Satellite load heat dissipation structure, thermal control system and method

Abstract

The invention discloses a satellite load heat dissipation structure, a thermal control system and a method, solves the problem of low heat dissipation efficiency caused by using an antenna array plane as a heat dissipation surface in the prior art, and has the beneficial effects of high integration degree and high heat dissipation efficiency, and the specific scheme is as follows: the satellite load heat dissipation structure comprises a heat dissipation plate connected with the antenna array plane, a plurality of first bosses are arranged on the surface of the heat dissipation plate, the first bosses are located on the side, close to the antenna array plane, of the heat dissipation plate, grooves are formed in the first bosses to contain first heat conduction pipes, the first bosses support a plurality of first heating active devices, and second bosses are arranged on the portion, between every two adjacent first bosses, of the heat dissipation plate. A second heating active device is supported through a second boss, a phase change material is arranged in the side, close to the first boss, in the heat dissipation plate, a second heat conduction pipe is arranged in the heat dissipation plate in the thickness direction of the heat dissipation plate, and the end of the second heat conduction pipe is arranged on the side of the heat dissipation plate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of satellite heat dissipation, in particular to a satellite load heat dissipation structure, a thermal control system and a method. BACKGROUND

[0002] The statements in this section merely provide background information related to the present application and do not necessarily constitute the prior art.

[0003] With the continuous development and progress of science and technology, miniaturization, flattening, modularization, light weight and high integration have become the main development trend of satellite load, the integration of components gradually increases, the heat consumption continues to rise, and the requirements for the uniformity, low cost, light weight and low profile of the thermal control system gradually increase. The thermal control system is an important service support system for satellite load, and its performance directly affects the performance, service life and reliability.

[0004] To adapt to the demand of one rocket multiple launches, the satellite load has higher and higher requirements for miniaturization and flattening design. In order to meet the uniformity and heat dissipation requirements, large satellites usually use antenna array surfaces as heat dissipation surfaces, and use orthogonal heat pipe networks for uniformity and heat dissipation. Using the antenna array surface as the heat dissipation surface has the following defects: 1. The satellite load is designed to be flat and low in profile, the integration of heat-generating active devices is high, the power density is large, the heat capacity is small, the heat dissipation area is limited, and heat dissipation is difficult; 2. Using the antenna array surface as the heat dissipation surface, the antenna array surface is a non-metallic structure with poor heat conduction ability, the heat transfer path of active devices such as transceiver assemblies is long, the thermal resistance is large, and the heat dissipation efficiency is low; 3. The antenna array surface structure is usually complex, when the antenna array surface is used as the heat dissipation surface, low-absorption high-emission thermal control surface treatment needs to be performed on the surface, the processing technology is complex, the cost is high, and the performance of the antenna array surface is also affected to a certain extent; 4. The orthogonal heat pipe network needs a large number of heat pipes, has a high profile, high cost and large weight.

[0005] That is, the existing heat dissipation surface with a high profile antenna array surface has a high profile, large weight, long heat transfer path and low heat dissipation efficiency, which is not suitable for thermal control design of small satellites. SUMMARY

[0006] In view of the deficiencies of the prior art, the purpose of the present application is to provide a satellite load heat dissipation structure, which realizes heat transfer and dissipation by reasonably designing the layout and structure of the heat conduction pipe, the heat dissipation plate and the heat-generating active device.

[0007] In order to achieve the above purpose, the present application is realized by the following technical scheme: In the first aspect, the present invention provides a satellite payload heat dissipation structure, including a heat sink connected to an antenna array surface, a plurality of first bosses are arranged on the surface of the heat sink, the first boss is located on the side of the heat sink close to the antenna array surface, the first boss has a groove to accommodate a first heat pipe, and a plurality of first heat-generating active devices are supported by the first boss, a second boss is arranged between two adjacent first bosses of the heat sink, and a second heat-generating active device is supported by the second boss, a phase change material is arranged inside the heat sink on the side close to the first boss, a second heat pipe is arranged inside the heat sink along its thickness direction, and an end of the second heat pipe is placed on the side of the heat sink.

