Coating for improving paint adhesion capability of metal component of distribution box and distribution box

Abstract

The invention discloses a coating for improving the paint adhesion capability of a metal part of a distribution box, and the coating is prepared by the following steps: depositing a first oxide layer on the metal surface, the first oxide layer comprising Zn element and Ce element; a second oxide layer is deposited on the surface of the first oxide layer, the second oxide layer comprises a Zn element and a Ce element, and the molar ratios of the Zn element and the Ce element of the first oxide layer and the second oxide layer are different; a third oxide layer is deposited on the surface of the second oxide layer, and the third oxide layer comprises a Zn element and a Dy element; and a fourth oxide layer is deposited on the surface of the third oxide layer, the fourth oxide layer comprises a Zn element and a Dy element, and the molar ratios of the Zn element and the Dy element of the third oxide layer and the fourth oxide layer are different. The coating provided by the invention can improve the adhesive ability of the paint to a metal substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of layered materials, and in particular to a coating for improving the adhesion of a paint surface of a metal part of a distribution box and a distribution box. BACKGROUND

[0002] A distribution box is a core device in a power system for distributing, controlling and protecting electric energy, usually installed in buildings, factories, public facilities and other places. It is responsible for distributing electric energy from the main power supply to each branch circuit, while providing short circuit, overload and other circuit protection functions to ensure the safety of electricity use and the stability of the system. The shell of the distribution box is generally made of metal, and in order to be beautiful and protect the metal body, paint needs to be sprayed on the metal shell. Since the distribution box is exposed to the outdoor environment for a long time, the paint surface of the distribution box may be subjected to a large stress in windy and rainy weather; in addition, since the distribution box needs to be regularly inspected, maintained and maintained, the paint surface will be repeatedly contacted by engineers. The use environment of the distribution box determines that the service life of the paint surface depends to a great extent on the adhesion of the paint to the metal body. The existing technology generally uses the method of improving the paint formula to improve the adhesion of the paint to the metal. However, this type of formula improvement technology has reached a bottleneck period, and our research shows that in the past 5 years, the adhesion of the paint to the metal cannot be effectively improved by improving the paint formula. SUMMARY

[0003] In view of the problems of the prior art, the present application uses a method of changing the chemical composition of the metal surface to improve the adhesion between the paint surface and the metal. Specifically, the present application improves the adhesion between the paint surface and the metal by depositing several oxide layers mixed with rare earth elements on the metal surface, and adjusting the composition ratio and element composition of each oxide layer.

[0004] The present application provides a coating for improving the adhesion of a paint surface to a metal part of a distribution box, which is prepared by the following steps:

[0005] depositing a first oxide layer on the metal surface, wherein the first oxide layer comprises Zn elements and Ce elements;

[0006] depositing a second oxide layer on the surface of the first oxide layer, wherein the second oxide layer comprises Zn elements and Ce elements, and the molar ratio of Zn elements to Ce elements of the first oxide layer and the second oxide layer is different;

[0007] depositing a third oxide layer on the surface of the second oxide layer, wherein the third oxide layer comprises Zn elements and Dy elements;

[0008] A fourth oxide layer is deposited on the surface of the third oxide layer, wherein the fourth oxide layer includes Zn and Dy elements, and the molar ratio of the Zn element to the Dy element in the third oxide layer is different from that in the fourth oxide layer.

[0009] In a preferred embodiment, the first oxide layer is deposited by magnetron sputtering, wherein the first target used to prepare the first oxide layer is a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the first target is (25-28):1.

[0010] In a preferred embodiment, the second oxide layer is deposited by magnetron sputtering, wherein the second target used to prepare the second oxide layer is a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the second target is (29-31):1.

[0011] In a preferred embodiment, the third oxide layer is deposited by magnetron sputtering, wherein the third target used to prepare the third oxide layer is a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the third target is (18-21):1.

[0012] In a preferred embodiment, the fourth oxide layer is deposited by magnetron sputtering, wherein the fourth target used to prepare the fourth oxide layer is a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the fourth target is (23-25):1.

