Mold cleaning material for semiconductor packaging mold, composition of mold cleaning material, preparation method of mold cleaning material and application of mold cleaning material

Abstract

The invention relates to a mold cleaning material for a semiconductor packaging mold, and the mold cleaning material uses a mixture of C5-C15 n-alkane and isoparaffin as a cleaning agent, or uses isododecane as the cleaning agent. The addition amount of the additive is 0.1%-5% of the total amount of the mold cleaning material. The invention also discloses a mold cleaning composition of the mold cleaning material for the conductor packaging mold, the mold cleaning composition comprises a cleaning agent, rubber, a curing agent, a filler and a curing auxiliary agent, and the invention also discloses a preparation method of the mold cleaning composition of the mold cleaning material for the conductor packaging mold. The cleaning agent can effectively soften and dissolve residues of high-adhesion resin, and the cleaning effect of the semiconductor mold cleaning rubber is remarkably improved. When the cleaning agent is used for cleaning SOP8 packaging or other high-reliability epoxy molding compounds, the cleaning effect is good, and after cleaning, the cleaning agent is matched with proper mold moistening rubber, and the continuous moldability can reach more than 400 mold times.

Description

Technical Field

[0001] The present invention relates to a mold cleaning material, in particular to a mold cleaning material for semiconductor packaging molds. The present invention also relates to the mold cleaning material composition and a preparation method thereof. Background Art

[0002] The reliability requirements for semiconductor packaging devices are becoming increasingly higher, necessitating the addition of highly adhesive materials such as biphenyl epoxy resin to epoxy molding compounds. Compared with traditional o-cresol epoxy, these highly adhesive materials have lower thermal hardness and stronger adhesion, making them prone to residue on the mold surface. Simultaneously, under cost pressures for semiconductor packaging, continuous molding times are increasing. Therefore, how to remove the highly adhesive materials remaining on the mold surface is a challenge facing semiconductor packaging companies.

[0003] Among traditional mold cleaning materials, melamine mold cleaning cake has the worst mold cleaning ability. However, mold cleaning strips are currently widely used because their vulcanized strips have good fluidity, good filling properties for the mold cavity, and can simultaneously clean the mold's exhaust grooves.

[0004] The mold cleaning strips on the market are not effective in cleaning the residues of high-adhesion epoxy molding compound in the mold cavity. As the cleaning cycle lengthens, the number of continuous molding cycles becomes less and less. When it reaches a certain level, the mold needs to be disassembled and thoroughly cleaned using a potion-based steaming method. Therefore, a special design is needed to clean the residues of high-adhesion epoxy molding compound. Summary of the Invention

[0005] The purpose of the present invention is to provide a new mold cleaning material that can effectively clean the residues of high-adhesion epoxy molding compound on the mold surface after continuous molding in view of the shortcomings of the existing technology.

[0006] Another technical problem to be solved by the present invention is to provide a composition of the above-mentioned mold clearing material.

[0007] Another technical problem to be solved by the present invention is to provide a method for preparing the aforementioned mold clearing material.

[0008] Another technical problem to be solved by the present invention is to provide a use of the above-mentioned mold clearing material.

[0009] The technical solution to be solved by the present invention is achieved by the following technical solution: The present invention is a mold cleaning material for semiconductor packaging molds, which is characterized in that the mold cleaning material uses a mixture of C5-C15 normal alkanes and isoalkanes as a cleaning agent, or uses isododecane as a cleaning agent.

[0010] The further preferred technical scheme of the mold cleaning material for semiconductor packaging mold is that the additive amount of the cleaning agent is 0.1% to 5% of the total amount of the mold cleaning material.

[0011] The further preferred technical scheme of the mold cleaning material for semiconductor packaging mold is that the additive amount of the cleaning agent is 0.5% to 1% of the total amount of the mold cleaning material.

[0012] The further preferred technical scheme of the mold cleaning material for semiconductor packaging mold is that when the cleaning agent is a mixture of normal alkanes and isomeric alkanes with C5 to C15, the mixing ratio is 1:1 to 5:1, and the total additive amount is 0.3% to 2%.

[0013] The further preferred technical scheme of the mold cleaning material for semiconductor packaging mold is that when the cleaning agent is a mixture of normal alkanes and isomeric alkanes with C5 to C15, the mixing ratio is 2:1, and the total additive amount is 0.6% to 1.5%.

