Preparation device and method of thermal-mechanical coupling high-energy particle deposition synchronous composite non-equilibrium state light etching microstructure

Abstract

The invention discloses a preparation device and method for a thermal-mechanical coupling high-energy particle deposition synchronous composite non-equilibrium state light etching microstructure. The device comprises a rack, and a stand column is vertically installed on the upper end face of the rack; the cross beam assembly is slidably mounted on the stand column through a sliding assembly; the conveying platform is installed on the upper end face of the rack. The light etching microstructure assembly comprises a first laser and a first moving assembly, the first moving assembly comprises a first transverse sliding block and a first longitudinal sliding block which are in sliding connection with each other, and the first laser is fixed to the first longitudinal sliding block and used for preparing a microstructure on the surface of a base body; and the coating preparation assembly comprises a second laser, a temperature measuring component, a nozzle and a second moving assembly, and the second laser is installed on the rotating clamp and used for heating a base body and powder in the coating preparation process and improving the coating bonding performance. According to the method, the production period is shortened, the bonding strength of the coating is improved, the residual stress is reduced, and meanwhile, the degradation of the light etching microstructure caused by secondary thermal damage is avoided.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of material surface treatment, and particularly relates to a preparation device for thermally coupled high-energy particle deposition synchronous composite non-equilibrium optical etching microstructure. BACKGROUND

[0002] In the fields of precision machinery, aerospace and biomedical treatment, the interface bonding strength, fatigue resistance and functionality (such as wear resistance, corrosion resistance or biocompatibility) of high-performance coatings are increasingly demanding. In traditional coating preparation technology, substrate surface pretreatment (such as sandblasting, chemical etching or mechanical polishing) is often used to enhance the coating adhesion, but these methods have the risk of environmental pollution, are difficult to accurately control the surface morphology, and are prone to cause uneven pretreatment on complex curved or micro-structured substrates, thereby causing local coating peeling or stress concentration. The non-equilibrium optical etching microstructure technology can effectively improve the mechanical interlocking effect of the coating and optimize the interface stress distribution by preparing controllable micron-scale grooves, pits or biomimetic structures on the substrate surface through high-precision laser processing, but as an independent pretreatment process, it requires additional equipment and process steps, resulting in increased production cost and difficulty in dynamic coordination with the deposition process.

[0003] Although the thermally coupled high-energy particle deposition technology improves the coating adhesion by laser-assisted kinetic energy deposition, its dependence on the substrate surface state is still high. In existing thermally coupled coating deposition processes, the substrate surface roughness and activity usually depend on traditional pretreatment methods, making it difficult to realize in-situ regulation of micro-nano structures. In addition, in the laser-assisted deposition process, the time sequence separation of the substrate surface optical etching microstructure and high-energy particle deposition can easily lead to the expansion of the heat-affected zone of the microstructure area or the degradation of the microstructure morphology due to high-temperature particle impact, weakening the mechanical interlocking effect. At the same time, the traditional step-by-step process cannot dynamically optimize the microstructure morphology using the thermal-mechanical coupling conditions during the deposition process, limiting the release of the potential of interface metallurgical-mechanical coupling strengthening.

[0004] To solve the above problems, it is urgent to develop an efficient preparation device for thermally coupled high-energy particle deposition synchronous composite non-equilibrium optical etching microstructure, which realizes in-situ preparation of non-equilibrium optical etching microstructure of the substrate and high-energy particle deposition in a single process cycle through precise regulation of the spatiotemporal distribution of laser energy. SUMMARY

[0005] To solve the above technical problems in the existing thermally coupled high-energy particle deposition coating preparation process, the application provides a preparation device for thermally coupled high-energy particle deposition synchronous composite non-equilibrium optical etching microstructure.