[0013] In a preferred embodiment, the process for depositing the first oxide layer is as follows: the power source type is RF power supply, the sputtering power is 50-70W, the sputtering voltage is 100-200V, the argon flow rate is 20-30sccm, and the sputtering temperature is 80-100°C.

[0014] In a preferred embodiment, the process for depositing the second oxide layer is as follows: the power source type is RF power supply, the sputtering power is 80-100W, the sputtering voltage is 200-300V, the argon flow rate is 20-30sccm, and the sputtering temperature is 80-100°C.

[0015] In a preferred embodiment, the process for depositing the third oxide layer is as follows: the power source type is RF power supply, the sputtering power is 50-70W, the sputtering voltage is 100-200V, the argon flow rate is 20-30sccm, and the sputtering temperature is 80-100°C.

[0016] In a preferred embodiment, the process for depositing the fourth oxide layer is as follows: the power source type is RF power supply, the sputtering power is 80-100W, the sputtering voltage is 200-300V, the argon flow rate is 20-30sccm, and the sputtering temperature is 80-100°C.

[0017] The present invention also provides a distribution box, wherein the distribution box includes a metal component, wherein the coating as described above is deposited on the surface of the metal component.

[0018] Compared to existing technologies, the present invention offers the following advantages: It improves the adhesion between paint and metal by modifying the chemical composition of the metal surface. Specifically, the present invention deposits multiple oxide layers mixed with rare earth elements on the metal surface and adjusts the composition ratio and elemental composition of each oxide layer, thereby improving the adhesion between paint and metal. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the structure of the coating of the present invention.

[0020] Figure 2 It is a flow chart of the method of the present invention.

[0021] Figure 3 This is a surface TEM photograph of one embodiment of the present invention.

[0022] Figure 4 Yes Figure 3 The two-dimensional Fourier transform image of the TEM photograph shown is shown.

[0023] Figure 5 This is a surface TEM photograph of another embodiment of the present invention.

[0024] Figure 6 Yes Figure 5 The two-dimensional Fourier transform image of the TEM photograph shown is shown. DETAILED DESCRIPTION

[0025] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0026] Our research has shown that the material composition of the metal substrate does not affect the fundamental conclusions of this invention. In other words, the coating of this invention can improve the adhesion between the paint surface and the metal (in this invention, adhesion is characterized by hiding power, adhesion, and impact resistance) for distribution box metal enclosures of any composition. To ensure comparability of results, unless otherwise indicated, the metal used in each embodiment and comparative example of this invention is SUS304 stainless steel. The thickness of the oxide layer generally does not affect the conclusions of this invention. As a general rule, if the oxide layer thickness is too low, the oxide layer will not be able to perform its role in improving the adhesion between the metal and the paint surface. If the oxide layer thickness is too high, the oxide layer itself may crack and fall off. To ensure comparability of results, the thickness of each oxide layer in this invention is 25 nm. The oxide target used in the present invention can be prepared by powder metallurgy. Specifically, using a mixed target of ZnO and CeO2 as an example, ZnO and CeO2 are first weighed according to a molar ratio (ZnO and CeO2 can be purchased from a chemical store). The ZnO and CeO2 raw materials are then thoroughly crushed and mixed by ball milling. The mixed powder is then cold-pressed and hot-pressed to produce the mixed target. Another target manufacturing method can be to mix metal Zn and Ce according to a molar ratio, then smelt the two metals together by smelting, and then fully oxidize the smelted metal ingot. The target used in the present invention was custom-made by the Beijing Nonferrous Metals Research Institute. The hiding power test of the present invention complies with GB / T1726-1979, the adhesion test complies with GB / T9286-1998, and the impact resistance test complies with GB / T1732-1993.

[0027] Figure 1 Schematic diagram of the structure of the coating of the present invention. As shown in the figure, the coating of the present invention comprises a first oxide layer, a second oxide layer, a third oxide layer and a fourth oxide layer on the metal surface.