[0008] As described above, in a satellite payload heat dissipation structure, the first boss is arranged along the first direction of the heat sink, and heat dissipation surfaces are respectively arranged on the outside of the outermost first boss on both surfaces of the heat sink, heat conductive material is encapsulated inside the heat dissipation surface, and thermal control paint is sprayed on the surface of the heat dissipation surface.

[0009] In the satellite payload heat dissipation structure described above, the second heat pipe is provided at least one location along the second direction of the heat dissipation plate, the second heat pipe passes through the phase change material and forms an integral structure with the phase change material, the second heat pipe is lower than the heat conductive material, and the second heat conductive pipe contacts the heat conductive material to dissipate heat through the heat dissipation surface; The thickness of the phase change material is greater than the thickness of the thermal conductive material.

[0010] In the satellite payload heat dissipation structure as described above, the thermally conductive material is graphite film.

[0011] In the satellite payload heat dissipation structure as described above, a skin is provided on the side of the heat dissipation plate away from the first boss, and a honeycomb structure is filled inside the heat dissipation plate between the skin and the phase change material.

[0012] In the satellite payload heat dissipation structure as described above, the first heat pipe is flush with the first boss, and the second boss is flush with the first boss.

[0013] In the second aspect, the present invention also provides a satellite payload thermal control system, which adopts the above-mentioned satellite payload heat dissipation structure, the antenna array surface is connected to the circuit board, the antenna array surface and the circuit board are installed on the above-mentioned heat dissipation plate, and the circuit board is arranged close to the heat dissipation plate. The first heat-generating active device is a transceiver component, and the second heat-generating active device is a delay component. The transceiver component and the delay component are soldered to the circuit board.

[0014] In the satellite payload thermal control system as described above, a first thermal pad is provided between the transceiver assembly and the first boss, a second thermal pad is provided between the delay assembly and the second boss, and the second boss corresponds to the delay assembly in a one-to-one manner.

[0015] In the satellite payload thermal control system as described above, a wave-controlled power supply is provided on the other side of the heat sink away from the first boss.

[0016] In a third aspect, the present invention further provides a satellite payload heat dissipation method, which uses the aforementioned satellite payload heat control system and includes the following contents: The heat transfer path of the heat generated by the transceiver assembly when it is working is: transceiver assembly-first heat pipe-phase change material and second heat pipe-outer surface of the heat sink; The heat transfer path of the heat generated when the delay component is working is: delay component-second boss-phase change material and second heat pipe-outer surface of the heat sink.

[0017] The beneficial effects of the present invention are as follows: 1) The present invention utilizes limited heat dissipation space and provides a heat sink on one side of the antenna array. The heat sink is provided with a first boss to support a first heat-generating active component and a second boss to support a second heat-generating active component. The heat sink is also provided with a first heat pipe and a second heat pipe, so that the heat sink integrates structural support and heat dissipation functions. The heat sink has a low profile, which effectively reduces the overall profile of the antenna system. The first heat-generating active component and the second heat-generating active component are both in direct contact with the heat sink, and the antenna array is not used as a heat dissipation surface. The overall thermal conductivity is strong, the heat transfer path is short, and the heat dissipation efficiency is high.

[0018] 2) The present invention uses a heat sink as the heat dissipation area, eliminating the need for complex thermal control of the antenna array, effectively controlling costs and avoiding impacts on antenna array performance; and rationally arranging heat-generating active components to avoid excessive heat concentration.

[0019] 3) In the present invention, the first heat pipe is arranged along the surface of the heat sink, and the second heat pipe is arranged along the thickness direction of the heat sink, so that the first heat pipe and the second heat pipe are orthogonally distributed, forming an orthogonal heat pipe network, thereby improving the temperature uniformity of the heat sink and the temperature uniformity of the transceiver component, reducing thermal resistance, and improving heat transfer efficiency. In addition, by combining the arrangement of phase change material and thermal conductive material, the number of first heat pipes and second heat pipes can be reduced, which is beneficial to controlling the quality and cost of the heat sink; the second heat pipe transfers the heat generated by the heat-generating active component during operation and the heat stored in the phase change material to the heat dissipation surface in a timely manner, with high heat transfer efficiency. The second heat pipe and the phase change material are designed and used in an integrated manner, which not only increases the heat capacity but also improves the heat transfer capacity.