[0014] The application further provides a mold cleaning composition containing the mold cleaning material for semiconductor packaging mold, which is characterized in that the mold cleaning composition is composed of the following five materials in the following weight ratio:

[0015] (1) cleaning agent: the cleaning agent is a mixture of normal alkanes and isomeric alkanes with C5 to C15 or isododecane, and the amount is 2 to 15 parts;

[0016] (2) rubber: one or more of binary or ternary ethylene-propylene rubber, isoprene rubber, styrene-butadiene rubber, cis-butadiene rubber, and vinyl acetate rubber, and the amount is 100 parts;

[0017] (3) curing agent: one or more of dicumyl peroxide, 2,5-dimethyl-2,5-bis(tert-butyl peroxy) hexane, 3,5-trimethylcyclohexane, 2,6-di-tert-butyl-p-cresol, monoethanolamine, diethanolamine, triethanolamine, and fatty alcohol polyoxyethylene ether, and the amount is 1 to 8 parts;

[0018] (4) filler: one or more of white carbon black, titanium white powder, and silicon powder, and the amount is 20 to 45 parts;

[0019] (5) curing aid: one or more of sulfur, 2,4-di-tert-butyl peroxide isopropyl benzene, N,N'-m-phenylene bismaleimide PDM, trimethylolpropane trimethacrylate TMP TMA, triallyl isocyanurate TAI C, triallyl cyanurate TAC, and tetramethyl dithio tetramethyl thiuram TMTD, and the amount is 0.5 to 3 parts.

[0020] The present invention also provides a method for preparing the mold cleaning composition of the mold cleaning material for semiconductor packaging molds as described above, which is characterized in that the steps are as follows:

[0021] (1) First, add the corresponding amount of rubber into the internal mixer according to the volume of the internal mixer and stir thoroughly to fully plasticize the rubber to form plasticized rubber;

[0022] (2) Then, the weighed filler and detergent are added to the internal mixer and stirred thoroughly to prepare the unsulfurized masterbatch; then, the curing agent and curing aid are added to the internal mixer in proportion and mixed for 0.2-0.5 hours until the temperature of the rubber compound rises to 100°C-130°C to prepare the mold-clearing rubber;

[0023] (3) Finally, the mixed mold-clearing rubber mixture is discharged and poured into an open mill to cool and remix, and then extruded through a calender to extrude the rubber into a solid mold-clearing rubber plate body, and finally cut into strip-shaped mold-clearing rubber strips through a strip cutting machine.

[0024] The present invention also discloses the use of the composition of normal alkanes and isoalkanes, which is characterized in that the composition of normal alkanes and isoalkanes with C5-C15 is used as a cleaning agent for mold cleaning materials used in semiconductor packaging molds.

[0025] The invention also discloses the use of isododecane, which is characterized in that the use is to use isododecane as a cleaning agent for mold cleaning materials used in semiconductor packaging molds.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. The cleaning agent of the present invention can effectively soften and dissolve the residue of high-adhesion resin, significantly improving the cleaning effect of semiconductor mold cleaning rubber.

[0028] 2. When the mold cleaning rubber of the present invention is used for cleaning SOP8 type packaging or other high reliability epoxy molding compounds, the cleaning effect is good. After cleaning, it is matched with a suitable mold lubricating rubber, and the continuous molding performance can reach more than 400 molds. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 -2 is the experimental photo comparison. DETAILED DESCRIPTION

[0030] The present invention will be described below using examples, but the scope of the present invention is not limited to these examples.

[0031] Example 1: A mold cleaning material for semiconductor packaging molds, wherein the mold cleaning material uses a mixture of C5-C15 normal alkanes and isoalkanes as a cleaning agent, and the addition amount is 0.1% of the total amount of the mold cleaning material.

[0032] Example 2: A mold cleaning material for semiconductor packaging molds, wherein the mold cleaning material uses a mixture of C5-C15 normal alkanes and isoalkanes as a cleaning agent, and the added amount is 5% of the total amount of the mold cleaning material.

[0033] Example 3: A mold cleaning material for semiconductor packaging molds, wherein the mold cleaning material uses a mixture of C5-C15 normal alkanes and isoalkanes as a cleaning agent, and the added amount is 2.5% of the total amount of the mold cleaning material.

[0034] Example 4, a mold cleaning material for semiconductor packaging molds, wherein isododecane is used as a cleaning agent, and its addition amount is 0.5% of the total amount of the mold cleaning material.

[0035] Example 5, a mold cleaning material for semiconductor packaging molds, wherein isododecane is used as a cleaning agent, and its addition amount is 1% of the total amount of the mold cleaning material.