[0028] Figure 2 : is a flow chart of the method of the present invention. As shown in the figure, the method of the present invention includes the following steps:

[0029] Step 1: depositing a first oxide layer on the metal surface, wherein the first oxide layer includes Zn and Ce elements;

[0030] Step 2: depositing a second oxide layer on the surface of the first oxide layer, wherein the second oxide layer comprises Zn and Ce, and the molar ratio of Zn to Ce in the first oxide layer and the second oxide layer is different;

[0031] Step 3: depositing a third oxide layer on the surface of the second oxide layer, wherein the third oxide layer includes Zn and Dy elements;

[0032] Step 4: depositing a fourth oxide layer on the surface of the third oxide layer, wherein the fourth oxide layer includes Zn and Dy elements, and the molar ratio of the Zn element to the Dy element in the third oxide layer is different from that in the fourth oxide layer.

[0033] The technical effects of the present invention are verified by the following examples and comparative examples.

[0034] Example 1

[0035] The coating is prepared by the following steps: depositing a first oxide layer on the metal surface; depositing a second oxide layer on the surface of the first oxide layer; depositing a third oxide layer on the surface of the second oxide layer; and depositing a fourth oxide layer on the surface of the third oxide layer.

[0036] The first oxide layer was deposited by magnetron sputtering, wherein the first target used to prepare the first oxide layer was a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the first target was 25:1. The second oxide layer was deposited by magnetron sputtering, wherein the second target used to prepare the second oxide layer was a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the second target was 29:1. The third oxide layer was deposited by magnetron sputtering, wherein the third target used to prepare the third oxide layer was a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the third target was 18:1. The fourth oxide layer was deposited by magnetron sputtering, wherein the fourth target used to prepare the fourth oxide layer was a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the fourth target was 23:1.

[0037] The process for depositing the first oxide layer is: the power supply type is RF power supply, the sputtering power is 50W, the sputtering voltage is 100V, the argon flow rate is 20sccm, and the sputtering temperature is 80°C. The process for depositing the second oxide layer is: the power supply type is RF power supply, the sputtering power is 80W, the sputtering voltage is 200V, the argon flow rate is 20sccm, and the sputtering temperature is 80°C. The process for depositing the third oxide layer is: the power supply type is RF power supply, the sputtering power is 50W, the sputtering voltage is 100V, the argon flow rate is 20sccm, and the sputtering temperature is 80°C. The process for depositing the fourth oxide layer is: the power supply type is RF power supply, the sputtering power is 80W, the sputtering voltage is 200V, the argon flow rate is 20sccm, and the sputtering temperature is 80°C. The TEM photograph of the fourth oxide layer of Example 1 can be seen. Figure 3 , Figure 4 Yes Figure 3The TEM sample preparation method is as follows: first, the sample prepared by the method of Example 1 is mechanically thinned (for example, sandpaper polishing) to make the thickness of the metal substrate less than 1 mm, then the sample is thinned from the direction of the metal substrate by ion thinning, and finally the thinned sample is subjected to TEM imaging. Figure 3 It can be seen that the fourth oxide layer includes nanocrystals with a size of about 3 nm. The surface of the sample of Example 1 was coated with the paint of Example 1 disclosed in the prior art CN118667399A, and then the sample of Example 1 coated with the paint was tested for hiding power, adhesion and impact resistance. Among them, the hiding power was 91 g / m 2 , adhesion level 0, and impact resistance 53cm. From a quantum mechanical perspective, the hiding power of paint is affected by interfacial quantum effects. Specifically, electronic hybridization at the interface between the paint and the substrate can form new energy levels, affecting the reflectance / transmittance ratio of photons and, consequently, the paint's hiding power. Changing the composition of the substrate in contact with the paint, while maintaining the same paint composition, can clearly improve the paint's hiding power. Prior to the present invention, the paint contacted a metal substrate, whereas in the present invention, the paint contacted an oxide layer. Experimental results from the present invention demonstrate that changing the substrate's material to a specific oxide layer can improve the paint's hiding power. This phenomenon may be explained by the unique electronic structure of rare earth elements, allowing ZnO doped with rare earth oxides to provide more energy levels. These additional energy levels facilitate electronic hybridization with the paint, thereby forming more new energy levels. Furthermore, a multi-layered, multi-component, and multi-ratio composite oxide layer can alter the lattice structure of the outermost oxide layer, providing it with a specific number of energy levels, which can also enhance the paint's hiding power. Adhesion and impact resistance are affected by the overlap of the electron clouds between paint molecules and the substrate. Changing the composition of the substrate in contact with the paint (and thus changing the shape of the substrate's electron cloud) while maintaining the same paint composition clearly can improve the paint's adhesion and impact resistance. In the present invention, due to the unique electronic structure of rare earth elements and the lattice structure of rare earth oxides, ZnO doped with rare earth oxides provides an electron cloud with a specific shape (the unique electronic structure of rare earth elements can alter the structure of the ZnO electron cloud, and the lattice structure of rare earth oxides can also alter the structure of the ZnO electron cloud). This electron cloud may better overlap with the electron clouds of paint molecules, thereby improving the paint's adhesion and impact resistance. More importantly, the multi-layered, multi-component, and multi-ratio composite oxide layer can alter the lattice structure of the outermost oxide layer and indirectly change the electron cloud shape of the outermost oxide layer through electron coupling, thereby improving the paint's adhesion and impact resistance.