[0006] The technical scheme adopted by the application is:

[0007] The first aspect of the present invention is a device for preparing a thermomechanically coupled high-energy particle deposition synchronous composite non-equilibrium photoetching microstructure, comprising a frame (1), characterized in that it also includes:

[0008] A column (2) is vertically mounted on the upper end surface of the frame (1);

[0009] The crossbeam assembly (3) is slidably mounted on the column (2) via a sliding assembly and slides up and down along the height direction of the column (2) to adjust the distance between the coating preparation assembly and the substrate, adjust the focal length of the first laser of the photoetching microstructure assembly, and adjust the overlap of the light spot of the second laser of the coating preparation assembly and the powder spot of the nozzle;

[0010] A conveying platform (4) is mounted on the upper end surface of the frame (1) and is used to convey the substrate;

[0011] A photoetching microstructure assembly (5) is located above the conveying platform (4), and includes a first laser and a first moving assembly, wherein the first moving assembly includes a first transverse slider and a first longitudinal slider that are slidably connected to each other, the first transverse slider being slidably mounted on a guide rail of the crossbeam assembly (3), the first longitudinal slider being slidably mounted on the guide rail of the first transverse slider, and the first laser being fixed on the first longitudinal slider for preparing a microstructure on the surface of the substrate;

[0012] and a coating preparation assembly (6), located above the conveying platform (4), comprising a second laser, a temperature measuring component, a nozzle, and a second moving assembly, wherein the second moving assembly comprises a second transverse slider, a second longitudinal slider, and a rotating fixture that are slidably connected to each other, the second transverse slider being mounted on the guide rail of the crossbeam assembly (3), the second longitudinal slider being slidably mounted on the guide rail of the second transverse slider, the rotating fixture and the nozzle being respectively mounted on the second longitudinal slider, the second laser being mounted on the rotating fixture, and being used for heating the substrate and the powder during the coating preparation process to improve the bonding of the coating; the temperature measuring component being mounted on the nozzle, and being used for detecting the real-time temperature of the substrate surface;

[0013] The sliding assembly, the crossbeam assembly (3), the conveying platform (4), the photoetching microstructure assembly (5) and the coating preparation assembly (6) are electrically connected to a controller respectively.

[0014] Furthermore, the sliding assembly includes a first guide rail slider (202) and a guard plate (203); the guide rail slider (202) is slidably mounted on the column (2); and the guard plate (203) is mounted on the column to protect the sliding assembly and the crossbeam assembly from damage by metal powder particles.

[0015] Furthermore, the crossbeam assembly (3) comprises a crossbeam (301), a second guide rail slider (302), a motor (303) and a support column (304); the crossbeam (301) is fixedly connected to the first guide rail slider; the second guide rail slider (302) is slidably mounted on a slide rail of the crossbeam (301); the support column (304) is fixedly connected to the second guide rail slider (302); and the motor (303) is mounted on the crossbeam (301) to drive the support column (304) to move along the length direction of the crossbeam (301).

[0016] Furthermore, the conveying platform includes a conveyor belt (401), a conveyor belt motor (402), a positioning seat (403) and a rotating assembly (404); the rotating assembly (404) is installed on the upper end surface of the frame (1) through the positioning seat (403); the conveyor belt (401) is rotatably connected to the rotating assembly (404); and the driving end of the conveyor belt motor (402) is drivingly connected to the rotating assembly (402).

[0017] Furthermore, the nozzle is a Laval nozzle; and the temperature measuring component is a temperature sensor.

[0018] The second aspect of the present invention is a method for preparing a coating of a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching, characterized in that it comprises the following steps:

[0019] S1. Self-inspection of coating preparation components:

[0020] Check whether the distance between the nozzle and the substrate is correct, check whether the focal length of the first laser of the photo-etching microstructure component is correct, check whether the light spot of the second laser of the coating preparation component coincides with the powder spot of the nozzle, and check whether the moving component can operate normally;

[0021] S2. Select appropriate spray powder. For example, copper powder or aluminum powder is commonly used in the field of preparing anti-corrosion coatings. Set the parameters of the equipment, including carrier gas pressure, preheating temperature, powder feeding rate, and nozzle scanning speed.