[0036] Example 6, a mold cleaning material for semiconductor packaging molds, the mold cleaning material is a mixture of C5-C15 normal alkanes and isoalkanes, the mixing ratio is 1:1; the total addition amount is 0.3%.

[0037] Example 7, a mold cleaning material for semiconductor packaging molds, the mold cleaning material is a mixture of C5-C15 normal alkanes and isoalkanes, the mixing ratio is 2:1; the total addition amount is 1.5%.

[0038] Example 8, a mold cleaning material for semiconductor packaging molds, the mold cleaning material is a mixture of C5-C15 normal alkanes and isoalkanes, the mixing ratio is 3:1; the total addition amount is 1%.

[0039] Example 9, a mold cleaning material for semiconductor packaging molds, the mold cleaning material is a mixture of C5-C15 normal alkanes and isoalkanes, the mixing ratio is 4:1; the total addition amount is 0.6%.

[0040] Example 10, a mold cleaning material for a semiconductor packaging mold, the mold cleaning material is a mixture of C5-C15 normal alkanes and isoalkanes, the mixing ratio is 5:1; the total addition amount is 1.2%.

[0041] Example 11, a mold cleaning composition for a semiconductor packaging mold, the mold cleaning composition is composed of the following five materials in the following weight ratio:

[0042] (1) Cleaning agent: a mixture of C5-C15 normal alkanes and isoalkanes as claimed in claim 1, or 2-15 parts of isododecane;

[0043] (2) Rubber: 100 parts of one or more of EPDM, isoprene rubber, styrene-butadiene rubber, butadiene rubber, and vinyl acetate rubber;

[0044] (3) Curing agent: one or more of dicumyl peroxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, 3,5-trimethylcyclohexane, 2,6-di-tert-butyl-p-cresol, monoethanolamine, diethanolamine, triethanolamine, and fatty alcohol polyoxyethylene ether; the addition amount is 1 to 8 parts;

[0045] (4) Filler: one or more of white carbon black, titanium dioxide, and silica powder; the addition amount is 20 to 45 parts;

[0046] (5) Curing aids: one or more of sulfur, 2,4-di-tert-butyl peroxide isopropylbenzene, N,N'-m-phenylene bismaleimide PDM, trimethylolpropane trimethacrylate TMP TMA, triallyl isocyanurate TAI C, triallyl cyanurate TAC, tetramethylthiuram disulfide TMTD, with the addition amount being 0.5 to 3 parts.

[0047] Example 11, a mold cleaning composition for a semiconductor packaging mold, the mold cleaning composition is composed of the following five materials in the following weight ratio:

[0048] (1) Cleaning agent: a mixture of C5-C15 normal alkanes and isoalkanes as claimed in claim 1, or 2 parts of isododecane;

[0049] (2) Rubber: 100 parts of one or more of EPDM, isoprene rubber, styrene-butadiene rubber, butadiene rubber, and vinyl acetate rubber;

[0050] (3) Curing agent: one or more of diisopropylbenzene peroxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, 3,5-trimethylcyclohexane, 2,6-di-tert-butyl-p-cresol, monoethanolamine, diethanolamine, triethanolamine, and fatty alcohol polyoxyethylene ether; the addition amount is 1 part;

[0051] (4) Filler: one or more of white carbon black, titanium dioxide, and silica powder; the addition amount is 20 parts; (5) Curing aid: one or more of sulfur, 2,4-di-tert-butyl peroxide isopropyl benzene, N,N'-m-phenylene bismaleimide PDM, trimethylolpropane trimethacrylate TMP TMA, triallyl isocyanurate TAI C, triallyl cyanurate TAC, and tetramethylthiuram disulfide T MTD; the addition amount is 0.5 parts.

[0052] Example 12, a mold cleaning composition for a semiconductor packaging mold, the mold cleaning composition is composed of the following five materials in the following weight ratio:

[0053] (1) Cleaning agent: a mixture of C5-C15 normal alkanes and isoalkanes as claimed in claim 1, or 15 parts of isododecane;

[0054] (2) Rubber: 100 parts of one or more of EPDM, isoprene rubber, styrene-butadiene rubber, butadiene rubber, and vinyl acetate rubber;

[0055] (3) Curing agent: one or more of diisopropylbenzene peroxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, 3,5-trimethylcyclohexane, 2,6-di-tert-butyl-p-cresol, monoethanolamine, diethanolamine, triethanolamine, and fatty alcohol polyoxyethylene ether; the addition amount is 8 parts;

[0056] (4) Filler: one or more of white carbon black, titanium dioxide, and silicon micropowder; the addition amount is 45 parts; (5) Curing aid: one or more of sulfur, 2,4-di-tert-butyl peroxide isopropyl benzene, N,N'-m-phenylene bismaleimide PDM, trimethylolpropane trimethacrylate TMP TMA, triallyl isocyanurate TAI C, triallyl cyanurate TAC, and tetramethylthiuram disulfide T MTD; the addition amount is 3 parts.