[0020] 4) The present invention uses phase change material to store the heat generated during the operation of the antenna by utilizing the latent heat of phase change. When the antenna is not operating, the heat is gradually released through the heat dissipation surface. Moreover, the phase change material has a large filling volume and a thin thickness, and can take care of every active device, making the temperature more uniform. A honeycomb structure is filled between the phase change material and the skin to improve the mechanical properties and at the same time have a weight reduction effect.

[0021] 5) In the present invention, a thermally conductive material is provided on the outer side of the first boss on the surface of the heat sink. The thermally conductive material is selected such that the graphite film has low density and high in-plane thermal conductivity, thereby improving the in-plane thermal conductivity of the heat sink and effectively reducing the weight. The second heat pipe transfers the heat generated when the antenna is working to the heat sink, and the graphite film disperses the heat and finally radiates the heat, thereby improving the heat transfer efficiency.

[0022] 6) The load thermal control system provided by the present invention integrates the phase change material, the first heat pipe, the second heat pipe, and the heat sink into an integrated structure to meet the requirements of heat storage, heat transfer, and mechanics. The delay component and the transceiver component are rationally arranged. The heat generated by the delay component and the transceiver component is dissipated through the first heat pipe, the second heat pipe, the phase change material, the thermal conductive material, and the heat dissipation surface, which can effectively transfer the heat generated by the heat-generating active components to the outside. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0024] Figure 1 A schematic diagram of a satellite payload thermal control system according to one or more embodiments of the present invention Figure 1 .

[0025] Figure 2 This is a schematic diagram of a satellite payload heat dissipation structure according to one or more embodiments of the present invention. Figure 2 .

[0026] Figure 3 It is a cross-sectional schematic diagram of a satellite payload heat dissipation structure according to one or more embodiments of the present invention.

[0027] Figure 4 This invention Figure 3 Schematic diagram of the AA section.

[0028] In the figure: the distances or sizes between parts are exaggerated to show the positions of various parts, and the schematic diagram is for reference only.

[0029] Among them: 1-antenna array surface; 2-circuit board; 3-delay component; 4-transceiver component; 5-first heat pipe; 6-heat dissipation surface; 7-heat dissipation plate; 8-wave-controlled power supply; 9-second heat pipe; 10-phase change material; 11-thermal conductive material; 12-second boss; 13-skin; 14-honeycomb structure; 15-first boss. DETAILED DESCRIPTION

[0030] It should be noted that the following detailed description is illustrative and is intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used in the present invention have the same meaning as commonly understood by those skilled in the art to which the present invention belongs.

[0031] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless otherwise clearly indicated in the present invention, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "include" and / or "comprising" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or their combinations; As introduced in the background technology, in the prior art, the heat dissipation area of ​​the satellite payload is limited, and the antenna array surface as a heat dissipation surface has poor thermal conductivity, resulting in low heat dissipation efficiency. In order to solve the above technical problems, the present invention proposes a satellite payload heat dissipation structure.