[0038] Example 2

[0039] The coating is prepared by the following steps: depositing a first oxide layer on the metal surface; depositing a second oxide layer on the surface of the first oxide layer; depositing a third oxide layer on the surface of the second oxide layer; and depositing a fourth oxide layer on the surface of the third oxide layer.

[0040] The first oxide layer was deposited by magnetron sputtering, wherein the first target used to prepare the first oxide layer was a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the first target was 28:1. The second oxide layer was deposited by magnetron sputtering, wherein the second target used to prepare the second oxide layer was a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the second target was 31:1. The third oxide layer was deposited by magnetron sputtering, wherein the third target used to prepare the third oxide layer was a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the third target was 21:1. The fourth oxide layer was deposited by magnetron sputtering, wherein the fourth target used to prepare the fourth oxide layer was a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the fourth target was 25:1.

[0041] The process for depositing the first oxide layer is: the power supply type is RF power supply, the sputtering power is 70W, the sputtering voltage is 200V, the argon flow rate is 30sccm, and the sputtering temperature is 100°C. The process for depositing the second oxide layer is: the power supply type is RF power supply, the sputtering power is 100W, the sputtering voltage is 300V, the argon flow rate is 30sccm, and the sputtering temperature is 100°C. The process for depositing the third oxide layer is: the power supply type is RF power supply, the sputtering power is 70W, the sputtering voltage is 200V, the argon flow rate is 30sccm, and the sputtering temperature is 100°C. The process for depositing the fourth oxide layer is: the power supply type is RF power supply, the sputtering power is 100W, the sputtering voltage is 300V, the argon flow rate is 30sccm, and the sputtering temperature is 100°C. The TEM photograph of the fourth oxide layer of Example 2 can be seen. Figure 5 , Figure 6 Yes Figure 5 The sample preparation method has been introduced in Example 1 and will not be repeated here. Figure 5 It can be seen that the fourth oxide layer includes nanocrystals with a size of about 2 nm. The surface of the sample of Example 2 was coated with the paint of Example 1 disclosed in the prior art CN118667399A, and then the sample of Example 2 coated with the paint was tested for hiding power, adhesion and impact resistance. Among them, the hiding power is 90 g / m 2 , adhesion level 0, impact resistance 55cm.

[0042] Example 3

[0043] The coating is prepared by the following steps: depositing a first oxide layer on the metal surface; depositing a second oxide layer on the surface of the first oxide layer; depositing a third oxide layer on the surface of the second oxide layer; and depositing a fourth oxide layer on the surface of the third oxide layer.

