Coating for improving paint adhesion to electrical box metal parts and electrical boxes

Abstract

The application discloses a coating for improving the paint adhesion of a metal part of a distribution box, which is prepared by the following steps: depositing a first oxide layer on the surface of the metal, wherein the first oxide layer comprises Zn and Ce elements; depositing a second oxide layer on the surface of the first oxide layer, wherein the second oxide layer comprises Zn and Ce elements, and the molar ratio of the Zn and Ce elements in the first oxide layer is different from that in the second oxide layer; depositing a third oxide layer on the surface of the second oxide layer, wherein the third oxide layer comprises Zn and Dy elements; and depositing a fourth oxide layer on the surface of the third oxide layer, wherein the fourth oxide layer comprises Zn and Dy elements, and the molar ratio of the Zn and Dy elements in the third oxide layer is different from that in the fourth oxide layer. The coating can improve the paint adhesion to the metal substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of layered materials, and in particular to a coating for improving the adhesion of a paint surface of a metal part of a distribution box and a distribution box. BACKGROUND

[0002] A distribution box is a core device in a power system for distributing, controlling and protecting electric energy, usually installed in buildings, factories, public facilities and other places. It is responsible for distributing electric energy from the main power supply to each branch circuit, while providing short circuit, overload and other circuit protection functions to ensure the safety of electricity use and the stability of the system. The shell of the distribution box is generally made of metal, and in order to be beautiful and protect the metal body, paint needs to be sprayed on the metal shell. Since the distribution box is exposed to the outdoor environment for a long time, the paint surface of the distribution box may be subjected to a large stress in windy and rainy weather; in addition, since the distribution box needs to be regularly inspected, maintained and maintained, the paint surface will be repeatedly contacted by engineers. The use environment of the distribution box determines that the service life of the paint surface depends to a great extent on the adhesion of the paint to the metal body. The existing technology generally uses the method of improving the paint formula to improve the adhesion of the paint to the metal. However, this type of formula improvement technology has reached a bottleneck period, and our research shows that in the past 5 years, the adhesion of the paint to the metal cannot be effectively improved by improving the paint formula. SUMMARY

[0003] In view of the problems of the prior art, the present application uses a method of changing the chemical composition of the metal surface to improve the adhesion between the paint surface and the metal. Specifically, the present application improves the adhesion between the paint surface and the metal by depositing several oxide layers mixed with rare earth elements on the metal surface, and adjusting the composition ratio and element composition of each oxide layer.

[0004] The present application provides a coating for improving the adhesion of a paint surface to a metal part of a distribution box, which is prepared by the following steps:

[0005] depositing a first oxide layer on the metal surface, wherein the first oxide layer comprises Zn elements and Ce elements;

[0006] depositing a second oxide layer on the surface of the first oxide layer, wherein the second oxide layer comprises Zn elements and Ce elements, and the molar ratio of Zn elements to Ce elements of the first oxide layer and the second oxide layer is different;

[0007] depositing a third oxide layer on the surface of the second oxide layer, wherein the third oxide layer comprises Zn elements and Dy elements;

[0008] A fourth oxide layer is deposited on the surface of the third oxide layer, wherein the fourth oxide layer comprises Zn element and Dy element, and the molar ratio of Zn element to Dy element of the third oxide layer and the fourth oxide layer is different.

[0009] In a preferred embodiment, the first oxide layer is deposited by a magnetron sputtering method, wherein a first target material used for preparing the first oxide layer is a mixed target material of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the first target material is (25-28): 1.

[0010] In a preferred embodiment, the second oxide layer is deposited by a magnetron sputtering method, wherein a second target material used for preparing the second oxide layer is a mixed target material of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the second target material is (29-31): 1.

[0011] In a preferred embodiment, the third oxide layer is deposited by a magnetron sputtering method, wherein a third target material used for preparing the third oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the third target material is (18-21): 1.

[0012] In a preferred embodiment, the fourth oxide layer is deposited by a magnetron sputtering method, wherein a fourth target material used for preparing the fourth oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the fourth target material is (23-25): 1.