[0022] S3. Setting the power of the first laser according to the selected substrate material and powder material;

[0023] S4. Setting the parameters of the second laser according to the material of the substrate, the parameters of the second laser including laser power, laser scanning speed, laser scanning path, laser scanning times and laser frequency;

[0024] S5. The coating preparation assembly and the photoetching microstructure assembly are driven by the motor of the crossbeam assembly to move along with the support column. At the same time, the first and second moving assemblies respectively drive the coating preparation assembly and the photoetching microstructure assembly to move along their respective guide rails, thereby performing thermal-mechanical coupling high-energy particle deposition and synchronous composite non-equilibrium photoetching microstructure preparation coating on the substrate;

[0025] S6. If the substrate is too long, after the coating preparation is completed on the substrate within the moving range of the beam assembly, the conveyor belt is driven by the motor to send the subsequent substrate to the coating preparation area until the coating preparation of the entire steel plate is completed.

[0026] Furthermore, in step S2, the selected powder particle size range is 1-100 μm, and the powder shape is spherical or dendritic.

[0027] Furthermore, in step S2, the carrier gas for spraying is nitrogen or helium, the carrier gas pressure range is 1-5 MPa, the preheating temperature range is 200-1000°C, and the powder feeding rate range is 1-10 r / min.

[0028] Furthermore, in step S3, the first laser is a red continuous laser with a power range of 0-6 kW, an angle between the laser and the substrate of 60°, and a spot diameter of 4 mm.

[0029] Furthermore, in step S4, the second laser is a red pulse laser with a power range of 0-200W, an angle between the laser and the substrate of 90°, a focal length between the laser and the substrate of 179mm, and a spot diameter of 105μm.

[0030] The innovation of the present invention lies in: 1. Overcoming the defects of process fragmentation, insufficient interface performance and single function in the traditional step-by-step process (first photo-etching microstructure and then thermal coupling coating deposition), through the spatiotemporal coordinated distribution and dynamic regulation of laser energy, the synchronous combination of substrate surface photo-etching microstructure processing and coating deposition is realized in a single process; 2. Efficient process integration, eliminating the problems of equipment switching, repeated positioning and secondary thermal damage caused by step-by-step operation, and shortening the production cycle; 3. Breakthrough in interface performance, using the laser thermal-mechanical coupling effect to simultaneously form mechanical interlocking and metallurgical bonding (local diffusion / melting), so that the coating bonding strength is improved and the residual stress is reduced; 4. Multifunctional composite expansion, through the coordinated design of photo-etching microstructure morphology and coating composition, multifunctional integration such as self-lubrication, antibacterial or conductivity is achieved, and it is adaptable to complex curved substrates.

[0031] The working principle of the present invention is: a pulsed laser (nanosecond level) performs in-situ photo-etching microstructure processing (such as micro-pits and grooves) on the surface of the substrate, and at the same time a continuous laser dynamically preheats the local or flying powder particles of the substrate to reduce the yield strength of the material and promote plastic deformation; a supersonic jet (He / N2 carrier gas) accelerates the powder and impacts the substrate, forming a mechanical anchoring effect in the photo-etched microstructure area (such as particles embedded in microgrooves) and laser-induced local micro-melting / diffusion metallurgical bonding, and the laser heat input and particle impact compressive stress are dynamically offset in the synchronous process, thereby suppressing residual stress and avoiding degradation of the photo-etched microstructure morphology; a four-axis linkage system is used to achieve spatiotemporal matching of the spot-jet-photo-etched microstructure, and finally the preparation of a high-bonding strength, low-thermal-damage coating is completed in a single process, breaking through the efficiency and performance bottleneck of the traditional step-by-step process.