[0044] The first oxide layer was deposited by magnetron sputtering, wherein the first target used to prepare the first oxide layer was a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the first target was 26:1. The second oxide layer was deposited by magnetron sputtering, wherein the second target used to prepare the second oxide layer was a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the second target was 30:1. The third oxide layer was deposited by magnetron sputtering, wherein the third target used to prepare the third oxide layer was a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the third target was 19:1. The fourth oxide layer was deposited by magnetron sputtering, wherein the fourth target used to prepare the fourth oxide layer was a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the fourth target was 24:1.

[0045] The process for depositing the first oxide layer is as follows: RF power supply, sputtering power of 60 W, sputtering voltage of 150 V, argon flow rate of 20 sccm, and sputtering temperature of 90°C. The process for depositing the second oxide layer is as follows: RF power supply, sputtering power of 90 W, sputtering voltage of 250 V, argon flow rate of 20 sccm, and sputtering temperature of 90°C. The process for depositing the third oxide layer is as follows: RF power supply, sputtering power of 60 W, sputtering voltage of 150 V, argon flow rate of 20 sccm, and sputtering temperature of 90°C. The process for depositing the fourth oxide layer is as follows: RF power supply, sputtering power of 90 W, sputtering voltage of 250 V, argon flow rate of 20 sccm, and sputtering temperature of 90°C. The surface of the sample of Example 3 was coated with the paint of Example 1 disclosed in the prior art CN118667399A, and the sample of Example 3 coated with the paint was then tested for hiding power, adhesion, and impact resistance. Among them, the hiding power is 88g / m 2 , adhesion level 0, impact resistance 56cm.

[0046] Comparative Example 1

[0047] The coating is prepared by the following steps: depositing a fourth oxide layer on the metal surface. The fourth oxide layer is deposited by a magnetron sputtering method, wherein the fourth target material used to prepare the fourth oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the fourth target material is 23:1. The process for depositing the fourth oxide layer is: the power supply type is a radio frequency power supply, the sputtering power is 80W, the sputtering voltage is 200V, the argon flow rate is 20sccm, and the sputtering temperature is 80°C. The paint of Example 1 disclosed in the prior art CN118667399A is coated on the surface of the sample of Comparative Example 1, and then the sample of Comparative Example 1 coated with the paint is tested for hiding power, adhesion and impact resistance. Among them, the hiding power is 98g / m 2 , adhesion level 1, and impact resistance 45cm. One explanation for the results of Comparative Example 1 is that with respect to hiding power, the fourth oxide layer provides a limited number of energy levels due to the lack of a multi-layered, multi-component, and multi-ratio composite oxide layer. Furthermore, direct contact between the fourth oxide layer and the metal substrate may result in distortion of the fourth oxide layer's lattice structure. This distortion of the lattice structure prevents some energy levels from hybridizing with the paint's electronic states, thereby affecting the improvement in hiding power. With respect to adhesion and impact resistance, simply doping ZnO with rare earth oxides cannot provide an electron cloud that can form a better overlap with paint molecules, resulting in a decrease in adhesion and impact resistance in Comparative Example 1.

[0048] Comparative Example 2

[0049] The coating was prepared by the following steps: depositing a first oxide layer on a metal surface; and depositing a fourth oxide layer on the surface of the first oxide layer. The remaining steps, parameters, and processes were the same as in Example 1. The paint of Example 1 disclosed in the prior art CN118667399A was applied to the surface of the sample of Comparative Example 2. The paint-coated sample of Comparative Example 2 was then tested for hiding power, adhesion, and impact resistance. The hiding power was 97 g / m 2 , adhesion level 1, impact resistance 49cm. The explanation of the experimental results of Comparative Example 2 is similar to that of Comparative Example 1 and will not be repeated.

