Wafer loading and unloading mechanism of wafer electroplating machine

Abstract

This application relates to the field of wafer electroplating technology, specifically a wafer loading and unloading mechanism for a wafer electroplating machine. The loading mechanism includes a wafer cassette channel and a loading support, with the wafer cassette channel located on a housing. The loading support includes a fixed frame and a movable frame, the distance between which is adjustable. Both the movable and fixed frames are equipped with conveying mechanisms, each with several sets of clamping components and clamping mechanisms. The flipping assembly includes a wafer adsorption frame and a mounting frame. The wafer adsorption frame is rotatably mounted on the mounting frame, which has a bearing seat at its center and a lifting cylinder at its bottom. The wafer adsorption frame has several sets of wafer adsorption ends arranged in a circumferential array. The wafer adsorption frame has an annular groove adapted to a positioning rod, and the annular groove includes both arc-shaped and straight grooves. The detection mechanism includes a CCD detection camera, which is equipped with an alarm. This application can meet the loading and unloading needs of wafers of different specifications, improving wafer loading and unloading efficiency and positioning accuracy.

Description

Technical Field

[0001] This application relates to the field of wafer electroplating technology, and in particular to a wafer loading and unloading mechanism for a wafer electroplating machine. Background Technology

[0002] A wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A layer of conductive metal is electroplated onto the wafer, and this conductive metal layer is then processed to create conductive circuitry. In automated processes within the semiconductor industry, wafers frequently need to be flipped around their center. During this flipping process, a high degree of concentricity is required between the wafer's center and the rotation axis, and the accuracy of the flipping angle is also crucial.

[0003] High requirements. For example, the electroplating process is one of the key processes for creating these metal layers. However, existing wafer electroplating equipment, especially vertical wafer electroplating equipment, usually uses manual operation for wafer loading and unloading, resulting in low wafer loading and unloading efficiency. At the same time, manual operation also affects the quality of wafer electroplating.

[0004] Chinese patent CN117604598B discloses a wafer loading and unloading mechanism for a wafer electroplating machine, including a lifting vertical slide rail. A protective cover is fixedly installed on the top surface of the lifting vertical slide rail. A wafer conveying mechanism is provided on both the top and inside of the protective cover. The wafer conveying mechanism realizes the vertical downward movement and conveying of the wafer. This wafer loading and unloading mechanism of the wafer electroplating machine, through the setting of a wafer flipping component and a wafer adsorption mechanism, realizes the automatic adsorption and flipping of the wafer in the vertical direction to the bottom for electroplating operation. This achieves direct flipping of the wafer from the top to the bottom for electroplating, reducing the multiple flipping steps in traditional methods, thereby saving electroplating time. This helps to improve electroplating production efficiency, reduce waiting time, and increase equipment utilization.

[0005] However, in existing patents, wafers need to be loaded into the wafer feeding mechanism sequentially before wafer loading, and only one wafer can be flipped at a time in a single wafer flipping mechanism. The automatic wafer loading and flipping efficiency is low. Although it reduces the number of wafer flips, the overall loading and unloading efficiency of the wafer electroplating machine is still low. Therefore, a wafer loading and unloading mechanism for a more efficient wafer electroplating machine is needed. Summary of the Invention

[0006] In order to overcome the problems existing in the prior art, this application provides a wafer loading and unloading mechanism for a wafer electroplating machine.

[0007] The wafer loading and unloading mechanism of the wafer electroplating machine provided in this application adopts the following technical solution:

[0008] A wafer loading and unloading mechanism for a wafer electroplating machine, comprising:

[0009] The loading mechanism includes a wafer cassette channel and a loading support. The wafer cassette channel is located on the outer shell on the back of the loading mechanism. The wafer cassette is fed to the loading mechanism by a robotic arm through the wafer cassette channel. The loading support includes a fixed frame and a movable frame. The distance between the fixed frame and the movable frame is adjustable. Both the movable frame and the fixed frame are equipped with a conveying mechanism for clamping and transferring wafers. The conveying mechanism has an array of several sets of clamping components. Each clamping component has a clamping mechanism with the same number of wafers as a single wafer cassette.

[0010] The flipping assembly includes a wafer adsorption rack and a mounting frame located in front of and behind the wafer adsorption rack. The wafer adsorption rack is rotatably mounted on the mounting frame, and a first bearing seat is slidably mounted at the center of the mounting frame. The bottom of the first bearing seat is provided with a lifting cylinder for driving the first bearing seat to rise and fall. The wafer adsorption rack has a circumferential array of several sets of wafer adsorption ends. Annular grooves are formed on the front and rear sides of the wafer adsorption rack facing the mounting frame. The annular grooves are adapted to the positioning rods on the inner side of the mounting frame. The annular grooves include a circumferential array of several sets of arc-shaped grooves and straight grooves. The number of arc-shaped grooves and straight grooves is the same as the number of wafer adsorption ends. The arc-shaped grooves extend from the outside of the wafer adsorption rack towards the center, and the straight grooves are located between the arc-shaped grooves. The center line of the straight grooves is horizontal with the center line of the wafer adsorption ends.

[0011] The testing mechanism includes a CCD inspection camera located on the side of the wafer adsorption mechanism in the direction of rotation, and an alarm is installed on the CCD inspection camera.