[0013] In a preferred embodiment, the process for depositing the first oxide layer is as follows: the power source type is a radio frequency power source, the sputtering power is 50-70 W, the sputtering voltage is 100-200 V, the argon flow rate is 20-30 sccm, and the sputtering temperature is 80-100°C.

[0014] In a preferred embodiment, the process for depositing the second oxide layer is as follows: the power source type is a radio frequency power source, the sputtering power is 80-100 W, the sputtering voltage is 200-300 V, the argon flow rate is 20-30 sccm, and the sputtering temperature is 80-100°C.

[0015] In a preferred embodiment, the process for depositing the third oxide layer is as follows: the power source type is a radio frequency power source, the sputtering power is 50-70 W, the sputtering voltage is 100-200 V, the argon flow rate is 20-30 sccm, and the sputtering temperature is 80-100°C.

[0016] In a preferred embodiment, the process for depositing the fourth oxide layer is as follows: the power source type is a radio frequency power source, the sputtering power is 80-100 W, the sputtering voltage is 200-300 V, the argon flow rate is 20-30 sccm, and the sputtering temperature is 80-100°C.

[0017] The present application also provides a distribution box, wherein the distribution box comprises a metal component, and the metal component is coated with the coating as described above.

[0018] Compared with the prior art, the present application has the following advantages. The present application improves the adhesion between the paint and the metal by changing the chemical composition of the metal surface. Specifically, the present application improves the adhesion between the paint and the metal by depositing several oxide layers mixed with rare earth elements on the metal surface and adjusting the composition ratio and element composition of each oxide layer. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a structural diagram of the coating of the present application.

[0020] Figure 2 is a flow chart of the method of the present application.

[0021] Figure 3 is a surface TEM photo of one embodiment of the present application.

[0022] Figure 4 is a diagram showing Figure 3 the two-dimensional Fourier transform image of the TEM photo shown in FIG. 6.

[0023] Figure 5 is a surface TEM photo of another embodiment of the present application.

[0024] Figure 6 is a diagram showing Figure 5 the two-dimensional Fourier transform image of the TEM photo shown in FIG. 8. DETAILED DESCRIPTION

[0025] The specific embodiments of the present application are described in detail below with reference to the accompanying drawings, but it should be understood that the scope of protection of the present application is not limited by the specific embodiments.

[0026] The metal substrate material composition does not affect the basic conclusion of the present application. In other words, the coating of the present application can improve the adhesion between the paint surface and the metal for any composition of the metal shell of the distribution box. In order to ensure the comparability of the results, unless otherwise indicated, the metal used in each embodiment of the present application and the comparative example is SUS304 stainless steel. The thickness of the oxide layer generally does not affect the conclusion of the present application. As a general principle, if the thickness of the oxide layer is too low, the oxide layer cannot play its role in improving the adhesion between the metal and the paint surface, and if the thickness of the oxide layer is too large, the oxide layer itself may crack and fall off. In order to ensure the comparability of the results, the thickness of each oxide layer in the present application is 25 nm. The preparation method of the oxide target material used in the present application can be a powder metallurgy method. Specifically, taking a mixed target of ZnO and CeO2 as an example, first, ZnO and CeO2 are weighed according to the molar ratio (ZnO and CeO2 can be purchased from a chemical store), then the mixed ZnO and CeO2 raw materials are fully broken by ball milling, and then the mixed powder is cold-pressed and hot-pressed to form a mixed target of ZnO and CeO2. Another target manufacturing method can be: mixing metals Zn and Ce according to the molar ratio, then melting the two metals together by melting, and then fully oxidizing the metal ingot after melting. The target used in the present application is ordered from Beijing Nonferrous Metals Research Institute. The hiding power test of the present application follows GB / T1726-1979, the adhesion test follows GB / T9286-1998, and the impact resistance test follows GB / T1732-1993.

[0027] Figure 1 is a structural schematic diagram of the coating of the present application. As shown in the figure, the coating of the present application includes a first oxide layer, a second oxide layer, a third oxide layer and a fourth oxide layer on the metal surface.