[0032] Example 1 In a typical embodiment of the present invention, reference is made to Figure 3 and Figure 4 As shown, a satellite payload heat dissipation structure includes a heat sink 7 connected to the antenna array surface, and a plurality of first bosses 15 are provided on the surface of the heat sink 7. The first boss 15 is located on the side of the heat sink 7 close to the antenna array surface 1. The first boss 15 has a groove to accommodate the first heat pipe 5. The first boss 15 supports multiple first heat-generating active devices. The first boss 15 plays a supporting and heat-dissipating role. The heat sink 7 is provided with a second boss 12 between two adjacent first bosses 15. The second heat-generating active device is supported by the second boss 12. The second boss 12 supports the second heat-generating active device. 2 also plays a supporting and heat dissipation role. The first boss 15 and the second boss 12 are both made of metal and can conduct heat. The phase change material 10 is set inside the heat dissipation plate 7 on the side close to the first boss 15. The second heat pipe 9 is set inside the heat dissipation plate 7 along its thickness direction. The heat dissipation plate 7 is set in a limited space. The heat dissipation plate 7 is reasonably arranged to support the corresponding heat-generating active components through the first boss 15 and the second boss 12. The heat dissipation plate integrates structural support and heat dissipation functions, effectively improves the heat dissipation capacity, and controls the cross-section of the heat dissipation plate.

[0033] Among them, the first heat pipe 5 is flush with the first boss 15, the first boss 15 is arranged along the first direction of the heat sink 7, the first boss 15 has the same length as the heat sink 7, the first boss 15 is long, the groove in the first boss 15 is formed by milling, the second boss 12 is flush with the first boss 15, the shape of the second boss 12 is consistent with the shape of the second heat-generating active device, and the adjacent two second bosses between the adjacent two first bosses are set at a set distance.

[0034] Specifically, the first heat pipe 5 is a copper-water heat pipe, which is flat with a width of 7~10mm and a thickness of 3~4mm; the second heat pipe 9 is pre-buried in the heat sink 7, and the second heat pipe 9 is an aluminum-ammonia heat pipe. The length of the aluminum-ammonia heat pipe is consistent with the length of the second direction of the heat sink 7. The copper-water heat pipe and the aluminum-ammonia heat pipe are orthogonally distributed to form an orthogonal heat pipe network, which improves the temperature uniformity of the heat sink and the temperature uniformity of the first heating active device and the second heating active device, reduces thermal resistance, improves heat transfer efficiency, and effectively reduces the profile, weight and cost of the satellite payload.

[0035] It should be noted that the number of the first heat pipes 5 is greater than the number of the second heat pipes 9. In this way, the first heat pipes 5 are copper-water heat pipes. Copper-water heat pipes are lighter, have a lower cross-section, and lower cost than aluminum-ammonia heat pipes, and their structure is more flexible than aluminum-ammonia heat pipes.

[0036] In this embodiment, the two surfaces of the heat sink 7 extend outward from the outer side of the outermost first boss 15 to form heat dissipation surfaces 6, and the heat dissipation surface 6 is encapsulated with a thermally conductive material 11, and the thickness of the thermally conductive material 11 is 0.2 mm; specifically, the thermally conductive material 11 is a graphite film, the density of the graphite film is about one-third of that of the aluminum alloy, and the in-plane thermal conductivity is about 2 to 3 times that of the aluminum alloy, which improves the planar thermal conductivity of the heat dissipation surface and effectively reduces the weight. The aluminum-ammonia heat pipe transfers the heat generated when the antenna is working to the heat dissipation surface, the graphite film disperses the heat, and finally radiates the heat, thereby improving the heat transfer efficiency.

[0037] In addition, the upper and lower surfaces of the heat dissipation plate 7 are sprayed with a heat control paint with low absorption and high emission.

[0038] It should be noted that a skin 13 is provided on the side of the heat sink 7 away from the first boss. The skin 13 is an aluminum skin. The inside of the heat sink 7 is filled with a honeycomb structure 14 between the skin 13 and the phase change material. The honeycomb structure 14 specifically adopts a honeycomb rate structure. The honeycomb structure 14 effectively improves the overall mechanical properties and has a weight reduction effect.

[0039] In addition, a second heat pipe 9 is provided at least one location along the second direction of the heat sink 7, that is, at least one second heat pipe 9 is provided below each antenna. The second heat pipe 9 passes through the phase change material 10 and forms an integral structure with the phase change material 10. The second heat pipe 9 is provided below the heat conductive material 11 and contacts the heat conductive material 11. The second heat conductive pipe 9 and the phase change material 10 are designed and used in an integrated manner, which increases the heat capacity and improves the heat transfer capability.