[0012] By adopting the above technical solution, the loading mechanism uses a robotic arm to move the wafer cassette containing the wafers directly through the wafer cassette channel to the side of the fixed frame. Multiple clamping mechanisms in the clamping assembly within the fixed frame adsorb the wafers in the wafer cassette, and the robotic arm removes the wafers from the wafer cassette. Then, the movable frame is driven to move towards the fixed frame, and the clamping components in the transfer mechanism within both frames clamp multiple sets of wafers in the entire wafer cassette, thereby completing the loading of all wafers in the entire wafer cassette in one go, greatly improving the wafer loading efficiency. The flipping assembly is installed below the loading mechanism. The wafer adsorption rack is rotatably mounted in the first bearing seat on the two side mounting frames. The first bearing seat controls the lifting and rotation of the wafer adsorption rack through the drive of the bottom lifting cylinder. In operation, the loading mechanism conveys the wafer to the wafer adsorption end at the top of the wafer adsorption rack for adsorption. Then, the lifting cylinder drives the wafer adsorption rack to descend, removing the wafer from the loading rack. At this time, the positioning rod on the inner side of the mounting frame moves from the bottom to the top of the straight groove. Then, the lifting cylinder drives the wafer adsorption mechanism to descend. At this time, the positioning rod moves from the top of the straight groove along the arc groove to the bottom of the adjacent straight groove. During this process, as the arc groove moves from the outside to the center of the wafer adsorption mechanism, the wafer adsorption mechanism will rotate accordingly. The bottom of the loading rack corresponds to the next set of wafer adsorption ends. At this time, the loading mechanism moves the next set of wafers down to the wafer adsorption end, where the wafer adsorption end adsorbs the wafer. Then, the lifting cylinder again drives the wafer to move down and detach it from the loading mechanism. This process is repeated. The wafer, adsorbed on the wafer adsorption end, is rotated to the CCD inspection camera on the side for visual inspection of the wafer surface. If any abnormality is found, an alarm will be triggered to alert the operator for handling.

[0013] Preferably, the conveying mechanism includes a driving roller, a driven roller, and a conveyor belt wound on the driving roller and the driven roller. The circumferential surfaces of the driving roller and the driven roller are provided with annular toothed surfaces that mesh with the inner teeth of the conveyor belt. A servo motor for driving the driving roller is installed in the fixed frame and the movable frame, and the servo motor drives synchronously. There are gaps between the clamping components. The clamping mechanisms on the clamping components are mounted on the spaced mounting plates, including a wafer adsorption mechanism located at the bottom of the mounting plate and a wafer gathering mechanism located at the top of the mounting plate. The two are signal connected, and the wafer adsorption mechanism and the wafer gathering mechanism correspond to each other between the mounting plates.

[0014] Preferably, the wafer adsorption mechanism includes an adsorption rod rotatably mounted on the end of the mounting plate, wherein a groove is formed on the bottom surface of the adsorption rod, and an adsorption disk is slidably mounted in the groove along the length direction of the adsorption rod. The end of the adsorption rod is driven to rotate by a first micro motor, and a wire sleeve provided at the bottom of the adsorption disk cooperates with a lead screw distributed along the length direction of the groove for transmission, wherein the lead screw is driven by a second micro motor at its end, and the first micro motor and the second micro motor are connected to the controller signal.

[0015] Preferably, the wafer gathering mechanism includes two sets of symmetrically distributed telescopic cylinders fixedly installed on the top of the mounting plate. A U-shaped clamping block is rotatably installed at the output end of the telescopic cylinder. An angle sensor is installed at the connection between the U-shaped clamping block and the output end of the telescopic cylinder. The angle sensor is connected to the controller signal. A rubber buffer pad is installed on the clamping end of the U-shaped clamping block.

[0016] By adopting the above technical solution, after the loading mechanism has installed all the wafers in the wafer cassette onto the conveyor mechanism on the fixed and movable frames, the servo motor of the conveyor mechanism synchronously drives the drive roller. The drive roller, with its annular toothed surface that meshes with the inner teeth of the conveyor belt, drives the driven roller to rotate, achieving stable transmission of the conveyor belt and thus moving the wafers in the loading mechanism toward the flipping assembly. The clamping assemblies are spaced apart, and the number of clamping mechanisms in a single set of clamping assemblies on the conveyor belt can be set according to the number of wafers in a single wafer cassette, thus differentiating the wafers in each cassette. The wafer adsorption mechanism and wafer gathering mechanism on the clamping mechanism correspond to each other on the mounting plate and are signal-connected. When the robotic arm moves the wafer cassette into the housing to grasp the wafer, the telescopic cylinder of the wafer gathering mechanism is activated, driving the U-shaped clamping block, which is rotated and mounted on its output end, to approach the wafer. This ensures that the U-shaped clamping block abuts against the edge of the wafer. An angle sensor provides real-time feedback of the U-shaped clamping block's angle information to the controller, which then transmits signals to the first and second micro motors. Based on the information from the controller, the suction rod rotates to the appropriate angle under the drive of the first micro motor, and the second micro motor drives the lead screw to rotate. This causes the suction plate, which is driven by the lead screw, to slide along the groove on the bottom surface of the suction rod to the center of the wafer and grasp it. Furthermore, when the wafer gathering mechanism on the fixed and movable frames grips wafers that have already been removed from the wafer cassette, the gripping end of the U-shaped clamping block is equipped with a rubber buffer pad to prevent damage to the wafer, ensuring the successful grasping and transfer of the wafer.

[0017] Preferably, both sides of the fixed frame and the movable frame are provided with sliding protrusions, which are adapted to the sliding grooves on the inner side of the outer shell. The sliding protrusions on both sides of the fixed frame are fixedly connected to the sliding grooves, and a second bearing seat is installed on the top of the fixed frame. The sliding protrusions on both sides of the movable frame are slidably connected to the sliding grooves, and a threaded sleeve is installed on the top of the movable frame. An adjusting motor is installed in the outer shell at the end of the movable frame away from the fixed frame. A lead screw is installed at the output end of the adjusting motor and is distributed along the length of the sliding groove. The lead screw passes through the threaded sleeve on the top of the movable frame and is rotatably connected to the second bearing seat on the top of the fixed frame.

[0018] By adopting the above technical solution, when it is necessary to adjust the distance between the fixed frame and the movable frame, the motor output is adjusted to drive the lead screw to rotate. Under the drive of the lead screw, the movable frame will slide relative to the fixed frame along the length of the sliding groove by means of its sliding protrusion, thereby realizing the precise adjustment of the distance between the fixed frame and the movable frame to meet the feeding requirements of wafer boxes of different sizes.