[0028] Figure 2 is a flow chart of the method of the present application. As shown in the figure, the method of the present application includes the following steps:

[0029] Step 1: depositing a first oxide layer on the metal surface, wherein the first oxide layer includes Zn element and Ce element;

[0030] Step 2: depositing a second oxide layer on the surface of the first oxide layer, wherein the second oxide layer includes Zn element and Ce element, and the molar ratio of Zn element to Ce element of the first oxide layer and the second oxide layer is different;

[0031] Step 3: depositing a third oxide layer on the surface of the second oxide layer, wherein the third oxide layer includes Zn element and Dy element;

[0032] Step 4: depositing a fourth oxide layer on the surface of the third oxide layer, wherein the fourth oxide layer comprises Zn element and Dy element, and the molar ratio of Zn element to Dy element of the third oxide layer and the fourth oxide layer is different.

[0033] The technical effects of the present application are verified by the following examples and comparative examples.

[0034] Example 1

[0035] The coating is prepared by the following steps: depositing a first oxide layer on the surface of a metal; depositing a second oxide layer on the surface of the first oxide layer; depositing a third oxide layer on the surface of the second oxide layer; and depositing a fourth oxide layer on the surface of the third oxide layer.

[0036] The first oxide layer is deposited by a magnetron sputtering method, wherein the first target material for preparing the first oxide layer is a mixed target material of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the first target material is 25:1. The second oxide layer is deposited by a magnetron sputtering method, wherein the second target material for preparing the second oxide layer is a mixed target material of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the second target material is 29:1. The third oxide layer is deposited by a magnetron sputtering method, wherein the third target material for preparing the third oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the third target material is 18:1. The fourth oxide layer is deposited by a magnetron sputtering method, wherein the fourth target material for preparing the fourth oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the fourth target material is 23:1.

[0037] The process for depositing the first oxide layer is as follows: the power type is a radio frequency power, the sputtering power is 50 W, the sputtering voltage is 100 V, the argon flow rate is 20 sccm, and the sputtering temperature is 80°C. The process for depositing the second oxide layer is as follows: the power type is a radio frequency power, the sputtering power is 80 W, the sputtering voltage is 200 V, the argon flow rate is 20 sccm, and the sputtering temperature is 80°C. The process for depositing the third oxide layer is as follows: the power type is a radio frequency power, the sputtering power is 50 W, the sputtering voltage is 100 V, the argon flow rate is 20 sccm, and the sputtering temperature is 80°C. The process for depositing the fourth oxide layer is as follows: the power type is a radio frequency power, the sputtering power is 80 W, the sputtering voltage is 200 V, the argon flow rate is 20 sccm, and the sputtering temperature is 80°C. The TEM photo of the fourth oxide layer of Example 1 can be seen in Figure 3 , Figure 4 is indicative of Figure 3A graph of the two-dimensional Fourier transform image of the TEM photograph shown. The TEM sample was prepared as follows: first, mechanically thinning (e.g., sanding) the sample prepared by the method of Example 1 to a thickness of less than 1 mm of the metal substrate, then thinning the sample from the direction of the metal substrate by the method of ion thinning, and finally imaging the thinned sample by TEM. The TEM image of the sample prepared by the method of Example 1 is shown in FIG. 1. The TEM image of the sample prepared by the method of Example 2 is shown in FIG. 2. Figure 3 It can be seen that the fourth oxide layer includes nanocrystals with a size of about 3 nm. The surface of the sample of Example 1 was coated with the paint of Example 1 disclosed in the prior art CN118667399A, and then the coated sample of Example 1 was tested for hiding power, adhesion, and impact resistance. Among them, the hiding power is 91 g / m 2 , the adhesion is 0 level, and the impact resistance is 53 cm. From the perspective of quantum mechanics, the hiding power of the paint is affected by the interface quantum effect. Specifically, the hybridization of the electronic states at the interface between the paint and the substrate can form new energy levels, affecting the reflection / transmission ratio of photons, thereby affecting the hiding power of the paint. In the case where the composition of the paint remains unchanged, changing the composition of the substrate in contact with the paint can obviously improve the hiding power of the paint. In the present invention, the substrate in contact with the paint is an oxide layer, and the experimental results of the present invention show that changing the material of the substrate in contact with the paint to a specific oxide layer can improve the hiding power of the paint. An explanation for this phenomenon can be that due to the special electronic structure of rare earth elements, ZnO doped with rare earth oxides can provide more energy levels, and more energy levels can better hybridize with the electronic states of the paint, thereby forming more new energy levels. In addition, the multi-layer, multi-component, and multi-component ratio composite oxide layer can change the lattice structure of the outermost oxide layer and provide a certain number of energy levels, which can also improve the hiding power of the paint. The adhesion and impact resistance are affected by the electronic cloud overlap state of the paint molecules and the substrate. In the case where the composition of the paint remains unchanged, changing the composition of the substrate in contact with the paint (and thus changing the shape of the electronic cloud of the substrate) can obviously improve the adhesion and impact resistance of the paint. In the present invention, due to the special electronic structure of rare earth elements and the lattice structure of rare earth oxides, ZnO doped with rare earth oxides can provide an electronic cloud with a specific shape (the special electronic structure of rare earth elements can change the structure of the ZnO electronic cloud, and the lattice structure of rare earth oxides can also change the structure of the ZnO electronic cloud), which can form a better overlap state with the electronic cloud of the paint molecules, thereby improving the adhesion and impact resistance of the paint. More importantly, the multi-layer, multi-component, and multi-component ratio composite oxide layer can change the lattice structure of the outermost oxide layer and indirectly change the shape of the electronic cloud of the outermost oxide layer through electronic coupling effect, thereby improving the adhesion and impact resistance of the paint.