[0032] Compared with the existing technology, the beneficial effects of the present invention are mainly reflected in:

[0033] (1) Dynamic thermal-mechanical synergistic effect: Laser energy can simultaneously regulate the morphology of the photoetched microstructure and the particle deposition behavior, avoiding the morphology degradation of the photoetched microstructure caused by secondary high-temperature impact (such as the kinetic energy of particles during deposition) in the step-by-step process.

[0034] (2) Process efficiency and cost optimization: Photoetching microstructure processing and coating deposition are completed in a single process, reducing the time for equipment switching, substrate transfer and repeated clamping, and avoiding the risk of surface contamination in step-by-step processes.

[0035] (3) Reduce thermal damage to heat-sensitive substrates: By controlling the laser energy partition (such as substrate preheating zone and photoetching microstructure processing zone), the heat input of the substrate is limited to a local area to avoid overall thermal damage.

[0036] (4) Provide high-performance coating integrated manufacturing solutions for the fields of aerospace, biomedicine and new energy equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is an assembly diagram of a highly efficient device for preparing microstructures by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching according to the present invention;

[0038] Figure 2 It is a front view of a moving device of a highly efficient device for preparing microstructures by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching according to the present invention;

[0039] Figure 3 This is a rear view of a moving device of an efficient device for preparing microstructures by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching according to the present invention;

[0040] Figure 4The photoetching microstructure device is a highly efficient preparation device for a thermomechanically coupled high-energy particle deposition synchronous composite non-equilibrium photoetching microstructure of the present invention;

[0041] Figure 5 A coating preparation device for a highly efficient preparation device for a thermomechanically coupled high-energy particle deposition synchronous composite non-equilibrium photoetching microstructure according to the present invention; DETAILED DESCRIPTION

[0042] The present invention will be further described below with reference to the accompanying drawings.

[0043] Example 1

[0044] The present invention provides a device for preparing a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching, comprising a frame 1 and:

[0045] Column 2, vertically mounted on the upper end surface of the frame 1;

[0046] The crossbeam assembly 3 is slidably mounted on the column 2 via a sliding assembly and slides up and down along the height direction of the column 2 to adjust the distance between the coating preparation assembly and the substrate, adjust the focal length of the first laser of the photo-etching microstructure assembly, and adjust the overlap of the light spot of the second laser of the coating preparation assembly with the powder spot of the nozzle;

[0047] The conveying platform 4 is mounted on the upper end surface of the frame 1 and is used to convey the substrate;

[0048] The photoetching microstructure assembly 5 is located above the conveying platform 4 and includes a first laser 5 and a first movable assembly. The first movable assembly includes a first transverse slider 501 and a first longitudinal slider 502 that are slidably connected to each other. The first transverse slider 501 is slidably mounted on the guide rail of the crossbeam assembly 3, and the first longitudinal slider 502 is slidably mounted on the guide rail of the first transverse slider 501. The first laser 5 is fixed to the first longitudinal slider 501 and is used to prepare a microstructure on the surface of the substrate.

[0049] And a coating preparation component 6, located above the conveying platform 4, includes a second laser, a temperature measuring component 7, a nozzle 8, and a second moving component, the second moving component includes a second transverse slider 601, a second longitudinal slider 602 and a rotating fixture 603 that are slidably connected to each other, the second transverse slider 601 is installed on the guide rail of the beam component (3), the second longitudinal slider 602 is slidably installed on the guide rail of the second transverse slider 601, the rotating fixture 603 and the nozzle 8 are respectively installed on the second longitudinal slider 602, and the second laser 604 is installed on the rotating fixture 603, which is used to heat the substrate and powder during the coating preparation process to improve the coating bonding; the temperature measuring component is installed on the nozzle to detect the real-time temperature of the substrate surface.

[0050] In this embodiment, the sliding assembly includes a first guide rail slider 202 and a guard plate 203 ; the guide rail slider 202 is slidably mounted on the column 2 .