[0019] Preferably, the two ends of the straight groove are connected to two adjacent arc-shaped grooves respectively. The two ends of the straight groove adopt an arc-shaped structure that is adapted to the circumferential surface of the positioning rod. A one-way limiting mechanism is installed on the side of the straight groove. The one-way limiting mechanism includes a limiting post and a spring connected to the receiving groove in the side wall of the straight groove. One end of the limiting post is rotatably connected to the side wall of the straight groove. The gap between the surface of the limiting post away from the rotating part and the adjacent arc-shaped groove is smaller than the tangential diameter of the positioning rod. The limiting post is adapted to the receiving groove.

[0020] By adopting the above technical solution, when the positioning rod moves in the track formed by the arc-shaped groove and the straight groove, the arc-shaped structure at both ends of the straight groove, which is adapted to the circumference of the positioning rod, allows the positioning rod to smoothly transition between two adjacent arc-shaped grooves through the straight groove. The one-way limiting mechanism installed on the side of the straight groove plays a key role. Under the action of the spring, one end of the limiting post rotates around the rotating part that is connected to the side wall of the straight groove. The gap between the surface of the end away from the rotating part and the adjacent arc-shaped groove is smaller than the tangential diameter of the mounting rod. This allows the mounting rod to move from the bottom to the top of the straight groove. However, when moving in the opposite direction, the mounting rod is blocked by the triangular prism limiting post, thus enabling it to move from the top of the straight groove to the arc-shaped groove, ensuring that the positioning rod and related components move in the predetermined direction.

[0021] Preferably, the wafer adsorption end adopts a diameter adjustable structure, including a base and an adjustment block. The base includes a rectangular mounting base and a suction cup bottom. The suction cup bottom surface is provided with a groove to accommodate the adjustment block. The adjustment block adopts an inverted T-shaped structure, including an upper adsorption layer and a lower adjustment layer. The adsorption layer has a first adsorption hole arrayed in a circle, and the adjustment layer has a plug arrayed in a circle. The top of the suction cup bottom is provided with a second adsorption hole corresponding to the plug.

[0022] Preferably, an adjusting cylinder for driving the adjusting block to rise and fall is installed at the bottom of the groove, and the contact surface between the adjusting block and the groove opening is sealed, and the height of the adjusting block is greater than the thickness of the groove opening.

[0023] By adopting the above technical solution, the diameter of the wafer adsorption end can be adjusted according to the wafer size. An adjusting cylinder drives an inverted T-shaped adjusting block to rise and fall within the groove at the bottom of the suction cup. Because the contact surface between the adjusting block and the groove opening is sealed, and the height of the adjusting block is greater than the thickness of the groove opening, the sealing of the adjustment process is ensured. When the adjusting block rises, the plug on the adjusting layer blocks the second adsorption hole corresponding to the top of the suction cup bottom. At this time, only the first adsorption hole in the circumferential array on the adsorption layer is active, which can adsorb wafers with smaller diameters. When the adjusting block descends, the plug disengages from the second adsorption hole, and the first and second adsorption holes work together to expand the adsorption range, allowing the adsorption of wafers with larger diameters. This achieves flexible adjustment of the adsorption end diameter according to the wafer size, meeting the adsorption requirements of different wafers.

[0024] Preferably, through-beam photoelectric sensors are installed on the opposite surfaces of the fixed frame and the movable frame, wherein the through-beam photoelectric sensors are evenly distributed at the four apex corners of the fixed frame and the movable frame.

[0025] By adopting the above technical solution, the through-beam photoelectric sensors evenly distributed at the four corners of the fixed and movable frames play a crucial role when the wafer cassette enters the loading mechanism. Each through-beam photoelectric sensor consists of a transmitter and a receiver, respectively mounted at opposite corners of the fixed and movable frames. When the wafer cassette enters the optical path between the transmitter and receiver, the light is blocked, and the receiver cannot receive the light emitted by the transmitter. At this moment, the through-beam photoelectric sensor immediately generates a change in electrical signal and transmits this signal to the controller, which then controls the wafer adsorption mechanism in the clamping assembly to begin operation. In this way, it is possible to determine whether the wafer cassette has accurately reached the designated position, providing a reliable detection basis for the wafer removal operation and ensuring the smooth operation of the entire process.

[0026] Preferably, a support leg is installed at the bottom of the housing, and a space for accommodating the electroplating device is provided between the support legs at the bottom of the flipping assembly. The wafer adsorption end of the flipping assembly at the end away from the detection mechanism extends out of the housing.

[0027] By adopting the above technical solution, during the operation of the wafer electroplating machine, the support legs at the bottom of the housing provide stable support for the entire equipment. Space is reserved between the support legs at the bottom of the flipping assembly to accommodate the electroplating device, ensuring that the flipping assembly can transfer the wafer to the electroplating device, guaranteeing smooth installation of the electroplating device without affecting the overall structural stability. When wafer loading and unloading operations are performed, the flipping assembly starts working. Its wafer suction end picks up the wafer from the loading mechanism and flips it. The wafer suction end of the flipping assembly, away from the detection mechanism, extends out of the housing. This design allows the end to flexibly move the wafer that has completed detection and electroplating outside the housing, facilitating the robot arm to transfer it to subsequent processes. The close cooperation of all parts ensures smooth operation of the wafer from loading and unloading to electroplating and subsequent processing.

[0028] In summary, this application includes at least one of the following beneficial technical effects:

[0029] This application improves wafer loading efficiency. The spacing between the fixed frame and the movable frame of the loading bracket is adjustable to accommodate wafers of different specifications. The conveying mechanism array has multiple sets of clamping components, which can clamp multiple wafers at the same time. Combined with the servo motor synchronously driving the active roller, the wafers are accurately and efficiently conveyed without the need for loading one by one, which greatly saves time.

[0030] The flipping component in this application reduces the load of wafer flipping. The wafer adsorption rack has multiple adsorption ends in a circumferential array, which can continuously adsorb multiple wafers for flipping, changing the inefficiency of traditional single wafer flipping. The annular groove and positioning rod work together to achieve precise positioning, ensuring accurate flipping operation and greatly improving flipping efficiency.