[0038] Example 2

[0039] The coating is prepared by the following steps: depositing a first oxide layer on a metal surface; depositing a second oxide layer on the surface of the first oxide layer; depositing a third oxide layer on the surface of the second oxide layer; and depositing a fourth oxide layer on the surface of the third oxide layer.

[0040] The first oxide layer is deposited by magnetron sputtering, wherein the first target used to prepare the first oxide layer is a mixed target of ZnO and CeO2, with a molar ratio of ZnO to CeO2 of 28:1. The second oxide layer is deposited by magnetron sputtering, wherein the second target used to prepare the second oxide layer is a mixed target of ZnO and CeO2, with a molar ratio of ZnO to CeO2 of 31:1. The third oxide layer is deposited by magnetron sputtering, wherein the third target used to prepare the third oxide layer is a mixed target of ZnO and Dy2O3, with a molar ratio of ZnO to Dy2O3 of 21:1. The fourth oxide layer is deposited by magnetron sputtering, wherein the fourth target used to prepare the fourth oxide layer is a mixed target of ZnO and Dy2O3, with a molar ratio of ZnO to Dy2O3 of 25:1.

[0041] The process for depositing the first oxide layer is as follows: RF power supply, sputtering power of 70W, sputtering voltage of 200V, argon flow rate of 30 sccm, and sputtering temperature of 100℃. The process for depositing the second oxide layer is as follows: RF power supply, sputtering power of 100W, sputtering voltage of 300V, argon flow rate of 30 sccm, and sputtering temperature of 100℃. The process for depositing the third oxide layer is as follows: RF power supply, sputtering power of 70W, sputtering voltage of 200V, argon flow rate of 30 sccm, and sputtering temperature of 100℃. The process for depositing the fourth oxide layer is as follows: RF power supply, sputtering power of 100W, sputtering voltage of 300V, argon flow rate of 30 sccm, and sputtering temperature of 100℃. A TEM image of the fourth oxide layer in Example 2 can be found [link to TEM image]. Figure 5 , Figure 6 It means Figure 5 The image shown is a two-dimensional Fourier transform of the TEM photograph. The sample preparation method has already been described in Example 1 and will not be repeated here. From Figure 5 It can be seen that the fourth oxide layer includes nanocrystals with a size of approximately 2 nm. The paint of Example 1 disclosed in CN118667399A was coated onto the surface of the sample of Example 2, and then the masking strength, adhesion, and impact resistance of the paint-coated sample of Example 2 were tested. The masking strength was 90 g / m². 2 Adhesion grade 0, impact resistance 55cm.

