sided layout. To ensure signal quality and reduce layer changes, all single-channel 100Base-T1 or 1000Base-T1 components are placed on the same layer. On the connector side, multiple 100Base-T1 and 1000Base-T1 components are placed on the bottom layer of the PCB to save space.
[0045] It's important to note that 100Base-T1 is an Ethernet standard with a data rate of 100 Mbps. "100" represents the 100 Mbps data rate, and "Base" refers to baseband transmission, meaning only one signal is allowed to transmit on the channel, occupying the full bandwidth. The "T" in "T1" stands for twisted pair. The "1" has a different meaning than some numbers in other Ethernet standards; it serves to distinguish 100Base-T1 from other similar Ethernet standards.
[0046] 1000Base-T1 has a data transmission rate of 1000Mbps, or 1Gbps. The "1000" represents the 1000Mbps rate, the "Base" also refers to baseband transmission, the "T" in "T1" stands for twisted pair, and the "1" distinguishes it from other standards in the same family.
[0047] Because the Ethernet module connector is located below the PCB, the PHY chip is placed below the PCB, close to the connector, to minimize 100Base-T1 and 1000Base-T1 trace lengths. The switch chip, due to its larger size, denser pin count, higher power consumption, and interconnection with the SoC, is placed in the liquid cooling area below the PCB. Following the connector signal path, the two switches are placed on either side of the PHY chip, prioritizing smooth traces between the chip, the SoC, the connector, the two switches, and between the switches and the PHY.
[0048] For SoC modules, it mainly includes the following parts: SoC (System on Chip), DDR chip, SoC power supply circuit, PMIC chip, SoC layout is a key consideration during PCB layout. First, the controller uses liquid cooling, requiring the SoC to be placed within a "U"-shaped heat dissipation zone. Second, the controller's SoC interconnects multiple chips, including the DDR chip, the switch chip, the video chip, the USB chip, the UFS chip, the Flash chip, and the power supply. Therefore, the SoC's layout must leave ample space for later wiring, and allow for the layout and routing of chips such as the switch, DDR, UFS, Flash, and power supply. Since the connector locations for modules like USB, video, and Ethernet are already determined, the corresponding chips and key circuitry can be placed close to the connectors. Since the video and Ethernet modules are located below the PCB, the SoC should be placed close to the bottom of the PCB to meet high-speed signal trace length requirements and ensure signal quality during later routing. Furthermore, by compressing the layout below the PCB, space is provided for modules like the AMP, USB, and power supply above the SoC, effectively utilizing the layout area.
[0049] The DDR chip needs to be placed close to the corresponding pins on the SoC. To ensure short trace lengths and allow space for the DDR to route equal-length traces, a distance of approximately 10 mm is generally reserved between the DDR and the SoC. However, since the present invention requires full utilization of the space above the SoC to accommodate modules such as the AMP and power supply, the DDR layout must consider the space required for later traces of these modules. Therefore, the present invention increases the distance between the DDR and the SoC to facilitate the use of two layers of traces. This long trace length can be compensated for by strictly controlling trace length errors later. Since the traces between the SoC and the DDR exit on the left and right sides of the SoC, the DDR should be placed on the left and right sides of the SoC, close to the corresponding pins. Furthermore, because the DDR chip in this controller experiences a significant temperature rise, it is necessary to ensure the DDR's heat dissipation to protect the chip from high-temperature damage during operation. Therefore, the DDR is placed in a heat dissipation zone.
[0050] To facilitate powering the SoC, the SoC power supply circuit must be placed close to the SoC. Furthermore, to facilitate powering the power chip within the power supply circuit, the SoC power supply circuit must be positioned so that it can draw power from the main current path. Because the primary current flow in this invention is from right to left, multiple controllers are placed above and to the right of the SoC, respectively, with the PMIC chip placed above and to the right of the SoC. Furthermore, the power chip generates significant heat and must be placed in a liquid cooling area to prevent damage from excessive temperatures.
[0051] The UFS and Flash chips are storage peripherals of the SoC and need to be placed close to the corresponding pins of the SoC to facilitate later routing and routing, while also preventing excessive trace lengths from affecting signal quality. Therefore, they are placed in the upper right and upper left of the SoC, respectively.
[0052] For the wireless communication module, it mainly includes the following contents: To ensure signal quality, RF signal traces should be kept short. Therefore, the wireless communication chip should be placed close to the antenna connector to minimize trace length. Furthermore, to prevent interference between the RF signal and other signals on the board, a shielding case is placed around the wireless communication chip. Only the wireless communication chip and its power supply chip are placed within the case. Furthermore, a shielding ground via area should be reserved near the antenna connector during layout.