[0031] This application improves the stability of equipment operation and the efficiency of loading and unloading by having the wafer adsorption and gathering mechanism work together when transferring wafers from the wafer box to the loading mechanism, with the adsorption end diameter adjustable and a through-beam photoelectric sensor assisting in monitoring. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the overall structure of the wafer loading and unloading mechanism of a wafer electroplating machine;

[0033] Figure 2 This is a schematic diagram of the rear structure of the wafer loading and unloading mechanism of a wafer electroplating machine;

[0034] Figure 3 yes Figure 2 Enlarged view of point A in the middle;

[0035] Figure 4 This is a schematic diagram of the wafer loading and unloading mechanism of a wafer electroplating machine, showing the removal of the front outer shell.

[0036] Figure 5 yes Figure 4 Exploded view of the mounting rack and wafer pick-up rack;

[0037] Figure 6 yes Figure 5 Enlarged view at point B in the middle;

[0038] Figure 7 yes Figure 6 Enlarged view at point C;

[0039] Figure 8 This is an exploded view of the adjusting block and the base;

[0040] Figure 9 yes Figure 5 Rear view;

[0041] Figure 10 yes Figure 9 Enlarged view at point D;

[0042] Figure 11 yes Figure 4 Bottom-side view;

[0043] Figure 12 yes Figure 11 Enlarged view of point E in the middle.

[0044] Explanation of reference numerals in the attached drawings: 1. Loading mechanism; 11. Wafer cassette channel; 12. Loading bracket; 2. Fixing frame; 21. Second bearing seat; 22. Through-beam photoelectric sensor; 3. Movable frame; 31. Sliding protrusion; 32. Adjusting motor; 4. Conveying mechanism; 41. Driving roller; 42. Driven roller; 43. Conveyor belt; 5. Clamping assembly; 51. Clamping mechanism; 52. Mounting plate; 53. Wafer adsorption mechanism; 531. Adsorption rod; 532. Slide groove; 533. Adsorption plate; 534. First micro motor; 535. Second micro motor; 54. Wafer gathering mechanism; 541. Telescopic cylinder; 542. U-shaped clamping block; 543. Rubber buffer pad; 6. Flipping assembly; 61. Wafer adsorption rack; 62. 621. Wafer adsorption end; 621. Base; 6211. Rectangular mounting base; 6212. Suction cup bottom; 6213. Groove; 6214. Adjusting cylinder; 622. Adjusting block; 6221. Adsorption layer; 6222. Adjusting layer; 6223. First adsorption hole; 6224. Plug; 6225. Second adsorption hole; 623. Annular groove; 6231. Arc groove; 6232. Straight groove; 624. One-way limiting mechanism; 6241. Limiting post; 6242. Receiving groove; 63. Mounting bracket; 631. First bearing seat; 632. Lifting cylinder; 633. Positioning rod; 7. Detection mechanism; 71. CCD detection camera; 72. Alarm; 8. Housing; 81. Sliding groove; 82. Support leg. Detailed Implementation

[0045] The following is in conjunction with the appendix Figure 1-12 This application will be described in further detail.

[0046] This application discloses a wafer loading and unloading mechanism for a wafer electroplating machine.

[0047] Reference Figures 1 to 12A wafer loading and unloading mechanism for a wafer electroplating machine includes a loading mechanism 1, comprising a wafer cassette channel 11 and a loading support 12. The wafer cassette channel 11 is located on the outer shell 8 on the back of the loading mechanism 1. The wafer cassette is fed to the loading mechanism 1 via the wafer cassette channel 11 by a robotic arm. The loading support 12 includes a fixed frame 2 and a movable frame 3, wherein the distance between the fixed frame 2 and the movable frame 3 is adjustable. Both the movable frame 3 and the fixed frame 2 are equipped with a conveying mechanism 4 for clamping and conveying wafers. The conveying mechanism 4 is arrayed with several sets of clamping components 5, and the clamping components 5 are provided with clamping mechanisms 51 equal to the number of wafers in a single wafer cassette. A flipping component 6 includes a wafer adsorption frame 61 and mounting frames 63 located in front of and behind the wafer adsorption frame 61. The wafer adsorption frame 61 is rotatably mounted on the mounting frame 63, and a first bearing seat 631 is slidably mounted at the center of the mounting frame 63. The unit is equipped with a lifting cylinder 632 for driving the first bearing seat 631 to rise and fall; the wafer adsorption rack 61 has four sets of wafer adsorption ends 62 arranged in a circumferential array; the wafer adsorption rack 61 has annular grooves 623 on the front and rear sides facing the mounting frame 63, wherein the annular grooves 623 are adapted to the positioning rods 633 on the inner side of the mounting frame 63; the annular grooves 623 include four sets of arc grooves 6231 and straight grooves 6232 arranged in a circumferential array; the number of arc grooves 6231 and straight grooves 6232 is the same as the number of wafer adsorption ends 62; the arc grooves 6231 extend from the outside of the wafer adsorption rack 61 to the center; the straight grooves 6232 are located between the arc grooves 6231; and the center line of the straight grooves 6232 is horizontal with the center line of the wafer adsorption ends 62; the detection mechanism 7 includes a CCD detection camera 71 located on the side in the rotation direction of the wafer adsorption mechanism 53, and an alarm 72 is installed on the CCD detection camera 71. The loading mechanism 1 uses a robotic arm to move the wafer cassette containing the wafers directly through the wafer cassette channel 11 to the side of the fixed frame 2. Multiple clamping mechanisms 51 in the clamping assembly 5 inside the fixed frame 2 adsorb the wafers in the wafer cassette. The robotic arm then removes the wafers from the wafer cassette. The movable frame 3 is then driven to move towards the fixed frame 2. The clamping assembly 5 in the transfer mechanism 4 between the two clamps multiple wafers in the entire wafer cassette, thus completing the loading of all wafers in the entire wafer cassette in one go, greatly improving the wafer loading efficiency.The flipping assembly 6 is installed below the loading mechanism 1. The wafer adsorption rack 61 is rotatably mounted in the first bearing seats 631 on the two side mounting frames 63. The first bearing seats 631 are driven by the bottom lifting cylinder 632 to control the lifting and rotation of the wafer adsorption rack 61. In operation, the loading mechanism 1 transfers the wafer to the wafer adsorption end 62 at the top of the wafer adsorption rack 61 for adsorption. Then, the lifting cylinder 632 drives the wafer adsorption rack 61 to descend, removing the wafer downwards from the loading frame. At this time, the positioning rod 633 inside the mounting frame 63 moves from the bottom of the straight groove 6232 to the top of the straight groove 6232, and then... The lowering cylinder 632 drives the wafer adsorption mechanism 53 to descend. At this time, the positioning rod 633 moves from the top of the straight groove 6232 along the arc groove 6231 to the bottom of the adjacent straight groove 6232. During this process, as the arc groove 6231 moves from the outside to the center of the wafer adsorption mechanism 53, the wafer adsorption mechanism 53 rotates accordingly. The bottom of the loading rack corresponds to the next set of wafer adsorption heads 62. The loading mechanism 1 then moves the next set of wafers downwards onto the wafer adsorption heads 62. The wafer adsorption heads 62 adsorb the wafers, and then the lifting cylinder 632 again drives the wafers downwards, detaching them from the loading mechanism 1. This process repeats. The wafers adsorbed on the wafer adsorption heads 62 rotate to the side CCD inspection camera 71 for visual inspection of the wafer surface. If an abnormality is detected, the alarm 72 will alert the operator for handling.