[0042] Example 3

[0043] The coating is prepared by the following steps: depositing a first oxide layer on the surface of the metal; depositing a second oxide layer on the surface of the first oxide layer; depositing a third oxide layer on the surface of the second oxide layer; and depositing a fourth oxide layer on the surface of the third oxide layer.

[0044] The first oxide layer is deposited by a magnetron sputtering method, wherein the first target material for preparing the first oxide layer is a mixed target material of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the first target material is 26:1. The second oxide layer is deposited by a magnetron sputtering method, wherein the second target material for preparing the second oxide layer is a mixed target material of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the second target material is 30:1. The third oxide layer is deposited by a magnetron sputtering method, wherein the third target material for preparing the third oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the third target material is 19:1. The fourth oxide layer is deposited by a magnetron sputtering method, wherein the fourth target material for preparing the fourth oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the fourth target material is 24:1.

[0045] The process for depositing the first oxide layer is as follows: the power type is a radio frequency power, the sputtering power is 60 W, the sputtering voltage is 150 V, the argon flow rate is 20 sccm, and the sputtering temperature is 90℃. The process for depositing the second oxide layer is as follows: the power type is a radio frequency power, the sputtering power is 90 W, the sputtering voltage is 250 V, the argon flow rate is 20 sccm, and the sputtering temperature is 90℃. The process for depositing the third oxide layer is as follows: the power type is a radio frequency power, the sputtering power is 60 W, the sputtering voltage is 150 V, the argon flow rate is 20 sccm, and the sputtering temperature is 90℃. The process for depositing the fourth oxide layer is as follows: the power type is a radio frequency power, the sputtering power is 90 W, the sputtering voltage is 250 V, the argon flow rate is 20 sccm, and the sputtering temperature is 90℃. The sample of Example 3 is coated with the paint of Example 1 disclosed in the prior art CN118667399A, and then the sample of Example 3 coated with the paint is tested for hiding power, adhesion, and impact resistance. The hiding power is 88 g / m 2 , the adhesion is 0 level, and the impact resistance is 56 cm.

[0046] Comparative Example 1

[0047] The coating is prepared by the following steps: depositing a fourth oxide layer on the metal surface. The fourth oxide layer is deposited by a magnetron sputtering method, wherein the fourth target material for preparing the fourth oxide layer is a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the fourth target material is 23:1. The process of depositing the fourth oxide layer is as follows: the power source type is a radio frequency power source, the sputtering power is 80 W, the sputtering voltage is 200 V, the argon flow rate is 20 sccm, and the sputtering temperature is 80°C. The sample surface of Comparative Example 1 is coated with the paint of Example 1 disclosed in the prior art CN118667399A, and then the sample of Comparative Example 1 coated with the paint is tested for hiding power, adhesion, and impact resistance. Among them, the hiding power is 98 g / m 2 , the adhesion is 1 level, and the impact resistance is 45 cm. One explanation for the results of Comparative Example 1 is that for the hiding power, the number of energy levels provided by the fourth oxide layer is limited due to the lack of a multi-layer, multi-component composite oxide layer, and a multi-component ratio. In addition, since the fourth oxide layer is in direct contact with the metal substrate, this can cause distortion of the lattice structure of the fourth oxide layer, and the distortion of the lattice structure will result in some energy levels being unable to hybridize with the paint electronic state, thereby affecting the improvement of the hiding power. For adhesion and impact resistance, pure ZnO doped with rare earth oxides cannot provide an electron cloud that can form a better overlapping state with paint molecules, so the adhesion and impact resistance of Comparative Example 1 have decreased.

[0048] Comparative Example 2

[0049] The coating is prepared by the following steps: depositing a first oxide layer on the metal surface; and depositing a fourth oxide layer on the surface of the first oxide layer. The remaining steps, parameters, and processes are the same as in Example 1. The sample surface of Comparative Example 2 is coated with the paint of Example 1 disclosed in the prior art CN118667399A, and then the sample of Comparative Example 2 coated with the paint is tested for hiding power, adhesion, and impact resistance. Among them, the hiding power is 97 g / m 2 , the adhesion is 1 level, and the impact resistance is 49 cm. The explanation for the experimental results of Comparative Example 2 is similar to that of Comparative Example 1 and is not repeated.