[0050] Comparative Example 3

[0051] The first oxide layer was deposited by magnetron sputtering, wherein the first target used to prepare the first oxide layer was a mixed target of ZnO and FeO, and the molar ratio of ZnO to FeO in the first target was 25:1. The second oxide layer was deposited by magnetron sputtering, wherein the second target used to prepare the second oxide layer was a mixed target of ZnO and FeO, and the molar ratio of ZnO to FeO in the second target was 29:1. The third oxide layer was deposited by magnetron sputtering, wherein the third target used to prepare the third oxide layer was a mixed target of ZnO and Al2O3, and the molar ratio of ZnO to Al2O3 in the third target was 18:1. The fourth oxide layer was deposited by magnetron sputtering, wherein the fourth target used to prepare the fourth oxide layer was a mixed target of ZnO and Al2O3, and the molar ratio of ZnO to Al2O3 in the fourth target was 23:1. The remaining steps, parameters, and processes were the same as in Example 1. The surface of the sample of comparative example 3 was coated with the paint of Example 1 disclosed in the prior art CN118667399A, and then the sample of comparative example 3 coated with the paint was tested for hiding power, adhesion and impact resistance. Among them, the hiding power was 106 g / m 2 , adhesion level 1, impact resistance 42cm. The explanation of the experimental results of Comparative Example 3 is similar to that of Comparative Example 1 and will not be repeated.

[0052] Comparative Example 4

[0053] The first oxide layer was deposited by magnetron sputtering, wherein the first target used to prepare the first oxide layer was a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the first target was 25:1. The second oxide layer was deposited by magnetron sputtering, wherein the second target used to prepare the second oxide layer was a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the second target was 25:1. The third oxide layer was deposited by magnetron sputtering, wherein the third target used to prepare the third oxide layer was a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the third target was 18:1. The fourth oxide layer was deposited by magnetron sputtering, wherein the fourth target used to prepare the fourth oxide layer was a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the fourth target was 18:1. The remaining steps, parameters, and processes were the same as in Example 1. The surface of the sample of comparative example 4 was coated with the paint of Example 1 disclosed in the prior art CN118667399A, and then the sample of comparative example 4 coated with the paint was tested for hiding power, adhesion and impact resistance. Among them, the hiding power was 96g / m 2 , adhesion level 1, impact resistance 47cm. The explanation of the experimental results of Comparative Example 4 is similar to that of Comparative Example 1 and will not be repeated.

[0054] Comparative Example 5

[0055] The first oxide layer is deposited by magnetron sputtering, wherein the first target material used to prepare the first oxide layer is a mixed target material of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the first target material is 30:1. The third oxide layer is deposited by magnetron sputtering, wherein the third target material used to prepare the third oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the third target material is 22:1. The remaining steps, parameters, and processes are the same as those in Example 1. The paint of Example 1 disclosed in the prior art CN118667399A is coated on the surface of the sample of Comparative Example 5, and then the sample of Comparative Example 5 coated with the paint is tested for hiding power, adhesion, and impact resistance. Among them, the hiding power is 96g / m 2 , adhesion level 1, impact resistance 48cm. The explanation of the experimental results of Comparative Example 5 is similar to that of Comparative Example 1 and will not be repeated.

[0056] Comparative Example 6

[0057] The process for depositing the first oxide layer is: the power type is RF power supply, the sputtering power is 30W, the sputtering voltage is 50V, the argon flow rate is 20sccm, and the sputtering temperature is 80°C. The process for depositing the third oxide layer is: the power type is RF power supply, the sputtering power is 30W, the sputtering voltage is 50V, the argon flow rate is 20sccm, and the sputtering temperature is 80°C. The remaining steps, parameters, and processes are the same as those in Example 1. The paint of Example 1 disclosed in the prior art CN118667399A is coated on the surface of the sample of Comparative Example 6, and then the sample of Comparative Example 6 coated with the paint is tested for hiding power, adhesion, and impact resistance. Among them, the hiding power is 105g / m 2 , adhesion level 2, impact resistance 40cm.