[0051] In this embodiment, the beam assembly 3 includes a beam 301, a second guide rail slider 302, a motor 303 and a support column 304. The beam 301 is fixedly connected to the first guide rail slider, the second guide rail slider 302 is slidably installed on the slide rail of the beam 301, the support column 304 is fixedly connected to the second guide rail slider 302, and the motor 303 is installed on the beam 301 to drive the support column 304 to move along the length direction of the beam 301.

[0052] In this embodiment, the conveying platform includes a conveyor belt 401, a conveyor belt motor 402, a positioning seat 403 and a rotating assembly 404. The rotating assembly 404 is installed on the upper end surface of the frame 1 through the positioning seat 403. The conveyor belt 401 is rotatably connected to the rotating assembly 404, and the driving end of the conveyor belt motor 402 is drivingly connected to the rotating assembly 402.

[0053] In this embodiment, the nozzle is a Laval nozzle; and the temperature measuring component is a temperature sensor.

[0054] Example 2

[0055] The present invention provides a method for preparing a coating of a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching, comprising the following steps:

[0056] S1. Self-inspection of coating preparation components:

[0057] Check whether the distance between the nozzle and the substrate is correct, and adjust the coating preparation device synchronously with the second longitudinal slider and the second transverse slider. The second transverse slider adjusts the "Y-axis" and the second longitudinal slider adjusts the "Z-axis". At the same time, the support column moves along the crossbeam to adjust the "X-axis" so that the coating preparation device first returns to the origin (that is, the origin in the spatial coordinate system), and then adjusts the "Y-axis" through the second transverse slider so that the coating preparation device reaches the starting position of coating preparation, and then adjusts the "Z-axis" through the second longitudinal slider, that is, adjusts the distance between the nozzle and the substrate. The distance between the nozzle and the substrate should be 30mm; check whether the focal length of the first laser of the photo-etching microstructure device is correct. If the focal length is incorrect, defocusing will occur, that is, the laser power will be inaccurate. Adjust the first longitudinal slider to align the focal length; check whether the light spot of the second laser of the coating preparation device coincides with the powder spot of the nozzle. The second laser is adjusted to the "collimation" mode, and the rotating fixture adjusts the laser angle so that it coincides with the powder spot (the spot on the substrate after the nozzle discharges powder); check whether the moving component can operate normally;

[0058] S2, select a suitable spraying powder, for example, to prepare an anti-corrosion coating, the copper powder or aluminum powder is generally used in the art, set the parameters of the equipment, the parameters of the equipment include carrier gas pressure, preheating temperature, powder feeding rate and nozzle scanning speed;

[0059] S3, according to the selected base material and powder material, set the power of the first laser;

[0060] S4, according to the material of the base, set the parameters of the second laser, including laser power, laser scanning speed, laser scanning path, laser scanning times and laser frequency;

[0061] S5, the coating preparation assembly and the photo-etching microstructure assembly are driven by the motor of the cross beam assembly and move with the support column, and the first and second moving assemblies drive the coating preparation assembly and the photo-etching microstructure assembly to move along the respective guide rails, for example, in the "arch" route, from the starting point, the photo-etching microstructure assembly is driven by the first transverse slider to complete a photo-etching microstructure processing along the "Y axis", then the support column of the cross beam assembly moves along the "X axis" to align the starting point, then the photo-etching microstructure assembly is driven by the first transverse slider to continue the processing, at the same time, the coating preparation assembly is driven by the first transverse slider to complete a coating preparation along the "Y axis", and the above process is repeated to perform the thermal coupling high-energy particle deposition synchronous composite non-equilibrium state photo-etching microstructure coating preparation on the base;

[0062] S6, if the base size is too long, after the base in the moving range of the cross beam assembly completes the coating preparation, the conveyor belt drives the subsequent base to the coating preparation area under the drive of the motor until the coating preparation of the entire steel plate is completed.

[0063] Specifically, in step S2, the particle size of the selected powder ranges from 1 to 100 μm, and the powder shape is spherical or dendritic.