[0050] Comparative Example 3

[0051] The first oxide layer is deposited by a magnetron sputtering method, wherein the first target material for preparing the first oxide layer is a mixed target of ZnO and FeO, and the molar ratio of ZnO to FeO of the first target material is 25:1. The second oxide layer is deposited by a magnetron sputtering method, wherein the second target material for preparing the second oxide layer is a mixed target of ZnO and FeO, and the molar ratio of ZnO to FeO of the second target material is 29:1. The third oxide layer is deposited by a magnetron sputtering method, wherein the third target material for preparing the third oxide layer is a mixed target of ZnO and Al2O3, and the molar ratio of ZnO to Al2O3 of the third target material is 18:1. The fourth oxide layer is deposited by a magnetron sputtering method, wherein the fourth target material for preparing the fourth oxide layer is a mixed target of ZnO and Al2O3, and the molar ratio of ZnO to Al2O3 of the fourth target material is 23:1. The remaining steps, parameters, and processes are the same as those of Example 1. The sample of Comparative Example 3 is coated with the paint of Example 1 disclosed in the prior art CN118667399A on the surface of the sample, and then the sample of Comparative Example 3 coated with the paint is tested for hiding power, adhesion, and impact resistance. Among them, the hiding power is 106 g / m2, the adhesion is level 1, and the impact resistance is 42 cm. The explanation of the experimental results of Comparative Example 3 is similar to that of Comparative Example 1, and is not repeated. 2 2

[0052] Comparative Example 4

[0053] The first oxide layer is deposited by a magnetron sputtering method, wherein the first target material for preparing the first oxide layer is a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the first target material is 25:1. The second oxide layer is deposited by a magnetron sputtering method, wherein the second target material for preparing the second oxide layer is a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the second target material is 25:1. The third oxide layer is deposited by a magnetron sputtering method, wherein the third target material for preparing the third oxide layer is a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the third target material is 18:1. The fourth oxide layer is deposited by a magnetron sputtering method, wherein the fourth target material for preparing the fourth oxide layer is a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the fourth target material is 18:1. The remaining steps, parameters, and processes are the same as those of Example 1. The sample of Comparative Example 4 is coated with the paint of Example 1 disclosed in the prior art CN118667399A on the surface of the sample, and then the sample of Comparative Example 4 coated with the paint is tested for hiding power, adhesion, and impact resistance. Among them, the hiding power is 96 g / m2, the adhesion is level 1, and the impact resistance is 47 cm. The explanation of the experimental results of Comparative Example 4 is similar to that of Comparative Example 1, and is not repeated. 2 2

[0054] Comparative Example 5

[0055] The first oxide layer was deposited by a magnetron sputtering method, wherein the first target material for preparing the first oxide layer was a mixed target of ZnO and CeO2, and the molar ratio of ZnO to CeO2 in the first target material was 30:1. The third oxide layer was deposited by a magnetron sputtering method, wherein the third target material for preparing the third oxide layer was a mixed target of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 in the third target material was 22:1. The remaining steps, parameters, and processes were the same as in Example 1. The sample of Comparative Example 5 was coated with the paint of Example 1 disclosed in the prior art CN118667399A on the surface of the sample, and then the sample of Comparative Example 5 coated with the paint was subjected to hiding power, adhesion, and impact resistance tests. Among them, the hiding power was 96 g / m 2 , the adhesion was level 1, and the impact resistance was 48 cm. The explanation of the experimental results of Comparative Example 5 is similar to that of Comparative Example 1 and is not repeated.

[0056] Comparative Example 6

[0057] The process for depositing the first oxide layer was as follows: the power type was a radio frequency power source, the sputtering power was 30 W, the sputtering voltage was 50 V, the argon flow rate was 20 sccm, and the sputtering temperature was 80°C. The process for depositing the third oxide layer was as follows: the power type was a radio frequency power source, the sputtering power was 30 W, the sputtering voltage was 50 V, the argon flow rate was 20 sccm, and the sputtering temperature was 80°C. The remaining steps, parameters, and processes were the same as in Example 1. The sample of Comparative Example 6 was coated with the paint of Example 1 disclosed in the prior art CN118667399A on the surface of the sample, and then the sample of Comparative Example 6 coated with the paint was subjected to hiding power, adhesion, and impact resistance tests. Among them, the hiding power was 105 g / m 2 , the adhesion was level 2, and the impact resistance was 40 cm.