[0053] The video module mainly includes the following parts: Since the video module connectors are located at the lower right and left sides of the PCB, to ensure short GMSL and FPD-Link traces, place the video chip close to the video connector. At the same time, position some video chips at a 45-degree angle to ensure smooth video signal routing.
[0054] For the audio module, it mainly includes the following parts: To ensure the quality of the A2B (Automotive Audio Bus) signal, its trace length should not be too long. Therefore, the A2B chip should be placed close to the antenna connector to reduce the trace length. To ensure space for modules such as the AMP and USB, the A2B chip can be shifted to the left to effectively utilize the layout space.
[0055] The DSP chip is placed right below the A2B chip for easy wiring.
[0056] The AMP chip is placed near the audio connector to facilitate wiring while providing space for the SoC and its power chip below.
[0057] For the USB module, it mainly includes the following: To ensure signal quality, USB traces should be short, so the USB chip should be placed close to the USB connector to minimize trace length. To maximize board space, the USB chip should be shifted to the left to effectively utilize board space.
[0058] For the GNSS module, it mainly includes the following contents: To ensure signal quality, the GNSS chip is placed close to the connector. At the same time, to save layout space and reduce the stubs caused by connector pins, the GNSS chip is placed on the bottom layer of the PCB.
[0059] An embodiment of the present invention further provides a layout device for a cabin mooring controller, comprising: The first module is used to obtain the lines between the SoC module and each connector in the cabin mooring controller; The second module is configured to, if it is determined that there are coincident lines, determine high-speed signals corresponding to each of the coincident lines, acquire priorities of the high-speed signals, arrange the lines in descending order of the priorities of the high-speed signals, and arrange connectors connected by each of the lines in order from near to far to the SoC module. The third module is configured to, if it is determined that the distance between the SoC module and the connector exceeds the distance threshold, determine priorities of lines between the SoC module and each of the connectors, and adjust the SoC module according to the priorities to arrange the SoC module close to the connector with a higher priority. The fourth module is configured to, after arranging the module circuits corresponding to the connectors, adjust the distances between the lines interconnecting the SoC module and each of the module circuits to make the distances between the lines meet the set distance.
[0060] The embodiment of the present application also provides a layout system of a cabin berthing controller, which comprises a memory, a processor, and a program stored in the memory and executable on the processor, and the program is executed by the processor to implement the layout method of the cabin berthing controller.
[0061] For example, the processor and the memory in the vehicle controller can be connected through a bus. The memory can be used to store non-transient software programs and non-transient computer executable programs as a non-transient computer readable storage medium. In addition, the memory can include a high-speed random access memory and can also include a non-transient memory, such as at least one disk memory, a flash memory device, or other non-transient solid-state memory device. In some embodiments, the memory can optionally include a memory remotely arranged relative to the control processor, and these remote memories can be connected to the control device through a network.
[0062] The non-transient software programs and instructions required for the layout method of the cabin berthing controller according to the above embodiment are stored in the memory, and when executed by the processor, the layout method of the cabin berthing controller according to the above embodiment is executed.
[0063] The device embodiments described above are only schematic, and the units described as separate components can or can not be physically separate, that is, can be located in one place or distributed on multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the embodiment scheme.
[0064] The embodiment of the present application also provides a vehicle comprising the vehicle control device according to the above embodiment.
[0065] The vehicle can be a private car, such as a sedan, SUV, MPV, or pickup truck. It can also be a commercial vehicle, such as a van, bus, small truck, or large trailer. The vehicle must have an electric motor that can output power or store mechanical energy as a generator. If the vehicle is a new energy vehicle, it can be a hybrid or a pure electric vehicle.
[0066] Since the vehicle applies all the technical solutions of the above-mentioned control device or vehicle controller, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.
[0067] In addition, an embodiment of the present invention further provides a computer-readable storage medium, which stores computer-executable instructions, and the computer-executable instructions are used to execute the above-mentioned layout method of the cabin mooring controller.
[0068] It is worth noting that since the computer-readable storage medium of an embodiment of the present invention can execute the layout method of the cabin mooring controller of any of the above-mentioned embodiments, the specific implementation methods and technical effects of the computer-readable storage medium of an embodiment of the present invention can refer to the specific implementation methods and technical effects of the layout method of the cabin mooring controller of any of the above-mentioned embodiments.
[0069] In addition, an embodiment of the present invention also provides a computer program product, including a computer program or computer instructions, the computer program or computer instructions are stored in a computer-readable storage medium, the processor of the computer device reads the computer program or computer instructions from the computer-readable storage medium, and the processor executes the computer program or computer instructions, so that the computer device executes the above-mentioned layout method of the cabin mooring controller.
[0070] It is worth noting that since the computer program product of the embodiment of the present invention can execute the layout method of the cabin mooring controller of any of the above-mentioned embodiments, the specific implementation methods and technical effects of the computer program product of the embodiment of the present invention can refer to the specific implementation methods and technical effects of the layout method of the cabin mooring controller of any of the above-mentioned embodiments.