[0064] Specifically, in step S2, the carrier gas for spraying is nitrogen or helium, the carrier gas pressure ranges from 1 to 5 MPa, the preheating temperature ranges from 200 to 1000 °C, and the powder feeding rate ranges from 1 to 10 r / min.

[0065] Specifically, in step S3, the first laser is a red continuous laser, the power ranges from 0 to 6 kw, the angle between the laser and the base is 60°, and the spot diameter is 4 mm.

[0066] Specifically, in step S4, the second laser is a red pulsed laser, the power ranges from 0 to 200 w, the angle between the laser and the base is 90°, the focal length between the laser and the base is 179 mm, and the spot diameter is 105 μm.

[0067] The working principle of the present invention is: a pulsed laser (nanosecond level) performs in-situ photo-etching microstructure processing (such as micro-pits and grooves) on the surface of the substrate, and at the same time a continuous laser dynamically preheats the local or flying powder particles of the substrate to reduce the yield strength of the material and promote plastic deformation; a supersonic jet (He / N2 carrier gas) accelerates the powder and impacts the substrate, forming a mechanical anchoring effect in the photo-etched microstructure area (such as particles embedded in microgrooves) and laser-induced local micro-melting / diffusion metallurgical bonding, and the laser heat input and particle impact compressive stress are dynamically offset in the synchronous process, thereby suppressing residual stress and avoiding degradation of the photo-etched microstructure morphology; a four-axis linkage system is used to achieve spatiotemporal matching of the spot-jet-photo-etched microstructure, and finally the preparation of a high-bonding strength, low-thermal-damage coating is completed in a single process, breaking through the efficiency and performance bottleneck of the traditional step-by-step process.

[0068] The contents described in this specification are merely an enumeration of the implementation forms of the inventive concept. The scope of protection of the present invention should not be regarded as limited to the specific forms described. The scope of protection of the present invention also includes equivalent technical means that can be thought of by those skilled in the art based on the inventive concept.

Claims

1. A device for preparing a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching, comprising a frame (1), characterized in that: Also includes: A column (2) is vertically mounted on the upper end surface of the frame (1); The crossbeam assembly (3) is slidably mounted on the column (2) via a sliding assembly and slides up and down along the height direction of the column (2) to adjust the distance between the coating preparation assembly and the substrate, adjust the focal length of the first laser of the photoetching microstructure assembly, and adjust the overlap of the light spot of the second laser of the coating preparation assembly and the powder spot of the nozzle; A conveying platform (4) is mounted on the upper end surface of the frame (1) and is used to convey the substrate; A photoetching microstructure assembly (5) is located above the conveying platform (4), and includes a first laser and a first moving assembly, wherein the first moving assembly includes a first transverse slider and a first longitudinal slider that are slidably connected to each other, the first transverse slider being slidably mounted on a guide rail of the crossbeam assembly (3), the first longitudinal slider being slidably mounted on the guide rail of the first transverse slider, and the first laser being fixed on the first longitudinal slider for preparing a microstructure on the surface of the substrate; and a coating preparation assembly (6), located above the conveying platform (4), comprising a second laser, a temperature measuring component, a nozzle, and a second moving assembly, wherein the second moving assembly comprises a second transverse slider, a second longitudinal slider, and a rotating fixture that are slidably connected to each other, the second transverse slider being mounted on a guide rail of the crossbeam assembly (3), the second longitudinal slider being slidably mounted on the guide rail of the second transverse slider, the rotating fixture and the nozzle being respectively mounted on the second longitudinal slider, and the second laser being mounted on the rotating fixture, and being used for heating the substrate and the powder during the coating preparation process to improve the bonding of the coating; The temperature measuring component is installed on the nozzle to detect the real-time temperature of the substrate surface; The sliding assembly, the crossbeam assembly (3), the conveying platform (4), the photoetching microstructure assembly (5) and the coating preparation assembly (6) are electrically connected to a controller respectively.