[0058] Comparative Example 7

[0059] The process for depositing the second oxide layer was as follows: the power type was a radio frequency power source, the sputtering power was 150 W, the sputtering voltage was 350 V, the argon flow rate was 20 sccm, and the sputtering temperature was 80°C. The process for depositing the fourth oxide layer was as follows: the power type was a radio frequency power source, the sputtering power was 150 W, the sputtering voltage was 350 V, the argon flow rate was 20 sccm, and the sputtering temperature was 80°C. The remaining steps, parameters, and processes were the same as in Example 1. The sample film layer prepared in Comparative Example 7 was broken and could not be subjected to subsequent experiments.

[0060] It should be understood that the foregoing detailed description of the application, rather than limiting the application, is intended to explain and describe the current implementation of the application. Therefore, any modification, equivalent replacement or improvement made without departing from the spirit and scope of the application should be included in the protection scope of the application. In addition, the appended claims of the application are intended to cover all changes and modifications falling within the scope and boundary of the appended claims, or the equivalent form of such scope and boundary.

Claims

1. A coating for improving the paint adhesion of a metal part of an electrical distribution box, the coating being prepared by the following steps: depositing a first oxide layer on a metal surface, wherein, the first oxide layer comprises Zn element and Ce element; depositing a second oxide layer on the surface of the first oxide layer, wherein the second oxide layer comprises Zn element and Ce element, and the molar ratio of Zn element to Ce element of the first oxide layer is different from that of the second oxide layer; depositing a third oxide layer on the surface of the second oxide layer, wherein the third oxide layer comprises Zn element and Dy element; depositing a fourth oxide layer on the surface of the third oxide layer, wherein the fourth oxide layer comprises Zn element and Dy element, and the molar ratio of Zn element to Dy element of the third oxide layer is different from that of the fourth oxide layer, the first oxide layer is deposited by a magnetron sputtering method, wherein a first target material for preparing the first oxide layer is a mixed target material of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the first target material is (25-28): 1, the second oxide layer is deposited by a magnetron sputtering method, wherein a second target material for preparing the second oxide layer is a mixed target material of ZnO and CeO2, and the molar ratio of ZnO to CeO2 of the second target material is (29-31): 1, the third oxide layer is deposited by a magnetron sputtering method, wherein a third target material for preparing the third oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the third target material is (18-21): 1, the fourth oxide layer is deposited by a magnetron sputtering method, wherein a fourth target material for preparing the fourth oxide layer is a mixed target material of ZnO and Dy2O3, and the molar ratio of ZnO to Dy2O3 of the fourth target material is (23-25):

1.

2. The coating of claim 1, wherein, the process of depositing the first oxide layer is: the power source type is a radio frequency power source, the sputtering power is 50-70 W, the sputtering voltage is 100-200 V, the argon flow rate is 20-30 sccm, and the sputtering temperature is 80-100℃.

3. The coating of claim 2, wherein, the process of depositing the second oxide layer is: the power source type is a radio frequency power source, the sputtering power is 80-100 W, the sputtering voltage is 200-300 V, the argon flow rate is 20-30 sccm, and the sputtering temperature is 80-100℃.

4. The coating of claim 3, wherein, the process of depositing the third oxide layer is: the power source type is a radio frequency power source, the sputtering power is 50-70 W, the sputtering voltage is 100-200 V, the argon flow rate is 20-30 sccm, and the sputtering temperature is 80-100℃.

5. The coating of claim 4, wherein, The process for depositing the fourth oxide layer is: the power source type is radio frequency power source, the sputtering power is 80-100 W, the sputtering voltage is 200-300 V, the argon flow rate is 20-30 sccm, and the sputtering temperature is 80-100 DEG C.

6. An electrical distribution box, wherein, The electrical distribution box comprises a metal component, wherein the metal component has a surface with a coating as claimed in any one of claims 1-5.

Images