[0057] Example 13, a mold cleaning composition for a semiconductor packaging mold, the mold cleaning composition is composed of the following five materials in the following weight ratio:

[0058] (1) Cleaning agent: a mixture of C5-C15 normal alkanes and isoalkanes as claimed in claim 1, or 5 parts of isododecane;

[0059] (2) Rubber: 100 parts of one or more of EPDM, isoprene rubber, styrene-butadiene rubber, butadiene rubber, and vinyl acetate rubber;

[0060] (3) Curing agent: one or more of diisopropylbenzene peroxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, 3,5-trimethylcyclohexane, 2,6-di-tert-butyl-p-cresol, monoethanolamine, diethanolamine, triethanolamine, and fatty alcohol polyoxyethylene ether; the addition amount is 5 parts;

[0061] (4) Filler: one or more of white carbon black, titanium dioxide, and silicon micropowder; the addition amount is 30 parts; (5) Curing aid: one or more of sulfur, 2,4-di-tert-butyl peroxide isopropyl benzene, N,N'-m-phenylene bismaleimide PDM, trimethylolpropane trimethacrylate TMP TMA, triallyl isocyanurate TAI C, triallyl cyanurate TAC, and tetramethylthiuram disulfide T MTD; the addition amount is 2 parts.

[0062] Example 14: A method for preparing the mold cleaning composition of the mold cleaning material for semiconductor packaging molds described in Examples 11-13, comprising the following steps:

[0063] (1) First, add the corresponding amount of rubber into the internal mixer according to the volume of the internal mixer and stir thoroughly to fully plasticize the rubber to form plasticized rubber;

[0064] (2) Then, the weighed filler and detergent are added to the internal mixer and stirred thoroughly to prepare the unsulfurized masterbatch; then, the curing agent and curing aid are added to the internal mixer in proportion, the temperature is raised to 120°C, and the mixture is mixed for 0.3 hours to prepare the mold-clearing rubber mix;

[0065] (3) Finally, the mixed mold-clearing rubber mixture is discharged and poured into an open mill to cool and remix, and then extruded through a calender to extrude the rubber into a solid mold-clearing rubber plate body, and finally cut into strip-shaped mold-clearing rubber strips through a strip cutting machine.

[0066] Example 15, a comparative experiment on the preparation method of a mold cleaning composition of a mold cleaning material for a semiconductor packaging mold, the steps of which are as follows:

[0067] First, add the corresponding amount of rubber into the internal mixer according to the volume of the internal mixer and stir thoroughly for 10 minutes to fully plasticize the rubber to form plasticized rubber;

[0068] Then, the weighed filler and detergent were added into the internal mixer, stirred at low speed for 8 minutes and at high speed for 3 minutes to prepare the unsulfurized masterbatch;

[0069] Next, add the curing agent and curing aid into the internal mixer according to the proportion, stir at low speed for 3 minutes and high speed for 2 minutes, until the temperature of the rubber compound rises to 100℃-130℃, and prepare the mold clearing rubber;

[0070] Finally, the mixed mold clearing rubber mixture is discharged and poured into an open mixing mill to cool and remix, and then extruded through a calender to extrude the rubber into a solid mold clearing rubber sheet. Finally, the mold clearing rubber strip sheet is cut into strip-shaped mold clearing rubber strips through a strip cutting machine.

[0071] Table 1 below shows the mass ratios of the raw materials in each experimental example and comparative example:

[0072]

[0073] Table 2 below is a comparison of the performance parameters of the rubber compounds obtained in Experimental Examples 1 to 5:

[0074]

[0075] Test evaluation method:

[0076] The high-reliability epoxy molding compound EMG-600-2 for SOP8 on the market was used to continuously mold 300 times on the SOP8-12 row mold. The mold was continuously cleaned 4 times with a mold cleaning strip, and the mold cleaning effect was determined by observing the surface condition of the cavity.