[0048] Reference Figures 1 to 12The conveying mechanism 4 includes a drive roller 41, a driven roller 42, and a conveyor belt 43 wound on the drive roller 41 and the driven roller 42. The circumferential surfaces of the drive roller 41 and the driven roller 42 are provided with annular toothed surfaces that mesh with the inner teeth of the conveyor belt 43. The fixed frame 2 and the movable frame 3 are equipped with servo motors for driving the drive roller 41, and the servo motors drive synchronously. There are gaps between the clamping components 5. The clamping mechanism 51 on the clamping component 5 is mounted on the spaced mounting plates 52, including a wafer adsorption mechanism 53 located at the bottom of the mounting plate 52 and a wafer gathering mechanism 54 located at the top of the mounting plate 52. The two are signal connected, and the wafer adsorption mechanism 53 and the wafer gathering mechanism 54 correspond to each other between the mounting plates 52. The wafer adsorption mechanism 53 includes an adsorption rod 531 rotatably mounted on the end of the mounting plate 52. A groove 532 is formed on the bottom surface of the adsorption rod 531, and an adsorption disk 533 is slidably mounted within the groove 532 along the length of the adsorption rod 531. The end of the adsorption rod 531 is driven to rotate by a first micro motor 534. A threaded sleeve at the bottom of the adsorption disk 533 engages with a lead screw distributed along the length of the groove 532 for transmission. The lead screw is driven by a second micro motor 535 at its end, and both the first and second micro motors are connected to a controller. The wafer gathering mechanism 54 includes two sets of symmetrically distributed telescopic cylinders 541 fixedly mounted on the top of the mounting plate 52. A U-shaped clamping block 542 is rotatably mounted on the output end of each telescopic cylinder 541. An angle sensor is installed at the connection between the U-shaped clamping block 542 and the output end of the telescopic cylinder 541, and the angle sensor is connected to a controller. A rubber buffer pad 543 is installed on the clamping end of the U-shaped clamping block 542. After the loading mechanism 1 mounts all the wafers in the wafer cassette onto the conveyor mechanism 4 on the fixed frame 2 and the movable frame 3, the servo motor of the conveyor mechanism 4 synchronously drives the active roller 41. The active roller 41 drives the driven roller 42 to rotate by the annular tooth surface on its circumferential surface that meshes with the inner teeth of the conveyor belt 43, thereby achieving stable transmission of the conveyor belt 43 and moving the wafers in the loading mechanism 1 toward the flipping assembly 6. The clamping assemblies 5 are spaced apart. The number of clamping mechanisms 51 in a single set of clamping assemblies 5 on the conveyor belt 43 can be set according to the number of wafers in a single wafer cassette, thus separating the wafers in each cassette. The wafer adsorption mechanism 53 and the wafer gathering mechanism 54 on the clamping mechanism 51 correspond to each other on the mounting plate 52 and are signal connected.When the robotic arm moves the wafer cassette into the housing to grasp the wafer, the telescopic cylinder 541 of the wafer gathering mechanism 54 is activated, driving the U-shaped clamping block 542, which is rotatably mounted on its output end, to approach the wafer, ensuring that the U-shaped clamping block 542 abuts against the edge of the wafer. An angle sensor provides real-time feedback of the angle information of the U-shaped clamping block 542 to the controller, which transmits signals to the first micro motor 534 and the second micro motor 535. Based on the feedback from the controller, the adsorption rod 531 rotates to a suitable angle under the drive of the first micro motor 534, and the second micro motor 535 drives the lead screw to rotate, causing the adsorption disk 533, which is driven by the lead screw, to slide along the sliding groove 532 on the bottom surface of the adsorption rod 531 to the center of the wafer and adsorb it. Furthermore, when the wafer gathering mechanism 54 on the fixed frame 2 and the movable frame 3 clamps the wafers that have been removed from the wafer cassette, the clamping end of the U-shaped clamping block 542 is equipped with a rubber buffer pad 543 to prevent damage to the wafer, ensuring the successful grasping and transfer of the wafer.

[0049] Reference Figures 1 to 12 Both sides of the fixed frame 2 and the movable frame 3 are provided with sliding protrusions 31, which are adapted to the sliding grooves 81 inside the outer shell 8. The sliding protrusions 31 on both sides of the fixed frame 2 are fixedly connected to the sliding grooves 81, and a second bearing seat 21 is installed on the top of the fixed frame 2. The sliding protrusions 31 on both sides of the movable frame 3 are slidably connected to the sliding grooves 81, and a threaded sleeve is installed on the top of the movable frame 3. An adjusting motor 32 is installed inside the outer shell 8 at the end of the movable frame 3 away from the fixed frame 2. A lead screw is installed at the output end of the adjusting motor 32, which is distributed along the length direction of the sliding groove 81. The lead screw passes through the threaded sleeve at the top of the movable frame 3 and is rotatably connected to the second bearing seat 21 at the top of the fixed frame 2. When it is necessary to adjust the distance between the fixed frame 2 and the movable frame 3, the output end of the adjusting motor 32 drives the lead screw to rotate. Driven by the lead screw, the movable frame 3 slides relative to the fixed frame 2 along the length direction of the sliding groove 81 by means of its sliding protrusions 31, thereby achieving precise adjustment of the distance between the fixed frame 2 and the movable frame 3 to meet the feeding requirements of wafer cassettes of different sizes.