2. The device for preparing a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching according to claim 1, characterized in that: The sliding assembly comprises a first guide rail slider (202) and a guard plate (203); the guide rail slider (202) is slidably mounted on the column (2); the guard plate (203) is mounted on the column and is used to protect the sliding assembly and the crossbeam assembly from being damaged by metal powder particles.

3. The device for preparing microstructures by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching according to claim 1, characterized in that: The crossbeam assembly (3) comprises a crossbeam (301), a second guide rail slider (302), a motor (303) and a support column (304); the crossbeam (301) is fixedly connected to the first guide rail slider; the second guide rail slider (302) is slidably mounted on a slide rail of the crossbeam (301); the support column (304) is fixedly connected to the second guide rail slider (302); and the motor (303) is mounted on the crossbeam (301) to drive the support column (304) to move along the length direction of the crossbeam (301).

4. The device for preparing microstructures by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching according to claim 1, characterized in that: The conveying platform comprises a conveyor belt (401), a conveyor belt motor (402), a positioning seat (403) and a rotating assembly (404); the rotating assembly (404) is mounted on the upper end surface of the frame (1) via the positioning seat (403); the conveyor belt (401) is rotatably connected to the rotating assembly (404); and the driving end of the conveyor belt motor (402) is drivingly connected to the rotating assembly (402).

5. The device for preparing a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching as claimed in claim 1, characterized in that: The nozzle is a Laval nozzle; and the temperature measuring component is a temperature sensor.

6. A method for preparing a coating of a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching, characterized in that: The following steps are involved: S1. Self-inspection of coating preparation components: Check whether the distance between the nozzle and the substrate is correct, check whether the focal length of the first laser of the photo-etching microstructure component is correct, check whether the light spot of the second laser of the coating preparation component coincides with the powder spot of the nozzle, and check whether the moving component can operate normally; S2. Select appropriate spray powder and set equipment parameters, including carrier gas pressure, preheating temperature, powder feeding rate and nozzle scanning speed; S3. Setting the power of the first laser according to the selected substrate material and powder material; S4. Setting the parameters of the second laser according to the material of the substrate, the parameters of the second laser including laser power, laser scanning speed, laser scanning path, laser scanning times and laser frequency; S5. The coating preparation assembly and the photoetching microstructure assembly are driven by the motor of the crossbeam assembly to move along with the support column. At the same time, the first and second moving assemblies respectively drive the coating preparation assembly and the photoetching microstructure assembly to move along their respective guide rails, thereby performing thermal-mechanical coupling high-energy particle deposition and synchronous composite non-equilibrium photoetching microstructure preparation coating on the substrate; S6. If the substrate is too long, after the coating preparation is completed on the substrate within the moving range of the beam assembly, the conveyor belt is driven by the motor to send the subsequent substrate to the coating preparation area until the coating preparation of the entire steel plate is completed.

7. The method for preparing a coating of a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching according to claim 6, characterized in that: In step S2 , the selected powder particle size range is 1-100 μm, and the powder shape is spherical or dendritic.

8. The method for preparing a coating of a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching as claimed in claim 6, characterized in that: In step S2, the carrier gas for spraying is nitrogen or helium, the carrier gas pressure range is 1-5 MPa, the preheating temperature range is 200-1000°C, and the powder feeding rate range is 1-10 r / min.

9. The method for preparing a coating of a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching according to claim 6, characterized in that: In step S3, the first laser is a red continuous laser with a power range of 0-6 kW, an angle between the laser and the substrate of 60°, and a spot diameter of 4 mm.

10. The method for preparing a coating of a microstructure by thermomechanically coupled high-energy particle deposition and synchronous composite non-equilibrium photoetching according to claim 6, characterized in that: In step S4, the second laser is a red pulse laser with a power range of 0-200W, an angle between the laser and the substrate of 90°, a focal length between the laser and the substrate of 179mm, and a spot diameter of 105μm.

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