[0071] Those skilled in the art will appreciate that all or some of the steps and systems disclosed above can be implemented as software, firmware, hardware, or any suitable combination thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on computer-readable media, which may include computer storage media (or non-transitory media) and communication media (or transient media). As is well known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information, such as computer-readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disks (DVDs) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. Furthermore, as is well known to those skilled in the art, communication media typically includes computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.
[0072] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, i.e., they may be located in one place or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of this embodiment.
Claims
1. A layout method for a cabin mooring controller, characterized in that: The method comprises: Obtain the lines between the SoC module and each connector in the cabin mooring controller; If it is determined that there are overlapping lines, the high-speed signals corresponding to the overlapping lines are determined, the priority of each high-speed signal is obtained, the multiple lines are arranged in descending order of the priority of the high-speed signals, and the connectors connected to the lines are arranged in order from near to far from the SoC module; If it is determined that the distance between the SoC module and the connector exceeds a distance threshold, determining the priority of the lines between the SoC module and each connector, and adjusting the SoC module according to the priority to arrange the SoC module closer to the connector with a higher priority; After arranging the module circuits corresponding to the connectors, the spacing between the lines interconnecting the SoC module and the module circuits is adjusted so that the spacing between the lines meets the set spacing.
2. The layout method according to claim 1, wherein: The obtaining of the priority of each high-speed signal includes: Obtaining the type of the high-speed signal, and increasing the priority score of the high-speed signal according to the type of the high-speed signal; Obtain the rate of the high-speed signal. If it is confirmed that the rate of the high-speed signal is higher than the rate threshold, increase the priority score of the high-speed signal. Increase the priority score of the high-speed signal based on its eye width, insertion loss, and return loss; The priority scores of the high-speed signals are accumulated to obtain the priority of the high-speed signal.
3. The layout method according to claim 2, wherein: Increasing the priority score of the high-speed signal according to the type of the high-speed signal includes: Obtain the type of the high-speed signal. If it is confirmed that the type of the high-speed signal belongs to the SoC minimum system, increase the priority score of the high-speed signal. The priority score of a high-speed signal is increased according to the number of high-speed signals of the same type.
4. The layout method according to claim 2, wherein: The method further comprises: If there are no overlapping lines, arrange the connectors so that the wiring between the connectors and the circuits of each module is smooth.
5. The layout method according to claim 1, wherein: The connectors include a main connector, an Ethernet connector, a video connector, a USB connector, an antenna connector, an A2B connector, a GNSS connector, and an audio connector. In S200, the connectors connected to the respective lines are arranged in order from near to far from the SoC module, including: Arranging the plurality of lines in descending order of priority of high-speed signals to obtain an order of connectors connected to each line; Corresponding layout areas are set up on the PCB board in sequence, and connectors connected to various lines are arranged in the corresponding layout areas in sequence.
6. The layout method according to claim 2, wherein: The method further comprises: If it is determined that the distances between the SoC module and each connector are within the distance threshold, the SoC module is arranged so that the distance deviations between the SoC module and each connector are lower than the deviation threshold.
7. The layout method according to claim 1, wherein: The step of adjusting the spacing between interconnected circuits between the SoC module and each module circuit so that the spacing between the circuits meets a set spacing includes: Determine the width of the lines that interconnect the SoC module with the circuits of each module; Adjust the spacing between adjacent lines so that the spacing between lines is at least 3 times the line width.
8. A layout device for a cabin mooring controller, characterized in that: The device comprises: The first module is used to obtain the lines between the SoC module and each connector in the cabin mooring controller; The second module is configured to, if it is determined that overlapping lines exist, determine the high-speed signals corresponding to the overlapping lines, obtain the priority of each high-speed signal, arrange the multiple lines in descending order of the priority of the high-speed signals, and arrange the connectors connected to the lines in order from closest to farthest from the SoC module; a third module, configured to, if it is determined that the distance between the SoC module and the connector exceeds a distance threshold, determine the priority of the lines between the SoC module and each connector, and adjust the SoC module according to the priority, so as to arrange the SoC module closer to the connector with a higher priority; The fourth module is used to adjust the spacing between the circuits interconnecting the SoC module and each module circuit after arranging the module circuits corresponding to each connector, so that the spacing between the circuits meets the set spacing.
9. A layout system for a cabin mooring controller, characterized in that: The method comprises a memory, a processor and a program stored in the memory and executable on the processor, wherein when the program is executed by the processor, the method for arranging a cabin mooring controller according to any one of claims 1 to 7 is implemented.
10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the layout method of the cabin mooring controller according to any one of claims 1 to 7 is implemented.