[0050] Reference Figures 1 to 12The two ends of the straight groove 6232 are respectively connected to two adjacent arc grooves 6231. The two ends of the straight groove 6232 adopt an arc structure adapted to the circumferential surface of the positioning rod 633. A one-way limiting mechanism 624 is installed on the side of the straight groove 6232. The one-way limiting mechanism 624 includes a limiting post 6241 and a spring connected to the receiving groove 6242 on the side wall of the straight groove 6232. One end of the limiting post 6241 is rotatably connected to the side wall of the straight groove 6232. The gap between the surface of the limiting post 6241 away from the rotating part and the adjacent arc groove 6231 is smaller than the tangential diameter of the positioning rod 633. The limiting post 6241 is adapted to the receiving groove 6242. When the positioning rod 633 moves in the track formed by the arc-shaped groove 6231 and the straight groove 6232, the straight groove 6232, with its arc-shaped structure at both ends adapted to the circumferential surface of the positioning rod 633, allows the positioning rod 633 to smoothly transition between adjacent arc-shaped grooves 6231 via the straight groove 6232. The one-way limiting mechanism 624 mounted on the side of the straight groove 6232 plays a crucial role. Under the action of a spring, one end of the limiting post 6241 rotates around the rotating part that is adjacent to the side wall of the straight groove 6232. The gap between the surface of the end away from the rotating part and the adjacent arc-shaped groove 6231 is smaller than the tangential diameter of the mounting rod. This allows the mounting rod to move from the bottom to the top of the straight groove 6232. However, in the reverse direction, the mounting rod is blocked by the triangular prism limiting post 6241, enabling it to move from the top of the straight groove 6232 to the arc-shaped groove 6231, ensuring that the positioning rod 633 and related components move in the predetermined direction.

[0051] Reference Figures 1 to 12The wafer adsorption end 62 adopts an adjustable diameter structure, including a base 621 and an adjusting block 622. The base 621 includes a rectangular mounting base 6211 and a suction cup bottom 6212. The surface of the suction cup bottom 6212 has a groove 6213 for accommodating the adjusting block 622. The adjusting block 622 adopts an inverted T-shaped structure, including an upper adsorption layer 6221 and a lower adjusting layer 6222. The adsorption layer 6221 has a first adsorption hole 6223 arranged in a circular array, and the adjusting layer 6222 has a plug 6224 arranged in a circular array. The top of the suction cup bottom 6212 has a second adsorption hole 6225 corresponding to the plug 6224. An adjusting cylinder 6214 for driving the adjusting block 622 to rise and fall is installed at the bottom of the groove 6213, and the contact surface between the adjusting block 622 and the groove opening of the groove 6213 is sealed. The height of the adjusting block 622 is greater than the thickness of the groove opening of the groove 6213. When the diameter of the wafer adsorption end 62 can be adjusted according to the wafer size, the adjusting cylinder 6214 drives the inverted T-shaped adjusting block 622 to rise and fall within the groove 6213 of the suction cup bottom 6212. Because the contact surface between the adjusting block 622 and the groove 6213 is sealed, and the height of the adjusting block 622 is greater than the thickness of the groove 6213, the sealing of the adjustment process is ensured. When the adjusting block 622 rises, the plug 6224 on the adjusting layer 6222 blocks the second adsorption hole 6225 corresponding to the top of the suction cup bottom 6212. At this time, only the first adsorption hole 6223 in the circumferential array on the adsorption layer 6221 is active, which can adsorb wafers with smaller diameters. When the adjusting block 622 falls, the plug 6224 disengages from the second adsorption hole 6225, and the first adsorption hole 6223 and the second adsorption hole 6225 work together to expand the adsorption range, allowing the adsorption of wafers with larger diameters. This allows for flexible adjustment of the adsorption end diameter according to the wafer size, meeting the adsorption requirements of different wafers.

[0052] Reference Figures 1 to 12 Through-beam photoelectric sensors 22 are installed on the opposite surfaces of the fixed frame 2 and the movable frame 3, with the sensors evenly distributed at the four corners of the fixed frame 2 and the movable frame 3. When the wafer cassette enters the loading mechanism 1, the evenly distributed through-beam photoelectric sensors 22 at the four corners of the fixed frame 2 and the movable frame 3 play a crucial role. Each through-beam photoelectric sensor 22 consists of a transmitter and a receiver, respectively installed at the opposite corners of the fixed frame 2 and the movable frame 3. When the wafer cassette enters the optical path between the transmitter and the receiver, the light is blocked, and the receiver cannot receive the light emitted by the transmitter. At this time, the through-beam photoelectric sensor 22 immediately generates an electrical signal change and transmits this signal to the controller, controlling the wafer adsorption mechanism 53 in the clamping assembly 5 to start working. In this way, it is possible to determine whether the wafer cassette has accurately reached the designated position, providing a reliable detection basis for the operation of removing the wafer from the wafer cassette and ensuring the smooth operation of the entire process.

[0053] Reference Figures 1 to 12 The bottom of the outer casing 8 is equipped with support legs 82. A space for accommodating the electroplating device is provided between the support legs 82 at the bottom of the flipping assembly 6. The wafer adsorption end 62 of the flipping assembly 6, located away from the detection mechanism 7, extends out of the outer casing 8. During the operation of the wafer electroplating machine, the support legs 82 at the bottom of the outer casing 8 provide stable support for the entire equipment. The space between the support legs 82 at the bottom of the flipping assembly 6 is specifically reserved for accommodating the electroplating device, ensuring that the flipping assembly 6 can transfer the wafer to the electroplating device, guaranteeing the smooth installation of the electroplating device without affecting the overall structural stability. When wafer loading and unloading operations are performed, the flipping assembly 6 starts working. The wafer adsorption end 62 on it grabs the wafer from the loading mechanism 1 and flips it. The wafer adsorption end 62 at the end of the flipping assembly 6 away from the detection mechanism 7 extends out of the outer casing 8. This design allows the end to flexibly move the wafer that has completed detection and electroplating outside the outer casing 8, facilitating the transfer of it to subsequent processes by the robotic arm. The close cooperation of all parts ensures smooth operation of the wafer from loading and unloading to electroplating and subsequent processing.