[0040] The thickness of the phase change material 10 is greater than that of the thermal conductive material 11. The thickness of the phase change material 10 is 3~5mm. The phase change material 10 is filled inside. The thickness of the phase change material is less than the thickness of the heat dissipation plate 7. The phase change material 10 can use the phase change latent heat to store the heat generated during the working time of the antenna. When the antenna is not working, the heat is gradually released through the heat dissipation surface. Specifically, the phase change material can be selected from paraffins such as n-tetradecane, n-hexadecane, n-octadecane, etc.

[0041] In this embodiment, considering that the antenna array surface 1 is a non-metallic thin plate structure with poor heat transfer performance and is not suitable as a heat dissipation surface, a heat dissipation plate 7 is separately provided on one side of the antenna array surface 1. The heat dissipation plate 7 dissipates heat through the first heat pipe 5, the second heat pipe 9, the phase change material 10, the heat conductive material 11 and the heat dissipation surface 6, and can effectively transfer the heat generated by the heat-generating active device to the outside. The heat dissipation area of ​​the heat dissipation plate 7 can be adjusted according to work requirements, the structure is flexible, and the processing technology is simple.

[0042] Example 2 This embodiment discloses a satellite payload thermal control system. Figure 1 and Figure 2 As shown, it includes an antenna array 1, a circuit board 2, a wave-controlled power supply 8, a first heat pipe 5, a second heat pipe 9, a phase change material and the heat sink 7 in Example 1. The circuit board 2 is a PCB board, the first heat-generating active device is a transceiver component 4, the second heat-generating active device is a delay component 3, and the transceiver component 4 is a TR component.

[0043] The antenna array 1 is a satellite payload radiation unit and is a thin plate non-metallic structure; the antenna array 1 and the circuit board 2 are plugged into each other through an existing connector; the heat sink 7 plays a role in heat dissipation and structural support, and the antenna array 1 and the circuit board 2 are installed on the heat sink 7 with screws; a wave-controlled power supply 8 is installed on the side of the heat sink 7 away from the antenna array 1, and power is supplied to the delay component and the transceiver component through the wave-controlled power supply 8.

[0044] Among them, the delay component 3 and the transceiver component 4 are the main heat-generating active components of the load. They are chip-type structures with thin thickness, small size and high heat flux density. They are installed on the circuit board 2 in the form of welding. Two rows of transceiver components 4 and multiple delay components 3 between them form a unit. Multiple such units are evenly arranged on the surface of the heat sink 7. The delay components 3 and the transceiver components 4 are evenly arranged on the circuit board 2 to make the heat evenly distributed, which is conducive to heat dissipation. In addition, the four transceiver components correspond to a copper-water heat pipe.

[0045] In addition, it should be noted that a first thermal pad is arranged between the transceiver component 4 and the first boss 15, and a second thermal pad is arranged between the delay component 3 and the second boss 12. The second boss 12 corresponds one-to-one with the delay component 3. The arrangement of the first thermal pad and the second thermal pad can ensure good contact and transfer heat in time. The first thermal pad and the second thermal pad can specifically be selected from aluminum plates or thermal pads made of other materials.

[0046] Finally, multiple layers of insulation are applied to the back of the heat sink and the outside of the wave-controlled power supply for thermal insulation.

[0047] The thermal control system provided in this embodiment utilizes limited heat dissipation space and provides a heat sink on one side of the antenna array surface. The heat sink is provided with a first boss to support the transceiver component and a second boss to support the delay component. The heat sink is also provided with a first heat pipe and a second heat pipe, so that the heat sink integrates structural support and heat dissipation functions, effectively reducing the overall cross-section of the antenna system. The first and second heat-generating active components are in direct contact with the heat sink, and the antenna array surface is not used as a heat dissipation surface. The overall thermal conductivity is strong, the heat transfer path is short, and the heat dissipation efficiency is high.