[0077] The specific cleaning parameters used are set as follows:

[0078] Mold temperature: 175°C

[0079] Mold cleaning time: 500 seconds for the first mold, 300 seconds for other molds

[0080] Pressure: 80~100kg / cm 2

[0081] Judging the mold cleaning effect: visually inspect the mold status and observe the appearance of the plastic-sealed product after the mold cleaning cycle.

[0082] Table 3 below shows the experimental results of the comparative example and Examples 1 to 5:

[0083]

[0084] from Figure 1 As can be seen from Table 2 and Table 3, the mold cleaning glue using a mixture of C5-C15 normal alkanes and isoalkanes or using isododecane as a cleaning agent has the following advantages:

[0085] 1. The physical and mechanical properties of the rubber material remain unchanged and will not affect the operability of the mold cleaning rubber;

[0086] 2. The cleaning effect of mold cleaning glue is significantly improved.

Claims

1. A mold cleaning material for semiconductor packaging mold, characterized in that: The mold cleaning material uses a mixture of C5-C15 normal alkanes and isoalkanes as a cleaning agent, or uses isododecane as a cleaning agent.

2. The mold cleaning material for semiconductor packaging mold according to claim 1, characterized in that: When the cleaning agent is used, the added amount thereof is 0.1% to 5% of the total amount of the mold cleaning material.

3. The mold cleaning material for semiconductor packaging mold according to claim 2, characterized in that: When the cleaning agent is used, the added amount thereof is 0.5% to 1% of the total amount of the mold cleaning material.

4. The mold cleaning material for semiconductor packaging mold according to claim 2, characterized in that: When a mixture of C5-C15 normal alkanes and isoalkanes is used as a detergent, the mixing ratio is 1:1 to 5:1; the total addition amount is 0.3~2%.

5. The mold cleaning material for semiconductor packaging mold according to claim 4, characterized in that: When a mixture of C5-C15 normal alkanes and isoalkanes is used as a detergent, the mixing ratio is 2:1; the total addition amount is 0.6~1.5%.

6. A mold cleaning composition containing the mold cleaning material for semiconductor packaging mold according to any one of claims 1 to 5, characterized in that: The mold clearing composition is composed of the following five materials in the following weight ratios: (1) Cleaning agent: a mixture of C5-C15 normal alkanes and isoalkanes as claimed in claim 1, or 2-15 parts of isododecane; (2) Rubber: 100 parts of one or more of EPDM, isoprene rubber, styrene-butadiene rubber, butadiene rubber, and vinyl acetate rubber; (3) Curing agent: one or more of diisopropylbenzene peroxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, 3,5-trimethylcyclohexane, 2,6-di-tert-butyl-p-cresol, monoethanolamine, diethanolamine, triethanolamine, and fatty alcohol polyoxyethylene ether; the addition amount is 1 to 8 parts; (4) Filler: one or more of white carbon black, titanium dioxide, and silica powder; the addition amount is 20~45 parts; (5) Curing aids: one or more of sulfur, 2,4-di-tert-butyl peroxide isopropylbenzene, N, N'-m-phenylene bismaleimide PDM, trimethylolpropane trimethacrylate TMP TMA, triallyl isocyanurate TAI C, triallyl cyanurate TAC, tetramethylthiuram disulfide TMTD, with the addition amount being 0.5~3 parts.

7. A method for preparing the mold cleaning composition of the mold cleaning material for semiconductor packaging mold according to claim 6, characterized in that: The steps are as follows: (1) First, add the corresponding amount of rubber into the internal mixer according to the volume of the internal mixer and stir it thoroughly to fully plasticize the rubber to form plasticized rubber; (2) Then, the weighed filler and detergent are added to the internal mixer and stirred thoroughly to prepare the unsulfurized masterbatch; then, the curing agent and curing aid are added to the internal mixer in proportion, the temperature is raised to 100℃-130℃, and the mixture is mixed for 0.2-0.5 hours to prepare the mold-clearing rubber mix; (3) Finally, the mixed mold cleaning rubber mixture is discharged and poured into an open mill to cool and remix, and then extruded through a calender to extrude the rubber into a solid mold cleaning rubber sheet. Finally, the mold cleaning rubber sheet is cut into strip-shaped mold cleaning rubber strips through a strip cutting machine.

8. Use of the composition of n-alkanes and isoalkanes according to any one of claims 1 to 5, characterized in that: The application is to use the composition of C5-C15 normal alkanes and isoalkanes as a cleaning agent for mold cleaning materials used in semiconductor packaging molds.

9. The use of isododecane according to claim 1, characterized in that: The application is to use isododecane as a cleaning agent for mold cleaning materials used in semiconductor packaging molds.

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