[0054] The wafer loading and unloading mechanism of this wafer electroplating machine operates as follows: The loading mechanism 1 uses a robotic arm to send the wafer cassette through the wafer cassette channel 11 to the side of the fixed frame 2. Multiple clamping mechanisms 51 of the clamping assembly 5 inside the fixed frame 2 adsorb the wafers and cooperate with the robotic arm to remove them. The movable frame 3 moves towards the fixed frame 2, and the clamping assembly 5 of the conveying mechanism 4 within both frames clamps multiple sets of wafers to complete the loading. A servo motor synchronously drives the active roller 41 of the conveying mechanism 4 to drive the driven roller 42, realizing the transmission of the conveyor belt 43 and moving the wafers towards the flipping assembly 6. When the robotic arm moves the wafer cassette to the designated position, the through-beam photoelectric sensor 22 detects that the wafer cassette is in place and controls the wafer adsorption mechanism 53 of the clamping assembly 5 to operate. The wafer adsorption rack 61 in the flipping assembly 6 is rotatably mounted on the mounting frame 63 and is driven to rise and rotate by the lifting cylinder 632. After the loading mechanism 1 transfers the wafers to the wafer adsorption end 62 for adsorption, the lifting cylinder 632 drives the wafer adsorption rack 61 to descend. The wafer is removed from the loading mechanism 1. The positioning rod 633 moves in the straight groove 6232 and the arc groove 6231 to rotate the wafer adsorption frame 61. The loading mechanism 1 continues to move the next set of wafers to the wafer adsorption end 62 for adsorption, and the operation is repeated. The wafers adsorbed on the wafer adsorption end 62 are rotated to the CCD inspection camera 71 for inspection. If there is an abnormality, the alarm 72 will sound. The diameter of the wafer adsorption end 62 can be adjusted by adjusting the cylinder 6214 to drive the adjusting block 622 to rise and fall according to the wafer size. When adjusting the distance between the fixed frame 2 and the movable frame 3, the adjusting motor 32 drives the lead screw to rotate, so that the movable frame 3 slides relative to the fixed frame 2 along the sliding groove 81. The bottom support legs 82 of the outer shell 8 provide stable support. The space between the bottom support legs 82 of the flip assembly 6 is reserved to accommodate the electroplating device. The wafer adsorption end 62 of the flip assembly 6 away from the inspection mechanism 7 extends out of the outer shell 8, which facilitates the transfer of the wafers that have completed inspection and electroplating to the subsequent processes.

[0055] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer loading and unloading mechanism for a wafer electroplating machine, characterized in that: include The loading mechanism (1) includes a wafer cassette channel (11) and a loading bracket (12). The wafer cassette channel (11) is located on the outer shell (8) on the back of the loading mechanism (1). The wafer cassette is fed to the loading mechanism (1) by a robot through the wafer cassette channel (11). The loading bracket (12) includes a fixed frame (2) and a movable frame (3). The distance between the fixed frame (2) and the movable frame (3) is adjustable. Both the movable frame (3) and the fixed frame (2) are equipped with a conveying mechanism (4) for clamping and conveying wafers. Several sets of clamping components (5) are arrayed on the conveying mechanism (4). The clamping components (5) are provided with clamping mechanisms (51) with the same number of wafers in a single wafer cassette. The flipping assembly (6) includes a wafer adsorption rack (61) and a mounting frame (63) located in front of and behind the wafer adsorption rack (61). The wafer adsorption rack (61) is rotatably mounted on the mounting frame (63), and a first bearing seat (631) is slidably mounted at the center of the mounting frame (63). The bottom of the first bearing seat (631) is provided with a lifting cylinder (632) for driving the first bearing seat (631) to rise and fall. The wafer adsorption rack (61) has a circumferential array of several sets of wafer adsorption ends (62), and annular grooves are opened on the front and rear sides of the wafer adsorption rack (61) facing the mounting frame (63). (623), wherein the annular groove (623) is adapted to the positioning rod (633) on the inner side of the mounting bracket (63), the annular groove (623) includes several sets of arc grooves (6231) and straight grooves (6232) in a circumferential array, the number of arc grooves (6231) and straight grooves (6232) is the same as that of the wafer adsorption end (62), the arc grooves (6231) extend from the outside of the wafer adsorption bracket (61) to the center, the straight grooves (6232) are located between the arc grooves (6231), and the center line of the straight grooves (6232) is horizontal with the center line of the wafer adsorption end (62); The detection mechanism (7) includes a CCD detection camera (71) located on the side of the wafer adsorption mechanism (53) in the rotation direction, and an alarm (72) is installed on the CCD detection camera (71); the loading mechanism (1) transfers the wafer to the wafer adsorption end (62) at the top of the wafer adsorption rack (61) for adsorption, and then the lifting cylinder (632) drives the wafer adsorption rack (61) to descend, taking the wafer down from the loading mechanism (1). At this time, the positioning rod (633) on the inner side of the mounting rack (63) moves from the bottom of the straight groove (6232) to the top of the straight groove (6232), and then the lifting cylinder (632) drives the wafer adsorption mechanism (53) to descend. 3) Descending, at this time the positioning rod (633) moves from the top of the straight groove (6232) along the arc groove (6231) to the bottom of the adjacent straight groove (6232). During this process, as the arc groove (6231) moves from the outside of the wafer adsorption mechanism (53) to the center, the wafer adsorption mechanism (53) will rotate. The bottom of the loading mechanism 1 corresponds to the next set of wafer adsorption end (62). At this time, the loading mechanism (1) moves the next set of wafers down to the wafer adsorption end (62). The wafer adsorption end (62) adsorbs the wafer, and then the lifting cylinder (632) drives the wafer to move down again, detaching it from the loading mechanism (1). This process is repeated.