[0048] Example 3 This embodiment discloses a method for dissipating heat from a satellite payload, which uses the satellite payload thermal control system described in the second embodiment and includes the following contents: The transceiver assembly 4 has a high power density, and the heat generated during operation is transferred along the following path: transceiver assembly 4 -> first thermal pad -> copper-water heat pipe -> phase change material 10 and aluminum-ammonia heat pipe -> heat dissipation surface 6 ; The power density of the delay component 3 is relatively low, and the heat transfer path generated by it during operation is: delay component 3 -> second thermal pad -> second boss 12 -> phase change material and aluminum-ammonia heat pipe -> heat dissipation surface 6 .

[0049] As for the wave-controlled power supply 8 on the back of the heat sink, the heat generated during operation is transferred to the heat sink surface 6 through the heat sink skin 13 and the aluminum-ammonia heat pipe for heat dissipation.

[0050] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A satellite payload heat dissipation structure, characterized in that: The invention comprises a heat sink connected to the antenna array surface, wherein a plurality of first bosses are arranged on the surface of the heat sink, the first boss is located on the side of the heat sink close to the antenna array surface, the first boss has a groove to accommodate a first heat pipe, and a plurality of first heat-generating active devices are supported by the first bosses, a second boss is arranged between two adjacent first bosses on the heat sink, and a second heat-generating active device is supported by the second bosses, a phase change material is arranged inside the heat sink on the side close to the first boss, a second heat pipe is arranged inside the heat sink along the thickness direction thereof, and an end of the second heat pipe is placed on the side of the heat sink.

2. A satellite payload heat dissipation structure according to claim 1, characterized in that: The first boss is arranged along the first direction of the heat sink, and heat sinks are respectively arranged on both surfaces of the heat sink outside the outermost first boss. Heat conducting material is encapsulated inside the heat sink, and thermal control paint is sprayed on the heat sink surface.

3. A satellite payload heat dissipation structure according to claim 2, characterized in that: The second heat conducting pipe is provided at least one place along the second direction of the heat dissipation plate, the second heat conducting pipe passes through the phase change material and forms an integral structure with the phase change material, the second heat conducting pipe is lower than the heat conducting material, and the second heat conducting pipe contacts the heat conducting material to dissipate heat through the heat dissipation surface; The thickness of the phase change material is greater than the thickness of the thermal conductive material.

4. A satellite payload heat dissipation structure according to claim 2, characterized in that: The thermal conductive material is graphite film.

5. The satellite payload heat dissipation structure according to claim 1, characterized in that: A skin is provided on a side of the heat dissipation plate away from the first boss, and a honeycomb structure is filled inside the heat dissipation plate between the skin and the phase change material.

6. The satellite payload heat dissipation structure according to claim 1, characterized in that: The first heat conducting pipe is flush with the first boss, and the second boss is flush with the first boss.

7. A satellite payload thermal control system, characterized in that: A satellite payload heat dissipation structure according to any one of claims 1 to 6 is adopted, wherein the antenna array surface is connected to the circuit board, the antenna array surface and the circuit board are mounted on the heat sink, the circuit board is arranged close to the heat sink, the first heat-generating active device is a transceiver component, and the second heat-generating active device is a delay component, and the transceiver component and the delay component are soldered to the circuit board.

8. The satellite payload thermal control system according to claim 7, characterized in that: A first thermal pad is provided between the transceiver assembly and the first boss, a second thermal pad is provided between the delay assembly and the second boss, and the second boss corresponds to the delay assembly in a one-to-one manner.

9. The satellite payload thermal control system according to claim 7, characterized in that: A wave-controlled power supply is arranged on the other side of the heat dissipation plate away from the first boss.

10. A method for dissipating heat from a satellite payload, characterized in that: A satellite payload thermal control system according to any one of claims 7 to 9, comprising the following contents: The heat transfer path of the heat generated by the transceiver assembly when it is working is: transceiver assembly-first heat pipe-phase change material and second heat pipe-outer surface of the heat sink; The heat transfer path of the heat generated when the delay component is working is: delay component-second boss-phase change material and second heat pipe-outer surface of the heat sink.

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