[0058] Comparative Example 7

[0059] The process for depositing the second oxide layer was as follows: RF power supply, sputtering power of 150 W, sputtering voltage of 350 V, argon flow rate of 20 sccm, and sputtering temperature of 80°C. The process for depositing the fourth oxide layer was as follows: RF power supply, sputtering power of 150 W, sputtering voltage of 350 V, argon flow rate of 20 sccm, and sputtering temperature of 80°C. The remaining steps, parameters, and processes were the same as in Example 1. The sample film produced in Comparative Example 7 was broken, and subsequent experiments could not be performed.

[0060] It should be understood that the above-described specific embodiments of the present invention are merely illustrative or illustrative of the principles of the present invention and do not constitute limitations of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included within the scope of protection of the present invention. In addition, the appended claims are intended to cover all variations and modifications that fall within the scope and metes and bounds of the appended claims, or equivalents thereof.

Claims

1. A coating for improving the paint adhesion of metal parts of a distribution box, the coating being prepared by the following steps: A first oxide layer is deposited on the metal surface, wherein The first oxide layer includes Zn and Ce elements; Depositing a second oxide layer on the surface of the first oxide layer, wherein the second oxide layer comprises Zn and Ce, and the molar ratio of Zn to Ce in the first oxide layer and the second oxide layer is different; Depositing a third oxide layer on the surface of the second oxide layer, wherein the third oxide layer includes Zn and Dy elements; A fourth oxide layer is deposited on the surface of the third oxide layer, wherein the fourth oxide layer includes Zn and Dy elements, and the molar ratio of the Zn element to the Dy element in the third oxide layer is different from that in the fourth oxide layer.

2. The coating according to claim 1, wherein The first oxide layer is deposited by a magnetron sputtering method, wherein a first target material used to prepare the first oxide layer is a mixed target material of ZnO and CeO2, and a molar ratio of ZnO to CeO2 in the first target material is (25-28):

1.

3. The coating according to claim 1, wherein The second oxide layer is deposited by a magnetron sputtering method, wherein a second target material used to prepare the second oxide layer is a mixed target material of ZnO and CeO2, and a molar ratio of ZnO to CeO2 in the second target material is (29-31):

1.

4. The coating according to claim 1, wherein The third oxide layer is deposited by a magnetron sputtering method, wherein a third target material used to prepare the third oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the third target material is (18-21):

1.

5. The coating according to claim 1, wherein The fourth oxide layer is deposited by a magnetron sputtering method, wherein a fourth target material used to prepare the fourth oxide layer is a mixed target material of ZnO and Dy2O3, and a molar ratio of ZnO to Dy2O3 in the fourth target material is (23-25):

1.

6. The coating according to claim 2, wherein The process for depositing the first oxide layer is as follows: the power source type is a radio frequency power supply, the sputtering power is 50-70W, the sputtering voltage is 100-200V, the argon flow rate is 20-30sccm, and the sputtering temperature is 80-100°C.

7. The coating according to claim 3, wherein The process for depositing the second oxide layer is as follows: the power source type is a radio frequency power supply, the sputtering power is 80-100W, the sputtering voltage is 200-300V, the argon flow rate is 20-30sccm, and the sputtering temperature is 80-100°C.

8. The coating according to claim 4, wherein The process for depositing the third oxide layer is as follows: the power source type is a radio frequency power supply, the sputtering power is 50-70W, the sputtering voltage is 100-200V, the argon flow rate is 20-30sccm, and the sputtering temperature is 80-100°C.

9. The coating according to claim 5, wherein The process for depositing the fourth oxide layer is as follows: the power source type is a radio frequency power supply, the sputtering power is 80-100 W, the sputtering voltage is 200-300 V, the argon flow rate is 20-30 sccm, and the sputtering temperature is 80-100° C.

10. A distribution box, wherein: The distribution box comprises a metal component, wherein the coating according to any one of claims 1 to 9 is deposited on the surface of the metal component.

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