2. The wafer loading and unloading mechanism of a wafer electroplating machine according to claim 1, characterized in that: The conveying mechanism (4) includes an active roller (41), a driven roller (42), and a conveyor belt (43) wound on the active roller (41) and the driven roller (42). The circumferential surfaces of the active roller (41) and the driven roller (42) are provided with annular tooth surfaces that mesh with the inner teeth of the conveyor belt (43). The fixed frame (2) and the movable frame (3) are equipped with servo motors for driving the active roller (41), and the servo motors drive synchronously. The clamping components (5) are spaced apart. The clamping mechanism (51) on the clamping component (5) is mounted on the spaced mounting plates (52), including a wafer adsorption mechanism (53) located at the bottom of the mounting plate (52) and a wafer gathering mechanism (54) located at the top of the mounting plate (52). The two are connected by a signal, and the wafer adsorption mechanism (53) and the wafer gathering mechanism (54) correspond to each other between the mounting plates (52).

3. The wafer loading and unloading mechanism of a wafer electroplating machine according to claim 2, characterized in that: The wafer adsorption mechanism (53) includes an adsorption rod (531) rotatably mounted on the end of the mounting plate (52). A groove (532) is provided on the bottom surface of the adsorption rod (531). An adsorption disk (533) is slidably mounted in the groove (532) along the length of the adsorption rod (531). The end of the adsorption rod (531) is driven to rotate by a first micro motor (534). A wire sleeve provided at the bottom of the adsorption disk (533) cooperates with a screw distributed along the length of the groove (532) for transmission. The screw is driven by a second micro motor (535) at the end. The first micro motor (534) and the second micro motor (535) are connected to the controller signal.

4. The wafer loading and unloading mechanism of a wafer electroplating machine according to claim 3, characterized in that: The wafer gathering mechanism (54) includes two sets of symmetrically distributed telescopic cylinders (541) fixedly installed on the top of the mounting plate (52). A U-shaped clamping block (542) is rotatably installed at the output end of the telescopic cylinder (541). An angle sensor is installed at the connection between the U-shaped clamping block (542) and the output end of the telescopic cylinder (541). The angle sensor is connected to the controller signal. A rubber buffer pad (543) is installed on the clamping end of the U-shaped clamping block (542).

5. The wafer loading and unloading mechanism of a wafer electroplating machine according to claim 1, characterized in that: Both sides of the fixed frame (2) and the movable frame (3) are provided with sliding protrusions (31). The sliding protrusions (31) are adapted to the sliding grooves (81) inside the outer shell (8). The sliding protrusions (31) on both sides of the fixed frame (2) are fixedly connected to the sliding grooves (81), and a second bearing seat (21) is installed on the top of the fixed frame (2). The sliding protrusions (31) on both sides of the movable frame (3) are slidably connected to the sliding grooves (81), and a threaded sleeve is installed on the top of the movable frame (3). An adjusting motor (32) is installed in the outer shell (8) at the end of the movable frame (3) away from the fixed frame (2). A screw is installed at the output end of the adjusting motor (32) and distributed along the length direction of the sliding grooves (81). The screw passes through the threaded sleeve at the top of the movable frame (3) and is rotatably connected to the second bearing seat (21) at the top of the fixed frame (2).

6. The wafer loading and unloading mechanism of a wafer electroplating machine according to claim 1, characterized in that: The two ends of the straight groove (6232) are respectively connected to two adjacent arc grooves (6231). The two ends of the straight groove (6232) adopt an arc structure adapted to the circumferential surface of the positioning rod (633). A one-way limiting mechanism (624) is installed on the side of the straight groove (6232). The one-way limiting mechanism (624) includes a limiting post (6241) and a spring connected to the receiving groove (6242) on the side wall of the straight groove (6232). One end of the limiting post (6241) is rotatably connected to the side wall of the straight groove (6232). The gap between the surface of the limiting post (6241) away from the rotating part and the adjacent arc groove (6231) is smaller than the cross-sectional diameter of the positioning rod (633). The limiting post (6241) is adapted to the receiving groove (6242).

7. The wafer loading and unloading mechanism of a wafer electroplating machine according to claim 1, characterized in that: The wafer adsorption end (62) adopts an adjustable diameter structure, including a base (621) and an adjustment block (622). The base (621) includes a rectangular mounting base (6211) and a suction cup bottom (6212). The suction cup bottom (6212) has a groove (6213) for accommodating the adjustment block (622) on its surface. The adjustment block (622) adopts an inverted T-shaped structure, including an upper adsorption layer (6221) and a lower adjustment layer (6222). The adsorption layer (6221) has a first adsorption hole (6223) arranged in a circumferential array, and the adjustment layer (6222) has a plug (6224) arranged in a circumferential array. The top of the suction cup bottom (6212) has a second adsorption hole (6225) corresponding to the plug (6224).

8. The wafer loading and unloading mechanism of a wafer electroplating machine according to claim 7, characterized in that: The bottom of the groove (6213) is equipped with an adjusting cylinder (6214) for driving the adjusting block (622) to rise and fall, and the contact surface between the adjusting block (622) and the groove opening of the groove (6213) is sealed. The height of the adjusting block (622) is greater than the thickness of the groove opening of the groove (6213).

9. The wafer loading and unloading mechanism of a wafer electroplating machine according to claim 1, characterized in that: Through-beam photoelectric sensors (22) are installed on the opposite surfaces of the fixed frame (2) and the movable frame (3), wherein the through-beam photoelectric sensors (22) are evenly distributed at the four apex corners of the fixed frame (2) and the movable frame (3).

10. The wafer loading and unloading mechanism of a wafer electroplating machine according to claim 1, characterized in that: The bottom of the housing (8) is equipped with support legs (82), and there is a space between the support legs (82) at the bottom of the flip assembly (6) for accommodating the electroplating device. The wafer adsorption end (62) of the flip assembly (6) at the end away from the detection mechanism (7) extends out of the housing (8).

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